AT522487A3 - Waferverarbeitungsverfahren - Google Patents

Waferverarbeitungsverfahren Download PDF

Info

Publication number
AT522487A3
AT522487A3 ATA50321/2020A AT503212020A AT522487A3 AT 522487 A3 AT522487 A3 AT 522487A3 AT 503212020 A AT503212020 A AT 503212020A AT 522487 A3 AT522487 A3 AT 522487A3
Authority
AT
Austria
Prior art keywords
dicing
wafer
wafer processing
aligning
lines
Prior art date
Application number
ATA50321/2020A
Other languages
English (en)
Other versions
AT522487B1 (de
AT522487A2 (de
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of AT522487A2 publication Critical patent/AT522487A2/de
Publication of AT522487A3 publication Critical patent/AT522487A3/de
Application granted granted Critical
Publication of AT522487B1 publication Critical patent/AT522487B1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/04—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0524—Plural cutting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

Hierin offenbart ist ein Waferverarbeitungsverfahren zum Auftrennen eines Wafers entlang von Trennlinien, um einzelne Vorrichtungschips zu erhalten. Das Waferverarbeitungsverfahren schließt einen Halteschritt zum Halten des Wafers auf einem Spanntisch, einen Ausrichteschritt zum Abbilden eines Bereichs betreffend die Trennlinien durch Verwenden einer Abbildungseinheit und zum Ausrichten eines Schneidemessers mit einer der Trennlinien durch Verwenden eines Bildes dieses Bereiches, das durch die Abbildungseinheit erhalten wird, einen äußerste-Trennlinie-Erfassungsschritt zum Erfassen einer äußersten der Trennlinien vor oder nach Durchführen des Ausrichteschrittes und einen Schneideschritt zum Schneiden des Wafers entlang jeder Trennlinie durch Verwenden des Schneidemessers ein.
ATA50321/2020A 2019-04-17 2020-04-16 Waferverarbeitungsverfahren AT522487B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019078270A JP7368098B2 (ja) 2019-04-17 2019-04-17 ウエーハの加工方法

Publications (3)

Publication Number Publication Date
AT522487A2 AT522487A2 (de) 2020-11-15
AT522487A3 true AT522487A3 (de) 2022-04-15
AT522487B1 AT522487B1 (de) 2022-08-15

Family

ID=72660208

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA50321/2020A AT522487B1 (de) 2019-04-17 2020-04-16 Waferverarbeitungsverfahren

Country Status (3)

Country Link
JP (1) JP7368098B2 (de)
AT (1) AT522487B1 (de)
DE (1) DE102020204898A1 (de)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745556A (ja) * 1993-07-26 1995-02-14 Disco Abrasive Syst Ltd ダイシング装置
US20140298968A1 (en) * 2013-04-08 2014-10-09 Disco Corporation Disk-shaped workpiece dividing method
DE102015214136A1 (de) * 2014-07-28 2016-01-28 Disco Corporation Waferbearbeitungsverfahren
DE102015220379A1 (de) * 2014-10-21 2016-04-21 Disco Corporation Wasser-Bearbeitungsverfahren
US20160151857A1 (en) * 2014-12-01 2016-06-02 Disco Corporation Laser processing apparatus
US20160293501A1 (en) * 2015-03-31 2016-10-06 Disco Corporation Method of dividing wafer
US20180161919A1 (en) * 2016-12-08 2018-06-14 Disco Corporation Dividing method of workpiece and laser processing apparatus
US20180214986A1 (en) * 2017-01-27 2018-08-02 Disco Corporation Laser processing apparatus
US20180304409A1 (en) * 2017-04-24 2018-10-25 Disco Corporation Laser processing method
DE102018215247A1 (de) * 2017-09-08 2019-03-14 Disco Corporation Bearbeitungsverfahren für einen Wafer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06224296A (ja) * 1993-01-27 1994-08-12 Sumitomo Electric Ind Ltd 半導体ウェーハのダイシング方法及び装置
JPH09139362A (ja) * 1995-11-10 1997-05-27 Disco Abrasive Syst Ltd ダイシング方法
JP5134216B2 (ja) 2006-06-23 2013-01-30 株式会社ディスコ ウエーハの加工結果管理方法
JP5122880B2 (ja) 2007-07-11 2013-01-16 株式会社ディスコ レーザー加工装置のアライメント方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745556A (ja) * 1993-07-26 1995-02-14 Disco Abrasive Syst Ltd ダイシング装置
US20140298968A1 (en) * 2013-04-08 2014-10-09 Disco Corporation Disk-shaped workpiece dividing method
DE102015214136A1 (de) * 2014-07-28 2016-01-28 Disco Corporation Waferbearbeitungsverfahren
DE102015220379A1 (de) * 2014-10-21 2016-04-21 Disco Corporation Wasser-Bearbeitungsverfahren
US20160151857A1 (en) * 2014-12-01 2016-06-02 Disco Corporation Laser processing apparatus
US20160293501A1 (en) * 2015-03-31 2016-10-06 Disco Corporation Method of dividing wafer
US20180161919A1 (en) * 2016-12-08 2018-06-14 Disco Corporation Dividing method of workpiece and laser processing apparatus
US20180214986A1 (en) * 2017-01-27 2018-08-02 Disco Corporation Laser processing apparatus
US20180304409A1 (en) * 2017-04-24 2018-10-25 Disco Corporation Laser processing method
DE102018215247A1 (de) * 2017-09-08 2019-03-14 Disco Corporation Bearbeitungsverfahren für einen Wafer

Also Published As

Publication number Publication date
JP2020177994A (ja) 2020-10-29
AT522487B1 (de) 2022-08-15
AT522487A2 (de) 2020-11-15
DE102020204898A1 (de) 2020-10-22
JP7368098B2 (ja) 2023-10-24

Similar Documents

Publication Publication Date Title
AT518580A3 (de) Waferbearbeitungsverfahren
AT515730A3 (de) Verfahren zum Bearbeiten von Wafern
PH12019550047A1 (en) Working apparatus and working method
SG10201709844WA (en) Laser processing apparatus
EP3081351A3 (de) Roboter-bedienhandgerät, sowie zugehöriges verfahren
EP1801569A3 (de) Verfahren und Vorrichtung zum Erkennen von Rissen in Silizium-Wafern
EP4300542A3 (de) Verfahren zur herstellung von halbleiterscheiben mittels einer drahtsäge, drahtsäge und halbleiterscheibe aus einkristallinem silizium
SG10201808747SA (en) Apparatus for dividing workpiece
MY190186A (en) Cutting apparatus and groove detecting method
EP2394803A3 (de) Verfahren und Bearbeitungsaggregat zum Bündigfräsen und/oder Abziehen eines Kantenbandes
AT522487A3 (de) Waferverarbeitungsverfahren
EP3181291A3 (de) Werkstück mit optischem linsenrohling, verfahren zu dessen herstellung und verfahren zu dessen bearbeitung
AT519921A3 (de) Verfahren und vorrichtung zum ausrichten eines ersten substrats zu einem zweiten substrat
AT504427B8 (de) Vorrichtung zum entgraten eines durch ein brennschneiden abgelängten metallstranges mit hobelwerkzeugen
AT517010A3 (de) Vorrichtung zum selektiven Bereitstellen eines ersten oder mindestens eines zweiten Werkzeugs für eine Drehmaschine
MY186298A (en) Method of cutting workpiece
EP2517847A3 (de) Vorrichtung zum Fixieren eines Werkstückes durch einen Bediener
EP3017910A3 (de) Drehtisch
CH288684A (de) Vorrichtung an einem Apparat zur Inbetriebsetzung desselben unter Einführung eines Fadens in ein Röhrensystem.
EP2999236A3 (de) Verfahren und vorrichtung zur rückkopplungsunterdrückung
EP3255515A3 (de) Verfahren zum betreiben einer cnc-maschine
CH425418A (de) Verfahren zur Erhöhung der Trennschärfe eines Sichtvorganges, insbesondere zur Sichtung von Zement, sowie Vorrichtung zur Durchführung dieses Verfahrens
CH320840A (de) Vorrichtung an Werkzeugmaschinen, insbesondere Koordinatenbohrmaschinen, zum genauen Einstellen und Begrenzen der Verstellbewegung von mindestens einem Verstellschlitten der Werkzeugmaschine
AT518377A3 (de) Verfahren und Vorrichtung zur Behandlung von Flachglaseinheiten an einer glasverarbeitenden Anlage
SG11201806275VA (en) Light-spot distribution structure, surface shape measurement method, and method for calculating exposure field-of-view control value