SG11201602919PA - Carrier-bonding methods and articles for semiconductor and interposer processing - Google Patents

Carrier-bonding methods and articles for semiconductor and interposer processing

Info

Publication number
SG11201602919PA
SG11201602919PA SG11201602919PA SG11201602919PA SG11201602919PA SG 11201602919P A SG11201602919P A SG 11201602919PA SG 11201602919P A SG11201602919P A SG 11201602919PA SG 11201602919P A SG11201602919P A SG 11201602919PA SG 11201602919P A SG11201602919P A SG 11201602919PA
Authority
SG
Singapore
Prior art keywords
articles
semiconductor
carrier
bonding methods
interposer
Prior art date
Application number
SG11201602919PA
Inventor
Darwin Gene Enicks
John Tyler Keech
Aric Bruce Shorey
Windsor Pipes Thomas Iii
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of SG11201602919PA publication Critical patent/SG11201602919PA/en

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    • H—ELECTRICITY
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    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Recrystallisation Techniques (AREA)
  • Laminated Bodies (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201602919PA 2013-10-14 2014-10-14 Carrier-bonding methods and articles for semiconductor and interposer processing SG11201602919PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361890524P 2013-10-14 2013-10-14
PCT/US2014/060340 WO2015057605A1 (en) 2013-10-14 2014-10-14 Carrier-bonding methods and articles for semiconductor and interposer processing

Publications (1)

Publication Number Publication Date
SG11201602919PA true SG11201602919PA (en) 2016-05-30

Family

ID=51799328

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201602919PA SG11201602919PA (en) 2013-10-14 2014-10-14 Carrier-bonding methods and articles for semiconductor and interposer processing

Country Status (8)

Country Link
US (1) US10510576B2 (en)
EP (1) EP3058587B1 (en)
JP (2) JP6873702B2 (en)
KR (1) KR102355656B1 (en)
CN (1) CN106133899B (en)
SG (1) SG11201602919PA (en)
TW (1) TWI632612B (en)
WO (1) WO2015057605A1 (en)

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US10510576B2 (en) 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
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US10177114B2 (en) 2015-11-25 2019-01-08 Invensas Corporation Hybrid 3D/2.5D interposer
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
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