ATE127653T1 - Träger für kupferfolien von flexiblen leiterplatten. - Google Patents

Träger für kupferfolien von flexiblen leiterplatten.

Info

Publication number
ATE127653T1
ATE127653T1 AT91109778T AT91109778T ATE127653T1 AT E127653 T1 ATE127653 T1 AT E127653T1 AT 91109778 T AT91109778 T AT 91109778T AT 91109778 T AT91109778 T AT 91109778T AT E127653 T1 ATE127653 T1 AT E127653T1
Authority
AT
Austria
Prior art keywords
circuit boards
flexible circuit
carrier
copper films
strength aqueous
Prior art date
Application number
AT91109778T
Other languages
German (de)
English (en)
Inventor
Joerg Hausdorf
Thomas Dr Kuhlmann
Rolf Schneider
Steffen Dr Kosack
Werner Schaefer
Volker Dr Siekermann
Original Assignee
Freudenberg Carl Fa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freudenberg Carl Fa filed Critical Freudenberg Carl Fa
Application granted granted Critical
Publication of ATE127653T1 publication Critical patent/ATE127653T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/308—Heat stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0284—Paper, e.g. as reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2631—Coating or impregnation provides heat or fire protection
    • Y10T442/2672—Phosphorus containing
    • Y10T442/268—Phosphorus and nitrogen containing compound

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
AT91109778T 1990-08-21 1991-06-14 Träger für kupferfolien von flexiblen leiterplatten. ATE127653T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4026354 1990-08-21

Publications (1)

Publication Number Publication Date
ATE127653T1 true ATE127653T1 (de) 1995-09-15

Family

ID=6412583

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91109778T ATE127653T1 (de) 1990-08-21 1991-06-14 Träger für kupferfolien von flexiblen leiterplatten.

Country Status (8)

Country Link
US (1) US5498471A (OSRAM)
EP (1) EP0471937B1 (OSRAM)
JP (1) JPH07101770B2 (OSRAM)
AT (1) ATE127653T1 (OSRAM)
DE (2) DE4102473A1 (OSRAM)
DK (1) DK0471937T3 (OSRAM)
ES (1) ES2078386T3 (OSRAM)
GR (1) GR3018183T3 (OSRAM)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9119795D0 (en) * 1991-09-17 1991-10-30 Albright & Wilson Flame retardant plastics material
DE19508835C1 (de) * 1995-03-11 1996-04-25 Freudenberg Carl Fa Verfahren zur Herstellung von Leiterplatten mit leitfähigen Sacklöchern
JP3054866B1 (ja) * 1998-12-14 2000-06-19 キョーワ株式会社 建設工事現場に展張するメッシュシート用難燃剤とこれを用いた建設工事現場に展張する防炎メッシュシート
US6245696B1 (en) 1999-06-25 2001-06-12 Honeywell International Inc. Lasable bond-ply materials for high density printed wiring boards
US6224965B1 (en) 1999-06-25 2001-05-01 Honeywell International Inc. Microfiber dielectrics which facilitate laser via drilling
US6327155B1 (en) 1999-12-16 2001-12-04 Nortel Networks Limited Method and apparatus for preventing flamespread in an equipment assembly
US6495244B1 (en) * 2000-09-07 2002-12-17 Oak-Mitsui, Inc. Manufacturing fire retardant circuit boards without the use of fire retardant resin additives
US8566211B2 (en) * 2000-11-22 2013-10-22 Efficient Auctions, Llc System and method for a dynamic auction with package bidding
GB0029071D0 (en) * 2000-11-29 2001-01-10 Clariant Int Ltd Coating
US6519162B1 (en) * 2001-08-30 2003-02-11 Adc Telecommunications, Inc. Protective panel for a splitter chassis or other device for holding electronic cards
WO2003054103A2 (en) * 2001-12-20 2003-07-03 World Properties, Inc. Resin with high damping properties
MX2009007097A (es) * 2007-01-24 2009-08-13 Basf Se Sustratos flexibles de estructura plana con superficie abrasiva.
PL2307612T3 (pl) * 2008-07-24 2014-03-31 Basf Se Elastyczne płaskie podłoża o powierzchni ścierającej
WO2014003835A1 (en) 2012-06-28 2014-01-03 3M Innovative Properties Company Thermally conductive substrate article

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4075420A (en) * 1975-08-28 1978-02-21 Burroughs Corporation Cover layer for flexible circuits
JPS5439873A (en) * 1977-09-06 1979-03-27 Nippon Denso Co Incombustible ypet flexible printed wiring board
JPS5831753B2 (ja) * 1979-02-02 1983-07-08 鐘淵化学工業株式会社 電気用絶縁積層板及び印刷回路用金属箔張り積層板
CA1200039A (en) * 1981-12-26 1986-01-28 Hiroaki Koyama Resin composition containing granular or powdery phenol-aldehyde resin
CA1259439A (en) * 1983-03-17 1989-09-12 Masaharu Abe Flame retarded epoxy resin composition for use in the manufacture of electrical laminates
GB8413929D0 (en) * 1984-05-31 1984-07-04 Plascoat Uk Ltd Flame retardant compositions
DE3732907A1 (de) * 1987-09-30 1989-04-13 Basf Ag Selbstverloeschende, thermoplastische polyphenylenether-polyamid-formmassen und ihre verwendung zur herstllung von formkoerpern
JPH01163256A (ja) * 1987-12-21 1989-06-27 Nippon Oil Co Ltd 積層板用樹脂組成物

Also Published As

Publication number Publication date
DK0471937T3 (da) 1995-11-27
DE4102473A1 (de) 1992-02-27
JPH07101770B2 (ja) 1995-11-01
ES2078386T3 (es) 1995-12-16
DE4102473C2 (OSRAM) 1992-07-16
DE59106414D1 (de) 1995-10-12
GR3018183T3 (en) 1996-02-29
EP0471937A2 (de) 1992-02-26
EP0471937A3 (en) 1993-04-21
EP0471937B1 (de) 1995-09-06
JPH04233784A (ja) 1992-08-21
US5498471A (en) 1996-03-12

Similar Documents

Publication Publication Date Title
DE59106414D1 (de) Träger für Kupferfolien von flexiblen Leiterplatten.
CA2223552A1 (en) Virus inactivating coatings
DE3471150D1 (en) Article clamp
ATE136160T1 (de) Elektrisches dünnschicht-bauelement mit polymersubstrat
EP0285669A4 (en) Functional film and process for its production
BR9808620A (pt) Elementos reativamente acoplados em circuitos sobre substratos flexìveis
DE69410393D1 (de) Klebeband für elektronische Bauteile und Flüssigklebstoff
EP0189765A3 (en) Circuit board made from cross-linked polycyanurate polymer, thermoplastic polymer and polyaramid fiber
DE3677539D1 (de) Polymere mit calixarensubstituenten.
SE7710350L (sv) Sett att framstella plaster
JPS5514504A (en) Recording component
DE3772005D1 (de) Kondensator des polymerfilmtyps mit hoher temperaturfestigkeit.
ATE26456T1 (de) Neue treibmittelkombination auf basis von azodicarbonamid, deren herstellung und verwendung zur verschaumung von kunststoffen.
EP0201831A3 (de) Thermotrope aromatische Polyester mit hoher Wärmeformbeständigkeit, Verfahren zu ihrer Herstellung und ihre Verwendung zur Herstellung von Formkörpern, Filamenten, Fasern und Folien
DE59103098D1 (de) Abdeckfolie für flexible Leiterplatten.
FI880850A0 (fi) Termostabila polymerer, vilka baserar sig pao maleimider, av vilka en aer en siloxan-bis-maleimid, samt foerfaranden foer deras framstaellning.
BR8704580A (pt) Composicao de revestimento antiestatica a base de agua e pelicula polimerica
EP0402038A3 (en) Polymeric charge transfer complexes for nonlinear optical applications
DE3578709D1 (de) Pfropfen von fluorkohlenwasserstoffen auf polymeren substraten.
ES2056268T3 (es) Substrato revestido con un recubrimiento de dos fases mediante barnizado catodico por electroinmersion.
AU571767B2 (en) Fabric conditioning composition
KR860006914A (ko) 비-감광전이 절연도료 시이트 성형품
Hausdorf et al. Carriers for Copper Sheets of Flexible Printed Circuit Boards
KR950008123A (ko) 평판인쇄판
ATE247376T1 (de) Bedruckte schaltträger

Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee