1344814 年05月11日替換頁 特別是關於一種可攜式電子 九、發明說明： 【發明所屬之技術領域】 本發明與電子裝置之機殼有關 裝置之機殼結構。 【先前技術】 在各種電子產品的效能不斷提昇之下，伴隨而來的散熱問題 也日盈嚴重’其中又以可攜式電子裝置的散_題最為嚴重。例 如筆記型電腦、掌上型電腦料的可攜式電子裝置，為了保有輕 巧易攜帶的特性，所以其機殼的設計都是喃薄短小為原則。相 對之下’可攜式f子裝置機殼崎的空間賴得相當有限，致使 機殼内部的電子元件必馳當緊密的排列，所以電子元件長時間 運=所產生的越也容易_在可赋電子裝置機㈣部，而在 短時間内讓整個可攜式電子裝置的溫度快速飆高。因此，若無法 地將"J攜式電子裝置機殼内部的熱能迅速排除，很容易使電 子元件一直處於高溫的作業環境下，勢必會影響到可攜式電子裴 置的正常運作，甚至造成電子元件過熱損壞。 目如市面上的筆5己型電腦通常會在機殼底面與側面設置散熱 孔，而機殼内的散熱器會由底面的散熱孔將空氣吸入，並導引與 電子組件進行熱接換後升溫之熱空氣由侧面的散熱孔排出。另一 方面，筆δ己型電腦上提供周邊裝置連接的擴充連接埠設置一般也 都會设置在機殼的側面。隨著筆記型電腦使用者對於更多周邊裴 置的需求增加，筆記型電腦上就需要設置更多的擴充連接埠。因 此’為了使側面的散熱孔與擴充連接埠的設置位置不會發生衝 突，市面上就出現有脾^ 匕0年一1月11曰M 1- 有將λ乳進出的散熱孔都設置於機殼底面的相 關吕又叶。 」斤卞即為散熱孔都開設在機殼底面之筆記型 :月匈的局。以面不意圖。筆記型電腦⑺具有一機殼11，而機殼 '、用乂匕覆住筆δ己型電腦1〇之主機。機殼u内部裝設有用來 =機内部電子組件進行散熱的散熱器12。機殼η的底部開設 夕個散熱孔I3與散熱孔Μ，而且機殼u的底部也設置有多個 腳塾15，使機殼u的底面與桌面16保持適當空隙，以供空氣進 出散熱孔13與散熱孔14。散熱器12由散熱孔13從機殼u外面 吸入恤度較低空氣，且空氣會帶走散魅I〗上由電子元件上吸收 的熱能崎溫’然後散魅12再將溫度較高的空諸散熱孔14 排到機殼11外’以藉由熱傳導與氣體對流排出電子元件運作時產BACKGROUND OF THE INVENTION The present invention relates to a casing structure of a device related to a casing of an electronic device. [Prior Art] Under the continuous improvement of the performance of various electronic products, the accompanying heat dissipation problem is also serious. The problem of the portable electronic device is the most serious. For example, portable electronic devices such as notebook computers and palm-sized computer materials are designed to be light and easy to carry, so the design of the casing is a principle of being thin and short. In contrast, the space of the portable sub-device chassis is quite limited, so that the electronic components inside the casing must be closely arranged, so the electronic components are prone to operate for a long time. The electronic device (4) is used to quickly increase the temperature of the entire portable electronic device in a short time. Therefore, if the thermal energy inside the casing of the "X portable electronic device" cannot be quickly eliminated, it is easy to keep the electronic components in a high-temperature working environment, which will inevitably affect the normal operation of the portable electronic device, or even cause The electronic components are overheated and damaged. For example, a pen-type computer on the market usually has a heat dissipation hole on the bottom surface and the side surface of the casing, and the heat sink in the casing absorbs air from the heat dissipation hole on the bottom surface and guides the heat exchange with the electronic component. The hot air that is warmed up is discharged by the side heat dissipation holes. On the other hand, the expansion port provided on the pen δ-type computer to provide peripheral device connections is also generally disposed on the side of the casing. As notebook users increase their demand for more peripheral devices, more expansion ports need to be set up on the notebook. Therefore, in order to prevent the position of the vent hole on the side and the expansion port from colliding, there is a spleen on the market. 匕0年一1月11曰M 1- There are vents for λ milk in and out. The bottom of the shell is related to the leaves. "Jinyu is the type of note that the vents are all on the bottom of the case: the month of the Hungarian. Not intended. The notebook computer (7) has a casing 11 and the casing ', which covers the main body of the pen-type computer. The casing u is internally provided with a heat sink 12 for the internal electronic components of the machine for heat dissipation. The bottom of the casing η has a heat dissipation hole I3 and a heat dissipation hole Μ, and the bottom of the casing u is also provided with a plurality of pedals 15 to keep a proper space between the bottom surface of the casing u and the table top 16 for air to enter and exit the heat dissipation hole. 13 and the heat dissipation hole 14. The heat sink 12 is sucked from the outside of the casing u by the heat dissipation hole 13 to lower the air, and the air will take away the heat energy absorbed by the electronic components on the illusion I and then dissipate the charm 12 and then the temperature is higher. The heat dissipation holes 14 are discharged to the outside of the casing 11 to operate when the electronic components are discharged by heat conduction and gas convection
生的熱此。就散熱的角度而言，若是由散熱孔13進人散熱器U 的空氣溫度越低’散熱的效率就越好。然而，因腳塾15將機殼 11的底面架高，且散熱孔13及散熱孔14之間並無任何阻隔，所 以奴散熱孔14排出的高溫空氣很有可能會沿著機殼u底面流向 散熱孔13周圍，然後再次被散熱器12由散熱孔13吸入。如此一 來’由散熱孔13進入散熱器12的空氣之溫度就會提高許多，導 致散熱器12的整體散熱效率下降。 【發明内容】 曰鑒於先前技術中筆記型電腦散熱排出之熱空氣會回流的問 題’本發明的主要目的在域供-魏子裝置之機殼，以解決先 前技術申熱空氣回流導致散熱效率降低的問題。 6 1 1J445I4 為解決上述之問題，本發明係提供 以容置至少—電子組件及一散熱模組。機殼之广Hi殼，用 進氣孔、至少一排氣孔及至少一輔助排氣孔 助二一 產生一氣流吹向排氣孔與辅助排氣孔，以排出電 生之熱能。輔助排氣孔周緣設置有至少—第—導引面，二 引面係導引至少部分之氣流 氣流不會朝進氣孔流動。 使由排爾出機殼之 ㈣i發明之功效在於，機殼之輔助排氣孔可藉由其第-導引面 n吩的氣流吹向排氣孔，而阻擔流出排氣孔之氣流朝進氣 模I唯ΖΓ111溫度較高的熱空氣又喊騎氣孔，進而將散熱 模、、且維持在較佳的散熱效率。 —、下在實〜方式巾詳細敘述本發明之詳細特徵以及優點，其 —足以使任何熟習相關技藝者了解本發明之技術内容並據以實 她’且根據本朗書所财之内容、申請專娜圖式，任何 熟習相關技勢者可輕易地理解本發明前述之目的及優點。 、一=上之_本發_容之制及以下之實施方式之說明係用 、八範”解釋本發明之原理’並且提供本發明之專财請範圍更 進一步之解釋。 【實施方式】 為使對本發明的目的、構造、特徵、及其功能有進一步的瞭 解’兹配合實施例詳細說明如下。 4參閱「第2圖」'「第3圖」及「第4圖」所示，為本發明 1344814 _ ιυυ牛05月11日替換頁 第-實施例所揭露之電子聢置之機殼22，係^裝置丨 20之主機’並輔助維持主機之散熱效率。在本發明的具體實施方 式中’前述電子裝置20可為但不侷限於筆記型電腦、掌上型電腦 等等可攜式電子裝置。電子裝置2〇之機殼22内部設置有一電子 組件21及-散熱模組23,其中電子組件21可以是一印刷電路板， 例如主機内部之主機板，而且散熱模組23係用以對於電子组件 21進行散熱。電子組件21之邊緣設置有多個連料2ιι，以提供 電子裝置20之主機連接擴充周邊硬體裝置用。 散熱模組23包含有-風扇233、一散熱.鰭片纽234及一熱導 管235，係用以與電子組件21進行熱交換。熱導管况嵌入散轨 鰭片組2Μ巾，其中熱導管说細熱傳導方式帶走電子組件^ 上熱源之熱能，並且將熱源之熱能傳導至散熱鰭片組234上。風 扇233係用以產生一吹向散熱鰭片組234與熱導管幻5之氣流， 使此氣流流過散熱鰭片組234與熱導管235表面帶走的熱能/並 強制機殼22之空氣與外界之空氣進行對流，以藉由熱傳導及熱對 流將散熱鰭片組234及熱導管235上的熱能帶走。 請繼續參閱「第4圖」及「第5圖」所示。電子裝置2〇係放 置於一平面50，例如桌子的頂面。機殼22係用以裝载電子裝置 20之主機，並提供主機内部之電子組件21及散熱模組23適當的 保5蒦與支#。機殼22的底部具有一面對平面5〇之底面221，底 面221具有複數個進氣孔222、複數個排氣孔223、複數個輔助排 氣孔24及複數個分散之腳墊224。各腳墊224的基部連接於機殼 22之底面221 ’而各腳墊224的前端抵標於平面5〇，使電子裝置 1344814 100年05月11日替換頁 2〇的底部架高在平面5〇上，換句話說，機殼22之底面221係與 平面50保持一適當的距離。機殼22之進氣孔222係對應於散熱 模組23之風扇233 ’而且機殼22之排氣孔223係對應於散熱模 組23之散熱鰭片組234。因此，散熱模組23之風扇233就能夠 順利地由進氣孔222將空氣吸入機殼22内部，以產生前述吹向散 熱鱗片組234與熱導管235之氣流，而氣流流過散熱鰭片組234 後也能夠順利地從排氣孔223排出機殼22外。所以，由排氣孔 223流出機殼22之氣流為相對高溫之空氣，而位於進氣孔222周 遭的空氣為相對低溫之空氣。 輔助排氣孔24位於進氣孔222與排氣孔223之間，而且輔助 排氣孔24係排列於進氣孔222面對排氣孔223之侧邊。輔助排氣 孔24比排氣孔223及散熱鰭片組234更接近風扇2%，所以風扇 233吹出的氣流會有一部份直接流入輔助排氣孔％，而流出機殼 22。各輔助排氣孔24的周緣設置有二第一導引面241，可導引氣 々il由輔助排氟孔24吹出機殼22外。較靠近排氣孔223之第一導 引面241係由散熱模組23底部朝向排氣孔2幻傾斜，以導引由輔 助排氣孔224之氣流背對進氣孔222流出機殼22。較遠離排氣孔 223之第-導引面241係由散熱模組23底部朝向輔助排氣孔— 延伸，並且彎折與底面221齊平，以導引由輔助排氣孔224之氣 流背對進氣孔222流出機殼22。因此，各輔助排氣孔24之第一 導引面241係導引部分的氣流吹向排氣孔如，使流經散熱籍片 組234而由排氣孔223吹出機殼22之熱氣流不會流向進氣孔似。 請繼續參閱「第6圖」及「第7圖」所示，為本發明第二實 1344814 100年05月11日替換頁 施例所提供之電子較之赌，其㈣實施 例大妓相同’㈣實施觸差異之處如下。機殼η畴設置有二 導流板225，其中各導流板225係隔著排氣孔223互相面對。各 導流板225之一端於排氣孔223邊緣連接於機殼22之内壁，而各 導流板奶之另一端朝向散熱模組a。各導流板奶上分別具有 -第二導引面226 ’各第二導引面226位於排氣孔扭之周緣。 導流板225係傾斜於機殼22之底面22卜使各第二導引面故與 底面221之距離係由排氣孔223朝進氣孔222逐漸增加。各導流 板225之第二導引面226係銜接風扇233之外罩，以承接風扇说 所吹出之氣流’而散熱.鰭片組234係伸入各導流板奶之間。導 流板22S之第二導引面226係用以導引風扇233所吹出之氣流朝 排氣孔223流動，並使前述之氣流由排氣孔223冑對進氣孔瓜 流出機殼22。因此’因吸收熱能而升溫之氣流翻機殼22後就 不會朝進氣孔222流動。 如「第8圖」及「第9圖」所示’為本發明第三實施例所提 供之電子裝置之機殼，其具體實施方式與祕第—實施例大致相 同，而兩實施例的差異之處如下。第三實施例中各第二導引面226 直接位於排氣孔223之孔壁上，且各第二導引面226係由機殼22 之底面221向内朝放熱模組23(風扇233)傾斜。第二導引面226 係用以導引風扇233所吹出之氣流朝排氣孔223流動，並使前述 之氣流由排氣孔223背對進氣孔222流出機殼，此，因吸收熱 能而升溫之氣流排出機殼22後就不會朝進氣孔迎流動。 本發明中機殼之輔助排氣孔24可藉由其第一導引面241導引 1344814 I年05月11曰替拖可 一邛分的氣流吹向排氣孔223，而阻擋流出 進氣孔222流動，且排氣孔223之第二導引面226可導弓月 氣孔223之氣流背對進氣孔222流動，以防止溫度較高的^空， 又回流到進氣孔222,進而將散熱模組23維持在較佳的散熱: 雖然本發明以前述之實施例揭露如上，然其並非用以 發明。在不脫離本發明之精神和範圍内，所為之更動與 _ 屬本發明之專利保護細。關於本發明所界定之範= 所附之申請專利範圍。 參考 【圖式簡單說明】 第1圖為習知技術中筆記型電腦散熱 示意圖。 '^位置之局部剖面 第2圖為本發明第—實關中電子裝置之 第3圖為本發明第—實施例中電子裝，思圖。 第4圖為本發·-實施财 ^立體示意圖。 第㈤為第4圖中氣流流動方向示意^局部剖面示意圖。 第6圖為本發明第二實施例中電子裝置 第7圖為第6圖中氣流流動方向示意圖。局部剖面示意圖。 圖 第8圖為本發明第三實補中電子裝置 第9圖為第8圖之局部放大示意圖7之局部剖面示意 【主要元件符號說明】 ...筆記型電腦 ··.機殼 ··.散熱器 10 11 12 1344814 13 .............................散熱孔 14 .............................散熱孔 15 .............................腳墊 16 .............................桌面 20 .............................電子裝置 21 .............................電子組件 211...........................連接埠 22 .............................機殼 221 ...........................底面 222 ...........................進氣孔 223 ...........................排氣孔 224 ...........................腳墊 225 ...........................導流板 226 ...........................第二導引面 23 .............................散熱模組 233 ...........................風扇 234 ...........................散熱鰭片組 235 ...........................熱導管 24 .............................輔助排氣孔 241...........................第一導引面 50.............................平面 100年05月11日替換頁The heat of life is this. In terms of heat dissipation, if the temperature of the air entering the radiator U by the heat dissipation holes 13 is lower, the heat dissipation efficiency is better. However, since the bottom surface of the casing 11 is elevated and the heat dissipation holes 13 and the heat dissipation holes 14 are not blocked by each other, the high-temperature air discharged from the heat dissipation holes 14 is likely to flow along the bottom surface of the casing u. The periphery of the heat dissipation hole 13 is then sucked in again by the heat dissipation hole 13 by the heat sink 12. As a result, the temperature of the air entering the heat sink 12 from the heat dissipation holes 13 is greatly increased, resulting in a decrease in the overall heat dissipation efficiency of the heat sink 12. SUMMARY OF THE INVENTION In view of the problem of hot air discharged from the heat dissipation of the notebook computer in the prior art, the main object of the present invention is to provide a chassis for the Weishen device to solve the heat dissipation efficiency of the prior art. The problem. 6 1 1J445I4 To solve the above problems, the present invention provides for accommodating at least an electronic component and a heat dissipation module. The Hi-shell of the casing is provided with an air inlet, at least one venting hole and at least one auxiliary venting hole to generate a gas flow to the venting opening and the auxiliary venting opening to discharge the heat energy of the electric power. The peripheral edge of the auxiliary venting opening is provided with at least a first guiding surface, and the two guiding surfaces guide at least a portion of the air flow to flow toward the air inlet opening. The effect of the invention is that the auxiliary vent hole of the casing can be blown toward the vent hole by the air flow of the first guiding surface n, and the airflow flowing out of the vent hole is blocked toward The intake air I only turns on the hot air with a higher temperature, and the hot air is called to ride the air holes, thereby maintaining the heat dissipation mode and maintaining the heat dissipation efficiency. The detailed features and advantages of the present invention are described in detail below, which is sufficient for any skilled person to understand the technical contents of the present invention and to apply for it according to the contents of the book. The foregoing objects and advantages of the present invention are readily understood by those skilled in the art. The description of the embodiments of the present invention and the following embodiments are used to explain the principles of the present invention and provide a further explanation of the scope of the present invention. Further understanding of the objects, structures, features, and functions of the present invention will be described in detail below with reference to the embodiments. 4 Refer to "Fig. 2", "Fig. 3" and "Fig. 4" Invention 1344814 _ ι υυ 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 05 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 In the specific embodiment of the present invention, the aforementioned electronic device 20 may be, but not limited to, a portable electronic device such as a notebook computer or a palmtop computer. An electronic component 21 and a heat dissipation module 23 are disposed inside the casing 22 of the electronic device 2, wherein the electronic component 21 can be a printed circuit board, such as a motherboard inside the host, and the heat dissipation module 23 is used for the electronic component. 21 for heat dissipation. The edge of the electronic component 21 is provided with a plurality of binders 2 ιι to provide a host connection for the electronic device 20 to expand the peripheral hardware device. The heat dissipation module 23 includes a fan 233, a heat dissipation fin 234 and a heat pipe 235 for heat exchange with the electronic component 21. The heat pipe condition is embedded in the loose-arm fin group 2, wherein the heat pipe means that the fine heat conduction mode takes away the heat energy of the heat source on the electronic component, and transfers the heat energy of the heat source to the heat dissipation fin group 234. The fan 233 is configured to generate a flow of air that is blown toward the fin assembly 234 and the heat pipe, so that the air flows through the heat dissipation fins 234 and the heat of the heat pipe 235 and forces the air of the casing 22 The outside air is convected to carry away the heat energy on the heat sink fin set 234 and the heat pipe 235 by heat conduction and heat convection. Please continue to refer to "Figure 4" and "Figure 5". The electronic device 2 is placed on a flat surface 50, such as the top surface of a table. The casing 22 is used to mount the host of the electronic device 20, and provides the electronic components 21 and the heat dissipation module 23 inside the main body to ensure proper protection. The bottom of the casing 22 has a bottom surface 221 facing the plane 5, and the bottom surface 221 has a plurality of air inlet holes 222, a plurality of air holes 223, a plurality of auxiliary air holes 24, and a plurality of dispersed foot pads 224. The base of each of the pads 224 is connected to the bottom surface 221 ' of the casing 22 and the front end of each of the foot pads 224 abuts against the plane 5〇, so that the bottom of the electronic device 1344814 is replaced by the bottom of the page 2〇 on the plane 5 In other words, in other words, the bottom surface 221 of the casing 22 is maintained at an appropriate distance from the plane 50. The air inlet 222 of the casing 22 corresponds to the fan 233' of the heat dissipation module 23, and the air vent 223 of the casing 22 corresponds to the heat dissipation fin group 234 of the heat dissipation module 23. Therefore, the fan 233 of the heat dissipation module 23 can smoothly suck air into the casing 22 through the air inlet hole 222 to generate the airflow that is blown toward the heat dissipation scale group 234 and the heat pipe 235, and the airflow flows through the heat dissipation fin group. It is also possible to smoothly discharge the outside of the casing 22 from the exhaust hole 223 afterwards. Therefore, the air flowing out of the casing 22 through the vent 223 is relatively high temperature air, and the air surrounding the air inlet 222 is relatively low temperature air. The auxiliary vent hole 24 is located between the intake hole 222 and the vent hole 223, and the auxiliary vent hole 24 is arranged on the side of the intake hole 222 facing the vent hole 223. The auxiliary venting hole 24 is closer to the fan 2% than the venting hole 223 and the heat radiating fin group 234, so that a part of the airflow blown by the fan 233 directly flows into the auxiliary venting hole % and flows out of the casing 22. Each of the auxiliary vent holes 24 is provided with two first guiding faces 241, and the ventilating il is blown out of the casing 22 by the auxiliary fluorinating holes 24. The first guiding surface 241 closer to the exhaust hole 223 is tilted obliquely from the bottom of the heat dissipation module 23 toward the exhaust hole 2 to guide the airflow from the auxiliary exhaust hole 224 to flow out of the casing 22 against the air inlet hole 222. The first guiding surface 241 farther away from the exhaust hole 223 extends from the bottom of the heat dissipation module 23 toward the auxiliary exhaust hole, and is bent flush with the bottom surface 221 to guide the airflow by the auxiliary exhaust hole 224. The air intake hole 222 flows out of the casing 22. Therefore, the first guiding surface 241 of each auxiliary venting hole 24 is directed to the airflow of the guiding portion to the venting opening, for example, so that the hot airflow flowing through the heat radiating chip group 234 and blown out of the casing 22 by the venting hole 223 is not Will flow to the air intake hole. Please continue to refer to "Figure 6" and "Figure 7" for the electronic gambling provided by the second embodiment of the second embodiment of the invention, which is based on the example of the replacement page of the May 11th, 2014. (4) The differences in implementation are as follows. The casing η domain is provided with two baffles 225, wherein each baffle 225 faces each other across the venting opening 223. One end of each of the baffles 225 is connected to the inner wall of the casing 22 at the edge of the venting opening 223, and the other end of each of the deflector plates faces the heat dissipating module a. Each of the deflector milks has a second guiding surface 226'. Each of the second guiding surfaces 226 is located at a periphery of the venting hole twist. The deflector 225 is inclined to the bottom surface 22 of the casing 22 so that the distance between each of the second guiding faces and the bottom surface 221 is gradually increased from the exhaust hole 223 toward the intake hole 222. The second guiding surface 226 of each of the deflectors 225 is coupled to the outer cover of the fan 233 to dissipate heat from the airflow blown by the fan. The fin set 234 extends between the respective deflector milk. The second guiding surface 226 of the deflector 22S is for guiding the airflow blown by the fan 233 to flow toward the exhaust hole 223, and causes the aforementioned airflow to flow out of the casing 22 from the exhaust hole 223. Therefore, the airflow which is heated by the absorption of heat energy does not flow toward the intake hole 222 after the casing 22 is turned over. As shown in FIG. 8 and FIG. 9 , the casing of the electronic device according to the third embodiment of the present invention is substantially the same as the secret embodiment-embodiment, and the difference between the two embodiments The place is as follows. In the third embodiment, each of the second guiding surfaces 226 is directly located on the hole wall of the venting opening 223, and each of the second guiding surfaces 226 is inwardly directed from the bottom surface 221 of the casing 22 toward the heat releasing module 23 (fan 233). tilt. The second guiding surface 226 is configured to guide the airflow blown by the fan 233 to flow toward the exhaust hole 223, and the foregoing airflow flows out of the casing through the exhaust hole 223 against the air inlet hole 222, thereby absorbing heat energy. After the warmed airflow exits the casing 22, it does not flow toward the intake hole. In the present invention, the auxiliary venting opening 24 of the casing can be guided by the first guiding surface 241 to guide the 1344814, and the airflow can be blown to the venting hole 223 for blocking the flow of air. The hole 222 flows, and the second guiding surface 226 of the venting hole 223 can flow the air flow of the bowing hole 223 against the air inlet hole 222 to prevent the temperature from being high and return to the air inlet hole 222, and then The heat dissipation module 23 maintains a preferred heat dissipation: although the invention has been disclosed above in the foregoing embodiments, it is not intended to be invented. The modifications and modifications of the present invention are not to be construed as a departure from the spirit and scope of the invention. The scope of the patent application is defined by the scope of the invention. Reference [Simple description of the drawing] Fig. 1 is a schematic diagram of the heat dissipation of the notebook computer in the prior art. A partial cross section of the '^ position Fig. 2 is a third diagram of the electronic device in the first embodiment of the present invention, which is an electronic device in the first embodiment of the present invention. Figure 4 is a three-dimensional diagram of the implementation of the implementation of the financial system. The fifth (5) is a schematic cross-sectional view of the flow direction of the airflow in Fig. 4. Fig. 6 is a view showing the flow direction of the air flow in Fig. 6 in the second embodiment of the present invention. A schematic view of a partial section. Figure 8 is a partial cross-sectional view of a partially enlarged schematic view of the electronic device in the third embodiment of the present invention, which is a partial enlarged view of the eighth embodiment of the present invention. [Notes of main components] ... notebook computer · ·. Radiator 10 11 12 1344814 13 .............................The vent hole 14 ........... .................. vents 15 ............................. Foot pads 16 .............................Desktop 20 ................ .............electronic device 21 .............................Electronic component 211.. .........................Connect 埠22 ...................... .......Chassis 221 ...........................Back surface 222 ........... ................ intake hole 223 ........................... vent hole 224 ...........................foot pad 225 ................... ........Baffle 226 ...........................Second guiding surface 23 ..... ........................The heat dissipation module 233 ...................... .....fan 234 ...........................heat fin array 235 ........... ................heat pipe 24 ............................. auxiliary row Hole 241...........................first guiding surface 50............... .............. Planned 100 years May 11th replacement page
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