201212799 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置，尤其涉及一種對電子元件進 行散熱的散熱裝置。 【先前技術·】 ' [0002] 隨著中央處理器（CPU)等電子元件功率的不斷提高，散 * 熱問題越來越受到人們的重視，在筆記型電腦中更係如 此。 0 [0003] 通常業界在電路板上安裝散熱裝置，用以對設置在電路 板上的發熱電子元件散熱。如圖1所示，散熱裝置通常包 括一與電子元件導熱接觸的熱管30、與熱管30導熱連接 的一鰭片組40及一位於該鰭片組40—侧的風扇50。該鰭 片組40由複數相互間隔、平行的散熱片疊設而成。該風 扇50具有一進風口及一出風口，風扇50藉由其進風口從 其周圍吸入冷空氣，吸入的冷空氣藉由其出風口吹向並 冷卻散熱片。然而，該散熱裝置中，熱管30與鰭片組40 Q 的結合方式為將熱管30的一端穿入焊接鰭片組40中，氣 流流經散熱片時，熱管30與鰭片組40結合的位置會阻礙 氣流流出鰭片組40，從而會擾亂氣流的流動方向，大大 影響了散熱裝置的散熱效率。 [0004] 圖2所示為習知技術中的另一種散熱裝置，該散熱裝置中 熱管30的一端焊接在鰭片組40的上表面，該種結合方式 雖然可以減小熱管30擾亂出風口氣流的流動方向，然而 會大大增加散熱裝置的厚度，從而會在上下方向上額外 佔用電腦主機原已十分有限的空間。 099129781 表單編號A0101 第3頁/共15頁 0992052174-0 201212799 【發明内容】 [0005] 有鑒於此，有必要提供一種散熱效率較高、且節省空間 的散熱裝置。 [0006] 一種散熱裝置，包括一離心式風扇、一熱管及與熱管的 一端導熱連接的一鰭片組，所述風扇包括一出風口，該 鰭片組設於該出風口處，該鰭片組包括複數散熱鰭片， 每一散熱鰭片邊緣彎折延伸形成至少一折邊，所述散熱 鰭片沿風扇的中心軸線的方向相互疊置，各散熱鰭片的 折邊相互抵靠而形成與風扇的中心軸線方向相互平行的 一側面，該熱管與該鰭片組的侧面導熱接觸。 [0007] 與習知技術相比，在本發明的散熱裝置中，由於熱管的 一端與鰭片組的側面導熱接觸，風扇產生的氣流在沿著 散熱鰭片流動的過程中不會受到熱管的干涉而受到阻擾 ，從而保持散熱裝置較高的散熱效率；另外，由於熱管 的一端與鰭片組的侧面導熱接觸，不會在上下方向上額 外佔用空間，可以減小該散熱裝置的總厚度。 【實施方式】 [0008] 請參閱圖3，本發明一較佳實施例的散熱裝置可對安裝在 一主機板（圖未示）上的一電子元件（圖未示）進行散 熱。該散熱裝置包括一散熱器10及一離心式風扇20。 [0009] 請同時參閱圖4，所述風扇20包括一扇框22及位於扇框22 内的一葉輪24。扇框22包括一底座26及罩設於該底座26 上的一蓋板28。一第一進風口 2 80設於蓋板28上，蓋板 28的周緣開設複數通孔282。該底座26包括一底板260及 沿底板260外緣垂直向上延伸的一侧壁262。底板260中 099129781 表單編號A0101 第4頁/共15頁 0992052174-0 201212799 Ο 間°又有第—進風口 2600，該第二進風口 2600與第—進 風口 280上下相對。—固S座26G2設於該第二進風口 2600内’該葉輪24固定在該固定座2602上。一出風口 202設於該底座26的側壁262上，該出風口 202包括—第 一部分2021及一第二部分2〇22。所述第一部分2〇21和第 二部分2022分別呈直線狀，且第一部分2021與第二部分 2022之間的夾角為鈍角。該出風口 202與第一進風口28〇 及第一進風口 2600相互垂直設置。底座26的侧壁262的 上端面對應蓋板28的通孔282處形成複數凸柱2620，用 以穿過蓋板28的通孔282將蓋板28固定在底座26的側壁 262上’從而蓋板28與底座26共同形成一容置葉輪24的 腔室（未標號）》 * [0010] Ο 該散熱器10包括一吸熱板12、一熱管14、_.及一結片組16 。所述熱管14被壓成扁平狀，其具有一蒸發段142與一冷 凝段144。該蒸發段142具有一平面狀的上表面及一平面 狀的下表面，該蒸發段I42的上、卞表面_與水平面平行 ，該蒸發段142的下表面與吸fv板12的上表面導熱接觸。 冷凝段144具有相互平行的一前側面及一後侧面，該冷凝 段1 44的前側面及後側面與該蒸發段142的上表面及下表 面相互垂直，該冷凝段144的後侧面與鰭片組16的一側面 導熱接觸。 [0011] 所述吸熱板12由鐵、鋁等導熱材枓製成。該吸熱板12的 下表面與主機板上的電子元件導熱接觸。該吸熱板12的 上表面的相對兩側設有二固定件122，用來將吸熱板12安 裝在主機板上。 099129781 表單編號A0101 第5頁/共15頁 0992052174-0 201212799 [0012] 所述鰭片組16由複數相互間隔、平行的散熱鰭片162疊設 而成。每一散熱鰭片162前後相對兩側形成折邊164，所 述政熱轉片162沿風扇20中心轴線的方向上下疊置，相鄰 散熱鰭片162的折邊164相互抵靠而形成鰭片組16前後的 兩相對第一、第二侧面165、166。所述第一、第二側面 、166分別與風扇20的中心軸線的方向平行。每一散 熱鰭片162靠近風扇20的一端被切除一部分而形成一弧形 的缺口 168，使得第二側面166的長度小於第一侧面165 的長度。各相鄰的散熱鰭片162左右兩側之間形成複數氣 流通道（未標號），該等氣流通道沿上、下方向排列。 組裝時，該鰭片組16設於風扇20的出風口 202處，其中， 该鰭片組16的第一侧面165與出風口202的第二部分2022 對齊並順沿該第二部分2022向遠離出風口 202的方向向外 延伸’而第二側面166與該出風口 202的第一部分2〇21遠 離該第二部分2022的一端相互接觸並向外延伸，該鰭片 組16的缺α 168靠近風扇20的葉輪24。熱管14的冷凝段 144的後側面藉由導熱介質丨3與鰭片組丨6的第一侧面I” 導熱接觸，用以將熱量傳遞給縛片組16，利用鰭片組i 6 的較大的散熱面積將熱量散發至周圍空氣中。 [0013] 政熱裝置工作時，該吸熱板1 2吸收電子元件產生的熱量 ，熱管14將吸收的熱量傳遞給鰭片組16。風扇2〇同時從 第一進風口 280及第二進風口 2600將外界空氣吸入蓋板 28與底座26共同形成的腔室内，氣流在葉輪24的作用下 沿著出風口 202的第一部分2〇21被吹向鰭片組1 6，並沿 著鰭片162間的氣流通道吹出。由於熱管14的冷凝段 099129781 表單編號A0101 第6頁/共15頁 0992052174-0 201212799 貼設在鰭片組16的前侧面上，氣流在沿著鰭片162間的氣 流通道流動的過程中不會受到熱管14的干涉而受到阻擾 ，從而保持散熱裝置較高的散熱效率。另外，熱管14的 冷凝段144貼設在鰭片組16的前側面上不會在上下方向上 額外佔用空間，從而可以減小該散熱裝置的總厚度。 [0014] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0015] 圖1與圖2係習知技術中散熱裝置的示意圖。 [0016] 圖3係本發明一較佳實施例中散熱裝置的組裝圖。 [0017] 圖4係圖3中散熱裝置的分解圖。 【主要元件符號說明】 [0018] 出風口 ： 202 〇 [0019]第一部分：2021 [0020]第二部分：2022 [0021] 散熱器：10 [0022] 導熱介質：13 [0023] 熱管：14、30 [0024] 蒸發段：142 [0025] 冷凝段：144 099129781 表單編號A0101 第7頁/共15頁 0992052174-0 201212799 [0026] 鰭片組：1 6 '40 [0027] 鰭片：162 [0028] 折邊：1 6 4 [0029] 缺口 ： 1 68 [0030] 第一側面： 165 [0031] 第二側面： 166 [0032] 風扇：2 0、 50 [0033] 扇框：22 [0034] 葉輪：24 [0035] 底座：26 [0036] 底板：260 [0037] 固定座：2602 [0038] 側壁：262 [0039] 凸柱：2620 [0040] 蓋板：28 [0041] 第二進風口 ：2600 [0042] 第一進風口 ：280 [0043] 通孔：282 [0044] 吸熱板：12 099129781 表單編號A0101 第8頁/共15頁 0992052174-0 201212799 L0045」 固定件：122201212799 VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from an electronic component. [Prior Art·] ' [0002] With the continuous improvement of the power of electronic components such as a central processing unit (CPU), the problem of heat dissipation has been receiving more and more attention, especially in notebook computers. 0 [0003] The heat sink is usually installed on the board to dissipate heat from the heat-generating electronic components placed on the board. As shown in FIG. 1, the heat sink generally includes a heat pipe 30 in thermal contact with the electronic component, a fin set 40 thermally coupled to the heat pipe 30, and a fan 50 on the side of the fin set 40. The fin set 40 is formed by stacking a plurality of mutually spaced, parallel fins. The fan 50 has an air inlet and an air outlet. The fan 50 draws cold air from its surroundings through its air inlet, and the sucked cold air is blown toward the air outlet and cools the heat sink. However, in the heat dissipating device, the heat pipe 30 and the fin group 40 Q are combined in such a manner that one end of the heat pipe 30 penetrates into the welding fin group 40, and when the airflow flows through the heat sink, the heat pipe 30 is combined with the fin group 40. The airflow will be hindered from flowing out of the fin set 40, which will disturb the flow direction of the airflow and greatly affect the heat dissipation efficiency of the heat sink. 2 is another heat dissipating device in the prior art, in which one end of the heat pipe 30 is welded to the upper surface of the fin group 40, and the combination manner can reduce the heat pipe 30 to disturb the air outlet flow. The flow direction, however, will greatly increase the thickness of the heat sink, which will additionally occupy the already limited space of the computer host in the up and down direction. 099129781 Form No. A0101 Page 3 of 15 0992052174-0 201212799 SUMMARY OF THE INVENTION [0005] In view of the above, it is necessary to provide a heat dissipating device having high heat dissipation efficiency and space saving. [0006] A heat dissipating device includes a centrifugal fan, a heat pipe, and a fin set thermally connected to one end of the heat pipe, the fan includes an air outlet, and the fin is disposed at the air outlet, the fin The heat sink fins are bent to form at least one folded edge, and the heat dissipation fins are stacked on each other along a central axis of the fan, and the folded edges of the heat dissipation fins abut each other to form a plurality of heat dissipation fins. A side surface parallel to the direction of the central axis of the fan, the heat pipe being in thermal contact with the side of the fin set. [0007] Compared with the prior art, in the heat dissipation device of the present invention, since one end of the heat pipe is in thermal contact with the side of the fin group, the airflow generated by the fan is not subjected to the heat pipe during the flow along the heat dissipation fin. Interference and interference, thereby maintaining a high heat dissipation efficiency of the heat sink; in addition, since one end of the heat pipe is in thermal contact with the side of the fin group, no additional space is occupied in the up and down direction, and the total thickness of the heat sink can be reduced. . [Embodiment] Referring to Fig. 3, a heat dissipating device according to a preferred embodiment of the present invention can dissipate an electronic component (not shown) mounted on a motherboard (not shown). The heat sink includes a heat sink 10 and a centrifugal fan 20. Referring to FIG. 4 simultaneously, the fan 20 includes a frame 22 and an impeller 24 located in the fan frame 22. The frame 22 includes a base 26 and a cover 28 that is disposed on the base 26. A first air inlet 2 80 is disposed on the cover plate 28, and a plurality of through holes 282 are defined in the periphery of the cover plate 28. The base 26 includes a bottom plate 260 and a side wall 262 extending vertically upward along the outer edge of the bottom plate 260. In the bottom plate 260 099129781 Form No. A0101 Page 4 / Total 15 pages 0992052174-0 201212799 There is a first air inlet 2600, and the second air inlet 2600 is opposite to the first air inlet 280. The solid S seat 26G2 is disposed in the second air inlet 2600. The impeller 24 is fixed to the fixing base 2602. An air outlet 202 is disposed on the side wall 262 of the base 26. The air outlet 202 includes a first portion 2021 and a second portion 222. The first portion 2〇21 and the second portion 2022 are respectively linear, and the angle between the first portion 2021 and the second portion 2022 is an obtuse angle. The air outlet 202 is disposed perpendicular to the first air inlet 28 and the first air inlet 2600. The upper end surface of the side wall 262 of the base 26 forms a plurality of protrusions 2620 corresponding to the through holes 282 of the cover plate 28 for fixing the cover plate 28 to the side wall 262 of the base 26 through the through hole 282 of the cover plate 28. The plate 28 and the base 26 together form a chamber for accommodating the impeller 24 (not labeled). [0010] The heat sink 10 includes a heat absorbing plate 12, a heat pipe 14, and a set of segments 16. The heat pipe 14 is pressed into a flat shape having an evaporation section 142 and a condensing section 144. The evaporation section 142 has a planar upper surface and a planar lower surface. The upper surface of the evaporation section I42 is parallel to the horizontal plane, and the lower surface of the evaporation section 142 is in thermal contact with the upper surface of the suction fv board 12. . The condensation section 144 has a front side and a rear side parallel to each other. The front side and the rear side of the condensation section 144 are perpendicular to the upper surface and the lower surface of the evaporation section 142, and the rear side and the fin of the condensation section 144 One side of the set 16 is in thermal contact. [0011] The heat absorbing plate 12 is made of a heat conductive material such as iron or aluminum. The lower surface of the heat absorbing panel 12 is in thermal contact with electronic components on the motherboard. Two fixing members 122 are provided on opposite sides of the upper surface of the heat absorbing plate 12 for mounting the heat absorbing plate 12 on the main board. 099129781 Form No. A0101 Page 5 of 15 0992052174-0 201212799 [0012] The fin set 16 is formed by stacking a plurality of mutually spaced, parallel fins 162. A flange 164 is formed on each of the front and rear opposite sides of each of the heat dissipation fins 162. The heat transfer fins 162 are stacked one above another along the central axis of the fan 20, and the flanges 164 of the adjacent heat dissipation fins 162 abut each other to form a fin. The first and second sides 165, 166 of the sheet group 16 are opposite to each other. The first and second sides 166 are respectively parallel to the direction of the central axis of the fan 20. One end of each of the heat sink fins 162 adjacent to the fan 20 is cut away to form an arcuate notch 168 such that the length of the second side 166 is less than the length of the first side 165. A plurality of air flow passages (not labeled) are formed between the left and right sides of each of the adjacent heat dissipation fins 162, and the air flow passages are arranged in the upper and lower directions. When assembled, the fin set 16 is disposed at the air outlet 202 of the fan 20, wherein the first side 165 of the fin set 16 is aligned with the second portion 2022 of the air outlet 202 and away from the second portion 2022. The direction of the air outlet 202 extends outwardly, and the second side 166 and the end of the first portion 2〇21 of the air outlet 202 away from the second portion 2022 are in contact with each other and extend outward, and the lack of α 168 of the fin group 16 is close to The impeller 24 of the fan 20. The rear side of the condensation section 144 of the heat pipe 14 is in thermal contact with the first side I" of the fin set 6 by the heat transfer medium 丨3 for transferring heat to the die set 16, using the larger of the fin set i 6 The heat dissipating area dissipates heat to the surrounding air. [0013] When the thermal device operates, the heat absorbing plate 12 absorbs heat generated by the electronic components, and the heat pipe 14 transfers the absorbed heat to the fin group 16. The fan 2〇 simultaneously The first air inlet 280 and the second air inlet 2600 draw outside air into the chamber formed by the cover plate 28 and the base 26, and the air flow is blown toward the fin along the first portion 2〇21 of the air outlet 202 under the action of the impeller 24. Group 1 6 and blown along the air flow passage between the fins 162. Due to the condensation section of the heat pipe 14 099129781 Form No. A0101 Page 6 / 15 pages 0992052174-0 201212799 affixed on the front side of the fin group 16, the air flow During the flow along the air flow passage between the fins 162, it is not disturbed by the interference of the heat pipe 14, thereby maintaining a high heat dissipation efficiency of the heat sink. In addition, the condensation section 144 of the heat pipe 14 is attached to the fin group. 16 will not be on the front side The space is additionally occupied in the direction, so that the total thickness of the heat dissipating device can be reduced. [0014] In summary, the present invention complies with the invention patent requirements, and the patent application is filed according to law. However, the above is only the comparison of the present invention. In the preferred embodiment, equivalent modifications or variations made by those skilled in the art of the present invention are intended to be included in the following claims. [FIG. 1 and FIG. 2] 3 is a schematic view of a heat dissipating device according to a preferred embodiment of the present invention. [0017] FIG. 4 is an exploded view of the heat dissipating device of FIG. 3. [Main component symbol description [0018] Air outlet: 202 〇 [0019] Part 1: 2021 [0020] Part 2: 2022 [0021] Heat sink: 10 [0022] Heat transfer medium: 13 [0023] Heat pipe: 14, 30 [0024] Evaporation Section: 142 [0025] Condensation section: 144 099129781 Form No. A0101 Page 7 of 15 Page 0992052174-0 201212799 [0026] Fin set: 1 6 '40 [0027] Fin: 162 [0028] Folding: 1 6 4 [0029] Notch: 1 68 [0030] First side: 165 [0031] Second side: 166 [0032] Fan: 2 0, 50 [0033] Fan frame: 22 [0034] Impeller: 24 [0035] Base: 26 [0036] Base plate: 260 [0037] Mounting seat: 2602 [0038] Side wall: 262 [0039] Bump: 2620 [0040] Cover: 28 [0041] Second air inlet: 2600 [0042] First air inlet: 280 [0043] Through hole: 282 [0044] Heat absorbing plate :12 099129781 Form No. A0101 Page 8 of 15 0992052174-0 201212799 L0045" Fixings: 122
Ο 099129781 表單編號Α0101 第9頁/共15頁 0992052174-0Ο 099129781 Form No. Α0101 Page 9 of 15 0992052174-0