AT252314B - Verfahren zum Herstellen eines Quarzkristall-Bauelementes - Google Patents

Verfahren zum Herstellen eines Quarzkristall-Bauelementes

Info

Publication number
AT252314B
AT252314B AT735164A AT735164A AT252314B AT 252314 B AT252314 B AT 252314B AT 735164 A AT735164 A AT 735164A AT 735164 A AT735164 A AT 735164A AT 252314 B AT252314 B AT 252314B
Authority
AT
Austria
Prior art keywords
producing
quartz crystal
crystal component
component
quartz
Prior art date
Application number
AT735164A
Other languages
English (en)
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Application granted granted Critical
Publication of AT252314B publication Critical patent/AT252314B/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04—Joining glass to metal by means of an interlayer
    • C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
    • C03C27/046—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of metals, metal oxides or metal salts only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/903—Metal to nonmetal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Products (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
AT735164A 1963-09-13 1964-08-25 Verfahren zum Herstellen eines Quarzkristall-Bauelementes AT252314B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US308724A US3296692A (en) 1963-09-13 1963-09-13 Thermocompression wire attachments to quartz crystals

Publications (1)

Publication Number Publication Date
AT252314B true AT252314B (de) 1967-02-10

Family

ID=23195134

Family Applications (1)

Application Number Title Priority Date Filing Date
AT735164A AT252314B (de) 1963-09-13 1964-08-25 Verfahren zum Herstellen eines Quarzkristall-Bauelementes

Country Status (5)

Country Link
US (1) US3296692A (de)
AT (1) AT252314B (de)
BE (1) BE652993A (de)
GB (1) GB1004553A (de)
NL (1) NL6409927A (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3461542A (en) * 1966-01-06 1969-08-19 Western Electric Co Bonding leads to quartz crystals
DE1671014A1 (de) * 1966-01-14 1971-08-26 Siemens Ag Verfahren zur Herstellung einer lotfreien gasdichten Verbindung
GB1256518A (de) * 1968-11-30 1971-12-08
US4096983A (en) * 1977-04-11 1978-06-27 E-Systems, Inc. Bonding copper leads to gold film coatings on alumina ceramic substrate
DE3319339A1 (de) * 1982-05-31 1983-12-29 Sharp K.K., Osaka Treiberanordnung fuer eine x-y-elektrodenmatrix
JPS5916282A (ja) * 1982-07-19 1984-01-27 Yuasa Battery Co Ltd ナトリウム−硫黄電池の製造法
US5476211A (en) * 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
GB2186456B (en) * 1986-01-13 1989-11-08 Hitachi Ltd Surface acoustic wave device
GB8609771D0 (en) * 1986-04-22 1986-05-29 Lilliwyte Sa Electrochemical cells
US4955523A (en) * 1986-12-17 1990-09-11 Raychem Corporation Interconnection of electronic components
US5189507A (en) * 1986-12-17 1993-02-23 Raychem Corporation Interconnection of electronic components
US20020053734A1 (en) * 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US5820014A (en) * 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US7073254B2 (en) * 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5994152A (en) * 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) * 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5715989A (en) * 1996-06-04 1998-02-10 Texas Instruments Incorporated Microelectronic wire bonding using friction welding process
US6019272A (en) * 1997-11-12 2000-02-01 Ford Global Technologies, Inc. Method for attaching a terminal connector to a metallic surface
US6781303B2 (en) 2001-09-10 2004-08-24 Light Sources, Inc. Mercury vapor lamp amalgam target
DE102005003370A1 (de) * 2005-01-24 2006-07-27 Juma Pcb Gmbh Verfahren zur durchgehenden Verlegung eines Leitungsdrahtes auf einer Leiterplatte und Vorrichtung zur Durchführung des Verfahrens

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2669660A (en) * 1951-10-27 1954-02-16 Western Electric Co Leak detecting apparatus
US2812270A (en) * 1954-01-28 1957-11-05 Continental Can Co Method and apparatus for depositing metal coatings on metal bases
NL219101A (de) * 1956-10-31 1900-01-01
BE581574A (de) * 1958-08-11
US3071491A (en) * 1960-10-05 1963-01-01 Charles W Horn Titanium coating process
US3217401A (en) * 1962-06-08 1965-11-16 Transitron Electronic Corp Method of attaching metallic heads to silicon layers of semiconductor devices

Also Published As

Publication number Publication date
US3296692A (en) 1967-01-10
BE652993A (de) 1964-12-31
NL6409927A (de) 1965-03-15
GB1004553A (en) 1965-09-15

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