AT519921A3 - Verfahren und vorrichtung zum ausrichten eines ersten substrats zu einem zweiten substrat - Google Patents
Verfahren und vorrichtung zum ausrichten eines ersten substrats zu einem zweiten substrat Download PDFInfo
- Publication number
- AT519921A3 AT519921A3 ATA50329/2018A AT503292018A AT519921A3 AT 519921 A3 AT519921 A3 AT 519921A3 AT 503292018 A AT503292018 A AT 503292018A AT 519921 A3 AT519921 A3 AT 519921A3
- Authority
- AT
- Austria
- Prior art keywords
- substrate
- aligning
- image
- positioning device
- pixels
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 9
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/42—Alignment or registration features, e.g. alignment marks on the mask substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
- H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
- H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7038—Alignment for proximity or contact printer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
- H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7049—Technique, e.g. interferometric
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Multimedia (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Die Erfindung betrifft ein Verfahren (100) zum Aus-richten eines ersten Substrats (201), insbesondere einer Maske, zu einem zweiten Substrat (203), insbesondere einem Wafer, mit: Einsetzen (101) des ersten Substrats (201) und des zweiten Substrats (203) in eine Positionierungseinrichtung (205); Aufnehmen (103) zumindest eines gemeinsamen Bildes (301) des ersten Substrats (201) und des zweiten Substrats (203); Anzeigen (105) des Bildes (301); Markieren (107) einer Vielzahl von Bildpunkten im Bild (301) durch einen Benutzer; und Ermitteln (109) eines Steuerbefehls zum Ansteuern der Positionierungseinrichtung (205) auf der Basis der markierten Bildpunkte, so dass die Substrate (201, 203) zueinander ausgerichtet werden.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2018856A NL2018856B1 (en) | 2017-05-05 | 2017-05-05 | Method and device for aligning a first substrate with a second substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
AT519921A2 AT519921A2 (de) | 2018-11-15 |
AT519921A3 true AT519921A3 (de) | 2020-02-15 |
Family
ID=59812066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ATA50329/2018A AT519921A3 (de) | 2017-05-05 | 2018-04-19 | Verfahren und vorrichtung zum ausrichten eines ersten substrats zu einem zweiten substrat |
Country Status (8)
Country | Link |
---|---|
US (1) | US20180323069A1 (de) |
JP (1) | JP2018189953A (de) |
KR (1) | KR20180122953A (de) |
CN (1) | CN108807252A (de) |
AT (1) | AT519921A3 (de) |
DE (1) | DE102018108948A1 (de) |
NL (1) | NL2018856B1 (de) |
TW (1) | TW201843761A (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10847369B2 (en) * | 2018-12-26 | 2020-11-24 | Samsung Electronics Co., Ltd. | Wafer bonding method, method for manufacturing semiconductor device, and apparatus therefor |
FR3105876B1 (fr) * | 2019-12-30 | 2021-11-26 | Soitec Silicon On Insulator | Procédé de fabrication d’une structure composite comprenant une couche mince en SiC monocristallin sur un substrat support |
CN115274528B (zh) * | 2022-09-22 | 2022-12-06 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | 一种芯片倒装键合用标定玻璃片 |
US20240258141A1 (en) * | 2023-01-26 | 2024-08-01 | Applied Materials, Inc. | Methods and apparatus for calibration of substrate processing chamber placement via imaging |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030092244A1 (en) * | 2000-04-28 | 2003-05-15 | Hiroyuki Oi | Method and apparatus for producing bonded dielectric separation wafer |
US6856029B1 (en) * | 2001-06-22 | 2005-02-15 | Lsi Logic Corporation | Process independent alignment marks |
US20110134235A1 (en) * | 2008-10-30 | 2011-06-09 | Mitsubishi Heavy Industries, Ltd. | Alignment unit control apparatus and alignment method |
WO2014112512A1 (ja) * | 2013-01-15 | 2014-07-24 | 株式会社アルバック | アラインメント装置、及びアラインメント方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4052603A (en) * | 1974-12-23 | 1977-10-04 | International Business Machines Corporation | Object positioning process and apparatus |
EP1253817A3 (de) * | 2001-04-23 | 2003-07-09 | Liconic Ag | Einrichtung zum Aufnehmen und Plazieren von kleinen Gegenständen |
CN100337089C (zh) * | 2002-09-20 | 2007-09-12 | Asml荷兰有限公司 | 器件检验 |
US7259828B2 (en) * | 2004-05-14 | 2007-08-21 | Asml Netherlands B.V. | Alignment system and method and device manufactured thereby |
JP2010045099A (ja) * | 2008-08-11 | 2010-02-25 | Adwelds:Kk | アライメントマーク画像の表示方法およびアライメント装置 |
-
2017
- 2017-05-05 NL NL2018856A patent/NL2018856B1/nl not_active IP Right Cessation
-
2018
- 2018-04-16 DE DE102018108948.1A patent/DE102018108948A1/de not_active Withdrawn
- 2018-04-19 AT ATA50329/2018A patent/AT519921A3/de not_active Application Discontinuation
- 2018-04-20 JP JP2018081145A patent/JP2018189953A/ja active Pending
- 2018-04-24 TW TW107113819A patent/TW201843761A/zh unknown
- 2018-05-03 KR KR1020180051128A patent/KR20180122953A/ko unknown
- 2018-05-03 US US15/970,303 patent/US20180323069A1/en not_active Abandoned
- 2018-05-04 CN CN201810420967.3A patent/CN108807252A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030092244A1 (en) * | 2000-04-28 | 2003-05-15 | Hiroyuki Oi | Method and apparatus for producing bonded dielectric separation wafer |
US6856029B1 (en) * | 2001-06-22 | 2005-02-15 | Lsi Logic Corporation | Process independent alignment marks |
US20110134235A1 (en) * | 2008-10-30 | 2011-06-09 | Mitsubishi Heavy Industries, Ltd. | Alignment unit control apparatus and alignment method |
WO2014112512A1 (ja) * | 2013-01-15 | 2014-07-24 | 株式会社アルバック | アラインメント装置、及びアラインメント方法 |
Also Published As
Publication number | Publication date |
---|---|
AT519921A2 (de) | 2018-11-15 |
TW201843761A (zh) | 2018-12-16 |
CN108807252A (zh) | 2018-11-13 |
NL2018856B1 (en) | 2018-11-14 |
US20180323069A1 (en) | 2018-11-08 |
KR20180122953A (ko) | 2018-11-14 |
JP2018189953A (ja) | 2018-11-29 |
DE102018108948A1 (de) | 2018-11-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
REJ | Rejection |
Effective date: 20210515 |