CH548109A - HOUSING WITH A SEMICONDUCTOR SYSTEM. - Google Patents
HOUSING WITH A SEMICONDUCTOR SYSTEM.Info
- Publication number
- CH548109A CH548109A CH1708472A CH1708472A CH548109A CH 548109 A CH548109 A CH 548109A CH 1708472 A CH1708472 A CH 1708472A CH 1708472 A CH1708472 A CH 1708472A CH 548109 A CH548109 A CH 548109A
- Authority
- CH
- Switzerland
- Prior art keywords
- housing
- semiconductor system
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19722213915 DE2213915A1 (en) | 1972-03-22 | 1972-03-22 | HOUSING FOR SEMI-CONDUCTOR SYSTEMS |
Publications (1)
Publication Number | Publication Date |
---|---|
CH548109A true CH548109A (en) | 1974-04-11 |
Family
ID=5839779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1708472A CH548109A (en) | 1972-03-22 | 1972-11-23 | HOUSING WITH A SEMICONDUCTOR SYSTEM. |
Country Status (9)
Country | Link |
---|---|
JP (1) | JPS496880A (en) |
AT (1) | AT327989B (en) |
CA (1) | CA979122A (en) |
CH (1) | CH548109A (en) |
DE (1) | DE2213915A1 (en) |
FR (1) | FR2176661B1 (en) |
GB (1) | GB1397330A (en) |
IT (1) | IT982542B (en) |
NL (1) | NL7302989A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2439478A1 (en) * | 1978-10-19 | 1980-05-16 | Cii Honeywell Bull | FLAT HOUSING FOR DEVICES WITH INTEGRATED CIRCUITS |
GB2146174B (en) * | 1983-09-06 | 1987-04-23 | Gen Electric | Hermetic power chip packages |
-
1972
- 1972-03-22 DE DE19722213915 patent/DE2213915A1/en active Pending
- 1972-11-23 CH CH1708472A patent/CH548109A/en not_active IP Right Cessation
- 1972-11-28 AT AT1012972A patent/AT327989B/en not_active IP Right Cessation
- 1972-12-18 FR FR7245013A patent/FR2176661B1/fr not_active Expired
- 1972-12-29 GB GB6005172A patent/GB1397330A/en not_active Expired
-
1973
- 1973-03-02 NL NL7302989A patent/NL7302989A/xx unknown
- 1973-03-15 CA CA166,172A patent/CA979122A/en not_active Expired
- 1973-03-16 IT IT2171273A patent/IT982542B/en active
- 1973-03-20 JP JP3155173A patent/JPS496880A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
FR2176661A1 (en) | 1973-11-02 |
NL7302989A (en) | 1973-09-25 |
IT982542B (en) | 1974-10-21 |
GB1397330A (en) | 1975-06-11 |
CA979122A (en) | 1975-12-02 |
DE2213915A1 (en) | 1973-10-04 |
ATA1012972A (en) | 1975-05-15 |
JPS496880A (en) | 1974-01-22 |
FR2176661B1 (en) | 1977-12-30 |
AT327989B (en) | 1976-02-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |