EP0718883A3 - Vorrichtung zum Abführen von Wärme von einem elektronischen Bauelement - Google Patents

Vorrichtung zum Abführen von Wärme von einem elektronischen Bauelement Download PDF

Info

Publication number
EP0718883A3
EP0718883A3 EP95119800A EP95119800A EP0718883A3 EP 0718883 A3 EP0718883 A3 EP 0718883A3 EP 95119800 A EP95119800 A EP 95119800A EP 95119800 A EP95119800 A EP 95119800A EP 0718883 A3 EP0718883 A3 EP 0718883A3
Authority
EP
European Patent Office
Prior art keywords
electronic circuit
dissipating heat
apparatus dissipating
heat
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP95119800A
Other languages
English (en)
French (fr)
Other versions
EP0718883A2 (de
Inventor
Dieter Ferling
Wolfgang Heck
Klaus Adam
Hans-Peter Hirler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent Deutschland AG
Original Assignee
Alcatel SEL AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel SEL AG filed Critical Alcatel SEL AG
Publication of EP0718883A2 publication Critical patent/EP0718883A2/de
Publication of EP0718883A3 publication Critical patent/EP0718883A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP95119800A 1994-12-22 1995-12-15 Vorrichtung zum Abführen von Wärme von einem elektronischen Bauelement Withdrawn EP0718883A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19944445849 DE4445849A1 (de) 1994-12-22 1994-12-22 Vorrichtung zum Abführen von Wärme von einem elektronischen Bauelement
DE4445849 1994-12-22

Publications (2)

Publication Number Publication Date
EP0718883A2 EP0718883A2 (de) 1996-06-26
EP0718883A3 true EP0718883A3 (de) 1997-02-26

Family

ID=6536622

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95119800A Withdrawn EP0718883A3 (de) 1994-12-22 1995-12-15 Vorrichtung zum Abführen von Wärme von einem elektronischen Bauelement

Country Status (2)

Country Link
EP (1) EP0718883A3 (de)
DE (1) DE4445849A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6191944B1 (en) * 1998-11-05 2001-02-20 Electrovac, Fabrikation Elektrotechnischer Spezialartikel Gesellschaft M.B.H. Heat sink for electric and/or electronic devices
CA2609712C (en) * 2005-05-26 2015-04-07 Nanocomp Technologies, Inc. Systems and methods for thermal management of electronic components
DE102019215958A1 (de) * 2019-10-16 2021-04-22 Volkswagen Aktiengesellschaft Elektronisches System mit Wärmeübertragungsvorrichtung
US11240934B1 (en) * 2020-07-22 2022-02-01 TE Connectivity Services Gmbh Thermal bridge for an electrical component
DE102021110319A1 (de) 2021-04-22 2022-10-27 Yazaki Systems Technologies Gmbh Elektrisches System und Verfahren zur Herstellung des elektrischen Systems

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2167905A (en) * 1984-10-08 1986-06-04 Nixdorf Computer Ag Heat sink for electronic components and/or equipment
US4800956A (en) * 1986-04-25 1989-01-31 Digital Equipment Corporation Apparatus and method for removal of heat from packaged element
JPH0322555A (ja) * 1989-06-20 1991-01-30 Hitachi Ltd 集積回路の冷却装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD96130A1 (de) * 1972-04-19 1973-03-12
DE2855493A1 (de) * 1978-12-22 1980-07-03 Bbc Brown Boveri & Cie Leistungs-halbleiterbauelement
DE3031912A1 (de) * 1980-08-23 1982-04-01 Brown, Boveri & Cie Ag, 6800 Mannheim Anordnung zur potentialunabhaengigen waermeabfuehrung
DE8320682U1 (de) * 1983-07-18 1983-12-29 Kallas, Hans, Dipl.-Ing., 8263 Burghausen Elektronisches regel- und kontrollgeraet
DD270618A1 (de) * 1988-04-08 1989-08-02 Adw Ddr Inst Kosmosforschung Anordnung zum waermetransfer
EP0376365B1 (de) * 1988-12-01 1995-08-09 Akzo Nobel N.V. Halbleitermodul

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2167905A (en) * 1984-10-08 1986-06-04 Nixdorf Computer Ag Heat sink for electronic components and/or equipment
US4800956A (en) * 1986-04-25 1989-01-31 Digital Equipment Corporation Apparatus and method for removal of heat from packaged element
JPH0322555A (ja) * 1989-06-20 1991-01-30 Hitachi Ltd 集積回路の冷却装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 015, no. 147 (E - 1055) 12 April 1991 (1991-04-12) *

Also Published As

Publication number Publication date
EP0718883A2 (de) 1996-06-26
DE4445849A1 (de) 1996-06-27

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