WO2021229860A1

WO2021229860A1 - Manufacturing assist system and manufacturing assist method

Info

Publication number: WO2021229860A1
Application number: PCT/JP2021/002993
Authority: WO
Inventors: 凜香東山; 昇早坂
Original assignee: Ｔｏｗａ株式会社
Priority date: 2020-05-15
Filing date: 2021-01-28
Publication date: 2021-11-18
Also published as: JP7291666B2; TW202145126A; TWI787790B; CN115315778A; KR20230009943A; JP2021180286A

Abstract

A manufacturing assist system for assisting manufacturing using a semiconductor manufacturing device, comprising: a holding unit that is disposed in an evaluation body and holds information specifying a semiconductor manufacturing device used or to be used in a use body and information specifying a manufacturing process to be executed by the semiconductor manufacturing device; an evaluation unit that is disposed in the evaluation body and evaluates the appropriateness of a material provided from a material supply body for supplying a material used by a semiconductor manufacturing device, on the basis of information specifying the material and information held by the holding unit; and an evaluation result providing unit for providing an evaluation result by the evaluation unit to the material supply body.

Description

Manufacturing support system and manufacturing support method

The present invention relates to a manufacturing support system and a manufacturing support method that support manufacturing using a semiconductor manufacturing apparatus.

In the manufacture of semiconductor devices, various approaches to shorten the lead time have been proposed by prior performance evaluation. As one of such approaches, Japanese Patent Application Laid-Open No. 2003-259015 (Patent Document 1) provides a process engineer of a semiconductor manufacturing equipment vendor and a semiconductor device maker (customer) as a preliminary activity for selling a semiconductor manufacturing equipment. Discloses an electronic conferencing system that allows process engineers in the world to hold conferences on semiconductor device processes or semiconductor manufacturing equipment performance without having to go to each other.

Japanese Patent Application Laid-Open No. 2003-259015

The electronic conferencing system disclosed in JP-A-2003-259015 (Patent Document 1) is intended for prior activities for selling semiconductor manufacturing equipment, and uses samples provided by semiconductor device manufacturers. The performance is evaluated in advance.

However, since various materials provided by material manufacturers are used in the actual manufacturing process of semiconductor devices, if the process engineer of the semiconductor device manufacturer does not have knowledge including material selection, the quality is appropriate. It is not always possible to manufacture semiconductor devices.

An object of the present invention is to provide a new mechanism for supporting the manufacture of a semiconductor device using such a semiconductor manufacturing device.

According to a certain aspect of the present invention, a manufacturing support system that supports manufacturing using a semiconductor manufacturing apparatus is provided. The manufacturing support system is located in the evaluator, which holds the information that identifies the semiconductor manufacturing equipment that will be used or will be used by the user and the information that identifies the manufacturing process performed by the semiconductor manufacturing equipment. The suitability of the material is evaluated based on the information provided by the holding unit, the material supplier that supplies the material used in the semiconductor manufacturing equipment, and the information held by the holding unit. , The evaluation unit assigned to the evaluation entity and the evaluation result providing unit that provides the evaluation result by the evaluation entity to the material supply entity.

According to another aspect of the present invention, a manufacturing support method for supporting manufacturing using a semiconductor manufacturing apparatus is provided. In the manufacturing support method, the holding unit arranged in the evaluation subject specifies information for identifying the semiconductor manufacturing equipment used or planned to be used by the user, and the manufacturing process executed in the semiconductor manufacturing equipment. Based on the steps to retain the information, the information that identifies the material provided by the material supplier that supplies the material used in the semiconductor manufacturing equipment in the evaluator, and the information that is retained by the retainer. It includes a step of evaluating the suitability of a material and a step of providing an evaluation result by the evaluation step to a material supplier.

It is possible to provide a new mechanism to support the manufacture of semiconductor devices using semiconductor manufacturing devices.

It is a schematic diagram for demonstrating the outline of the manufacturing support system according to this embodiment. It is a sequence diagram which shows the processing procedure executed in the manufacturing support system according to this embodiment. It is a schematic diagram for demonstrating one of the application examples of the manufacturing support system according to this Embodiment. It is a sequence diagram which shows the processing procedure executed in one of the application examples of the manufacturing support system according to this embodiment. It is a schematic diagram which shows an example of the apparatus configuration of the management apparatus which comprises the manufacturing support system according to this embodiment. It is a schematic diagram which shows the implementation example of the data retention in the manufacturing support system according to this embodiment.

An embodiment of the present invention will be described in detail with reference to the drawings. The same or corresponding parts in the drawings are designated by the same reference numerals and the description thereof will not be repeated.

<A. Overview of manufacturing support system configuration and processing>
First, the configuration of the manufacturing support system 1 and the outline of the processing in the manufacturing support system 1 according to the present embodiment will be described. The manufacturing support system 1 supports manufacturing using a semiconductor manufacturing apparatus. In the following description, the supply of various materials used in the semiconductor manufacturing apparatus will be mainly described, but the manufacturing support system 1 according to the present embodiment is not limited to these ranges.

FIG. 1 is a schematic diagram for explaining an outline of the manufacturing support system 1 according to the present embodiment. With reference to FIG. 1, the manufacturing support system 1 mainly supplies one or a plurality of users 20 using the semiconductor manufacturing apparatus 50 and one or a plurality of materials used in the semiconductor manufacturing apparatus 50. The supply entity 30 and the evaluation entity 10 that evaluates in advance the suitability of the material 60 supplied by the material supply entity 30 are involved.

In FIG. 1, "X" is attached to the information exchanged between the evaluation subject 10 and the "user subject X" which is one of the user subjects 20, and the evaluation subject 10 and the material supply subject 30 are used. "A" is attached to the information exchanged between a certain "material supply subject A" and between the "user subject X" and the "material supply subject A". For example, information having the same name but different signs of "X" and "A", such as "device information X" and "device information A", may have the same content or different contents. It may be information. The same applies to FIGS. 2 to 4 below.

In the present specification, the user subject 20 is a term that includes a user who uses the semiconductor manufacturing apparatus 50 in any form, and for example, a semiconductor maker, a semiconductor device maker, and an assembly house (undertaking only a package assembly process in semiconductor manufacturing). Includes companies), OSAT (semiconductor contract package testing business), foundry companies (semiconductor chip manufacturing companies), etc.

In the present specification, the "material supply entity" includes any entity that manufactures and / or sells any material 60 used in the semiconductor manufacturing apparatus 50, and is referred to as "evaluation entity 10" and "user entity 20". Is a different subject.

For example, as the semiconductor manufacturing apparatus 50, a molding apparatus for resin-sealing an electronic component including a semiconductor chip and a singing apparatus for individualizing an electronic component including a semiconductor chip are assumed. Such a resin encapsulation device seals a semiconductor chip mounted on a substrate (lead frame, printed circuit board, ceramics substrate, metal substrate, glass substrate, semiconductor substrate, resin substrate, etc.) with resin. Stop. The material supply main body 30 supplies a resin or a substrate for encapsulating a semiconductor chip as a material 60. The material 60 used in the semiconductor manufacturing apparatus 50 is not limited to such resins and substrates, and includes any consumable material related to the manufacturing process of the semiconductor manufacturing apparatus 50.

The user main body 20 manufactures a semiconductor device by the semiconductor manufacturing device 50 using the material 60 supplied by the material supply main body 30. The user main body 20 specifies specifications, quality performance, and the like of the material 60 to be supplied to the material supply main body 30 in consideration of the manufacturing process of its own semiconductor manufacturing apparatus 50. The material supply entity 30 supplies the material 60 that meets the specified specifications and quality performance.

However, not all users 20 have sufficient knowledge about the manufacturing process. Further, in the initial adjustment stage of the newly introduced semiconductor manufacturing apparatus 50, the manufacturing process is optimized by repeating trial and error, and the specifications and quality performance of the material 60 to be used are determined.

In optimizing the manufacturing process, it is necessary to evaluate the semiconductor device or its semi-finished product manufactured by the semiconductor manufacturing device 50 using the evaluation device. However, not all users 20 have an evaluation device, and in particular, with the miniaturization of manufactured semiconductor devices, a higher performance evaluation device is required. In addition, there may be a user 20 who cannot properly feed back the evaluation result output from the evaluation device to the manufacturing process even if he / she has it.

The manufacturing support system 1 according to the present embodiment provides a means for solving the above-mentioned problems related to the semiconductor manufacturing apparatus 50 used by the user 20. That is, the evaluation subject 10 is in charge of a part or all of the evaluation work performed by the user subject 20, and is also in charge of the preliminary evaluation of the specifications and quality performance of the material 60 supplied by the material supply entity 30. Due to the existence of such an evaluation subject 10 and the services provided, the user entity 20 does not have sufficient knowledge about the manufacturing process itself, and the user entity 20 cannot sufficiently evaluate the quality of the manufacturing process. Also, it is possible to facilitate the manufacture of a semiconductor device using the semiconductor manufacturing device 50.

Further, for the material supply entity 30, it is possible to increase the certainty that the material suitable for the semiconductor manufacturing apparatus 50 used by the user entity 20 of the supply destination can be supplied, so that a stronger supply system can be realized.

The evaluation subject 10 basically has the semiconductor manufacturing apparatus 50 and the evaluation apparatus 12 which are substantially the same as the semiconductor manufacturing apparatus 50 used by the user entity 20. It is preferable that the evaluation subject 10 is basically a manufacturer of the semiconductor manufacturing apparatus 50 or an affiliated company thereof. However, the evaluation subject 10 may be any organization or individual, not limited to the manufacturer of the semiconductor manufacturing apparatus 50 or its affiliated company.

In order to manage the information exchanged between the three parties, the management device 14, the management device 24, and the management device 34 may be arranged in the evaluation main body 10, the user main body 20, and the material supply main body 30, respectively.

Device information, evaluation information, process information, and certification information are exchanged between the evaluation subject 10 and the user subject 20. Equipment information, evaluation information, process information, and material information are exchanged between the evaluation subject 10 and the material supply entity 30. Equipment information, evaluation information, process information, and certification information are exchanged between the user entity 20 and the material supply entity 30. Here, each information exchanged between the three parties will be described.

The device information includes information that identifies the semiconductor manufacturing device 50 that is used or will be used by the user 20. The device information may further include information for identifying a commutative member or the like used in the target semiconductor manufacturing device 50.

The evaluation information includes the evaluation result when the target material 60 is used in the target semiconductor manufacturing apparatus 50 under the target manufacturing conditions.

The process information includes information that identifies the manufacturing process executed by the target semiconductor manufacturing apparatus 50. Typically, the process information includes information that defines the manufacturing conditions that apply to the semiconductor manufacturing equipment 50 of interest.

Material information includes information about the target material 60.

The certification information includes the required specifications in the manufacturing process including the target semiconductor manufacturing apparatus 50. The certification information is determined by the user 20.

FIG. 2 is a sequence diagram showing a processing procedure executed by the manufacturing support system 1 according to the present embodiment. An example of the processing procedure executed by the manufacturing support system 1 will be described with reference to FIGS. 1 and 2. In the example shown in FIG. 2, it is assumed that the evaluation subject 10 is a manufacturer of the semiconductor manufacturing apparatus 50, and the user entity 20 assumes a situation in which a new semiconductor manufacturing apparatus 50 is introduced. In such an aspect, the material supply entity 30 develops the material 60 used in the newly introduced semiconductor manufacturing apparatus 50.

In the phase of developing the material 60, the material supply entity 30 develops the material 60 according to the manufacturing conditions and the like presented by the user entity 20 and the like (step S2). The material supply entity 30 provides a part (material sample) of the developed material 60 and material information to the evaluation entity 10 (step S4). If the evaluation subject 10 can analyze the material sample, it is not always necessary to provide the material information.

The evaluation subject 10 includes device information (information specifying the semiconductor manufacturing device 50 used or planned to be used by the user body 20) and process information (information specifying the manufacturing process executed by the semiconductor manufacturing device 50). ) Is held in advance.

The evaluation subject 10 evaluates using the material sample provided by the material supply entity 30 (step S6). More specifically, the evaluation subject 10 determines the suitability of the material 60 based on the information specifying the material 60 provided by the material supply entity 30 and the information held by the evaluation entity 10 (device information and process information). To evaluate. Then, the evaluation subject 10 provides the device information and the process information to the material supply entity 30 together with the evaluation result obtained by the evaluation (step S8).

In the development phase of the material 60, the processes (* 1) of steps S2 to S8 are repeatedly executed. In this way, the evaluation subject 10 may perform processing for evaluating the suitability of the material 60 for each of the plurality of different materials 60. Specifically, in the process of evaluating suitability, the composition ratio of the material 60 can be used as an example.

After the evaluation results are obtained for one or more materials, candidate materials to be supplied to the user main body 20 are determined between the evaluation main body 10 and the material supply main body 30 as necessary (step S10). ). Then, the evaluation subject 10 provides the device information, the evaluation information, and the process information to the user subject 20 for the material determined as the candidate (step S12). Similarly, the material supply entity 30 provides device information, evaluation information, and process information to the user entity 20 for the material determined as a candidate (step S14).

The device information, evaluation information, and process information provided by the evaluation subject 10 in step S12 basically match the device information, evaluation information, and process information provided by the material supply entity 30 in step S14. .. The purpose of this is to prevent mistakes in information provision by confirming the identity of the information provided by each entity. From the viewpoint of simplifying the process, either step S12 or step S14 may be omitted.

The user 20 makes a final performance check with reference to the provided device information, evaluation information, and process information (step S16). Upon accepting the content of the performance confirmation, the user main body 20 transmits the certification information to the user main body 20 (step S18) and also transmits the certification information to the material supply main body 30 (step S20).

The above processing completes the pre-evaluation of the manufacturing process. Then, the user 20 orders the semiconductor manufacturing apparatus including the certification information from the evaluation subject 10 (in this example, the manufacturer of the semiconductor manufacturing apparatus 50) (step S22), and certifies the material supply entity 30. Order the material containing the information (step S24).

The evaluation subject 10 (manufacturer of the semiconductor manufacturing apparatus 50) manufactures the semiconductor manufacturing apparatus 50 according to the order from the user entity 20 (step S26), and delivers the manufactured semiconductor manufacturing apparatus 50 to the user entity 20 (step S28). .. Further, the material supply entity 30 manufactures the material 60 according to the order from the user entity 20 (step S30), and delivers the manufactured material 60 to the user entity 20 (step S32).

The pre-evaluation of the manufacturing process is completed according to the processing procedure as shown in FIG.

Note that FIG. 2 shows a processing procedure for pre-evaluation of the manufacturing process. However, if the user 20 wishes to review the manufacturing process after the semiconductor manufacturing apparatus 50 is delivered, steps S2 to S20 are performed. The process may be executed again.

<B. Evaluation process>
Next, an example of the evaluation process by the evaluation subject 10 will be described.

Typically, the evaluation subject 10 is a manufacturer of the semiconductor manufacturing apparatus 50 or an affiliated company thereof, and has substantially the same semiconductor manufacturing apparatus 50 as the semiconductor manufacturing apparatus 50 used by the user entity 20. Alternatively, it is possible to prepare a semiconductor manufacturing apparatus 50 that is substantially the same as the semiconductor manufacturing apparatus 50 used by the user 20.

The evaluation subject 10 uses the material sample provided by the material supply entity 30 in the semiconductor manufacturing apparatus 50 that is substantially the same as the semiconductor manufacturing apparatus 50 used or planned to be used by the user entity 20, and the user entity 20 is used. Reproduces the manufacturing process scheduled to be carried out or the manufacturing process being carried out. The product (semiconductor device) or its semi-finished product manufactured by the reproduced manufacturing process is evaluated by the evaluation device 12. Alternatively, it is possible to evaluate the influence of the reproduced manufacturing process on the semiconductor manufacturing apparatus 50 and the like.

As described above, the evaluation subject 10 has device information (information specifying the semiconductor manufacturing apparatus 50 used or planned to be used by the user entity 20) and process information (manufacturing process executed by the semiconductor manufacturing apparatus 50). Information that identifies the material 60), and the suitability of the material 60 based on the information that identifies the material 60 provided by the material supply entity 30 and the information (device information and process information) that the evaluation entity 10 holds. To evaluate. Then, the evaluation subject 10 provides the evaluation result to the material supply entity 30.

Evaluation of the semiconductor device or its semi-finished product manufactured by the reproduced manufacturing process may be performed by shape observation. Evaluation items include (1) external dimensions and warpage amount, (2) cross-sectional observation image, (3) thermal warp amount transition, (4) internal observation result, (5) hardness measurement result, and the like. Corresponding to such evaluation items, as the evaluation device 12 for evaluating the quality of the semiconductor device or the semi-finished product of the semiconductor device, a measuring device for measuring the shape, a microscope for acquiring a cross-sectional observation image, and an internal observation are performed. It may include any one of the exploration device for measuring the hardness and the hardness meter for measuring the hardness.

More specifically, for the evaluation of (1) external dimensions and the amount of warpage, and (3) the change in the amount of warpage during heat, the evaluation device 12 includes a heating warp measuring device (TSM) and an ultrasonic exploration device (SAT). A measuring device for measuring such a shape is used. (2) An optical microscope, a scanning electron microscope (SEM), or the like is used as the evaluation device 12 for the evaluation of the cross-sectional observation image. (4) An ultrasonic exploration device, an X-ray fluoroscope, or the like is used as the evaluation device 12 for the evaluation of the internal observation result. (5) A hardness tester or the like is used as the evaluation device 12 for evaluating the hardness measurement result.

The evaluation of the influence of the reproduced manufacturing process on the semiconductor manufacturing apparatus 50 may be performed by observing the molds and jigs and tools used in the semiconductor manufacturing apparatus 50. The evaluation items include (1) presence / absence of dirt on the mold surface, (2) blade wear state, (3) blade wear amount, and the like. Corresponding to such an evaluation item, any one of the observation device and the exploration device may be included as a configuration for evaluating the wear of substantially the same semiconductor manufacturing apparatus 50.

More specifically, (1) the presence or absence of dirt on the mold surface may be evaluated visually by a human being, or an observation device or the like may be used as the evaluation device 12. (2) An ultrasonic exploration device, an X-ray fluoroscope, or the like is used as the evaluation device 12 for evaluating the blade wear state. (3) A measuring device for measuring the shape is used for evaluating the amount of blade wear.

Not limited to the above-mentioned items, one or a plurality of evaluation devices 12 may be used depending on any evaluation item.

As described above, the evaluation unit of the evaluation subject 10 includes the semiconductor manufacturing apparatus 50 substantially the same as the semiconductor manufacturing apparatus 50 used or planned to be used by the user entity 20, and the semiconductor manufacturing apparatus 50 substantially the same. May include a semiconductor device manufactured by the semiconductor device or an evaluation device 12 for evaluating the quality of a semi-finished product of the semiconductor device and / or the wear of the substantially same semiconductor manufacturing device 50.

Typically, the evaluation is performed by reproducing the manufacturing process using the semiconductor manufacturing apparatus 50, but some or all of the evaluation may be realized by simulation. When the evaluation is performed by simulation, a simulation of the target manufacturing process can be realized by preparing a model of the semiconductor manufacturing apparatus 50 and generating a model according to the material information supplied from the material supply main body 30. In the case of evaluation by simulation, it is not always necessary to provide the material sample from the material supply main body 30 to the evaluation main body 10.

As described above, the evaluation unit of the evaluation subject 10 may include a simulation apparatus using a model of the semiconductor manufacturing apparatus 50 used or planned to be used by the user entity 20. By using the simulation, the evaluation can be performed even if the semiconductor manufacturing apparatus 50 is not actually possessed.

<C. Information details>
Next, the details of the information exchanged in the manufacturing support system 1 according to the present embodiment will be described.

(C1: Device information)
The device information includes information for identifying the target semiconductor manufacturing device 50, the commutative member to be used, and the like. More specifically, if the semiconductor manufacturing apparatus 50 is a molding apparatus, the apparatus information includes (1) an apparatus type (model number), (2) a mold type (model number), and the like.

If the semiconductor manufacturing apparatus 50 is a singing apparatus, the apparatus information includes (1) the apparatus type (model number), (2) the model number of the kit (unit part for product type), and (3) the model number of the blade. And so on.

(C2: Evaluation information)
The evaluation information includes the evaluation result when the target material 60 is used in the target semiconductor manufacturing apparatus 50 under the target manufacturing conditions. More specifically, the evaluation information includes the evaluation result of the quality of the semiconductor device manufactured by the target semiconductor manufacturing device 50 using the target material 60, the evaluation result of the degree of wear of the semiconductor manufacturing device 50, and the like. include.

An example of the quality evaluation result of a semiconductor device is a shape observation result. The shape observation results include (1) external dimensions and amount of warpage of the semiconductor device, (2) cross-sectional observation image of the semiconductor device (observation with an optical microscope or scanning electron microscope (SEM)), and (3) heat of the semiconductor device. Changes in the amount of time warpage, (4) Internal observation results of the semiconductor device by ultrasound (for example, the presence or absence of defects and voids), (5) Internal observation results of the semiconductor device by X-ray (for example, the presence or absence of defects and voids) , (6) Hardness measurement results of semiconductor devices, etc. are included.

Further, as an example of the evaluation result of the degree of wear of the semiconductor manufacturing apparatus 50, the observation result of the mold and the jig / tool can be mentioned. Observation results of the mold and jigs include (1) presence or absence of dirt on the mold surface (visual inspection), (2) blade wear state (observation with an optical microscope or scanning electron microscope), and (3) blade wear amount. , Etc. are included.

(C3: Process information)
The process information includes information defining manufacturing conditions applied to the target semiconductor manufacturing apparatus 50. More specifically, if the semiconductor manufacturing apparatus 50 is a molding apparatus, the process information includes (1) mold temperature, (2) resin weight and amount of variation, (3) preheat time, (4) molding pressure, and (4) molding pressure. 5) Includes molding profile (resin injection pressure, time shift of mold position, etc.), etc.

If the semiconductor manufacturing apparatus 50 is a singing apparatus, the process information regarding the cutting process includes (1) rotation speed, (2) cutting speed, (3) number of cuttings, (4) cutting resistance, and (5) cooling. Including the amount of water, etc.

(C4: Material information)
The material information includes information about the material 60 of interest. More specifically, if the material 60 is a resin material, the material information includes (1) spiral flow, which is an index indicating fluidity, (2) gel time, (3) glass transition temperature, and (4) coefficient of linear expansion. , (5) Filler content, (6) Filler particle size distribution, (7) Moisture content, (8) Density, and the like.

If the material 60 is a substrate material, the material information includes (1) wiring plating thickness and variation measurement results, (2) wiring resist thickness and variation measurement results, and the like.

(C5: Certification information)
The certification information includes the required specifications in the manufacturing process including the semiconductor manufacturing apparatus 50 of interest. More specifically, the certification information includes (1) a determination result of whether or not the guaranteed value of the semiconductor manufacturing apparatus is satisfied, (2) cpk (process capability index), (3) blade life prediction, and the like.

Note that the above items are examples, and any item can be included in each information depending on the manufacturing process, the type of material 60, and the like.

<D. Application example>
In the above description, an example applied mainly to the performance evaluation in advance is shown, but the present invention is not limited to this, and various applications are possible. For example, it may be used to guarantee the quality of the material 60 manufactured by the material supply entity 30. In this case, the material supply entity 30 may supply the evaluation result provided by the evaluation entity 10 to the user entity 20 in association with the corresponding material 60.

FIG. 3 is a schematic diagram for explaining one of the application examples of the manufacturing support system 1 according to the present embodiment. FIG. 4 is a sequence diagram showing a processing procedure executed in one of the application examples of the manufacturing support system 1 according to the present embodiment.

With reference to FIG. 3, an example in which the evaluation subject 10 evaluates in advance the quality of the material 60 supplied by the material supply entity 30 in a situation where the user entity 20 manufactures a semiconductor device using the semiconductor manufacturing apparatus 50. Is assumed.

With reference to FIGS. 3 and 4, in the phase of supplying the material 60, the material supply main body 30 manufactures the material 60 according to the manufacturing conditions and the like previously presented by the user main body 20 and the like (step S52). The material supply entity 30 provides a part of the manufactured material 60 (material sample) and material information to the evaluation entity 10 (step S54).

The evaluation subject 10 evaluates using the material sample provided by the material supply entity 30 (step S56). Then, the evaluation subject 10 provides the evaluation result obtained by the evaluation to the material supply entity 30 (step S58).

The material supply entity 30 attaches the evaluation result provided by the evaluation entity 10 to the manufactured material 60 and supplies it to the user entity 20 (step S60). The user main body 20 is used for the semiconductor manufacturing apparatus 50 after confirming the evaluation result attached to the material 60 delivered from the material supply main body 30.

In steps S56 and S58, the evaluation result may be provided to the material supply entity 30 only when the evaluation result by the evaluation entity 10 is appropriate.

By adopting the mechanism shown in FIGS. 3 and 4, it is possible to more reliably guarantee that the material 60 supplied from the material supply entity 30 to the user entity 20 is compatible with the target semiconductor manufacturing apparatus 50.

The quality evaluation shown in FIGS. 3 and 4 may be performed for each production lot of the material 60, for example.

<E. Management device>
Next, the management device 14, the management device 24, and the management device 34 arranged in the evaluation main body 10, the user main body 20, and the material supply main body 30, respectively, will be described. In the manufacturing support system 1, the management device 14, the management device 24, and the management device 34 substantially exchange necessary information.

FIG. 5 is a schematic diagram showing an example of the device configuration of the management device 14 constituting the manufacturing support system 1 according to the present embodiment. The management device 24 and the management device 34 have the same device configuration as shown in FIG.

With reference to FIG. 5, the management device 14 is realized by using a computer, and has two main components, a processor 102, a main memory 104, an input unit 106, a display unit 108, and an output unit 110. The next storage device 120 and the communication unit 126 are included. These components are connected to the internal bus 128.

The processor 102 is an arithmetic unit that executes processing necessary for the functions provided by the management device 14, and realizes the necessary functions by executing a program or a program module stored in the secondary storage device 120. The processor 102 may be multicore and / or multiprocessor, and the required number of cores or processors is set according to the required load processing capacity.

The main memory 104 provides the working memory required for the processor 102 to execute the program. The main memory 104 is a non-volatile memory that temporarily holds the code and working data of the program to be executed.

The input unit 106 is a component that receives an operation from an operator or the like, and is implemented by using, for example, a keyboard, a mouse, a touch panel, or the like. The display unit 118 is a component that presents information such as a processing result to an operator or the like, and is implemented by using, for example, a display or the like. The output unit 110 is a component that tangibly outputs the information in the management device 14, and is mounted by using, for example, a printer.

The secondary storage device 120 is an example of a holding unit, and is derived from a processing realization module 122 and various data for providing functions required in the manufacturing support system 1 according to the present embodiment, in addition to an operating system (not shown). Data group 124 is stored. The data group 124 of the management device 14 of the evaluator 10 typically includes certification information, device information and process information.

The communication unit 126 is a component for communicating with the user main body 20 and / or the material supply main body 30, and is implemented by using, for example, a wired LAN communication interface, a wireless LAN communication interface, a public network communication interface, or the like. A plurality of types or a plurality of communication units 126 may be mounted depending on the number of the user main body 20 and / or the material supply main body 30 to be communicated, the communication form, and the like.

In the above description, a configuration example is shown in which necessary information is directly exchanged between the evaluation subject 10 (management device 14), the user entity 20 (management device 24), and the material supply entity 30 (management device 34). Not limited to such a configuration, a specific entity may manage the information.

FIG. 6 is a schematic diagram showing an implementation example of data retention in the manufacturing support system 1 according to the present embodiment. FIG. 6A shows an implementation example in which the evaluation subject 10 manages necessary data, and FIG. 6B shows an implementation example in which the material supply entity 30 manages necessary data.

With reference to FIG. 6A, the evaluation entity 10 manages the evaluation information about the material sample provided by the material supply entity 30, and instead of the evaluation information, the evaluation entity 30 manages the evaluation information. Provide specific information such as a URL for accessing the managed evaluation information. Further, the material supply subject 30 provides the specific information provided by the evaluation subject 10 to the user subject 20.

The material supply entity 30 and the user entity 20 can access the evaluation entity managed by the evaluation entity 10 based on the specific information. In addition, various restrictions such as an access code (password) may be set for access to the evaluation information managed by the evaluation subject 10.

By adopting such a configuration, the computing resources in the material supply main body 30 (management device 34) can be reduced, and the processing related to the manufacturing support system 1 can be simplified.

With reference to FIG. 6B, the evaluation entity 10 transmits evaluation information about the material sample provided by the material supply entity 30 to the material supply entity 30. The material supply entity 30 manages the evaluation information received from the evaluation entity 10. The material supply entity 30 provides the user entity 20 with specific information such as a URL for accessing the evaluation information managed by the material supply entity 30.

The user subject 20 can access the evaluation subject managed by the material supply subject 30 based on the specific information. In addition, various restrictions such as an access code (password) may be set for access to the evaluation information managed by the material supply entity 30.

By adopting such a configuration, the computing resources in the user main body 20 (management device 24) can be reduced, and the processing related to the manufacturing support system 1 can be simplified.

In the above description, a configuration example in which the management device 14, the management device 24, and the management device 34 are arranged in the evaluation main body 10, the user main body 20, and the material supply main body 30, respectively, is shown, but the present invention is not limited to this, and the so-called cloud computer is used. As such, a part of a system in which a plurality of computers are connected via a network may be utilized to realize necessary processing and functions.

The manufacturing support system 1 according to the present embodiment can be realized in any computing environment, and the country or country where the known technology at the time of actual implementation is arbitrarily used or actually implemented is used. Any form of implementation can be adopted in accordance with local laws and the like. The technical scope of the present invention is not limited to a specific mounting form, but may include any mounting form.

<F. Advantages>
Preliminary evaluation of the suitability of semiconductor manufacturing equipment and the materials used in semiconductor manufacturing equipment for the desired manufacturing process requires sufficient knowledge and a lot of time. And. The evaluation process, which requires a lot of resources, is carried out by the evaluation entity (typically, the manufacturer of the semiconductor manufacturing equipment, etc.) in cooperation with the material supply entity, including the semiconductor manufacturing equipment and materials. It is possible to make a comprehensive evaluation.

By providing a manufacturing support system that can perform such a comprehensive evaluation, the material supplier can ensure that the material suitable for the manufacturing process desired by the user, who is the customer, is appropriately provided. Further, even if the user does not have sufficient knowledge, the knowledge of the evaluation subject can be used to realize the desired manufacturing process more quickly and reliably. Furthermore, the evaluator can utilize the knowledge it possesses to support various material suppliers and users.

The embodiments disclosed this time should be considered to be exemplary in all respects and not restrictive. The scope of the invention is set forth by the claims rather than the description of the embodiments described above, and is intended to include all modifications within the meaning and scope of the claims.

1 manufacturing support system, 10 evaluation main body, 12 evaluation equipment, 14, 24, 34 management equipment, 20 main body, 30 material supply main body, 50 semiconductor manufacturing equipment, 60 materials, 102 processor, 104 main memory, 106 input unit, 108 , 118 display unit, 110 output unit, 120 secondary storage device, 122 processing realization module, 124 data group, 126 communication unit, 128 internal bus.

Claims

A manufacturing support system that supports manufacturing using semiconductor manufacturing equipment.
A holding unit placed in the evaluation subject that holds information that identifies the semiconductor manufacturing equipment that is used or will be used by the user, and information that identifies the manufacturing process executed by the semiconductor manufacturing equipment.
The evaluation that evaluates the suitability of the material based on the information that identifies the material provided by the material supply entity that supplies the material used in the semiconductor manufacturing apparatus and the information that is held by the holding unit. The evaluation department placed in the main body and
A manufacturing support system including an evaluation result providing unit that provides the evaluation result by the evaluation unit to the material supply entity.
The evaluation unit
A semiconductor manufacturing device that is substantially the same as the semiconductor manufacturing device that is used or will be used by the user.
Includes an evaluation device that evaluates the quality of a semiconductor device or semi-finished product of the semiconductor device manufactured by the substantially same semiconductor manufacturing device, and at least one of the wear and tear of the substantially same semiconductor manufacturing device. The manufacturing support system according to claim 1.
The evaluation device includes a measuring device for measuring a shape, a microscope for acquiring a cross-sectional observation image, an exploration device for internal observation, and a hardness as a configuration for evaluating the quality of the semiconductor device or a semi-finished product of the semiconductor device. The manufacturing support system according to claim 2, further comprising any one of the hardness meters for measuring.
The manufacturing support system according to claim 2 or 3, wherein the evaluation device includes any one of an observation device and an exploration device as a configuration for evaluating wear of the substantially same semiconductor manufacturing device.
The manufacturing support system according to any one of claims 2 to 4, wherein the evaluation device includes a simulation device using a model of a semiconductor manufacturing device used or planned to be used by the user.
The manufacturing support system according to any one of claims 1 to 5, wherein the material supply entity associates the evaluation result provided by the evaluation entity with the corresponding material and supplies the evaluation result to the user entity.
The manufacturing support system according to any one of claims 1 to 6, wherein the evaluation unit performs processing for evaluating the suitability of a plurality of different materials.
It is a manufacturing support method that supports manufacturing using semiconductor manufacturing equipment.
A step in which a holding unit arranged in an evaluation subject holds information that identifies a semiconductor manufacturing device that is used or will be used by the user, and information that identifies a manufacturing process executed by the semiconductor manufacturing device. When,
In the evaluation subject, the suitability of the material is determined based on the information for specifying the material provided by the material supply entity that supplies the material used in the semiconductor manufacturing apparatus and the information held by the holding unit. Steps to evaluate and
A manufacturing support method comprising a step of providing an evaluation result by the evaluation step to the material supply entity.