TWM566459U - Improved structure of heat dissipation device - Google Patents

Abstract

The present invention relates to a structural improvement of a heat dissipating device, comprising a base and a plurality of fins, wherein the base has a slanted flow guiding surface on one side thereof and is formed on the bottom surface of the base for abutting against the preset auxiliary The abutting portion of the heat dissipating component is further provided with a plurality of fins on the surface of the base, and each of the fins has a windward side on one side thereof, and an angle between the deflector surface and the windward side is formed at 90°. The angle between ~180°, when the fan blows cold air to the heat sink, it can provide cold air guiding through the diversion surface to slow down the direct impact of cold air on the heat sink and the preset auxiliary heat dissipating component. In turn, the wind resistance and the turbulent flow are reduced, so that the gas between the plurality of heat dissipation fins is stably discharged outward, so as to improve the heat dissipation efficiency of the heat dissipation device, thereby achieving the purpose of stable heat dissipation of the predetermined heating element.

Description

Structural improvement of heat sink

The present invention provides a structural improvement of a heat dissipating device, in particular, an angle formed between a flow guiding surface of a base of the heat dissipating device and a windward surface of the heat dissipating fin, and when the fan blows cold air to the heat dissipating device, the diversion can be utilized. The surface provides a diversion function to slow the impact of the cold air on the heat sink and the preset auxiliary heat dissipating component, thereby reducing the wind resistance and turbulence.

According to the rapid development of today's technology information, personal computers, electronic notebooks and notebook computers are widely used in various industries due to their powerful computing functions and speed. The advent of the Internet era has also led to the popularization of computers. The wafers and electronic components are equal to the heat generated during operation, forming a heat source, and the higher the thermal energy generated by the faster operation, the shorter the use of heat sources such as wafers or electronic components due to high heat, thereby shortening the use of wafers and electronic components. For the life, the heat source will be equipped with a heat sink to take away the heat generated by the heat source.

Please refer to the twelfth figure, which is a state diagram of the use of the conventional heat sink. It can be clearly seen from the figure that the conventional heat sink has a plurality of heat sink fins A made by stamping, which dissipate heat. The first plate body A1 and the second plate body A2 are bent in the same direction in the upper and lower sides of the fin A, and a channel A3 is formed between the first plate body A1 and the second plate body A2, and the plurality of heat dissipation fins A are formed. In order to utilize the bottom surface of the plurality of second plates A2 to be welded to the at least one heat pipe B, and the opening on the side of the channel A3 is opposite to the air outlet C1 of the fan C, when the preset is issued When the heat source (not shown) operates to generate thermal energy, its thermal energy is transmitted to at least one heat pipe B, and the heat energy is uniformly diffused and conducted by the heat pipe B, and then transmitted to the plurality of heat radiating fins A. The fan C can blow cold air from the air outlet C1 to the channel A3 of the plurality of heat dissipation fins A to take away the heat energy accumulated in the channel A3, thereby achieving the heat dissipation effect.

However, when the above plurality of heat dissipating fins A are actually used, they have the following disadvantages:

(1) The side of the plurality of heat dissipating fins A adjacent to the air outlet C1 of the fan C is flat, so when the fan C blows the cold air back and forth in the direction of the fins A, the cold air will Directly impacting the side of the heat sink fin A and the auxiliary heat dissipating component (heat pipe or temperature equalizing plate, etc.), so that the wind resistance and turbulence are generated, which affects the heat dissipation effect of the airflow between the plurality of channels A3, thereby causing the preset heat generation. The heat generated by the source cannot be effectively taken away, so that overheating may occur, damage may occur.

(2) The thickness of the second plate body A2 at the bottom of the heat dissipation fin A is very thin, so that heat cannot be effectively accumulated, so as to affect the heat dissipation effect of heat conduction.

(3) The heat derived from the general heat pipe B is difficult to transfer to the end, so only a small amount of heat can be conducted at the end of the heat pipe B to the heat sink fin A near the end, however, due to the two adjacent heat sink fins A A gap is formed between the second plate body A2, and a thermal resistance is generated in the gap. Therefore, when the heat dissipation fin A of the current side transmits heat to the heat dissipation fin A at the end, the heat is blocked by the gap. Conduction, resulting in the inability to effectively use the multiple heat sink fins A for heat dissipation.

Therefore, how to solve the above problems and problems in the past, that is, the creators of the case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.

Therefore, in view of the above-mentioned problems and deficiencies, the creators have collected relevant information, evaluated and considered them through multiple parties, and through years of experience in the industry, through continuous trial and modification, the structural improvement of such a heat sink device was designed. The new birth.

The main purpose of the present invention is that the base side of the heat sink is provided with a slanted flow guiding surface and is disposed between the auxiliary heat dissipating component and the fan, and is formed at the bottom surface of the base for abutting against the preset auxiliary. a plurality of heat-dissipating fins are disposed on the surface of the heat-dissipating component, and a plurality of heat-dissipating fins are disposed on the surface of the heat-dissipating fin, and a windward surface is disposed at one side of each of the heat-dissipating fins, and an angle is formed between the guiding surface and the windward surface At an angle between 90° and 180°, when the fan blows external cold air to the heat sink, it can provide external cold air diversion through the diversion surface to slow the external cold air directly hitting the auxiliary heat dissipating component. The wind guide originally blown to the auxiliary heat dissipating component flows to the heat dissipating device, thereby reducing the wind resistance and the turbulent flow, thereby the gas in the heat dissipating passage between the plurality of heat dissipating fins is stably and outwardly discharged to improve the heat dissipation. The purpose of heat dissipation efficiency of the device.

The secondary purpose of the present invention is that the base of the heat sink has a certain thickness to provide better heat storage capability, thereby effectively transferring heat from the external auxiliary heat dissipating component to all of the plurality of heat sink fins and then using The fan is taken away to prevent heat from accumulating on the external auxiliary heat dissipating component, thereby achieving the purpose of improving the heat transfer capability of the heat sink.

1‧‧‧heating device

11‧‧‧Base

111‧‧ ‧ diversion surface

1110‧‧‧ accommodating space

1111‧‧‧Uplift

112‧‧‧Relief Department

1121‧‧‧Abutment

113‧‧‧Positioning holes

12‧‧‧ Heat sink fins

120‧‧‧Solution channel

121‧‧‧ Windward side

122‧‧‧ top board

123‧‧‧floor

13‧‧‧ Cover

131‧‧‧Substrate

132‧‧‧ side panels

1321‧‧‧through hole

1322‧‧‧Locking components

2‧‧‧fan

21‧‧‧ body

210‧‧‧ accommodating space

211‧‧ vents

22‧‧‧ fan leaves

23‧‧‧ Cover

231‧‧‧Air inlet

232‧‧‧ tablets

3‧‧‧Auxiliary heat sink

Θ‧‧‧ angle

A‧‧‧heat fins

A1‧‧‧ first board

A2‧‧‧Second plate

A3‧‧‧ channel

B‧‧‧heat pipe

C‧‧‧fan

C1‧‧‧air outlet

The first figure is a three-dimensional appearance of the first embodiment of the creation.

The second figure is a perspective view of another perspective of the first embodiment of the creation.

The third figure is an exploded perspective view of the first embodiment of the creation.

The fourth drawing is a side cross-sectional view of the first embodiment of the creation.

The fifth drawing is a perspective view of the second embodiment of the creation.

The sixth drawing is a perspective view of another perspective of the second embodiment of the creation.

The seventh figure is an enlarged view of part a of the fifth part of the creation.

The eighth figure is a usage state diagram of the second embodiment of the creation.

The ninth drawing is a perspective view of the third embodiment of the creation.

The tenth figure is a perspective view of the fourth embodiment of the creation.

The eleventh figure is an exploded perspective view of the fifth embodiment of the creation.

The twelfth figure is a state diagram of the use of the conventional heat sink.

In order to achieve the above objectives and effects, the technical means and structure of the present invention are described in detail in the preferred embodiment of the present invention, and the features and functions are as follows.

Please refer to the first, second, third and fourth figures, which are the three-dimensional appearance of the first embodiment of the creation, the three-dimensional appearance of another perspective, the exploded view when used, and the side cross-sectional view during use. It can be clearly seen from the figure that the heat dissipating device 1 of the first embodiment of the present invention comprises a base 11 and a plurality of heat dissipating fins 12, wherein: the side of the base 11 is bent and has a inclined flow guiding surface. 111, and the swell portion 1111 is bent on the side of the flow guiding surface 111, and the accommodating space 1110 is formed at the bottom of the bulging portion 1111, and the abutting portion 112 having the flat abutting surface 1121 is further disposed at the bottom surface of the pedestal 11 .

The plurality of heat dissipation fins 12 are disposed on the surface of the base 11 and are A heat dissipation channel 120 is formed between the two adjacent heat dissipation fins 12, and a windward surface 121 is disposed at one side of each of the heat dissipation fins 12, and an angle θ is formed between the windward surface 121 and the flow guiding surface 111, and the angle θ is formed. The angle is between 90° and 180°, and the top plate 122 and the bottom plate 123 are bent in the same direction on the top surface and the bottom surface of the heat dissipation fin 12, respectively.

The plurality of heat dissipating fins 12 of the heat dissipating device 1 are preferably soldered to the pedestal 11 by using the bottom plate 123, so that the plurality of heat dissipating fins 12 are stably fixed on the top surface of the pedestal 11, but in practical applications, it is not As a limitation, the pedestal 11 and the plurality of heat dissipation fins 12 may be integrally formed, or may be integrated by welding, riveting, stamping, snapping, screwing, or clamping, but related to heat dissipation. There are many ways for the device 1 to form the pedestal 11 and the plurality of heat dissipating fins 12. Therefore, the structure that can achieve the aforementioned effects should be covered by the present invention. Such simple modification and equivalent structural changes should be included in the creation. Within the scope of the patent, it is given to Chen Ming.

Furthermore, the plurality of heat dissipating fins 12 of the heat dissipating device 1 are preferably disposed along a length direction parallel to the susceptor 11, but in practical applications, the plurality of fins 12 may be parallel or perpendicular to the pedestal 11 The slanting, bending, and S-shaped manners are disposed on the surface of the pedestal 11. However, the plurality of heat-dissipating fins 12 are disposed on the pedestal 11 in a variety of shapes and shapes, and only need to be respectively disposed on the pedestal 11 and the plurality of heat-dissipating fins. A flow guiding surface 111 having an angle θ and a plurality of windward surfaces 121 may be respectively disposed at one side of the sheet 12, so that any structure that can achieve the aforementioned effects should be covered by the present creation, such simple modification and equivalent structural change, It should be included in the scope of the patent of this creation, and it should be combined with Chen Ming.

The heat sink 1 of the present invention can be installed in a notebook computer, a mobile phone, a micro projector, a small drone or other external thin electronic device internal fan. 2, the base 11 is a flat-shaped abutting surface 1121 that can be used by the abutting portion 112 to abut against the external auxiliary heat dissipating member 3 (for example, a heat pipe or a Vapor Chamber). In the case of a heat pipe, the base 11 of the heat dissipating device 1 can utilize the accommodating space 1110 at the bottom of the bulging portion 1111 to bend the end of the heat pipe into the surface, and the other auxiliary heat dissipating component 3 is abutted against the other end surface. On the surface of a preset heating element (such as a central processing unit, an image processor or a wafer, etc.; not shown), when the predetermined heating element is heated, the heat generated by the operation of the predetermined heating element can be quickly and On average, the external auxiliary heat dissipating component 3 is conducted to the base 11 of the heat dissipating device 1 at the distal end, and the susceptor 11 is used to uniformly conduct heat to the plurality of heat dissipating fins 12, and the side of the heat dissipating device 1 is A fan 2 for dissipating heat can be disposed, and the fan 2 has a body 21, and an air outlet at a position facing the flow guiding surface 111 and the windward surface 121 is opened at a side of the accommodating space 210 inside the seat body 21. 211, further, inside the accommodating space 210, a fan blade 22 that can be electrically rotated is housed, and the seat is The cover body 23 is coupled to the body 21, and the air inlet 231 is disposed at the center of the cover body 23, whereby the fan 2 can be used to blow away heat generated by the predetermined heat generating component.

When the fan 2 is energized to rotate the blade 22, the external cold air can be sucked from the air inlet 231 of the cover 23, and the external cold air is discharged from the seat 21 by the rotation of the blade 22. The tuyere 211 is discharged outward, and is blown toward the heat dissipating device 1. Since the pedestal 11 side is bent and has a slanted flow guiding surface 111, the inclined guiding surface 111 provides a guiding effect. In order to reduce the force of the external cold air directly striking the external auxiliary heat dissipating component 3, thereby reducing the wind resistance and the turbulent flow, the external cold air will climb along the diversion surface 111 and from the two adjacent fins 12 The heat dissipation channel 120 is blown in to discharge the gas in the plurality of heat dissipation channels 120 stably and quickly outward, thereby dissipating the heat dissipation device 1 The accumulated heat is quickly guided to the external discharge, and the heat dissipation operation can be stably performed on various external auxiliary heat dissipating components 3 inside the external electronic device to reduce the temperature of the surface of the preset heating element, thereby achieving good heat dissipation effect, thereby preventing The preset heating element is burned and damaged due to the excessive operating temperature; as for the power supply of the fan 2 of the present invention to obtain the power supply, it is a technical field of the prior art, and therefore no further description is made for understanding.

Please refer to the fifth, sixth, seventh, and eighth figures, which are the three-dimensional external view of the second embodiment of the present invention, the three-dimensional external view of the second embodiment, the enlarged view of the fifth part, and the second For the state of use of the embodiment, it can be clearly seen from the figure that the pedestal 11 of the heat dissipation device 1 of the second embodiment of the present invention is integrally formed with the plurality of heat dissipation fins 12, and the surface of the susceptor 11 is formed by planing. (Skiving) to form a plurality of heat-dissipating fins 12 in a vertical shape. When the heat-dissipating fins 12 are formed by planing, the thickness X and the pitch Y of the heat-dissipating channels 120 can be reduced, and the thickness of the heat-dissipating fins 12 can be reduced. The thinnest X of the heat dissipation channel 120 may be 0.1 mm, and the thickness of the heat dissipation fins 12 of the heat dissipation device 1 may be thin, and the distance between the heat dissipation channels 120 between the two adjacent heat dissipation fins 12 may be It can be reduced, so that the number of the heat dissipation fins 12 and the heat dissipation channels 120 can be set up at the air outlet 211 of the fan 2, and when the fan 2 blows the external cold air into the plurality of heat dissipation channels 120, the heat dissipation fins 12 The number is large, so it will increase the contact with external cold air. Product, so as to be quickly plurality of heat dissipating fins 12 of the heat accumulation quickly away, because a larger number of complex cooling channel 120, and thus can effectively enhance the effect of heat convection, thereby to achieve the effect of lifting the overall rate of heat dissipation.

The side of the cover body 23 of the fan 2 has a sheet body 232 extending outwardly from the top surface of the heat dissipation fin 12, so as to be transparent to the outside air through the sheet body 232. The plurality of fins 12 flow out above.

The plurality of heat dissipating fins 12 of the heat dissipating device 1 are integrally formed on the surface of the susceptor 11. Compared with the first embodiment, the structural design of the bottom plate 123 can be omitted, so when the heat is conducted, the second The heat dissipating device 1 of the embodiment does not need to conduct heat to the bottom plate 123 first, and then conducts to the heat dissipating fins 12, so as to reduce the conduction path, thereby achieving the effect of improving the heat conduction efficiency.

Please refer to the ninth drawing, which is a perspective view of the third embodiment of the present invention. As can be clearly seen from the figure, the third embodiment of the present invention is comparable to the second embodiment. The plurality of heat dissipation fins 12 are disposed on the flow guiding surface 111, and the plurality of heat dissipation fins 12 on the surface of the flow guiding surface 111 can be transmitted to further enhance the heat dissipation effect.

Please refer to the tenth drawing, which is a perspective view of the fourth embodiment of the present invention. It can be clearly seen from the figure that the surface of the base 11 of the heat dissipating device 1 of the fourth embodiment of the present invention also utilizes a planing method (Skiving). The plurality of heat dissipating fins 12 are formed in a standing shape, and the windward surface 121 of the plurality of fins 12 is inclined so that the angle θ between the deflector 111 and the windward surface 121 is V-shaped. The inclined windward surface 121 can also provide a diversion function to alleviate the direct impact of the external cold air, and the V-shaped angle θ can provide the effect of collecting the pressurized air flow, thereby accelerating the external cold air. The conveyance is thereby achieved by increasing the heat dissipation rate.

Referring to FIG. 11 again, it is a perspective exploded view of the fifth embodiment of the present invention. As can be clearly seen from the figure, the fifth embodiment of the present invention can be further compared with the heat dissipating device 1 of the fourth embodiment. An outer cover 13 is assembled, and the outer cover 13 has a substrate 131 for covering the surface of the plurality of heat dissipation fins 12, and is bent and extended on opposite sides of the substrate 131 to cover the base. The plurality of side plates 132 on the outer side of the plurality of fins 12 and the plurality of fins 12, the outer cover 13 can also have a diversion function, thereby not affecting the good heat conduction and heat dissipation effect of the heat dissipating device 1.

The pedestal 11 of the heat dissipating device 1 has a plurality of positioning holes 113 recessed in the opposite side wall surfaces, and the two side plates 132 of the outer cover 13 are provided with a plurality of through holes 131 at the plurality of positioning holes 113. A locking member 1322 (eg, a screw) passes through the plurality of through holes 1321 to be locked in the plurality of positioning holes 113, thereby firmly bonding the outer cover 13 to the base 11, thereby further confining the outer cover 13 The base 11 is not easily loosened.

This creation has the following advantages:

(1) The flow guiding surface 111 of the pedestal 11 and the windward surface 121 of the heat dissipating fin 12 are opposite to the air outlet 211 of the seat body 21 of the fan 2, and an angle is formed between the air guiding surface 111 and the windward surface 121. θ, so when the fan 2 blows the external cold air to the heat dissipating device 1, the external cold air guiding action can be provided through the guiding surface 111 to slow the external cold air directly hitting the heat dissipating device 1 and the external auxiliary heat dissipating component 3 The force is blown to the heat sink 1 by blowing the wind current originally blown to the external auxiliary heat dissipating component 3, thereby reducing windage and turbulence, thereby stabilizing the gas in the heat dissipating passage 120 between the plurality of fins 12 Discharged outward to improve the heat dissipation efficiency of the heat dissipating device 1, and to avoid the occurrence of overheating, burning, etc. of the heating element.

(2) The susceptor 11 of the heat dissipating device 1 has a certain thickness, so that a better heat storage capability can be provided, and the heat on the external auxiliary heat dissipating component 3 can be efficiently conducted to all of the plurality of heat dissipating fins 12 Then, it is blown away by the fan 2 to prevent heat from accumulating on the external auxiliary heat dissipating component 3, and the heat can be uniformly transmitted and dispersed through the susceptor 11. The opening is further and evenly conducted to the plurality of heat dissipation fins 12, so that the plurality of heat dissipation fins 12 can be effectively utilized, thereby reducing the uneven heat distribution, thereby achieving the effect of improving the heat conduction capability of the heat dissipation device 1.

The above detailed description is intended to illustrate a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and other equivalents and modifications may be made without departing from the spirit of the invention. Changes are to be included in the scope of patents covered by this creation.

In summary, the structure of the heat sink of the present invention is improved in use, in order to achieve its efficacy and purpose, so the creation is a practical and excellent creation, in order to meet the requirements of the new patent application, 提出 apply according to law, I hope that the trial committee will grant this case as soon as possible to protect the hard work of the creators. If there is any doubt in the ruling committee, please do not hesitate to give instructions, the creators will try their best to cooperate and feel good.

Claims (11)

The structure of the heat dissipating device comprises a base and a plurality of heat dissipating fins, wherein: a side of the base is provided with an inclined flow guiding surface, and a bottom surface is formed at the bottom of the base for abutting And abutting portion on the auxiliary auxiliary heat dissipating component; the surface of the base is provided with a plurality of heat dissipating fins, and a windward surface is formed at one side of each of the heat dissipating fins, and an angle is formed between the windward surface and the guiding surface And the angle of the angle is between 90 ° and 180 °. The structural improvement of the heat dissipating device according to claim 1, wherein one side of the guiding surface is bent with a bulging portion, and an accommodating space for the predetermined auxiliary heat dissipating component to protrude into the bottom of the bulging portion is formed. The structural improvement of the heat dissipating device according to claim 1, wherein the surface of the flow guiding surface is provided with a plurality of heat dissipating fins. The structural improvement of the heat dissipating device according to claim 1, wherein the abutting portion of the base has a flat abutting surface. The structural improvement of the heat dissipating device according to claim 1, wherein the top surface and the bottom surface of the heat dissipating fin are respectively bent in the same direction to have a top plate and a bottom plate. The structural improvement of the heat dissipating device according to claim 1, wherein the heat dissipating fin is formed on the surface of the pedestal by means of planing. The structural improvement of the heat dissipating device according to claim 1, wherein the heat dissipating fin has a thickness of 0.1 mm. The structural improvement of the heat dissipating device according to the first aspect of the patent application, wherein the plurality of heat dissipating fins The windward side of one side of the sheet is inclined, and an angle between the windward surface and the flow guiding surface is formed in a V shape. The structural improvement of the heat dissipating device according to claim 1, wherein the two adjacent heat dissipating fins are formed with a heat dissipating passage, and the distance of the heat dissipating passage is at least 0.1 mm. The structural improvement of the heat dissipating device according to claim 1, wherein the base is assembled with an outer cover, and the outer cover has a substrate for covering the surface of the plurality of heat dissipating fins, and is bent on opposite sides of the substrate. The fold extends a plurality of side panels for covering the opposite side of the base and the plurality of fins. The structural improvement of the heat dissipating device according to claim 10, wherein the base is recessed with a plurality of positioning holes on the opposite side wall surfaces, and the two side plate pairs of the outer cover are provided with a plurality of through holes at the plurality of positioning holes And passing through the locking elements for locking in the plurality of positioning holes in each of the through holes.