AT348622B - Spannvorrichtung fuer mindestens ein thermisch und elektrisch druckkontaktiertes halbleiterbauelement in scheibenzellenbauweise - Google Patents

Spannvorrichtung fuer mindestens ein thermisch und elektrisch druckkontaktiertes halbleiterbauelement in scheibenzellenbauweise

Info

Publication number
AT348622B
AT348622B AT66777A AT66777A AT348622B AT 348622 B AT348622 B AT 348622B AT 66777 A AT66777 A AT 66777A AT 66777 A AT66777 A AT 66777A AT 348622 B AT348622 B AT 348622B
Authority
AT
Austria
Prior art keywords
thermally
clamping device
conductor element
cell design
pressure contacted
Prior art date
Application number
AT66777A
Other languages
German (de)
English (en)
Other versions
ATA66777A (de
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Publication of ATA66777A publication Critical patent/ATA66777A/de
Application granted granted Critical
Publication of AT348622B publication Critical patent/AT348622B/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01055—Cesium [Cs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01076—Osmium [Os]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT66777A 1976-02-02 1977-02-02 Spannvorrichtung fuer mindestens ein thermisch und elektrisch druckkontaktiertes halbleiterbauelement in scheibenzellenbauweise AT348622B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2603813A DE2603813C2 (de) 1976-02-02 1976-02-02 Spannvorrichtung für ein thermisch und elektrisch druckkontaktiertes Halbleiterbauelement in Scheibenzellenbauweise

Publications (2)

Publication Number Publication Date
ATA66777A ATA66777A (de) 1978-07-15
AT348622B true AT348622B (de) 1979-02-26

Family

ID=5968800

Family Applications (1)

Application Number Title Priority Date Filing Date
AT66777A AT348622B (de) 1976-02-02 1977-02-02 Spannvorrichtung fuer mindestens ein thermisch und elektrisch druckkontaktiertes halbleiterbauelement in scheibenzellenbauweise

Country Status (3)

Country Link
AT (1) AT348622B (cs)
CH (1) CH604371A5 (cs)
DE (1) DE2603813C2 (cs)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2942401C2 (de) * 1979-10-19 1984-09-06 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit mehreren Halbleiterkörpern
US4504850A (en) * 1981-10-02 1985-03-12 Westinghouse Electric Corp. Disc-type semiconductor mounting arrangement with force distribution spacer
DE3143336A1 (de) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichterbaueinheit
DE3232154A1 (de) * 1982-08-30 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Leistungs-halbleitermodul
US4568962A (en) * 1982-11-08 1986-02-04 Motorola, Inc. Plastic encapsulated semiconductor power device means and method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL96864C (cs) * 1954-01-14 1900-01-01
NL281641A (cs) * 1961-08-04 1900-01-01
GB1001269A (cs) * 1960-09-30 1900-01-01
NL291270A (cs) * 1961-08-12
US3447118A (en) * 1966-08-16 1969-05-27 Westinghouse Electric Corp Stacking module for flat packaged electrical devices
DE2417106A1 (de) * 1974-04-08 1975-10-16 Siemens Ag Thyristorsaeule

Also Published As

Publication number Publication date
CH604371A5 (cs) 1978-09-15
DE2603813A1 (de) 1977-08-04
ATA66777A (de) 1978-07-15
DE2603813C2 (de) 1982-11-18

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee
RZN Patent revoked