AT376833B - Verfahren zum anbringen metallischer kontakte auf elektrischen bauelementen - Google Patents
Verfahren zum anbringen metallischer kontakte auf elektrischen bauelementenInfo
- Publication number
- AT376833B AT376833B AT175582A AT175582A AT376833B AT 376833 B AT376833 B AT 376833B AT 175582 A AT175582 A AT 175582A AT 175582 A AT175582 A AT 175582A AT 376833 B AT376833 B AT 376833B
- Authority
- AT
- Austria
- Prior art keywords
- electrical components
- metal contacts
- attaching metal
- attaching
- contacts
- Prior art date
Links
- 239000002184 metal Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19813125730 DE3125730A1 (de) | 1981-06-30 | 1981-06-30 | Verfahren zum metallisieren elektrischer bauelemente |
Publications (2)
Publication Number | Publication Date |
---|---|
ATA175582A ATA175582A (de) | 1984-05-15 |
AT376833B true AT376833B (de) | 1985-01-10 |
Family
ID=6135746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT175582A AT376833B (de) | 1981-06-30 | 1982-05-05 | Verfahren zum anbringen metallischer kontakte auf elektrischen bauelementen |
Country Status (2)
Country | Link |
---|---|
AT (1) | AT376833B (de) |
DE (1) | DE3125730A1 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0254201A1 (de) * | 1986-07-24 | 1988-01-27 | Kalman F. Zsamboky | Verfahren zum Metallisieren von keramischen Substraten |
GB8927310D0 (en) * | 1989-12-02 | 1990-01-31 | Lsi Logic Europ | Via-hole filling in semiconductor devices |
FR2656493A1 (fr) * | 1989-12-21 | 1991-06-28 | Bull Sa | Procede d'interconnexion de couches metalliques du reseau multicouche d'une carte electronique, et carte en resultant. |
DE4029681A1 (de) * | 1990-09-19 | 1992-04-02 | Siemens Ag | Verfahren zum herstellen von oberflaechenmontierbaren keramischen bauelementen in melf-technologie |
EP0838980B1 (de) * | 1996-10-25 | 2006-03-08 | Canon Kabushiki Kaisha | Glasschaltungssubstrat und Verfahren zu dessen Herstellung |
US20040186008A1 (en) * | 2001-03-11 | 2004-09-23 | Hiroaki Inoue | Catalyst-imparting treatment solution and electroless plating method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1665740B2 (de) * | 1966-09-13 | 1974-07-18 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | |
DE2127650B2 (de) * | 1971-06-03 | 1976-08-19 | Knjaschew, Andrej Alexandrowitsch; Awdeewa, Tamara Ignatewna; Schapiro, Ninel Isaewna; Bajkowa, Ekaterina Michajlowna; Leningrad (Sowjetunion) | Verfahren zum anbringen metallischer kontakte auf einer kohlenstoffkunstharz-widerstandsschicht |
US4112196A (en) * | 1977-01-24 | 1978-09-05 | National Micronetics, Inc. | Beam lead arrangement for microelectronic devices |
DE2433419C3 (de) * | 1974-07-11 | 1979-10-25 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Keramisches elektrisches Bauelement und Verfahren zu seiner Herstellung |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE605294C (de) * | 1928-02-03 | 1934-11-08 | Charlotte Dobenzig | Verfahren zur Herstellung von Kontakt- und Anschlussstellen hochohmiger Widerstaende |
US3237066A (en) * | 1963-02-25 | 1966-02-22 | Sprague Electric Co | Capacitor with electrodes of metal coated particles |
GB1042816A (en) * | 1964-06-15 | 1966-09-14 | Ibm | Improvements in or relating to the production of metallic coatings upon the surfacesof other materials |
US3454999A (en) * | 1965-05-17 | 1969-07-15 | Nippon Electric Co | Capacitor |
US3555376A (en) * | 1965-12-15 | 1971-01-12 | Matsushita Electric Ind Co Ltd | Ohmic contact electrode to semiconducting ceramics and a method for making the same |
US3674550A (en) * | 1970-03-04 | 1972-07-04 | Allied Res Prod Inc | Method of electroless deposition of a substrate and sensitizing solution therefor |
US3857683A (en) * | 1973-07-27 | 1974-12-31 | Mica Corp | Printed circuit board material incorporating binary alloys |
DE2410008A1 (de) * | 1974-03-02 | 1975-10-02 | Draloric Electronic | Verfahren zur herstellung von widerstands-netzwerken |
-
1981
- 1981-06-30 DE DE19813125730 patent/DE3125730A1/de not_active Withdrawn
-
1982
- 1982-05-05 AT AT175582A patent/AT376833B/de not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1665740B2 (de) * | 1966-09-13 | 1974-07-18 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | |
DE2127650B2 (de) * | 1971-06-03 | 1976-08-19 | Knjaschew, Andrej Alexandrowitsch; Awdeewa, Tamara Ignatewna; Schapiro, Ninel Isaewna; Bajkowa, Ekaterina Michajlowna; Leningrad (Sowjetunion) | Verfahren zum anbringen metallischer kontakte auf einer kohlenstoffkunstharz-widerstandsschicht |
DE2433419C3 (de) * | 1974-07-11 | 1979-10-25 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Keramisches elektrisches Bauelement und Verfahren zu seiner Herstellung |
US4112196A (en) * | 1977-01-24 | 1978-09-05 | National Micronetics, Inc. | Beam lead arrangement for microelectronic devices |
Also Published As
Publication number | Publication date |
---|---|
DE3125730A1 (de) | 1983-01-13 |
ATA175582A (de) | 1984-05-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ELJ | Ceased due to non-payment of the annual fee | ||
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |