1337699 099年10月19日修正替換頁 六、發明說明： 【發明所屬之技術領域】 ‘， [0001] 本發明涉及一種散熱裝置，尤其係指一種用於對電子元 件散熱之散熱裝置。 【先前技術】 [0002] 隨著電子產業之迅速發展，如電腦中電子元件之運算速 度大幅度提高，其產生之熱量亦隨之劇增，如何將電子 元件之熱量散發出去，以保證其正常運行，一直係業者 必需解決之問題。隨著近年來高頻圖像處理、無線通訊 等技術不斷發展，包括顯卡、視頻圖像卡（VGA卡）在内之 附加卡上電子元件之發熱量越'来:趫大丨例:奴_像卡，一 般包括一單獨之處理器，稱作:圖像"fc逆器（邸U)，其發熱 ιί/· 'W- '： 量亦相當大，如不能有效散熱將會景》響真正常運行。因 此，通常在GPU之表面安裝一散熱裝置進行散熱。該散熱 裝置一般包括與GPU接觸之散熱器及設於散熱器頂部之風 扇，該散熱器包括一基座及設於該基座上之複數散熱片 。風扇運轉時其產生之氣流吹過散熱器之散熱片並與散 熱片進行熱交換，從而將散熱器從GPU吸收之熱量散發。 然，該散熱器之底座往往係金屬實體與電子元件接觸， 電子元件產生之熱量從熱源中心向散熱裝置四周慢慢擴 散，直接影響了整個散熱裝置之散熱速度，同時，金屬 實體之底座很大程度上加大散熱器之質量。 [0003] 因此，需要設計一種散熱裝置，該散熱裝置可以將電子 元件產生之熱量更加快速、均勻地分佈至整個散熱裝置 096124620 表單編號A0101 第4頁/共18頁 0993373644-0 1337699 099年10月19日後正替換頁 【發明内容】 [0004] 本發明旨在提供一種可快速、有效對電子元件進行散熱 之散熱裝置。 ’ [0005] 一種散熱裝置，用以對一電路板上之電子元件進行散熱 ，其包括一基座、排列在該基座上之一散熱片組及安裝 在該基座上並位於該散熱片組一側之一風扇，該基座内 嵌置有一完全覆蓋於該電子元件頂部之均熱板，該均熱 板為一内封有工作介質之平板形熱管。 [0006] 與習知技術相比，上述散熱裝置之均熱板為一高效導熱 之平板形熱管且完全覆蓋於該電子元件頂部，故該電子 元件產生之熱量能完全被該均熱板吸妃並迅速均勻地分 佈在整個均熱板，在傳導到整個散熱片組上，最後通過 該風扇產生之氣流經過散熱片組内之氣流通道而快速將 熱量帶走，從而達到快速冷卻電子元件之效果。 【實施方式】 [0007] 圖1至圖2揭示了本發明一實施例中之散熱裝置，該散熱 裝置用於對電路板上（圖未示）之電子元件（圖未示） 進行散熱。該電路板可以係顯卡、視頻圖像卡或主機板 等，其上安裝之電子元件可以係圖片處理晶片等高功率 電子元件，該等電子元件在運行時會釋放出大量熱量， 需被及時地冷卻以確保其正常運行。 [0008] 該散熱裝置包括一基座10、安裝於該基座10—端之一風 扇20、排列於該基座10上之一散熱片組20和罩設於該風 扇30及散熱片組2 0上之一蓋體4 0。 096124620 表單編號A0101 第5頁/共18頁 0993373644-0 1337699 的9年仞月 [0009] 如圖3-5所示，上述基座10包括一基板11及嵌置在該基板 11内之一均.熱板13。該基板11由導熱性能良好且密度較 小之金屬材料如鋁形成，其一端形成一大致呈圓形凹陷 之安裝部110，該安裝部110中間開設一供安裝風扇3〇之 安裝通口 1102 ’該通口 1102周圍開設有與螺釘1〇〇配合 以安裝該風扇3 0之三配合孔11〇4 »該基座20中間偏向另 一端處設置一供該均熱板13嵌入之缺口 112，該缺口 112 之大小形狀與均熱板13相適配，該缺口 112邊緣之下半部 分形成向缺口 1 12中心内凸伸之凸簷1120，且該凸簷 1120在靠近該缺口 11〇之各個角落處向該缺口 η〗中心内 凸伸之長度較其它之長度長，以保、證聲固琢支撐該均熱 板13。違基板11在靠近該安袭部1 .l.'.Q，之.兩角..落上設置有與 基板Π長度方向平行之複數散熱择片114 ’該等散熱鰭片 114垂直於該基板11，且它們之長度由該基板11兩側向中 間遞減。該基板1 1在靠近各邊緣處均勻開設有從該基板 11上表面向下凹陷之複數階孔116，該等階孔116供固定 件（圖未示）穿過而將該散熱裝置安裝在電路板上。請 特別參閱圖4 ’該基板11在靠近各邊緣處均勻開設有從該 基板11下表面向上凹陷之複數固定孔117，該等固定孔 117供螺桿件200穿過並與該蓋體40螺合，以將該蓋體4〇 固定在該基座10上。特別參閱圖5，該基板u底部在該缺 口 112—角落附近向内凹陷形成一條形容置部118，該容 置部118沿該該缺口 112之對角線延伸。 [0010] 上述均熱板13為一平板形熱管，其内封裝有工作介質， 故相對實體金屬板體來說具有導熱性能好及質量小之優 096124620 表單編號A0101 第6頁/共18頁 0993373644-0 1337699 099年l〇月19日庚正雜頁」 點。該均熱板13大體呈矩形，其形狀大小與該基板丨丨之 缺口 112相匹配，以容置於該缺口 η〗内。該均熱板a之 上表面為一平面，其i面中間部分向下浮凸，而其底面 靠近各邊緣部分向上凹陷形成環繞該中間部分之凹陷部 130，該凹陷部130之形狀與基板112之凸簷112〇互補， 正好承接在該凸簷1120上使該均熱板13之上下表面分別 與β玄基板11之上下表面在同一面上。該均熱板η之一個 角上沿對角線向外凸伸一條形封口部132，該封口部132 在该均熱板13容置在該基板11之缺口 112處時容置在該基 板11底面之容置部118内》 [0011]請再次參閱圖2，上散熱片組20大致呈扇形，其包括由導 熱性能良好之金屬銅或鋁片等製成之複數散熱片22，該 等散熱片22由靠近該風扇30之一端向該基板11另一端延 伸’其上下邊緣各垂直向同側延伸有折邊220。該等折邊 220形成該散熱片組2〇之上下表面，該下表面通過焊接或 枯貼等方式固定在該基板丨丨及均熱板13共同形成之平面 上。該等折邊220之寬度從散熱片22靠近該風扇30—端向 遠離該風扇30之另一端逐漸增大，從而使每相鄰兩散熱 片22之間形成之空氣通道由散熱片22靠近該風扇30之一 端向遠離該風扇30之另一端逐漸增大》該散熱片組20中 間之散熱片22長度較靠向兩側之散熱片22長，其靠近該 風扇30之一端在該等散熱片22形成之氣流通道入口處形 成一圓弧形端面而包圍該風扇30，遠離該風扇30之另一 端在氣流流道出口處由其中間之散熱片22向兩侧呈階梯 狀遞減，其中向前側之遞減程度大於向後側遞減之程度 096124620 表單編號Α0101 第7頁/共18頁 0993373644-0 1337699 099年10月19日梭正替換頁 。該散熱片組20之氣流通道之出口相對於其入口呈發散 狀，故能將從該入口進入氣流通道中之氣流通過該出口 均勻地分佈到周圍環境中。 [0012] 上述風扇30為一軸流式風扇，其通過一三角固定架（未 標號）安裝在該基板11之安裝部110上。 [0013] 上述蓋體40由塑膠材料製成，其包括一頂板42及從該頂 板42邊緣垂直向下延伸之侧板44。該頂板42之形狀和該 基板11之形狀相對應，其覆蓋除該基板11 一端之散熱鰭 片114以外之其他部分。該頂板42之一端對應該風扇30處 開設有一圓形氣流入口 420，以供該風扇30在運轉時將周 ... .VT...戈:.... 圍之空氣從中吸入。該頂板42.垂直向汰延伸形成有複數 螺筒422，該等螺筒422間隔地分稀在读现k42之周緣， 並分別與該基板11之固定孔117對應，以供螺桿件200穿 過該固定孔11 7以與該螺筒422螺合而將該蓋體40固定在 該基座10上。該側板44之高度與該頂板42之螺筒422之 高度一致，略大於散熱片組20之高度，其在遠離該氣流 入口之一端之前側角落附近形成有一氣流出口 440，以供 該風扇30產生之氣流與該散熱片組20進行熱交換後被從 中排出。 [0014] 請再次參考圖1及圖2，上述散熱裝置在組裝狀態時，該 散熱熱片組20之底面通過焊接或粘貼等方式固定在該基 座10上面，該風扇30安裝在該基座10之安裝部110上， 該蓋體40覆蓋該散熱片組20及風扇30上面，並通過其螺 筒422與穿過該基座10固定孔117之螺桿件200螺合而固 定在該基座10上。 096124620 表單編號A0101 第8頁/共18頁 0993373644-0 1337699 099年ID月19日修正替換頁 [0015] 上述散熱裝置在工作時，通過固定件穿過該基座10之階 孔116固定到電路板上，該基座10均熱板13之底面可以與 一個或多個電子元件接觸，可以在該均熱板13底面與電 子元件頂面之間塗抹導熱膠以增強導熱效果，還可以在 該散熱裝置與電路板之間墊設絕緣膠片以起到絕緣及緩 衝作用。由於該均熱板11為一高效導熱之板形熱管，故 該電子元件產生之熱量能被該均熱板11吸收並迅速均勻 地分佈在整個均熱板，在傳導到整個散熱片組2 0上，最 後通過該風扇30產生之氣流經過散熱片組20内之氣流通 道而快速將熱量帶走，從而達到快速冷卻電子元件之效 果。此外，該散熱片組20圍繞該風扇30呈放射狀，該等 散熱片2 2之間之氣流通道由靠近該風扇3 0之一端向遠離 該風扇30之另一端逐漸變寬，從而減小氣流在氣流通道 中之空氣阻力，加快散熱速度。 [0016] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0017] 圖1係本發明散熱裝置之一實施例之立體組合圖。 [0018] 圖2係圖1中散熱裝置之立體分解圖。 [0019] 圖3係圖2中基座之立體組合圖。 [0020] 圖4係圖2中均熱板之倒置視圖。 [0021] 圖5係圖3中基座之倒置視圖。 096124620 表單編號A0101 第9頁/共18頁 0993373644-0 1337699 【主要元件符號說明】 [0022] 基座：10 [0023] 基板：11 [0024] 安裝部：110 [0025] 通口 ： 1102 [0026] 配合孔：1104 [0027] 缺口 ： 11 2 [0028] 凸簷：1120 [0029] 散熱鰭片：114 [0030] 階孔：116 [0031] 固定孔：117 [0032] 容置部：118 [0033] 均熱板：13 [0034] 凹陷部：13 0 [0035] 封口部：13 2 [0036] 散熱片組：20 [0037] 散熱片：22 [0038] 折邊：220 [0039] 風扇：3 0 [0040] 蓋體：40 表單編號A0101 096124620 第10頁/共18頁 099年10月19日修正替換頁 0993373644-0 1337699 099年10月19日按正替换頁 [0041] 頂板：42 [0042] 氣流入口 ： 42 0 [0043] 螺筒：422 [0044] 側板：44 [0045] 氣流出口 ： 440 [0046] 螺釘：100 [0047] 螺桿件：200 096124620 表單編號A0101 第11頁/共18頁 0993373644-01337699 Revision of the replacement page on October 19, 099. Description of the Invention: [Technical Field of the Invention] ‘, [0001] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from an electronic component. [Prior Art] [0002] With the rapid development of the electronics industry, such as the speed of computing electronic components in computers has increased dramatically, the heat generated by them has also increased dramatically. How to dissipate the heat of electronic components to ensure their normal operation. Operation, the problem that must be solved by the system. With the continuous development of high-frequency image processing, wireless communication and other technologies in recent years, the heat generated by electronic components on additional cards including video cards and video image cards (VGA cards) is more: Like a card, it usually includes a separate processor called: image "fc counter (邸U), which heats up ιί/· 'W- ': the amount is also quite large, such as unable to effectively dissipate the scene It works fine. Therefore, a heat sink is usually mounted on the surface of the GPU for heat dissipation. The heat sink generally includes a heat sink in contact with the GPU and a fan disposed on the top of the heat sink. The heat sink includes a base and a plurality of heat sinks disposed on the base. When the fan is running, the airflow generated by it blows through the heat sink of the heat sink and exchanges heat with the heat sink, thereby dissipating the heat absorbed by the heat sink from the GPU. However, the base of the heat sink is often in contact with the electronic component by the metal body, and the heat generated by the electronic component slowly diffuses from the center of the heat source to the periphery of the heat sink, directly affecting the heat dissipation speed of the entire heat sink, and at the same time, the base of the metal body is large To a greater extent, the quality of the radiator. [0003] Therefore, there is a need to design a heat sink that can distribute the heat generated by electronic components more quickly and evenly to the entire heat sink 096124620. Form No. A0101 Page 4 of 18 Page 0993373644-0 1337699 October 1099 [19] The present invention aims to provide a heat sink that can quickly and efficiently dissipate heat from electronic components. [0005] A heat dissipating device for dissipating heat from an electronic component on a circuit board, comprising a base, a heat sink group disposed on the base, and mounted on the base and located on the heat sink A fan on one side of the group, the base is embedded with a heat equalizing plate completely covering the top of the electronic component, and the heat equalizing plate is a flat heat pipe with a working medium sealed therein. [0006] Compared with the prior art, the heat equalizing plate of the heat dissipating device is a high-efficiency heat-conducting flat-plate heat pipe and completely covers the top of the electronic component, so that the heat generated by the electronic component can be completely sucked by the soaking plate. And quickly and evenly distributed throughout the soaking plate, which is conducted to the entire heat sink group, and finally the airflow generated by the fan passes through the airflow passage in the heat sink group to quickly carry away the heat, thereby achieving the effect of rapidly cooling the electronic components. . [Embodiment] FIG. 1 to FIG. 2 disclose a heat dissipating device for dissipating heat from an electronic component (not shown) on a circuit board (not shown) according to an embodiment of the present invention. The circuit board can be a video card, a video image card or a motherboard, etc., and the electronic components mounted thereon can be high-power electronic components such as image processing chips, and the electronic components release a large amount of heat during operation, which needs to be timely Cool to make sure it is working properly. [0008] The heat dissipating device includes a base 10, a fan 20 mounted on the base 10, a heat sink group 20 disposed on the base 10, and a cover 30 and a heat sink group 2 One of the covers 40 on the 0. 096124620 Form No. A0101 Page 5 of 18 Page 9993373644-0 1337699 9 years of the month [0009] As shown in FIG. 3-5, the susceptor 10 includes a substrate 11 and one of the substrates 11 embedded therein. . Hot plate 13. The substrate 11 is formed of a metal material having a good thermal conductivity and a low density, such as aluminum, and a mounting portion 110 having a substantially circular recess is formed at one end thereof, and a mounting port 1102 for mounting the fan 3 is opened in the middle of the mounting portion 110. The through hole 1102 is provided with a matching hole 11〇4 for mounting the fan 30. The base 20 is disposed at the other end and is provided with a notch 112 for the heat equalizing plate 13 to be embedded. The notch 112 is sized to fit the heat equalizing plate 13, and the lower half of the edge of the notch 112 forms a tenon 1120 that protrudes toward the center of the notch 1 12, and the tenon 1120 is adjacent to each corner of the notch 11 The length protruding into the center of the notch η is longer than the other lengths to support and support the heat-receiving plate 13 . The substrate 11 is disposed adjacent to the attack portion 1 .1.'.Q. The two corners are provided with a plurality of heat-dissipating fins 114 that are parallel to the longitudinal direction of the substrate '. The heat-dissipating fins 114 are perpendicular to the substrate. 11, and their length is decreased from the both sides of the substrate 11 toward the middle. The substrate 11 is uniformly provided with a plurality of holes 116 recessed downward from the upper surface of the substrate 11 near the edges, and the holes 116 are inserted through the fixing member (not shown) to mount the heat sink on the circuit. On the board. Referring to FIG. 4 in detail, the substrate 11 is uniformly provided with a plurality of fixing holes 117 recessed upward from the lower surface of the substrate 11 near the edges, and the fixing holes 117 are passed through the screw member 200 and screwed into the cover 40. The cover 4 is fixed to the base 10. Referring to FIG. 5, the bottom of the substrate u is recessed inwardly near the corner of the opening 112 to form a strip-shaped receiving portion 118 extending along a diagonal line of the notch 112. [0010] The above-mentioned heat equalizing plate 13 is a flat-plate heat pipe, which is packaged with a working medium, so that it has good thermal conductivity and small quality relative to the solid metal plate body. 096124620 Form No. A0101 Page 6 / Total 18 Page 0993373644 -0 1337699 099 〇月19日庚正杂页" Point. The heat equalizing plate 13 is substantially rectangular in shape and has a shape matching with the notch 112 of the substrate to be received in the notch η. The upper surface of the heat equalizing plate a is a flat surface, the intermediate portion of the i-plane is downwardly convex, and the bottom surface thereof is recessed upwardly adjacent to the edge portions to form a recess portion 130 surrounding the intermediate portion. The shape of the recess portion 130 and the substrate 112 are The tenons 112 are complementary, and are received on the tenon 1120 such that the upper surface of the heat equalizing plate 13 is on the same surface as the upper surface of the upper surface of the β-shaped substrate 11. A strip-shaped sealing portion 132 is protruded outwardly from a corner of the heat equalizing plate η. The sealing portion 132 is received on the substrate 11 when the heat-receiving plate 13 is received at the notch 112 of the substrate 11. In the receiving portion 118 of the bottom surface, please refer to FIG. 2 again. The upper fin group 20 is substantially fan-shaped, and includes a plurality of heat sinks 22 made of metal copper or aluminum sheets having good thermal conductivity, and the like. The sheet 22 extends from one end of the fan 30 toward the other end of the substrate 11 and has a folded edge 220 extending perpendicularly to the same side of the upper and lower edges thereof. The hem 220 forms an upper surface of the fin group 2, and the lower surface is fixed to a plane formed by the substrate 均 and the heat equalizing plate 13 by welding or pasting. The width of the hem 220 is gradually increased from the end of the heat sink 22 adjacent to the fan 30 toward the other end of the fan 30, so that the air passage formed between each adjacent two fins 22 is close to the air passage 22 by the heat sink 22 One end of the fan 30 gradually increases away from the other end of the fan 30. The heat sink 22 in the middle of the heat sink group 20 is longer than the heat sink 22 on both sides, and is adjacent to one end of the fan 30 in the heat sink. A circular arc-shaped end surface is formed at the inlet of the airflow passage formed at 22 to surround the fan 30, and the other end of the airflow passage 30 is stepped downward from the middle fins 22 at the outlet of the airflow passage, wherein the front side The degree of decline is greater than the degree of decline to the back side 096124620 Form No. 101 0101 Page 7 / Total 18 Page 0993373644-0 1337699 On October 19, 099, the shuttle is replacing the page. The outlet of the airflow passage of the fin group 20 is divergent with respect to its inlet so that the airflow entering the airflow passage from the inlet can be evenly distributed into the surrounding environment through the outlet. [0012] The fan 30 is an axial fan which is mounted on the mounting portion 110 of the substrate 11 via a triangular holder (not shown). [0013] The cover 40 is made of a plastic material and includes a top plate 42 and side plates 44 extending vertically downward from the edge of the top plate 42. The top plate 42 has a shape corresponding to the shape of the substrate 11, and covers other portions than the heat radiating fins 114 at one end of the substrate 11. One end of the top plate 42 defines a circular airflow inlet 420 corresponding to the fan 30 for allowing the fan 30 to draw air from the ... VT... The top plate 42 extends vertically to form a plurality of barrels 422 which are spaced apart at the periphery of the reading k42 and respectively correspond to the fixing holes 117 of the substrate 11 for the screw member 200 to pass through. The fixing hole 117 is screwed to the barrel 422 to fix the cover 40 to the base 10. The height of the side plate 44 coincides with the height of the screw barrel 422 of the top plate 42 and is slightly larger than the height of the heat sink group 20, and an air outlet 440 is formed in the vicinity of the side corner away from the one end of the air flow inlet for the fan 30 to be generated. The airflow is discharged from the heat sink group 20 after being exchanged. [0014] Referring again to FIG. 1 and FIG. 2, when the heat dissipating device is in an assembled state, the bottom surface of the heat dissipating heat pack 20 is fixed on the base 10 by soldering or pasting, and the fan 30 is mounted on the base. The cover 40 covers the heat sink group 20 and the upper surface of the fan 30, and is fixed to the base by screwing the screw 422 with the screw member 200 passing through the fixing hole 117 of the base 10. 10 on. 096124620 Form No. A0101 Page 8 of 18 0993373644-0 1337699 099 ID month 19 correction replacement page [0015] The above heat sink is fixed to the circuit through the stepped hole 116 of the base 10 through the fixing member during operation. On the board, the bottom surface of the heating plate 13 of the base 10 can be in contact with one or more electronic components, and a thermal conductive adhesive can be applied between the bottom surface of the heat equalizing plate 13 and the top surface of the electronic component to enhance the heat conduction effect. An insulating film is placed between the heat sink and the circuit board to provide insulation and buffering. Since the heat equalizing plate 11 is a highly heat-conductive plate-shaped heat pipe, heat generated by the electronic component can be absorbed by the heat equalizing plate 11 and quickly and evenly distributed throughout the heat equalizing plate, and transmitted to the entire heat sink group 20 Finally, the airflow generated by the fan 30 passes through the airflow passage in the heat sink group 20 to quickly carry away the heat, thereby achieving the effect of rapidly cooling the electronic components. In addition, the heat sink group 20 is radially surrounding the fan 30, and the air flow passage between the heat sinks 2 2 is gradually widened from one end of the fan 30 toward the other end of the fan 30, thereby reducing airflow. The air resistance in the air flow passage speeds up the heat dissipation. [0016] In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0017] FIG. 1 is a perspective assembled view of an embodiment of a heat sink of the present invention. 2 is an exploded perspective view of the heat sink of FIG. 1. 3 is a perspective assembled view of the susceptor of FIG. 2. 4 is an inverted view of the soaking plate of FIG. 2. [0021] FIG. 5 is an inverted view of the susceptor of FIG. 3. 096124620 Form No. A0101 Page 9 of 18 0993373644-0 1337699 [Description of main component symbols] [0022] Base: 10 [0023] Substrate: 11 [0024] Mounting: 110 [0025] Port: 1102 [0026 Fit hole: 1104 [0027] Notch: 11 2 [0028] Coil: 1120 [0029] Heat sink fin: 114 [0030] Step hole: 116 [0031] Fixing hole: 117 [0032] Housing: 118 [ 0033] Heated plate: 13 [0034] Depression: 13 0 [0035] Sealing part: 13 2 [0036] Heat sink set: 20 [0037] Heat sink: 22 [0038] Folding: 220 [0039] Fan: 3 0 [0040] Cover: 40 Form No. A0101 096124620 Page 10 of 18 October 19, 1999 Amendment Replacement Page 0993373644-0 1337699 October 19, 1999 Press Replacement Page [0041] Top Plate: 42 [ 0042] Airflow inlet: 42 0 [0043] Bore: 422 [0044] Side panel: 44 [0045] Air outlet: 440 [0046] Screw: 100 [0047] Screw: 200 096124620 Form No. A0101 Page 11 of 18 Page 0993373644-0