201146152 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種導風罩，尤指一種用於電腦散熱系統 分流式導風罩。 【先前技術】 ； [0002] 由於電子產業之快速升級，已發展出許多局精密度之電 子元件，該等電子元件隨著電腦技術之發展，其運作之 速度日益增加，其所產生之熱量亦隨之增加。CPU (中央 處理單元）等電子元件處理能力不斷升級，其散熱用之 ο 散熱裝置亦隨之多樣化，一般使用之散熱裝置文由散…、 器與風扇組合而成，散熱器其中—表面與電子元件接觸 ，另一表面形成複數具有一定間距之散熱鰭片，該散熱 鰭片之間形成氣流流道，而風扇設於與該散熱器氣流流 道相通之一側，從而加快其熱對流速度，然如此容易產 生熱氣流回流現象，影響散熱效率，造成系統不穩定或 者死機等現象。 ο _為避免減流回流_，，於线内設置一導風罩， 導風罩直接鎖固於系統外设上’系統外喊對應導風罩 之位置設有與外界相通之複數通孔，導風罩與散熱器之 間藉由一分別與該導風罩與散熱器連接之結構件相連接 ，從而藉由鎖固於系統外殼上之風扇，使進入系統内之 新鮮空氣及系統運作產生之高溫氣體’能夠經由導風罩 之導引以抽風方式排出系統外。然而此種導風裝置是利 用結構件分別與導風罩及散熱器連接，組裝時需經由多 次扣合才能組裝成體’因此不僅元件較多且扣合複雜 099118050 表單編號Α0101 第3頁/共13頁 0992031977-0 201146152 ，生產及組裝成本較高。 [0004] 對於伺服器，由於其内部功能模組之增加以及模組化之 設計，大量積體電路組合於一起，使得熱源增多，同時 使伺服器機箱内之散熱空間受到一定程度之限制，因此 散熱問題於伺服器中尤為突出。然而上述導風裝置僅形 成一中空罩體並單獨將冷空氣導向CPU，而與CPU相鄰之 記憶體卻無法接收到來自導風裝置之冷空氣，會使其散 熱不均，影響散熱效率。 【發明内容】 [0005] 鑒於以上内容，有必要提供一種結構簡單、成本較低且 能有效提高散熱效率之分流式導風罩。 [0006] 一種分流式導風罩，其具有一罩體，所述罩體被固定於 一機箱内，所述罩體具有一進風口與一出風口，所述罩 體内分別開設一第一導風通道與一第二導風通道，所述 出風口處相應於所述第一導風通道與第二導風通道開設 一第一出風開口與一第二出風開口，所述第一出風開口 與第二出風開口分別朝向所述機箱内之一第一發熱元件 與一第二發熱元件，以將來自於進風口之風流分別導向 所述第一發熱元件與第二發熱元件為其散熱。 [0007] 與習知技術相比，該分流式導風罩安裝於機箱内時，可 藉由所述第一導風通道與第二導風通道控制空氣氣流之 流動方向，分別為CPU與記憶體散熱，確保了伺服器之正 常運行，防止因過熱而死機造成伺服器中斷。 【實施方式】 099118050 表單編號A0101 第4頁/共13頁 0992031977-0 201146152 [0008] Ο =參閱圖1，本發明分流式導風罩之一較佳實施方式包括 體，所述罩體1〇被固定於一機箱2〇内，所述罩體 ίο具有—進風口u與一出風口 12。所述罩體u内分別開 又第導風通道與一第二導風通道，所述出風口 12處 相應於所述第—導風通道與第i導風通道開設一第一出 風開口 13與一第二出風開口 14。所述第一出風開口以與 第二出風開口 14分別朝向所述機箱2〇内之一第一發熱元 件21與第二發熱元件22，以將來自於進風口 11之風流 分別導向所述第一發熱元件21與第二發熱元件22為其散 熱。其中，所述第一發熱元件21包括一安裝於所述機箱 20内之中央處理器211與安裝於所述甲央處理器211上之 散熱器212，所述第二發熱元件22包括複數記憶體。所述 出風口 12與散熱器212之間裝詨一散熱風扇30。 [0009]請繼續參閱圖2，所述罩體1〇包括一進爲部15、一導風部 16及一出風部17。所述進風口 11與出風口12分別開設於 所述進風部15與出風部17上，所述導風部16連接於所述 進風部15與出風部11_間。所述進風部15包括一頂壁 151與垂直於所述頂壁151之兩側壁152。所述頂壁151之 後邊緣與兩侧壁152之間形成所述進風口 11。所述導風部 16包括一頂壁161、垂直於所述頂壁161之兩側壁162及 兩連接壁163。所述頂壁161對接所述頂壁151，兩連接 壁163分別連接相應之侧壁152與162。其中，所述導風 部16之寬度小於所述進風部15與出風部17之寬度。 [〇〇1〇] 所述出風部17包括兩相互平行之頂壁171、172、側壁 173、174、175、一傾斜壁176及一連接壁177。所述頂 099118050 表單編號A0101 第5頁/共13頁 0992031977-0 201146152 壁171對接頂壁161，所述侧壁173、174分別垂直於所述 頂壁171。所述側壁174連接所述頂壁171、172，所述侧 壁175垂直於頂壁172。所述連接壁177連接侧壁162、 175，所述傾斜壁176連接頂壁161、172。所述頂壁171 與側壁173、174之間形成所述第一導風通道，所述頂壁 172、側壁175及傾斜壁176之間形成所述第二導風通道 。其中，所述第一導風通道之高度高於所述第二導風通 道之高度。 [0011] 請參閱圖3，由於所述第一導風通道與第二導風通道控制 空氣氣流之流動方向，分別為散熱器212與第二發熱元件 22散熱，使得所述第二發熱元件22處之溫度亦大大降低 。藉由一業界熟知之電子產品熱分析軟體Icepak對所述 第二發熱元件22處之發熱效能進行仿真。模擬條件設定 為：初始環境溫度為35度，所述第二發熱元件22共包括 14根記憶體，每一根記憶體之散熱效率為4W。根據上述 之類比條件，應用本發明分流式導風罩後，得出之結果 為：所述第二發熱元件22之最高溫度為84. 051度。而沒 有應用本發明分流式導風罩時，所述第二發熱元件22之 最高溫度為104.805度。由此看出，改進後，所述第二發 熱元件22之最高溫度降低了將近20度，所述中央處理器 211與第二發熱元件22處之溫度均於系統允許之溫度範圍 内，確保了伺服器之正常運行，防止因過熱而死機造成 伺服器中斷。 [0012] 綜上所述，本創作確已符合發明專利要求，爰依法提出 專利申請。惟，以上所述者僅為本發明之較佳實施方式 099118050 表單編號A0101 第6頁/共13頁 0992031977-0 201146152 ，舉凡熟悉本發明技藝之人士，爰依本發明之精神所作 之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内 〇 [0013] 【圖式簡單說明】 圖1係本創作分流式導風罩較佳實施方式安裝於一機箱内 之立體分解圖。 [0014] 圖2係圖1中分流式導風罩之一立體圖。 [0015] 圖3係圖1之一立體組裝圖。 〇 【主要元件符號說明】 [0016] 罩體：10 [0017] 進風口 ： 11 [0018] 出風口 ： 12 [0019] 第一出風開口 ： 1 3 [0020] 第二出風開口 ： 14 ❹ [0021] 進風部：15 [0022] 導風部：16 [0023] 出風部：17 [0024] 機箱：20 [0025] 第一發熱元件：21 [0026] 第二發熱元件：22 [0027] 散熱風扇：30 099118050 表單編號A0101 第7頁/共13頁 0992031977-0 201146152 [0028] 頂壁：151、161、171、172 [0029] 侧壁：152、162、173、174、175 [0030] 連接壁：163、177 [0031] 傾斜壁：176 [0032] 中央處理器：211 [0033] 散熱器：212 0992031977-0 099118050 表單編號A0101 第8頁/共13頁201146152 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to an air hood, and more particularly to a split hood for a computer cooling system. [Prior Art] [0002] Due to the rapid upgrade of the electronics industry, many precision electronic components have been developed. With the development of computer technology, the speed of its operation is increasing, and the heat generated by it is also It will increase. The processing power of electronic components such as CPU (Central Processing Unit) is constantly upgrading, and the heat dissipation device is also diversified. The heat sink used in general is composed of a combination of a heat sink and a fan. The electronic component contacts, and the other surface forms a plurality of heat dissipating fins having a certain interval, and the air flow channel is formed between the heat dissipating fins, and the fan is disposed on one side of the airflow passage of the radiator to accelerate the heat convection speed thereof. However, it is easy to generate a phenomenon of hot air flow recirculation, affecting heat dissipation efficiency, causing system instability or crashes. ο _ In order to avoid the flow reduction _, an air hood is arranged in the line, and the air hood is directly locked on the system peripherals. The air hood and the heat sink are connected to each other by a structural member respectively connected to the air hood and the heat sink, so that the fresh air entering the system and the system are operated by the fan locked on the system casing. The high temperature gas 'can be exhausted out of the system via the guide of the air hood. However, the air guiding device is connected to the air guiding cover and the heat sink by using the structural members respectively, and the assembly is required to be assembled through multiple fastenings. Therefore, not only the components are large but also the fastening is complicated. 099118050 Form No. 1010101 Page 3 / A total of 13 pages 0992031977-0 201146152, the production and assembly costs are higher. [0004] For the server, due to the increase of the internal functional modules and the modular design, a large number of integrated circuits are combined to increase the heat source, and at the same time, the heat dissipation space in the server chassis is limited to a certain extent, The heat dissipation problem is particularly prominent in the server. However, the above air guiding device only forms a hollow cover and separately directs the cool air to the CPU, and the memory adjacent to the CPU cannot receive the cold air from the air guiding device, which causes uneven heat dissipation and affects heat dissipation efficiency. SUMMARY OF THE INVENTION [0005] In view of the above, it is necessary to provide a split type air hood that has a simple structure, a low cost, and can effectively improve heat dissipation efficiency. [0006] A split type air hood having a cover, the cover is fixed in a casing, the cover has an air inlet and an air outlet, and the first body respectively defines a first air outlet a first air outlet opening and a second air outlet opening corresponding to the first air guiding channel and the second air guiding channel, wherein the air guiding channel and the second air guiding channel open a first air outlet opening and a second air outlet opening, the first air outlet The air outlet opening and the second air outlet opening respectively face one of the first heating element and the second heating element in the chassis to guide the air flow from the air inlet to the first heating element and the second heating element respectively Its heat dissipation. [0007] Compared with the prior art, when the split air hood is installed in the chassis, the flow direction of the air flow can be controlled by the first air guiding channel and the second air guiding channel, respectively, for the CPU and the memory. The body heat dissipation ensures the normal operation of the server and prevents the server from being interrupted due to overheating. [Embodiment] 099118050 Form No. A0101 Page 4 / Total 13 Pages 0992031977-0 201146152 [0008] Referring to Figure 1, a preferred embodiment of the split hood of the present invention includes a body, the cover 1〇 It is fixed in a casing 2, and the cover has an air inlet u and an air outlet 12. And a second air guiding channel is defined in the cover body u, and a first air outlet opening 13 is defined in the air outlet 12 corresponding to the first air guiding channel and the ith air guiding channel And a second outlet opening 14. The first air outlet opening and the second air outlet opening 14 respectively face one of the first heating element 21 and the second heating element 22 in the chassis 2 to direct the airflow from the air inlet 11 to the The first heating element 21 and the second heating element 22 dissipate heat therefrom. The first heating element 21 includes a central processing unit 211 mounted in the chassis 20 and a heat sink 212 mounted on the central processing unit 211. The second heating element 22 includes a plurality of memory devices. . A heat dissipation fan 30 is disposed between the air outlet 12 and the heat sink 212. Referring to FIG. 2, the cover 1 includes an inlet portion 15, an air guiding portion 16, and an air outlet portion 17. The air inlet 11 and the air outlet 12 are respectively formed in the air inlet portion 15 and the air outlet portion 17, and the air guiding portion 16 is connected between the air inlet portion 15 and the air outlet portion 11_. The air inlet portion 15 includes a top wall 151 and two side walls 152 perpendicular to the top wall 151. The air inlet 11 is formed between the rear edge of the top wall 151 and the two side walls 152. The air guiding portion 16 includes a top wall 161, two side walls 162 perpendicular to the top wall 161, and two connecting walls 163. The top wall 161 abuts the top wall 151, and the two connecting walls 163 are respectively connected to the corresponding side walls 152 and 162. The width of the air guiding portion 16 is smaller than the width of the air inlet portion 15 and the air outlet portion 17. [1] The air outlet portion 17 includes two mutually parallel top walls 171, 172, side walls 173, 174, 175, an inclined wall 176, and a connecting wall 177. The top 099118050 Form No. A0101 Page 5 of 13 0992031977-0 201146152 The wall 171 abuts the top wall 161, which is perpendicular to the top wall 171, respectively. The side walls 174 connect the top walls 171, 172, which are perpendicular to the top wall 172. The connecting wall 177 connects the side walls 162, 175, and the inclined wall 176 connects the top walls 161, 172. The first air guiding passage is formed between the top wall 171 and the side walls 173, 174, and the second air guiding passage is formed between the top wall 172, the side wall 175 and the inclined wall 176. The height of the first air guiding channel is higher than the height of the second air guiding channel. [0011] Referring to FIG. 3, since the first air guiding channel and the second air guiding channel control the flow direction of the air airflow, the heat sink 212 and the second heat generating component 22 respectively dissipate heat, so that the second heat generating component 22 The temperature at the place is also greatly reduced. The heat generation performance at the second heating element 22 is simulated by an industry-recognized electronic product thermal analysis software Icepak. The simulation condition is set such that the initial ambient temperature is 35 degrees, and the second heating element 22 includes a total of 14 memories, and each of the memories has a heat dissipation efficiency of 4W. 051度。 The maximum temperature of the second heating element 22 is 84. 051 degrees. When the split type air hood of the present invention is not applied, the maximum temperature of the second heat generating element 22 is 104.805 degrees. It can be seen that, after the improvement, the maximum temperature of the second heating element 22 is reduced by nearly 20 degrees, and the temperatures of the central processing unit 211 and the second heating element 22 are within the temperature range allowed by the system, ensuring The normal operation of the server prevents the server from being interrupted due to overheating. [0012] In summary, the creation has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only the preferred embodiment of the present invention 099118050 Form No. A0101 Page 6 / Total 13 Page 0992031977-0 201146152, equivalent modifications made by those skilled in the art of the present invention in accordance with the spirit of the present invention </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; 2 is a perspective view of a split air hood of FIG. 1. 3 is a perspective assembled view of FIG. 1. 〇[Main component symbol description] [0016] Cover: 10 [0017] Air inlet: 11 [0018] Air outlet: 12 [0019] First air outlet: 1 3 [0020] Second air outlet: 14 ❹ [0021] Air inlet portion: 15 [0022] Air guiding portion: 16 [0023] Air outlet portion: 17 [0024] Chassis: 20 [0025] First heating element: 21 [0026] Second heating element: 22 [0027 ] Cooling fan: 30 099118050 Form number A0101 Page 7 / Total 13 pages 0992031977-0 201146152 [0028] Top wall: 151, 161, 171, 172 [0029] Side wall: 152, 162, 173, 174, 175 [0030] ] Connecting wall: 163, 177 [0031] Tilting wall: 176 [0032] Central processing unit: 211 [0033] Radiator: 212 0992031977-0 099118050 Form number A0101 Page 8 of 13