ATA21202000A - Mikro-wärmetauscher - Google Patents

Mikro-wärmetauscher

Info

Publication number
ATA21202000A
ATA21202000A AT21202000A AT21202000A ATA21202000A AT A21202000 A ATA21202000 A AT A21202000A AT 21202000 A AT21202000 A AT 21202000A AT 21202000 A AT21202000 A AT 21202000A AT A21202000 A ATA21202000 A AT A21202000A
Authority
AT
Austria
Prior art keywords
heat exchanger
micro heat
micro
exchanger
heat
Prior art date
Application number
AT21202000A
Other languages
English (en)
Other versions
AT410881B (de
Original Assignee
Cool Structures Production And
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cool Structures Production And filed Critical Cool Structures Production And
Priority to AT21202000A priority Critical patent/AT410881B/de
Priority to PCT/AT2001/000369 priority patent/WO2002050902A1/de
Priority to AU2002223252A priority patent/AU2002223252A1/en
Publication of ATA21202000A publication Critical patent/ATA21202000A/de
Application granted granted Critical
Publication of AT410881B publication Critical patent/AT410881B/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/08—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
AT21202000A 2000-12-20 2000-12-20 Mikro-wärmetauscher AT410881B (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AT21202000A AT410881B (de) 2000-12-20 2000-12-20 Mikro-wärmetauscher
PCT/AT2001/000369 WO2002050902A1 (de) 2000-12-20 2001-11-21 Mikro-wärmetauscher
AU2002223252A AU2002223252A1 (en) 2000-12-20 2001-11-21 Micro heat-exchanger

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT21202000A AT410881B (de) 2000-12-20 2000-12-20 Mikro-wärmetauscher

Publications (2)

Publication Number Publication Date
ATA21202000A true ATA21202000A (de) 2002-12-15
AT410881B AT410881B (de) 2003-08-25

Family

ID=3689899

Family Applications (1)

Application Number Title Priority Date Filing Date
AT21202000A AT410881B (de) 2000-12-20 2000-12-20 Mikro-wärmetauscher

Country Status (3)

Country Link
AT (1) AT410881B (de)
AU (1) AU2002223252A1 (de)
WO (1) WO2002050902A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005071748A1 (en) * 2004-01-22 2005-08-04 Koninklijke Philips Electronics N.V. Method and system for cooling at least one electronic device
WO2006010822A2 (fr) * 2004-06-24 2006-02-02 TECHNOLOGIES DE L'ECHANGE THERMIQUE Société Anonyme Simplifiée Dispositifs de refroidissement perfectionnes pour applications diverses
IT201900016769A1 (it) * 2019-09-19 2021-03-19 Giovanni Marini Struttura di scambiatore ed apparecchiatura di condizionamento

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5667949A (en) * 1979-11-07 1981-06-08 Hitachi Ltd Cooling body of electrical parts
DE3329325A1 (de) * 1982-09-03 1984-03-08 Peter 2563 Ipsach Herren Kuehlkoerper zur fluessigkeitskuehlung wenigstens eines elektrischen leistungselementes
DE68918156T2 (de) * 1988-05-09 1995-01-12 Nec Corp Flache Kühlungsstruktur für integrierte Schaltung.
US5079619A (en) * 1990-07-13 1992-01-07 Sun Microsystems, Inc. Apparatus for cooling compact arrays of electronic circuitry
US5099311A (en) * 1991-01-17 1992-03-24 The United States Of America As Represented By The United States Department Of Energy Microchannel heat sink assembly
DE4315581A1 (de) * 1993-05-11 1994-11-17 Fraunhofer Ges Forschung Laserdioden mit Kühlsystem
JPH09102568A (ja) * 1995-10-05 1997-04-15 Mitsubishi Electric Corp プレート型ヒートシンク
DE19833707A1 (de) * 1998-07-27 2000-02-10 Abb Daimler Benz Transp Kühler zur Fluidkühlung eines elektronischen Bauteils
US6154363A (en) * 1999-12-29 2000-11-28 Chang; Neng Chao Electronic device cooling arrangement

Also Published As

Publication number Publication date
WO2002050902A1 (de) 2002-06-27
AU2002223252A1 (en) 2002-07-01
AT410881B (de) 2003-08-25

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Legal Events

Date Code Title Description
EIH Change in the person of patent owner
ELJ Ceased due to non-payment of the annual fee