TW202145126A - Manufacturing assist system and manufacturing assist method - Google Patents

Abstract

A manufacturing assist system for assisting manufacturing using a semiconductor manufacturing device, comprising: a holding unit that is disposed in an evaluation body and holds information specifying a semiconductor manufacturing device used or to be used in a use body and information specifying a manufacturing process to be executed by the semiconductor manufacturing device; an evaluation unit that is disposed in the evaluation body and evaluates the appropriateness of a material provided from a material supply body for supplying a material used by a semiconductor manufacturing device, on the basis of information specifying the material and information held by the holding unit; and an evaluation result providing unit for providing an evaluation result by the evaluation unit to the material supply body.

Description

Manufacturing support system and manufacturing support method

The present invention relates to a manufacturing support system and a manufacturing support method for supporting manufacturing using a semiconductor manufacturing apparatus.

When manufacturing a semiconductor device, various methods have been proposed for shortening the preparation time by performing performance evaluation in advance or the like. As one of such methods, Japanese Unexamined Patent Application Publication No. 2003-259015 (Patent Document 1) discloses an electronic conference system in which a process of a supplier of semiconductor manufacturing equipment is used as a prior activity for selling semiconductor manufacturing equipment. Technicians and process technicians of semiconductor equipment manufacturers (customers) can conduct meetings about the performance of semiconductor equipment process technicians or semiconductor manufacturing equipment without having to travel to each other. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2003-259015

[The problem to be solved by the invention] The electronic conference system disclosed in Japanese Patent Laid-Open No. 2003-259015 (Patent Document 1) assumes a prior activity for selling semiconductor manufacturing equipment, and evaluates the performance in advance using samples provided by semiconductor equipment manufacturers.

However, in the actual manufacturing process of semiconductor devices, since various materials provided by material manufacturers are used, if the process technicians of the semiconductor equipment manufacturers do not have the knowledge including material selection, they may not be able to manufacture the desired materials. quality semiconductor devices.

An object of the present invention is to provide a new structure that supports the manufacture of a semiconductor device using such a semiconductor manufacturing apparatus. [Means of Solving Problems]

According to one aspect of the present invention, there is provided a manufacturing support system that supports manufacturing using a semiconductor manufacturing apparatus. The manufacturing support system includes: a holding unit, which is arranged in the evaluation body, and holds information for identifying a semiconductor manufacturing apparatus used or intended to be used by the user body, and information for identifying a manufacturing process performed by the semiconductor manufacturing apparatus; and the evaluating unit, It is arranged in the evaluation body to evaluate the suitability of the material based on the information provided by the material supply body for specifying the material used in the semiconductor manufacturing apparatus and the information held by the holding unit; and the evaluation The result providing unit provides the material supply body with the evaluation result obtained by the evaluation unit.

According to another aspect of the present invention, a manufacturing support method for supporting manufacturing using a semiconductor manufacturing apparatus is provided. The manufacturing support method includes the step of holding information for specifying a semiconductor manufacturing apparatus used or intended to be used by a user body and information for specifying a manufacturing process performed by the semiconductor manufacturing apparatus in a holding portion disposed in the evaluation body, and performing the evaluation in the evaluation In the main body, a step of evaluating the suitability of the material based on the information provided by the material supply main body for specifying the material used in the semiconductor manufacturing apparatus and the information held by the holding unit; and The step of providing the evaluation result obtained in the step of evaluating by the material supplying body. [Effect of invention]

The present invention can provide a new structure for supporting the manufacture of a semiconductor device using a semiconductor manufacturing apparatus.

Embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same symbols are attached to the same or corresponding parts in the figures, and the description thereof will not be repeated.

<A. Outline of the structure and processing of the manufacturing support system> First, the configuration of the manufacturing support system 1 according to the present embodiment and the outline of the processing in the manufacturing support system 1 will be described. The manufacturing support system 1 supports manufacturing using a semiconductor manufacturing apparatus. In the following description, the supply of various materials used in the semiconductor manufacturing apparatus will be mainly described, but the manufacturing support system 1 according to the present embodiment is not limited to these ranges.

FIG. 1 is a schematic diagram for explaining the outline of the manufacturing support system 1 according to the present embodiment. Referring to FIG. 1 , the manufacturing support system 1 mainly relates to one or more use bodies 20 using a semiconductor manufacturing apparatus 50 , one or more material supply bodies 30 supplying a material 60 used by the semiconductor manufacturing apparatus 50 , and a material supply body in advance 30 The evaluation body 10 that evaluates the suitability of the supplied material 60 .

In FIG. 1 , the information exchanged between the evaluation main body 10 and the “using main body X” which is one of the using main bodies 20 is marked with “X”, and the information exchanged between the evaluation main body 10 and the “material supplying body X” which is one of the material supplying main bodies 30 is marked with “X”. Information exchanged between entities A" and between "using entity X" and "material supply entity A" is marked with "A". For example, information with the same name as "device information X" and "device information A" but different symbols of "X" or "A" may be information with the same content or information with different content. The same applies to the following FIGS. 2 to 4 .

In this specification, the user body 20 is a term that includes a user who uses the semiconductor manufacturing apparatus 50 in any form, and includes, for example, a semiconductor manufacturer, a semiconductor equipment manufacturer, and a packaging factory (which only undertakes the packaging and assembly process in semiconductor manufacturing). Enterprises), Out-Sourced Assembly and Testing (OSAT) (enterprises engaged in entrusted packaging and testing of semiconductors), foundries (enterprises specializing in the manufacture of semiconductor wafers), etc.

In this specification, the "material supply body" includes any body that manufactures and/or sells any material 60 used in the semiconductor manufacturing apparatus 50, and is a body different from the "evaluation body 10" and the "use body 20".

For example, as the semiconductor manufacturing apparatus 50, a mold sealing apparatus for resin-sealing an electronic component including a semiconductor wafer, and a singulation apparatus for singulation of an electronic component including a semiconductor wafer are assumed. Such a resin sealing device is a semiconductor wafer mounted on a substrate (a lead frame, a printed circuit board, a ceramic substrate, a metal substrate, a glass substrate, a semiconductor substrate, a resin substrate, etc.) by resin sealing. The material supply main body 30 supplies a resin or a substrate for sealing the semiconductor wafer as the material 60 . The material 60 used by the semiconductor manufacturing apparatus 50 is not limited to such resins or substrates, and includes any consumables related to the manufacturing process of the semiconductor manufacturing apparatus 50 .

The semiconductor device is manufactured by the semiconductor manufacturing apparatus 50 using the material 60 supplied from the material supplying body 30 using the main body 20 . The use body 20 specifies the specifications, quality performance, etc. of the material 60 supplied by the material supply body 30 in consideration of the manufacturing process of the semiconductor manufacturing apparatus 50 and the like thereof. The material supply main body 30 supplies the material 60 satisfying the specified specifications and quality properties.

However, not all users 20 have sufficient insight into the manufacturing process. In addition, in the initial adjustment stage of the newly introduced semiconductor manufacturing apparatus 50 , the following work is performed to optimize the manufacturing process while repeating trial and error, and to determine the specifications and quality performance of the material 60 to be used.

In the optimization of the manufacturing process, it is necessary to use an evaluation apparatus to evaluate the semiconductor device or its semi-finished product manufactured by the semiconductor manufacturing apparatus 50 . However, it is not always necessary for all of the user bodies 20 to have an evaluation device, and in particular, with the miniaturization of the manufactured semiconductor device and the like, a higher-performance evaluation device is required. In addition, there may be a user body 20 that cannot properly feed back the evaluation result output from the evaluation device to the manufacturing process even if the evaluation device is retained.

The manufacturing support system 1 according to the present embodiment provides means for solving the above-described problems related to the semiconductor manufacturing apparatus 50 used in the use body 20 . That is, the evaluation body 10 is in charge of a part or all of the evaluation work performed using the main body 20 , and is also responsible for pre-evaluation of the specifications, quality performance, etc. of the material 60 supplied by the material supply body 30 . The existence of the evaluation body 10 and the services provided can be easily used even by the user body 20 that does not have sufficient knowledge of the manufacturing process itself, and the user body 20 that cannot sufficiently evaluate the quality of the manufacturing process. The semiconductor manufacturing apparatus 50 manufactures a semiconductor device.

In addition, the material supply body 30 can improve the reliability of supplying a material suitable for the semiconductor manufacturing apparatus 50 used by the user body 20 of the supply destination, so that a more stable supply system can be realized.

The evaluation main body 10 basically includes the semiconductor production apparatus 50 that is substantially the same as the semiconductor production apparatus 50 used for the main body 20 , and the evaluation apparatus 12 . The evaluation subject 10 is basically suitably the manufacturer of the semiconductor manufacturing apparatus 50 or its affiliates. However, it is not limited to the manufacturer of the semiconductor manufacturing apparatus 50 or its affiliates, and any group or individual may also be the evaluation subject 10 .

In order to manage the information exchanged between the three, a management device 14 , a management device 24 and a management device 34 can be configured in the evaluation main body 10 , the user main body 20 and the material supply main body 30 , respectively.

Device information, evaluation information, process information, and certification information are exchanged between the evaluation body 10 and the user body 20 . Device information, evaluation information, process information, and material information are exchanged between the evaluation body 10 and the material supply body 30 . Device information, evaluation information, process information, and certification information are exchanged between the user body 20 and the material supply body 30 . Here, each piece of information exchanged between the three will be described.

The device information includes information for identifying the semiconductor manufacturing device 50 used or scheduled to be used by the user body 20 . The device information may further include information used to identify replaceable components and the like utilized in the target semiconductor manufacturing device 50 .

The evaluation information includes evaluation results when the object's material 60 is used by the object's semiconductor manufacturing apparatus 50 under the object's manufacturing conditions.

The process information includes information for identifying the manufacturing process performed by the target semiconductor manufacturing apparatus 50 . Typically, the process information includes information that defines the manufacturing conditions applicable to the semiconductor manufacturing apparatus 50 of the object.

The material information includes information related to the material 60 of the object.

The certification information includes the required specification in the manufacturing process of the semiconductor manufacturing apparatus 50 including the target. The identification information depends on the use subject 20 .

FIG. 2 is a sequence diagram showing a processing procedure executed by the manufacturing support system 1 according to the present embodiment. 1 and 2 , an example of the processing sequence executed by the manufacturing support system 1 will be described. In the example shown in FIG. 2 , it is assumed that the evaluation main body 10 is the manufacturer of the semiconductor manufacturing apparatus 50 , and a new semiconductor manufacturing apparatus 50 is introduced using the main body 20 . In this aspect, the material supply body 30 develops the material 60 used in the newly introduced semiconductor manufacturing apparatus 50 .

In the aspect of the development of the material 60 , the material supply body 30 develops the material 60 in accordance with the manufacturing conditions and the like proposed by the use body 20 and the like (step S2 ). The material supply main body 30 supplies a part (material sample) and material information of the developed material 60 to the evaluation main body 10 (step S4 ). Furthermore, when evaluating the situation that the main body 10 can analyze the material sample, it is not necessary to provide material information.

The evaluation body 10 previously holds device information (information for determining the semiconductor manufacturing apparatus 50 used or intended to be used by the use body 20 ) and process information (information for determining the manufacturing process performed by the semiconductor manufacturing apparatus 50 ).

The evaluation body 10 performs evaluation using the material samples provided by the material supply body 30 (step S6 ). More specifically, the evaluation body 10 evaluates the suitability of the material 60 based on the information for identifying the material 60 provided by the material supply body 30 and the information (device information and process information) held by the evaluation body 10 . Then, the evaluation main body 10 provides the evaluation result obtained by the evaluation to the material supply main body 30 together with the device information and the process information (step S8 ).

In the aspect of the development of the material 60, the process (*1) of step S2 - step S8 is repeatedly performed. The evaluation main body 10 may perform the process of evaluating whether the materials 60 are suitable or not for different kinds of materials 60 in the manner described above. Specifically, in the process of evaluating suitability, the composition ratio of the material 60 can be used as an example.

After obtaining the evaluation results for one or more materials, as necessary, a material to be a candidate to be supplied to the user body 20 is determined between the evaluation body 10 and the material supply body 30 (step S10 ). Then, the evaluation body 10 provides device information, evaluation information, and process information to the user body 20 for the material determined as a candidate (step S12 ). Similarly, the material supply body 30 provides device information, evaluation information, and process information to the user body 20 for the material determined as a candidate (step S14 ).

Furthermore, the device information, evaluation information and process information provided by the evaluation main body 10 in step S12 are basically the same as the device information, evaluation information and process information provided by the material supply main body 30 in step S14. The purpose of this is to prevent errors in the provision of information by confirming the identity of the information provided by each subject. From the viewpoint of simplifying the processing, either of step S12 and step S14 may be omitted.

The use main body 20 refers to the provided device information, evaluation information and process information to perform final performance confirmation (step S16 ). After the user body 20 understands the content of the performance confirmation, the certification information is sent to the evaluation body 10 (step S18 ), and the certification information is sent to the material supply body 30 (step S20 ).

With the above processing, the pre-assessment of the manufacturing process is completed. Then, the use body 20 orders the semiconductor manufacturing apparatus including the certification information from the evaluation body 10 (in this example, the manufacturer of the semiconductor manufacturing apparatus 50 ) (step S22 ), and orders the material including the certification information from the material supply body 30 (step S24 ) .

The evaluation body 10 (the manufacturer of the semiconductor manufacturing apparatus 50 ) manufactures the semiconductor manufacturing apparatus 50 according to the order of the use body 20 (step S26 ), and delivers the manufactured semiconductor manufacturing apparatus 50 to the use body 20 (step S28 ). Moreover, the material supply main body 30 manufactures the material 60 according to the order of the use body 20 (step S30 ), and delivers the manufactured material 60 to the use body 20 (step S32 ).

According to the processing sequence shown in FIG. 2 , the pre-assessment of the manufacturing process ends.

2 shows the processing procedure of the pre-assessment of the manufacturing process, but after the semiconductor manufacturing apparatus 50 is delivered, when the user body 20 wishes to reconsider the manufacturing process, the processing of Step S2 to Step S20 may be performed again.

<B. Evaluation Processing> Next, an example of evaluation processing by the evaluation body 10 will be described.

Typically, the evaluation body 10 is a manufacturer of the semiconductor manufacturing apparatus 50 or an affiliate thereof, and has a semiconductor manufacturing apparatus 50 that is substantially the same as the semiconductor manufacturing apparatus 50 used by the use body 20 . Alternatively, a semiconductor manufacturing apparatus 50 that is substantially the same as the semiconductor manufacturing apparatus 50 used for the main body 20 may be prepared.

The evaluation body 10 reproduces a manufacturing process or is being performed using the main body 20 in substantially the same semiconductor manufacturing apparatus 50 as the semiconductor manufacturing apparatus 50 used or intended to be used using the main body 20 using the material samples provided by the material supplying body 30 manufacturing process. The product (semiconductor device) or its semi-product manufactured by the reproduced manufacturing process is evaluated by the evaluation apparatus 12 . Alternatively, the effect of the reproduced manufacturing process on the semiconductor manufacturing apparatus 50 and the like may also be evaluated.

As described above, the evaluation body 10 holds device information (information for determining the semiconductor manufacturing apparatus 50 used or intended to be used by the use body 20 ), and process information (information for determining the manufacturing process performed by the semiconductor manufacturing apparatus 50 ) , the suitability of the material 60 is evaluated based on the information for determining the material 60 provided by the material supply body 30 and the information (device information and process information) held by the evaluation body 10 . Then, the evaluation main body 10 provides the evaluation result to the material supply main body 30 .

Evaluation of the semiconductor device or its semi-finished product manufactured using the reproduced manufacturing process can also be performed by shape observation. Examples of evaluation items include (1) external dimensions and warpage, (2) cross-sectional observation image, (3) thermal warpage change, (4) internal observation results, and (5) hardness measurement results. Corresponding to such evaluation items, the evaluation device 12 for evaluating the quality of the semiconductor device or the semi-finished product of the semiconductor device may include a measuring device for measuring the shape, a microscope for obtaining a cross-sectional observation image, and a probe device for internal observation. , Any one of the durometers used to measure hardness.

More specifically, (1) evaluation of external dimensions and warpage amount, and (3) evaluation of thermal warpage amount change, the shape is measured using a thermal warpage measurement device (TSM), an ultrasonic detection device (Scanning Acoustic Tomography, SAT), or the like The measuring device is used as the evaluation device 12 . (2) Evaluation of the cross-sectional observation image An optical microscope, a scanning electron microscope (SEM), or the like is used as the evaluation device 12 . (4) Evaluation of Internal Observation Results An ultrasonic detection device, an X-ray fluoroscopy device, or the like is used as the evaluation device 12 . (5) Evaluation of Hardness Measurement Results A durometer or the like is used as the evaluation device 12 .

Evaluation of the impact of the reproduced manufacturing process on the semiconductor manufacturing apparatus 50 can also be performed by observing the molds and jigs used by the semiconductor manufacturing apparatus 50 . Examples of evaluation items include (1) presence or absence of dirt on the die surface, (2) blade wear state, (3) blade wear amount, and the like. Corresponding to such an evaluation item, as a structure for evaluating the loss of substantially the same semiconductor manufacturing apparatus 50, any one of an observation apparatus and a probe apparatus may be included.

More specifically, (1) the evaluation of the presence or absence of contamination on the surface of the mold can be performed by human eyes, or an observation device or the like can be used as the evaluation device 12 . (2) Evaluation of the wear state of the blade An ultrasonic detection device or an X-ray fluoroscopy device or the like is used as the evaluation device 12 . (3) The evaluation of the blade wear amount used a measuring device for measuring the shape.

Not limited to the items described, one or more evaluation devices 12 may be used according to any evaluation item.

As described above, the evaluation unit for evaluating the main body 10 may include: a semiconductor production apparatus 50 that is substantially the same as the semiconductor production apparatus 50 used or intended to be used using the main body 20; The evaluation device 12 for evaluating the quality of the manufactured semiconductor device or the semi-finished product of the semiconductor device, and/or the loss of the substantially identical semiconductor manufacturing device 50 .

Typically, the evaluation is performed by reproducing the manufacturing process using the semiconductor fabrication apparatus 50, but a part or all of the evaluation can also be accomplished by simulation. In the case of evaluation by simulation, a model of the semiconductor manufacturing apparatus 50 is prepared, and a model corresponding to the material information supplied from the material supplying body 30 is generated, whereby simulation related to the manufacturing process of the object can be realized. Furthermore, in the case of performing the evaluation by simulation, it is not necessary to supply the material sample to the evaluation main body 10 from the material supply main body 30 .

As described above, as the evaluation section for evaluating the main body 10 , a simulation device using a model of the semiconductor manufacturing apparatus 50 used or scheduled to be used by the main body 20 may be included. By using simulation, evaluation can be performed even without the semiconductor fabrication apparatus 50 in reality.

<C. Details of information> Next, the details of the information exchanged in the manufacturing support system 1 according to the present embodiment will be described.

(c1: device information) The apparatus information includes information for specifying the semiconductor manufacturing apparatus 50 to be targeted, the replaceable components used, and the like. More specifically, if the semiconductor manufacturing device 50 is a molding device, the device information includes (1) device type (model number), (2) mold type (model number), and the like.

In addition, if the semiconductor manufacturing apparatus 50 is a singulation apparatus, the apparatus information includes (1) the type of the apparatus (model number), (2) the model number of the set (unit assembly for variety), and (3) the model number of the blade.

(c2: Evaluation Information) The evaluation information includes evaluation results when the object's material 60 is used by the object's semiconductor manufacturing apparatus 50 under the object's manufacturing conditions. More specifically, the evaluation information includes the evaluation result of the quality of the semiconductor device manufactured by the object semiconductor manufacturing apparatus 50 using the target material 60 , the evaluation result of the degree of wear of the semiconductor manufacturing apparatus 50 , and the like.

As an example of the evaluation result of the quality of a semiconductor device, the shape observation result etc. are mentioned. The shape observation results include: (1) the external dimensions and the amount of warpage of the semiconductor device, (2) the cross-sectional observation image of the semiconductor device (observation with an optical microscope or observation with a scanning electron microscope (SEM)), ( 3) Variation in the amount of thermal warpage of the semiconductor device, (4) Internal observation results (for example, presence or absence of defects or voids, etc.) of the semiconductor device using ultrasound, (5) Internal observation results using X-rays of the semiconductor device (For example, presence or absence of defects or voids, etc.), (6) Hardness measurement results of semiconductor devices, and the like.

Moreover, as an example of the evaluation result of the wear level of the semiconductor manufacturing apparatus 50, the observation result of a mold and a jig, etc. are mentioned. The observation results of the mold and jig include: (1) the presence or absence of dirt on the mold surface (visual inspection), (2) the wear state of the blade (observation with an optical microscope or observation with a scanning electron microscope), (3) blade wear, etc.

(c3: Process information) The process information includes information that defines the manufacturing conditions applicable to the semiconductor manufacturing apparatus 50 of the object. More specifically, if the semiconductor manufacturing device 50 is a molding device, the process information includes: (1) mold temperature, (2) resin weight and deviation, (3) preheating time, (4) molding pressure, (5) ) molding profile (resin injection pressure and change of mold position with time, etc.), etc.

In addition, if the semiconductor manufacturing device 50 is a single cutting device, the process information related to the cutting process includes: (1) rotational speed, (2) cutting speed, (3) cutting times, (4) cutting resistance, and (5) cooling water amount Wait.

(c4: material information) The material information includes information related to the material 60 of the object. More specifically, if the material 60 is a resin material, the material information includes: (1) helical flow as an indicator of fluidity, (2) gel time, (3) glass transition temperature, and (4) linear expansion coefficient , (5) filler content, (6) filler particle size distribution, (7) moisture content, (8) density, etc.

In addition, when the material 60 is a substrate material, the material information includes (1) the thickness of the wiring plating and the measurement result of variation, (2) the thickness of the wiring resist and the measurement result of variation, and the like.

(c5: Certification information) The certification information includes the required specification in the manufacturing process of the semiconductor manufacturing apparatus 50 including the target. More specifically, the certification information includes: (1) the determination result of whether the guaranteed value of the semiconductor manufacturing apparatus is satisfied, (2) the Process Capability Index (cpk), (3) the prediction of the blade life, and the like.

In addition, the said item is an example, and arbitrary items may be included in each information according to the manufacturing process, the kind of the material 60, etc. FIG.

<D. Application example> In the above description, the example applied to the performance evaluation in advance is mainly shown, but it is not limited to this, and various applications are possible. For example, it can also be used to ensure the quality of the material 60 produced by the material supply body 30 . In this case, the material supply main body 30 can associate the evaluation result provided by the evaluation main body 10 with the corresponding material 60 and supply it to the user main body 20 .

FIG. 3 is a schematic diagram for explaining one example of application of the manufacturing support system 1 according to the present embodiment. FIG. 4 is a sequence diagram showing a processing sequence executed by one of the application examples of the manufacturing support system 1 according to the present embodiment.

Referring to FIG. 3 , assume an example in which the evaluation body 10 evaluates the quality of the material 60 supplied by the material supply body 30 in advance in a situation where the semiconductor device 50 is used to manufacture a semiconductor device using the body 20 .

3 and 4 , in the aspect of supplying material 60 , material supply main body 30 manufactures material 60 in accordance with the production conditions and the like proposed in advance by using main body 20 and the like (step S52 ). The material supply main body 30 supplies a part (material sample) and material information of the manufactured material 60 to the evaluation main body 10 (step S54 ).

The evaluation body 10 performs evaluation using the material samples supplied from the material supply body 30 (step S56 ). Then, the evaluation body 10 provides the evaluation result obtained by the evaluation to the material supply body 30 (step S58 ).

The material supply body 30 supplies the produced material 60 with the evaluation result provided by the evaluation body 10 to the use body 20 (step S60 ). After confirming the evaluation result attached to the material 60 delivered by the material supplying body 30 using the main body 20 , it is used for the semiconductor manufacturing apparatus 50 .

Furthermore, in step S56 and step S58, the evaluation result may be provided to the material supply main body 30 only when the evaluation result obtained by the evaluation main body 10 is suitable.

By adopting the structure shown in FIGS. 3 and 4 , it is possible to more reliably ensure that the material 60 supplied from the material supply body 30 to the use body 20 is suitable for the semiconductor manufacturing apparatus 50 of the target.

Furthermore, the quality evaluation shown in FIGS. 3 and 4 can be performed, for example, in the manufacture of each batch of material 60 .

<E. Management device> Next, the management apparatus 14, the management apparatus 24, and the management apparatus 34 arrange|positioned at the evaluation main body 10, the usage main body 20, and the material supply main body 30, respectively, are demonstrated. In the manufacturing support system 1, information required by the management device 14, the management device 24, and the management device 34 is essentially exchanged.

FIG. 5 is a schematic diagram showing an example of the device configuration of the management device 14 constituting the manufacturing support system 1 according to the present embodiment. Furthermore, the management device 24 and the management device 34 have the same structure as the device shown in FIG. 1 .

Referring to FIG. 5 , the management device 14 is realized by using a computer, and as main components, includes a processor 102 , a main memory 104 , an input unit 106 , a display unit 108 , an output unit 110 , a secondary memory device 120 , and a communication unit 126 . These elements are connected to the internal bus bar 128 .

The processor 102 is a computing body that executes the processing required for the functions provided by the management device 14 , and realizes the required functions by executing the programs or program modules stored in the secondary memory device 120 . The processor 102 can also be multi-core and/or multi-processor, and the required number of cores or processors can be set according to the required load processing capability.

The main memory 104 provides the working memory required by the processor 102 to execute programs. The main memory 104 is a non-volatile memory that once saves the program code or working data of the executed program.

The input unit 106 is an element that receives an operation from an operator or the like, and is realized using, for example, a keyboard, a mouse, a touch panel, or the like. The display unit 118 is an element for presenting information such as processing results to an operator or the like, and is implemented using a display or the like, for example. The output unit 110 is a device that outputs the information in the management device 14 in a tangible form, and is realized by, for example, a printer or the like.

The secondary memory device 120 is an example of a holding unit, and stores, in addition to the operating system (not shown), a data set 124 including functions for providing the manufacturing support system 1 according to the present embodiment. The processing implements the module 122 and various data. Typically, the data set 124 of the management device 14 of the evaluation body 10 includes authentication information, device information, and process information.

The communication unit 126 is an element for communicating with the user body 20 and/or the material supply body 30 , for example, using a wired local area network (LAN) communication interface, a wireless LAN communication interface, a public network communication interface, and the like. accomplish. A plurality of types or a plurality of communication units 126 may be installed in accordance with the number of use bodies 20 and/or material supply bodies 30 to be communicated with, the communication form, and the like.

In the above description, a configuration example in which necessary information is directly exchanged between the evaluation body 10 (management device 14 ), the user body 20 (management device 24 ), and the material supply body 30 (management device 34 ) is shown, but it is not Limited to this structure, information can also be managed by a specific subject.

FIG. 6(A) and FIG. 6(B) are schematic diagrams showing an installation example of data retention in the manufacturing support system 1 according to the present embodiment. (A) in FIG. 6 shows an example of installation of data required for management by the evaluation body 10 , and (B) in FIG. 6 shows an example of installation of data required for management by the material supply body 30 .

Referring to (A) in FIG. 6 , the evaluation body 10 manages evaluation information related to the material samples provided by the material supply body 30 , and provides the material supply body 30 with a uniform resource locator for accessing the managed evaluation information (Uniform Resource Locator, URL) and other specific information in place of evaluation information. Further, the material supply body 30 provides the user body 20 with the specific information provided by the evaluation body 10 .

The material supplying main body 30 and the using main body 20 can access the evaluation main body managed by the evaluation main body 10 based on the specific information. Furthermore, various restrictions, such as an access code (password), may be set in the access to the evaluation information managed by the evaluation body 10 .

By adopting such a configuration, the computing resources in the material supply body 30 (the management device 34 ) can be reduced, and the processing of the manufacturing support system 1 can be simplified.

Referring to (B) in FIG. 6 , the evaluation main body 10 transmits evaluation information related to the material sample provided by the material supply main body 30 to the material supply main body 30 . The material supply body 30 manages the evaluation information received from the evaluation body 10 . The material supply body 30 provides the user body 20 with specific information such as a URL for accessing the evaluation information managed by itself.

The user body 20 can access the evaluation body managed by the material supply body 30 based on specific information. Furthermore, various restrictions, such as an access code (password), may be provided in the access to the evaluation information managed by the material supply main body 30 .

By adopting such a configuration, the computing resources in the main body 20 (the management device 24 ) can be reduced, and the processing of the manufacturing support system 1 can be simplified.

In the above description, a configuration example in which the management device 14 , the management device 24 , and the management device 34 are arranged in the evaluation body 10 , the user body 20 and the material supply body 30 is shown, but it is not limited to this, and a so-called cloud computer may be used. , using part of a system such as connecting a plurality of computers via a network to realize the required processing and functions.

The manufacturing support system 1 according to the present embodiment can be implemented in any computing environment, and any known technology at the time of actual installation can be used arbitrarily, or any installation form can be adopted in accordance with the laws of the country or region where the actual installation is performed. The technical scope of the present invention is not limited to a specific installation form, and can include any installation form.

<F. Advantages> Assessing the suitability of a semiconductor manufacturing apparatus and the materials used in the semiconductor manufacturing apparatus in advance for a target manufacturing process requires sufficient insight, and also requires a lot of time. By performing such a resource-intensive evaluation process in conjunction with an evaluation body (typically, a manufacturer of semiconductor manufacturing equipment, etc.) and a material supplier, comprehensive evaluation including semiconductor manufacturing equipment and materials can be performed.

By providing the manufacturing support system which can perform such a comprehensive evaluation, the material supplier can appropriately supply the material suitable for the manufacturing process desired by the user as the customer. In addition, even if the user body does not have sufficient knowledge, the target manufacturing process can be realized earlier and surely by using the knowledge of the evaluation body. Furthermore, the evaluation subject can support various material suppliers and users using their own insights.

It should be construed that the embodiments disclosed this time are illustrative in all respects and not restrictive. The scope of the present invention is disclosed by the scope of the patent application rather than the description of the above-described embodiments, and it is intended that the scope of the patent application and the equivalent meaning and all changes within the scope are included.

1: Manufacturing Support System 10: Evaluation subject 12: Evaluation device 14, 24, 34: Management devices 20: Use Subjects 30: Material supply main body 50: Semiconductor manufacturing equipment 60: Materials 102: Processor 104: main memory 106: Input section 108, 118: Display part 110: Output part 120: Secondary memory device 122: Processing implementation module 124: Data Group 126: Ministry of Communications 128: Internal busbar S2～S32, S52～S60: Steps

FIG. 1 is a schematic diagram for explaining the outline of the manufacturing support system according to the present embodiment. FIG. 2 is a sequence diagram showing a processing sequence executed by the manufacturing support system according to the present embodiment. FIG. 3 is a schematic diagram for explaining one application example of the manufacturing support system according to the present embodiment. FIG. 4 is a sequence diagram showing a processing sequence executed by one of the application examples of the manufacturing support system according to the present embodiment. FIG. 5 is a schematic diagram showing an example of the device configuration of the management device constituting the manufacturing support system according to the present embodiment. FIG. 6(A) and FIG. 6(B) are schematic diagrams showing an installation example of data retention in the manufacturing support system according to the present embodiment.

1: Manufacturing Support System

10: Evaluation subject

12: Evaluation device

14, 24, 34: Management devices

20: Use Subjects

30: Material supply main body

50: Semiconductor manufacturing equipment

60: Materials

Claims (8)

A manufacturing support system that supports manufacturing using semiconductor manufacturing equipment, including: a holding unit, disposed in the evaluation body, to hold information for identifying a semiconductor manufacturing apparatus used or intended to be used by a user, and information for identifying a manufacturing process performed by the semiconductor manufacturing apparatus; An evaluation unit is disposed in the evaluation body, and based on information for specifying the material supplied by a material supply body that supplies the material used in the semiconductor manufacturing apparatus and information held by the holding unit, evaluates the evaluation unit. assess the suitability of the material; and An evaluation result providing unit provides the material supply body with the evaluation result obtained by the evaluation unit. The manufacturing support system of claim 1, wherein the evaluation section includes: Substantially the same semiconductor manufacturing equipment as the semiconductor manufacturing equipment used or intended to be used by the said user; and The evaluation device evaluates at least one of the quality of a semiconductor device or a semi-finished product of the semiconductor device manufactured by the substantially identical semiconductor fabrication apparatus, and the loss of the substantially identical semiconductor fabrication apparatus. The manufacturing support system according to claim 2, wherein the evaluation device includes any of a measuring device for measuring a shape, a microscope for obtaining a cross-sectional observation image, a probe device for performing internal observation, and a durometer for measuring hardness One is a structure for evaluating the quality of the semiconductor device or the semi-finished product of the semiconductor device. The manufacturing support system according to claim 2, wherein the evaluation device includes any one of an observation device and a detection device as a structure for evaluating the loss of the substantially identical semiconductor manufacturing device. The manufacturing support system according to any one of Claims 2 to 4, wherein the evaluation device includes a simulation device that uses a model of a semiconductor manufacturing device used or intended to be used by the user body. The manufacturing support system according to any one of Claims 1 to 4, wherein the material supply body associates the evaluation result provided by the evaluation body with the corresponding material, and supplies the material to the user body. The manufacturing support system according to any one of claim 1 to claim 4, wherein the evaluation unit performs a process of evaluating whether the material is suitable or not for a plurality of different materials, respectively. A manufacturing support method for supporting manufacturing using a semiconductor manufacturing apparatus, comprising: a step of holding information for specifying a semiconductor manufacturing apparatus used or intended to be used by a user body and information for specifying a manufacturing process performed by the semiconductor manufacturing apparatus in a holding portion disposed in the evaluation body, In the evaluation body, based on the information for specifying the material supplied by the material supply body that supplies the material used in the semiconductor manufacturing apparatus and the information held by the holding unit, the evaluation of the material is performed. the steps for assessing suitability; and The step of providing the evaluation result obtained by the step of evaluating to the material supply body.

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