201124691 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置，特別涉及一種對電子元件散 熱的散熱裝置。 【先前技術】 [0002] 隨著電子資訊產業的快速發展，中央處理器等發熱電子 元件高速、高頻及集成化使其發熱量劇增，如不及時排 除該等熱量，將引起發熱電子元件自身溫度的升高，進 而導致發熱電子元件的損壞或其性能的降低。因此，需 要對發熱電子元件進行散熱。目前，業者常用的散熱方 式為在發熱電子元件表面裝設一散熱裝置。 [0003] 習知的散熱裝置一般包括一散熱器、設於散熱器上的一 風扇及穿設於散熱器上的複數熱管。該散熱器包括複數 平行設置的散熱鰭片，每相鄰兩散熱鰭片之間形成一氣 流通道，各散熱鰭片上設有供熱管穿設的穿孔。所述熱 管的蒸發段與一發熱電子元件熱接觸，其冷凝段穿插於 散熱鰭片上的穿孔中。該發熱電子元件產生的熱量通過 所述熱管的蒸發段傳至其冷凝段，然後再進一步通過該 散熱器散發出去。然而由於散熱鰭片存在一定的熱阻， 因此，熱管周圍的散熱雜片的溫度較高，而由風扇產生 的氣流在流經熱管時，由於受熱管的阻擔，在熱管的後 方形成一空氣熱旋窩，不利於熱管的散熱，影響散熱裝 置的散熱效果。 【發明内容】 [0004] 有鑒於此，有必要提供一種散熱性能較佳的散熱裝置。 099100510 表單編號A0101 第4頁/共14頁 0992001098-0 201124691 [0005] 一種散熱裝置，包括一散熱器及穿設於該散熱器内的至 少一熱管，所述散熱器包括間隔設置的複數散熱片，每 相鄰的兩散熱片之間形成供氣流通過的氣流通道，每一 散熱片上設有供所述熱管穿設的一穿孔，每一散熱片於 靠近該穿孔的位置設有一導流結構，所述導流結構包括 圍繞所述穿孔的一側設置的一弧形壁，所述弧形壁迎著 該氣流通道内的氣流方向傾斜設置以將氣流通道内的氣 流導引至所述熱管處。 0 [0006] 與習知技術相比，上述散熱裝置在散熱片上靠近熱管的 位置處設置導流結構，且導流結構的弧形壁迎著該氣流 通道内的氣流方向傾斜設置，可以將氣流通道内的氣流 導引至所述熱管處，增強了熱管處的熱交換，減弱了熱 管後方的熱旋窩對散熱的影響，從而提升了該散熱裝置 的散熱效果。 【實施方式】 [0007] 以下參照附圖，對本發明散熱裝置予以進一步說明。 U [0008] 如圖1及圖2所示，該散熱裝置10包括一基板12、設於該 基板12上的一第一散熱器14、設於該第一散熱器14上的 一第二散熱器16及穿設於該基板12與該第一散熱器14及 第二散熱器16之間的兩根熱管18。 [0009] 該基板12呈矩形板狀，其具有一平整的下表面120及一與 該下表面120相對的上表面122。該上表面122上並排設 有兩個相互平行的橫直溝槽1 2 3。 [0010] 該第一散熱器14貼設於該基板12的上表面122上，其包括 099100510 表單編號A0101 第5頁/共14頁 0992001098-0 201124691 一底板140及由該底板140的頂面向上垂直延伸形成的複 數第一散熱片142。該底板140為一大小大於該基板12的 矩形板狀體，其於對應該基板12的溝槽123的左右兩端外 側的位置各設有兩個圓形的通孔143。 [0011] 該第二散熱器16設於該第一散熱器14的上方，其包括複 數上下堆疊的第二散熱片160，每相鄰的兩個第二散熱片 160之間形成一氣流通道162。每一第二散熱片16〇包括 一本體161及設於該本體丨61中部的一導流結構163。所 述本體161為矩形板狀，其與該第一散熱器14上的通孔 14 3對應的位置設有四個圓形的穿孔丨64。所述導流結構 163設於所述四個穿孔164的中間位置，並由各本體161 向上垂直延伸而成。該導流結構1@3凸出於本體161的高 度小於各氣流通道162的寬度’以在多個第二散熱片 組裝在一起時，該導流結構163的頂端與相鄰的另一第二 政熱片16 0間隔一定距離而不相碰觸◊所述導流結構丨6 3 大致為二角形’其包括一直壁165友南個弧形壁1 67，所 述直壁165與所述兩個弧形壁167相互連接成一三角形環 狀結構。所述直壁165設於所述四個穿孔164之間的後侧 位置’且由該第二散熱器1 6後侧的一個穿孔1 64附近向與 其相對的後側的另一穿孔164附近延伸。所述兩個弧形壁 167沿散熱片160的中部對稱設置，且分別與該第二散熱 器1 6左右兩側的兩個穿孔1 6 4相對。所述兩個弧形壁16 7 迎著該氣流通道162内的氣流方向傾斜設置，且於第二散 熱器16靠近前側的兩個穿孔164中間的位置相連接，所述 兩個弧形壁167相連接的一端位於散熱片！ 6〇的中部。每 099100510 表單編號A0101 第6頁/共14頁 0992001098-0 201124691 一弧形壁167由該連接位置分別圍繞所述第二散熱器16左 右兩側的兩個穿孔1 64向其後側的兩個穿孔1 64附近外擴 延伸，以將流過該乳流通道1 6 2内的氣流分別導引至該第 二散熱器16的左右兩側的兩個穿孔164處。 [0012] Ο [0013] Ο 所述兩根熱管18設於該基板12與該第一散熱器14及第二 散熱器16之間，其分別包括一蒸發段18 〇、由該蒸發段 180的兩端向上垂直延伸形成兩個冷凝段182。所述兩個 冷凝段182相互平行設置，並與該蒸發段18〇共同形成一υ 形。組裝時，所述兩根熱管18的蒸發段18〇分別收容於該 基板12的溝槽123内，其兩個冷凝段丨82分別穿設於該第 一散熱器14的四個通孔143及該·第二散熱器16的四個穿孔 1 64 内。 使用時，該散熱裝置10可與一風扇（圖未示）配合使用 ，该風扇可以為電腦的系統風扇，亦可以為裝在該散熱 裝置10的第二散熱器16一侧的風扇。請同時參閱圖3，該 風扇產生的氣流沿該散熱裝置丨〇的前側吹入流入該第二 散熱器16的氣流通道162内，由於該導流結構163的頂端 與相鄰的另一第二散熱片16〇間隔一定距離而不松碰觸， 使流經氣流通道〗62的氣流一部分被該導流結構丨63的兩 個弧开>壁167導引沿該氣流通道162向熱管18的冷凝段 182附近流動，使該第二散熱器16的熱量密集區内的熱量 快速地被氣流帶走，防止熱管18的後㈣成空氣熱旋涡 ’從而有利於提高該散熱裝置1〇的散熱效率；該氣流通 道162内的另一部分氣流沿著原來的方向繼續流動吹至 該導流結構163的直壁165後側，將該直壁165後側的第 099100510 表單編號A0101 第7頁/共14頁 0992001098-0 201124691 二散熱器16的熱量帶走。在本實施例中，該散熱裝置10 採用四個冷凝段182穿設於該第二散熱器16内的熱管18， 通過該導流結構163的設置可使氣流導引至該第二散熱器 16後側的兩個冷凝段182附近，即遠離風扇的氣流的兩個 冷凝段182附近有較多的氣流流過，防止位於其前側的兩 個冷凝段182的阻擋而形成氣流熱渦區。具體實施時，該 導流結構163亦適用於僅有一個或兩個冷凝段的熱管穿設 於該第二散熱器16内的散熱裝置，同時該導流結構163的 構造亦可根據該第二散熱器16内的冷凝段182的個數、佈 置情況以及風扇的氣流吹入的方向而作相應的變更，只 要能保證有一弧形壁迎著風扇的氣流方向，且圍繞所述 熱管的冷凝段傾斜設置即可。 [0014] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0015] 圖1為本發明一較佳實施例散熱裝置的立體分解圖。 [0016] 圖2為圖1的立體組裝圖。 [0017] 圖3為圖2的流場示意圖。 【主要元件符號說明】 [0018] 10:散熱裝置 [0019] 12 :基板 [0020] 14、16 :散熱器 099100510 表單編號A0101 第8頁/共14頁 0992001098-0 201124691 [0021] 18 :熱管 [0022] 120 :下表面 ' [0023] 122 :上表面 [0024] 123 :溝槽 [0025] 140 :底板 [0026] 142、160 :散熱片 [0027] ❹ 143 :通孔 [0028] 162 :氣流通道 [0029] 163 :導流結構 [0030] 164 :穿孔 [0031] 165 :直壁 [0032] 167 :弧形壁 [0033] 〇 180 :蒸發段 [0034] 182 :冷凝段 099100510 表單編號A0101 第9頁/共14頁 0992001098-0201124691 VI. Description of the Invention: [Technical Field] The present invention relates to a heat sink, and more particularly to a heat sink for dissipating heat from electronic components. [Prior Art] [0002] With the rapid development of the electronic information industry, high-speed, high-frequency and integration of heat-generating electronic components such as central processing units have caused a rapid increase in heat generation. If these heats are not removed in time, heat-generating electronic components will be caused. An increase in its own temperature, which in turn causes damage to the heat-generating electronic component or a decrease in its performance. Therefore, heat dissipation from the heat-generating electronic components is required. At present, the heat dissipation method commonly used by the industry is to install a heat sink on the surface of the heat-generating electronic component. [0003] A conventional heat sink generally includes a heat sink, a fan disposed on the heat sink, and a plurality of heat pipes disposed on the heat sink. The heat sink includes a plurality of heat dissipating fins disposed in parallel, and a gas flow passage is formed between each of the two adjacent heat radiating fins, and each of the heat dissipating fins is provided with a through hole for the heat pipe to pass through. The evaporation section of the heat pipe is in thermal contact with a heat generating electronic component, and the condensation section thereof is inserted into the through hole in the heat dissipation fin. The heat generated by the heat-generating electronic component is transferred to the condensation section through the evaporation section of the heat pipe, and then further radiated through the heat sink. However, since the heat dissipation fins have a certain thermal resistance, the temperature of the heat dissipation fins around the heat pipe is high, and when the airflow generated by the fan flows through the heat pipe, an air is formed behind the heat pipe due to the resistance of the heat pipe. The hot swirling nest is not conducive to the heat dissipation of the heat pipe and affects the heat dissipation effect of the heat sink. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide a heat sink having better heat dissipation performance. 099100510 Form No. A0101 Page 4 of 14 0992001098-0 201124691 [0005] A heat sink comprising a heat sink and at least one heat pipe disposed in the heat sink, the heat sink including a plurality of heat sinks spaced apart An air flow passage for airflow is formed between each adjacent two heat sinks, and each of the heat dissipation fins is provided with a through hole for the heat pipe to pass through, and each heat sink is provided with a flow guiding structure near the through hole. The flow guiding structure includes an arcuate wall disposed around one side of the perforation, the arcuate wall being inclined to face the airflow direction in the airflow passage to guide the airflow in the airflow passage to the heat pipe . [0006] Compared with the prior art, the heat dissipating device is provided with a flow guiding structure at a position on the heat sink near the heat pipe, and the curved wall of the guiding structure is inclined against the air flow direction in the air flow channel, and the air flow can be The airflow in the channel is guided to the heat pipe, which enhances the heat exchange at the heat pipe, and reduces the heat sinking effect of the heat pipe behind the heat pipe, thereby improving the heat dissipation effect of the heat sink. Embodiments [0007] Hereinafter, a heat sink according to the present invention will be further described with reference to the accompanying drawings. As shown in FIG. 1 and FIG. 2 , the heat dissipating device 10 includes a substrate 12 , a first heat sink 14 disposed on the substrate 12 , and a second heat sink disposed on the first heat sink 14 . The device 16 and the two heat pipes 18 are disposed between the substrate 12 and the first heat sink 14 and the second heat sink 16 . The substrate 12 has a rectangular plate shape with a flat lower surface 120 and an upper surface 122 opposite the lower surface 120. Two upper horizontal grooves 1 2 3 are arranged side by side on the upper surface 122. [0010] The first heat sink 14 is attached to the upper surface 122 of the substrate 12, which includes 099100510 Form No. A0101 Page 5 / 14 pages 0992001098-0 201124691 A bottom plate 140 and a top surface of the bottom plate 140 A plurality of first fins 142 are formed vertically extending. The bottom plate 140 is a rectangular plate-like body having a size larger than that of the substrate 12, and two circular through holes 143 are provided at positions on the outer sides of the left and right ends of the groove 123 corresponding to the substrate 12. The second heat sink 16 is disposed above the first heat sink 14 and includes a plurality of second heat sinks 160 stacked one above another, and an air flow passage 162 is formed between each adjacent two second heat sinks 160. . Each of the second fins 16 includes a body 161 and a flow guiding structure 163 disposed in the middle of the body 61. The body 161 has a rectangular plate shape, and four circular perforations 64 are provided at positions corresponding to the through holes 14 3 of the first heat sink 14. The flow guiding structure 163 is disposed at an intermediate position of the four through holes 164 and is vertically extended by the respective bodies 161. The flow guiding structure 1@3 protrudes from the body 161 by a height smaller than the width of each airflow passage 162 to make the top end of the flow guiding structure 163 and the adjacent other second when the plurality of second heat sinks are assembled together The hot film 16 0 is spaced apart by a certain distance without touching the flow guiding structure 丨 6 3 is substantially a quadrangular shape 'which includes a straight wall 165 south of the curved wall 167, the straight wall 165 and the two The curved walls 167 are connected to each other to form a triangular ring structure. The straight wall 165 is disposed at a rear side position 'between the four through holes 164 and extends from the vicinity of one of the through holes 1 64 on the rear side of the second heat sink 16 to the vicinity of the other through hole 164 on the rear side opposite thereto . The two arcuate walls 167 are symmetrically disposed along the middle of the heat sink 160 and are opposite to the two perforations 164 of the left and right sides of the second heat sink 16. The two curved walls 16 7 are disposed obliquely to the direction of the air flow in the air flow passage 162 and are connected at a position intermediate the two heat sinks 16 adjacent to the front side of the two through holes 164, the two curved walls 167 One end of the connection is located on the heat sink! 6 〇 middle. Every 099100510 Form No. A0101 Page 6 / Total 14 Pages 0992001098-0 201124691 A curved wall 167 is respectively surrounded by two perforations 1 64 on the left and right sides of the second heat sink 16 to the rear side of the second heat sink 16 The perforations 1 64 extend outwardly to guide the airflow flowing through the milk flow passages 162 to the two perforations 164 on the left and right sides of the second heat sink 16, respectively. [0012] Ο The two heat pipes 18 are disposed between the substrate 12 and the first heat sink 14 and the second heat sink 16 respectively, and respectively comprise an evaporation section 18 〇, by the evaporation section 180 The two ends extend vertically upward to form two condensation sections 182. The two condensation sections 182 are disposed in parallel with each other and form a meander shape with the evaporation section 18A. During the assembly, the evaporation sections 18 of the two heat pipes 18 are respectively received in the grooves 123 of the substrate 12, and the two condensation sections 82 are respectively disposed in the four through holes 143 of the first heat sink 14 and The second heat sink 16 has four perforations 1 64 therein. In use, the heat sink 10 can be used with a fan (not shown), which can be a system fan of the computer or a fan mounted on the side of the second heat sink 16 of the heat sink 10. Referring to FIG. 3 simultaneously, the airflow generated by the fan is blown into the airflow passage 162 flowing into the second heat sink 16 along the front side of the heat sink ,, because the top end of the flow guiding structure 163 is adjacent to another adjacent second. The fins 16 are spaced apart from each other by a distance so that a portion of the airflow flowing through the airflow path 62 is opened by the two arcs of the flow guiding structure 63. The wall 167 is guided along the airflow path 162 to the heat pipe 18. The heat is circulated around the condensing section 182, so that the heat in the heat-concentrated area of the second heat sink 16 is quickly taken away by the airflow, preventing the rear (four) of the heat pipe 18 from becoming a hot air vortex, thereby facilitating the heat dissipation efficiency of the heat sink 1〇. Another portion of the airflow in the airflow passage 162 continues to flow in the original direction to the rear side of the straight wall 165 of the flow guiding structure 163. The 099100510 on the rear side of the straight wall 165 is numbered A0101, page 7 of 14 Page 0992001098-0 201124691 The heat of the two radiators 16 is taken away. In the present embodiment, the heat dissipating device 10 is configured to pass through the heat pipe 18 disposed in the second heat sink 16 by the four condensation sections 182, and the airflow is guided to the second heat sink 16 by the arrangement of the flow guiding structure 163. Near the two condensation sections 182 on the rear side, i.e., near the two condensation sections 182 of the gas flow away from the fan, there is more gas flow therethrough, preventing the blocking of the two condensation sections 182 on the front side thereof to form a gas flow hot vortex zone. In a specific implementation, the flow guiding structure 163 is also applicable to a heat dissipation device in which the heat pipe having only one or two condensation sections is disposed in the second heat sink 16, and the structure of the flow guiding structure 163 may also be according to the second The number of the condensation sections 182 in the radiator 16 , the arrangement, and the direction in which the airflow of the fan is blown are changed accordingly, as long as a curved wall is provided to face the flow direction of the fan and the condensation section surrounding the heat pipe Tilt the settings. [0014] In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0015] FIG. 1 is an exploded perspective view of a heat sink according to a preferred embodiment of the present invention. 2 is an assembled, isometric view of FIG. 1. 3 is a schematic view of the flow field of FIG. 2. [Description of main component symbols] [0018] 10: Heat sink [0019] 12: Substrate [0020] 14, 16: Heat sink 099100510 Form No. A0101 Page 8 / Total 14 Page 0992001098-0 201124691 [0021] 18 : Heat pipe [ 0022] 120 : lower surface ' [0023] 122 : upper surface [0024] 123 : trench [0025] 140 : bottom plate [0026] 142, 160 : heat sink [0027] ❹ 143 : through hole [0028] 162 : air flow Channel [0029] 163: Diversion structure [0030] 164: Perforation [0031] 165: Straight wall [0032] 167: Curved wall [0033] 〇 180: Evaporation section [0034] 182: Condensation section 099100510 Form No. A0101 9 pages / total 14 pages 0992001098-0