ATE131958T1 - Aufbau zur kühlung eines rf-leistungstransistors - Google Patents

Aufbau zur kühlung eines rf-leistungstransistors

Info

Publication number
ATE131958T1
ATE131958T1 AT91301800T AT91301800T ATE131958T1 AT E131958 T1 ATE131958 T1 AT E131958T1 AT 91301800 T AT91301800 T AT 91301800T AT 91301800 T AT91301800 T AT 91301800T AT E131958 T1 ATE131958 T1 AT E131958T1
Authority
AT
Austria
Prior art keywords
cooling
transistor
circuit board
insulation plate
collector
Prior art date
Application number
AT91301800T
Other languages
English (en)
Inventor
Mikko Pesola
Original Assignee
Nokia Mobile Phones Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Mobile Phones Ltd filed Critical Nokia Mobile Phones Ltd
Application granted granted Critical
Publication of ATE131958T1 publication Critical patent/ATE131958T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/253—Semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/03—Constructional details, e.g. casings, housings
    • H04B1/036—Cooling arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Bipolar Transistors (AREA)
  • Amplifiers (AREA)
  • Non-Reversible Transmitting Devices (AREA)
  • Measuring Volume Flow (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
AT91301800T 1990-03-29 1991-03-05 Aufbau zur kühlung eines rf-leistungstransistors ATE131958T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI901582A FI88452C (fi) 1990-03-29 1990-03-29 Konstruktion foer att foerbaettra avkylning av en effekttransistor

Publications (1)

Publication Number Publication Date
ATE131958T1 true ATE131958T1 (de) 1996-01-15

Family

ID=8530154

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91301800T ATE131958T1 (de) 1990-03-29 1991-03-05 Aufbau zur kühlung eines rf-leistungstransistors

Country Status (6)

Country Link
US (1) US5164884A (de)
EP (1) EP0449435B1 (de)
JP (1) JPH04225264A (de)
AT (1) ATE131958T1 (de)
DE (1) DE69115536T2 (de)
FI (1) FI88452C (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5453293A (en) * 1991-07-17 1995-09-26 Beane; Alan F. Methods of manufacturing coated particles having desired values of intrinsic properties and methods of applying the coated particles to objects
US5614320A (en) * 1991-07-17 1997-03-25 Beane; Alan F. Particles having engineered properties
DE4217289C2 (de) * 1992-05-25 1996-08-29 Mannesmann Ag Fluidgekühlte Leistungstransistoranordnung
DE4234022C2 (de) * 1992-10-09 1995-05-24 Telefunken Microelectron Schichtschaltung mit mindestens einem Leistungswiderstand
DE9312006U1 (de) * 1993-08-11 1993-09-23 Fischer, Gerhard, 91052 Erlangen Kondensatoranordnung fuer hochleistungs- und hochfrequenzanwendungen
GB2296145B (en) * 1994-12-15 1999-09-22 Nokia Mobile Phones Ltd Radio transmitters and methods of operation
JP3786446B2 (ja) * 1995-03-31 2006-06-14 松下電器産業株式会社 送風装置
FI98014C (fi) * 1995-06-30 1997-03-25 Nokia Mobile Phones Ltd Kuutiointipiiri signaalin esisäröyttämiseksi
US5786745A (en) * 1996-02-06 1998-07-28 Motorola, Inc. Electronic package and method
ES2123435B1 (es) * 1996-10-29 1999-09-16 Mecanismos Aux Ind Sistema de disipacion termica en circuito impreso de 800 micras.
GB9811382D0 (en) 1998-05-27 1998-07-22 Nokia Mobile Phones Ltd A transmitter
GB9811381D0 (en) 1998-05-27 1998-07-22 Nokia Mobile Phones Ltd Predistortion control for power reduction
GB2339113B (en) 1998-06-30 2003-05-21 Nokia Mobile Phones Ltd Data transmission in tdma system
US6175500B1 (en) 1998-09-22 2001-01-16 Lucent Technologies Inc. Surface mount thermal connections
US6377462B1 (en) * 2001-01-09 2002-04-23 Deere & Company Circuit board assembly with heat sinking
US7129640B2 (en) * 2003-06-03 2006-10-31 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Integrated circuit device for driving a laser diode with reduced heat transfer and method for fabricating the device
EP2276329A1 (de) * 2009-07-16 2011-01-19 ABB Research Ltd. Elektronische Platine mit Wärmekondensator
US8383946B2 (en) * 2010-05-18 2013-02-26 Joinset, Co., Ltd. Heat sink
CN102446873A (zh) * 2010-10-07 2012-05-09 卓英社有限公司 散热器
US9113583B2 (en) * 2012-07-31 2015-08-18 General Electric Company Electronic circuit board, assembly and a related method thereof
US9687290B2 (en) 2012-10-02 2017-06-27 Covidien Lp Energy-based medical devices
FR3080501B1 (fr) * 2018-04-23 2021-10-08 Valeo Systemes Thermiques Groupe moto-ventilateur pour vehicule automobile comprenant une carte electronique de commande d’un moteur electrique
CN211908640U (zh) * 2020-05-19 2020-11-10 阳光电源股份有限公司 一种功率变换装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3517272A (en) * 1968-12-24 1970-06-23 Rca Corp Microwave circuit with coaxial package semiconductor device
US3859570A (en) * 1973-02-20 1975-01-07 Bose Corp Power transistor mounting
DE2918845A1 (de) * 1979-05-10 1980-11-20 Licentia Gmbh Verfahren zum anschrauben eines halbleiter-bauteils an ein kuehlblech und schrauber fuer das verfahren
JPS5753947A (en) * 1980-09-17 1982-03-31 Hitachi Ltd Transistor and electronic device containing it
DE3342923A1 (de) * 1983-11-26 1985-06-05 Philips Patentverwaltung Gmbh, 2000 Hamburg Befestigungsanordnung
US4935581A (en) * 1986-04-17 1990-06-19 Citizen Watch Co., Ltd. Pin grid array package
CA1307355C (en) * 1988-05-26 1992-09-08 David C. Degree Soft-faced semiconductor component backing
FI85783C (fi) * 1989-02-17 1992-05-25 Nokia Mobira Oy Kylningskonstruktion foer transistor.
US5021925A (en) * 1990-03-20 1991-06-04 Nuarms, Inc. Electrical isolator device

Also Published As

Publication number Publication date
FI901582L (fi) 1991-09-30
EP0449435A3 (en) 1993-01-20
DE69115536D1 (de) 1996-02-01
EP0449435A2 (de) 1991-10-02
DE69115536T2 (de) 1996-06-05
US5164884A (en) 1992-11-17
EP0449435B1 (de) 1995-12-20
FI88452C (fi) 1993-05-10
FI901582A0 (fi) 1990-03-29
JPH04225264A (ja) 1992-08-14
FI88452B (fi) 1993-01-29

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties