KR20230009943A - Manufacturing support system and manufacturing support method - Google Patents

Abstract

A manufacturing support system that supports manufacturing using a semiconductor manufacturing apparatus maintains information specifying a semiconductor manufacturing apparatus used or scheduled to be used by a user, and information specifying a manufacturing process executed in the semiconductor manufacturing apparatus, Evaluating suitability of the material based on information specifying the material supplied from the holding unit arranged in the evaluation body and the material supplying body supplying the material used in the semiconductor manufacturing apparatus, and the information held by the holding unit , an evaluation unit arranged in the evaluation subject, and an evaluation result providing unit providing the evaluation result by the evaluation unit to the material supplying subject.

Description

Manufacturing support system and manufacturing support method

The present invention relates to a manufacturing support system and a manufacturing support method for supporting manufacturing using a semiconductor manufacturing apparatus.

In the manufacture of semiconductor devices, various approaches for shortening the lead time have been proposed by prior performance evaluation and the like. As one of these approaches, Japanese Unexamined Patent Publication No. 2003-259015 (Patent Document 1) is a preliminary activity for selling semiconductor manufacturing equipment, in which process engineers of semiconductor manufacturing equipment vendors and semiconductor device manufacturers (customers) interact with each other. Disclosed is an electronic conference system capable of realizing a conference on semiconductor device processes or semiconductor manufacturing equipment performance without going to the other party.

Patent Document 1: Japanese Unexamined Patent Publication No. 2003-259015

The electronic conference system disclosed in Japanese Unexamined Patent Publication No. 2003-259015 (Patent Document 1) assumes prior activities for selling semiconductor manufacturing equipment, and its performance is tested in advance using samples provided from semiconductor device manufacturers. to evaluate

However, since various materials provided from material manufacturers and the like are used in the actual semiconductor device manufacturing process, it is impossible to manufacture a semiconductor device of appropriate quality unless the process engineer of the semiconductor device maker has knowledge including material selection. can't say it can

An object of the present invention is to provide a novel structure that supports manufacturing of a semiconductor device using such a semiconductor manufacturing apparatus.

According to one aspect of the present invention, a manufacturing support system for supporting manufacturing using a semiconductor manufacturing apparatus is provided. The manufacturing support system includes a holding unit disposed in an evaluation body that holds information specifying a semiconductor manufacturing device used or scheduled to be used in a user body, and information specifying a manufacturing process executed in the semiconductor manufacturing device; An evaluation unit disposed in the evaluation body that evaluates the suitability of the material based on the information specifying the material provided by the material supply entity supplying the material used in the semiconductor manufacturing apparatus and the information held by the holding unit; , and includes an evaluation result providing unit that provides the evaluation result by the evaluation unit to the material supplying entity.

According to another aspect of the present invention, a manufacturing support method for supporting manufacturing using a semiconductor manufacturing apparatus is provided. A manufacturing support method includes a step of holding, by a holding unit disposed in an evaluation body, information specifying a semiconductor manufacturing device used or scheduled to be used in a user body, and information specifying a manufacturing process to be executed in the semiconductor manufacturing device; , a step of evaluating suitability of the material based on information specifying the material provided from a material supplying subject supplying material used in the semiconductor manufacturing apparatus and information held by the holding unit in the evaluation subject; and a step of providing the evaluation result by the step of evaluating to the material supplier.

It is possible to provide a new structure that supports manufacturing of a semiconductor device using a semiconductor manufacturing apparatus.

1 is a schematic diagram for explaining the outline of a manufacturing support system according to the present embodiment.
2 is a sequence diagram showing the processing sequence executed in the manufacturing support system according to the present embodiment.
3 is a schematic diagram for explaining one of the application examples of the manufacturing support system according to the present embodiment.
4 is a flowchart showing a processing sequence executed in one of the application examples of the manufacturing support system according to the present embodiment.
5 is a schematic diagram showing an example of the device configuration of the management device constituting the manufacturing support system according to the present embodiment.
6 is a schematic diagram showing an implementation example of data retention in the manufacturing support system according to the present embodiment.

EMBODIMENT OF THE INVENTION Embodiment of this invention is described in detail, referring drawings. In addition, the same code|symbol is attached|subjected to the same or equivalent part in drawing, and the description is not repeated.

<A. Outline of configuration and processing of manufacturing support system>

First, the configuration of the manufacturing support system 1 according to the present embodiment and an outline of processing in the manufacturing support system 1 will be described. The manufacturing support system 1 supports manufacturing using a semiconductor manufacturing apparatus. In the following description, supply of various materials used in the semiconductor manufacturing apparatus is mainly explained, but the manufacturing support system 1 according to the present embodiment is not limited to this range.

1 is a schematic diagram for explaining the outline of a manufacturing support system 1 according to the present embodiment. Referring to FIG. 1 , in the manufacturing support system 1, one or a plurality of users 20 that mainly use the semiconductor manufacturing apparatus 50 and materials 60 used in the semiconductor manufacturing apparatus 50 are provided. One or a plurality of material supply main body 30 to supply and the evaluation main body 10 which evaluates suitability of the material 60 supplied by the material supply main body 30 in advance are involved.

In Fig. 1, "X" is assigned to information exchanged between "user X", which is one of the evaluation entity 10 and the user entity 20, and among the evaluation entity 10 and the material supply entity 30 "A" is assigned to information exchanged between one "material supply principal A" and between "use principal X" and "material supply principal A". For example, information having the same name and different codes of "X" and "A", such as "device information X" and "device information A", may be information having the same contents or different contents. It is the same also in the following FIGS. 2-4.

In this specification, the subject of use 20 is a term including a user who uses the semiconductor manufacturing apparatus 50 in an arbitrary form, for example, a semiconductor manufacturer, a semiconductor device maker, an assembly house (in semiconductor manufacturing It includes companies that subcontract only the package assembly process of the company), OSAT (company that conducts semiconductor packaging and testing business), foundry company (company that specializes in manufacturing semiconductor chips), and the like.

In this specification, "material supply entity" includes any entity that manufactures and/or sells any material 60 used in the semiconductor manufacturing apparatus 50, and includes "evaluation entity 10" and " It is a subject different from the "using subject 20".

For example, as the semiconductor manufacturing apparatus 50, a mold device for resin-sealing electronic components including semiconductor chips and a singulation device for separating electronic components including semiconductor chips are assumed. Such a resin encapsulation device seals a semiconductor chip mounted on a substrate (a lead frame, a printed circuit board, a ceramic substrate, a metal substrate, a glass substrate, a semiconductor substrate, or a resin substrate) with resin. The material supply main body 30 supplies a resin or a substrate for sealing the semiconductor chip as the material 60 . The material 60 used in the semiconductor manufacturing apparatus 50 is not limited to these resins and substrates, and includes any consumables related to the manufacturing process of the semiconductor manufacturing apparatus 50 .

The main body 20 uses the material 60 supplied by the main body 30 supplying the material, and manufactures a semiconductor device with the semiconductor manufacturing device 50 . The user 20 designates specifications, quality performance, and the like of the material 60 to be supplied to the material supply main body 30 in consideration of the manufacturing process of the own semiconductor manufacturing apparatus 50 and the like. The material supply main body 30 supplies the material 60 that satisfies specified specifications and quality performance.

However, it cannot be said that all users 20 have sufficient knowledge about the manufacturing process. In addition, in the initial adjustment stage of the newly introduced semiconductor manufacturing apparatus 50, while optimizing the manufacturing process by repeating trial and error, work also occurs to determine the specifications, quality performance, etc. of the material 60 to be used. .

In optimizing the manufacturing process, it is necessary to evaluate the semiconductor device manufactured by the semiconductor manufacturing apparatus 50 or its semi-finished product using an evaluation device. However, it cannot be said that not all users 20 have evaluation devices, and in particular, higher performance evaluation devices are required due to miniaturization of semiconductor devices to be manufactured. In addition, even if it is possessed, there may be a user subject 20 who cannot appropriately feedback the evaluation result output from the evaluation device to the manufacturing process.

The manufacturing support system 1 according to the present embodiment provides means for solving the problems described above regarding the semiconductor manufacturing apparatus 50 used by the user 20 . In other words, the evaluation entity 10 is in charge of part or all of the evaluation work performed by the user entity 20, and in advance of the specification, quality performance, etc. of the material 60 supplied by the material supply entity 30. It is also responsible for evaluation. Even if the user 20 does not have sufficient knowledge about the manufacturing process itself and the user 20 cannot sufficiently evaluate the quality of the manufacturing process due to the existence of the evaluation subject 10 and the service provided, Manufacturing of semiconductor devices using the semiconductor manufacturing apparatus 50 can be facilitated.

In addition, in the material supply main body 30, since it is possible to increase the certainty of supplying suitable materials to the semiconductor manufacturing apparatus 50 used by the main user 20 of the supply destination, a more robust supply system can be realized. .

The evaluation body 10 basically has a semiconductor manufacturing device 50 substantially the same as the semiconductor manufacturing device 50 used by the user body 20 and the evaluation device 12 . It is preferable that the evaluation subject 10 is basically a maker of the semiconductor manufacturing apparatus 50 or a related company thereof. However, it is not limited to the maker of the semiconductor manufacturing apparatus 50 or its related company, and any group or individual may serve as the evaluation subject 10 .

In order to manage information exchanged between the third party, the evaluation subject 10, the user subject 20, and the material supply subject 30 are provided with a management device 14, a management device 24, and a management device 34. You may arrange each.

Between the evaluation subject 10 and the user subject 20, device information, evaluation information, process information, and authorization information are exchanged. Between the evaluation entity 10 and the material supply entity 30, device information, evaluation information, process information, and material information are exchanged. Between the user main body 20 and the material supply main body 30, device information, evaluation information, process information, and certification information are exchanged. Here, each piece of information exchanged between the three parties will be described.

The device information includes information specifying the semiconductor manufacturing device 50 used or planned to be used by the user 20 . The device information may further include information for specifying a interchangeable member or the like used in the target semiconductor manufacturing device 50 .

The evaluation information includes an evaluation result when the material 60 as a target is used in the semiconductor manufacturing apparatus 50 as a target under manufacturing conditions as a target.

The process information includes information specifying a manufacturing process to be executed in the target semiconductor manufacturing apparatus 50 . Typically, the process information includes information defining manufacturing conditions applied to the semiconductor manufacturing apparatus 50 as a target.

Material information includes information about the material 60 as a target.

The authorization information includes required specifications in a manufacturing process including the target semiconductor manufacturing apparatus 50 . Authorization information is determined by the subject 20 of use.

Fig. 2 is a sequence diagram showing the processing sequence executed in the manufacturing support system 1 according to the present embodiment. Referring to Figs. 1 and 2, an example of the processing sequence executed in the manufacturing support system 1 will be described. In the example shown in FIG. 2 , the case where the evaluation subject 10 is a manufacturer of the semiconductor manufacturing apparatus 50 is assumed, and a situation in which the user subject 20 introduces a new semiconductor manufacturing apparatus 50 is assumed. In this situation, the material supplier 30 develops the material 60 used in the newly introduced semiconductor manufacturing apparatus 50 .

In the phase of development of the material 60, the material supply entity 30 develops the material 60 according to the manufacturing conditions and the like suggested by the user entity 20 and the like (step S2). The material supply main body 30 provides a part of the developed material 60 (material sample) and material information to the evaluation main body 10 (step S4). In addition, when the evaluation subject 10 can analyze a material sample, it is not necessarily necessary to provide material information.

The evaluation subject 10 includes device information (information specifying the semiconductor manufacturing device 50 used or planned to be used by the user 20), and process information (manufacturing process executed by the semiconductor manufacturing device 50). information specifying) is maintained in advance.

The evaluation main body 10 evaluates using the material sample provided from the material supply main body 30 (step S6). More specifically, the evaluation entity 10, based on the information specifying the material 60 provided from the material supply entity 30 and the information (device information and process information) maintained by the evaluation entity 10, The suitability of the material 60 is evaluated. Then, the evaluation entity 10 provides the device information and process information to the material supply entity 30 together with the evaluation result obtained by the evaluation (step S8).

In the phase of development of the material 60, the process of steps S2-S8 (*1) is repeatedly executed. In this way, the evaluation main body 10 may each perform the process of evaluating suitability of the material 60 with respect to the some different material 60. Specifically, in the process of evaluating suitability, the composition ratio of the material 60 can be used as an example.

After the evaluation result is obtained for one or a plurality of materials, a candidate material to be supplied to the user 20 is determined between the evaluation subject 10 and the material supply subject 30 as necessary (step S10). ). Then, the evaluation subject 10 provides the device information, evaluation information, and process information to the using subject 20 for the material determined as a candidate (step S12). Similarly, the material supplying entity 30 provides the device information, evaluation information, and process information to the using entity 20 for the material determined as a candidate (step S14).

In addition, the device information, evaluation information, and process information provided from the evaluation main body 10 in step S12, and the device information, evaluation information, and process information provided from the material supply main body 30 in step S14 are basically coincide This is to confirm the identity of the information provided from each subject, and aims to prevent a mis-provision of information or the like. From the viewpoint of simplifying the processing, either step S12 or step S14 may be omitted.

The user subject 20 refers to the provided device information, evaluation information, and process information, and performs final performance confirmation (step S16). When the content of the performance confirmation is accepted, the user subject 20 transmits the authorization information to the evaluation subject 20 (step S18) and transmits the authorization information to the material supply main body 30 (step S20). ).

With the above processing, the preliminary evaluation of the manufacturing process is completed. Then, the user subject 20 places an order for the semiconductor manufacturing apparatus including the authorization information from the evaluation subject 10 (in this example, the manufacturer of the semiconductor manufacturing apparatus 50) (step S22), and the material supplying subject matter Regarding (30), an order is made for the material including the authorization information (step S24).

The evaluation subject 10 (the manufacturer of the semiconductor manufacturing apparatus 50) manufactures the semiconductor manufacturing apparatus 50 in response to an order from the user subject 20 (step S26), and manufactures the semiconductor manufacturing apparatus 50 is delivered to the user 20 (step S28). In addition, the material supply main body 30 manufactures the material 60 according to the order from the using main body 20 (step S30), and supplies the manufactured material 60 to the using main body 20 (step S30). S32).

According to the processing procedure as shown in Fig. 2, the preliminary evaluation of the manufacturing process is completed.

2 shows the processing procedure of the preliminary evaluation of the manufacturing process. After the semiconductor manufacturing device 50 is delivered, when the user 20 wishes to review the manufacturing process or the like, steps S2 to S20 The processing up to may be executed again.

<B. Evaluation processing>

Next, an example of evaluation processing by the evaluation subject 10 will be described.

Typically, the evaluation subject 10 is a maker of the semiconductor manufacturing apparatus 50 or a related company thereof, and the semiconductor manufacturing apparatus 50 substantially the same as the semiconductor manufacturing apparatus 50 used by the user 20 is used. Have. Alternatively, the semiconductor manufacturing apparatus 50 substantially the same as the semiconductor manufacturing apparatus 50 used by the user 20 can be prepared.

The evaluation entity 10 uses the material sample provided from the material supply entity 30 to use the semiconductor manufacturing apparatus 50 that is substantially the same as the semiconductor manufacturing apparatus 50 used or scheduled to be used by the user 20. In this case, the manufacturing process scheduled to be implemented by the user 20 or the manufacturing process being implemented is reproduced. A product (semiconductor device) manufactured by the reproduced manufacturing process or a semi-finished product thereof is evaluated by the evaluation device 12 . Alternatively, the influence of the reproduced manufacturing process on the semiconductor manufacturing apparatus 50 and the like can be evaluated.

In this way, the evaluation subject 10 provides device information (information specifying the semiconductor manufacturing device 50 used or scheduled to be used by the user subject 20), and process information (execution in the semiconductor manufacturing device 50). based on the information specifying the material 60 provided from the material supply entity 30 and the information (apparatus information and process information) maintained by the evaluation entity 10. , the suitability of the material 60 is evaluated. And the evaluation main body 10 provides the evaluation result to the material supply main body 30 .

Evaluation of the semiconductor device manufactured by the reproduced manufacturing process or its semi-finished product may be performed by shape observation. Evaluation items include (1) external dimensions and amount of warping, (2) cross-section observation, (3) change in warping amount under heat, (4) internal observation results, and (5) hardness measurement results. there is. Corresponding to these evaluation items, the evaluation device 12 for evaluating the quality of a semiconductor device or a semi-finished product of a semiconductor device includes a measuring device for measuring a shape, a microscope for acquiring a cross-sectional observation image, and a probe device for conducting internal observation. , a hardness tester for measuring hardness.

More specifically, for the evaluation of (1) external dimensions and amount of warp and (3) variation in the amount of warp when heated, as the evaluation device 12, a heating warp measurement device (TSM), an ultrasonic probe (SAT), or the like is used. A measuring device that measures the shape is used. (2) For evaluation of cross-sectional observation images, an optical microscope, a scanning electron microscope (SEM), or the like is used as the evaluation device 12 . (4) For evaluation of internal observation results, an ultrasonic probe, an X-ray fluoroscopy device, or the like is used as the evaluation device 12 . (5) For evaluation of the hardness measurement result, a hardness tester or the like is used as the evaluation device 12 .

The evaluation of the influence of the reproduced manufacturing process on the semiconductor manufacturing apparatus 50 may be performed by observing the mold and jigs used in the semiconductor manufacturing apparatus 50 . Evaluation items include (1) presence or absence of contamination on the surface of the mold, (2) blade abrasion state, (3) blade abrasion amount, and the like. Corresponding to these evaluation items, as a configuration for evaluating wear and tear of substantially the same semiconductor manufacturing apparatus 50, either an observation device or a search device may be included.

More specifically, (1) evaluation of the presence or absence of contamination on the mold surface may be performed by human eyes, or an observation device or the like may be used as the evaluation device 12 . (2) For evaluation of the state of wear of the blade, an ultrasonic probe or an X-ray fluoroscopic device is used as the evaluation device 12 . (3) For evaluation of the amount of wear of the blade, a measuring device for measuring the shape is used.

It is not limited to the above-mentioned items, and one or a plurality of evaluation devices 12 may be used according to arbitrary evaluation items.

In this way, as the evaluation unit of the evaluation subject 10, the semiconductor manufacturing apparatus 50 substantially the same as the semiconductor manufacturing apparatus 50 used or planned to be used by the user 20, and the substantially identical semiconductor manufacturing apparatus An evaluation device 12 for evaluating the quality of the semiconductor device manufactured in step (50) or the semi-finished product of the semiconductor device and/or the wear and tear of the substantially identical semiconductor manufacturing device 50 may be included.

Typically, the evaluation is performed by reproducing the manufacturing process using the semiconductor manufacturing apparatus 50, but a part or all of the evaluation may be realized by simulation. When evaluation is performed by simulation, simulation of the target manufacturing process can be realized by preparing a model of the semiconductor manufacturing apparatus 50 and generating a model according to material information supplied from the material supply main body 30. . In the case of evaluation by simulation, it is not necessary to necessarily provide a material sample from the material supply main body 30 to the evaluation main body 10 .

In this way, the evaluation unit of the evaluation subject 10 may include a simulation device using a model of the semiconductor manufacturing apparatus 50 used by the user subject 20 or scheduled to be used. By using simulation, it is possible to perform evaluation even without actually having the semiconductor manufacturing apparatus 50 .

<C. Details of information>

Next, details of information exchanged in the manufacturing support system 1 according to the present embodiment will be described.

(c1: device information)

The device information includes information for specifying the target semiconductor manufacturing device 50 and the interchangeable member to be used. More specifically, if the semiconductor manufacturing device 50 is a mold device, the device information includes (1) device type (model number), (2) mold type (model number), and the like.

In addition, if the semiconductor manufacturing device 50 is a singulation device, the device information includes (1) device type (model number), (2) model number of kit (unit part for product type), (3) model number of blade, etc. includes

(c2: evaluation information)

The evaluation information includes an evaluation result when the material 60 as a target is used in the semiconductor manufacturing apparatus 50 as a target under manufacturing conditions as a target. More specifically, the evaluation information is an evaluation result of the quality of a semiconductor device manufactured by the semiconductor manufacturing apparatus 50 as a target using the target material 60 and an evaluation of the degree of wear and tear of the semiconductor manufacturing apparatus 50 Include results, etc.

A shape observation result etc. are mentioned as an example of the evaluation result of the quality of a semiconductor device. As the shape observation results, (1) the external dimension and warpage amount of the semiconductor device, (2) a cross-sectional observation image of the semiconductor device (observation with an optical microscope or a scanning electron microscope (SEM)), (3) the semiconductor device Variation in the amount of warp when heated, (4) results of internal observation of semiconductor devices by ultrasonic waves (eg, presence or absence of defects or voids), (5) results of internal observation of semiconductor devices by X-rays (eg, defects or voids) presence/absence of voids, etc.), (6) hardness measurement results of the semiconductor device, and the like.

Moreover, as an example of the evaluation result of the wear degree of the semiconductor manufacturing apparatus 50, the observation result of a mold and a jig, etc. are mentioned. As the result of observation of the mold and tooling, (1) presence or absence of contamination on the surface of the mold (visual inspection), (2) state of braid wear (observation with an optical microscope or observation with a scanning electron microscope), (3) amount of wear of the blade, Include etc.

(c3: Process information)

The process information includes information defining manufacturing conditions applied to the target semiconductor manufacturing apparatus 50 . More specifically, if the semiconductor manufacturing device 50 is a mold device, the process information includes: (1) mold temperature, (2) resin weight and unevenness amount, (3) preheating time, (4) molding pressure, (5) ) molding profile (resin injection pressure and temporal variation of mold position, etc.), and the like.

In addition, if the semiconductor manufacturing device 50 is a singulation device, process information related to the cut process includes (1) number of revolutions, (2) cut speed, (3) number of cuts, (4) cutting resistance, and (5) cooling water quantity, etc.

(c4: material information)

Material information includes information about the material 60 as a target. More specifically, if the material 60 is a resin material, the material information includes (1) spiral flow as an indicator of fluidity, (2) gel time, (3) glass transition temperature, (4) linear expansion coefficient, ( 5) filler content, (6) filler particle size distribution, (7) moisture content, (8) density, and the like.

Further, if the material 60 is a substrate material, the material information includes (1) wiring plating thickness and unevenness measurement results, (2) wiring resist thickness and unevenness measurement results, and the like.

(c5: Authorization information)

The authorization information includes required specifications in a manufacturing process including the target semiconductor manufacturing apparatus 50 . More specifically, the certification information includes (1) a result of determination of whether or not the guaranteed value of the semiconductor manufacturing equipment is satisfied, (2) cpk (process capability index), (3) blade life prediction, and the like.

Incidentally, the items described above are examples, and arbitrary items can be included in each piece of information depending on the manufacturing process, the type of material 60, and the like.

<D. Application example>

In the above description, an example mainly applied to prior performance evaluation has been shown, but it is not limited to this, and various applications are possible. For example, it may be used in order to guarantee the quality of the material 60 manufactured by the material supply main body 30. In this case, the material supplying entity 30 may associate the evaluation result provided from the evaluation entity 10 with the corresponding material 60 and supply it to the using entity 20 .

3 is a schematic diagram for explaining one of the application examples of the manufacturing support system 1 according to the present embodiment. Fig. 4 is a sequence diagram showing a processing sequence executed in one of the application examples of the manufacturing support system 1 according to the present embodiment.

Referring to FIG. 3 , in a situation in which the user 20 manufactures a semiconductor device using the semiconductor manufacturing device 50, the material supplier 30 evaluates the quality of the material 60 supplied ( 10) assumes an example of evaluating in advance.

3 and 4, in the phase of supplying the material 60, the material supplying entity 30 manufactures the material 60 according to the manufacturing conditions previously suggested by the using entity 20 and the like ( Step S52). The material supply main body 30 provides a part of the manufactured material 60 (material sample) and material information to the evaluation main body 10 (step S54).

The evaluation main body 10 evaluates using the material sample provided from the material supply main body 30 (step S56). And the evaluation main body 10 provides the evaluation result obtained by evaluation to the material supply main body 30 (step S58).

The material supply main body 30 attaches the evaluation result provided from the evaluation main body 10 to the manufactured material 60, and supplies it to the using main body 20 (step S60). The user 20 confirms the evaluation result attached to the material 60 delivered from the material supply main body 30 and then uses it for the semiconductor manufacturing device 50 .

In addition, in step S56 and S58, you may make it provide the evaluation result with respect to the material supply main body 30 only when the result of the evaluation by the evaluation main body 10 is valid.

By employing the structure shown in FIGS. 3 and 4 , it is possible to more reliably ensure that the material 60 supplied from the material supplier 30 to the user 20 is suitable for the target semiconductor manufacturing apparatus 50 . there is.

In addition, you may perform the quality evaluation shown in FIG. 3 and FIG. 4 for every manufacturing lot of the material 60, for example.

<E. Management device>

Next, the management device 14, the management device 24, and the management device 34 disposed in the evaluation entity 10, the use entity 20, and the material supply entity 30, respectively, will be described. In the manufacturing support system 1, substantially, the management device 14, the management device 24, and the management device 34 exchange necessary information.

5 is a schematic diagram showing an example of the device configuration of the management device 14 constituting the manufacturing support system 1 according to the present embodiment. The configuration of the management device 24 and the management device 34 is the same as that shown in FIG. 5 .

Referring to FIG. 5 , the management device 14 is realized using a computer, and includes, as main components, a processor 102, a main memory 104, an input unit 106, a display unit 108, It includes an output unit 110, a secondary storage device 120, and a communication unit 126. These components are connected to internal bus 128 .

The processor 102 is an arithmetic entity that executes processing necessary for the functions provided by the management device 14, and executes programs or program modules stored in the secondary storage device 120, and functions necessary. to realize The processor 102 may be multi-core and/or multi-processor, and the required number of cores or processors is set according to the required load processing capability.

Main memory 104 provides working memory for processor 102 to execute programs. The main memory 104 is a non-volatile memory that primarily retains the code or working data of an executed program.

The input unit 106 is a component that receives an operation from an operator or the like, and is implemented using, for example, a keyboard, mouse, touch panel, or the like. The display unit 118 is a component that presents information such as processing results to an operator and the like, and is mounted using a display or the like, for example. The output unit 110 is a component that categorizes and outputs the information in the management device 14, and is implemented using, for example, a printer.

The secondary storage device 120 is an example of a holding unit, and in addition to an operating system (not shown), a processing realization module 122 for providing necessary functions in the manufacturing support system 1 according to the present embodiment. and a data group 124 composed of various data. The data group 124 of the management device 14 of the evaluation subject 10 typically includes authentication information, device information, and process information.

The communication unit 126 is a component for communicating with the user 20 and/or the material supplier 30, and is mounted using, for example, a wired LAN communication interface, a wireless LAN communication interface, a public network communication interface, and the like. do. A plurality of types or a plurality of communication units 126 may be mounted depending on the number of users 20 and/or material supply main bodies 30 to be communicated and communication types, and the like.

In the above description, between the evaluation subject 10 (management device 14), the use subject 20 (management device 24), and the material supply subject 30 (management device 34), necessary information Although an example of a configuration in which ? is directly exchanged is shown, it is not limited to this configuration, and a specific subject may manage information.

6 is a schematic diagram showing an implementation example of data retention in the manufacturing support system 1 according to the present embodiment. Fig. 6 (a) shows an implementation example in which the evaluation entity 10 manages necessary data, and Fig. 6 (b) shows an implementation example in which the material supply entity 30 manages necessary data.

Referring to Fig. 6 (a), the evaluation entity 10 manages evaluation information for material samples provided from the material supply entity 30, and for the material supply entity 30, instead of evaluation information, Provides specific information such as a URL for accessing evaluation information being managed. In addition, the material supplying entity 30 provides the specific information provided from the evaluation entity 10 to the using entity 20 .

The material supply entity 30 and the user entity 20 can access the evaluation entity managed by the evaluation entity 10 based on specific information. In addition, various restrictions such as an access code (password) may be provided for access to the evaluation information managed by the evaluation subject 10.

By adopting such a structure, while being able to reduce the computing resource in the material supply main body 30 (management device 34), the process associated with the manufacturing support system 1 can be simplified.

Referring to FIG. 6B , the evaluation entity 10 transmits evaluation information on the material sample provided from the material supply entity 30 to the material supply entity 30 . The material supply entity 30 manages the evaluation information received from the evaluation entity 10 . The material supply main body 30 provides the using main body 20 with specific information, such as a URL for accessing the evaluation information managed by itself.

The user 20 can access the evaluation information managed by the material supplier 30 based on the specific information. In addition, you may provide various restrictions, such as an access code (password), on access to the evaluation information managed by the material supply main body 30.

By adopting such a structure, while being able to reduce computing resources in the user 20 (management device 24), the processing associated with the manufacturing support system 1 can be simplified.

In the above description, configuration examples in which the management device 14, the management device 24, and the management device 34 are respectively disposed in the evaluation entity 10, the use entity 20, and the material supply entity 30 are not shown. However, it is not limited to this, and necessary processing and functions may be realized by using a part of a system in which a plurality of computers are connected via a network, such as a so-called cloud computer.

The manufacturing support system 1 according to the present embodiment can be realized in any computing environment, arbitrarily using known technologies at the time of actual implementation, or according to the laws of the country or region where actual implementation is implemented. , any mounting form can be adopted. The technical scope of the present invention is not limited to a specific mounting form, but may include any mounting form.

<F. Benefits＞

Evaluating in advance whether or not the semiconductor manufacturing equipment and the materials used in the semiconductor manufacturing equipment are suitable for the target manufacturing process requires sufficient knowledge and also requires a lot of time. The evaluation process, which requires a lot of resources, is carried out by the evaluation entity (typically, a semiconductor manufacturing equipment manufacturer, etc.) in cooperation with the material supply entity, so that a comprehensive evaluation including semiconductor manufacturing equipment and materials can be performed. there is a number

By providing a manufacturing support system capable of performing such a comprehensive evaluation, the material supply entity can ensure that the material supply entity appropriately provides materials suitable for the manufacturing process desired by the user entity, which is the customer. In addition, even if the user subject does not have sufficient knowledge, the target manufacturing process can be realized more quickly and reliably by using the knowledge of the evaluation subject. In addition, the evaluation entity can support various material supply entities and users by using the knowledge possessed by the evaluation entity.

Embodiment disclosed this time should be considered as an illustration and not restrictive in all respects. The scope of the present invention is indicated by the scope of the claims rather than the description of the above-described embodiments, and is intended to include all changes within the scope and meaning equivalent to the scope of the claims.

1 Manufacturing support system, 10 evaluation entity, 12 evaluation device, 14, 24, 34 management device, 20 user entity, 30 material supply entity, 50 semiconductor manufacturing device, 60 material, 102 processor, 104 main memory, 106 input unit, 108, 118 display unit, 110 output unit, 120 secondary storage unit, 122 processing realization module, 124 data group, 126 communication unit, 128 internal bus.

Claims (8)

As a manufacturing support system that supports manufacturing using a semiconductor manufacturing apparatus,
a holding unit disposed in the evaluation body that holds information specifying a semiconductor manufacturing apparatus used or to be used in the user body, and information specifying a manufacturing process executed in the semiconductor manufacturing apparatus;
Arranged in the evaluation body, which evaluates the suitability of the material based on information specifying the material supplied from the material supply body supplying the material used in the semiconductor manufacturing apparatus, and the information held by the holding unit. evaluation department,
A manufacturing support system comprising an evaluation result providing unit for providing an evaluation result by the evaluation unit to the material supplier. According to claim 1,
The evaluation unit,
A semiconductor manufacturing apparatus substantially identical to a semiconductor manufacturing apparatus used or planned to be used by the user;
Manufacturing support including an evaluation device that evaluates at least one of the quality of a semiconductor device manufactured by the substantially identical semiconductor manufacturing device or a semi-finished product of the semiconductor device, and wear and tear of the substantially identical semiconductor manufacturing device system. According to claim 2,
The evaluation device is a configuration for evaluating the quality of the semiconductor device or a semi-finished product of the semiconductor device, and includes a measuring device for measuring a shape, a microscope for obtaining a cross-sectional observation image, a probe device for observing the inside, and a hardness measurement device. A manufacturing support system including any one of hardness testers for According to claim 2 or 3,
The manufacturing support system according to claim 1 , wherein the evaluation device includes any one of an observation device and a search device as a configuration for evaluating wear and tear of the substantially identical semiconductor manufacturing device. According to any one of claims 2 to 4,
The manufacturing support system of claim 1 , wherein the evaluation device includes a simulation device using a model of a semiconductor manufacturing device used or scheduled to be used by the user. According to any one of claims 1 to 5,
The manufacturing support system of claim 1 , wherein the material supply entity associates the evaluation result provided from the evaluation entity with a corresponding material, and supplies the material to the user entity. According to any one of claims 1 to 6,
The manufacturing support system according to claim 1 , wherein the evaluation unit performs a process of evaluating suitability of materials for a plurality of different materials, respectively. As a manufacturing support method for supporting manufacturing using a semiconductor manufacturing apparatus,
a step in which a holding unit disposed in the evaluation body holds information specifying a semiconductor manufacturing device used or to be used in the user body, and information specifying a manufacturing process to be executed in the semiconductor manufacturing device;
Evaluating, in the evaluation body, the suitability of the material based on information specifying the material provided from a material supply body supplying the material used in the semiconductor manufacturing apparatus and information held by the holding unit. class,
and a step of providing the evaluation result of the evaluation step to the material supplier.

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