ATA203589A - Verfahren zum partiellen galvanisieren von metallischen oberflächen von gedruckten schaltungen - Google Patents
Verfahren zum partiellen galvanisieren von metallischen oberflächen von gedruckten schaltungenInfo
- Publication number
- ATA203589A ATA203589A AT203589A AT203589A ATA203589A AT A203589 A ATA203589 A AT A203589A AT 203589 A AT203589 A AT 203589A AT 203589 A AT203589 A AT 203589A AT A203589 A ATA203589 A AT A203589A
- Authority
- AT
- Austria
- Prior art keywords
- metal surfaces
- printed circuits
- galvanizing
- partial
- partial galvanizing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT203589A AT398675B (de) | 1989-08-29 | 1989-08-29 | Verfahren zum partiellen galvanisieren von metallischen oberflächen von gedruckten schaltungen |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT203589A AT398675B (de) | 1989-08-29 | 1989-08-29 | Verfahren zum partiellen galvanisieren von metallischen oberflächen von gedruckten schaltungen |
Publications (2)
Publication Number | Publication Date |
---|---|
ATA203589A true ATA203589A (de) | 1994-05-15 |
AT398675B AT398675B (de) | 1995-01-25 |
Family
ID=3526402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT203589A AT398675B (de) | 1989-08-29 | 1989-08-29 | Verfahren zum partiellen galvanisieren von metallischen oberflächen von gedruckten schaltungen |
Country Status (1)
Country | Link |
---|---|
AT (1) | AT398675B (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017005286A1 (de) * | 2015-07-05 | 2017-01-12 | D. Swarovski Kg | Schmucksteinfassung mit antik-ruthenium-beschichtung |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1790025B1 (de) * | 1968-08-29 | 1972-05-04 | Siemens Ag | Verfahren zur herstellung galvanisch verstaerkter m etallischer mikrostrukturen |
FR2148167A1 (en) * | 1971-08-02 | 1973-03-11 | Du Pont | Electronic device - composed of a dielectric substrate with molybdenum contg circuit pattern and gold plated |
BE788117A (fr) * | 1971-08-30 | 1973-02-28 | Perstorp Ab | Procede de production d'elements pour circuits imprimes |
DE2411988A1 (de) * | 1973-03-14 | 1974-09-19 | Du Pont | Metallisierungspaste und ihre verwendung fuer die herstellung von nicht unterbrochenen mustern auf unterlagen |
US4206254A (en) * | 1979-02-28 | 1980-06-03 | International Business Machines Corporation | Method of selectively depositing metal on a ceramic substrate with a metallurgy pattern |
DE3022757C2 (de) * | 1980-06-13 | 1982-12-16 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Leiterplatte mit zweischichtigem Leiterbahnaufbau und Verfahren zur Herstellung |
DE3145721A1 (de) * | 1981-11-19 | 1983-05-26 | Helmuth 2058 Lauenburg Schmoock | Verfahren zum herstellen von gedruckten schaltungen |
-
1989
- 1989-08-29 AT AT203589A patent/AT398675B/de active
Also Published As
Publication number | Publication date |
---|---|
AT398675B (de) | 1995-01-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification |