NL7604158A - MULTI-LAYERED LAYER CIRCUIT AND METHOD OF MANUFACTURE THEREOF. - Google Patents

MULTI-LAYERED LAYER CIRCUIT AND METHOD OF MANUFACTURE THEREOF.

Info

Publication number
NL7604158A
NL7604158A NL7604158A NL7604158A NL7604158A NL 7604158 A NL7604158 A NL 7604158A NL 7604158 A NL7604158 A NL 7604158A NL 7604158 A NL7604158 A NL 7604158A NL 7604158 A NL7604158 A NL 7604158A
Authority
NL
Netherlands
Prior art keywords
manufacture
layer circuit
layered layer
layered
circuit
Prior art date
Application number
NL7604158A
Other languages
Dutch (nl)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of NL7604158A publication Critical patent/NL7604158A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
NL7604158A 1975-06-13 1976-04-20 MULTI-LAYERED LAYER CIRCUIT AND METHOD OF MANUFACTURE THEREOF. NL7604158A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2526553A DE2526553C3 (en) 1975-06-13 1975-06-13 Multilayer electronic circuit and method for its manufacture

Publications (1)

Publication Number Publication Date
NL7604158A true NL7604158A (en) 1976-12-15

Family

ID=5949067

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7604158A NL7604158A (en) 1975-06-13 1976-04-20 MULTI-LAYERED LAYER CIRCUIT AND METHOD OF MANUFACTURE THEREOF.

Country Status (9)

Country Link
JP (2) JPS5210569A (en)
AT (1) AT359583B (en)
CH (1) CH604344A5 (en)
DE (1) DE2526553C3 (en)
FR (1) FR2314585A1 (en)
GB (1) GB1540112A (en)
IT (1) IT1063970B (en)
NL (1) NL7604158A (en)
SE (1) SE421852B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2045540B (en) * 1978-12-28 1983-08-03 Tdk Electronics Co Ltd Electrical inductive device
EP0062084A1 (en) * 1981-04-06 1982-10-13 Herbert Irwin Schachter Multi-level circuit and method of making same
US4495479A (en) * 1982-10-22 1985-01-22 International Business Machines Corporation Selective wiring for multilayer printed circuit board
JPS60130883A (en) * 1983-12-19 1985-07-12 中央銘板工業株式会社 Multilayer printed circuit board
DE3831148C1 (en) * 1988-09-13 1990-03-29 Robert Bosch Gmbh, 7000 Stuttgart, De
NO900229D0 (en) * 1990-01-16 1990-01-16 Micro Electronics Ame A S PROCEDURE FOR MANUFACTURING MINIATURIZED IMPEDAN CUSTOMIZED WIRING NETWORK.

Also Published As

Publication number Publication date
DE2526553C3 (en) 1978-06-01
AT359583B (en) 1980-11-25
IT1063970B (en) 1985-02-18
FR2314585A1 (en) 1977-01-07
SE7606715L (en) 1976-12-14
ATA358776A (en) 1980-04-15
SE421852B (en) 1982-02-01
DE2526553B2 (en) 1977-09-29
CH604344A5 (en) 1978-09-15
FR2314585B1 (en) 1979-09-28
GB1540112A (en) 1979-02-07
JPS5210569A (en) 1977-01-26
DE2526553A1 (en) 1976-12-16
JPS5731876U (en) 1982-02-19

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Legal Events

Date Code Title Description
BV The patent application has lapsed