CN115315778A - Manufacturing support system and manufacturing support method - Google Patents

Manufacturing support system and manufacturing support method Download PDF

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CN115315778A
CN115315778A CN202180022986.0A CN202180022986A CN115315778A CN 115315778 A CN115315778 A CN 115315778A CN 202180022986 A CN202180022986 A CN 202180022986A CN 115315778 A CN115315778 A CN 115315778A
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information
manufacturing apparatus
semiconductor manufacturing
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东山凜香
早坂昇
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Towa Corp
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Towa Corp
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Abstract

A manufacturing support system for supporting manufacturing using a semiconductor manufacturing apparatus according to the present invention includes: a holding section configured to the evaluation subject, and holding information for specifying a semiconductor manufacturing apparatus used by the use subject or scheduled to be used, and information for specifying a manufacturing process performed by the semiconductor manufacturing apparatus; an evaluation unit that is disposed in the evaluation body and evaluates suitability of a material used in the semiconductor manufacturing apparatus based on information for specifying the material supplied from a material supply body that supplies the material and information held by the holding unit; and an evaluation result providing unit that provides the evaluation result obtained by the evaluation unit to the material supply body.

Description

Manufacturing support system and manufacturing support method
Technical Field
The present invention relates to a manufacturing support system and a manufacturing support method for supporting manufacturing using a semiconductor manufacturing apparatus.
Background
In manufacturing a semiconductor device, various methods for shortening a preparation time by performance evaluation in advance or the like have been proposed. As one of such methods, japanese patent laid-open No. 2003-259015 (patent document 1) discloses an electronic conference system in which a process technician of a semiconductor manufacturing apparatus supplier and a process technician of a semiconductor device manufacturer (customer) can realize a conference about a semiconductor device process or a semiconductor manufacturing apparatus performance without going to each other as a prior activity to sell the semiconductor manufacturing apparatus.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2003-259015
Disclosure of Invention
Problems to be solved by the invention
The electronic conference system disclosed in japanese patent laid-open No. 2003-259015 (patent document 1) is to evaluate the performance in advance using a sample provided by a semiconductor device manufacturer, assuming a prior activity for selling semiconductor manufacturing apparatuses.
However, in an actual process for manufacturing a semiconductor device, since various materials provided by a material manufacturer or the like are used, it is not always possible to manufacture a semiconductor device of due quality unless a process technician of a semiconductor device manufacturer has knowledge including material selection.
The present invention provides a new structure for supporting the manufacture of a semiconductor device using such a semiconductor manufacturing apparatus.
Means for solving the problems
According to an aspect of the present invention, there is provided a manufacturing support system for supporting manufacturing using a semiconductor manufacturing apparatus. The manufacturing support system includes: a holding section configured to hold information for specifying a semiconductor manufacturing apparatus used by a use subject or scheduled to be used, and information for specifying a manufacturing process performed by the semiconductor manufacturing apparatus; an evaluation section configured to evaluate whether or not a material used in the semiconductor manufacturing apparatus is suitable based on information for determining the material supplied from a material supply main for supplying the material and information held by the holding section; and an evaluation result providing unit that provides the evaluation result obtained by the evaluation unit to the material supply body.
According to another aspect of the present invention, there is provided a manufacturing support method for supporting manufacturing using a semiconductor manufacturing apparatus. The manufacturing support method includes: a step in which a holding section disposed in an evaluation subject holds information for determining a semiconductor manufacturing apparatus used by or intended to be used by a using subject and information for determining a manufacturing process performed by the semiconductor manufacturing apparatus, and in the evaluation subject, a step in which the suitability of a material used by the semiconductor manufacturing apparatus is evaluated based on the information for determining the material supplied by a material supplying subject supplying the material and the information held by the holding section; and a step of providing the evaluation result obtained by the step of evaluating to the material supply subject.
ADVANTAGEOUS EFFECTS OF INVENTION
The present invention can provide a new structure for supporting the manufacture of a semiconductor device using a semiconductor manufacturing apparatus.
Drawings
Fig. 1 is a schematic diagram for explaining an outline of a manufacturing support system according to the present embodiment.
FIG. 2 is a sequence diagram showing a process sequence executed by the manufacturing support system according to the present embodiment.
FIG. 3 is a schematic diagram for explaining one example of application of the manufacturing support system according to the present embodiment.
Fig. 4 is a sequence diagram showing a processing procedure executed by one of application examples of the manufacturing support system according to the present embodiment.
Fig. 5 is a schematic diagram showing an example of the device configuration of a management device constituting the manufacturing support system according to the present embodiment.
Fig. 6 is a schematic diagram showing an example of installation of data holding in the manufacturing support system according to the present embodiment.
Detailed Description
Embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same or corresponding portions are denoted by the same reference numerals, and description thereof will not be repeated.
< A. Overview of construction and processing of manufacturing support System >
First, the configuration of the manufacturing support system 1 according to the present embodiment and the outline of the processing in the manufacturing support system 1 will be described. The manufacturing support system 1 supports manufacturing using a semiconductor manufacturing apparatus. In the following description, the supply of various materials used in the semiconductor manufacturing apparatus will be mainly described, but the manufacturing support system 1 according to the present embodiment is not limited to these ranges.
Fig. 1 is a schematic diagram for explaining an outline of a manufacturing support system 1 according to the present embodiment. Referring to fig. 1, a manufacturing support system 1 mainly relates to one or more use subjects 20 that use semiconductor manufacturing apparatuses 50, one or more material supply subjects 30 that supply materials 60 used in the semiconductor manufacturing apparatuses 50, and an evaluation subject 10 that evaluates in advance the suitability of the materials 60 supplied by the material supply subjects 30.
In fig. 1, "X" is given to information exchanged between the evaluating body 10 and the "using body X" that is one of the using bodies 20, "a" is given to information exchanged between the evaluating body 10 and the "material supplying body a" that is one of the material supplying bodies 30, and "a" is given to information exchanged between the "using body X" and the "material supplying body a". For example, information having the same name but different symbols of "X" or "a" such as "device information X" and "device information a" may be information having the same content or information having different contents. The same applies to fig. 2 to 4 described below.
In the present specification, the main body 20 is a term including a user who uses the semiconductor manufacturing apparatus 50 in an arbitrary form, and includes, for example, a semiconductor manufacturer, a semiconductor device manufacturer, a packaging factory (an enterprise that only contracts a package Assembly process in semiconductor manufacturing), an Out-of-commission Assembly and Testing (OSAT) (an enterprise that performs a semiconductor entrusted package or a test industry), a foundry (an enterprise that specializes in manufacturing semiconductor chips), and the like.
In the present specification, the "material supply body" includes any body of any material 60 used for manufacturing and/or selling the semiconductor manufacturing apparatus 50, and is a body different from the "evaluation body 10" and the "use body 20".
For example, as the semiconductor manufacturing apparatus 50, a mold sealing apparatus for resin-sealing an electronic component including a semiconductor chip and a singulation apparatus for singulating the electronic component including the semiconductor chip are assumed. Such a resin sealing device seals a semiconductor chip mounted on a substrate (a lead frame, a printed circuit board, a ceramic substrate, a metal substrate, a glass substrate, a semiconductor substrate, a resin substrate, or the like) with a resin. The material supply body 30 supplies a resin or a substrate for sealing the semiconductor chip as the material 60. The material 60 used in the semiconductor manufacturing apparatus 50 is not limited to such a resin or substrate, and includes any consumable material related to the manufacturing process of the semiconductor manufacturing apparatus 50.
The semiconductor manufacturing apparatus 50 manufactures a semiconductor device using the material 60 supplied from the material supply body 30 using the body 20. The main body 20 is used to specify the specification, quality performance, and the like of the material 60 to be supplied from the material supply main body 30, in consideration of the manufacturing process of the semiconductor manufacturing apparatus 50 itself and the like. The material supply body 30 supplies the material 60 that satisfies the specified specifications and quality performance.
However, not all uses of the body 20 are sufficient insight into the manufacturing process. In the initial adjustment stage of the newly introduced semiconductor manufacturing apparatus 50, an operation of optimizing the manufacturing process while repeating trial and error and determining the specification, quality performance, and the like of the material 60 to be used also occurs.
In optimizing the manufacturing process, it is necessary to evaluate the semiconductor device or its intermediate product manufactured by the semiconductor manufacturing apparatus 50 using an evaluation apparatus. However, all the using bodies 20 do not necessarily hold evaluation devices, and particularly, with miniaturization of semiconductor devices to be manufactured, higher-performance evaluation devices are required. Also, there may be a use subject 20 that cannot properly feed back the evaluation result output from the evaluation apparatus to the manufacturing process even if the evaluation apparatus is held.
The manufacturing support system 1 according to the present embodiment provides a solution to the above-described problems associated with the semiconductor manufacturing apparatus 50 used by the main body 20. That is, the evaluation main body 10 takes charge of a part or all of the evaluation work performed using the main body 20, and also takes charge of the prior evaluation of the specification, quality performance, and the like of the material 60 supplied by the material supply main body 30. By such presence of the evaluation agent 10 and the service provided, even if the use agent 20 does not have sufficient knowledge of the manufacturing process itself and the use agent 20 cannot sufficiently evaluate the quality of the manufacturing process, the semiconductor manufacturing apparatus 50 can be used to easily manufacture a semiconductor device.
Further, the material supply body 30 can improve the certainty that the material suitable for the semiconductor manufacturing apparatus 50 used in the supply-destination use body 20 can be supplied, and thus a more stable supply system can be realized.
The evaluation subject 10 basically includes a semiconductor manufacturing apparatus 50 substantially identical to the semiconductor manufacturing apparatus 50 used with the subject 20, and an evaluation apparatus 12. The evaluation subject 10 is basically suitably a manufacturer of the semiconductor manufacturing apparatus 50 or an associated company thereof. But not limited to, the manufacturer of the semiconductor manufacturing apparatus 50 or its associated company, any group or individual may also be the evaluation subject 10.
In order to manage information exchanged among the three, the management device 14, the management device 24, and the management device 34 may be disposed in the evaluation agent 10, the use agent 20, and the material supply agent 30, respectively.
Device information, evaluation information, process information, and certification information are exchanged between the evaluation subject 10 and the use subject 20. Device information, evaluation information, process information, and material information are exchanged between the evaluation main body 10 and the material supply main body 30. Device information, evaluation information, process information, and certification information are exchanged between the use body 20 and the material supply body 30. Here, each information exchanged between the three will be described.
The device information includes information for determining the semiconductor manufacturing device 50 used or scheduled to be used using the main body 20. The device information may further include information of replaceable members or the like utilized in the semiconductor manufacturing device 50 for determining the object.
The evaluation information includes evaluation results when the material 60 of the object is used by the semiconductor manufacturing apparatus 50 of the object under the manufacturing conditions of the object.
The process information includes information for determining a manufacturing process performed by the semiconductor manufacturing apparatus 50 of the object. Typically, the process information includes information defining manufacturing conditions of the semiconductor manufacturing apparatus 50 applied to the object.
The material information includes information related to the material 60 of the object.
The certification information includes a specification required in the manufacturing process of the semiconductor manufacturing apparatus 50 including the object. The certification information depends on the use of the main body 20.
Fig. 2 is a sequence diagram showing a process sequence executed by the manufacturing support system 1 according to the present embodiment. An example of the processing procedure executed by the manufacturing support system 1 will be described with reference to fig. 1 and 2. In the example shown in fig. 2, a case is assumed where the evaluation subject 10 is the manufacturer of the semiconductor manufacturing apparatus 50, and a scenario is assumed where a new semiconductor manufacturing apparatus 50 is introduced using the subject 20. In this case, the material supply body 30 develops the material 60 used in the newly introduced semiconductor manufacturing apparatus 50.
In the development of the material 60, the material supply body 30 develops the material 60 in accordance with the manufacturing conditions and the like proposed by the use body 20 and the like (step S2). The material supplying body 30 supplies a part of the developed material 60 (material sample) and material information to the evaluating body 10 (step S4). Further, in the case where the evaluation subject 10 can analyze the material sample, it is not necessary to provide the material information.
The evaluation subject 10 holds in advance device information (information for determining the semiconductor manufacturing device 50 used or scheduled to be used using the subject 20) and process information (information for determining the manufacturing process performed by the semiconductor manufacturing device 50).
The evaluation main body 10 performs evaluation using the material sample supplied from the material supply main body 30 (step S6). More specifically, the evaluation subject 10 evaluates the suitability of the material 60 based on the information for determining the material 60 supplied from the material supply subject 30 and the information (apparatus information and process information) held by the evaluation subject 10. Then, the evaluation subject 10 supplies the evaluation result obtained by the evaluation to the material supply subject 30 together with the device information and the process information (step S8).
In the development of the material 60, the processing of steps S2 to S8 (corresponding to 1) is repeatedly performed. The assessment main body 10 may separately perform the process of assessing the suitability of the material 60 for different kinds of materials 60 in the manner described. Specifically, in the process of evaluating the suitability, as an example, the composition ratio of the material 60 may be used.
After obtaining the evaluation result for one or more materials, the material to be a candidate for supply to the use subject 20 is decided between the evaluation subject 10 and the material supply subject 30 as necessary (step S10). Then, the evaluation agent 10 provides the use agent 20 with the device information, the evaluation information, and the process information for the material determined as the candidate (step S12). Similarly, the material supplying body 30 supplies the device information, the evaluation information, and the process information to the using body 20 for the material determined as the candidate (step S14).
The device information, the evaluation information, and the process information provided by the evaluation main body 10 in step S12 substantially match the device information, the evaluation information, and the process information provided by the material supply main body 30 in step S14. The purpose is to prevent errors in information provision by confirming the identity of information provided by each subject. From the viewpoint of simplifying the processing, either one of step S12 and step S14 may be omitted.
The final performance check is performed by referring to the supplied device information, evaluation information, and process information using the main body 20 (step S16). The user body 20 recognizes the content of the performance confirmation, and transmits the certification information to the user body 20 (step S18), and also transmits the certification information to the material supply body 30 (step S20).
Through the above processing, the prior evaluation of the manufacturing process ends. Then, the main body 20 is used to order a semiconductor manufacturing apparatus including certification information from the evaluation main body 10 (the manufacturer of the semiconductor manufacturing apparatus 50 in this example) (step S22), and to order a material including the certification information from the material supply main body 30 (step S24).
The evaluation body 10 (the manufacturer of the semiconductor manufacturing apparatus 50) manufactures the semiconductor manufacturing apparatus 50 in accordance with the order of the use body 20 (step S26), and delivers the manufactured semiconductor manufacturing apparatus 50 to the use body 20 (step S28). The material supply body 30 manufactures the material 60 in accordance with the order of the use body 20 (step S30), and delivers the manufactured material 60 to the use body 20 (step S32).
The prior evaluation of the manufacturing process is ended in accordance with the processing sequence shown in fig. 2.
Note that fig. 2 shows the processing procedure of the preliminary evaluation of the manufacturing process, but the processing of step S2 to step S20 may be executed again when the main body 20 is used after the semiconductor manufacturing apparatus 50 is delivered and it is desired to reconsider the manufacturing process or the like.
Evaluation processing >
Next, an example of the evaluation process of the evaluation subject 10 will be described.
Typically, the evaluation subject 10 is a manufacturer of the semiconductor manufacturing apparatus 50 or a company associated therewith, and has substantially the same semiconductor manufacturing apparatus 50 as the semiconductor manufacturing apparatus 50 used by the evaluation subject 20. Alternatively, a semiconductor manufacturing apparatus 50 substantially identical to the semiconductor manufacturing apparatus 50 used with the main body 20 may be prepared.
The evaluation subject 10 reproduces a manufacturing process that is intended to be carried out or a manufacturing process that is being carried out using the subject 20 in a semiconductor manufacturing apparatus 50 that is substantially the same as the semiconductor manufacturing apparatus 50 that is used or intended to be used using the subject 20, using a material sample supplied from the material supply subject 30. The product (semiconductor device) manufactured by the reproduced manufacturing process or a semi-product thereof is evaluated by the evaluation device 12. Or the influence of the reproduced manufacturing process on the semiconductor manufacturing apparatus 50 and the like may also be evaluated.
As described above, the evaluation subject 10 holds the device information (information for determining the semiconductor manufacturing device 50 used or intended to be used by the use subject 20) and the process information (information for determining the manufacturing process performed by the semiconductor manufacturing device 50), and the suitability of the material 60 is evaluated based on the information for determining the material 60 supplied from the material supply subject 30 and the information (device information and process information) held by the evaluation subject 10. Then, the evaluation subject 10 provides the evaluation result to the material supply subject 30.
Evaluation of a semiconductor device or a semi-product thereof manufactured by the reproduced manufacturing process can also be performed by shape observation. As evaluation items, there can be cited: the external dimensions and the amount of warpage, (2) cross-sectional observation images, (3) the amount of thermal warpage shift, (4) the results of internal observation, and (5) the results of hardness measurement. As the evaluation device 12 for evaluating the quality of the semiconductor device or the semiconductor device semi-product, there may be included any one of a measuring device for measuring a shape, a microscope for obtaining a cross-sectional observation image, a probe device for performing internal observation, and a hardness meter for measuring hardness, corresponding to such evaluation items.
More specifically, (1) the external dimensions and the amount of warpage, and (3) the amount of thermal warpage shifts are evaluated using a measuring apparatus for measuring the shape, such as a thermal warpage measuring apparatus (TSM) or an ultrasonic probe (SAT), as the evaluation apparatus 12. (2) Evaluation of the cross-sectional observation image an optical microscope, a Scanning Electron Microscope (SEM), or the like is used as the evaluation device 12. (4) Evaluation of the internal observation result uses an ultrasonic probe, an X-ray fluoroscopy device, or the like as the evaluation device 12. (5) Evaluation of the hardness measurement result uses a durometer or the like as the evaluation device 12.
The evaluation of the influence of the reproduced manufacturing process on the semiconductor manufacturing apparatus 50 can also be performed by observing the mold and jig used in the semiconductor manufacturing apparatus 50. As evaluation items, there can be enumerated: the method comprises the following steps of (1) whether dirt exists on the surface of a die, (2) a blade abrasion state, (3) blade abrasion amount and the like. In response to such evaluation items, the structure for evaluating the loss of substantially the same semiconductor manufacturing apparatus 50 may include any of an observation apparatus and a probe apparatus.
More specifically, (1) the presence or absence of fouling on the mold surface can be evaluated visually by a human, and an observation device or the like can be used as the evaluation device 12. (2) The evaluation of the blade wear state uses an ultrasonic detection device, an X-ray fluoroscopy device, or the like as the evaluation device 12. (3) Evaluation of the wear amount of the blade uses a measuring device for measuring the shape.
Not limited to the items, one or more evaluation devices 12 may be used according to any evaluation item.
As described above, as the evaluation section of the evaluation subject 10, there may be included: a semiconductor manufacturing apparatus 50 substantially the same as the semiconductor manufacturing apparatus 50 used or intended to be used using the main body 20; and an evaluation device 12 for evaluating the quality of the semiconductor devices or the semi-finished products of the semiconductor devices manufactured by the substantially identical semiconductor manufacturing device 50 and/or the loss of the substantially identical semiconductor manufacturing device 50.
Typically, the evaluation is performed by reproducing the manufacturing process using the semiconductor manufacturing apparatus 50, but a part or all of the evaluation may be realized by simulation. In the case of evaluation by simulation, a model of the semiconductor manufacturing apparatus 50 is prepared, and a model corresponding to the material information supplied by the material supply body 30 is generated, whereby simulation related to the manufacturing process of the object can be realized. Further, in the case of evaluation by simulation, it is also not necessary to supply the material sample from the material supply body 30 to the evaluation body 10.
As described above, as the evaluation section for evaluating the main body 10, a simulation apparatus using a model of the semiconductor manufacturing apparatus 50 used or intended to be used by the main body 20 may be included. By using the simulation, evaluation can be performed even without actually having the semiconductor manufacturing apparatus 50.
Details of information >
Next, the details of the information exchanged in the manufacturing support system 1 according to the present embodiment will be described.
(c 1: device information)
The device information includes information for specifying the semiconductor manufacturing apparatus 50 of the object, the replaceable member used, and the like. More specifically, if the semiconductor manufacturing apparatus 50 is a mold sealing apparatus, the apparatus information includes (1) an apparatus type (model), and (2) a mold type (model), and the like.
In addition, if the semiconductor manufacturing apparatus 50 is a single-cut apparatus, the apparatus information includes (1) the apparatus type (model), (2) the model of the set (model unit), and (3) the model of the blade.
(c 2: evaluation information)
The evaluation information includes evaluation results when the material 60 of the object is used by the semiconductor manufacturing apparatus 50 of the object under the manufacturing conditions of the object. More specifically, the evaluation information includes the evaluation result of the quality of the semiconductor device manufactured by the target semiconductor manufacturing apparatus 50 using the target material 60, the evaluation result of the wear level of the semiconductor manufacturing apparatus 50, and the like.
As an example of the evaluation result of the quality of the semiconductor device, a shape observation result and the like can be cited. As a result of shape observation, included are: the present invention relates to a semiconductor device, and more particularly, to (1) an external dimension and a warpage amount of a semiconductor device, (2) a cross-sectional observation image of the semiconductor device (observation by an optical microscope or observation by a Scanning Electron Microscope (SEM)), (3) a thermal warpage amount shift of the semiconductor device, (4) an internal observation result of the semiconductor device (for example, presence or absence of a defect or a void) obtained by ultrasonic waves, (5) an internal observation result of the semiconductor device (for example, presence or absence of a defect or a void) obtained by X-rays, and (6) a hardness measurement result of the semiconductor device.
As an example of the evaluation result of the degree of wear of the semiconductor manufacturing apparatus 50, there is an observation result of a mold or a jig. The observation results of the mold and the jig include: the mold surface was examined for the presence or absence of fouling (visual observation), (2) the state of blade wear (observation by an optical microscope or observation by a scanning electron microscope), (3) the amount of blade wear, and the like.
(c 3: process information)
The process information includes information defining manufacturing conditions of the semiconductor manufacturing apparatus 50 applied to the object. More specifically, if the semiconductor manufacturing apparatus 50 is a mold sealing apparatus, the process information includes: the molding process includes (1) the mold temperature, (2) the resin weight and the deviation amount, (3) the preheating time, (4) the molding pressure, (5) the molding profile (such as the resin injection pressure and the time-dependent displacement of the mold position).
In addition, if the semiconductor manufacturing apparatus 50 is a singulation apparatus, the process information related to the dicing process includes: rotation speed (1), cutting speed (2), cutting times (3), cutting resistance (4), cooling water amount (5) and the like.
(c 4: material information)
The material information includes information related to the material 60 of the object. More specifically, if the material 60 is a resin material, the material information includes: spiral flow as an index indicating fluidity, (2) gel time, (3) glass transition temperature, (4) linear expansion coefficient, (5) filler content, (6) filler particle size distribution, (7) moisture content, and (8) density.
If the material 60 is a substrate material, the material information includes: (1) The results of measuring the thickness and variation of the wiring plating, and (2) the results of measuring the thickness and variation of the wiring resist.
(c 5: identification information)
The certification information includes a specification required in the manufacturing process of the semiconductor manufacturing apparatus 50 including the object. More specifically, the certification information includes: the Process Capability Index (cpk) is used for (1) determination of whether or not the guaranteed value of the semiconductor manufacturing apparatus is satisfied, (2) Process Capability Index (cpk), and (3) blade life prediction.
Note that the above items are examples, and any item may be included in each piece of information depending on the manufacturing process, the type of material 60, and the like.
Application example >
In the description, an example applicable to the previous performance evaluation is mainly shown, but is not limited thereto, and various applications may be made. For example, it may be used to ensure the quality of the material 60 produced by the material supply body 30. In this case, the material supply body 30 may supply the use body 20 with the evaluation result provided by the evaluation body 10 in association with the corresponding material 60.
Fig. 3 is a schematic diagram for explaining one application example of the manufacturing support system 1 according to the present embodiment. Fig. 4 is a sequence diagram showing a processing procedure executed by one of application examples of the manufacturing support system 1 according to the present embodiment.
Referring to fig. 3, assume the following example: in a situation where a semiconductor device is manufactured using the semiconductor manufacturing apparatus 50 using the main body 20, the evaluation main body 10 evaluates the quality of the material 60 supplied by the material supply main body 30 in advance.
Referring to fig. 3 and 4, in the embodiment of supplying the material 60, the material supplying body 30 manufactures the material 60 according to the manufacturing conditions and the like previously proposed by using the body 20 and the like (step S52). The material supply body 30 supplies a part of the manufactured material 60 (material sample) and material information to the evaluation body 10 (step S54).
The evaluation main body 10 performs evaluation using the material sample supplied from the material supply main body 30 (step S56). Then, the evaluation subject 10 supplies the evaluation result obtained by the evaluation to the material supplying subject 30 (step S58).
The material supply body 30 supplies the evaluation result provided by the evaluation body 10 to the use body 20 with the manufactured material 60 (step S60). The main body 20 is used for the semiconductor manufacturing apparatus 50 after confirming the evaluation result accompanying the material 60 delivered from the material supply main body 30.
Further, in step S56 and step S58, the evaluation result may be provided to the material supplying body 30 only when the evaluation result obtained by the evaluation body 10 is appropriate.
By adopting the structure shown in fig. 3 and 4, the material 60 supplied from the material supply main body 30 to the use main body 20 can be ensured more reliably to be suitable for the semiconductor manufacturing apparatus 50 to be processed.
Further, the quality assessment shown in fig. 3 and 4 may be performed, for example, during the manufacture of each batch of material 60.
< E. management apparatus >
Next, the management device 14, the management device 24, and the management device 34, which are disposed in the evaluation agent 10, the use agent 20, and the material supply agent 30, respectively, will be described. In the manufacturing support system 1, information necessary for the management device 14, the management device 24, and the management device 34 is essentially exchanged.
Fig. 5 is a schematic diagram showing an example of the device configuration of the management device 14 constituting the manufacturing support system 1 according to the present embodiment. The management device 24 and the management device 34 are also configured similarly to the devices shown in fig. 1.
Referring to fig. 5, the management device 14 is implemented using a computer, and includes, as main elements, a processor 102, a main memory 104, an input unit 106, a display unit 108, an output unit 110, a secondary storage device 120, and a communication unit 126. These elements are connected to an internal bus 128.
The processor 102 is an arithmetic main body that executes processing necessary for the functions provided by the management apparatus 14, and realizes the necessary functions by executing programs or program modules stored in the secondary storage apparatus 120. The processors 102 may also be multi-core and/or multi-processor, and the number of cores or processors may be set as desired based on the required load handling capacity.
Main memory 104 provides the working memory needed by processor 102 to execute programs. The main memory 104 is a nonvolatile memory that once holds program codes or work data of programs to be executed.
The input unit 106 is an element that receives an operation from an operator or the like, and is implemented using, for example, a keyboard, a mouse, a touch panel, or the like. The display unit 118 is an element for presenting information such as a processing result to an operator or the like, and is implemented using, for example, a display or the like. The output unit 110 is an element for outputting information in the management apparatus 14 in a form, and is realized by using a printer or the like, for example.
The secondary storage device 120 is an example of a holding unit, and stores a data set 124 in addition to an operating system (not shown), and the data set 124 includes a process implementation module 122 and various data for providing functions required in the manufacturing support system 1 according to the present embodiment. Typically, the data set 124 of the management device 14 of the evaluation subject 10 includes certification information, device information, and process information.
The communication unit 126 is an element for communicating with the use main body 20 and/or the material supply main body 30, and is implemented using, for example, a wired Area Network (LAN) communication interface, a wireless LAN communication interface, a public Network communication interface, or the like. A plurality of types or a plurality of communication units 126 may be installed according to the number of the use units 20 and/or the material supply units 30 to be communicated, the communication mode, and the like.
In the above description, an example of a configuration in which necessary information is directly exchanged among the evaluation agent 10 (management apparatus 14), the use agent 20 (management apparatus 24), and the material supply agent 30 (management apparatus 34) is shown, but the present invention is not limited to this configuration, and information may be managed by a specific agent.
Fig. 6 is a schematic diagram showing an example of installation of data holding in the manufacturing support system 1 according to the present embodiment. Fig. 6 (a) shows an example of mounting data necessary for the management of the evaluation body 10, and fig. 6 (B) shows an example of mounting data necessary for the management of the material supplying body 30.
Referring to fig. 6 (a), the evaluation main body 10 manages evaluation information related to the material sample supplied from the material supply main body 30, and supplies specific information such as a Uniform Resource Locator (URL) for accessing the managed evaluation information to the material supply main body 30 instead of the evaluation information. Further, the material supplying body 30 provides the use body 20 with specific information provided by the evaluating body 10.
The material supply body 30 and the use body 20 can access the evaluating body managed by the evaluating body 10 based on specific information. Further, various restrictions such as an access code (password) may be set in accessing the evaluation information managed by the evaluation main unit 10.
With such a configuration, the calculation resources in the material supply body 30 (management device 34) can be reduced, and the processing of the manufacturing support system 1 can be simplified.
Referring to fig. 6 (B), the evaluating body 10 transmits evaluation information related to the material sample supplied from the material supplying body 30 to the material supplying body 30. The material supplying body 30 manages the evaluation information received from the evaluating body 10. The material supply agent 30 supplies the usage agent 20 with specific information such as a URL for accessing evaluation information managed by itself.
The use subject 20 can access an evaluation subject managed by the material supply subject 30 based on specific information. Further, various restrictions such as an access code (password) may be provided for accessing the evaluation information managed by the material supplying body 30.
With such a configuration, the computational resources in the use agent 20 (management device 24) can be reduced, and the processing of the manufacturing support system 1 can be simplified.
In the above description, the configuration examples of the management device 14, the management device 24, and the management device 34 that are respectively arranged in the evaluation agent 10, the use agent 20, and the material supply agent 30 are shown, but the present invention is not limited thereto, and a part of a system in which a plurality of computers are connected via a network may be used to realize necessary processes and functions, such as a so-called cloud computer.
The manufacturing support system 1 according to the present embodiment can be implemented in any computing environment, and any technique known at the time of actual installation or any installation form can be used, depending on the law of the country or region where the actual installation is performed. The technical scope of the present invention is not limited to a specific mounting form, and may include any mounting form.
< F. Advantage >
Evaluating the semiconductor manufacturing apparatus and whether the material used by the semiconductor manufacturing apparatus is suitable in advance for the target manufacturing process requires sufficient insight, and also requires a lot of time. By performing such an evaluation process requiring a large amount of resources by an evaluation subject (typically, a manufacturer of a semiconductor manufacturing apparatus or the like) in association with a material supply subject, comprehensive evaluation including the semiconductor manufacturing apparatus and materials can be performed.
By providing a manufacturing support system capable of such comprehensive evaluation, the material supply body can reliably and appropriately supply materials suitable for the manufacturing process desired by the use body as a customer. Further, even if the subject used does not have sufficient knowledge, the target manufacturing process can be realized earlier and reliably by the knowledge of the subject to be evaluated. Further, the evaluation subject can support various material supply subjects and use subjects using his own knowledge.
The embodiments disclosed herein are illustrative in all respects and should not be construed as being limiting. The scope of the present invention is shown by the claims rather than the description of the embodiment, and is intended to include all modifications within the scope and meaning equivalent to the claims.
Description of the symbols
1: manufacturing support system
10: evaluating a subject
12: evaluation device
14. 24, 34: management device
20: use the main body
30: material supply body
50: semiconductor manufacturing apparatus
60: material
102: processor with a memory for storing a plurality of data
104: main memory
106: input unit
108. 118: display unit
110: output unit
120: secondary storage device
122: processing implementation module
124: data set
126: communication unit
128: an internal bus.

Claims (8)

1. A manufacturing support system for supporting manufacturing using a semiconductor manufacturing apparatus, comprising:
a holding section configured to the evaluation subject, and holding information for specifying a semiconductor manufacturing apparatus used by the use subject or scheduled to be used, and information for specifying a manufacturing process performed by the semiconductor manufacturing apparatus;
an evaluation unit that is disposed in the evaluation subject and evaluates suitability of a material used in the semiconductor manufacturing apparatus based on information for determining the material supplied from a material supply subject that supplies the material and information held by the holding unit; and
an evaluation result providing section that provides the evaluation result obtained by the evaluation section to the material supply body.
2. The manufacturing support system according to claim 1, wherein the evaluation unit includes:
a substantially identical semiconductor manufacturing apparatus, substantially identical to a semiconductor manufacturing apparatus used or intended for use by the use subject; and
and an evaluation device that evaluates at least one of a quality of a semiconductor device or a semi-product of the semiconductor device manufactured by the substantially same semiconductor manufacturing apparatus and a loss of the substantially same semiconductor manufacturing apparatus.
3. The manufacturing support system according to claim 2, wherein the evaluation device includes any one of a measurement device for measuring a shape, a microscope for obtaining a cross-sectional observation image, a probe device for performing internal observation, and a hardness meter for measuring hardness, as a structure for evaluating the quality of the semiconductor device or a semi-product of the semiconductor device.
4. The manufacturing support system according to claim 2 or 3, wherein the evaluation device includes either one of an observation device and a probe device as a structure for evaluating a loss of the substantially same semiconductor manufacturing apparatus.
5. The manufacturing support system according to any one of claims 2 to 4, wherein the evaluation device includes a simulation device that uses a model of a semiconductor manufacturing device used by or scheduled to be used by the usage body.
6. The manufacturing support system according to any one of claims 1 to 5, wherein the material supply body supplies the use body with an evaluation result provided by the evaluation body in association with a corresponding material.
7. The manufacturing support system according to any one of claims 1 to 6, wherein the evaluation unit performs processing for evaluating whether or not a material is suitable for each of a plurality of different materials.
8. A manufacturing support method for supporting manufacturing using a semiconductor manufacturing apparatus, comprising:
a step in which a holding section provided in the evaluation subject holds information for specifying a semiconductor manufacturing apparatus used by the use subject or intended to be used, and information for specifying a manufacturing process performed by the semiconductor manufacturing apparatus,
a step of evaluating, in the evaluation subject, suitability of a material used in the semiconductor manufacturing apparatus based on information for determining the material supplied by a material supply subject that supplies the material and information held by the holding portion; and
a step of providing the evaluation result obtained by the step of evaluating to the material supply subject.
CN202180022986.0A 2020-05-15 2021-01-28 Manufacturing support system and manufacturing support method Pending CN115315778A (en)

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