TWI787790B - Manufacturing support system and manufacturing support method - Google Patents

Abstract

The manufacturing support system for supporting the manufacture using the semiconductor manufacturing device of the present invention includes: a holding unit disposed on the evaluation body, holding information for specifying the semiconductor manufacturing device used or planned to be used by the user body; Information on the manufacturing process performed by the semiconductor manufacturing device; the evaluation unit is disposed in the evaluation body based on the information provided by the material supply body for specifying the material used in the semiconductor manufacturing device and the information held by the holding unit , evaluating the suitability of the material; and the evaluation result providing department, providing the evaluation result obtained by the evaluation department to the material supplier.

Description

Manufacturing support system and manufacturing support method

The present invention relates to a manufacturing support system and a manufacturing support method for supporting manufacturing using semiconductor manufacturing equipment.

In the manufacture of semiconductor devices, various methods have been proposed to shorten the preparation time by prior performance evaluation and the like. As one of such methods, Japanese Patent Laid-Open No. 2003-259015 (Patent Document 1) discloses an electronic conference system in which as a pre-event for selling semiconductor manufacturing devices, the semiconductor manufacturing device supplier's process The technical personnel and the process technicians of the semiconductor equipment manufacturer (customer) can realize the meeting about the performance of the semiconductor equipment process technicians or the semiconductor manufacturing equipment without going to each other. [Prior art literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2003-259015

[Problem to be Solved by the Invention] The electronic conferencing system disclosed in Japanese Patent Application Laid-Open No. 2003-259015 (Patent Document 1) assumes a prior activity for selling semiconductor manufacturing equipment, and evaluates performance in advance using samples provided by semiconductor equipment manufacturers.

However, in the actual manufacturing process of semiconductor devices, since various materials provided by material manufacturers are used, if the process technicians of semiconductor equipment manufacturers do not have knowledge including material selection, they may not be able to manufacture due quality semiconductor devices.

An object of the present invention is to provide a new structure for supporting the manufacture of a semiconductor device using such a semiconductor manufacturing apparatus. [Means to solve the problem]

According to one aspect of the present invention, there is provided a manufacturing support system that supports manufacturing using a semiconductor manufacturing apparatus. The manufacturing support system includes: a holding unit disposed on the evaluation body, holding information for specifying a semiconductor manufacturing device used or planned to be used by the user body, and information for specifying a manufacturing process executed by the semiconductor manufacturing device; the evaluation unit, Arranged in the evaluation body, based on the information for determining the material supplied by the material supply body for supplying the material used in the semiconductor manufacturing device and the information held by the holding unit, the suitability of the material is evaluated; and evaluation The result providing unit provides the evaluation result obtained by the evaluation unit to the material supplier.

According to another aspect of the present invention, there is provided a manufacturing support method for supporting manufacturing using a semiconductor manufacturing apparatus. The manufacturing support method includes a step of holding information for specifying a semiconductor manufacturing device used or planned to be used by the user body and information for specifying a manufacturing process executed by the semiconductor manufacturing device in a holding unit disposed in the evaluation body, and in the evaluation In the main body, a step of evaluating the suitability of the material based on the information for determining the material provided by the material supplying main body for supplying the material used in the semiconductor manufacturing device and the information held by the holding unit; and A step in which the material supply subject provides the evaluation result obtained in the evaluation step. [Effect of the invention]

The present invention can provide a new structure for supporting the manufacture of semiconductor devices using semiconductor manufacturing equipment.

Embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code|symbol is attached|subjected to the same or corresponding part in a figure, and the description is not repeated.

<A. Overview of the structure and processing of the manufacturing support system> First, the configuration of the manufacturing support system 1 according to the present embodiment and the outline of processing in the manufacturing support system 1 will be described. The manufacturing support system 1 supports manufacturing using semiconductor manufacturing equipment. In the following description, supply of various materials used in semiconductor manufacturing equipment will be mainly described, but the manufacturing support system 1 according to this embodiment is not limited to these ranges.

FIG. 1 is a schematic diagram for explaining the outline of a manufacturing support system 1 according to this embodiment. Referring to FIG. 1 , the manufacturing support system 1 mainly relates to one or more user subjects 20 who use a semiconductor manufacturing device 50, one or more material supply subjects 30 that supply materials 60 used by the semiconductor fabrication device 50, and material supply subject The evaluation subject 10 who evaluates the suitability of the supplied material 60 at 30 .

In FIG. 1, "X" is marked for the information exchanged between the evaluation subject 10 and the "user X" which is one of the user subjects 20, and "Material Supply The information exchanged between subject A" and between "using subject X" and "material supply subject A" is marked with "A". For example, information having the same name as "device information X" and "device information A" but with different symbols of "X" or "A" may have the same content or different content. The same applies to the following FIGS. 2 to 4 .

In this specification, the subject of use 20 is a term that includes users who use the semiconductor manufacturing apparatus 50 in any form, and includes, for example, semiconductor manufacturers, semiconductor equipment manufacturers, packaging factories (only those who contract packaging and assembly processes in semiconductor manufacturing) Enterprises), Out-Sourced Assembly and Testing (OSAT) (enterprises engaged in entrusted packaging and testing of semiconductors), foundries (enterprises specializing in the manufacture of semiconductor chips), etc.

In this specification, the "material supply entity" includes any entity that manufactures and/or sells arbitrary materials 60 used in the semiconductor manufacturing device 50, and is a entity different from the "evaluation entity 10" and the "user entity 20".

For example, as the semiconductor manufacturing apparatus 50 , a molding device that resin-seals electronic components including a semiconductor wafer and a singulation device that singulates electronic components including a semiconductor wafer are assumed. Such a resin sealing device is a semiconductor wafer mounted on a substrate (lead frame, printed circuit board, ceramic substrate, metal substrate, glass substrate, semiconductor substrate, resin substrate, etc.) by resin sealing. The material supply body 30 supplies a resin or a substrate sealing a semiconductor wafer as a material 60 . The material 60 used in the semiconductor manufacturing device 50 is not limited to such resins or substrates, and includes any consumables related to the manufacturing process of the semiconductor manufacturing device 50 .

The semiconductor device is manufactured by the semiconductor manufacturing apparatus 50 using the material 60 supplied by the material supplying body 30 using the main body 20 . The use body 20 considers the manufacturing process of its own semiconductor manufacturing device 50 , and specifies the specifications, quality performance, etc. of the material 60 to be supplied to the material supply body 30 . The material supply body 30 supplies the material 60 satisfying the specified specifications and quality performance.

However, not all subjects 20 may have sufficient insight into the manufacturing process. In addition, in the initial adjustment stage of the newly introduced semiconductor manufacturing equipment 50, the following operations occur: optimizing the manufacturing process through trial and error, and at the same time determining the specifications and quality performance of the material 60 to be used.

When optimizing the manufacturing process, it is necessary to use an evaluation device to evaluate the semiconductor device manufactured by the semiconductor manufacturing device 50 or its semi-finished product. However, evaluation devices are not necessarily available for all the main bodies 20 to be used, and in particular, higher-performance evaluation devices are required along with the miniaturization of manufactured semiconductor devices. Also, there may be users 20 who cannot properly feed back the evaluation results output from the evaluation device to the manufacturing process even if they have the evaluation device.

The manufacturing support system 1 according to the present embodiment provides means for solving the above-mentioned problems related to the semiconductor manufacturing apparatus 50 used by the main body 20 . That is, the evaluation subject 10 is responsible for part or all of the evaluation work performed by the main body 20 , and is also responsible for the pre-evaluation of the specifications and quality performance of the material 60 supplied by the material supply body 30 . Due to the existence and service provided by such an evaluation subject 10, even the user subject 20 who does not have sufficient insights into the manufacturing process itself, and the user subject 20 who cannot sufficiently evaluate the quality of the manufacturing process can easily use The semiconductor manufacturing apparatus 50 is used to manufacture semiconductor devices.

In addition, since the material supply body 30 can increase the reliability of supplying materials suitable for the semiconductor manufacturing apparatus 50 used by the user body 20 of the supply destination, a more stable supply system can be realized.

The evaluation body 10 basically includes a semiconductor manufacturing device 50 substantially the same as the semiconductor manufacturing device 50 used in the use body 20 , and an evaluation device 12 . The evaluation subject 10 is basically suitably a manufacturer of the semiconductor manufacturing apparatus 50 or an affiliated company thereof. But not limited to the manufacturer of the semiconductor manufacturing device 50 or its affiliated companies, any group or individual can also be the evaluation subject 10 .

In order to manage the information exchanged among the three, a management device 14 , a management device 24 and a management device 34 can be respectively configured on the evaluation subject 10 , the user subject 20 and the material supply subject 30 .

Device information, evaluation information, process information, and certification information are exchanged between the evaluation subject 10 and the user subject 20 . Device information, evaluation information, process information, and material information are exchanged between the evaluation body 10 and the material supply body 30 . Device information, evaluation information, process information, and certification information are exchanged between the user body 20 and the material supply body 30 . Here, each piece of information exchanged among the three is explained.

The device information includes information for specifying the semiconductor manufacturing device 50 used or planned to be used by the user body 20 . The device information may further include information for specifying replaceable components and the like used in the target semiconductor manufacturing device 50 .

The evaluation information includes evaluation results when the target material 60 is used by the target semiconductor manufacturing device 50 under the target manufacturing conditions.

The process information includes information for specifying the manufacturing process executed by the target semiconductor manufacturing apparatus 50 . Typically, the process information includes information defining manufacturing conditions applicable to the target semiconductor manufacturing apparatus 50 .

The material information includes information related to the material 60 of the object.

The certification information includes the required specifications in the manufacturing process of the target semiconductor manufacturing device 50 . The identification information depends on the user 20 .

FIG. 2 is a sequence diagram showing the processing procedure executed by the manufacturing support system 1 according to the present embodiment. An example of the processing procedure executed by the manufacturing support system 1 will be described with reference to FIGS. 1 and 2 . In the example shown in FIG. 2 , it is assumed that the evaluation subject 10 is a manufacturer of a semiconductor manufacturing device 50 , and it is assumed that a new semiconductor manufacturing device 50 is introduced using the subject 20 . In this aspect, the material supplier body 30 develops the material 60 used for the newly introduced semiconductor manufacturing device 50 .

In the aspect of development of the material 60, the material supply body 30 develops the material 60 according to the manufacturing conditions etc. proposed by the user body 20 etc. (step S2). The material supply body 30 supplies a part of the developed material 60 (material sample) and material information to the evaluation body 10 (step S4 ). Furthermore, when the assessment subject 10 can analyze the material sample, it is not necessary to provide material information.

The evaluation body 10 holds device information (information for specifying the semiconductor manufacturing device 50 used or planned to be used by the user body 20 ) and process information (information for specifying the manufacturing process executed by the semiconductor manufacturing device 50 ) in advance.

The evaluation body 10 performs evaluation using the material sample provided by the material supply body 30 (step S6 ). More specifically, the evaluator 10 evaluates the suitability of the material 60 based on the information for specifying the material 60 provided by the material supplier 30 and the information held by the evaluator 10 (device information and process information). Then, the evaluation subject 10 provides the evaluation result obtained through the evaluation together with the device information and the process information to the material supplier 30 (step S8 ).

In the aspect of development of the material 60, the process of step S2 - step S8 is repeatedly performed (*1). The evaluation body 10 can perform the process of evaluating whether the materials 60 are suitable or not for different kinds of materials 60 in the above-described manner. Specifically, the composition ratio of the material 60 can be used as an example in the process of evaluating suitability.

After the evaluation results are obtained for one or a plurality of materials, a candidate material to be supplied to the user 20 is determined between the evaluation body 10 and the material supply body 30 if necessary (step S10 ). Then, the evaluation subject 10 provides device information, evaluation information and process information to the user subject 20 for the materials determined as candidates (step S12 ). Similarly, the material supplier 30 provides device information, evaluation information, and process information to the user 20 for the material determined as a candidate (step S14 ).

Furthermore, the device information, evaluation information and process information provided by the evaluation subject 10 in step S12 are basically the same as the device information, evaluation information and process information provided by the material supply subject 30 in step S14. Its purpose is to prevent errors in information provision by confirming the identity of information provided by each subject. From the viewpoint of simplifying the processing, any one of step S12 and step S14 may be omitted.

The user body 20 performs final performance verification with reference to the provided device information, evaluation information and process information (step S16 ). After the user subject 20 understands the content of the performance confirmation, it sends certification information to the evaluation subject 10 (step S18 ), and sends certification information to the material supply subject 30 (step S20 ).

Through the above processing, the pre-evaluation of the manufacturing process is completed. Then, the user unit 20 orders the semiconductor manufacturing device including the certification information from the evaluation unit 10 (in this example, the manufacturer of the semiconductor manufacturing unit 50 ) (step S22 ), and orders materials including the certification information from the material supply unit 30 (step S24 ). .

The evaluation body 10 (manufacturer of the semiconductor manufacturing device 50 ) manufactures the semiconductor manufacturing device 50 according to the order of the user body 20 (step S26 ), and delivers the manufactured semiconductor manufacturing device 50 to the user body 20 (step S28 ). Moreover, the material supply body 30 manufactures the material 60 according to the order of the user body 20 (step S30), and delivers the manufactured material 60 to the user body 20 (step S32).

According to the processing sequence shown in FIG. 2 , the pre-evaluation of the manufacturing process is completed.

Furthermore, FIG. 2 shows the processing sequence of the pre-evaluation of the manufacturing process, but after delivery of the semiconductor manufacturing device 50, when the user body 20 wishes to reconsider the manufacturing process, the processing of steps S2 to S20 may be performed again.

〈B. Evaluation process〉 Next, an example of evaluation processing by the evaluation main body 10 will be described.

Typically, the evaluation subject 10 is a manufacturer of the semiconductor manufacturing device 50 or its affiliated company, and has the semiconductor manufacturing device 50 substantially the same as the semiconductor manufacturing device 50 used by the user 20 . Or the semiconductor manufacturing apparatus 50 substantially the same as the semiconductor manufacturing apparatus 50 used for the main body 20 may be prepared.

The evaluation body 10 uses the material sample provided by the material supply body 30 to reproduce the manufacturing process that the user body 20 is scheduled to implement or is currently implementing in a semiconductor manufacturing device 50 that is substantially the same as the semiconductor manufacturing device 50 used or intended to be used by the user body 20 . manufacturing process. A product (semiconductor device) manufactured by the reproduced manufacturing process or a semi-finished product thereof is evaluated by the evaluation device 12 . Alternatively, it is also possible to evaluate the influence of the reproduced manufacturing process on the semiconductor manufacturing apparatus 50 .

As described above, the evaluation body 10 holds device information (information for specifying the semiconductor manufacturing device 50 used or planned to be used by the user body 20 ), and process information (information for specifying the manufacturing process executed by the semiconductor manufacturing device 50 ) , based on the information for determining the material 60 provided by the material supply body 30 and the information held by the evaluation body 10 (device information and process information), the suitability of the material 60 is evaluated. Then, the evaluation body 10 provides the evaluation result to the material supply body 30 .

The evaluation of the semiconductor device or its semi-finished product manufactured using the reproduced manufacturing process can also be performed by shape observation. Examples of evaluation items include (1) external dimensions and warpage, (2) cross-sectional observation images, (3) thermal warpage change, (4) internal observation results, (5) hardness measurement results, and the like. Corresponding to such evaluation items, as the evaluation device 12 for evaluating the quality of a semiconductor device or a semi-finished product of a semiconductor device, a measuring device for measuring a shape, a microscope for obtaining a cross-sectional observation image, and a detection device for internal observation may be included. , any of the durometers used to measure the hardness.

More specifically, (1) external dimensions and warpage, and (3) evaluation of thermal warpage change, shape measurement using a heating warpage measurement device (TSM) or an ultrasonic detection device (Scanning Acoustic Tomography, SAT) The assay device is used as the evaluation device 12. (2) Evaluation of cross-sectional observation images An optical microscope, a scanning electron microscope (SEM), or the like is used as the evaluation device 12 . (4) Evaluation of Internal Observation Results An ultrasonic detection device, an X-ray fluoroscopy device, or the like is used as the evaluation device 12 . (5) Evaluation of Hardness Measurement Results A hardness meter or the like is used as the evaluation device 12 .

The influence of the reproduced manufacturing process on the semiconductor manufacturing device 50 can also be evaluated by observing the molds and jigs used in the semiconductor manufacturing device 50 . Examples of evaluation items include (1) presence or absence of dirt on the mold surface, (2) state of blade wear, (3) amount of blade wear, and the like. Corresponding to such evaluation items, either one of an observation device and a detection device may be included as a structure for evaluating the loss of the semiconductor manufacturing apparatus 50 that is substantially the same.

More specifically, (1) The evaluation of the presence or absence of dirt on the surface of the mold can be performed by human eyesight, and an observation device or the like can also be used as the evaluation device 12 . (2) Evaluation of blade wear state An ultrasonic detection device, an X-ray fluoroscopy device, or the like is used as the evaluation device 12 . (3) The evaluation of the amount of blade wear used a measuring device for measuring the shape.

Without being limited to the items described, one or more evaluation devices 12 may be used according to arbitrary evaluation items.

As described above, the evaluation unit of the evaluation body 10 may include: a semiconductor manufacturing device 50 that is substantially the same as the semiconductor manufacturing device 50 used or intended to be used by the user body 20; The evaluation device 12 evaluates the quality of the manufactured semiconductor device or the semi-finished product of the semiconductor device, and/or the loss of the substantially identical semiconductor manufacturing device 50 .

Typically, the evaluation is performed by reproducing the manufacturing process using the semiconductor manufacturing apparatus 50 , but part or all of the evaluation can also be realized by simulation. In the case of evaluation by simulation, a model of the semiconductor manufacturing device 50 is prepared, and a model corresponding to material information supplied from the material supply body 30 is generated, whereby simulation related to the manufacturing process of the object can be realized. Furthermore, when evaluating by simulation, it is not necessary for the material supply body 30 to provide the material sample to the evaluation body 10 .

As described above, as the evaluation section of the evaluation body 10, a simulation device using a model of the semiconductor manufacturing apparatus 50 used or planned to be used by the user body 20 may be included. By using simulation, evaluation can be performed even if there is no semiconductor manufacturing apparatus 50 in reality.

<C. Details of information> Next, details of information exchanged in the manufacturing support system 1 according to this embodiment will be described.

(c1: Device Information) The device information includes information for specifying the target semiconductor manufacturing device 50 and used replaceable components. More specifically, if the semiconductor manufacturing device 50 is a molding device, the device information includes (1) device type (model), and (2) mold type (model), etc.

Also, if the semiconductor manufacturing device 50 is a singulation device, the device information includes (1) the device type (model), (2) the model of the set (unit assembly for a variety), (3) the model of the blade, and the like.

(c2: assessment information) The evaluation information includes evaluation results when the target material 60 is used by the target semiconductor manufacturing device 50 under the target manufacturing conditions. More specifically, the evaluation information includes an evaluation result of the quality of a semiconductor device manufactured by the target semiconductor manufacturing device 50 using the target material 60 , an evaluation result of the degree of wear of the semiconductor manufacturing device 50 , and the like.

As an example of the evaluation result of the quality of a semiconductor device, the shape observation result etc. are mentioned. The shape observation results include: (1) Outer dimensions and warpage of the semiconductor device, (2) Cross-sectional observation images of the semiconductor device (observation with an optical microscope or observation with a scanning electron microscope (SEM)), ( 3) Changes in thermal warpage of semiconductor devices, (4) Internal observation results of semiconductor devices using ultrasonic waves (for example, presence or absence of defects or voids, etc.), (5) Internal observation results of semiconductor devices using X-rays (For example, presence or absence of defects or voids, etc.), (6) Hardness measurement results of semiconductor devices, etc.

Moreover, as an example of the evaluation result of the degree of wear of the semiconductor manufacturing apparatus 50, the observation result of a mold and a jig, etc. are mentioned. The observation results of molds and jigs include: (1) presence or absence of dirt on the surface of the mold (visual inspection), (2) blade wear status (observation with an optical microscope or observation with a scanning electron microscope), (3) blade wear Abrasion etc.

(c3: process information) The process information includes information defining manufacturing conditions applicable to the target semiconductor manufacturing apparatus 50 . More specifically, if the semiconductor manufacturing device 50 is a molding device, the process information includes: (1) mold temperature, (2) resin weight and deviation, (3) preheating time, (4) molding pressure, (5) ) Forming profile (resin injection pressure and mold position changes over time, etc.), etc.

In addition, if the semiconductor manufacturing device 50 is a single cutting device, the process information related to the cutting process includes: (1) rotational speed, (2) cutting speed, (3) number of cutting times, (4) cutting resistance, (5) amount of cooling water Wait.

(c4: material information) The material information includes information related to the material 60 of the object. More specifically, if the material 60 is a resin material, the material information includes: (1) spiral flow as an indicator of fluidity, (2) gel time, (3) glass transition temperature, (4) linear expansion coefficient , (5) filler content, (6) filler particle size distribution, (7) moisture content, (8) density, etc.

Also, if the material 60 is a substrate material, the material information includes: (1) measurement results of thickness and variation of wiring plating, (2) measurement results of thickness and variation of wiring resist, and the like.

(c5: Identification information) The certification information includes the required specifications in the manufacturing process of the target semiconductor manufacturing device 50 . More specifically, the identification information includes: (1) the result of determining whether the guaranteed value of the semiconductor manufacturing device is satisfied, (2) the process capability index (Process Capability Index, cpk), (3) blade life prediction, and the like.

In addition, the said item is an example, and arbitrary items may be included in each piece of information according to a manufacturing process, the kind of material 60, etc. FIG.

〈D. Application example〉 In the description above, the example applied to the performance evaluation in advance was mainly shown, but it is not limited thereto, and various applications are possible. For example, it can also be used to ensure the quality of the material 60 manufactured by the material supply body 30 . In this situation, the material supplier 30 can associate the evaluation result provided by the evaluation body 10 with the corresponding material 60 and supply it to the user body 20 .

FIG. 3 is a schematic diagram for explaining one of application examples of the manufacturing support system 1 according to this embodiment. FIG. 4 is a sequence diagram showing the processing procedure executed by one of the application examples of the manufacturing support system 1 according to the present embodiment.

Referring to FIG. 3 , assume an example in which the evaluation body 10 evaluates the quality of the material 60 supplied by the material supply body 30 in advance under the condition that the body 20 manufactures a semiconductor device using the semiconductor manufacturing apparatus 50 .

Referring to FIGS. 3 and 4 , in the aspect of supplying the material 60 , the material supply body 30 manufactures the material 60 according to the manufacturing conditions proposed by the user body 20 and the like in advance (step S52 ). The material supply body 30 supplies a part of the manufactured material 60 (material sample) and material information to the evaluation body 10 (step S54 ).

The evaluation body 10 performs evaluation using the material sample provided by the material supply body 30 (step S56 ). Then, the evaluation body 10 provides the evaluation result obtained by the evaluation to the material supply body 30 (step S58 ).

The material supply body 30 supplies the evaluation result provided by the evaluation body 10 to the user body 20 along with the produced material 60 (step S60 ). The use body 20 is used for the semiconductor manufacturing apparatus 50 after confirming the evaluation result attached to the material 60 delivered from the material supply body 30 .

Furthermore, in step S56 and step S58 , the evaluation result may be provided to the material supplier 30 only when the evaluation result obtained by the evaluation body 10 is appropriate.

By adopting the structure shown in FIGS. 3 and 4 , it is possible to ensure more reliably that the material 60 supplied from the material supply body 30 to the user body 20 is suitable for the target semiconductor manufacturing apparatus 50 .

Furthermore, the quality assessment shown in FIGS. 3 and 4 can be performed during the manufacture of each batch of material 60 , for example.

<E. Management device> Next, the management device 14 , the management device 24 , and the management device 34 respectively arranged in the evaluation body 10 , the user body 20 , and the material supply body 30 will be described. In the manufacturing support system 1 , information necessary for the management device 14 , the management device 24 , and the management device 34 is essentially exchanged.

FIG. 5 is a schematic diagram showing an example of the device configuration of the management device 14 constituting the manufacturing support system 1 according to the present embodiment. Furthermore, the management device 24 and the management device 34 have the same structure as the device shown in FIG. 1 .

Referring to Fig. 5, the management device 14 is implemented using a computer, and as main components, includes a processor 102, a main memory 104, an input unit 106, a display unit 108, an output unit 110, a secondary memory device 120, and a communication unit 126 . These components are connected to internal bus bars 128 .

The processor 102 is the main body of computation required to perform the processing required by the functions provided by the management device 14 , and realizes required functions by executing programs or program modules stored in the secondary memory device 120 . The processor 102 can also be multi-core and/or multi-processor, and the required number of cores or processors can be set according to the required load processing capability.

The main memory 104 provides the working memory required by the processor 102 for executing programs. The main memory 104 is a non-volatile memory that stores program codes or work data of executed programs at one time.

The input unit 106 is an element that receives an operation from an operator or the like, and is realized using, for example, a keyboard, a mouse, a touch panel, or the like. The display unit 118 is a device that presents information such as processing results to an operator and the like, and is realized using a display or the like, for example. The output unit 110 is a device for outputting the information in the management device 14 in a tangible form, and is realized by using a printer or the like, for example.

The secondary memory device 120 is an example of a holding unit, and stores a data group 124 including functions required for providing the manufacturing support system 1 according to the present embodiment, in addition to the operating system (not shown). The processing realizes module 122 and various data. Typically, the data set 124 of the management device 14 of the evaluation body 10 includes identification information, device information and process information.

The communication unit 126 is a component used to communicate with the user body 20 and/or the material supply body 30, such as using a wired area network (Local Area Network, LAN) communication interface, a wireless LAN communication interface, a public network communication interface, etc. accomplish. Various types or a plurality of communication units 126 may be installed according to the number of user bodies 20 and/or material supply bodies 30 to be communicated with, communication modes, and the like.

In the description above, an example of the structure in which necessary information is directly exchanged between the evaluation body 10 (management device 14 ), the user body 20 (management device 24 ), and the material supply body 30 (management device 34 ) is shown, but not Limited to this structure, information can also be managed by a specific subject.

(A) of FIG. 6 and (B) of FIG. 6 are schematic diagrams showing an implementation example of data storage in the manufacturing support system 1 according to the present embodiment. (A) in FIG. 6 shows an installation example of data required for management by the evaluation body 10 , and (B) in FIG. 6 shows an installation example of data required for management by the material supply body 30 .

Referring to (A) in FIG. 6 , the assessment subject 10 manages the assessment information related to the material samples provided by the material supply subject 30 , and provides the material supply subject 30 with a URL for accessing the managed assessment information. (Uniform Resource Locator, URL) and other specific information instead of evaluation information. Furthermore, the material supply body 30 provides the specific information provided by the evaluation body 10 to the user body 20 .

The material supplier 30 and the user 20 can access the evaluation subject managed by the evaluation subject 10 based on specific information. Furthermore, various restrictions such as access codes (passwords) may be set for access to the evaluation information managed by the evaluation subject 10 .

By employing such a configuration, the calculation resources in the material supply body 30 (management device 34 ) can be reduced, and the processing of the manufacturing support system 1 can be simplified.

Referring to (B) in FIG. 6 , the evaluation body 10 transmits evaluation information related to the material sample supplied by the material supply body 30 to the material supply body 30 . The material supply body 30 manages the evaluation information received from the evaluation body 10 . The material provider 30 provides the user 20 with specific information such as a URL for accessing the evaluation information managed by itself.

The user subject 20 can access the evaluation subject managed by the material supply subject 30 based on specific information. Furthermore, various restrictions such as an access code (password) may be set for access to the evaluation information managed by the material supply body 30 .

By adopting such a configuration, the use of computing resources in the main body 20 (management device 24 ) can be reduced, and the processing of the manufacturing support system 1 can be simplified.

In the above description, an example of the structure in which the management device 14, the management device 24, and the management device 34 are respectively arranged on the evaluation body 10, the user body 20, and the material supply body 30 is shown. , using a part of a system such as connecting multiple computers via a network to realize the required processing and functions.

The manufacturing support system 1 according to this embodiment can be realized in any computing environment, and any known technology at the time of actual installation can be used arbitrarily, or any installation form can be adopted in accordance with the laws of the country or region where it is actually installed. The technical scope of the present invention is not limited to a specific mounting form, but may include arbitrary mounting forms.

<F. Advantages> Evaluating whether the semiconductor manufacturing device and the materials used in the semiconductor manufacturing device are suitable for the target manufacturing process in advance requires sufficient insights and also requires a lot of time. Comprehensive evaluation including semiconductor manufacturing devices and materials can be performed by jointly implementing such resource-intensive evaluation processing by an evaluation subject (typically, a semiconductor manufacturing device manufacturer, etc.) and a material supplier.

By providing a manufacturing support system capable of such a comprehensive evaluation, the material supplier can reliably and appropriately provide materials suitable for the manufacturing process desired by the user as a customer. Also, even if the user does not have sufficient knowledge, the knowledge of the evaluation body can be used to realize the target manufacturing process earlier and reliably. Furthermore, the assessment subject can support various material supply subjects and user subjects using their own insights.

It should be thought that the embodiment disclosed this time is an illustration in every respect and is not restrictive. The scope of the present invention is indicated by the scope of the patent application rather than the description of the above-mentioned embodiment, and it is intended that all changes within the meaning and range equivalent to the scope of the patent application are included.

1: Manufacturing support system 10: Evaluation subject 12:Evaluation device 14, 24, 34: management device 20: Using principals 30:Material supply subject 50:Semiconductor manufacturing equipment 60: material 102: Processor 104: main memory 106: input part 108, 118: display part 110: output unit 120: Secondary memory device 122: Processing implementation module 124: data set 126: Ministry of Communications 128: Internal busbar S2～S32, S52～S60: steps

FIG. 1 is a schematic diagram for explaining the outline of a manufacturing support system according to this embodiment. FIG. 2 is a sequence diagram showing the processing procedure executed by the manufacturing support system according to the present embodiment. Fig. 3 is a schematic diagram for explaining one of application examples of the manufacturing support system according to the present embodiment. FIG. 4 is a sequence diagram showing the processing procedure executed by one of the application examples of the manufacturing support system according to the present embodiment. FIG. 5 is a schematic diagram showing an example of a device configuration of a management device constituting the manufacturing support system according to the present embodiment. (A) of FIG. 6 and (B) of FIG. 6 are schematic diagrams showing an implementation example of data storage in the manufacturing support system according to this embodiment.

1: Manufacturing support system

10: Evaluation subject

12:Evaluation device

14, 24, 34: management device

20: Using principals

30:Material supply subject

50:Semiconductor manufacturing equipment

60: material

Claims (7)

A manufacturing support system that supports manufacturing using a semiconductor manufacturing device, including: a holding unit disposed on an evaluation body for holding information for specifying a semiconductor manufacturing device used or planned to be used by the user body; information on the manufacturing process performed by the semiconductor manufacturing device; an evaluation unit disposed in the evaluation body based on the information on the material provided by the material supply body for determining the material used in the semiconductor manufacturing device and by the The information held by the above-mentioned maintenance part is used to evaluate the suitability of the material; and the evaluation result providing part is used to provide the material supplier with the evaluation result obtained by the evaluation part; the evaluation part includes: substantially the same a semiconductor manufacturing device substantially identical to the semiconductor manufacturing device used or intended to be used by the user; and an evaluation device for a semiconductor device manufactured by the substantially identical semiconductor manufacturing device or a semi-finished product of the semiconductor device At least one of quality and loss of the substantially identical semiconductor manufacturing apparatus is evaluated. The manufacturing support system according to claim 1, wherein the evaluation means includes any one of a measuring means for measuring a shape, a microscope for obtaining a cross-sectional observation image, a detection means for internal observation, and a hardness tester for measuring hardness. One is used to evaluate the quality of the semiconductor device or the semi-finished product of the semiconductor device Structure. The manufacturing support system according to claim 1, wherein the evaluation device includes any one of an observation device and a detection device as a structure for evaluating the wear of the substantially identical semiconductor manufacturing device. The manufacturing support system according to any one of claims 1 to 3, wherein the evaluation means includes a simulation means using a model of a semiconductor manufacturing apparatus used or planned to be used by the user. The manufacturing support system according to any one of claim 1 to claim 3, wherein the material supplier associates the evaluation results provided by the evaluation body with corresponding materials, and supplies them to the user body. The manufacturing support system according to any one of claim 1 to claim 3, wherein the evaluation section evaluates suitability of a plurality of different materials respectively. A manufacturing support method for supporting manufacturing using a semiconductor manufacturing device, comprising: a holding unit disposed on an evaluation body retains information for specifying a semiconductor manufacturing device used or planned to be used by the user; The step of information on the manufacturing process performed by the manufacturing device, in the evaluation body, based on the information for determining the material provided by the material supply body that supplies the material used in the semiconductor manufacturing device, and the information provided by the steps to assess the suitability of the material in question; and an evaluation result providing unit providing the material supply subject with the evaluation result obtained in the evaluation step; the evaluation step includes semiconductor manufacturing devices used or planned to be used by the semiconductor manufacturing device and the user body The step of evaluating at least one of the quality of the substantially identical manufactured semiconductor device or the semi-finished product of the semiconductor device, and the loss of the substantially identical semiconductor manufacturing device.

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