WO2022037329A1

WO2022037329A1 - Heat dissipation apparatus and communication device

Info

Publication number: WO2022037329A1
Application number: PCT/CN2021/106245
Authority: WO
Inventors: 郝旭峰; 李帅; 汪艳
Original assignee: 中兴通讯股份有限公司
Priority date: 2020-08-18
Filing date: 2021-07-14
Publication date: 2022-02-24
Also published as: CN212544428U

Abstract

A heat dissipation apparatus, comprising a radiator and a heat dissipation plate. The radiator (100) comprises a substrate (110) and a plurality of heat dissipation fins (120), wherein the plurality of heat dissipation fins (120) are arranged on the substrate (110); and the plurality of heat dissipation fins (120) are arranged spaced apart from each other, and adjacent heat dissipation fins (120) form a first channel (130). The heat dissipation plate (200) is arranged above the plurality of heat dissipation fins (120), and the heat dissipation plate (200) comprises heat dissipation ports (210) and air guide sheets (300), wherein the heat dissipation ports (210) are in communication with the first channels (130); the air guide sheets (300) are connected to the heat dissipation ports (210); and the air guide sheets (300) at least partially extend into the first channels (130).

Description

A kind of cooling device and communication equipment

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based on the Chinese patent application with the application number 202021742677.X and the filing date on August 18, 2020, and claims the priority of the Chinese patent application. The entire content of the Chinese patent application is incorporated herein by reference.

technical field

The present application relates to the field of heat dissipation technology, and in particular, to a heat dissipation device and a communication device.

Background technique

At present, in order to improve the heat dissipation capability, the communication devices on the market all use heat sinks containing heat sinks to dissipate heat. In order to increase the strength of the heat sink, prevent damage during transportation, and improve the thermal cascade caused by heat dissipation, a heat sink is usually installed on the top of the heat sink. The heat dissipation plate isolates the heat sink from the external environment, which can effectively avoid the above problems. However, adding a heat dissipation plate will reduce the heat exchange capacity, thereby affecting the heat dissipation effect.

SUMMARY OF THE INVENTION

The present application provides a heat dissipation device with enhanced heat exchange capability.

The following is an overview of the topics detailed in this article. This summary is not intended to limit the scope of protection of the claims.

According to a first aspect of the present application, there is provided a heat dissipation device, comprising: a heat sink and a heat dissipation plate; the heat sink includes a base plate and a plurality of heat dissipation fins, and a plurality of the heat dissipation fins are arranged on the base plate; The radiating fins are arranged at intervals from each other, and the adjacent radiating fins form a first channel; the radiating plate is arranged above a plurality of the radiating fins; The port is communicated with the first channel; the air guide fin is connected to the heat dissipation port, and the air guide fin at least partially extends into the first channel.

According to a second aspect of the present application, a communication device is provided, including the heat dissipation device of the first aspect of the present application.

Other features and advantages of the present application will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the present application. The objectives and other advantages of the application may be realized and attained by the structure particularly pointed out in the description, claims and drawings.

Description of drawings

FIG. 1 is a perspective view of a specific embodiment of a heat dissipation device in an embodiment of the present application;

FIG. 2 is a perspective view of a specific embodiment of a heat dissipation device in an embodiment of the present application;

Fig. 3 is the partial enlarged view of A place in Fig. 1;

FIG. 4 is a front view of a specific embodiment of the heat dissipation device in the embodiment of the present application.

Reference number:

100- heat sink, 110- base plate, 120- heat sink, 130- first channel, 200- heat sink plate, 210- heat sink, 300- air guide fin, 310- through hole, a- angle.

detailed description

In order to make the purpose, technical solutions and advantages of the present application more clearly understood, the present application will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. If there is no conflict, the embodiments in this application and the features in the embodiments may be combined with each other arbitrarily.

The terms "first", "second" and the like in the description and claims and the above drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that if the orientation description is involved, for example, the orientation or positional relationship indicated by up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and The description is simplified rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the application.

It should be noted that the meaning of several is one or more, the meaning of multiple is two or more, greater than, less than, exceeding, etc. are understood as not including this number, above, below, within, etc. are understood as including this number. If it is described that the first and the second are only for the purpose of distinguishing technical features, it cannot be understood as indicating or implying relative importance, or indicating the number of the indicated technical features or the order of the indicated technical features. relation.

The following disclosure provides many different embodiments or examples for implementing different aspects of the present application.

Referring to FIG. 1 to FIG. 4 , it is a heat dissipation device according to an embodiment of the present application.

First of all, it should be noted that the length direction of the heat sink 120 corresponds to the front-rear direction in the drawing, and the thickness direction of the heat sink 120 corresponds to the left-right direction in the drawing.

As shown in FIG. 1 and FIG. 2, a heat dissipation device includes a heat sink 100 and a heat dissipation plate 200; The fins 120 are spaced apart from each other, and the adjacent fins 120 form the first channel 130; the cooling plate 200 is arranged above the plurality of cooling fins 120; The channels 130 communicate with each other; the air guide fins 300 are arranged in the heat dissipation ports 210 , and the air guide fins 300 at least partially extend into the first channel 130 .

In this embodiment, the substrate 110 is provided with a plurality of heat sinks 120 . The heat sinks 120 are spaced apart from each other and are arranged side by side on the substrate 110 . The longitudinal direction is extended, or the substrate 110 may be extended in the width direction. A first channel 130 is formed between the adjacent heat sinks 120. After the cold air enters the heat sink 100 from the base plate 110, it can drive the hot air to flow upward from the first channel 130; The air may enter the first channel 130 through the heat dissipation port, so as to cool the heat dissipation fin 120 . The heat dissipation plate 200 can be made of aluminum alloy and is disposed above the heat dissipation fin 120 to isolate the heat dissipation fin 120 from the external environment, thereby avoiding damage to the heat dissipation fin 120 caused by external force during transportation. In order to improve the thermal cascading phenomenon of the heat sink 120 in the length direction, the heat dissipation port 210 may extend in the front-rear direction on the heat dissipation plate 200 , so that air can be blown from the heat dissipation port 210 to the heat sink 120 for cooling. Meanwhile, the heat dissipation port 210 allows the hot air in the heat sink 100 to be exhausted to the outside through the heat dissipation port 210 . The shape of the heat dissipation port 210 may be other opening shapes such as a rectangle, a rectangle with rounded corners, and the like. Through the heat dissipation ports 210 opened in the front-rear direction, the cold air can uniformly heat the heat sink 120 along the length direction of the heat sink 120 , thereby reducing the heat accumulation in the length direction of the heat sink 120 and improving the thermal cascade phenomenon of the heat sink 120 .

In order to guide the cold air into the radiator 100 from top to bottom from the heat dissipation port 210 , the heat dissipation port 210 is connected with an air guide fin 300 , and a part of the air guide fin 300 extends downward into the first channel 130 , so as to enter the heat dissipation port The cool air of 210 is guided to the cooling fins 120 . In some embodiments, one side of the air guide fin 300 is connected to a peripheral side of the heat dissipation port 210 , and the other side of the air guide fin 300 extends into the first channel 130 . For example, the air guide fins 300 may extend along the length direction of the heat dissipation port 210 . The channel 130 is inclined inwardly, so that at least part of the air guide fins 300 protrude into the first channel 130 , and at the same time, the stable connection of the air guide fins 300 with respect to the heat dissipation port 210 can be ensured. The air guide fins 300 can not only guide cold air into the heat sink 100 to cool the top of the heat sink 120 and the surface of the heat sink 120 , but also because the density of hot air in the heat sink 100 is relatively small, the air guide fins 300 can guide heat The air is discharged from the radiator 100 along the direction of the air guide fins 300 , and the rising of hot air and the sinking of cold air form air convection, thereby enhancing air heat exchange and further improving the heat dissipation performance of the radiator 100 . It should be noted that the shape of the heat sink 120 may be a single plate shape, or may be a curved surface shape with a certain arc, as long as it can guide air into and out of the heat sink 100 .

It should be noted that, the connection here can be a generalized connection, that is, the air guide fin 300 can be made by welding on the heat dissipation port 210, or it can be made by punching the heat dissipation plate 200 and integrally molding with the heat dissipation port 210. In this embodiment, the air guide fins 300 are formed by punching the heat dissipation plate 200, which can simplify the process flow and reduce the production cost.

Referring to FIG. 2 , in some embodiments, in order to increase the efficiency of air entering the heat sink 100 , a plurality of heat dissipation ports 210 are provided on the heat dissipation plate 200 . A plurality of cooling vents 210 may be provided at intervals along the front-rear direction and the left-right direction in the form of an array, and at the same time, a plurality of air guide fins 300 may be provided along the front-rear direction and the left-right direction. Compared with the single elongated heat dissipation port 210 and the air guide fin 300 in the front-rear direction, such a design can not only increase the disturbance to the air flowing into the heat dissipation port 210, but also help to improve the overall rigidity of the heat dissipation plate 200, so that the The heat dissipation plate 200 is not easily deformed based on the opening of the heat dissipation port 210 . A plurality of first channels 130 may be provided and communicated with a plurality of heat dissipation ports 210 . For example, when a plurality of heat dissipation ports 210 are provided at intervals along the front-rear direction, each first channel 130 may be located above the first channel 130 in conjunction with the first channel 130 . The plurality of radiating ports 210 arranged in the front-rear direction are communicated; when a plurality of radiating ports 210 are arranged in the left-right direction, each first channel 130 can communicate with the radiating ports 210 located above the first channel 130 at the same time, thereby, The air entered by the plurality of heat dissipation ports 210 flows in the radiator 100 through the first channel 210 , which not only increases the path of the air entering the heat sink 100 , but also allows the air to be located in the heat sink 100 through the plurality of heat dissipation ports 210 . The air has a disturbing effect and enhances the heat exchange efficiency.

Referring to FIG. 3 , in some embodiments, a plurality of through holes 310 are formed in the air guide plate 300 , for example, the through holes 310 may be formed along the length direction thereof. Under normal circumstances, both cold air and hot air enter and exit the radiator 100 through the heat dissipation port 210 and the air guide fins 300 for heat exchange. After the through holes 310 are provided, the through holes 310 can disturb the smooth flow of the cold air and the hot air. The flow rate of the air at the heat dissipation port 210 is increased, and the heat exchange capacity of the air is enhanced. Specifically, the through holes 310 may be rectangular through holes 310 , circular through holes 310 or through holes 310 of other shapes. The number of through holes 310 is related to the length of the air guide 300. When the length of the air guide 300 is longer, the number of through holes 310 can also be appropriately increased. The stronger the disturbance effect is, the faster the air velocity at the heat dissipation port 210 is.

4 , in some embodiments, in order to better guide air into and out of the heat dissipation port 210 and to better cool the heat dissipation fins 120 , the angle a between the air guide fins 300 and the heat dissipation port 210 is set to be less than 90°. The size of the included angle a is related to the size of the second channel 220. In some embodiments, the included angle a may be 30°, 60°, and in some embodiments, the included angle a is more likely to be 45° angle.

In some embodiments, in order to ensure that the heat dissipation plate 200 covers the heat dissipation fins 120 , the thickness of the heat dissipation plate 200 is 0.9 mm to 2 mm. The thinner heat dissipation plate 200 is beneficial to the heat dissipation performance of the overall heat dissipation device. However, if the thickness of the heat dissipation plate 200 is too thin, when too many heat dissipation ports are opened on the heat dissipation plate 200, the rigidity of the heat dissipation plate 200 will be reduced, and it is easy to deformed. Therefore, in some embodiments, the thickness of the heat dissipation plate 200 is 1 mm.

In some embodiments, in order to firmly fix the heat dissipation plate 200, the heat dissipation plate 200 may be fixed on the heat dissipation fin 120 by different connection methods, such as welding, bonding, screw connection and the like. In some embodiments, the heat sink 200 can be connected to the heat sink 120 by riveting. Since the heat sink 200 itself is made of aluminum alloy, the disassembly of the heat sink 200 can be facilitated by the connection by rivets. The material is mostly aluminum alloy, which reduces the weight of the heat sink 200 connected to the heat sink 120 to a certain extent.

In some embodiments, a plurality of heat sinks 120 are arranged side by side on the substrate 110 , and a first channel 130 is formed between adjacent heat sinks 120 . A heat dissipation plate 200 made of aluminum alloy is arranged above the heat sink 120 through rivets. The surface of the heat dissipation plate 200 is punched to form a rectangular heat dissipation port 210 and an air guide fin 300. The length direction of the 120 is appropriately extended, and the heat dissipation port 210 is located in the middle position just above the first channel 130 , so that the cold air entering from the first channel 130 can be discharged from the heat dissipation port 210 with heat. A plurality of heat dissipation ports 210 and air guide fins 300 are arranged in an array on the heat dissipation plate 200 along the length direction of the heat dissipation fin 120 and along the thickness direction of the heat dissipation fin 120 . The air guide is inclined at 45° along the direction of the heat sink 120 , which can guide cold air into the heat sink 100 to cool the heat sink 120 . A plurality of through holes 310 are formed on the surface of the air guide plate 300 along the length direction thereof, and the number of the through holes 310 is determined according to the length of the air guide plate 300 . The through holes 310 can play the role of turbulence when the air enters and exits, so that the air flow rate is increased and the heat exchange is improved.

A second embodiment of the present application provides a communication device. The communication device includes the heat dissipation device of the first embodiment of the present application. By installing the heat dissipation device in the communication equipment, the overall heat dissipation performance of the communication equipment can be increased, the failure caused by the overheating of the communication equipment can be prevented, and the competitiveness of the product can be improved.

The above is a specific description of some implementations of the application, but the application is not limited to the above-mentioned embodiments. Those skilled in the art can make various equivalent modifications or replacements without departing from the scope of the application. These equivalents Variations or substitutions of the above are all included within the scope defined by the claims of the present application.

Claims

A heat dissipation device includes a heat sink and a heat dissipation plate; wherein,

The heat sink includes a base plate and a plurality of heat sinks, and the plurality of heat sinks are arranged on the base plate; the plurality of heat sinks are arranged at intervals, and the adjacent heat sinks form a first channel;

The heat dissipation plate is arranged above the plurality of heat dissipation fins; the heat dissipation plate includes a heat dissipation port and an air guide fin;

the heat dissipation port communicates with the first channel;

The air guide fin is connected to the heat dissipation port, and the air guide fin at least partially extends into the first channel.
The heat dissipation device of claim 1, wherein the heat dissipation plate includes a plurality of the heat dissipation ports, and the first channel communicates with at least one of the heat dissipation ports.
The heat dissipation device according to claim 1 or 2, wherein the heat dissipation fin is vertically disposed on the base plate, and the heat sink includes a plurality of the first channels.
The heat dissipation device according to claim 1, wherein a plurality of through holes are provided on the air guide fins.
The heat dissipation device according to claim 1, wherein one side of the air guide fin is connected to a peripheral edge side of the heat dissipation port, and the other side of the air guide fin extends into the first channel.
The heat dissipation device according to claim 1, wherein the air guide fins are arranged obliquely with respect to the heat dissipation port.
The heat dissipation device according to claim 1, wherein the air guide fins are made by punching.
The heat dissipation device according to claim 1, wherein the thickness of the heat dissipation plate is 0.9 mm to 2 mm.
The heat dissipation device according to claim 1, wherein the heat dissipation plate is disposed above the heat dissipation fins by means of riveting.
A communication device, comprising the heat sink according to any one of claims 1 to 9.