ATA1012972A - HOUSING FOR SEMI-CONDUCTOR SYSTEMS - Google Patents

HOUSING FOR SEMI-CONDUCTOR SYSTEMS

Info

Publication number
ATA1012972A
ATA1012972A AT1012972A AT1012972A ATA1012972A AT A1012972 A ATA1012972 A AT A1012972A AT 1012972 A AT1012972 A AT 1012972A AT 1012972 A AT1012972 A AT 1012972A AT A1012972 A ATA1012972 A AT A1012972A
Authority
AT
Austria
Prior art keywords
semi
housing
conductor systems
conductor
systems
Prior art date
Application number
AT1012972A
Other languages
German (de)
Other versions
AT327989B (en
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of ATA1012972A publication Critical patent/ATA1012972A/en
Application granted granted Critical
Publication of AT327989B publication Critical patent/AT327989B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
AT1012972A 1972-03-22 1972-11-28 HOUSING FOR SEMI-CONDUCTOR SYSTEMS AT327989B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722213915 DE2213915A1 (en) 1972-03-22 1972-03-22 HOUSING FOR SEMI-CONDUCTOR SYSTEMS

Publications (2)

Publication Number Publication Date
ATA1012972A true ATA1012972A (en) 1975-05-15
AT327989B AT327989B (en) 1976-02-25

Family

ID=5839779

Family Applications (1)

Application Number Title Priority Date Filing Date
AT1012972A AT327989B (en) 1972-03-22 1972-11-28 HOUSING FOR SEMI-CONDUCTOR SYSTEMS

Country Status (9)

Country Link
JP (1) JPS496880A (en)
AT (1) AT327989B (en)
CA (1) CA979122A (en)
CH (1) CH548109A (en)
DE (1) DE2213915A1 (en)
FR (1) FR2176661B1 (en)
GB (1) GB1397330A (en)
IT (1) IT982542B (en)
NL (1) NL7302989A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2439478A1 (en) * 1978-10-19 1980-05-16 Cii Honeywell Bull FLAT HOUSING FOR DEVICES WITH INTEGRATED CIRCUITS
GB2146174B (en) * 1983-09-06 1987-04-23 Gen Electric Hermetic power chip packages

Also Published As

Publication number Publication date
NL7302989A (en) 1973-09-25
FR2176661A1 (en) 1973-11-02
CA979122A (en) 1975-12-02
DE2213915A1 (en) 1973-10-04
CH548109A (en) 1974-04-11
JPS496880A (en) 1974-01-22
GB1397330A (en) 1975-06-11
AT327989B (en) 1976-02-25
IT982542B (en) 1974-10-21
FR2176661B1 (en) 1977-12-30

Similar Documents

Publication Publication Date Title
DK143875C (en) computer systems
BR7302852D0 (en) PERFECT DATA PROCESSING SYSTEMS
SE380440B (en) CENTRAL VENKATERIZATION SYSTEM
CH551690A (en) SEMI-CONDUCTOR ARRANGEMENT.
DE2352359A1 (en) PLUG-IN SYSTEM
SE398447B (en) VENTILATION DEVICE FOR VETSKOR
AT351302B (en) DATA PROCESSING SYSTEM
BE804888A (en) EMULSIONING SYSTEM
SE388690B (en) MOVING SYSTEM
SE397396B (en) VENTILATION DEVICE FOR VEXELLADA
SE392671B (en) HALLARE FOR BLIXTLASLOPARE
IT983389B (en) PHOTOGRAPHIC TREATMENT SYSTEM
AT314017B (en) Plastic housing for small devices
SE381980B (en) PALEGGARE FOR HARFERGNING
AT376844B (en) SEMICONDUCTOR COMPONENT
IT980014B (en) VENTILATION DEVICE
ATA602473A (en) DIVIDED GLARE PROTECTION ELEMENT FOR GLARE PROTECTION DEVICES
AT322313B (en) VALVE HOUSING
SE390790B (en) LOPARE FOR BLIXTLAS
AT324792B (en) VALVE SYSTEM
DK138248C (en) SEMICONDUCTOR ELEMENT
SE401016B (en) COOLING SYSTEM
CH552285A (en) SEMI-CONDUCTOR ARRANGEMENT.
SE386580B (en) HALLARE FOR BLIXTLASLOPARE
BR7300519D0 (en) CIRCUIT FOR SUPERVISING CONNECTIONS

Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee