JP7272400B2 - Adhesive composition, adhesive film, and method for producing connected body - Google Patents

Description

TECHNICAL FIELD The present disclosure relates to an adhesive composition used for bonding a semiconductor chip and a flexible printed circuit board, an adhesive film comprising a plurality of adhesive strips made of this adhesive composition, and a method for manufacturing a connecting body.

Conventionally, a semiconductor device is manufactured through the following steps. First, a semiconductor wafer is attached to an adhesive sheet for dicing, and in that state, the semiconductor wafer is separated into semiconductor chips. After that, a pick-up process, a mounting process, a reflow process, a die bonding process, and the like are performed. Patent Literature 1 discloses an adhesive sheet (die bond dicing sheet) having both a function of fixing a semiconductor wafer in a dicing process and a function of bonding a semiconductor chip to a substrate in a die bonding process.

JP 2007-288170 A

By the way, in recent years, along with the evolution of semiconductor devices for small devices represented by smartphones, the manufacturing process of conventional semiconductor devices has changed remarkably from the conventional ones. For example, a process that uses the adhesive sheet (die bond dicing sheet) described in Patent Document 1 and does not perform the dicing process and the die bonding process, or a process that does not perform the reflow process is being put into practical use. Along with this, there is a demand for new types of adhesive films used in the manufacturing process of semiconductor devices. In addition to this situation, the inventors of the present invention have developed a semiconductor chip having a corresponding shape in a specific limited area of a substrate in order to cope with the increasing functionality and thinning of small devices on which semiconductor devices are mounted. We proceeded with the development of an adhesive film that is easy to use for adhering

One aspect of the present disclosure provides an adhesive composition that exhibits excellent adhesiveness between a semiconductor chip and a flexible printed circuit board and that can suitably perform wire bonding after bonding the semiconductor chip and the flexible printed circuit board. . One aspect of the present disclosure provides an adhesive film comprising a plurality of adhesive strips made of this adhesive composition, and a method for manufacturing a connected body.

An adhesive composition according to one aspect of the present disclosure is used for bonding a semiconductor chip and a flexible printed circuit board, and has a melt viscosity of 3500 to 20000 Pa·s at 130°C.

According to the adhesive composition, the melt viscosity at 130° C. is 3500 to 20000 Pa·s, so that excellent adhesion is achieved in the bonding step between the semiconductor chip and the flexible printed circuit board (hereinafter referred to as “FPC board”). It is possible to achieve a sufficiently high level of both excellent wire bonding properties in the subsequent wire bonding process between the semiconductor chip and the FPC board. The melt viscosity of the adhesive composition at 130°C is 20000 Pa·s or less (the adhesive composition is moderately soft at 130°C), thereby achieving excellent adhesion in the bonding process between the semiconductor chip and the FPC substrate. can. On the other hand, the melt viscosity of the adhesive composition at 130 ° C. is 3500 Pa s or more (the adhesive composition is moderately hard at 130 ° C.), so that the adhesive layer ( (Adhesive composition interposed between the semiconductor chip and the FPC board) can be sufficiently suppressed from changing in thickness, thereby achieving excellent wire bonding properties. In the wire bonding process, the positions (for example, height positions) of the semiconductor chip and the FPC board to be connected are set in advance. Otherwise (see FIG. 8(b)), wire bonding cannot be suitably performed.

The adhesive composition contains at least a thermoplastic resin and a thermosetting resin, and when the content of the thermoplastic resin is 100 parts by mass, the content of the thermosetting resin is 70 to 240 parts by mass. is preferred. When the content of the thermosetting resin is within the above range, it is easy to achieve both excellent adhesiveness and wire bondability. From the viewpoint of adjusting the melt viscosity (hardness) of the adhesive composition at 130° C., the adhesive composition may further contain a filler. The amount is preferably 10 to 450 parts by weight.

An adhesive film according to one aspect of the present disclosure includes a strip-shaped carrier film having a width of 100 mm or less, and a plurality of adhesive pieces arranged on the carrier film so as to line up in the longitudinal direction of the carrier film. The adhesive strip consists of the adhesive composition described above.

According to this adhesive film, a plurality of adhesive strips arranged side by side on a carrier film are sequentially picked up, and then each adhesive strip is placed on a predetermined area of an adherend (semiconductor chip or FPC substrate). It is possible to efficiently carry out the bonding process between the semiconductor chip and the FPC board. For example, if a band-shaped adhesive film is wound around a reel, the adhesion process can be carried out more efficiently by a roll-to-roll method. The shape of the adhesive piece may be appropriately set according to the shape of the region of the FPC board to which the semiconductor chip is to be bonded or the shape of the semiconductor chip.

The size, number, etc. of the adhesive pieces arranged on the carrier film may be appropriately set according to the design of the connecting body to be manufactured. For example, the area of one adhesive strip can range from 10 to 200 mm ² . One or more rows of the adhesive strips may be formed on the carrier film. A plurality of adhesive strips can be formed, for example, by die-cutting an adhesive layer formed over the surface of the carrier film.

The adhesive film according to the present disclosure may further include a protective member that covers the second surface of the adhesive piece opposite to the first surface on the carrier film side and has the same shape as the adhesive piece. By covering the adhesive piece with the protective member, it is possible to prevent dust and the like from adhering to the adhesive piece until use. The adhesive piece and the protective member can be formed by die-cutting an adhesive layer formed to cover the surface of the carrier film and a protective film arranged to cover the adhesive layer.

According to one aspect of the present disclosure, there is provided an adhesive composition that exhibits excellent adhesion between a semiconductor chip and an FPC board, and that can suitably perform wire bonding after bonding the semiconductor chip and the FPC board. According to one aspect of the present disclosure, there are provided an adhesive film comprising a plurality of adhesive strips made of this adhesive composition, and a method for manufacturing a connected body.

FIG. 1 is a perspective view schematically showing one embodiment of the adhesive film according to the present disclosure. FIG. 2 is a cross-sectional view along line II-II shown in FIG. FIG. 3 is a cross-sectional view schematically showing a laminate in which a carrier film, an adhesive layer and a protective film are laminated in this order. FIG. 4 is a perspective view showing how a plurality of adhesive strips are formed on a carrier film by die cutting. FIG. 5 is a cross-sectional view schematically showing how the adhesive piece and the protective member covering it are picked up from the carrier film. 6(a) and 6(b) are cross-sectional views schematically showing the state of the adhesive pieces before the step of bonding the front end portion of the FPC board to the semiconductor chip. FIG. 7 schematically shows how adhesive pieces between the tip of the FPC board and the semiconductor chip are cured while holding the FPC board by applying an upward force to the FPC board. It is a sectional view showing. FIG. 8(a) is a cross-sectional view schematically showing a module in which the tip of the FPC board can be suitably bonded to the semiconductor chip, and FIG. FIG. 10 is a cross-sectional view schematically showing a module whose tip portion could not be properly bonded.

Hereinafter, embodiments of the present disclosure will be described with appropriate reference to the drawings. In addition, this invention is not limited to the following embodiment. As used herein, (meth)acryl means acryl or methacryl.

<Adhesive film>
FIG. 1 is a perspective view schematically showing an adhesive film according to this embodiment. FIG. 2 is a cross-sectional view along line II-II shown in FIG. The adhesive film 10 shown in these figures includes a strip-shaped carrier film 1 having a width of 100 mm or less, and a plurality of adhesive films arranged on the carrier film 1 in the longitudinal direction (the direction of the arrow X shown in FIG. 1). An adhesive piece 3p and a protective member 5p covering the surface F2 of the adhesive piece 3p and having the same shape as the adhesive piece 3p are provided. As shown in FIG. 2, the surface F2 (second surface) of the adhesive piece 3p is the surface opposite to the surface F1 (first surface) of the adhesive piece 3p on the carrier film 1 side.

The adhesive film 10 is applied for adhesion between a semiconductor chip and an FPC board. According to the adhesive film 10, the plurality of adhesive strips 3p arranged so as to line up on the carrier film 1 can be sequentially picked up, and then each adhesive strip 3p can be arranged on a predetermined region of the substrate, thereby providing a semiconductor device. It is possible to efficiently perform the bonding process between the chip and the FPC board.

The adhesive piece 3p is made of an adhesive composition having a melt viscosity of 3500 to 20000 Pa·s at 130°C. The melt viscosity of this adhesive composition at 130° C. is preferably 4,000 to 19,000 Pa·s, more preferably 4,000 to 15,000 Pa·s, and even more preferably 4,000 to 13,000 Pa·s. Since the melt viscosity of the adhesive composition at 130 ° C. is 3500 to 20000 Pa s, excellent adhesion in the bonding process between the semiconductor chip and the FPC board, and the subsequent wire bonding process between the semiconductor chip and the FPC board. A sufficiently high level of both excellent wire bondability can be achieved.

Specifically, when the melt viscosity of the adhesive composition at 130° C. is 20000 Pa·s or less, excellent adhesion can be achieved in the bonding step between the semiconductor chip and the FPC substrate. On the other hand, since the melt viscosity of the adhesive composition at 130 ° C. is 3500 Pa s or more, the adhesive layer (adhesive composition interposed between the semiconductor chip and the FPC substrate) in the wire bonding process performed after the bonding process It is possible to sufficiently suppress the change in the thickness of the object), thereby achieving excellent wire bondability. In the wire bonding process, the positions (for example, height positions) of the semiconductor chip and the FPC board to be connected are set in advance. If the thickness becomes uneven or becomes excessively thick (see FIG. 8(b)), wire bonding cannot be suitably performed.

As used herein, the melt viscosity of the adhesive composition at 130°C is a value measured by the following method. First, an adhesive piece (adhesive layer) having a thickness of 25 μm is attached to a Teflon (registered trademark) sheet and pressed with a roll (temperature: 60° C., linear pressure: 0.2 MPa, feeding speed: 0.5 m/min). After that, the PET film is peeled off, and the adhesive piece is overlaid with another adhesive layer having a thickness of 25 μm and laminated under pressure. This is repeated to obtain an adhesive sample with a thickness of about 200 μm. The melt viscosity of the obtained adhesive sample was measured using a viscoelasticity measuring device (manufactured by Rheometrics Scientific FE Co., Ltd., trade name: ARES) using a parallel plate with a diameter of 25 mm as a measurement plate, and the heating rate: 10°C/min, frequency: 1Hz, and temperature range from 20°C to 200°C. From this measurement result, the melt viscosity at 130°C is determined.

In this embodiment, as shown in FIG. 1, the adhesive piece 3p having a shape like a thick T is exemplified. Alternatively, it may be appropriately set according to the shape of the semiconductor chip. 1 and 2 illustrate the case where one row 3A made up of a plurality of adhesive strips 3p is provided on the carrier film 1, but two or more rows 3A are provided on the carrier film 1. may have been

The size of the adhesive piece 3p in this embodiment is assumed to be sufficiently small, and the area of one adhesive piece 3p is, for example, 10 to 200 mm ² . The ratio of the area of the surface of the carrier film 1 covered with the plurality of adhesive strips 3p (the area ratio of the adhesive strips) is, for example, 10 to 60% based on the area of the carrier film 1, It may be 10-35%. This area ratio is obtained by dividing the area A of one adhesive piece 3p by the pitch of the adhesive pieces 3p provided on the carrier film 1 (pitch P in FIG. 1) and the width of the carrier film 1 (width W in FIG. ) may be calculated by dividing by the product. That is, the area ratio R may be a value calculated by the following formula.
Area ratio R (%) = A/(P x W) x 100

The configuration of the adhesive film 10 will be described below.
[Carrier film]
As described above, the carrier film 1 is strip-shaped and has a width of 100 mm or less. The width of the carrier film 1 may be appropriately set according to the size of the adhesive strips 3p arranged thereon and the number of rows 3A. For example, as shown in FIG. 1, when the number of rows 3A is one, the width of the carrier film 1 is preferably 10-50 mm, and may be 10-30 mm or 10-20 mm. Since the width of the carrier film 1 is 10 mm or more, it is easy to prevent deterioration of workability due to twisting of the carrier film 1 when a roll-to-roll method is adopted.

The material of the carrier film 1 is not particularly limited as long as it can sufficiently withstand the tension applied during the manufacturing process of the adhesive film 10 and the manufacturing process of the semiconductor device. The carrier film 1 is preferably transparent from the viewpoint of visibility of the adhesive piece 3p and/or the protective member 5p arranged thereon. Examples of the carrier film 1 include polyester films such as polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, polyvinyl acetate film, poly-4-methylpentene-1, and ethylene-vinyl acetate film. Polyolefin films such as polymers, homocopolymers such as ethylene-ethyl acrylate copolymers or copolymers, or mixtures thereof, plastic films such as polyvinyl chloride films, polyimide films, and the like can be used. The carrier film 1 may have a single layer structure or a multilayer structure.

The thickness of the carrier film 1 may be appropriately selected within a range that does not impair workability, and may be, for example, 10 to 200 μm, 20 to 100 μm, or 25 to 80 μm. These thickness ranges are practically acceptable and economically effective ranges.

In order to increase the adhesion of the adhesive piece 3p to the carrier film 1, the surface of the carrier film 1 is subjected to chemical or physical treatment such as corona treatment, chromic acid treatment, ozone exposure, flame exposure, high voltage shock exposure, and ionizing radiation treatment. Surface treatment may be applied. As the carrier film 1, a film made of fluororesin and having a low surface energy can also be used. Examples of such films include A-63 (release agent: modified silicone type) manufactured by Teijin DuPont Films Ltd., and A-31 (release agent: Pt-based) manufactured by Teijin DuPont Films Ltd. silicone), etc.

In order to prevent the adhesion of the adhesive piece 3p to the carrier film 1 from becoming excessively high, the surface of the carrier film 1 is coated with a release agent such as a silicone-based release agent, a fluorine-based release agent, or a long-chain alkyl acrylate-based release agent. A release layer composed of a mold agent may be formed.

The adhesion between the carrier film 1 and the adhesive piece 3p is preferably 0.5 to 18 N/m, more preferably 2 to 10 N/m, 2 to 6 N/m or 2 to 4 N/m. m may be used. When the adhesive strength is 0.5 N/m or more, it is easy to prevent the adhesive piece 3p from being carelessly peeled off from the carrier film 1 in the process of manufacturing the adhesive film 10. On the other hand, when the adhesive strength is 18 N/m or less, Therefore, when the adhesive film 10 is used, it is easy to stably pick up the adhesive piece 3p and the protective member 5p covering the adhesive piece 3p from the carrier film 1. FIG. The adhesive strength of the adhesive piece 3p to the carrier film 1 means the 90° peel strength. Specifically, an adhesive layer having a width of 20 mm and having the same composition as the adhesive piece 3p is formed on the carrier film 1. It means the peel strength measured when a sample is prepared and the adhesive layer is peeled from the carrier film at an angle of 90° and at a peel speed of 50 mm/min.

[Adhesive piece]
The adhesive piece 3p is formed by simultaneously punching out the adhesive layer 3 formed so as to cover the surface of the carrier film 1 and the protective film 5 arranged so as to cover the adhesive layer 3, thereby forming the protective member 5p. (See FIG. 4). The thickness of the adhesive piece 3p may be appropriately selected within a range that does not impair workability, and may be, for example, 1 to 200 μm, 3 to 150 μm, or 5 to 150 μm. When the thickness of the adhesive piece 3p is 1 μm or more or 5 μm or more, it is easy to secure sufficient adhesiveness. It is easy to suppress protruding from the member 5p.

The adhesive composition that constitutes the adhesive piece 3p preferably has both moderate softness (adhesion) and the property of not excessively stretching at 130°C. The adhesive piece 3p preferably contains a thermoplastic resin, a thermosetting resin, a curing accelerator, and a filler, and may contain a photoreactive monomer, a photopolymerization initiator, and the like, if necessary.

(Thermoplastic resin)
As the thermoplastic resin, a resin having thermoplasticity, or a resin having thermoplasticity at least in an uncured state and forming a crosslinked structure after heating can be used. As a thermoplastic resin, a (meth)acrylic copolymer having a reactive group (hereinafter referred to as "reactive group-containing (meth)acrylic polymer) is preferred.
When a reactive group-containing (meth)acrylic copolymer is included as the thermoplastic resin, the adhesive piece 3p may be in a mode that does not include the thermosetting resin. That is, an aspect including a reactive group-containing (meth)acrylic copolymer, a curing accelerator, and a filler may be used.
A thermoplastic resin can be used individually by 1 type or in combination of 2 or more types.

Examples of the (meth)acrylic copolymer include (meth)acrylic acid ester copolymers such as acrylic glass and acrylic rubber, and acrylic rubber is preferred. Acrylic rubber is preferably composed mainly of acrylic acid ester and is formed by copolymerization of monomers selected from (meth)acrylic acid ester and acrylonitrile.

(Meth)acrylates include methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, butyl acrylate, isobutyl acrylate, hexyl acrylate, cyclohexyl acrylate, 2-ethylhexyl acrylate, lauryl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, Isopropyl acrylate, butyl methacrylate, isobutyl methacrylate, hexyl methacrylate, cyclohexyl methacrylate, 2-ethylhexyl methacrylate, lauryl methacrylate and the like.
As the (meth)acrylic acid ester copolymer, a copolymer containing butyl acrylate and acrylonitrile as copolymer components, and a copolymer containing ethyl acrylate and acrylonitrile as copolymer components are preferable.

The reactive group-containing (meth)acrylic copolymer is preferably a reactive group-containing (meth)acrylic copolymer containing a (meth)acrylic monomer having a reactive group as a copolymerization component. Such a reactive group-containing (meth)acrylic copolymer can be obtained by copolymerizing a (meth)acrylic monomer having a reactive group and a monomer composition containing the above monomers. .

The reactive group is preferably an epoxy group, a carboxyl group, an acryloyl group, a methacryloyl group, a hydroxyl group, or an episulfide group from the viewpoint of improving heat resistance, and more preferably an epoxy group or a carboxyl group from the viewpoint of crosslinkability.

In the present embodiment, the reactive group-containing (meth)acrylic copolymer is preferably an epoxy group-containing (meth)acrylic copolymer containing a (meth)acrylic monomer having an epoxy group as a copolymerization component. In this case, the (meth)acrylic monomer having an epoxy group includes glycidyl acrylate, 4-hydroxybutyl acrylate glycidyl ether, 3,4-epoxycyclohexylmethyl acrylate, glycidyl methacrylate, 4-hydroxybutyl methacrylate glycidyl ether, 3,4- Epoxycyclohexylmethyl methacrylate and the like are included. The (meth)acrylic monomer having a reactive group is preferably glycidyl acrylate or glycidyl methacrylate from the viewpoint of heat resistance.

The Tg of the thermoplastic resin is preferably -50°C to 50°C. When the Tg of the thermoplastic resin is 50° C. or less, it is easy to secure the flexibility of the adhesive piece 3p. In addition, when there are irregularities when the adhesive is attached to the adherend, it becomes easier to follow the unevenness, and it comes to have an appropriate adhesiveness. On the other hand, when the Tg of the thermoplastic resin is −50° C. or higher, it is easy to prevent the flexibility of the adhesive piece 3p from becoming too high, and excellent handleability, adhesiveness, and peelability can be achieved.

The Tg of a thermoplastic is the midpoint glass transition temperature value obtained by differential scanning calorimetry (DSC). Specifically, the Tg of the thermoplastic resin is measured by measuring the heat quantity change under the conditions of a temperature increase rate of 10 ° C./min and a measurement temperature of -80 to 80 ° C., and calculated by a method in accordance with JIS K 7121: 1987. is the point glass transition temperature.

The weight average molecular weight of the thermoplastic resin is preferably 100,000 or more and 2,000,000 or less. When the weight-average molecular weight is 100,000 or more, heat resistance can be easily ensured when used for temporary fixation. On the other hand, when the weight-average molecular weight is 2,000,000 or less, when used for temporary fixation, it is easy to suppress deterioration of flow and deterioration of sticking properties. From the above-described viewpoint, the weight average molecular weight of the thermoplastic resin is more preferably 500,000 or more and 2,000,000 or less, and further preferably 1,000,000 or more and 2,000,000 or less. The weight-average molecular weight is a polystyrene-equivalent value obtained by gel permeation chromatography (GPC) using a standard polystyrene calibration curve.

When the (meth)acrylic copolymer having a reactive group contains glycidyl acrylate or glycidyl methacrylate as a copolymerization component, the total content of these is 0.1 to 20% by mass based on the total amount of the copolymerization component. preferably 0.5 to 15% by mass, even more preferably 1.0 to 10% by mass. When the content is within the above range, it is easy to achieve a higher level of flexibility, adhesiveness and peelability of the adhesive piece 3p.

As the (meth)acrylic copolymer having a reactive group as described above, those obtained by polymerization methods such as pearl polymerization and solution polymerization may be used. Alternatively, a commercially available product such as HTR-860P-3CSP (trade name, manufactured by Nagase ChemteX Corporation) may be used.

(Thermosetting resin)
As the thermosetting resin, any resin that can be cured by heat can be used without particular limitation. Thermosetting resins include epoxy resins, acrylic resins, silicone resins, phenol resins, thermosetting polyimide resins, polyurethane resins, melamine resins, and urea resins. These can be used individually by 1 type or in combination of 2 or more types.

The epoxy resin is not particularly limited as long as it cures and has a heat-resistant effect. As the epoxy resin, a bifunctional epoxy resin such as bisphenol A type epoxy, a phenol novolak type epoxy resin, a cresol novolak type epoxy resin, or the like can be used. Conventionally known epoxy resins such as polyfunctional epoxy resins, glycidylamine type epoxy resins, heterocycle-containing epoxy resins, and alicyclic epoxy resins can be used as the epoxy resin.

Examples of the bisphenol A type epoxy resins include Epikote 807, Epikote 815, Epikote 825, Epikote 827, Epikote 828, Epikote 834, Epikote 1001, Epikote 1004, Epikote 1007, Epikote 1009 (all manufactured by Mitsubishi Chemical Corporation), DER- 330, DER-301, DER-361 (all manufactured by Dow Chemical Co.), YD8125 and YDF8170 (all manufactured by Tohto Kasei Co., Ltd.).
Examples of phenolic novolac epoxy resins include Epicoat 152 and Epicote 154 (both manufactured by Mitsubishi Chemical Corporation), EPPN-201 (manufactured by Nippon Kayaku Co., Ltd.), and DEN-438 (manufactured by Dow Chemical Co., Ltd.). .
Examples of o-cresol novolac type epoxy resins include YDCN-700-10 (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, and EOCN-1027 (any (manufactured by Nippon Kayaku Co., Ltd.), YDCN701, YDCN702, YDCN703 and YDCN704 (all manufactured by Tohto Kasei Co., Ltd.).
Examples of polyfunctional epoxy resins include Epon 1031S (manufactured by Mitsubishi Chemical Corporation), Araldite 0163 (manufactured by BASF Japan), Denacol EX-611, EX-614, EX-614B, EX-622, EX-512, EX- 521, EX-421, EX-411, EX-321 (all manufactured by Nagase ChemteX Corporation) and the like.
Amine-type epoxy resins include Epicoat 604 (manufactured by Mitsubishi Chemical Corporation), YH-434 (manufactured by Tohto Kasei Co., Ltd.), TETRAD-X, TETRAD-C (both manufactured by Mitsubishi Gas Chemical Co., Ltd.), and ELM. -120 (manufactured by Sumitomo Chemical Co., Ltd.) and the like.
Araldite PT810 (manufactured by BASF Japan), ERL4234, ERL4299, ERL4221, ERL4206 (all manufactured by Union Carbide) and the like can be used as the heterocycle-containing epoxy resin. These epoxy resins can be used singly or in combination of two or more.

Commonly used known resins can be used as the epoxy resin curing agent which is a part of the thermosetting resin component. Specifically, amines, polyamides, acid anhydrides, polysulfides, boron trifluoride, bisphenols having two or more phenolic hydroxyl groups in one molecule such as bisphenol A, bisphenol F, bisphenol S, phenol novolak resins , bisphenol A novolak resin, cresol novolak resin and other phenol resins. Phenol resins such as phenol novolak resins, bisphenol A novolak resins, and cresol novolak resins are particularly preferable as epoxy resin curing agents from the viewpoint of excellent electrolytic corrosion resistance when moisture is absorbed.
The epoxy curing agent may be used together with the epoxy resin, or may be used alone.

Among the above phenolic resin curing agents, Phenolite LF2882, Phenolite LF2822, Phenolite TD-2090, Phenolite TD-2149, Phenolite VH-4150, Phenolite VH4170 (all manufactured by DIC Corporation, trade names), H-1 (manufactured by Meiwa Kasei Co., Ltd., trade name), Epicure MP402FPY, Epicure YL6065, Epicure YLH129B65, Millex XL, Millex XLC, Millex XLC-LL, Millex RN, Millex RS, Millex VR ), trade name) is preferably used.

The content of the thermosetting resin in the adhesive piece 3p is preferably 70 to 240 parts by mass, more preferably 70 to 180 parts by mass, and even more preferably 70 to 120 parts by mass with respect to 100 parts by mass of the thermoplastic resin. When the content of the thermosetting resin is within the above range, the shrinkage of the adhesive piece 3p due to heat curing can be suppressed, and excellent adhesion after heat curing can be easily achieved.

(Curing accelerator)
Curing accelerators include imidazoles, dicyandiamide derivatives, dicarboxylic acid dihydrazide, triphenylphosphine, tetraphenylphosphonium tetraphenylborate, 2-ethyl-4-methylimidazole-tetraphenylborate, 1,8-diazabicyclo[5,4, 0]undecene-7-tetraphenylborate and the like. These can be used individually by 1 type or in combination of 2 or more types.

When the adhesive piece 3p contains a (meth)acrylic copolymer having an epoxy group, it preferably contains a curing accelerator that accelerates curing of the epoxy group contained in the acrylic copolymer. Curing accelerators that accelerate the curing of epoxy groups include phenolic curing agents, acid anhydride curing agents, amine curing agents, imidazole curing agents, imidazoline curing agents, triazine curing agents and phosphine curing agents. mentioned. Among these, from the viewpoints of rapid curability, heat resistance, and releasability, imidazole-based curing agents are preferred because they can be expected to shorten the process time and improve workability. These compounds can be used individually by 1 type or in combination of 2 or more types.

The content of the curing accelerator in the adhesive piece 3p is preferably 0.01 to 2.0 parts by mass, more preferably 0.02 to 1.5 parts by mass, and 0.02 to 1.5 parts by mass with respect to 100 parts by mass of the thermoplastic resin. 03 to 1.0 parts by mass is more preferable. When the content of the curing accelerator is within the above range, it tends to be possible to sufficiently suppress deterioration in storage stability while improving the curability of the adhesive piece 3p.

(Inorganic filler)
Adhesive piece 3p preferably contains an inorganic filler. Examples of inorganic fillers include metallic fillers such as silver powder, gold powder and copper powder, and non-metallic inorganic fillers such as silica, alumina, boron nitride, titania, glass, iron oxide and ceramics. The inorganic filler can be selected according to desired functions.

The inorganic filler preferably has an organic group on its surface. By modifying the surface of the inorganic filler with an organic group, the dispersibility in an organic solvent when preparing the varnish for forming the adhesive piece 3p and the shrinkage associated with heat curing of the adhesive piece 3p are suppressed. In addition, it is easy to achieve both a high elastic modulus and excellent releasability of the adhesive piece 3p.

An inorganic filler having an organic group on its surface can be obtained, for example, by mixing a silane coupling agent represented by the following formula (B-1) with an inorganic filler and stirring the mixture at a temperature of 30° C. or higher. It can be confirmed by UV measurement, IR measurement, XPS measurement, or the like that the surface of the inorganic filler is modified with an organic group.

In formula (B-1), X represents an organic group selected from the group consisting of a phenyl group, a glycidoxy group, an acryloyl group, a methacryloyl group, a mercapto group, an amino group, a vinyl group, an isocyanate group and a methacryloxy group; represents an integer of 0 or 1 to 10, and each of R ¹¹ , R ¹² and R ¹³ independently represents an alkyl group having 1 to 10 carbon atoms.
Examples of alkyl groups having 1 to 10 carbon atoms include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, isopropyl group and isobutyl group. .
The alkyl group having 1 to 10 carbon atoms is preferably a methyl group, an ethyl group, or a pentyl group from the viewpoint of easy availability. From the viewpoint of heat resistance, X is preferably an amino group, a glycidoxy group, a mercapto group and an isocyanate group, more preferably a glycidoxy group and a mercapto group. s in the formula (B-1) is preferably 0 to 5, more preferably 0 to 4, from the viewpoint of suppressing the film fluidity at high heat and improving the heat resistance.

Silane coupling agents include trimethoxyphenylsilane, dimethyldimethoxyphenylsilane, triethoxyphenylsilane, dimethoxymethylphenylsilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(2-methoxyethoxy)silane, N-(2 -aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-glycide xypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3- Mercaptopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, N-(1,3-dimethylbutylidene)-3-(triethoxysilyl)-1-propanamine, N,N'-bis(3-(tri methoxysilyl)propyl)ethylenediamine, polyoxyethylenepropyltrialkoxysilane, polyethoxydimethylsiloxane, and the like.
Among these, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane, and 3-mercaptopropyltrimethoxysilane are preferred, and trimethoxyphenylsilane and 3-glycidoxysilane are preferred. More preferred are propyltrimethoxysilane and 3-mercaptopropyltrimethoxysilane. A silane coupling agent can be used individually by 1 type or in combination of 2 or more types.

From the viewpoint of balancing heat resistance and storage stability, the content of the coupling agent is preferably 0 to 10 parts by mass, more preferably 0 to 5 parts by mass, with respect to 100 parts by mass of the thermoplastic resin. From the viewpoint of storage stability, 0 to 3 parts by mass is more preferable.

The content of the inorganic filler in the adhesive piece 3p is preferably 450 parts by mass or less, more preferably 400 parts by mass or less, and preferably 350 parts by mass or less with respect to 100 parts by mass of the thermoplastic resin. More preferred. Although the lower limit of the content of the inorganic filler is not particularly limited, it is preferably 10 parts by mass or more, more preferably 50 parts by mass or more, relative to 100 parts by mass of the thermoplastic resin. By setting the content of the inorganic filler within the above range, the shrinkage due to heat curing can be suppressed, and it is easy to achieve both high melt viscosity and excellent peelability of the adhesive piece 3p.

(organic filler)
The adhesive piece 3p may contain an organic filler. Examples of organic fillers include carbon, rubber-based fillers, silicone-based fine particles, polyamide fine particles, polyimide fine particles, and the like. The content of the organic filler is preferably 450 parts by mass or less, more preferably 400 parts by mass or less, and even more preferably 350 parts by mass or less with respect to 100 parts by mass of the thermoplastic resin. Although the lower limit of the content of the organic filler is not particularly limited, it is preferably 10 parts by mass or more with respect to 100 parts by mass of the thermoplastic resin.

(Organic solvent)
The adhesive piece 3p may be diluted with an organic solvent if necessary. Although the organic solvent is not particularly limited, it can be determined by considering the volatility and the like during film formation from the boiling point. Specifically, solvents with relatively low boiling points such as methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methyl ethyl ketone, acetone, methyl isobutyl ketone, toluene, and xylene may cause film formation during film formation. It is preferable from the viewpoint that hardening does not progress easily. For the purpose of improving the film-forming property, it is preferable to use a relatively high-boiling solvent such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, cyclohexanone, or the like. These solvents can be used singly or in combination of two or more.

[Protective material]
The protective member 5p is formed by simultaneously punching out the adhesive layer 3 formed so as to cover the surface of the carrier film 1 and the protective film 5 arranged so as to cover the adhesive layer 3, thereby forming adhesive pieces 3p. (See FIG. 4). Since the protective member 5p according to the present embodiment is formed simultaneously with the adhesive piece 3p by die cutting, it has substantially the same shape as the adhesive piece 3p. Any protective film 5 may be used as long as it can be punched in the manufacturing process of the adhesive film 10 and the protective member 5p can be easily peeled off from the adhesive piece 3p in the manufacturing process of the semiconductor device.

The adhesive force between the adhesive piece 3p and the protective member 5p is preferably 16 N/m or less, more preferably 10 N/m or less, and 5 N/m or less or 4.5 N/m or less. good too. In particular, when the adhesive piece 3p is made of a thermosetting resin composition, it is preferable that the adhesive strength of the protective member 5p to the adhesive piece 3p is within the above range after heat treatment at 90° C. for 1 second. Since the adhesive force is 16 N/m or less, the adhesive piece 3p covered with the protective member 5p is temporarily pressed to the adherend (for example, substrate) at 90° C. for 1 second, The protective member 5p can be easily peeled off from the semi-cured adhesive piece 3p with an adhesive tape or the like. The adhesion of the protective member 5p to the adhesive piece 3p means the 90° peel strength. is arranged, and the peel strength is measured when the protective film is peeled from the adhesive layer at an angle of 90° and at a peeling speed of 300 mm/min.

As the protective film 5, polyester films such as polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, polyvinyl acetate film, poly-4-methylpentene-1, ethylene-vinyl acetate Polymers, polyolefin films such as homopolymers or copolymers such as ethylene-ethyl acrylate copolymers, or mixtures thereof, plastic films such as polyvinyl chloride films, polyimide films, and the like can be used. The protective film 5 may have a single layer structure or a multilayer structure.

The thickness of the protective film 5 may be appropriately selected within a range that does not impair workability, and may be, for example, 10 to 200 μm, 20 to 100 μm, or 25 to 80 μm. These thickness ranges are practically acceptable and economically effective ranges.

The light transmittance of the protective member 5p is preferably lower than the light transmittance of the carrier film 1 . By adopting such a configuration, it becomes possible to recognize the position and direction of the adhesive piece 3p by a device such as a camera, and it is easy to automate the bonding process in the manufacturing process of the semiconductor device. For example, it is preferable to use a colored protective member 5p having a transmittance of less than 10% (more preferably less than 7%) for light with a wavelength of 500 nm.

<Method for manufacturing adhesive film>
Next, a method for manufacturing the adhesive film 10 will be described. The manufacturing method of this embodiment includes the following steps.
(A) A laminate having a strip-shaped carrier film 1 with a width of 100 mm or less, an adhesive layer 3 formed so as to cover the surface of the carrier film 1, and a protective film 5 arranged so as to cover the adhesive layer 3. 20.
(B) A step of obtaining a plurality of adhesive pieces 3p arranged on the carrier film 1 so as to be aligned in the longitudinal direction of the carrier film 1 by punching out the adhesive layer 3 and the protective film 5 in the laminate 20;

FIG. 3 is a cross-sectional view schematically showing the laminate 20 prepared in step (A). The laminate 20 can be produced as follows. First, a coating liquid is prepared by dissolving a raw material resin composition of the adhesive layer 3 in a solvent such as an organic solvent to form a varnish. After applying this coating solution onto the carrier film 1, the adhesive layer 3 is formed by removing the solvent. Coating methods include knife coating, roll coating, spray coating, gravure coating, bar coating and curtain coating. Next, a protective film 5 is adhered to the surface of the adhesive layer 3 under conditions of room temperature to 60°C. Thereby, the laminated body 20 can be obtained. After the adhesive layer 3 is formed on a wide carrier film, a protective film 5 is attached so as to cover it to prepare a laminated film, which is cut (slit) into widths of 100 mm or less. A laminate 20 may be obtained.

FIG. 4 is a perspective view showing how a plurality of adhesive pieces 3p and protective members 5p covering the adhesive pieces 3p are formed on the carrier film 1 by die cutting in the step (B). As shown in FIG. 4, by passing the laminate 20 between a rotating body 51 having a plurality of blades 51c on the outer peripheral surface for performing die cutting and a roll 52 paired with the rotating body 51, An adhesive piece 3p and a protective member 5p corresponding to the shape of the blade 51c are continuously formed on the carrier film 1. As shown in FIG. At this time, the layered product 20 faces the rotor 51 on the side of the protective film 5 and faces the roll 52 on the side of the carrier film 1 . By adjusting the distance between the rotating shaft 51a of the rotating body 51 and the rotating shaft 52a of the roll 52, the depth of the cut formed in the laminate 20 by the blade 51c can be adjusted.

As shown in FIG. 4, the laminate 20 that has passed between the rotating body 51 and the roll 52 is separated into the adhesive film 10 and the unnecessary portion 30, and wound up on respective reels (not shown). The unnecessary portion 30 is composed of the adhesive layer 3 and the protective film 5 from which the adhesive piece 3p and the protective member 5p are cut out.

<How to use the adhesive film>
Next, a method of using the adhesive film 10 will be described by taking as an example a method of manufacturing a connected body including a semiconductor chip and an FPC board. FIG. 5 is a cross-sectional view schematically showing how the adhesive piece 3p and the protective member 5p covering the adhesive piece 3p are picked up from the carrier film 1. As shown in FIG. While applying a constant tension to the adhesive film 10, the adhesive film 10 is moved in the direction of the arrow shown in FIG. As a result, the adhesive piece 3p and the front side of the protective member 5p are lifted from the carrier film 1, as shown in FIG. In this state, for example, the pick-up device 65 having a suction force picks up the adhesive piece 3p and the protective member 5p. For example, by using a pickup device 65 equipped with a camera or the like for visually recognizing the protective member 5p, information such as the presence or absence of the adhesive piece 3p and the protective member 5p and their orientation can be grasped. . Based on this information, subsequent bonding steps can be properly implemented.

Next, the adhesive piece 3p covered with the protective member 5p is arranged at a predetermined position and orientation on the front surface C1 of the semiconductor chip C (see FIG. 6A). In this state, the adhesive piece 3p is temporarily pressure-bonded to the semiconductor chip C. As shown in FIG. Temporary pressure bonding may be performed, for example, under conditions of a temperature of 60 to 100° C. and a pressing force of 0.1 to 0.8 MPa for 0.1 to 10 seconds. The temporary pressure bonding semi-hardens the adhesive piece 3p, thereby improving the adhesive force to the surface C1. After that, the protective member 5p is separated from the adhesive piece 3p using an adhesive tape or the like (see FIG. 6(b)).

The bonding process of the front end portion S1 of the FPC board S to the semiconductor chip C includes a step of pressure bonding the semiconductor chip C and the front end portion S1 of the FPC board S via the adhesive piece 3p, and then pressing the adhesive piece 3p. and applying a curing treatment. That is, first, the front end portion S1 of the FPC board S is placed on the surface of the adhesive piece 3p exposed by peeling off the protective member 5p, and then the front end portion S1 of the FPC board S is pressure-bonded to the semiconductor chip C. FIG. The crimping may be performed, for example, at a temperature of 90 to 150° C. and a pressure of 0.1 to 1 MPa for 0.1 to 10 seconds. Next, as shown in FIG. 7, while holding the FPC board S by applying an upward force F to the FPC board S, the adhesive piece between the front end portion S1 of the FPC board S and the semiconductor chip C is removed. 3p hardening treatment is performed. The curing treatment may be performed at a temperature of 100 to 175° C. for 0.5 to 6 hours, for example.

FIG. 8(a) is a cross-sectional view schematically showing the module 50 (connector) in which the front end portion S1 of the FPC board S can be preferably adhered to the semiconductor chip C. FIG. FIG. 8(b) is a cross-sectional view schematically showing a module in which the front end portion S1 of the FPC board S could not be properly bonded to the semiconductor chip C. As shown in FIG. As shown in FIG. 8(b), the adhesive piece 3p is partially elongated due to the force F when the adhesive piece 3p is cured, and as a result, the adhesive piece 3p is partially thickened. , the position where wire bonding should be performed is shifted from the surface C1 of the semiconductor chip C to the upper surface S2 of the FPC board S, and the wire bonding cannot be preferably performed.

In the preferred module 50 shown in FIG. 8A, the semiconductor chip C and the FPC board S are electrically connected by wire bonding from the surface C1 of the semiconductor chip C to the upper surface S2 of the FPC board S. A module (not shown) is obtained.

Although the embodiments of the present disclosure have been described above in detail, the present disclosure is not limited to the above embodiments. For example, in the above-described embodiment, the case of using the colored protective film 5 is illustrated so that the presence or absence and orientation of the protective member 5p can be grasped by a camera or the like. You may mark the position of Also, if the adhesive piece 3p is colored, the protective member 5p may not be provided. Note that if the orientation of the adhesive piece 3p does not matter (for example, if the adhesive piece 3p is circular in shape), it is not necessary to identify the orientation.

Further, in the above-described embodiment, the case where the adhesive piece 3p made of the adhesive composition is prepared in advance by die-cutting was exemplified. By coating a predetermined region of the substrate S, an adhesive layer may be formed in that region.

Hereinafter, the present disclosure will be described based on examples. The disclosure is not limited to the following examples.

<Example 1>
(Preparation of adhesive varnish)
An adhesive varnish was obtained by mixing and vacuum degassing the following materials (see Example 1 in Table 1).
・ Thermoplastic resin: HTR-860P-3 (trade name, manufactured by Nagase ChemteX Co., Ltd., glycidyl group-containing acrylic rubber, molecular weight: 1 million, Tg -7 ° C.) 100 parts by mass ・ Thermosetting resin: YDCN-700- 10 (trade name, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., o-cresol novolac type epoxy resin, epoxy equivalent 210) 30 parts by mass Thermosetting resin: PSM-4326 (trade name, manufactured by Gun Ei Chemical Industry Co., Ltd., Phenolic resin, functional group equivalent weight 105) 95 parts by weight Thermosetting resin: YDF-8170C (trade name, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., bisphenol F type epoxy resin, epoxy equivalent weight 157) 100 parts by weight Curing accelerator: 2PZ-CN (trade name, manufactured by Shikoku Kasei Co., Ltd., imidazole compound) 0.3 parts by mass Surface treatment filler: SC-2050-HLG (trade name, manufactured by Admatechs Co., Ltd.) 330 parts by mass Silane cup Ring agent: A-189 (trade name, manufactured by NUC Co., Ltd., γ-mercaptopropyltrimethoxysilane) 0.9 parts by mass Silane coupling agent: A-1160 (trade name, manufactured by NUC Co., Ltd., γ- Ureidopropyltriethoxysilane) 2 parts by mass

(Preparation of adhesive film)
The above adhesive varnish was applied onto a 50 μm-thick surface-release-treated polyethylene terephthalate film (trade name: Teijin Tetron Film A-63, manufactured by Teijin DuPont Films Japan Ltd.). Through a drying process, a film having an adhesive layer with a thickness of 25 μm formed on one surface of the polyethylene terephthalate film (carrier film) was obtained. A laminate film was obtained by laminating this film to a colored polyethylene film (TDM-1, manufactured by Tamapoly Co., Ltd.) having a thickness of 50 μm. A band-shaped laminate was obtained by slitting this laminated film into a width of 15 mm.

An adhesive film according to this example was obtained by performing die-cutting on the laminate obtained as described above using an apparatus having the configuration shown in FIG. The shape of the adhesive piece was a rectangular shape of about 7 mm long×about 6 mm wide with some corners missing (area: 29 mm ² ). The pitch P was set to approximately 9 mm. The area ratio R of the adhesive pieces was 23%. The melt viscosity at 130° C. of the adhesive composition constituting the adhesive piece was 3500 Pa·s.

(Fabrication of module)
An adhesive piece of 3.2 mm×3.2 mm and a protective member covering it were placed on the upper surface of a semiconductor chip (approximately 15 mm long×approximately 15 mm wide×0.4 mm thick) (see FIG. 6A). In this state, a pressing force of 10 N was applied to the adhesive piece for 0.5 seconds under a temperature condition of 90° C., thereby temporarily press-bonding the adhesive piece to the semiconductor chip. After that, the protective member was peeled off to expose the adhesive piece (see FIG. 6(b)). The tip of the FPC board was pressed against the exposed piece of adhesive. The pressure bonding was performed at a temperature of 130° C. by applying a pressing force of 15 N to the adhesive piece for 1 second. After crimping, as shown in FIG. 7, while holding the FPC board by applying an upward force of 250 g, the adhesive piece is cured at a temperature of 130° C. for 1 hour, and the module (connection body) was produced. These steps were repeated to produce a total of 10 modules.

<Example 2>
Adhesive strips according to this example were produced in the same manner as in Example 1, except that the adhesive varnish having the composition shown in Example 2 in Table 1 was used. A module was produced. The melt viscosity at 130° C. of the adhesive composition constituting the adhesive piece was 6500 Pa·s.

<Example 3>
An adhesive piece according to this example was produced in the same manner as in Example 1 except that an adhesive varnish having the composition shown in Example 3 in Table 1 was used, and a total of 10 adhesive pieces were produced using this. A module was produced. The melt viscosity at 130° C. of the adhesive composition constituting the adhesive piece was 13000 Pa·s.

<Example 4>
An adhesive piece according to this example was produced in the same manner as in Example 1 except that an adhesive varnish having a composition shown in Example 4 in Table 1 was used, and a total of 10 adhesive pieces were produced using this. A module was produced. The melt viscosity at 130° C. of the adhesive composition constituting the adhesive piece was 20000 Pa·s.

<Comparative Example 1>
An adhesive piece according to this comparative example was produced in the same manner as in Example 1 except that the adhesive varnish having the composition shown in Comparative Example 1 in Table 1 was used, and a total of 10 adhesive pieces were produced using this. A module was produced. The melt viscosity at 130° C. of the adhesive composition constituting the adhesive piece was 24000 Pa·s.

<Comparative Example 2>
An adhesive piece according to this comparative example was produced in the same manner as in Example 1 except that the adhesive varnish having the composition shown in Comparative Example 2 in Table 1 was used, and a total of 10 adhesive pieces were produced using this. A module was produced. The melt viscosity at 130° C. of the adhesive composition constituting the adhesive piece was 1700 Pa·s.

The following items were evaluated for the adhesive strips according to the above examples and comparative examples. Table 1 shows the results.

(1) Elongation of Adhesive Piece Adhesiveness of a total of 10 modules obtained as described above was evaluated as follows. That is, the thickness of the side (the left side in FIG. 7) where tension was applied to the adhesive piece during the curing process was measured using an optical microscope image. The thickness of each of the four modules was measured at the above points, and the average value was calculated. The thickness of the adhesive piece before use was 25 μm.
Evaluation was made according to the following criteria.
A: The average thickness is less than 30 µm.
B: The average thickness is 30 to 250 μm.
C: The average thickness is more than 250 µm.
D: Of the four modules in total, the number of modules in which the FPC substrate was peeled off during the curing process of the adhesive pieces was three or more.

(2) Adhesiveness of Adhesive Piece Adhesiveness of a total of 10 modules obtained as described above was evaluated as follows. That is, the semiconductor chip was fixed by being attached to the surface of the table, and in this state, force was gradually applied upward to the FPC board. It was confirmed whether or not the FPC board was separated from the semiconductor chip when a force of 0.5 N was applied to the FPC board.
Evaluation was made according to the following criteria.
A: The number of modules with peeled FPC substrates is 2 or less out of 10 modules in total.
B: Of the 10 modules in total, the number of modules from which the FPC substrate was peeled off was 3 to 8.
C: Out of 10 modules in total, the number of modules from which the FPC substrate was peeled off is 9 or more.
D: Among the total of 10 modules, the number of modules in which the FPC substrate was peeled off during the curing process of the adhesive pieces was 5 or more.

(3) Voids in Adhesive Pieces Voids in a total of two modules obtained as described above were evaluated as follows. That is, the obtained module was inspected with an ultrasonic imaging device SAT (manufactured by Hitachi Construction Machinery, FS200II) to confirm the presence or absence of voids. The evaluation criteria for the presence or absence of voids are as follows.
A: The percentage of voids is less than 10%.
D: The percentage of voids is 10% or more.

According to one aspect of the present disclosure, there is provided an adhesive composition that exhibits excellent adhesion between a semiconductor chip and an FPC board, and that can suitably perform wire bonding after bonding the semiconductor chip and the FPC board. According to one aspect of the present disclosure, there are provided an adhesive film comprising a plurality of adhesive strips made of this adhesive composition, and a method for manufacturing a connected body.

DESCRIPTION OF SYMBOLS 1... Carrier film 3... Adhesive layer 3p... Adhesive piece (adhesive composition) 5... Protective film 5p... Protective member 10... Adhesive film 50... Module (connector) C... Semiconductor chip, F1... Adhesive piece surface (first surface), F2... Adhesive piece surface (second surface), S... Flexible printed circuit board

Claims (15)

A method for manufacturing a connected body including a semiconductor chip and a flexible printed circuit board,
(A1) Between the semiconductor chip and the tip of the flexible printed circuit board, an adhesive layer made of an adhesive composition having a melt viscosity of 3500 to 20000 Pa s at 130 ° C. is interposed, and the semiconductor chip and a step of adhering the tip portion of the flexible printed circuit board;
(B1) wire bonding the semiconductor chip and the flexible printed circuit board;
in that order ,
The adhesive composition contains at least a thermoplastic resin and a thermosetting resin,
When the content of the thermoplastic resin is 100 parts by mass, the content of the thermosetting resin is 70 to 240 parts by mass,
A method for producing a connected body, wherein the thermoplastic resin has a weight average molecular weight of 100,000 or more and 2,000,000 or less . The step (A1) includes pressing the front end of the flexible printed circuit board against the adhesive layer provided on the surface of the semiconductor chip, and curing the adhesive layer. 2. The method of manufacturing a connector according to claim 1, comprising: A method for manufacturing a connected body including a semiconductor chip and a flexible printed circuit board,
(A2) Between the semiconductor chip and the tip of the flexible printed circuit board, an adhesive piece made of an adhesive composition having a melt viscosity of 3500 to 20000 Pa s at 130 ° C. is interposed, and the semiconductor chip and the a step of adhering the tip portion of the flexible printed circuit board;
(B2) wire bonding the semiconductor chip and the flexible printed circuit board;
in that order ,
The adhesive composition contains at least a thermoplastic resin and a thermosetting resin,
When the content of the thermoplastic resin is 100 parts by mass, the content of the thermosetting resin is 70 to 240 parts by mass,
A method for producing a connected body, wherein the thermoplastic resin has a weight average molecular weight of 100,000 or more and 2,000,000 or less . The step (A2) includes the step of press-bonding the tip of the flexible printed circuit board to the adhesive piece provided on the surface of the semiconductor chip, and the step of curing the adhesive piece. 4. The manufacturing method of the connecting body according to claim 3, comprising: 5. The method for manufacturing a connected body according to claim 3 or 4, wherein the adhesive piece has an area of 10 to 200 mm ² . The method for producing a connected body according to any one of claims 1 to 5, wherein the adhesive composition has a melt viscosity of 3500 to 6500 Pa·s at 130°C. The adhesive composition further comprises a filler,
7. The method for manufacturing a connector according to any one of claims 1 to 6 , wherein the content of the filler is 10 to 450 parts by mass when the content of the thermoplastic resin is 100 parts by mass. An adhesive composition used for bonding a semiconductor chip and a tip of a flexible printed circuit board,
Melt viscosity at 130 ° C. is 3500 to 20000 Pa s,
including at least a thermoplastic resin and a thermosetting resin,
When the content of the thermoplastic resin is 100 parts by mass, the content of the thermosetting resin is 70 to 240 parts by mass,
The adhesive composition , wherein the thermoplastic resin has a weight average molecular weight of 100,000 or more and 2,000,000 or less . The adhesive composition according to claim 8, which has a melt viscosity of 3500 to 6500 Pa·s at 130°C . further comprising a filler;
10. The adhesive composition according to claim 8 , wherein the content of the filler is 10 to 450 parts by mass when the content of the thermoplastic resin is 100 parts by mass. a strip-shaped carrier film with a width of 100 mm or less;
a plurality of adhesive strips arranged on the carrier film in the longitudinal direction of the carrier film;
with
An adhesive film, wherein the adhesive piece comprises the adhesive composition according to any one of claims 8-10 . The adhesive film according to claim 11, wherein the adhesive strip has an area of 10-200 mm ² . 13. The adhesive film according to claim 11 or 12, wherein said adhesive piece is formed by die-cutting an adhesive layer formed to cover the surface of said carrier film. 14. The protective member according to any one of claims 11 to 13, further comprising a protective member covering a second surface of the adhesive piece opposite to the first surface on the carrier film side and having the same shape as the adhesive piece. The adhesive film described in . The adhesive piece and the protective member are formed by die-cutting an adhesive layer formed to cover the surface of the carrier film and a protective film arranged to cover the adhesive layer. 15. The adhesive film of claim 14, which is a

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