ATA703471A - Verfahren zur herstellung elektrischer leiterplatten - Google Patents

Verfahren zur herstellung elektrischer leiterplatten

Info

Publication number
ATA703471A
ATA703471A AT703471A AT703471A ATA703471A AT A703471 A ATA703471 A AT A703471A AT 703471 A AT703471 A AT 703471A AT 703471 A AT703471 A AT 703471A AT A703471 A ATA703471 A AT A703471A
Authority
AT
Austria
Prior art keywords
circuit boards
electric circuit
manufacturing electric
manufacturing
boards
Prior art date
Application number
AT703471A
Other languages
English (en)
Other versions
AT326204B (de
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of ATA703471A publication Critical patent/ATA703471A/de
Application granted granted Critical
Publication of AT326204B publication Critical patent/AT326204B/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
AT703471A 1968-02-09 1971-08-11 Verfahren zur herstellung elektrischer leiterplatten AT326204B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70438368A 1968-02-09 1968-02-09

Publications (2)

Publication Number Publication Date
ATA703471A true ATA703471A (de) 1975-02-15
AT326204B AT326204B (de) 1975-11-25

Family

ID=24829249

Family Applications (3)

Application Number Title Priority Date Filing Date
AT703371A AT318048B (de) 1968-02-09 1969-02-06 Verfahren zur Herstellung von elektrischen Leiterplatten
AT122769A AT301665B (de) 1968-02-09 1969-02-06 Verfahren zur Herstellung elektrischer Leiterplatten
AT703471A AT326204B (de) 1968-02-09 1971-08-11 Verfahren zur herstellung elektrischer leiterplatten

Family Applications Before (2)

Application Number Title Priority Date Filing Date
AT703371A AT318048B (de) 1968-02-09 1969-02-06 Verfahren zur Herstellung von elektrischen Leiterplatten
AT122769A AT301665B (de) 1968-02-09 1969-02-06 Verfahren zur Herstellung elektrischer Leiterplatten

Country Status (5)

Country Link
AT (3) AT318048B (de)
CH (1) CH495683A (de)
DK (1) DK128260B (de)
ES (1) ES363391A1 (de)
NL (1) NL162537C (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6985943B2 (en) 1998-09-11 2006-01-10 Genesys Telecommunications Laboratories, Inc. Method and apparatus for extended management of state and interaction of a remote knowledge worker from a contact center

Also Published As

Publication number Publication date
ES363391A1 (es) 1970-12-16
DE1906967B2 (de) 1971-05-19
DE1906967A1 (de) 1970-08-20
CH495683A (de) 1970-08-31
DK128260B (da) 1974-03-25
NL162537C (nl) 1980-05-16
AT301665B (de) 1972-09-11
NL162537B (nl) 1979-12-17
AT326204B (de) 1975-11-25
AT318048B (de) 1974-09-25
NL6902088A (de) 1969-08-12

Similar Documents

Publication Publication Date Title
AT312731B (de) Verfahren zur Herstellung elektrischer Leiterplatten
CH455898A (de) Verfahren zur Herstellung von leitfähigen Durchgängen
CH413941A (de) Verfahren zur Herstellung von leitenden Verbindungen bei elektrischen Schaltungsplatten
CH483087A (de) Verfahren zur Herstellung eines isolierten elektrischen Leiters
CH505474A (de) Integrierte Schaltung und Verfahren zur Herstellung dieser Schaltung
DE1918845B2 (de) Verfahren zur herstellung von halbleiteranordnungen
AT298599B (de) Verfahren zur Herstellung von mit Leiterbahnen versehenen Schaltungsplatten
CH435392A (de) Verfahren zur Herstellung eines zusammengesetzten elektrischen Leiters
CH449777A (de) Verfahren zur Herstellung einer Festkörperschaltung
DE1924775B2 (de) Verfahren zur herstellung einer leiterplatte
AT306899B (de) Verfahren zur Herstellung von Elektroisolierbändern
AT352206B (de) Verfahren zur verbesserung der loetbarkeit elektrischer leiterplatten
CH452016A (de) Verfahren zur Herstellung vielschichtiger, ein Leitungssystem enthaltender, elektrischer Schaltungselemente
CH488289A (de) Verfahren zur Herstellung einer mehrlagigen mikroelektronischen Schaltung
DE1925499B2 (de) Verfahren zur herstellung einer elektrischen gluehlampe
CH512824A (de) Verfahren zur Herstellung von Halbleitervorrichtungen
CH440405A (de) Verfahren zur Herstellung eines elektrischen Leiters
CH482325A (de) Verfahren zur Herstellung von supraleitenden metallischen Leitern
AT283483B (de) Verfahren zur Herstellung eines isolierten elektrischen Leiters
AT326204B (de) Verfahren zur herstellung elektrischer leiterplatten
DE2014138B2 (de) Verfahren zur herstellung von gedruckten leiterplatten
CH495039A (de) Verfahren zur Herstellung eines elektrischen Kabels
AT294955B (de) Verfahren zur Herstellung von gedruckten Leiterplatten
AT262383B (de) Verfahren zur Herstellung einer integrierten Schaltung
AT275631B (de) Verfahren zur Herstellung eines isolierten elektrischen Leiters