TW201921524A - Adhesive film for use in semiconductor device manufacture, semiconductor device, and manufacturing method of semiconductor device - Google Patents

Abstract

This adhesive film is provided with a carrier film strip no more than 100 mm in width, and multiple adhesive pieces arranged on the carrier film aligned in the longitudinal direction of the carrier film, and the adhesive pieces have a rectangular or square shape with a protrusion and/or recess formed on at least one side thereof. This semiconductor device is provided with a semiconductor chip, a substrate to which the semiconductor chip is electrically connected, and an adhesive piece which is arranged between the semiconductor chip and the substrate and which bonds the semiconductor chip and the substrate together, and the shape of the semiconductor chip and the shape of the adhesive piece are different.

Description

Adhesive film for manufacturing semiconductor device, semiconductor device and manufacturing method thereof

The present disclosure relates to an adhesive film used in a manufacturing process of a semiconductor device, a semiconductor device, and a manufacturing method thereof.

Previously, semiconductor devices were manufactured through the following steps. First, a semiconductor wafer is attached to an adhesive sheet for dicing, and in this state, the semiconductor wafer is singulated into a semiconductor wafer. Thereafter, a pick-up step, an assembly step, a re-soldering step, and a die-bonding step are performed. Patent Document 1 discloses an adhesive sheet (cut crystal sticky wafer) having both a function of fixing a semiconductor wafer in a dicing step and a function of adhering a semiconductor wafer to a substrate in a die bonding step. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2007-288170

[Problems to be Solved by the Invention] However, in recent years, with the evolution of semiconductor devices for small components such as smart phones, the manufacturing process of semiconductor devices has also changed significantly compared to the past. For example, the practical use of a process of not performing a dicing step and a dicing step using the adhesive sheet (dicing die bonding wafer) described in Patent Document 1 or a process not performing a reflow step is progressing. Along with this, a new aspect of the adhesive film used in the manufacturing process of the semiconductor device is also required. In addition to the above, in order to cope with the increase in functionality and thickness of small components on which semiconductor devices are mounted, the inventors and others have promoted the development of a shape that adheres to a specific area of a substrate in a specific region. A good adhesive film for semiconductor wafers.

In the conventional semiconductor device, the shape of the semiconductor wafer is generally the same as the shape of the adhesive sheet used to adhere it to the substrate. For example, these shapes are rectangular or square. However, for example, when the area of the substrate to be bonded to the semiconductor wafer is limited, or when it is necessary to electrically connect the semiconductor wafer to the substrate at a different position from the previous one, a more complicated shape than the previous shape is used. The demand for adhesive tablets has increased.

An object of the present disclosure is to provide an adhesive film including an adhesive sheet having a complicated shape, which is useful for efficiently performing a subsequent step in a manufacturing process of a semiconductor device. Another object of the present disclosure is to provide a semiconductor device using a complex-shaped adhesive sheet and a method for manufacturing the same. [Means for solving problems]

The adhesive film for manufacturing a semiconductor device according to the present disclosure includes a belt-shaped carrier film having a width of 100 mm or less, and a plurality of adhesive sheets arranged on the carrier film so as to be aligned along the longitudinal direction of the carrier film; and It has a shape in which at least one of a convex portion and a concave portion is formed on at least one side of a rectangle or a square.

According to this adhesive film, a plurality of adhesive sheets arranged in order to be arranged on a carrier film can be sequentially picked up, and then each adhesive sheet can be arranged in a predetermined area of the substrate, and the substrate and the semiconductor wafer can be efficiently implemented. The next steps. For example, if a tape-shaped adhesive film is wound on a reel, a bonding process can be implemented more efficiently by a roll-to-roll method. As described above, the adhesive sheet has a more complicated shape than a rectangle or a square. The shape of the adhesive sheet may be appropriately set according to the shape of the region of the substrate to which the semiconductor wafer is to be attached or the shape of the semiconductor wafer. For example, the adhesive sheet may have 6 or more corners, or may have 8 or more corners. An example of the shape of the adhesive sheet having six corners is an L-shape.

The size and number of the adhesive sheet arranged on the carrier film may be appropriately set according to the design of the semiconductor device to be manufactured. For example, the area of one adhesive sheet may be set to a range of 10 mm ² to 200 mm ² . Based on the area of the carrier film, the ratio of the surface of the carrier film to the area covered by the plurality of adhesive sheets can be set to 10% to 60%. One or more rows containing the plurality of adhesive sheets may also be formed on the carrier film.

The plurality of adhesive sheets can be formed by, for example, die-cutting an adhesive layer formed so as to cover the surface of the carrier film. From the viewpoint of the processability of the adhesive film (in terms of preventing inadvertent peeling of the adhesive sheet from the carrier film during and after die cutting), the adhesion between the carrier film and the adhesive sheet is preferably 0.5 N / m ～ 18 N / m.

The adhesive film of the present disclosure may further include a protective member covering the second surface of the adhesive agent sheet on the side opposite to the first surface on the carrier film side and having the same shape as the adhesive agent sheet. When the adhesive sheet is covered with a protective member, dust or the like can be prevented from adhering to the adhesive sheet until it is used. The adhesive sheet and the protective member can be formed by die-cutting an adhesive layer formed to cover the surface of the carrier film and a protective film disposed to cover the adhesive layer.

The light transmittance of the protective member is preferably lower than the light transmittance of the carrier film. By adopting such a configuration, the position of the adhesive sheet can be identified by a device such as a camera, and the subsequent step can be easily automated.

From the viewpoint of the workability of the subsequent steps of the semiconductor wafer and the substrate, the adhesion between the adhesive sheet and the protective member is preferably 16 N / m or less. For example, in the case where the adhesive sheet contains a thermosetting resin composition, it is preferable that after the heat treatment at 100 ° C for 10 minutes, the adhesion between the adhesive sheet and the protective member is 16 N / m or less. [Effect of the invention]

According to the present disclosure, it is possible to provide an adhesive film including an adhesive sheet having a complicated shape, which is useful for efficiently performing a subsequent step in a manufacturing process of a semiconductor device. In addition, according to the present disclosure, a semiconductor device using a complex-shaped adhesive sheet and a method for manufacturing the same can be provided.

Hereinafter, embodiments of the present disclosure will be described with reference to drawings as appropriate. The present invention is not limited to the following embodiments. As used herein, (meth) acrylic acid means acrylic acid or methacrylic acid.

<Adhesive Film for Semiconductor Device Manufacturing> FIG. 1 is a perspective view schematically showing an adhesive film according to this embodiment. FIG. 2 is a cross-sectional view taken along a line II-II shown in FIG. 1. The adhesive film 10 shown in these figures includes a strip-shaped carrier film 1 having a width of 100 mm or less, and is arranged on the carrier film so as to be aligned along the longitudinal direction of the carrier film 1 (direction of arrow X shown in FIG. 1). A plurality of adhesive sheets 3p on 1; and a protective member 5p covering the surface F2 of the adhesive sheet 3p and having the same shape as the adhesive sheet 3p. As shown in FIG. 2, the surface F2 (second surface) of the adhesive sheet 3 p is a surface on the side opposite to the surface F1 (first surface) of the carrier film 1 side of the adhesive sheet 3 p.

The bonding film 10 can be applied to various bonding steps (for example, bonding of a semiconductor wafer and a substrate) in a manufacturing process of a semiconductor device. According to the adhesive film 10, a plurality of adhesive sheets 3p arranged in order to be arranged on the carrier film 1 can be sequentially picked up, and thereafter, each adhesive sheet 3p is arranged in a predetermined area of the substrate, and the substrate can be efficiently implemented. Next step with semiconductor wafer. Furthermore, FIG. 1 and FIG. 2 illustrate a case where a row 3A including a plurality of adhesive sheets 3p is provided on the carrier film 1, and two or more rows 3A may be provided on the carrier film 1.

As shown in FIG. 1, the adhesive sheet 3 p of this embodiment has a shape (T-shape) like a thick T-shape. As shown in FIG. 3 (a), the shape has eight corners C1 to C8. The shape may be referred to as a shape in which one convex portion is formed at a central portion of one side of the rectangle, or a shape in which one concave portion is formed at each end of one side of the rectangle.

The shape of the adhesive agent sheet 3p is not limited to the shape shown in FIG. 3 (a), and may be a shape in which at least one of a convex portion and a concave portion is formed on at least one side of a rectangle or a square. For example, as shown in FIG. 3 (b), it may be L-shaped and may have six corners C1 to C6. As shown in FIG. 3 (c), it may have a shape in which a recess is formed in a rectangle or a square, and has eight corners C1 to C8. As shown in FIG. 3 (d), a concave portion may be formed at one corner of the rectangle or square (lower left in FIG. 3 (d)) and a convex may be formed at one side (right side in FIG. 3 (d)). The shape of the part has 10 corners C1 to C10. As shown in FIG. 3 (e), a rectangular or square shape may have a convex portion formed on one side and a concave portion formed on the other side, and may have 12 corners C1 to C12. Furthermore, as shown in FIG. 3 (f), the shape of the concave portion or the convex portion may be a triangle or an arc shape.

The shape of the adhesive sheet may be appropriately set according to the shape of the region of the substrate to which the semiconductor wafer is to be attached or the shape of the semiconductor wafer. In addition, a semiconductor wafer has, for example, a rectangular or square shape, and a plurality of terminals are provided at its corners. When these terminals need to be connected to the wiring of the substrate, the bonding may be determined so that the terminals and the wiring are not covered by the adhesive sheet. Tablet shape. FIG. 4 is a plan view showing an example of the arrangement of a T-shaped adhesive sheet 3 p and a rectangular semiconductor wafer S. FIG. In the regions R1 and R2 shown in FIG. 4, there is no adhesive between the substrate and the semiconductor wafer, and the substrate and the semiconductor wafer can be electrically connected in the regions R1 and R2.

The adhesive sheet 3p in this embodiment is assumed to have a sufficiently small size. The area of one adhesive sheet 3p is, for example, 10 mm ² to 200 mm ² , and may also be 20 mm ² to 160 mm ² or 25 mm ² to 100 mm. ² . Based on the area of the carrier film 1, the ratio of the surface of the carrier film 1 to the area covered by the plurality of adhesive sheets 3 p (area ratio of the adhesive sheet) is, for example, 10% to 60%, or 10% to 35% or 15% to 33%. This area ratio can be calculated by dividing the area A of one adhesive sheet 3p by the pitch (pitch P in FIG. 1) of the adhesive sheet 3p provided on the carrier film 1 and the width ( The product of width W) in FIG. 1. That is, the area ratio R may be a value calculated by the following formula. Area ratio R (%) = A / (P × W) × 100

Hereinafter, the structure of the adhesive film 10 is demonstrated. [Carrier film] As described above, the carrier film 1 has a band shape and has a width of 100 mm or less. The width of the carrier film 1 may be appropriately set according to the size of the adhesive sheet 3p disposed thereon and the number of rows 3A. For example, as shown in FIG. 1, when the number of rows 3A is one, the width of the carrier film 1 is preferably 10 mm to 50 mm, and may also be 10 mm to 30 mm or 10 mm to 20 mm. When the width of the carrier film 1 is 10 mm or more, when the roll-to-roll method is used, it is easy to prevent workability from being lowered by twisting the carrier film 1.

The material of the carrier film 1 is not particularly limited as long as it can sufficiently withstand the tension applied during the manufacturing process of the adhesive film 10 and the manufacturing process of the semiconductor device. The carrier film 1 is preferably transparent from the viewpoint of the visibility of the adhesive sheet 3p and / or the protective member 5p disposed thereon. As the carrier film 1, a polyester film such as a polyethylene terephthalate film, a polytetrafluoroethylene film, a polyethylene film, a polypropylene film, a polymethylpentene film, a polyethylene acetate film, Homopolymers or copolymers such as poly-4-methylpentene-1, ethylene-vinyl acetate copolymers, ethylene-ethyl acrylate copolymers, or mixtures thereof, such as polyolefin-based films, polyvinyl chloride films,塑胶 imine film and other plastic films. The carrier film 1 may have a single-layer structure or a multilayer structure.

The thickness of the carrier film 1 may be appropriately selected within a range that does not impair workability, and is, for example, 10 μm to 200 μm, or 20 μm to 100 μm, or 25 μm to 80 μm. These thickness ranges are ranges that are practically practical and economically effective.

In order to improve the adhesion of the adhesive sheet 3p to the carrier film 1, the surface of the carrier film 1 may be chemically or physically treated by corona treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionizing radiation treatment, and the like Sexual surface treatment. As the carrier film 1, a film having a low surface energy including a fluororesin may be used. As such a film, there are, for example, A-63 (die-cutting treatment agent: modified silicone type) manufactured by Teijin film solutions Co., Ltd. and Teijin film solutions Co., Ltd. A-31 (die-cutting treatment agent: Pt-based silicone) and so on.

In order to prevent the adhesive force of the adhesive sheet 3p from becoming excessively high with respect to the carrier film 1, a mold containing a silicone-based release agent, a fluorine-based release agent, a long-chain alkyl acrylate-based release agent, or the like may be formed on the surface of the carrier film 1. Die-cut layer of the cutting agent.

The adhesion force between the carrier film 1 and the adhesive sheet 3p is preferably 0.5 N / m to 18 N / m, more preferably 2 N / m to 10 N / m, or 2 N / m to 6 N / m or 2 N / m to 4 N / m. With this adhesion force being 0.5 N / m or more, it is easy to prevent the adhesive sheet 3p from being unintentionally peeled from the carrier film 1 in the process of manufacturing the adhesion film 10. On the other hand, the adhesion force is 18 N / m or less When the adhesive film 10 is used, it is easy to stably pick up the adhesive sheet 3p and the protective member 5p covering the adhesive sheet 3p from the carrier film 1. In addition, the adhesive force of the adhesive sheet 3p with respect to the carrier film 1 is a 90 ° peel strength, and specifically, the peel strength is as follows: The carrier film 1 is prepared to have a composition containing the same composition as the adhesive sheet 3p. For a sample of the adhesive layer having a width of 20 mm, the peel strength measured when the adhesive layer was peeled from the carrier film at an angle of 90 ° and a peeling speed of 50 mm / min.

[Adhesive Sheet] The adhesive sheet 3p is formed by die-cutting the adhesive layer 3 formed so as to cover the surface of the carrier film 1 and the protective film 5 disposed so as to cover the adhesive layer 3 simultaneously with the protective member 5p. Formed together (see Figure 6). The thickness of the adhesive agent sheet 3p may be appropriately selected within a range that does not impair workability, and is, for example, 3 μm to 50 μm, 5 μm to 40 μm, or 7 μm to 30 μm. When the thickness of the adhesive sheet 3p is 3 μm or more, it is easy to ensure sufficient adhesiveness. On the other hand, when the thickness of the adhesive sheet 3p is 50 μm or less, the adhesive composition constituting the adhesive sheet 3p is easily suppressed. The protective member 5p oozes.

As long as the adhesive composition constituting the adhesive sheet 3p has properties (for example, adhesiveness and heat resistance to heat of about 150 ° C) that can be used in the manufacturing process of a semiconductor device without any problem, as long as it is suitable It can be used by the user in the manufacturing process of the semiconductor device. The adhesive agent sheet 3p preferably contains a thermoplastic resin, a thermosetting resin, a hardening accelerator, and a filler, and may optionally include a photoreactive monomer, a photopolymerization initiator, and the like. Along with the thinning of the substrate, there is a tendency to use a substrate having low heat resistance, and there is a tendency to reduce the temperature of the manufacturing process of the semiconductor device. The adhesive agent sheet 3p is preferably capable of adhering an object at a temperature of 160 ° C. or lower.

(Thermoplastic resin) As the thermoplastic resin, a resin having a thermoplastic property or a resin having a thermoplastic property at least in an uncured state and forming a crosslinked structure after heating can be used. As the thermoplastic resin, a (meth) acrylic copolymer having a reactive group (hereinafter, also sometimes referred to as "containing" Reactive (meth) acrylic copolymers "). When the (meth) acrylic acid copolymer containing a reactive group is contained as a thermoplastic resin, the adhesive agent sheet 3p may be a state which does not contain a thermosetting resin. That is, it may be a state including a reactive group-containing (meth) acrylic copolymer, a hardening accelerator, and a filler. The thermoplastic resin may be used singly or in combination of two or more kinds.

Examples of the (meth) acrylic copolymer include (meth) acrylic acid ester copolymers such as acrylic resins and acrylic rubbers, and acrylic rubbers are preferred. The acrylic rubber is preferably formed by copolymerizing a monomer selected from (meth) acrylate and acrylonitrile with acrylate as a main component.

Examples of the (meth) acrylate include methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, butyl acrylate, isobutyl acrylate, hexyl acrylate, cyclohexyl acrylate, and 2-ethyl acrylate Hexyl ester, lauryl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl acrylate, butyl methacrylate, isobutyl methacrylate, hexyl methacrylate, Cyclohexyl methacrylate, 2-ethylhexyl methacrylate, lauryl methacrylate, and the like. The (meth) acrylate copolymer is preferably a copolymer containing butyl acrylate and acrylonitrile as copolymerization components, and a copolymer containing ethyl acrylate and acrylonitrile as copolymerization components.

The reactive group-containing (meth) acrylic copolymer is preferably a reactive group-containing (meth) acrylic copolymer containing a (meth) acrylic monomer having a reactive group as a copolymerization component. Such a (meth) acrylic copolymer containing a reactive group can be obtained by copolymerizing a monomer composition containing a (meth) acrylic monomer having a reactive group and the monomer.

As a reactive group, from a viewpoint of improving heat resistance, an epoxy group, a carboxyl group, an acrylfluorenyl group, a methacrylfluorenyl group, a hydroxyl group, and an epithio group are preferable. Among these, in terms of crosslinkability, More preferred are epoxy and carboxy.

In this embodiment, the reactive group-containing (meth) acrylic copolymer is preferably an epoxy-containing (meth) acrylic copolymer containing a (meth) acrylic monomer having an epoxy group as a copolymerization component. . In this case, examples of the (meth) acrylic monomer having an epoxy group include glycidyl acrylate, 4-hydroxybutyl acrylate, glycidyl ether, 3,4-epoxycyclohexyl methyl acrylate, and methyl formate. Glycidyl acrylate, 4-hydroxybutyl methacrylate glycidyl ether, 3,4-epoxycyclohexyl methyl methacrylate, and the like. From the viewpoint of heat resistance, the (meth) acrylic monomer having a reactive group is preferably glycidyl acrylate or glycidyl methacrylate.

The Tg of the thermoplastic resin is preferably -50 ° C to 50 ° C. When the Tg of the thermoplastic resin is 50 ° C or lower, it is easy to ensure the flexibility of the adhesive sheet 3p. In addition, when attached to an adherend, when unevenness is present, it is easy to follow and has moderate adhesiveness. On the other hand, when the Tg of the thermoplastic resin is −50 ° C. or higher, it is easy to suppress the flexibility of the adhesive sheet 3 p from becoming too high, and excellent handleability, adhesion, and peelability can be achieved.

The Tg of the thermoplastic resin is a midpoint glass transition temperature value obtained by differential scanning calorimetry (DSC). Specifically, the Tg of the thermoplastic resin is measured at a heating rate of 10 ° C./min and at a measurement temperature of −80 ° C. to 80 ° C. The heat change is measured, and the intermediate point glass transition is calculated by a method in accordance with JIS K 7121: 1987. temperature.

The weight average molecular weight of the thermoplastic resin is preferably from 100,000 to 2 million. When the weight average molecular weight is 100,000 or more, it is easy to ensure heat resistance when it is used for temporary fixing applications. On the other hand, when the weight average molecular weight is 2 million or less, when it is used for a temporary fixing application, it is easy to suppress a decrease in flowability and a decrease in adhesion. From this viewpoint, the weight average molecular weight of the thermoplastic resin is more preferably 500,000 or more and 2 million or less, and even more preferably 1 million or more and 2 million or less. The weight average molecular weight is a polystyrene-equivalent value obtained by gel permeation chromatography (GPC) using a standard polystyrene calibration curve.

In the case where the (meth) acrylic copolymer having a reactive group contains glycidyl acrylate or glycidyl methacrylate as a copolymerization component, based on the total amount of the copolymerization component, the content thereof is preferably 0.1 in total. Mass% to 20% by mass, more preferably 0.5% to 15% by mass, and even more preferably 1.0% to 10% by mass. If the content is within the above range, all of the flexibility, adhesiveness, and peelability of the adhesive sheet 3p can be easily achieved at a higher level.

As the (meth) acrylic copolymer having a reactive group as described above, one obtained by a polymerization method such as pearl polymerization and solution polymerization can also be used. Alternatively, a commercially available product such as HTR-860P-3CSP (trade name, manufactured by Nagase ChemteX Co., Ltd.) may be used.

(Thermosetting resin) The thermosetting resin can be used without particular limitation as long as it is a resin that is cured by heat. Examples of the thermosetting resin include epoxy resin, acrylic resin, silicone resin, phenol resin, thermosetting polyimide resin, polyurethane resin, melamine resin, and urea resin. These can be used alone or in combination of two or more.

The epoxy resin is not particularly limited as long as it has a heat-resistant effect for curing. As the epoxy resin, bifunctional epoxy resins such as bisphenol A epoxy resin, novolac epoxy resins such as phenol novolac epoxy resin, cresol novolac epoxy resin, and the like can be used. As the epoxy resin, a conventionally known one such as a polyfunctional epoxy resin, a glycidylamine type epoxy resin, a heterocyclic ring-containing epoxy resin, and an alicyclic epoxy resin can be used.

Examples of the bisphenol A epoxy resin include: Epikote 807, Epikote 815, Epikote 825, Epikote 827, and Epiphan Epikote 828, Epikote 834, Epikote 1001, Epikote 1004, Epikote 1007, Epikote 1009 (all manufactured by Mitsubishi Chemical Corporation); DER-330, DER-301, DER-361 (all manufactured by Dow Chemical); YD8125, YDF8170 (both Nippon Steel & Sumitomo Chemical Co., Ltd.) Company)). Examples of the phenol novolac epoxy resin include: Epikote 152, Epikote 154 (all manufactured by Mitsubishi Chemical Corporation); EPPN-201 (Nippon Kayaku Co., Ltd.) (Manufactured); DEN-438 (manufactured by Dow Chemical). Examples of o-cresol novolac epoxy resin include: YDCN-700-10 (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.); EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025 , EOCN-1027 (all manufactured by Nippon Kayaku Co., Ltd.); YDCN701, YDCN702, YDCN703, YDCN704 (all manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), etc. Examples of the polyfunctional epoxy resin include: Epon 1031S (manufactured by Mitsubishi Chemical Corporation); Araldite 0163 (manufactured by BASF Japan); Denacol EX-611, EX-614, EX-614B, EX-622, EX-512, EX-521, EX-421, EX-411, EX-321 (all manufactured by Nagase ChemteX Co., Ltd.) Wait. Examples of the amine-type epoxy resin include Epikote 604 (manufactured by Mitsubishi Chemical Corporation); YH-434 (manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.); and TETRAD-X , TETRAD-C (all manufactured by Mitsubishi Chemical Corporation); ELM-120 (made by Sumitomo Chemical Corporation), etc. Examples of the heterocyclic-containing epoxy resin include: Araldite PT810 (manufactured by BASF Japan); ERL4234, ERL4299, ERL4221, and ERL4206 (all manufactured by Union Carbide) Wait. These epoxy resins can be used alone or in combination of two or more.

As for the epoxy resin hardener which is a part of a thermosetting resin component, a well-known resin generally used can be used. Specific examples include: amines; polyamines; acid anhydrides; polysulfides; boron trifluoride; bisphenol A, bisphenol F, and bisphenol S having two or more phenolic hydroxyl groups in one molecule Phenols; phenol novolac resin, bisphenol A novolac resin, cresol novolac resin and other phenol resins. As an epoxy resin hardener, a phenol resin, such as a phenol novolak resin, a bisphenol A novolak resin, and a cresol novolak resin, is especially preferable from a viewpoint of being excellent in the electric-resistance at the time of moisture absorption. Furthermore, the epoxy hardener may be used simultaneously with the epoxy resin, or may be used alone.

Among the phenol resin hardeners, it is preferable to use Phenolite LF4871, Phenolite TD-2090, Phenolite TD-2149, and Phenolite. VH-4150, Phenolite VH4170 (both are manufactured by DIC Corporation, trade name); H-1 (made by Meiwa Chemical Co., Ltd., trade name); Epi- Cure) MP402FPY, Epi-Cure YL6065, Epi-Cure YLH129B65, Milex XL, Milex XLC, Milex XLC-LL, Melex ( Milex) RN, Milex RS, Milex VR (all manufactured by Mitsubishi Chemical Corporation, trade names) and other structural materials.

The content of the thermosetting resin in the adhesive sheet 3p is preferably 10 to 500 parts by mass, more preferably 30 to 450 parts by mass, and even more preferably 50 parts by mass to 100 parts by mass of the thermoplastic resin. 400 parts by mass. When the content of the thermosetting resin is within the above range, it is easy to achieve excellent adhesion after the thermosetting of the adhesive sheet 3p.

(Hardening accelerator) Examples of the hardening accelerator include imidazoles, dicyandiamide derivatives, dihydrazine dicarboxylic acid, triphenylphosphine, tetraphenylphosphonium tetraphenylborate, and 2-ethyl-4 -Methylimidazole-tetraphenylborate, 1,8-diazabicyclo [5,4,0] undecene-7-tetraphenylborate, and the like. These can be used alone or in combination of two or more.

When the adhesive sheet 3p contains a (meth) acrylic acid copolymer which has an epoxy group, it is preferable to contain the hardening accelerator which accelerates hardening of the epoxy group contained in the said acrylic copolymer. Examples of the hardening accelerator that accelerates the hardening of epoxy groups include phenol-based hardeners, acid anhydride-based hardeners, amine-based hardeners, imidazole-based hardeners, imidazoline-based hardeners, triazine-based hardeners, and phosphine-based hardeners. Agent. Among these, from the viewpoints of rapid curing, heat resistance, and releasability, an imidazole-based curing agent that can be expected to reduce the step time and improve the workability. These compounds may be used alone or in combination of two or more.

The content of the hardening accelerator in the adhesive agent sheet 3p is preferably from 0.01 to 50 parts by mass, more preferably from 0.02 to 20 parts by mass, and even more preferably from 0.025 to 10 parts by mass based on 100 parts by mass of the thermoplastic resin. Parts by mass. When the content of the hardening accelerator is within the above-mentioned range, there is a tendency that the hardenability of the adhesive sheet 3p can be improved, and a decrease in storage stability can be sufficiently suppressed.

(Inorganic Filler) The adhesive sheet 3p preferably contains an inorganic filler. Examples of the inorganic filler include metal fillers such as silver powder, gold powder, and copper powder; silica, alumina, boron nitride, titania, glass, iron oxide, and ceramic ) And other non-metallic inorganic fillers. The inorganic filler can be selected according to a desired function.

The inorganic filler is preferably one having an organic group on the surface. By modifying the surface of the inorganic filler with an organic group, it is easy to coexist the dispersibility of the varnish used to form the adhesive sheet 3p in an organic solvent, the high elastic coefficient of the adhesive sheet 3p, and excellent peelability.

The inorganic filler having an organic group on the surface can be obtained, for example, by mixing a silane coupling agent represented by the following formula (B-1) with an inorganic filler and stirring the mixture at a temperature of 30 ° C or higher. The modification of the surface of the inorganic filler with an organic group can be confirmed by ultraviolet (UV) measurement, infrared (Infrared Radiation) measurement, X-ray photoelectron spectroscopy (XPS) measurement, and the like.

[Chemical 1]

In the formula (B-1), X represents a member selected from the group consisting of a phenyl group, a glycidyloxy group, an acrylfluorenyl group, a methacrylfluorenyl group, a mercapto group, an amino group, a vinyl group, an isocyanate group, and a methacryloxy group. In the organic group in the group, s represents an integer of 0 or 1 to 10, and R ¹¹ , R ^12, and R ¹³ each independently represent an alkyl group having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, isopropyl, and isobutyl. . From the viewpoint of easy availability, the alkyl group having 1 to 10 carbon atoms is preferably a methyl group, an ethyl group, and an pentyl group. From the viewpoint of heat resistance, X is preferably an amine group, a glycidyloxy group, a mercapto group, and an isocyanate group, and more preferably a glycidyloxy group and a mercapto group. From the viewpoint of suppressing the fluidity of the film during high heat and improving the heat resistance, s in the formula (B-1) is preferably 0 to 5, and more preferably 0 to 4.

Examples of the silane coupling agent include trimethoxyphenylsilane, dimethyldimethoxyphenylsilane, triethoxyphenylsilane, dimethoxymethylphenylsilane, and vinyltrimethoxysilane , Vinyltriethoxysilane, vinyltri (2-methoxyethoxy) silane, N- (2-aminoethyl) -3-aminopropylmethyldimethoxysilane, N -(2-aminoethyl) -3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-glycidyloxy Propyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-isocyanatepropyltriethyl Oxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, N- (1,3-dimethyl Butylene) -3- (triethoxysilyl) -1-propylamine, N, N'-bis (3- (trimethoxysilyl) propyl) ethylenediamine, polyoxyethylenepropyltriane Oxysilane, polyethoxydimethylsiloxane, etc. Among these, 3-aminopropyltriethoxysilane, 3-glycidyloxypropyltrimethoxysilane, 3-isocyanatepropyltriethoxysilane, and 3-mercaptopropyltrimethylsilane are preferred. The oxysilane is more preferably trimethoxyphenylsilane, 3-glycidyloxypropyltrimethoxysilane, and 3-mercaptopropyltrimethoxysilane. The silane coupling agent may be used singly or in combination of two or more kinds.

From the viewpoint of achieving a balance between heat resistance and storage stability, the content of the coupling agent is preferably 0.01 to 50 parts by mass, and more preferably 0.05 to 20 parts by mass based on 100 parts by mass of the inorganic filler. From the viewpoint of improving heat resistance, it is more preferably 0.5 to 10 parts by mass.

The content of the inorganic filler in the adhesive sheet 3p is preferably 600 parts by mass or less, more preferably 500 parts by mass or less, and still more preferably 400 parts by mass or less with respect to 100 parts by mass of the thermoplastic resin. The lower limit of the content of the inorganic filler is not particularly limited, but it is preferably 5 parts by mass or more, more preferably 8 parts by mass or more, based on 100 parts by mass of the thermoplastic resin. By setting the content of the inorganic filler within the above range, it is possible to suppress shrinkage due to thermal curing, and it is easy to coexist a high elastic modulus and excellent peelability of the adhesive sheet 3p.

(Organic Filler) The adhesive sheet 3p may contain an organic filler. Examples of the organic filler include carbon, rubber-based fillers, silicone-based fine particles, polyamidofine particles, polyamidofine particles, and the like. The content of the organic filler relative to 100 parts by mass of the thermoplastic resin is preferably 300 parts by mass or less, more preferably 200 parts by mass or less, and even more preferably 100 parts by mass or less. The lower limit of the content of the organic filler is not particularly limited, but is preferably 5 parts by mass or more with respect to 100 parts by mass of the thermoplastic resin.

(Organic solvent) The adhesive agent sheet 3p may be diluted with an organic solvent if necessary. The organic solvent is not particularly limited, and can be determined in consideration of the volatility at the time of film formation and the like based on the boiling point. Specifically, methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, and methylethyl are preferred from the viewpoint that it is difficult to harden the film during film formation. Relatively low-boiling solvents such as ketones, acetone, methyl isobutyl ketone, toluene, and xylene. In addition, for the purpose of improving film forming properties, it is preferable to use a solvent having a relatively high boiling point, such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, or cyclohexanone. These solvents may be used alone or in combination of two or more.

[Protective member] The protective member 5p is formed by simultaneously die-cutting the adhesive layer 3 formed so as to cover the surface of the carrier film 1 and the protective film 5 disposed so as to cover the adhesive layer 3 together with the adhesive sheet 3p. The creator (see Figure 6). The protective member 5p of this embodiment is formed at the same time as the adhesive sheet 3p by die cutting, and therefore has substantially the same shape as the adhesive sheet 3p. The protective film 5 may be any one that can be press-processed in the manufacturing process of the adhesive film 10 and can easily peel the protective member 5p from the adhesive sheet 3p in the manufacturing process of the semiconductor device.

The adhesive force between the adhesive agent sheet 3p and the protective member 5p is preferably 16 N / m or less, more preferably 10 N / m or less, and also 5 N / m or 4.5 N / m or less. In particular, when the adhesive sheet 3p contains a resin composition having a thermosetting property, it is preferable that the adhesive strength of the protective member 5p with respect to the adhesive sheet 3p after the heat treatment at 100 ° C for 10 minutes is The range. When the adhesion force is 16 N / m or less, the adhesive sheet 3p in a state covered by the protective member 5p can be temporarily pressure-bonded to the adherend (for example, a substrate) at 100 ° C. for 3 seconds. After that, the protective member 5p is easily peeled from the adhesive sheet 3p with an adhesive tape or the like. In addition, the adhesive force of the protective member 5p with respect to the adhesive sheet 3p is a 90 degree peeling strength, specifically, the peeling strength which is prepared for the adhesive agent with a width of 20 mm containing the same composition as the adhesive sheet 3p. A sample having a protective film of the same width arranged on the layer, and the peeling strength measured when the protective film was peeled from the adhesive layer at an angle of 90 ° and a peeling speed of 300 mm / min.

As the protective film 5, a polyester film such as a polyethylene terephthalate film, a polytetrafluoroethylene film, a polyethylene film, a polypropylene film, a polymethylpentene film, a polyethylene acetate film, Homopolymers or copolymers such as poly-4-methylpentene-1, ethylene-vinyl acetate copolymers, ethylene-ethyl acrylate copolymers, or mixtures thereof, such as polyolefin-based films, polyvinyl chloride films,塑胶 imine film and other plastic films. The protective film 5 may have a single-layer structure or a multilayer structure. By covering the adhesive layer 3 with the protective film 5, excessive tension on the adhesive layer 3 can be suppressed, and foreign matter can be prevented from being mixed into the adhesive layer 3 during die cutting.

The thickness of the protective film 5 may be appropriately selected within a range that does not impair workability, and is, for example, 10 μm to 200 μm, or 20 μm to 100 μm, or 25 μm to 80 μm. These thickness ranges are ranges that are practically practical and economically effective.

The light transmittance of the protective member 5 p is preferably lower than the light transmittance of the carrier film 1. By adopting such a configuration, the position and orientation of the adhesive sheet 3p can be recognized by using a device such as a camera, and the subsequent steps in the manufacturing process of the semiconductor device can be easily automated. For example, as the protective member 5p, it is preferable to use a light having a transmittance of less than 10% (more preferably less than 7%) colored with a wavelength of 500 nm.

<The manufacturing method of an adhesive film> Next, the manufacturing method of the adhesive film 10 is demonstrated. The manufacturing method of this embodiment includes the following steps. (A) A step of preparing a laminated body 20 having a belt-shaped carrier film 1 having a width of 100 mm or less, an adhesive layer 3 formed to cover the surface of the carrier film 1, and an adhesive layer 3 to cover the surface. The protective film 5 is configured in a manner. (B) A step of obtaining a plurality of adhesive sheets 3p arranged on the carrier film 1 so as to be arranged in the longitudinal direction of the carrier film 1 by die-cutting the adhesive layer 3 and the protective film 5 in the laminated body 20 .

FIG. 5 is a cross-sectional view schematically showing the laminated body 20 prepared in step (A). The laminated body 20 can be manufactured as follows. First, a coating liquid prepared by dissolving a raw resin composition of the adhesive layer 3 in a solvent such as an organic solvent and varnishing it is prepared. After this coating liquid is applied on the carrier film 1, the solvent is removed to form an adhesive layer 3. Examples of the coating method include a knife coating method, a roll coating method, a spray coating method, a gravure coating method, a bar coating method, and a curtain coating method. Then, the protective film 5 is adhered to the surface of the adhesive layer 3 under the conditions of normal temperature to 60 ° C. Thereby, the laminated body 20 can be obtained. Alternatively, the adhesive layer 3 may be formed on a wide carrier film, and then the protective film 5 may be bonded to cover the carrier film, thereby producing a laminated film, and cutting (slitting) the laminated film into A width of 100 mm or less, thereby obtaining a laminated body 20.

FIG. 6 is a perspective view showing a case where a plurality of adhesive sheet 3p and a protective member 5p covering the adhesive sheet 3p are formed on the carrier film 1 by die cutting in the step (B). As shown in FIG. 6, the laminated body 20 is formed continuously on the carrier film 1 between a rotating body 51 having a plurality of blades 51 c for die cutting and a roller 52 paired with the rotating body 51 on the outer peripheral surface. The adhesive sheet 3p and the protective member 5p correspond to the shape of the blade 51c. At this time, regarding the laminated body 20, the surface on the protective film 5 side faces the rotating body 51, and the surface on the carrier film 1 side faces the roller 52. By adjusting the distance between the rotating shaft 51a of the rotating body 51 and the rotating shaft 52a of the roller 52 or changing the height of the blade 51c, the depth of the cut formed in the laminated body 20 by the blade 51c can be adjusted.

As shown in FIG. 6, the laminated body 20 between the rotating body 51 and the roller 52 is separated into an adhesive film 10 and an unnecessary portion 30, and is wound around a respective reel (not shown). The unnecessary portion 30 includes the adhesive layer 3 and the protective film 5 from which the adhesive sheet 3p and the protective member 5p have been cut out.

<Usage method of adhesive film> Next, the usage method of the adhesive film 10 is demonstrated. FIG. 7 is a cross-sectional view schematically showing a state in which the adhesive sheet 3p and the protective member 5p covering the adhesive sheet 3p are picked up from the carrier film 1. In a state where a certain tension is applied to the adhesive film 10, the adhesive film 10 is moved in the direction of the arrow shown in FIG. 7 while the surface of the carrier film 1 side of the adhesive film 10 is brought into contact with the wedge-shaped member 60. Thereby, as shown in the figure, the front of the adhesive sheet 3p and the protective member 5p is in a state of being floated from the carrier film 1. In this state, for example, the adhesive sheet 3p and the protective member 5p are picked up by the attractive pickup device 65. For example, by using a pickup device such as a camera including the protective member 5p as the pickup device 65, it is possible to grasp information such as the presence or absence of the adhesive sheet 3p and the protective member 5p, and the orientation thereof. Based on this information, subsequent steps can be appropriately implemented.

Then, the adhesive sheet 3p covered with the protective member 5p is arrange | positioned in predetermined position and direction of a board | substrate (not shown). In this state, temporary pressure bonding of the adhesive sheet 3p to the substrate is performed. The temporary compression bonding may be performed under conditions of, for example, a temperature of 60 ° C. to 150 ° C. and a pressing pressure of 0.05 MPa to 1 MPa for 0.1 to 10 seconds. The temporary pressure bonding causes the adhesive sheet 3p to be weaker than the substrate but not to be peeled off from the substrate. In this state, the protective member 5p is peeled from the adhesive sheet 3p using an adhesive tape or the like. A semiconductor wafer having a shape different from that of the adhesive sheet 3p is placed on the surface of the adhesive sheet 3p exposed by the peeling of the protective member 5p, and then the semiconductor wafer is pressure-bonded to the substrate. The compression bonding may be performed under conditions of, for example, a temperature of 60 ° C. to 150 ° C. and a pressing pressure of 0.05 MPa to 1 MPa for 0.1 to 10 seconds. In addition, as the substrate is thinned, the heating temperature is desirably low, the compression bonding temperature is preferably 160 ° C or lower, and the subsequent heat curing temperature is also preferably 160 ° C or lower.

<Semiconductor Device> FIG. 8 is a cross-sectional view schematically showing an example of a semiconductor device manufactured using the adhesive sheet 3p. The semiconductor device 100 shown in the figure includes: a semiconductor wafer S; a substrate 50 electrically connected to the semiconductor wafer S; and an adhesive sheet 3p disposed between the semiconductor wafer S and the substrate 50 and connecting the semiconductor wafer S and the substrate 50. . The shape of the semiconductor wafer S is, for example, rectangular or square. In contrast, the shape of the adhesive sheet 3p is T-shaped, and the shape of the semiconductor wafer S is different from the shape of the adhesive sheet 3p. By adopting the configuration, as shown in FIG. 4, in the region R1 and the region R2, the substrate 50 and the semiconductor wafer S can be electrically connected by the conductive material A1 and the conductive material A2.

The manufacturing method of the semiconductor device 100 includes a step of preparing a laminated body (not shown) in which a substrate 50, an adhesive sheet 3p, and a semiconductor wafer S are laminated in this order; and heating the laminated body with the adhesive sheet interposed therebetween. The step of attaching the substrate 50 to the semiconductor wafer S. The temperature at which the substrate 50 and the semiconductor wafer S are bonded is preferably a low temperature, for example, 160 ° C. or lower.

As mentioned above, although embodiment of this indication was described in detail, this indication is not limited to the said embodiment. For example, in the embodiment described above, the use of a colored protective film 5 is exemplified so that the presence or absence of the protective member 5p can be grasped by a camera or the like. Alternatively, the protective member 5p may be marked at a predetermined position. mark. If the adhesive sheet 3p is colored, the protective member 5p may not be provided. Furthermore, if the orientation of the adhesive sheet 3p is not a problem, it is not necessary to identify the orientation. [Example]

Hereinafter, the present disclosure will be described based on examples. The present disclosure is not limited to the following examples.

<Example 1> (Preparation of Adhesive Varnish) The following materials were mixed and vacuum degassed to obtain an adhesive varnish. × Thermoplastic resin: HTR-860P-3 (trade name, manufactured by Nagase ChemteX Co., Ltd., glycidyl-containing acrylic rubber, molecular weight 1 million, Tg-7 ° C) 100 parts by mass × thermosetting resin : YDCN-700-10 (trade name, manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd., o-cresol novolac epoxy resin, epoxy equivalent 210) 30 parts by mass × thermosetting resin: LF-4871 (trade name , Manufactured by Di Edison (DIC) Co., Ltd., 95 parts by mass of bisphenol A epoxy resin, epoxy equivalent 118) × thermosetting resin: YDF-8170C (trade name, manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd. Bisphenol F-type epoxy resin, epoxy equivalent 157) 100 parts by mass × hardening accelerator: 2PZ-CN (trade name, manufactured by Shikoku Chemical Industry Co., Ltd., imidazole compound) 0.3 parts by mass × surface treatment filler: SC- 2050-HLG (trade name, manufactured by Admatechs Co., Ltd.) 330 parts by mass × silane coupling agent: A-189 (trade name, manufactured by NUC Corporation, γ-mercaptopropyltrimethoxysilane) 0.9 Parts by mass × Silane coupling agent: A-1160 (trade name, manufactured by NUC Corporation, γ-ureidopropyltriethoxysilane) 2 parts by mass

(Production of Adhesive Film) The adhesive varnish was applied to a surface die-cut polyethylene terephthalate film (manufactured by Teijin film solutions Co., Ltd.) with a thickness of 50 μm, trade name: Teijin tetoron film (A-63). After the drying step, a film having an adhesive layer with a thickness of 25 μm formed on one side of the polyethylene terephthalate film (carrier film) was obtained. This film was laminated to a colored polyethylene film (Tamapoly Co., Ltd., TDM-1) having a thickness of 50 μm to obtain a laminated film. The laminated film was slit into a 15 mm width to obtain a band-shaped laminated body.

The laminated body obtained in the above-mentioned manner was die-cut using the apparatus having the configuration shown in FIG. 6, thereby obtaining an adhesive film of this embodiment. The shape of the adhesive sheet was a shape with a part of corners (area: 29 mm ² ) of a rectangle with a length of about 7 mm and a width of about 6 mm. The pitch P is set to approximately 9 mm. The area ratio R of the adhesive sheet was 23%.

<Example 2> An adhesive film was produced in the same manner as in Example 1 except that the size and pitch of the adhesive sheet were changed.

<Example 3> An adhesive film was produced in the same manner as in Example 2 except that a surface-treated carrier film different from the carrier film used in Example 2 was used and the shape of the adhesive sheet was changed. As a carrier film, a 50 μm-thick surface die-cut polyethylene terephthalate film (manufactured by Teijin film solutions Co., Ltd., trade name: teijin tetoron film) A-53).

<Example 4> An adhesive film was produced in the same manner as in Example 2 except that a protective film different from the protective film used in Example 2 was used. As the protective film, an uncolored polyethylene film (manufactured by Tamapoly Co., Ltd., trade name: NF-13, thickness: 20 μm) was used.

<Example 5> An adhesive film was produced in the same manner as in Example 2 except that a protective film different from the protective film used in Example 2 was used. As the protective film, an uncolored polyethylene film (manufactured by Tamapoly Co., Ltd., trade name: GF-3, thickness: 30 μm) was used.

<Example 6> An adhesive film was produced in the same manner as in Example 2 except that a carrier film different from the carrier film used in Example 2 was used. As the carrier film, a polyethylene terephthalate film (manufactured by Teijin film solutions Co., Ltd. without surface die-cutting treatment) was used, trade name: Teijin tetoron film G2 , Thickness: 50 μm).

<Example 7> An adhesive film was produced in the same manner as in Example 2 except that a carrier film different from the carrier film used in Example 2 was used. As the carrier film, a polyethylene terephthalate film (manufactured by Teijin film solutions Co., Ltd. without surface die-cutting treatment) was used, trade name: Teijin tetoron film G2 , Thickness: 38 μm).

<Example 8> An adhesive film was produced in the same manner as in Example 2 except that the size of the adhesive sheet was changed.

<Example 9> An adhesive film was produced in the same manner as in Example 2 except that the size of the adhesive sheet was changed.

The following films were evaluated for the adhesive film of the example. The results are shown in Tables 1 and 2. (1) Area ratio R of the adhesive sheet The area A (mm ² ), the pitch P (mm), and the width W (mm) of the carrier film of the adhesive sheet shown in Table 1 were substituted into the following formula to calculate the adhesive strength. The area ratio R (%) of the tablet. Area ratio R (%) = A / (P × W) × 100

(2) Light transmittance V-570 (trade name) manufactured by JASCO Corporation was used to measure the light transmittance of light at a wavelength of 500 nm in a region where an adhesive sheet and a protective member covering the carrier film were provided on a carrier film.

(3) Adhesion of carrier film (90 ° peel strength) The laminated film (carrier film / adhesive layer / protective film) without die cutting was cut to a width of 20 mm. After attaching the surface on the carrier film side to the aluminum plate using a double-sided tape, the protective film was peeled off. Thereafter, while maintaining the angle of the adhesive layer with respect to the carrier film at 90 °, the adhesive layer was pulled upward to peel the adhesive layer from the carrier film. The pulling speed was set to 50 mm / min, and the measurement ambient temperature was set to 23 ° C ± 2 ° C. Determine the force required to lift. The measured value (mN) and the width of the sample (20 mm) were substituted into the following formula to calculate the adhesion between the carrier film and the adhesive layer. Adhesion (N / m) = Measured value (mN) / 20 (mm)

(4) Adhesion of protective film (90 ° peel strength) The laminated film (carrier film / adhesive layer / protective film) without die cutting was cut into a width of 20 mm. After the carrier film was peeled off, the surface of the adhesive layer side was attached to an aluminum plate using a double-sided tape, and then, while maintaining the angle of the protective film with respect to the adhesive layer at 90 °, the protective film was pulled upwards, and This peels the adhesive layer from the protective film. The pulling speed was set to 300 mm / min, and the measurement ambient temperature was set to 23 ° C ± 2 ° C. Determine the force required to lift. The measured value (mN) and the width of the sample (20 mm) were substituted into the following formula to calculate the adhesion between the protective film and the adhesive layer. Adhesion (N / m) = Measured value (mN) / 20 (mm)

[Table 1]

[Table 2] [Industrial availability]

According to the present disclosure, it is possible to provide an adhesive film including an adhesive sheet having a complicated shape, which is useful for efficiently performing a subsequent step in a manufacturing process of a semiconductor device. In addition, according to the present disclosure, a semiconductor device using a complex-shaped adhesive sheet and a method for manufacturing the same can be provided.

1‧‧‧ carrier film

3‧‧‧ Adhesive layer

3A‧‧‧Line

3p‧‧‧ Adhesive Tablets

5‧‧‧ protective film

5p‧‧‧protective member

10‧‧‧ Adhesive film

20‧‧‧Laminated body

30‧‧‧ no need part

50‧‧‧ substrate

51‧‧‧rotating body

51a, 52a‧‧‧rotation shaft

51c‧‧‧Blade

52‧‧‧roller

60‧‧‧ Wedge-shaped member

65‧‧‧Pick up device

100‧‧‧ semiconductor device

A1, A2‧‧‧ conductive material

C1 ～ C12‧‧‧ Adhesive corner

F1‧‧‧ Adhesive film surface (first side)

F2‧‧‧ Adhesive film side (second side)

P‧‧‧Pitch

R1, R2‧‧‧ area

S‧‧‧Semiconductor wafer

W‧‧‧Width

X‧‧‧ arrow

II-II‧‧‧ hatching

FIG. 1 is a perspective view schematically showing an embodiment of the adhesive film of the present disclosure. FIG. 2 is a cross-sectional view taken along a line II-II shown in FIG. 1. 3 (a) to 3 (f) are plan views showing changes in the shape of the adhesive sheet. 4 is a plan view showing an example of the arrangement of a T-shaped adhesive sheet and a semiconductor wafer. FIG. 5 is a cross-sectional view schematically showing a laminated body in which a carrier film, an adhesive layer, and a protective film are sequentially laminated. FIG. 6 is a perspective view showing a case where a plurality of adhesive sheets are formed on a carrier film by die cutting. FIG. 7 is a cross-sectional view schematically showing a state in which an adhesive sheet and a protective member covering the adhesive sheet are picked up from a carrier film. FIG. 8 is a cross-sectional view schematically showing an example of a semiconductor device manufactured using the adhesive sheet of the present disclosure.

Claims (17)

An adhesive film for manufacturing a semiconductor device, comprising: a belt-shaped carrier film having a width of 100 mm or less; and a plurality of adhesive agent sheets arranged on the carrier film so as to be aligned along the long-side direction of the carrier film; The adhesive sheet has a shape in which at least one of a convex portion and a concave portion is formed on at least one side of a rectangle or a square. The adhesive film according to item 1 of the patent application scope, wherein the adhesive sheet has more than 6 corners. The adhesive film according to item 2 of the patent application scope, wherein the shape of the adhesive sheet is L-shaped. The adhesive film according to item 1 of the patent application scope, wherein the adhesive sheet has more than 8 corners. The adhesive film according to any one of claims 1 to 4, wherein the area of the adhesive sheet is 10 mm ² to 200 mm ² . The adhesive film according to any one of claims 1 to 5, in which the surface of the carrier film is covered by the plurality of adhesive sheets based on the area of the carrier film. The proportion of the area is 10% to 60%. The adhesive film according to any one of claims 1 to 6, wherein one or more rows including the plurality of adhesive sheets are formed on the carrier film. The adhesive film according to any one of claims 1 to 7, wherein the adhesive sheet is formed by die-cutting an adhesive layer formed to cover a surface of the carrier film. Former. The adhesive film according to any one of claims 1 to 8 in the scope of the patent application, wherein the adhesive force between the carrier film and the adhesive sheet is 0.5 N / m to 18 N / m. The adhesive film according to any one of claims 1 to 9, further comprising a protective member covering the first surface of the adhesive sheet opposite to the first surface of the carrier film side. The second surface on one side has the same shape as the adhesive sheet. The adhesive film according to claim 10, wherein the adhesive sheet is formed by die-cutting an adhesive layer formed so as to cover a surface of the carrier film, and the protective member is formed by applying The protective film arranged so as to cover the adhesive layer is formed by die cutting. The adhesive film according to claim 10 or claim 11, wherein the light transmittance of the protective member is lower than the light transmittance of the carrier film. The adhesive film according to any one of claims 10 to 12, in which the adhesive force between the adhesive sheet and the protective member is 16 N / m or less. A semiconductor device includes: a substrate; a semiconductor wafer; and the adhesive sheet of the adhesive film according to any one of claims 1 to 13 of a patent application range; and the adhesive sheet is disposed on the adhesive sheet A shape between the substrate and the semiconductor wafer and the substrate and the semiconductor wafer are different from each other. A method for manufacturing a semiconductor device, wherein the adhesive sheet for an adhesive film according to any one of claims 1 to 13 of a patent application range is used. The method for manufacturing a semiconductor device according to item 15 of the scope of patent application, comprising: a step of preparing a laminated body having a substrate, the adhesive sheet, and a semiconductor wafer sequentially laminated; and heating the laminated body The step of bonding the substrate to the semiconductor wafer through the adhesive sheet; and the shape of the semiconductor wafer is different from the shape of the adhesive sheet. The method for manufacturing a semiconductor device according to item 16 of the scope of patent application, wherein the semiconductor wafer and the substrate are bonded by the adhesive sheet by heating the laminated body to a temperature of 160 ° C. or lower.