ATE276109T1 - Maschine zur warmlaminierung eines trockenfotoresistfilms auf eine platte für eine leiterplatte - Google Patents
Maschine zur warmlaminierung eines trockenfotoresistfilms auf eine platte für eine leiterplatteInfo
- Publication number
- ATE276109T1 ATE276109T1 AT00974777T AT00974777T ATE276109T1 AT E276109 T1 ATE276109 T1 AT E276109T1 AT 00974777 T AT00974777 T AT 00974777T AT 00974777 T AT00974777 T AT 00974777T AT E276109 T1 ATE276109 T1 AT E276109T1
- Authority
- AT
- Austria
- Prior art keywords
- board
- photoresist film
- ribbon
- dry photoresist
- tacking
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
- B32B37/223—One or more of the layers being plastic
- B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
- B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
Landscapes
- Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/IT2000/000406 WO2002030668A1 (en) | 2000-10-12 | 2000-10-12 | Hot lamination of a dry photoresist film onto a board for printed circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE276109T1 true ATE276109T1 (de) | 2004-10-15 |
Family
ID=11133568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00974777T ATE276109T1 (de) | 2000-10-12 | 2000-10-12 | Maschine zur warmlaminierung eines trockenfotoresistfilms auf eine platte für eine leiterplatte |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1324881B1 (de) |
JP (1) | JP2004511110A (de) |
KR (1) | KR20030034248A (de) |
CN (1) | CN1264673C (de) |
AT (1) | ATE276109T1 (de) |
DE (1) | DE60013918D1 (de) |
TW (1) | TW530527B (de) |
WO (1) | WO2002030668A1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010075948A (ja) * | 2008-09-25 | 2010-04-08 | Daihen Corp | コンジットケーブル |
TWI460075B (zh) * | 2010-11-11 | 2014-11-11 | C Sun Mfg Ltd | 壓合機 |
CN103488051B (zh) * | 2013-08-28 | 2015-11-11 | 中国科学院高能物理研究所 | 一种用于liga技术的光刻胶膜与基片的复合结构的制备方法 |
CN107222974B (zh) * | 2017-07-01 | 2019-04-12 | 华中科技大学 | 一种延性电路制作方法 |
CN108054272B (zh) * | 2017-08-29 | 2021-02-19 | 南京航空航天大学 | 一种低成本可快速大量制备集成化微型薄膜热电器件的制造方法 |
US20240109280A1 (en) * | 2021-03-17 | 2024-04-04 | Automatic Lamination Technologies S.R.L. | Laminator device for pliable sheet semi-finished products and method for producing said pliable semi-finished products |
TWI810089B (zh) * | 2022-10-14 | 2023-07-21 | 鴻鉑科技有限公司 | 壓膜裝置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3547730A (en) * | 1966-12-16 | 1970-12-15 | Du Pont | Machine for making resist images |
US4025380A (en) * | 1975-07-24 | 1977-05-24 | International Business Machines Corporation | Variable resist laminator |
US4214936A (en) * | 1978-10-24 | 1980-07-29 | E. I. Du Pont De Nemours And Company | Lamination process |
DE3736509A1 (de) * | 1987-10-28 | 1989-05-11 | Hoechst Ag | Vorrichtung zum laminieren und schneiden von fotoresistbahnen |
ATE131777T1 (de) * | 1988-04-04 | 1996-01-15 | Somar Corp | Vorrichtung zum verbinden von dünnen filmen |
US6826987B1 (en) * | 1996-08-14 | 2004-12-07 | International Business Machines Corporation | Method for cutting movable web material |
US6077373A (en) * | 1996-09-11 | 2000-06-20 | Du Pont Canada Inc. | Manufacture of multilayer polymer films |
US6026884A (en) * | 1998-01-27 | 2000-02-22 | Maintech, Inc. | Laminating device |
JP2000085011A (ja) * | 1998-07-16 | 2000-03-28 | Somar Corp | フィルム張付装置 |
-
2000
- 2000-10-12 EP EP00974777A patent/EP1324881B1/de not_active Expired - Lifetime
- 2000-10-12 CN CNB008199620A patent/CN1264673C/zh not_active Expired - Fee Related
- 2000-10-12 AT AT00974777T patent/ATE276109T1/de not_active IP Right Cessation
- 2000-10-12 JP JP2002534075A patent/JP2004511110A/ja active Pending
- 2000-10-12 KR KR10-2003-7004744A patent/KR20030034248A/ko not_active Application Discontinuation
- 2000-10-12 DE DE60013918T patent/DE60013918D1/de not_active Expired - Fee Related
- 2000-10-12 WO PCT/IT2000/000406 patent/WO2002030668A1/en active IP Right Grant
- 2000-11-29 TW TW089125314A patent/TW530527B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1264673C (zh) | 2006-07-19 |
EP1324881A1 (de) | 2003-07-09 |
DE60013918D1 (de) | 2004-10-21 |
JP2004511110A (ja) | 2004-04-08 |
TW530527B (en) | 2003-05-01 |
KR20030034248A (ko) | 2003-05-01 |
WO2002030668A1 (en) | 2002-04-18 |
CN1460069A (zh) | 2003-12-03 |
EP1324881B1 (de) | 2004-09-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |