TWI820739B - Heat dissipation structure - Google Patents

Abstract

A heat dissipation device includes a housing, a heat dissipation plate, a first fan and at least two second fans. The housing has a first sidewall and a second sidewall that are opposite to each other. The first sidewall has a first opening area. The second sidewall has a second opening area. The first opening area and the second opening area are facing each other. The heat dissipation plate is located inside the housing and covers at least one heat source. An opening penetrates through the heat dissipation plate, and the opening corresponds to the first opening area. The first fan is located inside the opening. The at least two second fans are located nearby the heat dissipation plate. Each gas outlets of the at least two second fans are away from the first fan. The housing further includes side surfaces that connect the first sidewall and the second sidewall. The side surfaces include three side opening areas. The three side opening areas are facing different directions.

Description

Heat dissipation structure

This disclosure relates to a heat dissipation structure.

Most of the air-cooled heat dissipation structures of laptops on the market today are dual-fan designs. Its configuration is mainly to set up a heat pipe around the heating element, and conduct the heat to the cooling fan through the heat pipe, and the cold air flow passing through the fan will take the heat out to the outside of the laptop. However, the heating components (such as CPU and GPU chips) in laptops are often placed very close to each other due to space constraints. Therefore, the laptop will generate heat accumulation in a single location, which is not conducive to heat dissipation. In addition, the air inlet of the fan usually draws in cold air from a single side of the laptop (usually the bottom of the laptop). The space for drawing the cold air is small, which further results in poor cooling efficiency of the laptop.

Therefore, how to propose a heat dissipation structure that can solve the above problems is one of the problems that the industry is currently eager to invest in research and development resources to solve.

In view of this, one purpose of the present disclosure is to provide a heat dissipation structure that can effectively solve the above problems.

The present disclosure relates to a heat dissipation structure including a chassis, a vapor chamber, a first fan and at least two second fans. The casing has first and second opposite side walls. The first side wall is provided with a first opening area. The second side wall provides a second opening area. The first opening area and the second opening area are opposite to each other. The vapor chamber is arranged inside the casing and covers at least one heat source. The vapor chamber includes an opening corresponding to the first opening area and penetrating the vapor chamber. The first fan is disposed in the opening. At least two second fans are disposed adjacent to the vapor chamber. The air flow outlets of at least two second fans are respectively located away from the first fan. The casing further includes a plurality of side surfaces connecting the first side wall and the second side wall. The side surface contains three side open areas. The opening areas on the three sides face different directions.

In some current embodiments, the vapor chamber includes thermally conductive elements extending from the vapor chamber and passing through the airflow outlets of at least two second fans.

In some current implementations, the three-side opening area includes a first side opening area disposed on one side of the vapor chamber adjacent to the first fan.

In some current implementations, the casing further includes at least one collapsible bracket disposed on the second side wall adjacent to the first side opening area. At least one bracket isolates the airflow discharged from the first side opening area.

In some current implementations, when at least one bracket is deployed, the height of one side of the casing is increased.

In some current implementations, the heat exchanger is disposed between the first side opening area and the first fan.

In some current implementations, the three-side opening area further includes two second side opening areas corresponding to the air flow outlets of at least two second fans. The vapor chamber includes a thermal conductive element extending from the vapor chamber and disposed between the airflow outlet and the two second side opening areas.

In some current implementations, the heat exchanger is disposed between the two second side opening areas and at least two second fans.

In some current implementations, the first side opening area faces a first direction, and the two second side opening areas face a second direction and a third direction opposite to each other.

In some current implementations, there are multiple heat sources and the openings separate the heat sources.

In some current implementations, the casing includes third opening areas and fourth opening areas located on the first side wall and the second side wall respectively and corresponding to at least two second fans.

In some current implementations, the housing further includes blocking blocks. The blocking blocks are disposed on the second side wall and are respectively located between the air flow outlets and the fourth opening areas of at least two adjacent second fans.

In some current implementations, the heat dissipation structure further includes a first baffle to separate at least two second fans and a vapor chamber.

In some current implementations, the first blocking body is disposed inside the casing and connects one of the second side wall and the first side wall.

In some current implementations, the first baffle is disposed on the edges of at least two second fans, and the edges are connected to one of the first side wall and the second side wall through the first baffle.

In some current implementations, the at least two second fans include a second baffle partially surrounding the airflow inlets of the at least two second fans.

In summary, in the heat dissipation structure of the present disclosure, by systematically arranging the air flow outlets of the first fan and the two second fans in different directions, heat can be quickly conducted in different directions and discharged to the outside of the casing. In addition, the large-area vapor chamber, extended thermal conductive elements and multiple heat exchangers installed in the heat dissipation structure will effectively increase the heat dissipation area. At the same time, the heat dissipation structure also arranges the heat sources dispersedly on the vapor chamber, so heat accumulation in a single location can be avoided. On the other hand, the heat dissipation structure is provided with multiple opening areas on the first side wall and the second side wall corresponding to the air flow inlet of the fan, which allows the fan to suck in cold air from two directions, thereby increasing the amount of cold air sucked in by the fan. Furthermore, the heat dissipation structure is provided with a bracket and a blocking block between the air flow outlet and the air flow inlet of the fan. Under their synergy, it will be possible to prevent the discharged hot air flow from being sucked into the cabinet again, thereby improving the convection of each fan. The flow fields are independent and do not interfere with each other, ensuring a smooth heat dissipation path and avoiding inefficient heat transfer. In addition, the heat dissipation structure is provided with a first baffle inside the casing to divide a uniform heat zone and a heat dissipation zone, and is provided with a second baffle around the air inlets of the two second fans to separate them from the inside of the casing. In this way, the direction of heat transfer can be effectively controlled to prevent the hot air flow from causing inefficient heat transfer inside the casing during the heat dissipation process of the fan.

The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, the following description where a first feature is formed on or on a second feature may include embodiments in which the first feature and the second feature are formed in direct contact, and may also include embodiments in which additional features may be Embodiments are formed between a first feature and a second feature such that the first feature and the second feature may not be in direct contact. Additionally, the present disclosure may repeat reference symbols and/or letters in various instances. This repetition is for simplicity and clarity and does not in itself represent a relationship between the various embodiments and/or configurations discussed.

In addition, for simplicity of description, spatially relative terms such as "below", "below", "lower", "above", "upper" and similar terms may be used herein. Describe the relationship of one element or feature to another (additional) element or feature as illustrated in the figures. These spatially relative terms are intended to encompass different orientations of elements in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

As used herein, "about," "approximately," "approximately" or "substantially" generally means falling within twenty percent, within ten percent, or within one hundred percent of a given value or range. Out of five. Numerical quantities given herein are approximations, meaning that terms such as "about," "approximately," "approximately" or "substantially" may be inferred when not expressly stated otherwise.

FIG. 1 is a schematic diagram of a heat dissipation structure 100 from a top view according to some embodiments of the present disclosure. FIG. 2 is a schematic diagram of the heat dissipation structure 100 from a rear view according to some embodiments of the present disclosure. FIG. 3A is a schematic cross-sectional view of the local heat dissipation structure 100 located inside the chassis 110 according to some embodiments of the present disclosure. Referring to FIGS. 1 to 3A , the present disclosure relates to a heat dissipation structure 100 including a chassis 110 , a vapor chamber 120 , a first fan 130 and at least two second fans 140 . The casing 110 has opposite first side walls 112 and second side walls 114 . The first side wall 112 provides a first opening area 112a. The second side wall 114 provides a second opening area 114a. The first opening area 112a and the second opening area 114a face each other. The vapor chamber 120 is disposed inside the casing 110 and covers at least one heat source 150 . The vapor chamber 120 includes an opening 122 disposed corresponding to the first opening area 112 a and penetrating the vapor chamber 120 . The first fan 130 is disposed in the opening 122 . At least two second fans 140 are disposed adjacent to the vapor chamber 120 . The respective airflow outlets 142 of at least the two second fans 140 are away from the first fan 130 . The casing 110 further includes a plurality of side surfaces 116 connecting the first side wall 112 and the second side wall 114 . Side surface 116 includes three side open areas 116a, 116b, 116c. The three-side opening areas 116a, 116b, and 116c face different directions respectively.

Referring to FIGS. 1 to 2 , in some embodiments, the first side wall 112 , the second side wall 114 and the plurality of side surfaces 116 of the chassis 110 may define a receiving space to accommodate part of the heat dissipation structure 100 . However, the casing 110 can also be part of other devices, such as a computer or a processor. On the other hand, other electronic components or devices that do not belong to the heat dissipation structure 100 may also be included in the accommodation space, such as keyboards, touch pads, stylus pens, etc. For example, in the embodiment shown in Figures 1 to 2, the case 110 is combined with a notebook computer. In addition to housing the heat dissipation structure 100, the case 110 also includes a processor, a circuit board, an input Devices and input/output interfaces and other devices or components.

FIG. 4 is a cross-sectional side view of the heat dissipation structure 100 according to some embodiments of the present disclosure. Please refer to Figures 1 to 4. The first side wall 112 and the second side wall 114 are opposite to each other and are respectively provided with a first opening area 112a and a second opening area 114a. In some embodiments, any number of openings may be included in the first opening area 112a and the second opening area 114a. When the first opening area 112a and the second opening area 114a are arranged opposite to each other, these openings do not necessarily need to be opposite to each other. When the first opening area 112a and the second opening area 114a are arranged opposite to each other, the airflow can flow in from the first opening area 112a and pass through the casing 110 and then flow out from the second opening area 114a. Similarly, the airflow can also flow along the Opposite path movement. In some embodiments, the casing 110 includes a third opening area 112b and a fourth opening area 114b respectively located on the first side wall 112 and the second side wall 114 and corresponding to at least two second fans 140. In some embodiments, the third opening area 112b and the fourth opening area 114b may be adjacent to the air flow inlets 144 provided on the at least two second fans 140 to assist the at least two second fans 140 in sucking cold air from outside the casing 110 . For example, the third opening area 112b is provided on the first side wall 112 corresponding to the position of the two second fans 140, and the fourth opening area 114b is provided on the second side wall 114 corresponding to the position of the two second fans 140. In some embodiments, any number of openings may be included in the third opening area 112b and the fourth opening area 114b, but the disclosure is not limited thereto.

Referring to FIGS. 1 to 4 , in some embodiments, a plurality of side surfaces 116 connects the edges of the first side wall 112 and the second side wall 114 , and each side surface 116 faces a different direction. Side opening areas 116a, 116b, and 116c are provided on the side surface 116. The side opening areas 116a, 116b, and 116c can be divided into a first side opening area 116a adjacent to the first fan 130 and two second side opening areas 116b, 116c adjacent to at least two second fans 140 according to their installation positions. . In some embodiments, the first side opening area 116a and the two second side opening areas 116b and 116c can be used as exhaust ports to discharge gas from the interior of the casing 110 along multiple different directions. The specific positions of the first side opening area 116a and the two second side opening areas 116b and 116c can be set relative to the vapor chamber 120, the first fan 130 and at least two second fans 140. The relative positional relationship between them will be described below. Details.

Referring to Figures 1 to 3A, the vapor chamber 120 is disposed in the accommodation space and covers the heat source 150. In some embodiments, heat source 150 may be, for example, a CPU, GPU, or other heat-generating electronic component. The vapor chamber 120 is provided with an opening 122 and accommodates the first fan 130 . Specifically, the position of the first fan 130 (also the position of the opening 122) corresponds to the first opening area 112a and the second opening area 114a, and the first opening area 112a and the second opening area 114a will assist the first fan 130 to move from Cold air is sucked in from the outside of the casing 110 . In some embodiments, the opening 122 of the vapor chamber 120 is located in the center of the vapor chamber 120 . In this way, the first fan 130 disposed in the opening 122 will be located in the center of the vapor chamber 120 . The first fan 130 can radially conduct heat from the heat source to other positions of the vapor chamber 120 in a direction away from the first fan 130 through airflow, thereby improving the heat dissipation efficiency of the vapor chamber 120 . In other embodiments, there are multiple heat sources 150 and the openings 122 separate the heat sources 150 . For example, referring to FIG. 3A , the heat sources 150 are located on both sides of the opening 122 respectively. By dispersing the heat source 150 on both sides of the first fan 130 (that is, the position of the opening 122 ), the heat generated by the heat source 150 is dispersed, so that the heat can be more evenly distributed on the vapor chamber 120 and improve the heat distribution. The heat dissipation efficiency of the board 120.

Referring to FIGS. 1 to 3A , in some embodiments, the first side opening area 116 a is disposed on one side of the vapor chamber 120 adjacent to the first fan 130 . Furthermore, in the embodiment shown in FIG. 3A , a heat exchanger 160 is further disposed between the first side opening area 116 a and the first fan 130 . In this way, the first fan 130 can assist the conduction of heat on the vapor chamber 120 and at the same time, bring the heat to the heat exchanger 160 through the air flow and leave the casing 110 through the first side opening area 116 a and discharge it to the outside. The heat exchanger 160 provides a larger surface area for heat to contact the airflow, so as to more efficiently utilize the airflow to discharge heat to the outside of the casing 110 .

Referring to FIGS. 1 to 3A , in some embodiments, the vapor chamber 120 includes a thermally conductive element 124 extending from the vapor chamber 120 and through the airflow outlet 142 . The thermal conductive element 124 can be arranged to extend the heat conduction path of the vapor chamber 120 and place it at a specific position to assist the vapor chamber 120 in dissipating heat. For example, referring to the embodiment shown in FIG. 3A , two heat conducting elements 124 respectively extend from two opposite edges of the vapor chamber 120 to the air flow outlets 142 of at least two second fans 140 . Furthermore, in some embodiments, the two second side opening areas 116b and 116c are provided corresponding to the airflow outlet 142. The thermal conductive element 124 extends from the vapor chamber 120 and is disposed between the airflow outlet 142 and the two second side opening areas 116b and 116c. In this way, the heat conducted by the heat-conducting element 124 can accurately move to the airflow outlet 142 and be taken out to the outside of the casing 110 by the airflow of the at least two second fans 140 . In some embodiments, the heat exchanger 160 is disposed between the two second side opening areas 116b, 116c and the at least two second fans 140. Specifically, the heat conductive element 124 can be connected to the heat exchanger 160 to increase its heat dissipation surface area, and then the heat exchanger 160 is disposed in front of the air flow outlet 142 to more efficiently utilize the air flow to transfer heat from the two second side opening areas. 116b, 116c are brought out of the casing 110.

It should be noted that the design of the heat dissipation structure 100 can reduce and avoid inefficient transfer of hot air flow between the fans of the heat dissipation structure 100 (for example, heat continues to be transferred between the first fan 130 and at least two second fans 140 ). . The principle is that the air flow outlets 142 of at least two second fans 140 of the heat dissipation structure 100 are arranged in different directions (ie, the directions of the two second side opening areas 116b and 116c) and the air flow outlet directions of the first fan 130 (ie, the direction of the first fan 130). direction of one side opening area 116a). In this way, the hot airflow leaving the casing 110 through the airflow outlet of a certain fan can be prevented from entering the airflow inlet of another fan. For example, in the embodiments of FIGS. 1 to 3A , the first side opening area 116a faces the first direction A1, and the two second side opening areas 116b, 116c face the second direction A2 and the third direction A2, which are opposite to each other. Direction A3.

Referring to FIGS. 1 to 3A , in some embodiments, the housing 110 further includes a blocking block 170 . The blocking blocks 170 are disposed on the second side wall 114 and are respectively located between the adjacent air flow outlets 142 (corresponding to the two second side opening areas 116b and 116c respectively) and the fourth opening area 114b. Specifically, the fourth opening area 114b corresponds to at least the airflow inlet 144 of the second fan 140. If the blocking block 170 is disposed between the airflow outlet 142 and the airflow inlet 144, the hot airflow discharged from the airflow outlet 142 can be better blocked. Return to airflow inlet 144 to avoid inefficient heat transfer. In some embodiments, the casing 110 further includes a collapsible bracket 180 disposed on the second side wall 114 adjacent to the first side opening area 116a. When the bracket 180 is deployed, the airflow discharged from the first side opening area 116a is blocked. Specifically, the bracket 180 may be disposed between the first side opening area 116a and the second opening area 114a. When the bracket 180 is deployed, a convex wall can be formed between the first side opening area 116a and the second opening area 114a, and prevent the hot air flow discharged from the first side opening area 116a from flowing back to the second opening area 114a to avoid Inefficient heat transfer. In addition, when the bracket 180 is deployed, it can also raise one side of the casing 110 and increase the cold air intake space in the second opening area 114 a to improve the air intake efficiency of the first fan 130 .

FIG. 3B is a schematic cross-sectional view of the local heat dissipation structure 100 located inside the chassis 110 according to other embodiments of the present disclosure. Please refer to Figures 1, 2 and 3B. In some embodiments, the heat dissipation structure 100 further includes a first baffle 190 disposed to separate at least two second fans 140 and the vapor chamber 120. Specifically, the first baffle 190 can be provided to divide the internal space of the casing 110 to improve the heat dissipation efficiency of the heat dissipation structure 100 . Providing the first baffle 190 between at least two second fans 140 and the vapor chamber 120 can prevent the two second fans 140 from inhaling hot air from the vapor chamber 120 when operating. The first baffle 190 separates the heat chamber 120 and the first fan 130 into a heat chamber. The heat will be evenly dispersed in the uniform heat zone to avoid heat superposition between multiple heat sources 150 and improve heat dissipation efficiency. On the other hand, the first baffle 190 simultaneously separates at least two second fans 140 into heat dissipation areas. A heat conduction path can be formed between the heat uniformity zone and the heat dissipation zone through the thermal conductive element 124 to conduct heat from the heat uniformity zone to the heat dissipation zone. In this way, the cold air flow sucked by the at least two second fans 140 can focus on helping the heat conduction element 124 to dissipate heat, and the first baffle 190 can ensure that the cold air flow of the at least two second fans 140 will not be in the heat equalizing zone and the heat dissipation zone. inefficient heat transfer.

FIG. 3C is a schematic cross-sectional view of the local heat dissipation structure 100 located inside the chassis 110 according to other embodiments of the present disclosure. Please refer to Figure 1, Figure 2 and Figure 3C. In some embodiments, the first blocking body 190 is disposed inside the casing 110 and connects one of the second side wall 114 and the first side wall 112. Specifically, the first baffle 190 may be disposed between the second side wall 114 and the first side wall 112 and surround the heat distribution area. The first baffle 190 may be a boss extending from the second side wall 114 or the first side wall 112 . The heat equalizing area separated by the first baffle 190 includes the first fan 130 and the heat equalizing plate 120 . In some embodiments, the heat soaking zone may also include other components, such as circuit boards or other electronic devices, or parts of these components. On the other hand, the first baffle 190 separates at least two second fans 140 into heat dissipation areas. In some embodiments, the two heat dissipation areas are not connected to each other, and the two heat dissipation areas are each connected to the vapor chamber 120 of the vapor chamber through a thermal conductive element 124 . In this way, the heat dissipation paths of each heat dissipation area will be independent of each other and will not interfere with each other, thus improving the heat dissipation efficiency of the heat dissipation structure 100 . In some other embodiments, the first baffle 190 is disposed on the edges of at least two second fans 140 , and the edges connect one of the first side wall 112 and the second side wall 114 through the first baffle 190 . Specifically, arranging the first baffle 190 at the edges of at least two second fans 140 can also achieve the aforementioned effect of dividing the heat equalizing zone and the heat dissipation zone.

Referring to FIGS. 1 to 3A , in some embodiments, at least two second fans 140 include second baffles 146 partially surrounding the airflow inlets 144 of the at least two second fans 140 . Providing a second baffle 146 around the airflow inlet 144 can further ensure that the cold airflow of at least two second fans 140 enters from outside the casing 110 . In this way, it will be ensured that the airflow inlet 144 only receives cold airflow from the outside, and will not cause inefficient heat transfer with the hot airflow inside the casing 110 .

From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the heat dissipation structure of the present disclosure, by systematically arranging the air flow outlets of the first fan and the two second fans in different directions, the heat can be dissipated. It is quickly conducted from different directions and discharged to the outside of the casing. In addition, the large-area vapor chamber, extended thermal conductive elements and multiple heat exchangers installed in the heat dissipation structure will effectively increase the heat dissipation area. At the same time, the heat dissipation structure also arranges the heat sources dispersedly on the vapor chamber, so heat accumulation in a single location can be avoided. On the other hand, the heat dissipation structure is provided with multiple opening areas on the first side wall and the second side wall corresponding to the air flow inlet of the fan, which allows the fan to suck in cold air from two directions, thereby increasing the amount of cold air sucked in by the fan. Furthermore, the heat dissipation structure is provided with a bracket and a blocking block between the air flow outlet and the air flow inlet of the fan. Under their synergy, it will be possible to prevent the discharged hot air flow from being sucked into the cabinet again, thereby improving the convection of each fan. The flow fields are independent and do not interfere with each other, ensuring a smooth heat dissipation path and avoiding inefficient heat transfer. In addition, the heat dissipation structure is provided with a first baffle inside the casing to divide a uniform heat zone and a heat dissipation zone, and is provided with a second baffle around the air inlets of the two second fans to separate them from the inside of the casing. In this way, the direction of heat transfer can be effectively controlled to prevent the hot air flow from causing inefficient heat transfer inside the casing during the heat dissipation process of the fan.

The foregoing summarizes the features of several embodiments so that those skilled in the art can better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent structures do not depart from the spirit and scope of the disclosure, and they can make various changes, substitutions and substitutions herein without departing from the spirit and scope of the disclosure.

100:Heat dissipation structure

110:Chassis

112:First side wall

112a: First opening area

112b: The third opening area

114:Second side wall

114a: Second opening area

114b: The fourth opening area

116:Side surface

116a, 116b, 116c: Side opening area

120:Vapor chamber

122:Open your mouth

124: Thermal conductive element

130:First fan

140: Second fan

142:Air flow outlet

144:Air flow inlet

146:Second blocking body

150:Heat source

160:Heat exchanger

170: blocking block

180:Bracket

190:First block

A1,A2,A3: direction

Aspects of the present disclosure are best understood from the following detailed description when read in conjunction with the accompanying figures. It should be noted that in accordance with standard industry practice, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion. Figure 1 is a schematic diagram from a top view of a heat dissipation structure according to some embodiments of the present disclosure. FIG. 2 is a schematic diagram of a heat dissipation structure from a rear view according to some embodiments of the present disclosure. Figure 3A is a schematic cross-sectional view of a local heat dissipation structure located inside a casing according to some embodiments of the present disclosure. Figure 3B is a schematic cross-sectional view of a local heat dissipation structure located inside the casing according to other embodiments of the present disclosure. Figure 3C is a schematic cross-sectional view of a local heat dissipation structure located inside the casing according to other embodiments of the present disclosure. Figure 4 is a cross-sectional side view of a heat dissipation structure according to some embodiments of the present disclosure.

100:Heat dissipation structure

110:Chassis

112:First side wall

112a: First opening area

112b: The third opening area

116:Side surface

116c: Side opening area

Claims (15)

A heat dissipation structure includes: a casing having an opposite first side wall and a second side wall, the first side wall is provided with a first opening area, the second side wall is provided with a second opening area, and the first opening The area and the second opening area are opposite; a vapor chamber is arranged inside the casing and covers the two heat sources, and includes an opening corresponding to the first opening area and penetrating the vapor chamber; a first fan located at The two heat sources are disposed in the opening of the vapor chamber; and two second fans are disposed adjacent to the vapor chamber, and an airflow outlet of each of the two second fans is away from the first fan. One of the heat sources is located between the first fan and one of the two second fans, and the other of the two heat sources is located between the first fan and the other of the two second fans, wherein the The casing further includes a plurality of side surfaces connected to the first side wall and the second side wall, and the side surfaces include three-side opening areas, and the three-side opening areas are respectively facing different directions. The heat dissipation structure of claim 1, wherein the vapor chamber includes a plurality of thermal conductive elements extending from the vapor chamber and passing through the airflow outlets of the two second fans. The heat dissipation structure of claim 1, wherein the three-side opening area includes a first side opening area adjacent to the first fan and is disposed on the uniform One side of the hot plate. The heat dissipation structure of claim 3, wherein the casing further includes at least one collapsible bracket disposed on the second side wall adjacent to the first side opening area, and the at least one bracket is separated by the first side opening area. An airflow is discharged from the side opening area. The heat dissipation structure of claim 4, wherein when the at least one bracket is unfolded, a height of one side of the casing is increased. The heat dissipation structure of claim 3, wherein a plurality of heat exchangers are disposed between the first side opening area and the first fan. The heat dissipation structure of claim 3, wherein the three-side opening area further includes two second side opening areas corresponding to the air flow outlets of the two second fans, and the vapor chamber includes a plurality of heat conductive elements formed by the vapor chamber. The hot plate extends and is disposed between the air flow outlets and the two second side opening areas. The heat dissipation structure of claim 7, wherein a plurality of heat exchangers are disposed between the two second side opening areas and the two second fans. The heat dissipation structure of claim 7, wherein the first side opening area faces a first direction, and the two second side opening areas face A second direction and a third direction that are opposite to each other. The heat dissipation structure of claim 1, wherein the chassis includes a plurality of third opening areas and a plurality of fourth opening areas respectively located on the first side wall and the second side wall and corresponding to the two second fans. The heat dissipation structure of claim 10, wherein the casing further includes a plurality of blocking blocks, which are disposed on the second side wall and are respectively located at the air flow outlets of the two adjacent second fans and between the fourth opening areas. The heat dissipation structure of claim 1 further includes a plurality of first baffles arranged to separate the two second fans and the vapor chamber. The heat dissipation structure of claim 12, wherein the first baffles are disposed inside the casing and connect one of the second side wall and the first side wall. The heat dissipation structure of claim 12, wherein the first baffles are arranged on a plurality of edges of the two second fans, and the edges connect the first side wall and the second side wall through the first baffles. One of the side walls. The heat dissipation structure as described in claim 1, wherein the two second The fan includes a plurality of second baffles partially surrounding a plurality of airflow inlets of the two second fans.

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