AT359583B - MULTILAYER ELECTRONIC LAYER CIRCUIT AND METHOD FOR THEIR PRODUCTION - Google Patents

MULTILAYER ELECTRONIC LAYER CIRCUIT AND METHOD FOR THEIR PRODUCTION

Info

Publication number
AT359583B
AT359583B AT358776A AT358776A AT359583B AT 359583 B AT359583 B AT 359583B AT 358776 A AT358776 A AT 358776A AT 358776 A AT358776 A AT 358776A AT 359583 B AT359583 B AT 359583B
Authority
AT
Austria
Prior art keywords
production
layer circuit
multilayer electronic
electronic layer
multilayer
Prior art date
Application number
AT358776A
Other languages
German (de)
Other versions
ATA358776A (en
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of ATA358776A publication Critical patent/ATA358776A/en
Application granted granted Critical
Publication of AT359583B publication Critical patent/AT359583B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AT358776A 1975-06-13 1976-05-17 MULTILAYER ELECTRONIC LAYER CIRCUIT AND METHOD FOR THEIR PRODUCTION AT359583B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2526553A DE2526553C3 (en) 1975-06-13 1975-06-13 Multilayer electronic circuit and method for its manufacture

Publications (2)

Publication Number Publication Date
ATA358776A ATA358776A (en) 1980-04-15
AT359583B true AT359583B (en) 1980-11-25

Family

ID=5949067

Family Applications (1)

Application Number Title Priority Date Filing Date
AT358776A AT359583B (en) 1975-06-13 1976-05-17 MULTILAYER ELECTRONIC LAYER CIRCUIT AND METHOD FOR THEIR PRODUCTION

Country Status (9)

Country Link
JP (2) JPS5210569A (en)
AT (1) AT359583B (en)
CH (1) CH604344A5 (en)
DE (1) DE2526553C3 (en)
FR (1) FR2314585A1 (en)
GB (1) GB1540112A (en)
IT (1) IT1063970B (en)
NL (1) NL7604158A (en)
SE (1) SE421852B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2045540B (en) * 1978-12-28 1983-08-03 Tdk Electronics Co Ltd Electrical inductive device
EP0062084A1 (en) * 1981-04-06 1982-10-13 Herbert Irwin Schachter Multi-level circuit and method of making same
US4495479A (en) * 1982-10-22 1985-01-22 International Business Machines Corporation Selective wiring for multilayer printed circuit board
JPS60130883A (en) * 1983-12-19 1985-07-12 中央銘板工業株式会社 Multilayer printed circuit board
DE3831148C1 (en) * 1988-09-13 1990-03-29 Robert Bosch Gmbh, 7000 Stuttgart, De
NO900229D0 (en) * 1990-01-16 1990-01-16 Micro Electronics Ame A S PROCEDURE FOR MANUFACTURING MINIATURIZED IMPEDAN CUSTOMIZED WIRING NETWORK.

Also Published As

Publication number Publication date
SE421852B (en) 1982-02-01
GB1540112A (en) 1979-02-07
DE2526553A1 (en) 1976-12-16
DE2526553C3 (en) 1978-06-01
ATA358776A (en) 1980-04-15
JPS5731876U (en) 1982-02-19
SE7606715L (en) 1976-12-14
DE2526553B2 (en) 1977-09-29
FR2314585A1 (en) 1977-01-07
FR2314585B1 (en) 1979-09-28
JPS5210569A (en) 1977-01-26
IT1063970B (en) 1985-02-18
NL7604158A (en) 1976-12-15
CH604344A5 (en) 1978-09-15

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Legal Events

Date Code Title Description
EIH Change in the person of patent owner
ELJ Ceased due to non-payment of the annual fee