AT306183B - Hülle für electronische Einrichtungen in Miniaturausführung - Google Patents

Hülle für electronische Einrichtungen in Miniaturausführung

Info

Publication number
AT306183B
AT306183B AT905065A AT905065A AT306183B AT 306183 B AT306183 B AT 306183B AT 905065 A AT905065 A AT 905065A AT 905065 A AT905065 A AT 905065A AT 306183 B AT306183 B AT 306183B
Authority
AT
Austria
Prior art keywords
cover
electronic equipment
miniature design
miniature
design
Prior art date
Application number
AT905065A
Other languages
English (en)
Original Assignee
Corning Glass Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Glass Works filed Critical Corning Glass Works
Application granted granted Critical
Publication of AT306183B publication Critical patent/AT306183B/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
    • C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
AT905065A 1964-10-12 1965-10-06 Hülle für electronische Einrichtungen in Miniaturausführung AT306183B (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US403125A US3340347A (en) 1964-10-12 1964-10-12 Enclosed electronic device
US61887267A 1967-02-27 1967-02-27

Publications (1)

Publication Number Publication Date
AT306183B true AT306183B (de) 1973-03-26

Family

ID=27018165

Family Applications (1)

Application Number Title Priority Date Filing Date
AT905065A AT306183B (de) 1964-10-12 1965-10-06 Hülle für electronische Einrichtungen in Miniaturausführung

Country Status (4)

Country Link
US (2) US3340347A (de)
AT (1) AT306183B (de)
DE (1) DE1489781B2 (de)
GB (1) GB1101029A (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514273B2 (de) * 1964-08-21 1974-08-22 Nippon Electric Co., Ltd., Tokio Halbleiteranordmng
US3505726A (en) * 1966-12-02 1970-04-14 Western Electric Co Bonding process which reduces workpiece displacement and backwelding
US3648121A (en) * 1967-09-06 1972-03-07 Tokyo Shibaura Electric Co A laminated semiconductor structure
US3469017A (en) * 1967-12-12 1969-09-23 Rca Corp Encapsulated semiconductor device having internal shielding
US3590480A (en) * 1968-10-03 1971-07-06 Theodore H Johnson Jr Method of manufacturing a pulse transformer package
NL7011885A (de) * 1970-08-12 1972-02-15
US3767839A (en) * 1971-06-04 1973-10-23 Wells Plastics Of California I Plastic micro-electronic packages
US3774232A (en) * 1971-11-11 1973-11-20 Circuit Stik Inc Package for integrated circuit chip
US3778127A (en) * 1971-12-30 1973-12-11 Ibm Sealing technique for gas panel
US3778126A (en) * 1971-12-30 1973-12-11 Ibm Gas display panel without exhaust tube structure
US3984166A (en) * 1975-05-07 1976-10-05 Burroughs Corporation Semiconductor device package having lead frame structure with integral spring contacts
US4141712A (en) * 1977-07-18 1979-02-27 Diacon Inc. Manufacturing process for package for electronic devices
JPS598358Y2 (ja) * 1978-02-08 1984-03-15 京セラ株式会社 半導体素子パツケ−ジ
IT1180514B (it) * 1984-07-27 1987-09-23 Arcotroniks Italia Spa Procedimento per la realizzazione di involucri protettivi in cui risultano annegati corrispondenti componenti elettrico elettronici
US4651415A (en) * 1985-03-22 1987-03-24 Diacon, Inc. Leaded chip carrier
US4704626A (en) * 1985-07-08 1987-11-03 Olin Corporation Graded sealing systems for semiconductor package
US4729010A (en) * 1985-08-05 1988-03-01 Hitachi, Ltd. Integrated circuit package with low-thermal expansion lead pieces
US5133795A (en) * 1986-11-04 1992-07-28 General Electric Company Method of making a silicon package for a power semiconductor device
US4961106A (en) * 1987-03-27 1990-10-02 Olin Corporation Metal packages having improved thermal dissipation
US5034044A (en) * 1988-05-11 1991-07-23 General Electric Company Method of bonding a silicon package for a power semiconductor device
US5151118A (en) * 1988-07-08 1992-09-29 Kabushiki Kaisha Goto Seisakusho Method for producing a package-type semiconductor assembly
US5334874A (en) * 1991-09-13 1994-08-02 Metzler Richard A Electronic device package
US5420752A (en) * 1993-08-18 1995-05-30 Lsi Logic Corporation GPT system for encapsulating an integrated circuit package
US5585203A (en) * 1994-03-03 1996-12-17 Murata Manufacturing Co., Ltd. Method of producing a solid oxide fuel cell
US5891751A (en) * 1995-06-02 1999-04-06 Kulite Semiconductor Products, Inc . Hermetically sealed transducers and methods for producing the same
US5805048A (en) * 1995-09-01 1998-09-08 Sumitomo Wiring Systems, Ltd. Plate fuse and method of producing the same
NL1004651C2 (nl) * 1996-11-29 1998-06-03 Nedcard Werkwijze voor het inkapselen van een chip op een drager.
US20070138240A1 (en) * 2005-12-15 2007-06-21 Aleksandra Djordjevic Method for forming leadframe assemblies
US8851923B2 (en) 2012-08-08 2014-10-07 Emerson Electric Co. Hermetically sealed terminal pins with holes for connecting to wires
USD937231S1 (en) 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
CN114434589B (zh) * 2022-01-28 2023-11-07 Oppo广东移动通信有限公司 陶瓷壳体制备方法、陶瓷壳体及电子设备

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2771663A (en) * 1952-12-04 1956-11-27 Jr Robert L Henry Method of making modular electronic assemblies
US2744180A (en) * 1953-03-30 1956-05-01 Daniel M Sullivan Electrical contact or circuit component
LU38605A1 (de) * 1959-05-06
NL120812C (de) * 1959-07-01 1965-12-15
US3159775A (en) * 1960-11-30 1964-12-01 Sylvania Electric Prod Semiconductor device and method of manufacture
NL272139A (de) * 1960-12-15 1900-01-01
DE1416437B2 (de) * 1961-09-21 1970-06-11 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Trägerplatte für mikrominiaturisierte Schaltelemente und Verfahren zu ihrer Herstellung
US3303265A (en) * 1962-05-17 1967-02-07 Texas Instruments Inc Miniature semiconductor enclosure
US3190952A (en) * 1963-02-21 1965-06-22 Bitko Sheldon Welded hermetic seal
GB1087863A (en) * 1963-04-18 1967-10-18 Sealectro Corp Improvements in electrical socket connectors and other electrical contact devices
US3187083A (en) * 1963-06-17 1965-06-01 Rca Corp Container for an electrical component
US3231797A (en) * 1963-09-20 1966-01-25 Nat Semiconductor Corp Semiconductor device
DE1249466B (de) * 1963-10-29 1900-01-01
US3289045A (en) * 1964-03-02 1966-11-29 Intellux Inc Circuit module

Also Published As

Publication number Publication date
DE1489781A1 (de) 1969-07-03
US3501833A (en) 1970-03-24
US3340347A (en) 1967-09-05
DE1489781B2 (de) 1972-12-21
GB1101029A (en) 1968-01-31

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