TWI501719B - Heat dissipation device - Google Patents

Description

Heat sink

The invention relates to a heat dissipating device, in particular to a heat dissipating device for dissipating heat from an electronic component.

With the continuous improvement of the power of electronic components such as a central processing unit (CPU), the problem of heat dissipation has received more and more attention, especially in notebook computers.

Generally, the industry installs heat sinks on the circuit board to dissipate heat-generating electronic components disposed on the circuit board. As shown in FIG. 1, the heat sink generally includes a heat pipe 30 in thermal contact with the electronic component, a fin set 40 thermally coupled to the heat pipe 30, and a fan 50 on a side of the fin set 40. The fin set 40 is formed by stacking a plurality of mutually spaced, parallel fins. The fan 50 has an air inlet and an air outlet. The fan 50 draws cold air from its surroundings through its air inlet, and the sucked cold air blows toward the cooling air vent and cools the heat sink. However, in the heat dissipating device, the heat pipe 30 and the fin group 40 are combined in such a manner that one end of the heat pipe 30 penetrates into the welding fin group 40, and when the airflow flows through the heat sink, the position where the heat pipe 30 and the fin group 40 are combined The airflow is prevented from flowing out of the fin set 40, thereby disturbing the flow direction of the airflow, which greatly affects the heat dissipation efficiency of the heat sink.

FIG. 2 shows another heat dissipating device in the prior art, in which one end of the heat pipe 30 is welded to the upper surface of the fin group 40. This combination can reduce the flow direction of the air pipe 30 to disturb the air flow of the air outlet. However, it will greatly increase the thickness of the heat sink, which will additionally occupy the space of the computer host in the up and down direction. .

In view of this, it is necessary to provide a heat dissipating device with high heat dissipation efficiency and space saving.

A heat dissipating device includes a centrifugal fan, a heat pipe and a fin set thermally connected to one end of the heat pipe, the fan includes an air outlet, the fin set is disposed at the air outlet, and the fin set includes a plurality of fins a heat dissipating fin, the edge of each of the heat dissipating fins is bent to form at least one folded edge, the heat dissipating fins are stacked on each other in a direction of a central axis of the fan, and the folded edges of the heat dissipating fins abut each other to form a fan a side surface parallel to the central axis direction, the heat pipe is in thermal contact with the side surface of the fin set, wherein the centrifugal fan comprises a frame and an impeller mounted in the fan frame, the fan frame comprises a bottom plate and a bottom plate a cover plate and a side wall between the bottom plate and the cover plate, wherein the air outlet is disposed on the side wall, and the corresponding impeller is provided with a first air inlet port, and the fin group is sandwiched between the fan cover Between the bottom plate and the bottom plate, one end of the fin group is concavely formed with an arc-shaped notch, and the notch of the fin group is close to the impeller of the fan.

Compared with the prior art, in the heat dissipating device of the present invention, since one end of the heat pipe is in thermal contact with the side surface of the fin group, the air flow generated by the fan is not interfered by the heat pipe during the flow along the heat dissipating fin. Blocking, thereby maintaining a high heat dissipation efficiency of the heat sink; in addition, since one end of the heat pipe is in thermal contact with the side of the fin group, no additional space is occupied in the up and down direction, and the total thickness of the heat sink can be reduced.

10‧‧‧ radiator

12‧‧‧Heat plate

13‧‧‧ Thermal medium

14, 30‧‧‧ heat pipe

16, 40‧‧‧Fin set

20, 50‧‧‧ fans

22‧‧‧Fan frame

24‧‧‧ Impeller

26‧‧‧Base

28‧‧‧ Cover

122‧‧‧Fixed parts

142‧‧‧Evaporation section

144‧‧‧Condensation section

162‧‧‧Fins

164‧‧‧Folding

165‧‧‧ first side

166‧‧‧ second side

168‧‧‧ gap

202‧‧‧air outlet

260‧‧‧floor

262‧‧‧ side wall

280‧‧‧first air inlet

282‧‧‧through hole

2021‧‧‧Part 1

2022‧‧‧Part II

2600‧‧‧second air inlet

2602‧‧‧ Fixed seat

2620‧‧‧Bump

1 and 2 are schematic views of a heat sink in a prior art.

Figure 3 is an assembled view of a heat sink in accordance with a preferred embodiment of the present invention.

Figure 4 is an exploded view of the heat sink of Figure 3.

Referring to FIG. 3, a heat dissipating device according to a preferred embodiment of the present invention can dissipate heat from an electronic component (not shown) mounted on a motherboard (not shown). The heat sink includes a heat sink 10 and a centrifugal fan 20.

Referring to FIG. 4 , the fan 20 includes a frame 22 and an impeller 24 located in the frame 22 . The frame 22 includes a base 26 and a cover 28 that is disposed on the base 26. A first air inlet 280 is disposed on the cover plate 28, and a plurality of through holes 282 are defined in the periphery of the cover plate 28. The base 26 includes a bottom plate 260 and a side wall 262 extending vertically upward along the outer edge of the bottom plate 260. A second air inlet 2600 is disposed in the middle of the bottom plate 260. The second air inlet 2600 is opposite to the first air inlet 280. A fixing seat 2602 is disposed in the second air inlet 2600, and the impeller 24 is fixed on the fixing seat 2602. An air outlet 202 is disposed on the side wall 262 of the base 26, and the air outlet 202 includes a first portion 2021 and a second portion 2022. The first portion 2021 and the second portion 2022 are respectively linear, and the angle between the first portion 2021 and the second portion 2022 is an obtuse angle. The air outlet 202 is disposed perpendicular to the first air inlet 280 and the second air inlet 2600. The upper end surface of the side wall 262 of the base 26 forms a plurality of protrusions 2620 corresponding to the through holes 282 of the cover plate 28 for fixing the cover plate 28 to the side wall 262 of the base 26 through the through hole 282 of the cover plate 28, so that the cover plate Together with the base 26, 28 forms a chamber (not numbered) that houses the impeller 24.

The heat sink 10 includes a heat absorbing plate 12, a heat pipe 14, and a fin set 16. The heat pipe 14 is pressed into a flat shape having an evaporation section 142 and a condensation section 144. The evaporation section 142 has a planar upper surface and a planar lower surface. The upper and lower surfaces of the evaporation section 142 are parallel to the horizontal plane, and the lower surface of the evaporation section 142 is in thermal contact with the upper surface of the heat absorbing plate 12. The condensation section 144 has a front side parallel to each other and a The rear side and the rear side of the condensation section 144 are perpendicular to the upper and lower surfaces of the evaporation section 142, and the rear side of the condensation section 144 is in thermal contact with a side of the fin set 16.

The heat absorbing plate 12 is made of a heat conductive material such as iron or aluminum. The lower surface of the heat absorbing panel 12 is in thermal contact with electronic components on the motherboard. Two fixing members 122 are disposed on opposite sides of the upper surface of the heat absorbing plate 12 for mounting the heat absorbing plate 12 on the main board.

The fin set 16 is formed by stacking a plurality of mutually spaced, parallel fins 162. A flange 164 is formed on each of the front and rear opposite sides of each of the heat dissipation fins 162. The heat dissipation fins 162 are stacked one above another along the central axis of the fan 20, and the flanges 164 of the adjacent heat dissipation fins 162 abut each other to form a fin group. The first and second sides 165, 166 are opposite to each other. The first and second side faces 165, 166 are respectively parallel to the direction of the central axis of the fan 20. One end of each of the heat dissipation fins 162 near the fan 20 is cut away to form an arcuate notch 168 such that the length of the second side 166 is smaller than the length of the first side 165. A plurality of air flow passages (not labeled) are formed between the left and right sides of each of the adjacent heat dissipation fins 162, and the air flow passages are arranged in the upper and lower directions. When assembled, the fin set 16 is disposed at the air outlet 202 of the fan 20, wherein the first side 165 of the fin set 16 is aligned with the second portion 2022 of the air outlet 202 and away from the second portion 2022. The direction of the air outlet 202 extends outwardly, and the second side 166 and the end of the first portion 2021 of the air outlet 202 away from the second portion 2022 are in contact with each other and extend outwardly. The notch 168 of the fin group 16 is adjacent to the fan 20 Impeller 24. The rear side of the condensation section 144 of the heat pipe 14 is in thermally conductive contact with the first side 165 of the fin set 16 by a heat conductive medium 13 for transferring heat to the fin set 16, utilizing a larger heat dissipation area of the fin set 16 Heat is released into the surrounding air.

When the heat sink is in operation, the heat absorbing plate 12 absorbs heat generated by the electronic component, and the heat pipe 14 The absorbed heat is transferred to the fin set 16. The fan 20 simultaneously draws outside air from the first air inlet 280 and the second air inlet 2600 into a chamber formed by the cover plate 28 and the base 26, and the airflow is blown along the first portion 2021 of the air outlet 202 by the impeller 24. The fin sets 16 are blown out along the air flow path between the fins 162. Since the condensation section 144 of the heat pipe 14 is attached to the front side of the fin set 16, the airflow is not disturbed by the interference of the heat pipe 14 during the flow along the air flow path between the fins 162, thereby maintaining the heat sink Higher heat dissipation efficiency. In addition, the condensation section 144 of the heat pipe 14 is attached to the front side of the fin set 16 without occupying an extra space in the up and down direction, so that the total thickness of the heat sink can be reduced.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧ radiator

12‧‧‧Heat plate

14‧‧‧heat pipe

16‧‧‧Fin set

20‧‧‧Fan

122‧‧‧Fixed parts

142‧‧‧Evaporation section

144‧‧‧Condensation section

Claims (6)

A heat dissipating device includes a centrifugal fan, a heat pipe and a fin set thermally connected to one end of the heat pipe, the fan includes an air outlet, the fin set is disposed at the air outlet, and the fin set includes a plurality of fins The heat dissipating fins are bent to extend at least one of the edges of the fins. The improvement is that the fins are stacked on each other along the central axis of the fan, and the fins of the fins abut each other. Forming a side parallel to a direction parallel to a central axis of the fan, the heat pipe being in thermal contact with a side of the fin set, wherein the centrifugal fan includes a frame and an impeller mounted in the fan frame, the fan frame including a bottom plate, a cover plate and a side wall between the bottom plate and the cover plate, wherein the air outlet is disposed on the side wall, and the corresponding impeller is provided with a first air inlet port, and the fin group is sandwiched by Between the cover plate of the fan and the bottom plate, one end of the fin set is concavely formed with an arc-shaped notch, and the notch of the fin set is close to the impeller of the fan. The heat dissipating device according to claim 1, wherein the heat pipe has a flat evaporation section and a flat condensation section, the evaporation section has a planar lower surface, and the lower surface of the evaporation section is used for absorption. The heat generated by the heat source has a side that is perpendicular to the lower surface of the evaporation section, and the side of the condensation section is in thermal contact with the side of the fin set. The heat dissipating device of claim 2, further comprising a heat absorbing plate, the upper surface of the heat absorbing plate being in thermal contact with the lower surface of the evaporation section of the heat pipe, the lower surface of the heat absorbing plate being for thermally contacting the heat source. The heat dissipating device of claim 1, wherein a second air inlet is disposed in the middle of the bottom plate, the second air inlet is opposite to the first air inlet, and a fixed seat is disposed in the second air inlet. The impeller is fixed to the mount. The heat dissipating device of claim 4, wherein the air outlet is disposed perpendicular to the first air inlet and the second air inlet. The heat dissipating device of claim 1, wherein the air outlet comprises a first portion and a second portion, the first portion and the second portion are respectively linear, and between the first portion and the second portion The angle is an obtuse angle, and the airflow is blown toward the fin group along the first portion of the air outlet, the side of the fin group being aligned with the second portion of the air outlet and extending outward along the second portion away from the air outlet.