ATA175582A - Verfahren zum anbringen metallischer kontakte auf elektrischen bauelementen - Google Patents

Verfahren zum anbringen metallischer kontakte auf elektrischen bauelementen

Info

Publication number
ATA175582A
ATA175582A AT175582A AT175582A ATA175582A AT A175582 A ATA175582 A AT A175582A AT 175582 A AT175582 A AT 175582A AT 175582 A AT175582 A AT 175582A AT A175582 A ATA175582 A AT A175582A
Authority
AT
Austria
Prior art keywords
electrical components
metal contacts
attaching metal
attaching
contacts
Prior art date
Application number
AT175582A
Other languages
English (en)
Other versions
AT376833B (de
Original Assignee
Siemens Bauelemente Ohg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Bauelemente Ohg filed Critical Siemens Bauelemente Ohg
Publication of ATA175582A publication Critical patent/ATA175582A/de
Application granted granted Critical
Publication of AT376833B publication Critical patent/AT376833B/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
AT175582A 1981-06-30 1982-05-05 Verfahren zum anbringen metallischer kontakte auf elektrischen bauelementen AT376833B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813125730 DE3125730A1 (de) 1981-06-30 1981-06-30 Verfahren zum metallisieren elektrischer bauelemente

Publications (2)

Publication Number Publication Date
ATA175582A true ATA175582A (de) 1984-05-15
AT376833B AT376833B (de) 1985-01-10

Family

ID=6135746

Family Applications (1)

Application Number Title Priority Date Filing Date
AT175582A AT376833B (de) 1981-06-30 1982-05-05 Verfahren zum anbringen metallischer kontakte auf elektrischen bauelementen

Country Status (2)

Country Link
AT (1) AT376833B (de)
DE (1) DE3125730A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0254201A1 (de) * 1986-07-24 1988-01-27 Kalman F. Zsamboky Verfahren zum Metallisieren von keramischen Substraten
GB8927310D0 (en) * 1989-12-02 1990-01-31 Lsi Logic Europ Via-hole filling in semiconductor devices
FR2656493A1 (fr) * 1989-12-21 1991-06-28 Bull Sa Procede d'interconnexion de couches metalliques du reseau multicouche d'une carte electronique, et carte en resultant.
DE4029681A1 (de) * 1990-09-19 1992-04-02 Siemens Ag Verfahren zum herstellen von oberflaechenmontierbaren keramischen bauelementen in melf-technologie
DE69735406T2 (de) * 1996-10-25 2006-08-31 Canon K.K. Glasschaltungssubstrat und Verfahren zu dessen Herstellung
US20040186008A1 (en) * 2001-03-11 2004-09-23 Hiroaki Inoue Catalyst-imparting treatment solution and electroless plating method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE605294C (de) * 1928-02-03 1934-11-08 Charlotte Dobenzig Verfahren zur Herstellung von Kontakt- und Anschlussstellen hochohmiger Widerstaende
US3237066A (en) * 1963-02-25 1966-02-22 Sprague Electric Co Capacitor with electrodes of metal coated particles
GB1042816A (en) * 1964-06-15 1966-09-14 Ibm Improvements in or relating to the production of metallic coatings upon the surfacesof other materials
US3454999A (en) * 1965-05-17 1969-07-15 Nippon Electric Co Capacitor
US3555376A (en) * 1965-12-15 1971-01-12 Matsushita Electric Ind Co Ltd Ohmic contact electrode to semiconducting ceramics and a method for making the same
DE1665740C3 (de) * 1966-09-13 1975-03-13 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Kontaktierung eines elektrischen Bauelementes
US3674550A (en) * 1970-03-04 1972-07-04 Allied Res Prod Inc Method of electroless deposition of a substrate and sensitizing solution therefor
US3857683A (en) * 1973-07-27 1974-12-31 Mica Corp Printed circuit board material incorporating binary alloys
DE2410008A1 (de) * 1974-03-02 1975-10-02 Draloric Electronic Verfahren zur herstellung von widerstands-netzwerken
DE2433419C3 (de) * 1974-07-11 1979-10-25 Siemens Ag, 1000 Berlin Und 8000 Muenchen Keramisches elektrisches Bauelement und Verfahren zu seiner Herstellung
US4112196A (en) * 1977-01-24 1978-09-05 National Micronetics, Inc. Beam lead arrangement for microelectronic devices

Also Published As

Publication number Publication date
DE3125730A1 (de) 1983-01-13
AT376833B (de) 1985-01-10

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties