200813693 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置’尤係指一種用於散熱發熱 電子元件熱量之散熱裝置。 …… 【先前技術】 中央處理器（CPU)等電子元件運行時産生大量餘熱， 而業界經常使用散熱器與電子元件接觸，達到電子元件上 籲的熱里得到擴散並增大散熱面積，而使其快速散熱降溫的 目的。一般，為了使散熱速度更快、使電子元件處於均勻 低溫周圍環境中，散熱器上還組裝一風扇進行主動散熱。 其中，散熱器是由熱傳導係數較高的金屬材料（銅、鋁等） 製成，由於金屬材料的導熱特性，不管散熱器的熱傳導係 數多高對應電子元件最近部分的熱量總是較集中而最高。 並且對應電子元件的散熱器底座及散熱鰭片表面與流體 鲁（風扇的乳流）之間具有一定的流體阻力而總是存有黏滯 層。該黏滞層可能導致散熱器底座及散熱縛片與氣流之間 的換熱效率下降，尤其對應電子元件的散熱器底座中部及 f散熱鰭片位置的温度較高，此處更有必要克服其黏滞層 ▼來的阻礙換熱的問題。 【發明内容】 有鑒於此有必要提供一種散熱效率較好之散熱裝置。 一種散熱裝置，包括—散熱器、風扇，該散熱器具有 200813693 *r 一導熱底座及底座上延伸形成的複數散熱鰭片，該等散熱 2片之間形成複數氣流通道，該風扇安裝於散熱器的盘氣 流通道相通之-方，該散熱器與風扇之間還設有一導^裝 置該V/瓜褒置至少包括一相對風扇氣流方向傾斜的導流 板。 瓜 ^述散熱裝置由於導流裝置的導流，使風扇部分氣流 向放熱器的指定之區域（高溫區），達到對散熱器不同區 鲁域具有不同密度或壓力之氣流，使得散熱器與氣流於單位 面積及時間内的換熱量增加，提升散熱裝置的散熱效率。 下面參照附圖，結合具體實施例對本發明作進一步描 述0 【實施方式】 月：閱圖1至圖4 ’本發明第一實施例的散熱裝置包括 放熱器10、安裝於散熱器1〇一側的風扇2〇、位於散埶器 10與風扇20之間的一導流裝置30以及將散熱器1〇、風二 瞟與導流裝置30共同罩設的罩體4〇。 該散熱器10具有-導熱底座；!^，該底座12底面形成一 凸出平面（未標示）供電子元件貼合，該底座山頁面中部 斜上向外延伸設有橫截面略呈乂字形的導熱翼部12，該導熱 翼部12内侧表面向上延伸設有與底座^表面垂直的複數第 -散㈣13，而該導熱翼部12兩外側表面向外側延伸設 ，與底座11表面平行的複數第二散熱韓片14，從而該導熱 翼部12將散熱器1〇頂面分成三散熱鰭片組。其中，各第一 7 200813693 散熱鰭片13之間和各第二散熱鰭片14之間均形成有氣流通 道，並且第一散熱鰭片13的頂端平齊，第二散熱鰭片14侧 向平齊，由於導熱翼部12的形狀而位於底座11中部的第一 散熱鰭片13之間的氣流通道最深直至底座11頂面。該導熱 翼部12的一端侧面及底座11側面分別設有供導流裝置40固 定的螺孔15、16。 該罩體40包括一頂壁41及頂壁41相對兩邊向下延伸的 二侧壁42，並形成兩個不同容積的容置空間，較小容積的 一容置空間43容納風扇20，另一容置空間（未標示）容納 散熱器10，進而罩體40安裝在散熱器10與風扇20上方後， 使散熱裝置整體形成一種只有相對兩端敞開的氣流通道。 該罩體40二侧壁42底緣向外延伸形成固定邊44，該固定邊 44上進一步設有固定散熱裝置於電路板的固定孔45。該罩 體40容置風扇20的一端周緣還設有供風扇20固定的固定角 4 6並設有供螺絲4 7螺合的螺孔4 8。 該導流裝置30包括第一導流板32和第二導流板34。該 第一導流板32具有矩形片狀本體320，該本體320相對散熱 器10向外向下延伸，其靠向散熱器10的邊緣彎折延伸形成 一折邊322，該折邊322兩端進一步延伸出固定耳324並於其 上設有固定孔326。該第二導流板34也具有矩形片狀本體 340，該本體相對散熱器向外斜上延伸，其靠向散熱器10的 邊緣彎折延伸設有二固定耳344並於其上設有固定孔346。 該二導流板32、34安裝於散熱器10上時，第一導流板32位 於下方，其二固定耳324向散熱器10第一散熱鰭片13方向延 8 200813693 伸配置並藉由螺絲35固定於散熱器10底座11上的螺孔16 中；第二導流板34位於上方對應於風扇20中部位置，其二 固定耳344與第一導流板32的固定耳324相向方向延伸配置 並藉由螺絲35固定於散熱器10的導熱翼部12上的螺孔15 中，從而二導流板32、34之間的空間在遠離散熱器10方向 逐漸擴大，形成一種從風扇至散熱器方向減縮的氣流通道 36。如圖4所示的氣流流動狀態（圖中箭頭為氣流方向）， 當風扇20於該二導流板32、34的外側鄰接並驅動時，使得 ⑩其部分氣流藉由氣流通道36朝散熱器1〇底座11中部（高溫 區）方向集中，風壓增大，克服黏滯層，進而使散熱器1〇 的高溫區的第一散熱鰭片13與氣流的熱交換率提升。其 中，位於氣流通道36下方的氣流流向散熱器10周圍的其他 電子元件上，而位於氣流通道36上方的氣流吹向散熱器10 較低溫區。 當然，上述二導流板的傾斜度以及固定方式分別可以 @根據需求適當的調整，只要使其組成的氣流通道滿足從風 扇至散熱器高溫區方向減縮即可。 請參閱圖5，本發明散熱裝置第二實施例的部分結構立 體圖。本實施例與第一實施例的主要區別是，將上述分開 的第一導流板32與第二導流板34進行一體化，形成一體式 的導流裝置50。該導流裝置50具有一框體52，該框體52包 括平行設置的長方形狀的上板522和下板524、以及連接該 上板522和下板524的二侧板526，該框體52高寬與風扇20大 小相匹配，其敞開的一端可安裝風扇20。該框體52的中間 9 200813693 設有一與侧板526垂直而與上板522和下板524具一定斜度 的導流板54，使框體52形成二上、下導流空間，該導流板 54相對散熱器10向外斜下延伸，在遠離風扇20方向上與下 板524的間距逐漸縮小，該框體52由導流板54與下板524間 距較小的一端與散熱器10鄰接。由於該導流裝置50的框體 52將風扇20的氣流完整的導入散熱器10上的作用，本實施 例可忽略第一實施例中所述的罩體40。 當然，本發明散熱裝置的導流裝置可根據需求進行適 ®當的改變，如第二實施例的導流板做成相對框體可活動 的，即根據需求將導流板相對框體旋轉擺動，改變其斜度； 或將該導流板相對框體上下移動，改變其相對散熱器的位 置及上下導流空間大小等等。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上該者僅為本發明之較佳實施例，舉凡熟 悉本案技藝之人士，在爰依本發明精神所作之等效修飾或 ⑩變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1是本發明第一實施例散熱裝置的立體分解圖。 圖2是圖1的立體組裝圖。 圖3是圖1中導流裝置的結構示意圖。 圖4是本發明第一實施例散熱裝置的氣流流向示意圖。 圖5是本發明第二實施例散熱裝置的部分結構立體圖。 【主要元件符號說明】 200813693 « 散熱器 10 底座 11 導熱翼部 12 第一散熱鰭片 13 第二散熱鰭片 14 螺孔 15,16,48 風扇 20 導流裝置 30,50 第一導流板 32 本體 320,340 折邊 322 固定耳 324,344 固定孔 326,346,45第二導流板 34 螺絲 35,47 氣流通道 36 罩體 40 頂壁 41 侧壁 42 容置空間 43 固定邊 44 固定角 46 框體 52 上板 522 下板 524 侧板 526 導流板 54 11BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipating device, particularly to a heat dissipating device for dissipating heat of an electronic component. ...... [Prior Art] When electronic components such as a central processing unit (CPU) operate, a large amount of residual heat is generated. In the industry, the heat sink is often in contact with electronic components, so that the heat in the electronic components is diffused and the heat dissipation area is increased. Its purpose of rapid cooling and cooling. Generally, in order to make the heat dissipation faster and the electronic components are in a uniform low temperature environment, a fan is also assembled on the heat sink for active heat dissipation. Among them, the heat sink is made of a metal material (copper, aluminum, etc.) with a high thermal conductivity. Due to the thermal conductivity of the metal material, no matter how high the heat transfer coefficient of the heat sink, the heat of the nearest part of the electronic component is always concentrated and highest. . Moreover, there is a certain fluid resistance between the surface of the heat sink corresponding to the electronic component and the surface of the heat sink fin and the fluid (the milk flow of the fan), and there is always a viscous layer. The viscous layer may cause a decrease in heat exchange efficiency between the heat sink base and the heat dissipation tab and the air flow, and in particular, the temperature of the middle portion of the heat sink base of the electronic component and the position of the fin fin is higher, and it is more necessary to overcome the temperature. The problem of heat transfer is hindered by the viscous layer ▼. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat dissipating device with better heat dissipation efficiency. A heat dissipating device includes: a heat sink and a fan, the heat sink has a heat-conducting base of 200813693 *r and a plurality of heat-dissipating fins extending on the base, and the plurality of heat-dissipating fins are formed between the two heat-dissipating fins, and the fan is mounted on the heat sink The disk air passage is connected to the side, and a heat guiding device is disposed between the heat sink and the fan. The V/shaped device includes at least a deflector inclined with respect to the fan airflow direction. According to the diversion of the flow guiding device, the fan part of the airflow is directed to the designated area (high temperature zone) of the radiator, and the airflow with different density or pressure is applied to the different zones of the radiator, so that the radiator and the airflow The heat exchange amount per unit area and time increases, and the heat dissipation efficiency of the heat sink is improved. The present invention will be further described with reference to the accompanying drawings in conjunction with the specific embodiments. FIG. 1 to FIG. 4 The heat dissipating device of the first embodiment of the present invention includes a radiator 10 and is mounted on the side of the radiator 1 The fan 2 is a flow guiding device 30 between the diffuser 10 and the fan 20, and a cover 4 that covers the heat sink 1 and the wind deflector 30 together with the deflector 30. The heat sink 10 has a heat-conducting base; the bottom surface of the base 12 forms a convex plane (not shown) for the electronic components to be attached, and the base of the base mountain page extends obliquely upward and has a cross-section slightly U-shaped. a heat conducting wing portion 12, the inner surface of the heat conducting wing portion 12 extends upwardly and has a plurality of first-scattering portions (four) 13 perpendicular to the surface of the base portion, and the outer side surfaces of the heat conducting wing portion 12 extend outwardly and are parallel to the surface of the base 11 The heat sink fins 14 are cooled, so that the heat conducting wings 12 divide the top surface of the heat sink 1 into three heat sink fin groups. An air flow channel is formed between each of the first 7 200813693 heat dissipation fins 13 and each of the second heat dissipation fins 14 , and the top ends of the first heat dissipation fins 13 are flush, and the second heat dissipation fins 14 are laterally flush. Due to the shape of the heat conducting wings 12, the air flow passage between the first heat radiating fins 13 in the middle of the base 11 is the deepest up to the top surface of the base 11. The one end side surface of the heat transfer fin portion 12 and the side surface of the base portion 11 are respectively provided with screw holes 15, 16 for fixing the flow guiding device 40. The cover body 40 includes a top wall 41 and two side walls 42 extending downwardly from opposite sides of the top wall 41, and two accommodating spaces of different volumes are formed. A small volume of the accommodating space 43 accommodates the fan 20, and the other The accommodating space (not shown) accommodates the heat sink 10, and after the cover 40 is mounted on the heat sink 10 and the fan 20, the heat sink integrally forms an air flow passage which is open only at opposite ends. The bottom edge of the two side walls 42 of the cover 40 extends outwardly to form a fixed edge 44. The fixed edge 44 is further provided with a fixing hole 45 for fixing the heat dissipation device to the circuit board. The cover 40 accommodates a peripheral end of the fan 20 and is provided with a fixed angle 46 for fixing the fan 20 and a screw hole 48 for screwing the screw 47. The flow guiding device 30 includes a first baffle 32 and a second baffle 34. The first baffle 32 has a rectangular sheet-like body 320. The body 320 extends outwardly and downwardly relative to the heat sink 10. The bent portion extends toward the edge of the heat sink 10 to form a flange 322. The flange 322 is further extended at both ends. The fixing ear 324 is extended and a fixing hole 326 is provided thereon. The second baffle 34 also has a rectangular plate-like body 340 extending obliquely outwardly with respect to the heat sink. The two-shaped fixing ears 344 are bent and extended toward the edge of the heat sink 10 and are fixed thereon. Hole 346. When the two baffles 32 and 34 are mounted on the heat sink 10, the first baffle 32 is located below, and the two fixing ears 324 extend toward the first heat dissipating fins 13 of the heat sink 10 and are arranged by screws. 35 is fixed in the screw hole 16 of the base 11 of the heat sink 10; the second baffle 34 is located above the middle portion of the fan 20, and the second fixing ears 344 extend in the opposite direction to the fixing ears 324 of the first baffle 32. And being fixed in the screw hole 15 of the heat conducting wing portion 12 of the heat sink 10 by the screw 35, so that the space between the two deflectors 32, 34 gradually expands away from the heat sink 10, forming a fan to the heat sink. The direction-reduced airflow passage 36. As shown in FIG. 4, the flow state of the airflow (the arrow in the figure is the direction of the airflow), when the fan 20 abuts and drives on the outer side of the two baffles 32, 34, so that part of the airflow 10 is directed toward the radiator by the airflow passage 36. 1〇 The central portion of the base 11 (high temperature region) is concentrated, and the wind pressure is increased to overcome the viscous layer, thereby increasing the heat exchange rate of the first heat radiating fins 13 in the high temperature region of the heat sink 1 to the airflow. The airflow under the airflow passage 36 flows to other electronic components around the heat sink 10, and the airflow above the airflow passage 36 is blown toward the lower temperature zone of the heat sink 10. Of course, the inclination and the fixing manner of the above two deflectors can be appropriately adjusted according to the requirements, as long as the airflow passages of the two guide plates are reduced in the direction from the fan to the high temperature region of the radiator. Referring to Figure 5, a partial structural perspective view of a second embodiment of the heat sink of the present invention is shown. The main difference between this embodiment and the first embodiment is that the above-mentioned separate first deflector 32 and second deflector 34 are integrated to form an integrated flow guiding device 50. The flow guiding device 50 has a frame 52 including a rectangular upper plate 522 and a lower plate 524 arranged in parallel, and two side plates 526 connecting the upper plate 522 and the lower plate 524. The frame 52 The height is matched to the size of the fan 20, and the open end can be fitted with the fan 20. The middle portion 9 200813693 of the frame 52 is provided with a baffle 54 perpendicular to the side plate 526 and inclined to the upper plate 522 and the lower plate 524, so that the frame 52 forms two upper and lower flow guiding spaces, and the diversion flow is realized. The plate 54 extends obliquely downward with respect to the heat sink 10, and the distance from the lower plate 524 is gradually reduced in a direction away from the fan 20. The frame 52 is adjacent to the heat sink 10 by a lower end of the baffle 54 and the lower plate 524. . Since the frame 52 of the flow guiding device 50 functions to completely introduce the airflow of the fan 20 into the heat sink 10, the cover 40 described in the first embodiment can be omitted in this embodiment. Of course, the flow guiding device of the heat dissipating device of the present invention can be modified according to requirements. For example, the baffle of the second embodiment is made movable relative to the frame, that is, the baffle is rotated relative to the frame according to requirements. , change its slope; or move the deflector up and down relative to the frame, change its position relative to the heat sink and the size of the upper and lower flow guiding space. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above is only a preferred embodiment of the present invention, and those skilled in the art will be able to devise the equivalent modifications or variations of the present invention within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of a heat sink according to a first embodiment of the present invention. Figure 2 is an assembled, isometric view of Figure 1. 3 is a schematic structural view of the flow guiding device of FIG. 1. Fig. 4 is a schematic view showing the flow of airflow of the heat dissipating device of the first embodiment of the present invention. Fig. 5 is a perspective view showing a partial structure of a heat sink according to a second embodiment of the present invention. [Main component symbol description] 200813693 « Radiator 10 base 11 heat conducting wing 12 first heat sink fin 13 second heat sink fin 14 screw hole 15, 16, 48 fan 20 flow guiding device 30, 50 first deflector 32 Main body 320, 340 Folding 322 fixing ears 324, 344 fixing holes 326, 346, 45 second baffle 34 screws 35, 47 air flow passage 36 cover 40 top wall 41 side wall 42 accommodating space 43 fixed side 44 fixed angle 46 frame 52 upper plate 522 lower plate 524 side plate 526 deflector 54 11