201223419 六、發明說明：201223419 VI. Description of invention:
【發明所屬之技術領W[Technology to which the invention belongs
[0001] 本發明涉及一種電子裝置，特別是指一種具有散熱裝置 之電子裝置。 [0002] 【先前技術] 習知機箱中之發熱元件散熱裝置，如cpu(central 〇 processing unit，中央處理器）散熱裝置等，是由散 熱韓片及t裝於散朗片上方之賴風扇組成。該散熱 風扇是=上往下吹向散熱震置，從而將哪產生之熱量吹 出、再糟由系錢叙之熱風帶出機箱。目前，為 了滿足消費者之需步 ’電腦轉來越往輊和薄之方向發展 ’機箱亦越來越,]、。从 於許多小機箱中，為降低成本和節 約機箱之空間取消 巧『機相内部之系統風扇Λ既影響了 CPU 之散熱’又影響了盎从 系統之散熱。 【發明内容】 [0003] 鑒於以上内容，古 有必要提供一種可提南散熱效率之電子 ❹ 裝置。 . -.： ； . .... ... [0004] 一種電子裝置，包括主機及安裝於所述主機中之散熱裝 置，所述散熱裝置包括用以對發熱元件進行散熱之散熱 器、散熱風扇及導風罩，所述散熱器裝設於所述發熱元 件上方，所述散熱風扇裝設於所述散熱器上方，所述導 風罩安裝於所述散熱風扇上，所述散熱風扇將流經所述 散熱器之氣流吸入所述導風罩中，並藉由所述導風罩排 出所述主機，從而對所述發熱元件進行散熱。 [0005] 與習知技術相比，所述導風罩安裝於所述散熱風扇上， 099140252 表單編號 A0101 ^ ^ 0992070132-0 第3頁/共13頁 201223419 [0006] [0007] [0008] [0009] 099140252 所述散熱風扇將流經所述散熱器之氣流吸入所述導風罩 中，並藉由所述導風罩排出所述主機。所述散熱裝置不 僅為所述發熱元件散熱，還能對系統進行散熱，提高了 散熱效率。 【實施方式】 請參閱圖1，於本發明之一較佳實施方式中，一電子裝置 包括一主機30及一固定於所述主機30中之散熱裝置100。 所述主機3 0包括一底板31、一側板3 3、一後板3 5及一主 機板50。於一實施方式中，所述底板31、側板33與所述 後板35兩兩相互垂直。所述側板33開設複數第一進風口 331，所述後板35開設複數第二出風口351。所述主機板 50安裝於所述底板31上，且裝設有一發熱元件（圖未示 )，比如CPU等。 所述散熱裝置100包括一散熱器10、一散熱風扇20及一導 風罩6 0。 請參閱圖2，所述導風罩6 0包括一頂壁61、一底壁62、一 前壁63、兩相對之第一側壁651、兩相對之第二側壁653 、及一擋風壁67。於一實施方式中，所述頂壁61垂直於 所述前壁63及所述第一側壁651、第二侧壁653，所述前 壁63垂直於所述第一侧壁651、第二側壁653，所述底壁 62大致平行所述頂壁61。所述第一側壁651大致成一矩形 ，所述第二側壁653大致成一梯形。所述擋風壁67自所述 第一側壁651與所述第二側壁653之拐角處傾斜延伸，並 連接兩所述第二侧壁653及所述底壁62。於一實施方式中 ，所述擋風壁67與所述第一側壁651之間之夾角為鈍角， 表單編號A0101 第4頁/共13頁 0992070132-0 201223419 與所述第二側壁653之間之夾角為 1軏角。所述前壁63連接 兩所述第一側壁651及所述頂壁61。 所述前壁63 '擋風壁 67、及兩所述第一側壁651之自由邊故 自細形成1二進風口 68，所述頂壁61、底壁62及兩所at# 逆第二側壁653之自由 邊緣形成一第一出風口 69。 [0010] ο [0011] ο 請繼續參閱圖3_4，安裝時，所述散熱HH)之下表面與所 述發熱元件之上表面相抵靠。_散熱風⑽裝於所述 散熱器1G上，所述散熱㈣處於所述散熱風⑽與所述 發熱元件之間。所述前壁63及兩所述第—側壁651安裝於 所述散熱風扇20上’所述第二進風D68與所述散熱風扇 20相對’所述第—出風口 69與所述後板35之第二出風口 351相對。 所述電子裝置工作時，風流由所述第—進風口331進入所 述主機30。所述發熱元件將產生之熱量傳遞給所述散熱 器10。所述散熱風扇20將所述散熱器1〇中之熱量及所述 發熱元件周圍之熱氣海一起從下往上吸，並藉由所述第 二進風口 68進入所述導風罩60中。於所述頂壁6丨、底壁 62、第二側壁653、及所述擋風壁67之引導下，沿垂直於 進風之方向進入所述第一出風口69，並藉由所述側板33 之第二出風口 351將熱量排出所述主機3〇。 [0012] 綜上所述，本發明確已符合發明專利要求，爰依法提出 專利申請。惟’以上所述者僅為本發明之較佳實施方式 ，舉凡熟悉本發明技藝之人士’爰依本發明之精神所作 之等效修飾或變化’皆應涵蓋於以下之申請專利範圍内 099140252 表單編號A0101 第5頁/共13頁 0992070132-0 201223419 [0013] 【圖式簡單說明】 圖1是一電子裝置之一立體分解圖。 [0014] 圖2是圖1中之導風罩之另 一視角圖。 [0015] 圖3是圖1之電子裝置之一 立體組裝圖。 [0016] 圖4是圖1之電子裝置之另 一立體組裝圖 [0017] 【主要元件符號說明】 散熱裝置：100 [0018] 散熱器：10 [0019] 散熱風扇：20 [0020] 主機：30 [0021] 底板：31 [0022] 側板：33 [0023] 第一進風口 ： 331 [0024] 後板：35 [0025] 第二出風口 ： 351 [0026] 主機板：50 [0027] 導風罩：60 [0028] 頂壁：61 [0029] 底壁：62 [0030] 前壁：63 表單編號A0101 第6頁/共13頁 099140252 0992070132-0 201223419 [0031] 第 一側壁： 651 [0032] 第 二側壁： 653 [0033] 擋風壁：67 [0034] 第 二進風口 ：68 [0035] 第 一出風口 ：69 ❹ 099140252 表單編號A0101[0001] The present invention relates to an electronic device, and more particularly to an electronic device having a heat sink. [0002] [Prior Art] A heat-dissipating component of a heat-generating component in a conventional chassis, such as a CPU (central 〇processing unit) cooling device, is composed of a heat-dissipating Korean film and a fan mounted on the top of the slab . The heat-dissipating fan is blown up and down to dissipate heat, so that the generated heat is blown out, and then the hot air of the money is taken out of the chassis. At present, in order to meet the needs of consumers, the computer is turning more and more toward the direction of thinness. From many small chassis, in order to reduce the cost and save space in the chassis, the system fan inside the machine phase affects the heat dissipation of the CPU and affects the heat dissipation of the system. SUMMARY OF THE INVENTION [0003] In view of the above, it is necessary to provide an electronic device capable of improving heat dissipation efficiency in the south. -.: ; . . . [0004] An electronic device includes a main body and a heat dissipating device mounted in the main body, the heat dissipating device includes a heat sink for dissipating heat from the heat generating component, and dissipating heat a fan and an air hood, the heat sink is disposed above the heat generating component, the heat dissipation fan is disposed above the heat sink, and the air hood is mounted on the heat dissipation fan, and the heat dissipation fan The airflow flowing through the radiator is sucked into the air hood, and the air hood is discharged from the main body to dissipate heat from the heat generating component. [0005] Compared with the prior art, the air hood is mounted on the cooling fan, 099140252 Form No. A0101 ^ ^ 0992070132-0 Page 3 / Total 13 Page 201223419 [0006] [0007] [0008] 0009] The heat dissipation fan draws a gas flow through the radiator into the air hood, and discharges the main body by the air hood. The heat dissipating device not only dissipates heat from the heat generating component, but also dissipates heat to the system, thereby improving heat dissipation efficiency. [Embodiment] Referring to FIG. 1, in an embodiment of the present invention, an electronic device includes a host 30 and a heat sink 100 fixed in the host 30. The main body 30 includes a bottom plate 31, a side plate 3 3, a rear plate 35 and a main plate 50. In one embodiment, the bottom plate 31, the side plates 33, and the rear plate 35 are perpendicular to each other. The side plate 33 defines a plurality of first air inlets. The rear plate 35 defines a plurality of second air outlets 351. The motherboard 50 is mounted on the bottom plate 31 and is provided with a heating element (not shown) such as a CPU or the like. The heat sink 100 includes a heat sink 10, a heat dissipation fan 20, and a windshield 60. Referring to FIG. 2 , the air hood 60 includes a top wall 61 , a bottom wall 62 , a front wall 63 , two opposite first side walls 651 , two opposite second side walls 653 , and a windshield wall 67 . . In an embodiment, the top wall 61 is perpendicular to the front wall 63 and the first sidewall 651 and the second sidewall 653. The front wall 63 is perpendicular to the first sidewall 651 and the second sidewall. The bottom wall 62 is substantially parallel to the top wall 61. The first sidewall 651 is substantially rectangular, and the second sidewall 653 is substantially trapezoidal. The windshield wall 67 extends obliquely from a corner of the first side wall 651 and the second side wall 653, and connects the two second side walls 653 and the bottom wall 62. In an embodiment, the angle between the windshield wall 67 and the first sidewall 651 is an obtuse angle, between Form No. A0101, page 4/13, 0992070132-0 201223419, and the second sidewall 653. The angle is 1 軏. The front wall 63 connects the two first side walls 651 and the top wall 61. The front wall 63' windshield wall 67 and the free sides of the two first side walls 651 are formed by a thin air inlet 68, the top wall 61, the bottom wall 62 and the two at# reverse second side walls. The free edge of 653 forms a first air outlet 69. [0010] ο. Referring to FIG. 3_4, the lower surface of the heat dissipation HH) abuts the upper surface of the heat generating component during installation. The heat dissipation air (10) is mounted on the heat sink 1G, and the heat dissipation (4) is between the heat dissipation wind (10) and the heat generating component. The front wall 63 and the two side walls 651 are mounted on the heat dissipation fan 20. The second air inlet D68 is opposite to the heat dissipation fan 20, and the first air outlet 69 and the rear plate 35 are opposite to each other. The second air outlet 351 is opposite. When the electronic device is in operation, the wind flow enters the host 30 from the first air inlet 331. The heat generating component transfers the generated heat to the heat sink 10. The heat radiating fan 20 sucks the heat in the heat sink 1 and the hot air around the heat generating component from bottom to top, and enters the air guiding cover 60 through the second air inlet 68. Guided by the top wall 6丨, the bottom wall 62, the second side wall 653, and the windshield wall 67, entering the first air outlet 69 in a direction perpendicular to the air inlet, and by the side panel The second air outlet 351 of 33 discharges heat from the main unit 3〇. [0012] In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be covered in the following claims. No. A0101 Page 5 of 13 0992070132-0 201223419 [0013] [Simplified Schematic] FIG. 1 is an exploded perspective view of an electronic device. 2 is another perspective view of the air guiding hood of FIG. 1. 3 is an assembled, isometric view of one of the electronic devices of FIG. 1. 4 is another perspective assembled view of the electronic device of FIG. 1 [0017] [Description of main component symbols] Heat sink: 100 [0018] Heat sink: 10 [0019] Cooling fan: 20 [0020] Host: 30 [0021] Base plate: 31 [0022] Side plate: 33 [0023] First air inlet: 331 [0024] Rear plate: 35 [0025] Second air outlet: 351 [0026] Motherboard: 50 [0027] Air hood :60 [0028] Top wall: 61 [0029] Bottom wall: 62 [0030] Front wall: 63 Form number A0101 Page 6 / Total 13 pages 099140252 0992070132-0 201223419 [0031] First side wall: 651 [0032] Two side walls: 653 [0033] Windshield: 67 [0034] Second air inlet: 68 [0035] First air outlet: 69 ❹ 099140252 Form number A0101
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