AR227225A1 - Composicion de moldeo termoplastica,pirorretardante de gran electroconductividad,procedimiento para producirla,procedimiento para producir un articulo moldeado,pirorretardante altamente conductor utilizando dicha composicion y articulo asi producido - Google Patents

Composicion de moldeo termoplastica,pirorretardante de gran electroconductividad,procedimiento para producirla,procedimiento para producir un articulo moldeado,pirorretardante altamente conductor utilizando dicha composicion y articulo asi producido

Info

Publication number
AR227225A1
AR227225A1 AR288473A AR28847382A AR227225A1 AR 227225 A1 AR227225 A1 AR 227225A1 AR 288473 A AR288473 A AR 288473A AR 28847382 A AR28847382 A AR 28847382A AR 227225 A1 AR227225 A1 AR 227225A1
Authority
AR
Argentina
Prior art keywords
composition
highly
pyramid
article
procedure
Prior art date
Application number
AR288473A
Other languages
English (en)
Original Assignee
Diamond Shamrock Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diamond Shamrock Corp filed Critical Diamond Shamrock Corp
Application granted granted Critical
Publication of AR227225A1 publication Critical patent/AR227225A1/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/022—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the choice of material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/12—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of short lengths, e.g. chopped filaments, staple fibres or bristles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2327/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
    • C08J2327/06—Homopolymers or copolymers of vinyl chloride

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Medical Uses (AREA)
AR288473A 1981-02-27 1982-02-18 Composicion de moldeo termoplastica,pirorretardante de gran electroconductividad,procedimiento para producirla,procedimiento para producir un articulo moldeado,pirorretardante altamente conductor utilizando dicha composicion y articulo asi producido AR227225A1 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23875781A 1981-02-27 1981-02-27
US06/332,000 US4490283A (en) 1981-02-27 1981-12-18 Flame retardant thermoplastic molding compounds of high electroconductivity

Publications (1)

Publication Number Publication Date
AR227225A1 true AR227225A1 (es) 1982-09-30

Family

ID=26931919

Family Applications (1)

Application Number Title Priority Date Filing Date
AR288473A AR227225A1 (es) 1981-02-27 1982-02-18 Composicion de moldeo termoplastica,pirorretardante de gran electroconductividad,procedimiento para producirla,procedimiento para producir un articulo moldeado,pirorretardante altamente conductor utilizando dicha composicion y articulo asi producido

Country Status (7)

Country Link
US (1) US4490283A (es)
EP (1) EP0059456A3 (es)
KR (1) KR830009164A (es)
AR (1) AR227225A1 (es)
DK (1) DK85282A (es)
IL (1) IL65038A0 (es)
NO (1) NO820592L (es)

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US5378879A (en) * 1993-04-20 1995-01-03 Raychem Corporation Induction heating of loaded materials
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US10541482B2 (en) 2015-07-07 2020-01-21 Amphenol Fci Asia Pte. Ltd. Electrical connector with cavity between terminals
TWI754439B (zh) 2015-07-23 2022-02-01 美商安芬諾Ｔｃｓ公司 連接器、製造連接器方法、用於連接器的擴充器模組以及電子系統
US10312638B2 (en) 2016-05-31 2019-06-04 Amphenol Corporation High performance cable termination
CN109155491B (zh) 2016-06-01 2020-10-23 安费诺Fci连接器新加坡私人有限公司 高速电连接器
TWI790798B (zh) 2016-08-23 2023-01-21 美商安芬諾股份有限公司 可配置為高性能的連接器
CN115189188A (zh) 2016-10-19 2022-10-14 安费诺有限公司 柔性屏蔽件、电连接器及电子装置
CN115275663A (zh) 2017-08-03 2022-11-01 安费诺有限公司 用于低损耗互连系统的连接器以及电子器件系统
US11710917B2 (en) 2017-10-30 2023-07-25 Amphenol Fci Asia Pte. Ltd. Low crosstalk card edge connector
US10601181B2 (en) 2017-12-01 2020-03-24 Amphenol East Asia Ltd. Compact electrical connector
US10777921B2 (en) 2017-12-06 2020-09-15 Amphenol East Asia Ltd. High speed card edge connector
DE202018101536U1 (de) * 2018-03-20 2019-06-24 Rehau Ag + Co Polymerzusammensetzung
US10665973B2 (en) 2018-03-22 2020-05-26 Amphenol Corporation High density electrical connector
CN115632285A (zh) 2018-04-02 2023-01-20 安达概念股份有限公司 受控阻抗线缆连接器以及与其耦接的装置
CN208862209U (zh) 2018-09-26 2019-05-14 安费诺东亚电子科技(深圳)有限公司 一种连接器及其应用的pcb板
CN113169484A (zh) 2018-10-09 2021-07-23 安费诺商用电子产品(成都)有限公司 高密度边缘连接器
TWM576774U (zh) 2018-11-15 2019-04-11 香港商安費諾（東亞）有限公司 具有防位移結構之金屬殼體及其連接器
US10931062B2 (en) 2018-11-21 2021-02-23 Amphenol Corporation High-frequency electrical connector
US11381015B2 (en) 2018-12-21 2022-07-05 Amphenol East Asia Ltd. Robust, miniaturized card edge connector
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US11101611B2 (en) 2019-01-25 2021-08-24 Fci Usa Llc I/O connector configured for cabled connection to the midboard
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Also Published As

Publication number Publication date
US4490283A (en) 1984-12-25
KR830009164A (ko) 1983-12-17
IL65038A0 (en) 1982-04-30
DK85282A (da) 1982-08-28
EP0059456A2 (en) 1982-09-08
NO820592L (no) 1982-08-30
EP0059456A3 (en) 1983-02-09

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