AT352204B - MULTI-LAYER PCB AND METHOD OF MANUFACTURING IT - Google Patents

MULTI-LAYER PCB AND METHOD OF MANUFACTURING IT

Info

Publication number
AT352204B
AT352204B AT503974A AT503974A AT352204B AT 352204 B AT352204 B AT 352204B AT 503974 A AT503974 A AT 503974A AT 503974 A AT503974 A AT 503974A AT 352204 B AT352204 B AT 352204B
Authority
AT
Austria
Prior art keywords
manufacturing
layer pcb
pcb
layer
Prior art date
Application number
AT503974A
Other languages
German (de)
Other versions
ATA503974A (en
Inventor
Georgy Avenirovich Kitaev
Vadim Alexandrovich Ploskikh
Viktor Alexeevich Minkov
Viktor Georgievich Kurbakov
Tatyana Nikolaevn Zlatkovskaya
Evangelina Mikhail Chernyshova
Gennady Mikhailovich Fofanov
Viktor Timofeevich Brunov
Evgeny Pavlovich Kotov
Original Assignee
Uralsky Politekhn Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uralsky Politekhn Inst filed Critical Uralsky Politekhn Inst
Priority to AT503974A priority Critical patent/AT352204B/en
Publication of ATA503974A publication Critical patent/ATA503974A/en
Application granted granted Critical
Publication of AT352204B publication Critical patent/AT352204B/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/429Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0344Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
AT503974A 1974-06-18 1974-06-18 MULTI-LAYER PCB AND METHOD OF MANUFACTURING IT AT352204B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT503974A AT352204B (en) 1974-06-18 1974-06-18 MULTI-LAYER PCB AND METHOD OF MANUFACTURING IT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT503974A AT352204B (en) 1974-06-18 1974-06-18 MULTI-LAYER PCB AND METHOD OF MANUFACTURING IT

Publications (2)

Publication Number Publication Date
ATA503974A ATA503974A (en) 1979-02-15
AT352204B true AT352204B (en) 1979-09-10

Family

ID=3571236

Family Applications (1)

Application Number Title Priority Date Filing Date
AT503974A AT352204B (en) 1974-06-18 1974-06-18 MULTI-LAYER PCB AND METHOD OF MANUFACTURING IT

Country Status (1)

Country Link
AT (1) AT352204B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113322499A (en) * 2021-04-27 2021-08-31 昆山一鼎工业科技有限公司 Continuous production method for preparing multilayer electrolytic metal terminal by electrolytic treatment production equipment

Also Published As

Publication number Publication date
ATA503974A (en) 1979-02-15

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee