KR20170079896A - Polyimidepolymer composition, method for producing thereof and method for producing polyimide film using the same - Google Patents

Polyimidepolymer composition, method for producing thereof and method for producing polyimide film using the same Download PDF

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KR20170079896A
KR20170079896A KR1020150190927A KR20150190927A KR20170079896A KR 20170079896 A KR20170079896 A KR 20170079896A KR 1020150190927 A KR1020150190927 A KR 1020150190927A KR 20150190927 A KR20150190927 A KR 20150190927A KR 20170079896 A KR20170079896 A KR 20170079896A
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anhydride
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polyimide
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차영철
박세주
안민석
이승준
변자훈
홍우성
박성연
정재훈
배민영
양기석
이상준
김동민
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주식회사 동진쎄미켐
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    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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Abstract

본 발명은 폴리이미드 고분자 조성물, 이의 제조 방법 및 이를 이용한 폴리이미드 필름의 제조 방법에 관한 것이다.The present invention relates to a polyimide polymer composition, a process for producing the same, and a process for producing a polyimide film using the same.

Description

폴리이미드고분자 조성물, 이의 제조 방법 및 이를 이용한 폴리이미드 필름의 제조 방법{POLYIMIDEPOLYMER COMPOSITION, METHOD FOR PRODUCING THEREOF AND METHOD FOR PRODUCING POLYIMIDE FILM USING THE SAME}TECHNICAL FIELD The present invention relates to a polyimide polymer composition, a process for producing the same, and a process for producing a polyimide film using the same. BACKGROUND ART [0002]

본 발명은 폴리이미드고분자 조성물, 이의 제조 방법 및 이를 이용한 폴리이미드 필름의 제조 방법에 관한 것이다.The present invention relates to a polyimide polymer composition, a process for producing the same, and a process for producing a polyimide film using the same.

폴리이미드 수지는 다른 고분자에 비해 전기적, 열적, 화학적, 기계적 성질이 우수하기 때문에 내열 첨단 소재 및 전자 소재 분야에 다양하게 적용되고 있다. 특히 디스플레이 분야에 있어서 유연기판을 만들기 위한 소재에 있어서 높은 내열 특성으로 인해 관심이 모아지고 있다. The polyimide resin has various electrical, thermal, chemical and mechanical properties as compared with other polymers, and thus has been widely applied to heat-resistant materials and electronic materials. Particularly in the display field, attention is being paid to the high heat resistance properties of materials for making flexible substrates.

폴리이미드를 합성하기 위해서 일반적으로 디아민 단량체와 디안하이드라이드 단량체 및 극성용매가 사용된다. 이미드 방법에 따라 열적이미드 방법, 화학적 이미드 방법 등이 많이 사용되는데 화학적 이미드 방법을 적용하기 위해 촉매와 탈수제를 사용하여 화학적 이미드 반응을 진행하기도 한다. To synthesize the polyimide, a diamine monomer, a dianhydride monomer and a polar solvent are generally used. According to the imide method, a thermal imide method and a chemical imide method are widely used. In order to apply a chemical imide method, a chemical imide reaction is carried out using a catalyst and a dehydrating agent.

내열성이 우수한 폴리이미드 수지를 합성하기 위해서는 방향족 구조의 단량체를 사용하여야 하는데 방향족 고리의 고밀도로 인해 필름 색상이 갈색 또는 황색을 띠어 가시광선 영역에서 투과도가 낮아진다. 이러한 폴리이미드 수지는 투명성이 요구되는 분야에는 한계가 있어 유리기판 소재를 대체하여 사용하기 위해서는 다른 조성물과 구조 설계가 필요하다. 그러나, 한가지 물성이 개선되면 다른 물성이 떨어지는 성질이 있어 폴리이미드의 투명성, 열적 성질, 기계적 성질을 모두 만족시키는 투명 유연 기판을 제조하기 위해서는 폴리아믹산(polyamic acid) 조성물의 개발이 필요한 실정이다.  In order to synthesize a polyimide resin having excellent heat resistance, an aromatic structure monomer should be used, but the film color is brown or yellow due to the high density of the aromatic ring, so that the transmittance in the visible light region is lowered. Such a polyimide resin has limitations in areas where transparency is required, and other compositions and structure design are required to replace glass substrate materials. However, when one physical property is improved, other properties are deteriorated, and thus it is necessary to develop a polyamic acid composition in order to produce a transparent flexible substrate satisfying all the transparency, thermal properties, and mechanical properties of polyimide.

폴리이미드를 합성하기 위해 사용하는 용매는 대부분이 극성용매로 환경에 규제되는 물질이다(일본 등록 특허 제5201155호). 하지만 이를 대체하였을 때 원하는 물성을 얻을 수가 없어, 그대로 사용하고 있다.Most of the solvents used for synthesizing polyimide are substances which are environmentally regulated by a polar solvent (Japanese Patent No. 5201155). However, when I replace it, I can not get the desired property, and I use it as it is.

본 발명은 상기 종래기술에 따른 문제점들을 해결하기 위해, DMPA(dimethylpropionamide)를 합성 용매 또는 분산 용매로서 사용하여 폴리아믹산-폴리이미드 공중합체를 제조함으로써, 본 발명을 완성하였다.The present invention has been accomplished to solve the problems of the prior art by preparing a polyamic acid-polyimide copolymer using dimethylpropionamide (DMPA) as a synthetic solvent or a dispersion solvent.

본 발명의 일 측면은, DMPA(dimethylpropionamide)를 합성 용매 또는 분산 용매로 사용하여 제조되며, 하기 화학식 1로서 표시되는 폴리아믹산-폴리이미드 공중합체를 포함하는, 폴리이미드 고분자 조성물을 제공한다:One aspect of the present invention provides a polyimide polymer composition comprising a polyamic acid-polyimide copolymer, which is produced by using dimethylpropionamide (DMPA) as a synthetic solvent or a dispersion solvent, and is represented by the following Chemical Formula 1:

[화학식 1][Chemical Formula 1]

Figure pat00001
Figure pat00001

상기 화학식 1에서,In Formula 1,

R1은 불소기 또는 방향족 안하이드라이드 단량체이고,R 1 is a fluorine group or an aromatic anhydride monomer,

R은 디아민 단량체이며,R is a diamine monomer,

n은 1 내지 1,000의 정수이고,n is an integer of 1 to 1,000,

m은 1 내지 1,000의 정수임.and m is an integer of 1 to 1,000.

본 발명의 다른 측면은, 디아민 단량체를 함유하는 합성 용매에 안하이드라이드 단량체를 첨가하여 반응시키는 단계; 상기 반응 용액에 촉매 및 탈수제를 첨가하여 반응시킨 후 고형화시키는 단계; 및 상기 고형화물을 DMPA(dimethylpropionamide)에 분산시키는 단계를 포함하는, 투명 폴리이미드 필름 제조용 폴리이미드 고분자 조성물의 제조 방법을 제공한다.According to another aspect of the present invention, there is provided a process for producing a polyimide resin, comprising the steps of: adding an anhydride monomer to a synthetic solvent containing a diamine monomer and reacting; Adding a catalyst and a dehydrating agent to the reaction solution to react and solidify the catalyst; And dispersing the solidified material in DMPA (dimethylpropionamide). The present invention also provides a method for producing a polyimide polymer composition for producing a transparent polyimide film.

본 발명의 또 다른 측면은, 디아민 단량체를 함유하는 DMPA(dimethylpropionamide) 용액에 안하이드라이드 단량체를 첨가하여 반응시키는 단계; 상기 반응 용액에 말단-캡핑 제제를 첨가한 후 반응시켜 폴리아믹산을 합성하는 단계; 및 상기 폴리아믹산에 가교제를 첨가하여 혼합하는 단계를 포함하는, 폴리이미드 고분자 조성물의 제조 방법을 제공한다.According to another aspect of the present invention, there is provided a method for producing a polymer electrolyte membrane comprising the steps of: adding an anhydride monomer to a dimethylpropionamide (DMPA) solution containing a diamine monomer and reacting; Adding a terminal-capping agent to the reaction solution, and then reacting to synthesize a polyamic acid; And a step of adding a cross-linking agent to the polyamic acid and mixing the polyimide polymer composition.

본 발명의 또 다른 측면은, 본 발명의 상기 측면에 따른 폴리이미드 고분자 조성물로부터 형성된 투명 또는 유색의 폴리이미드 필름을 제공한다.Another aspect of the present invention provides a transparent or colored polyimide film formed from the polyimide polymer composition according to the above aspect of the present invention.

본 발명은 기존에 폴리이미드의 합성에 사용되던 극성 용매 대신 DMPA(Dimethylpropionamide)를 합성 또는 분산에 사용함으로써 환경 규제 대상인 극성 용매를 대체할 수 있다. 본 발명은 DMPA를 사용함에 따라, 종래의 극성 용매를 사용했을 때보다 CTE, 투과도 등의 물성이 향상된 폴리이미드 필름을 제공할 수 있다.The present invention can replace a polar solvent to be environmentally controlled by using DMPA (dimethylpropionamide) instead of the polar solvent used for the synthesis of polyimide. By using DMPA, the present invention can provide a polyimide film improved in physical properties such as CTE and transmittance as compared with a conventional polar solvent.

이하, 첨부한 도면을 참조하여 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 본 발명의 구현예 및 실시예를 상세히 설명한다.Hereinafter, embodiments and embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art.

그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 구현예 및 실시예에 한정되지 않는다. 그리고 도면에서 본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 유사한 부분에 대해서는 유사한 도면 부호를 붙였다.The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments and examples described herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

본 발명의 일 측면은, DMPA(dimethylpropionamide)를 합성 용매 또는 분산 용매로 사용하여 제조되며, 하기 화학식 1로서 표시되는 폴리아믹산-폴리이미드 공중합체를 포함하는, 폴리이미드 고분자 조성물을 제공한다:One aspect of the present invention provides a polyimide polymer composition comprising a polyamic acid-polyimide copolymer, which is produced by using dimethylpropionamide (DMPA) as a synthetic solvent or a dispersion solvent, and is represented by the following Chemical Formula 1:

[화학식 1][Chemical Formula 1]

Figure pat00002
Figure pat00002

상기 화학식 1에서,In Formula 1,

R1은 불소기 또는 방향족 안하이드라이드 단량체이고,R 1 is a fluorine group or an aromatic anhydride monomer,

R은 디아민 단량체이며,R is a diamine monomer,

n은 1 내지 1,000의 정수이고,n is an integer of 1 to 1,000,

m은 1 내지 1,000의 정수임.and m is an integer of 1 to 1,000.

본 발명의 일 구현예에 있어서, 상기 폴리이미드 고분자 조성물은 투명 또는 유색의 폴리이미드 필름을 제조하기 위한 것일 수 있다. In one embodiment of the present invention, the polyimide polymer composition may be one for producing a transparent or colored polyimide film.

본 발명의 일 구현예에 있어서, 상기 디아민 단량체는 PPDA(p-Phenylenediamine), ODA(4,4'-Oxydianiline), MDA(4,4'-Methylenedianiline), m-톨리딘(2,2'-Dimethyl-4,4'-Diaminobiphenyl), TPE-R(1,3-BIS(4'-Aminophenoxyl)benzene), TFMB(2,2'-Bis(trifluoromethyl) benzidine), HFBAPP(2,2-BIS[4-(4-Aminophenoxy)Phenyl]Hexafluoropropane), BIS-AP-AF(2,2-Bis(3-amino-4-hydroxyphenyl)hexafluoropropane), DRFB(1,3-Diamino-2,4,5,6-Tetrafluorobenzene), DDS(3,3'-Diaminodiphenyl Sulfone), ASD(4,4'-Diaminodiphenyl Sulfide), BAPS(Bis[4-(4-aminophenoxy)phenyl]sulfone), m-BAPS(2,2-Bis [4-(3-Aminophenoxy) Benzene] Sulfone) 및 이들의 조합들로 이루어진 군으로부터 선택된 것을 포함할 수 있다. 폴리이미드의 적용 분야에 요구 물성에 따라 적절한 디아민 단량체를 선택하여 사용할 수 있다. 높은 내열 특성 가지고 낮은 열팽창계수를 나타내는 폴리이미드 필름을 제조하기 위해서는 방향족 구조의 디아민 단량체를 선택하여 사용할 수 있으며, 투명성이 요구되지 않는 유색 폴리이미드 합성시에 PPDA 단량체를 사용하는 것이 적절하다. 또한, 투명한 폴리이미드를 합성하기 위해서는 불소계 단랑체를 사용할 수 있으며, 예를 들어, TFMB 단량체를 사용할 수 있다.In one embodiment of the present invention, the diamine monomer is selected from the group consisting of PPDA (p-Phenylenediamine), ODA (4,4'-Oxydianiline), MDA (4,4'-Methylenedianiline), m- Dimethyl-4,4'-Diaminobiphenyl), TPE-R (1,3-BIS (4'-Aminophenoxyl) benzene), TFMB (2,2'-Bis (trifluoromethyl) benzidine), HFBAPP (2,2- 4- (4-Aminophenoxy) Phenyl] hexafluoropropane), BIS-AP-AF (2,2-Bis (4,4'-Diaminodiphenyl Sulfide), BAPS (Bis [4- (4-aminophenoxy) phenyl] sulfone), m-BAPS (2,2- Bis [4- (3-Aminophenoxy) Benzene] Sulfone), and combinations thereof. Appropriate diamine monomers may be selected depending on the required properties in the application field of polyimide. In order to produce a polyimide film exhibiting a low thermal expansion coefficient with a high heat resistance property, a diamine monomer having an aromatic structure can be selected and used. It is appropriate to use a PPDA monomer in the synthesis of a colored polyimide which does not require transparency. Further, in order to synthesize a transparent polyimide, fluorine-based monomers can be used. For example, TFMB monomers can be used.

본 발명의 일 구현예에 있어서, 상기 안하이드라이드 단량체는 방향족 디안하이드라이드 단량체일 수 있으며, 예를 들어, BTDA(3,3',4,4'-benzophenonetetracarboxylicdianhydride), PMDA(pyromelliticdianhydride), BPDA(3,3',4,4'-biphenyl tetracarboxylicaciddianhydride), 6FDA(2,2-bis(3,4-anhydrodicarboxyphenyl)-hexafluoropropanedianhydride), a-BPDA(2,3,3',4-biphenyl tetracarboxylicaciddianhydride), ODPA(4,4'-oxydiphthalic anhydride), DSDA(3,3',4,4'-diphenylsulfone-tetracarboxylic dianhydride), BPADA(2,2-bis[4-(3,4-dicarboxyphenoxy) phenyl] propane dianhydride), HQDA(hydroquinone diphthalic anhydride) 및 이들의 조합들로 이루어진 군으로부터 선택된 것을 포함할 수 있다. 상기 방향족 디안하이드라이드 단량체는 하나 이상, 예를 들어 적어도 두 개의 단량체를 사용할 수 있다. 폴리이미드의 적용 분야에 요구 물성에 따라 적절한 안하이드라이드 단량체를 선택하여 사용할 수 있다. 높은 내열 특성을 보이고 투명성이 요구되지 않는 유색 폴리이미드 필름의합성시에는 BPDA 및 PMDA 단량체를 사용할 수 있다. 또한, 투명한 폴리이미드를 합성하기 위해서는 6FDA 단량체 사용이 적절하며, 내열특성과 기계적 물성을 향상시키기 위해서 BPDA 단량체를 사용하는 것이 적절하다.In one embodiment of the present invention, the anhydride monomer may be an aromatic dianhydride monomer, such as, for example, 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride, PMDA (pyromellitic dianhydride), BPDA 3,3 ', 4,4'-biphenyl tetracarboxylic acid hydrides, 6-di (3,4-anhydrodicarboxyphenyl) -hexafluoropropanediohydride, 6,3'4-biphenyl tetracarboxylic acid hydrides, 4,4'-oxydiphthalic anhydride, DSDA (3,3 ', 4,4'-diphenylsulfone-tetracarboxylic dianhydride), BPADA (2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] propane dianhydride) , Hydroquinone diphthalic anhydride (HQDA), and combinations thereof. The aromatic dianhydride monomer may use one or more, for example, at least two monomers. Suitable anhydride monomers can be selected and used according to the requirements of the polyimide application field. BPDA and PMDA monomers can be used in the synthesis of colored polyimide films which exhibit high heat resistance and do not require transparency. Further, in order to synthesize a transparent polyimide, the use of a 6FDA monomer is appropriate, and in order to improve heat resistance and mechanical properties, it is appropriate to use a BPDA monomer.

본 발명의 다른 측면은, 디아민 단량체를 함유하는 합성 용매에 안하이드라이드 단량체를 첨가하여 반응시키는 단계; 상기 반응 용액에 촉매 및 탈수제를 첨가하여 반응시킨 후 고형화시키는 단계; 및 상기 고형화물을 DMPA(dimethylpropionamide)에 분산시키는 단계를 포함하는, 폴리이미드 고분자 조성물의 제조 방법을 제공한다.According to another aspect of the present invention, there is provided a process for producing a polyimide resin, comprising the steps of: adding an anhydride monomer to a synthetic solvent containing a diamine monomer and reacting; Adding a catalyst and a dehydrating agent to the reaction solution to react and solidify the catalyst; And dispersing the solidified material in dimethylpropionamide (DMPA). The present invention also provides a method for producing a polyimide polymer composition.

본 발명의 또 다른 측면은, 디아민 단량체를 함유하는 DMPA(dimethylpropionamide) 용액에 안하이드라이드 단량체를 첨가하여 반응시키는 단계; 상기 반응 용액에 말단-캡핑 제제를 첨가한 후 반응시켜 폴리아믹산을 합성하는 단계; 및 상기 폴리아믹산에 가교제를 첨가하여 혼합하는 단계를 포함하는, 폴리이미드 고분자 조성물의 제조 방법을 제공한다.According to another aspect of the present invention, there is provided a method for producing a polymer electrolyte membrane comprising the steps of: adding an anhydride monomer to a dimethylpropionamide (DMPA) solution containing a diamine monomer and reacting; Adding a terminal-capping agent to the reaction solution, and then reacting to synthesize a polyamic acid; And a step of adding a cross-linking agent to the polyamic acid and mixing the polyimide polymer composition.

본 발명의 일 구현예에 있어서, 상기 폴리이미드 고분자 조성물은 투명 또는 유색의 폴리이미드 필름을 제조하기 위한 것일 수 있다.In one embodiment of the present invention, the polyimide polymer composition may be one for producing a transparent or colored polyimide film.

본 발명의 일 구현예에 있어서, 상기 디아민 단량체는 PPDA(p-Phenylenediamine), ODA(4,4'-Oxydianiline), MDA(4,4'-Methylenedianiline), m-톨리딘(2,2'-Dimethyl-4,4'-Diaminobiphenyl), TPE-R(1,3-BIS(4'-Aminophenoxyl)benzene), TFMB(2,2'-Bis(trifluoromethyl) benzidine), HFBAPP(2,2-BIS[4-(4-Aminophenoxy)Phenyl]Hexafluoropropane), BIS-AP-AF(2,2-Bis(3-amino-4-hydroxyphenyl)hexafluoropropane), DRFB(1,3-Diamino-2,4,5,6-Tetrafluorobenzene), DDS(3,3'-Diaminodiphenyl Sulfone), ASD(4,4'-Diaminodiphenyl Sulfide), BAPS(Bis[4-(4-aminophenoxy)phenyl]sulfone), m-BAPS(2,2-Bis [4-(3-Aminophenoxy) Benzene] Sulfone) 및 이들의 조합들로 이루어진 군으로부터 선택된 것을 포함할 수 있다. 폴리이미드의 적용 분야에 요구 물성에 따라 적절한 디아민 단량체를 선택하여 사용할 수 있다. 높은 내열 특성 가지고 낮은 열팽창계수를 나타내는 폴리이미드 필름을 제조하기 위해서는 방향족 구조의 디아민 단량체를 선택하여 사용할 수 있으며, 투명성이 요구되지 않는 유색 폴리이미드 합성시에 PPDA 단량체를 사용하는 것이 적절하다. 또한, 투명한 폴리이미드를 합성하기 위해서는 불소계 단랑체를 사용할 수 있으며, 예를 들어, TFMB 단량체를 사용할 수 있다.In one embodiment of the present invention, the diamine monomer is selected from the group consisting of PPDA (p-Phenylenediamine), ODA (4,4'-Oxydianiline), MDA (4,4'-Methylenedianiline), m- Dimethyl-4,4'-Diaminobiphenyl), TPE-R (1,3-BIS (4'-Aminophenoxyl) benzene), TFMB (2,2'-Bis (trifluoromethyl) benzidine), HFBAPP (2,2- 4- (4-Aminophenoxy) Phenyl] hexafluoropropane), BIS-AP-AF (2,2-Bis (4,4'-Diaminodiphenyl Sulfide), BAPS (Bis [4- (4-aminophenoxy) phenyl] sulfone), m-BAPS (2,2- Bis [4- (3-Aminophenoxy) Benzene] Sulfone), and combinations thereof. Appropriate diamine monomers may be selected depending on the required properties in the application field of polyimide. In order to produce a polyimide film exhibiting a low thermal expansion coefficient with a high heat resistance property, a diamine monomer having an aromatic structure can be selected and used. It is appropriate to use a PPDA monomer in the synthesis of a colored polyimide which does not require transparency. Further, in order to synthesize a transparent polyimide, fluorine-based monomers can be used. For example, TFMB monomers can be used.

본 발명의 일 구현예에 있어서, 상기 안하이드라이드 단량체는 방향족 디안하이드라이드 단량체일 수 있으며, 예를 들어, BTDA(3,3',4,4'-benzophenonetetracarboxylicdianhydride), PMDA(pyromelliticdianhydride), BPDA(3,3',4,4'-biphenyl tetracarboxylicaciddianhydride), 6FDA(2,2-bis(3,4-anhydrodicarboxyphenyl)-hexafluoropropanedianhydride), a-BPDA(2,3,3',4-biphenyl tetracarboxylicaciddianhydride), ODPA(4,4'-oxydiphthalic anhydride), DSDA(3,3',4,4'-diphenylsulfone-tetracarboxylic dianhydride), BPADA(2,2-bis[4-(3,4-dicarboxyphenoxy) phenyl] propane dianhydride), HQDA(hydroquinone diphthalic anhydride) 및 이들의 조합들로 이루어진 군으로부터 선택된 것을 포함할 수 있다. 상기 방향족 디안하이드라이드 단량체는 하나 이상, 예를 들어 적어도 두 개의 단량체를 사용할 수 있다. 폴리이미드의 적용 분야에 요구 물성에 따라 적절한 안하이드라이드 단량체를 선택하여 사용할 수 있다. 높은 내열 특성을 보이고 투명성이 요구되지 않는 유색 폴리이미드 필름의 합성시에는 BPDA 및 PMDA 단량체를 사용할 수 있다. 또한, 투명한 폴리이미드를 합성하기 위해서는 6FDA 단량체 사용이 적절하며, 내열특성과 기계적 물성을 향상시키기 위해서 BPDA 단량체를 사용하는 것이 적절하다.In one embodiment of the present invention, the anhydride monomer may be an aromatic dianhydride monomer, such as, for example, 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride, PMDA (pyromellitic dianhydride), BPDA 3,3 ', 4,4'-biphenyl tetracarboxylic acid hydrides, 6-di (3,4-anhydrodicarboxyphenyl) -hexafluoropropanediohydride, 6,3'4-biphenyl tetracarboxylic acid hydrides, 4,4'-oxydiphthalic anhydride, DSDA (3,3 ', 4,4'-diphenylsulfone-tetracarboxylic dianhydride), BPADA (2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] propane dianhydride) , Hydroquinone diphthalic anhydride (HQDA), and combinations thereof. The aromatic dianhydride monomer may use one or more, for example, at least two monomers. Suitable anhydride monomers can be selected and used according to the requirements of the polyimide application field. BPDA and PMDA monomers can be used in the synthesis of colored polyimide films which exhibit high heat resistance and do not require transparency. Further, in order to synthesize a transparent polyimide, the use of a 6FDA monomer is appropriate, and in order to improve heat resistance and mechanical properties, it is appropriate to use a BPDA monomer.

본 발명의 일 구현예에 있어서, 상기 합성 용매는 본 분야에서 사용되는 용매라면 제한 없이 사용될 수 있으며, 예를 들어, 아미드계 용매, 케톤계 용매, 에테르계 용매, 에스테르계 용매, 대칭 글리콜디에테르류 용매, 에테르류 용매 및 이들의 조합들로 이루어진 군으로부터 선택된 것을 포함할 수 있다. 상기 아미드계용매는 디메틸포름아미드(DMF), 디메틸아세트아미드(DMAC), n-메틸피롤리돈(NMP) 등을 포함할 수 있으며, 상기 케톤계 용매는 아세톤, 메틸에틸케톤(MEK), 메틸이소부틸케톤(MIBK), 시클로펜탄온, 시클로헥산온 등을 포함할 수 있다. 상기 에테르계 용매는 테트라히드로퓨란(THF), 1,3-디옥솔란및 1,4-디옥산등을 포함할 수 있으며, 상기 에스테르계 용매는 아세트산메틸, 아세트산에틸, 아세트산부틸, γ-부티로락톤, α-아세트락톤, β-프로피오락톤, δ-발레로락톤 등을 포함할 수 있다. 상기 대칭 글리콜디에테르류 용매는 메틸모노글라임(1,2-디메톡시에탄), 메틸디글라임(비스(2-메톡시에틸)에테르), 메틸트리글라임(1,2-비스(2-메톡시에톡시)에탄), 메틸테트라글라임(비스[2-(2-메톡시에톡시에틸)]에테르), 에틸모노글라임(1,2-디에톡시에탄), 에틸디글라임(비스(2-에톡시에틸)에테르), 부틸디글라임(비스(2-부톡시에틸)에테르) 등을 포함할 수 있으며, 상기 에테르류 용매는 글리콜디에테르류, 디프로필렌글리콜메틸에테르, 트리프로필렌글리콜메틸에테르, 프로필렌글리콜n-프로필에테르, 디프로필렌글리콜n-프로필에테르, 프로필렌글리콜n-부틸에테르, 디프로필렌글리콜n-부틸에테르, 트리피렌글리콜n-프로필에테르, 프로필렌글리콜페닐에테르, 디프로필렌글리콜디메틸에테르, 1,3-디옥솔란, 에틸렌글리콜모노부틸에테르, 디에틸렌글리콜모노에틸에테르, 디에틸렌글리콜모노부틸에테르, 에틸렌글리콜모노에틸에테르 등을 포함할 수 있다.In one embodiment of the present invention, the synthetic solvent may be any solvent that is used in the art without limitation, and examples thereof include amide solvents, ketone solvents, ether solvents, ester solvents, symmetric glycol diethers A solvent, a solvent, an ether solvent, and combinations thereof. The amide solvent may include dimethylformamide (DMF), dimethylacetamide (DMAC), n-methylpyrrolidone (NMP), etc. The ketone solvent may include acetone, methyl ethyl ketone (MEK), methyl Isobutyl ketone (MIBK), cyclopentanone, cyclohexanone, and the like. The ether solvent may include tetrahydrofuran (THF), 1,3-dioxolane and 1,4-dioxane, and the ester solvent may include methyl acetate, ethyl acetate, butyl acetate, Lactone,? -Acetolactone,? -Propiolactone,? -Valerolactone, and the like. The symmetrical glycol diether solvents include methyl monoglyme (1,2-dimethoxyethane), methyl diglyme (bis (2-methoxyethyl) ether), methyltriglyme (1,2- Methoxyethoxy) ethane), methyl tetraglyme (bis [2- (2-methoxyethoxyethyl) ether], ethyl monoglyme (1,2-diethoxyethane), ethyl diglyme (bis (2-ethoxyethyl) ether), butyldiglyme (bis (2-butoxyethyl) ether), and the ether solvents include glycol diethers, dipropylene glycol methyl ether, tripropylene glycol methyl Ether, propylene glycol n-propyl ether, dipropylene glycol n-propyl ether, propylene glycol n-butyl ether, dipropylene glycol n-butyl ether, tripylene glycol n-propyl ether, propylene glycol phenyl ether, dipropylene glycol dimethyl ether , 1,3-dioxolane, ethylene glycol monobutyl ether, diethylene glycol No-ethyl ether, di, and the like ethylene glycol monobutyl ether, ethylene glycol monoethyl ether.

본 발명의 일 구현예에 있어서, 상기 합성 용매는 DMPA(dimethylpropionamide)일 수 있다.In one embodiment of the present invention, the synthetic solvent may be dimethylpropionamide (DMPA).

본 발명의 일 구현예에 있어서, 상기 말단-캡핑 제제는 PA(phthallic anhydride), TSA(tetradecyl succinic anhydride), HAS(hexadecyl succinic anhydride), OSA(octadecyl succinic anhydride) 및 이들의 조합들로 이루어진 군으로부터 선택된 것일 수 있으며, 바람직하게는 PA일 수 있다. 상기 말단-캡핑 제제는 중합 반응을 조절하기 위한 것으로, 모노-안하이드라이드 형태로 고분자의 분자량을 조절하고, 미반응물의 함량을 감소시키며, 보관 안정성을 향상시킬 수 있다.In one embodiment of the invention, the end-capping agent is selected from the group consisting of phthalic anhydride, tetradecyl succinic anhydride (TSA), hexadecyl succinic anhydride (HAS), octadecyl succinic anhydride (OSA) It may be selected, and preferably it may be PA. The end-capping agent is for controlling the polymerization reaction, and can control the molecular weight of the polymer in the mono-anhydride form, reduce the content of the unreacted material, and improve the storage stability.

본 발명의 일 구현예에 있어서, 디아민 단량체를 함유하는 합성 용매에 안하이드라이드 단량체를 첨가하여 반응시키는 단계 후에 말단-캡핑 제제를 첨가하는 단계를 추가 포함할 수 있다.In one embodiment of the present invention, the step of adding an anhydride monomer to a synthetic solvent containing a diamine monomer, followed by the step of reacting, may further include the step of adding an end-capping agent.

본 발명의 일 구현예에 있어서, 폴리아믹산 고분자 용액에서 폴리이미드 고분자 조성물을 합성하는데 있어서 이미드화 반응은 열적 이미드 반응과 화학적 이미드 반응을 병행할 수 있다. 두 이미드화 반응을 병행할 경우, 열적 이미드화 반응시 반응 온도를 감소시킬 수 있고, 침전 공정을 통해 합성시 남은 미반응상을 사전에 제거할 수 있는 장점이 있다.In one embodiment of the present invention, in the synthesis of the polyimide polymer composition in the polyamic acid polymer solution, the imidization reaction may be performed in parallel with the thermal imide reaction and the chemical imide reaction. When the two imidization reactions are carried out simultaneously, the reaction temperature can be reduced during the thermal imidization reaction, and the unreacted phase remaining in the synthesis can be removed in advance through the precipitation process.

본 발명의 일 구현예에 있어서, 상기 탈수제 및 촉매는 화학적 이미드화 반응을 위해 사용되는 것으로, 상기 탈수제는 아세트산 무수물 등의 산무수물을 포함하며, 상기 촉매는 피리딘, 이소퀴놀린, β-피콜린 등과 같은 3급 아민류를 포함할 수 있다. In one embodiment of the present invention, the dehydrating agent and the catalyst are used for a chemical imidization reaction, and the dehydrating agent includes an acid anhydride such as acetic anhydride, and the catalyst is selected from the group consisting of pyridine, isoquinoline, And may contain the same tertiary amines.

본 발명의 일 구현예에 있어서, 상기 가교제는 4,4’-메틸렌비스(N,N-디글리시딜아닐린)을 포함할 수 있다. 상기 4,4’-메틸렌비스(N,N-디글리시딜아닐린)은 하기 구조를 가질 수 있다:In one embodiment of the present invention, the crosslinking agent may include 4,4'-methylenebis (N, N-diglycidylaniline). The 4,4'-methylenebis (N, N-diglycidylaniline) may have the following structure:

Figure pat00003
Figure pat00003

본 발명의 일 구현예에 있어서, 상기 폴리이미드 고분자 조성물에 가교제를 첨가하는 단계를 추가 포함할 수 있다. In one embodiment of the present invention, a step of adding a crosslinking agent to the polyimide polymer composition may be further included.

본 발명의 또 다른 측면은, 본 발명의 따른 폴리이미드 고분자 조성물로부터 형성된 투명 또는 유색의 폴리이미드 필름을 제공한다.Another aspect of the present invention provides a transparent or colored polyimide film formed from the polyimide polymer composition according to the present invention.

본 발명의 일 구현예에 있어서, 상기 폴리이미드 필름은 상기 폴리이미드 고분자 조성물을 기판 상에 코팅하는 단계; 및 상기 폴리이미드 고분자가 코팅된 기판을 가열 건조하는 단계에 의해 제조될 수 있다.In one embodiment of the present invention, the polyimide film comprises: coating the polyimide polymer composition on a substrate; And heating and drying the substrate coated with the polyimide polymer.

본 발명의 일 구현예에 있어서, 상기 폴리이미드 고분자 조성물의 제조시 사용된 디아민 단량체 및 안하이드라이드 단량체의 종류에 따라 투명 또는 유색 폴리이미드 필름이 제조될 수 있다.In one embodiment of the present invention, a transparent or colored polyimide film may be produced depending on the kind of the diamine monomer and the anhydride monomer used in the production of the polyimide polymer composition.

이하, 본 발명의 실시예를 통하여 보다 구체적으로 설명하며, 본 실시예에 의하여 본 발명의 범위가 제한되는 것은 아니다.Hereinafter, the present invention will be described more specifically with reference to Examples, but the scope of the present invention is not limited by these Examples.

[[ 실시예Example ]]

실시예Example 1: 투명 폴리이미드 필름 제조를 위한 폴리이미드 고분자 용액의 제조 1: Preparation of Polyimide Polymer Solution for the Production of Transparent Polyimide Film

질소 주입장치 및 적하 깔때기가 연결된 온도 조절이 가능한 교반반응기에 질소를 통과시키면서 상온에서 DMAC 704.2 g을 채운 후 불소계 디아민 단량체인 TFMB 32.02 g(0.1 mol)를 용해시켰다. 여기에 안하이드라이드 단량체로서 방향족 단량체 BPDA 8.83 g(0.03 mol)와 불소계 단량체 6FDA 31.1 g(0.07 mol)를 넣어 반응시켰다. 완전히 용해되고 1 시간 경과 후 촉매 및 탈수제로서 피리딘과 아세트산 무수물을 투입하고 70℃로 승온시킨 후 1 시간 동안 반응시키고 상온까지 냉각시켰다.(DMF) was charged with 704.2 g of DMAC at room temperature, and then 32.02 g (0.1 mol) of TFMB, which is a fluorine-based diamine monomer, was dissolved in a temperature-controlled stirring reactor connected to a nitrogen injection apparatus and a dropping funnel. 8.83 g (0.03 mol) of the aromatic monomer BPDA and 31.1 g (0.07 mol) of the fluorine-based monomer 6FDA were reacted as anhydride monomers. After 1 hour, pyridine and acetic anhydride were added as a catalyst and dehydrating agent, and the mixture was heated to 70 ° C, reacted for 1 hour, and cooled to room temperature.

그런 다음, MeOH와 증류수(3:1)혼합 용액에 침전시켜 고형화시켰다. MeOH에서 충분히 세척한 후 80℃의 진공 오븐에서 6 시간 동안 충분히 건조하여 폴리이미드 고분자 고형물을 수득하였다. It was then solidified by precipitation in a mixture of MeOH and distilled water (3: 1). Sufficiently washed with MeOH, and sufficiently dried in a vacuum oven at 80 DEG C for 6 hours to obtain a polyimide polymer solid.

수득한 폴리이미드 고형물을 DMPA 용액에 분산시키고, 남아있는 고형물이 없도록 충분히 교반시킨 후, 이물질 및 미반응상을 제거하기 위해 여과하여 폴리이미드 고분자 용액을 수득하였다.  The polyimide solids obtained were dispersed in a DMPA solution, stirred sufficiently to avoid the remaining solids, and then filtered to remove the foreign substances and unreacted phases to obtain a polyimide polymer solution.

비교예Comparative Example 1  One

질소 주입장치 및 적하 깔때기가 연결된 온도 조절이 가능한 교반반응기에 질소를 통과시키면서 상온에서 DMAC 704.2 g을 채운 후 불소계 디아민 단량체인 TFMB 32.02 g(0.1 mol)를 완전히 용해시켰다. 여기에 안하이드라이드 단량체로서 방향족 단량체인 BPDA 8.83 g(0.03 mol)와 불소계 단량체인 6FDA 31.1g(0.07 mol)를 첨가하여 반응시켰다. 완전히 용해되고 1 시간 경과 후 촉매 및 탈수제로서피리딘과 아세트산 무수물을 투입하고 70℃로 승온시킨 후 1 시간 동안 반응시키고 상온까지 냉각시켰다.The DMF was charged with 704.2 g of DMAC at room temperature while passing nitrogen through a temperature-controlled stirring reactor connected to a nitrogen injection device and a dropping funnel, and then 32.02 g (0.1 mol) of TFMB as a fluorine-based diamine monomer was completely dissolved. 8.83 g (0.03 mol) of BPDA, which is an aromatic monomer, and 31.1 g (0.07 mol) of 6FDA as a fluorine monomer were added as anhydride monomers and reacted. After 1 hour, pyridine and acetic anhydride were added as a catalyst and dehydrating agent, and the mixture was heated to 70 ° C, reacted for 1 hour, and cooled to room temperature.

그런 다음, MeOH와 증류수 혼합 용액에 침전시킨 후 고형화시켰다. MeOH 에서 충분히 세척한 후 80℃ 진공 오븐에서 6 시간 동안 충분히 건조시켜 폴리이미드 고형물을 수득하였다. Then, it was precipitated in a mixed solution of MeOH and distilled water, and solidified. Sufficiently washed with MeOH, and dried thoroughly in a vacuum oven at 80 캜 for 6 hours to obtain a polyimide solid.

수득한 폴리이미드 고형물을 DMAC 용액에 분산시킨 후, 남아있는 고형물이 없도록 충분히 교반시키고 이물질 및 미반응상을 제거하기 위해 여과하여 폴리이미드 고분자 용액을 수득하였다.  The resulting polyimide solid was dispersed in a DMAC solution, filtered sufficiently to remove foreign matters and unreacted phases to obtain a polyimide polymer solution.

비교예Comparative Example 2 2

질소 주입장치 및 적하 깔때기가 연결된 온도 조절이 가능한 교반반응기에 질소를 통과시키면서 상온에서 DMPA 704.2 g을 채운 후 불소계 디아민 단량체인 TFMB 32.02 g(0.1 mol)를 완전히 용해시켰다. 여기에 안하이드라이드 단량체로서 방향족 단량체인 BPDA 8.83 g(0.03 mol)와 불소계 단량체인 6FDA 31.1 g(0.07 mol)를 첨가하여 반응시켰다. 완전히 용해되고 1 시간 경과 후 촉매 및 탈수제로서 피리딘과 아세트산 무수물을 투입하고 70℃로 승온시킨 후 1 시간 동안 반응시키고 상온까지 냉각시켰다.A nitrogen-introducing reactor and a dropping funnel were connected to a thermostatable stirring reactor. While nitrogen was passed through the reactor, 704.2 g of DMPA was charged at room temperature, and 32.02 g (0.1 mol) of TFMB as a fluorine-based diamine monomer was completely dissolved. 8.83 g (0.03 mol) of BPDA, which is an aromatic monomer, and 31.1 g (0.07 mol) of 6FDA as a fluorine monomer were reacted as anhydride monomers. After 1 hour, pyridine and acetic anhydride were added as a catalyst and dehydrating agent, and the mixture was heated to 70 ° C, reacted for 1 hour, and cooled to room temperature.

그런 다음, MeOH와 증류수 혼합 용액에 침전시킨 후 고형화시켰다. MeOH 에서 충분히 세척한 후 80℃ 진공 오븐에서 6 시간 동안 충분히 건조시켜 폴리이미드 고형물을 수득하였다. Then, it was precipitated in a mixed solution of MeOH and distilled water, and solidified. Sufficiently washed with MeOH, and dried thoroughly in a vacuum oven at 80 캜 for 6 hours to obtain a polyimide solid.

수득한 폴리이미드 고형물을 DMPA 용액에 분산시킨 후, 남아있는 고형물이 없도록 충분히 교반시키고 이물질 및 미반응상을 제거하기 위해 여과하여 폴리이미드 고분자 용액을 수득하였다. The resulting polyimide solid was dispersed in a DMPA solution, and sufficiently stirred to eliminate remaining solids and filtered to remove foreign matter and unreacted phases to obtain a polyimide polymer solution.

실시예Example 2: 투명 폴리이미드 필름의 제조 2: Preparation of transparent polyimide film

상기 실시예 1 및 비교예 1 및 2에서 수득한 폴리이미드 고분자 용액을 유리 기판 위에 어플리케이터(applicator)를 이용하여 wet 두께 400 ㎛로 코팅한 후 컨벤션 오븐(convection oven)에서 280℃까지 가열 건조시켜 30 ㎛ 두께의 폴리이미드 필름을 제조하였다.The polyimide polymer solution obtained in Example 1 and Comparative Examples 1 and 2 was coated on a glass substrate with an applicator at a wet thickness of 400 μm and then heated and dried in a convection oven at 280 ° C. A polyimide film having a thickness of 탆 was prepared.

실시예Example 3: 유색 폴리이미드 필름 제조를 위한 폴리이미드 고분자 용액의 제조 3: Preparation of polyimide polymer solution for the production of colored polyimide film

질소 주입장치 및 적하 깔때기가 연결된 온도 조절이 가능한 교반반응기에 질소를 통과시키면서 상온에서 DMPA 242.45 g을 채운 후 PPDA 10.91 g을 완전히 용해시키고 BPDA 26.48 g과 PMDA 2.18 g을 차례로 투입하였다. 완전히 용해된 후 1 시간 경과 후에 PA 0.2 g을 투입하고 16 시간 동안 반응시켜 PAA를 합성하였다. 그런 다음, 단량체(DMPA, BPDA 및 PMDA) 함량의 4000 ppm의 4,4’-메틸렌비스(N,N-디글리시딜아닐린)을 반응 용매와 동일한 용매에 녹여 반응이 끝난 PAA에 첨가하여 혼합하였다.In a temperature-controlled stirred reactor equipped with a nitrogen inlet and a dropping funnel, 242.45 g of DMPA was charged at room temperature while nitrogen was passed through. Then 10.91 g of PPDA was completely dissolved and 26.48 g of BPDA and 2.18 g of PMDA were added in turn. After 1 hour from complete dissolution, 0.2 g of PA was added and reacted for 16 hours to synthesize PAA. Then, 4,4'-methylenebis (N, N-diglycidylaniline) of 4000 ppm of the contents of monomers (DMPA, BPDA and PMDA) was dissolved in the same solvent as the reaction solvent, Respectively.

비교예Comparative Example 3 3

질소 주입장치 및 적하 깔때기가 연결된 온도 조절이 가능한 교반반응기에 질소를 통과시키면서 상온에서 NMP 242.45 g을 채운 후 PPDA 10.91 g을 완전히 용해시키고 BPDA 26.48 g과 PMDA 2.18 g을 차례로 투입하였다. 완전히 용해되고1 시간 경과 후에 PA 0.2 g을 투입하고 16 시간 동안 반응시켜 PAA를 합성하였다. 그런 다음, 단량체(PPDA, BPDA및 PMDA) 함량의 4000 ppm의 4,4’-메틸렌비스(N,N-디글리시딜아닐린)을 용매에 녹여 반응이 끝난 PAA에 첨가하여 혼합하였다.Nitrogen was injected into a stirred reactor equipped with a nitrogen inlet and a dropping funnel. NMP (242.45 g) was charged at room temperature while passing nitrogen through the reactor. Then, 10.91 g of PPDA was completely dissolved and 26.48 g of BPDA and 2.18 g of PMDA were introduced. After 1 hour of complete dissolution, PAA was synthesized by adding 0.2 g of PA and reacting for 16 hours. Then, 4,4'-methylenebis (N, N-diglycidylaniline) of 4000 ppm of the monomer (PPDA, BPDA and PMDA) contents was dissolved in the solvent and added to the PAA after the reaction.

실시예Example 4: 유색 폴리이미드필름의 제조 4: Preparation of colored polyimide film

상기 실시예 3 및 비교예 3에서 수득한 폴리이미드 고분자 용액을 유리 기판 위에 어플리케이터를 이용하여 wet 두께 350 ㎛ 코팅한 후 컨벤션 오븐에서 450℃까지 가열 건조시켜 20 ㎛ 두께의 폴리이미드 필름을 제조하였다.The polyimide polymer solution obtained in Example 3 and Comparative Example 3 was coated on a glass substrate with an applicator using a wet thickness of 350 占 퐉 and then heated to 450 占 폚 in a convention oven to prepare a polyimide film having a thickness of 20 占 퐉.

실험예Experimental Example 1 One

상기 실시예 2 및 4에서 합성한 폴리이미드 필름을 하기 방법으로 물성을 평가하였으며, 그 결과는 하기 표 1 내지 3에 나타냈다. The properties of the polyimide films synthesized in Examples 2 and 4 were evaluated by the following methods, and the results are shown in Tables 1 to 3 below.

열팽창계수 측정 Measurement of thermal expansion coefficient

TMA(TA instrument社, Q400)을 이용하여 TMA-method에 따라 선형 열팽창계수를 측정하였다. 승온 속도는 분당 5℃, 냉각 속도는 분당 20℃로 측정하였으며, 필름내 응력이 남아 있을 수 있기 때문에 Tg 이하 온도에서 30℃에서 300℃까지 온도 범위에서 측정하였다. CTE 값은 냉각시 기울기에서 측정하였다. The linear thermal expansion coefficient was measured according to TMA-method using TMA (TA instrument, Q400). The heating rate was measured at 5 ° C per minute and the cooling rate at 20 ° C per minute. Since the stress in the film may remain, the temperature was measured from 30 ° C to 300 ° C at a temperature below Tg. CTE values were measured at slope during cooling.

투과도 측정Permeability measurement

광학 측정 장비 (Nippon Denshoku社, COH-400) 을 이용하여 가시광성 영역에서 5회 측정 후 평균값을 측정하였다. The average value was measured five times in the visible region using an optical measuring instrument (Nippon Denshoku Co., COH-400).

황색도 측정Yellowness measurement

광학 측정 장비 (Nippon Denshoku社, COH-400) 을 이용하여 황색도를 측정하였다.The yellowness was measured using an optical measuring instrument (Nippon Denshoku, COH-400).

상기 측정한 결과를 표 1 내지 3에 나타냈다.The measurement results are shown in Tables 1 to 3.

투명 폴리이미드 제조 (30 ㎛ 필름 두께)Transparent polyimide preparation (30 탆 film thickness) No. No. 분류 Classification 아민Amine 안하이드라이드Anhydride 촉매catalyst 용매menstruum CTECTE TT YIYI 실시예 1Example 1 합성synthesis F계 단량체F-based monomer 방향족 구조 단량체Aromatic structure monomer 촉매 및 탈수제 Catalyst and dehydrating agent DMACDMAC 20.820.8 90.190.1 2.72.7 분산Dispersion 침전 후 건조, 재분산After precipitation, drying, redispersing DMPADMPA 17.617.6 90.390.3 3.13.1 비교예 1Comparative Example 1 합성synthesis F계 단량체F-based monomer 방향족 구조 단량체Aromatic structure monomer 촉매 및 탈수제 Catalyst and dehydrating agent DMACDMAC 21.121.1 89.889.8 2.62.6 분산Dispersion 침전 후 건조, 재분산After precipitation, drying, redispersing DMACDMAC 20.520.5 89.789.7 4.54.5 비교예 2Comparative Example 2 합성synthesis F계 단량체F-based monomer 방향족 구조 단량체Aromatic structure monomer 촉매 및 탈수제 Catalyst and dehydrating agent DMPA DMPA 22.4922.49 89.589.5 3.93.9 분산Dispersion 침전 후 건조, 재분산After precipitation, drying, redispersing DMPA DMPA 21.0521.05 89.7289.72 4.14.1

유색 폴리이미드 제조 (20 ㎛ 필름 두께)Preparation of colored polyimide (20 탆 film thickness)   분류Classification 아민Amine 안하이드라이드Anhydride 용매menstruum CTECTE TT YIYI 실시예 3Example 3 합성synthesis 방향족 구조 단량체Aromatic structure monomer 방향족 구조 단량체Aromatic structure monomer DMPADMPA 3.123.12 55.855.8 -- 비교예 3Comparative Example 3 합성synthesis 방향족 구조 단량체Aromatic structure monomer 방향족 구조 단량체Aromatic structure monomer NMPNMP 3.543.54 51.351.3 --

합성 용매 물성 비교: DMPA, DMAC, NMPComparison of synthetic solvent properties: DMPA, DMAC, NMP 구분division DMPA DMPA DMAC DMAC NMP NMP N,N-DimethylpropionamideN, N-Dimethylpropionamide N,N-DimethylacetamideN, N-Dimethylacetamide 1-Methyl-2-pyrrolidinone 1-Methyl-2-pyrrolidinone CAS No. CAS No. 758-96-3 758-96-3 127-19-5 127-19-5 872-50-4 872-50-4 몰수 confiscation 101.15 101.15 87.12 87.12 99.13 99.13 B.P B.P 174-176 °C 174-176 [deg.] C 165.1 °C 165.1 DEG C. 202 °C 202 ° C 굴절률 Refractive index 1.438 1.438 1.439 1.439 1.479 1.479 유전상수 Dielectric constant 33.08 33.08 37.78 37.78 32.20 32.20 Dipole Moment Dipole Moment 3.78D 3.78D 3.72D 3.72D 4.09D 4.09D 구조 rescue

Figure pat00004
Figure pat00004
Figure pat00005
Figure pat00005
Figure pat00006
Figure pat00006

상기 표 1 내지 3에서 볼 수 있는 바와 같이, 종래에 폴리이미드 필름의 제조에 사용되는 극성 용매인 DMAC(N,N-Dimethylacetamide) 또는 NMP(n-Methyl 2 pyrrolidone)에 비해 DMPA(Dimethylpropionamide)를 사용했을 때 CTE, 투과도 등의 물성이 더 우수함을 확인할 수 있다. 또한, DMPA에서 단량체들이 더 잘 용해되어 높은 용해도를 보였다.As can be seen from Tables 1 to 3, DMPA (dimethylpropionamide) was used in comparison with DMAC (N, N-Dimethylacetamide) or NMP (n-Methyl 2 pyrrolidone) which are conventionally used in the production of polyimide films. , It can be confirmed that the physical properties such as CTE and permeability are superior. Also, the monomers were more soluble in DMPA and showed high solubility.

전술한 본 발명의 설명은 예시를 위한 것이며, 본 발명이 속하는 기술분야의 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 쉽게 변형이 가능하다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다. 예를 들어, 단일형으로 설명되어 있는 각 구성요소는 분산되어 실시될 수도 있으며, 마찬가지로 분산된 것으로 설명되어 있는 구성요소들도 결합된 형태로 실시될 수 있다.It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

본 발명의 범위는 상기 상세한 설명보다는 후술하는 특허청구범위에 의하여 나타내어지며, 특허청구범위의 의미 및 범위, 그리고 그 균등 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다. The scope of the present invention is defined by the appended claims rather than the foregoing description, and all changes or modifications derived from the meaning and scope of the claims and the equivalents thereof are included in the scope of the present invention. .

Claims (14)

DMPA(dimethylpropionamide)를 합성 용매 또는 분산 용매로 사용하여 제조되며, 화학식 1로서 표시되는 폴리아믹산-폴리이미드 공중합체를 포함하는, 폴리이미드 고분자 조성물:
[화학식 1]
Figure pat00007

상기 화학식 1에서,
R1은 불소기 또는 방향족 안하이드라이드 단량체이고,
R은 디아민 단량체이며,
n은 1 내지 1,000의 정수이고,
m은 1 내지 1,000의 정수임.

A polyimide polymer composition comprising a polyamic acid-polyimide copolymer, which is produced by using dimethylpropionamide (DMPA) as a synthesis solvent or a dispersion solvent and represented by Formula (1)
[Chemical Formula 1]
Figure pat00007

In Formula 1,
R 1 is a fluorine group or an aromatic anhydride monomer,
R is a diamine monomer,
n is an integer of 1 to 1,000,
and m is an integer of 1 to 1,000.

제 1 항에 있어서,
상기 디아민 단량체는PPDA(p-Phenylenediamine), ODA(4,4'-Oxydianiline), MDA(4,4'-Methylenedianiline), m-톨리딘(2,2'-Dimethyl-4,4'-Diaminobiphenyl), TPE-R(1,3-BIS(4'-Aminophenoxyl)benzene), TFMB(2,2'-Bis(trifluoromethyl) benzidine), HFBAPP(2,2-BIS[4-(4-Aminophenoxy)Phenyl]Hexafluoropropane), BIS-AP-AF(2,2-Bis(3-amino-4-hydroxyphenyl)hexafluoropropane), DRFB(1,3-Diamino-2,4,5,6-Tetrafluorobenzene), DDS(3,3'-Diaminodiphenyl Sulfone), ASD(4,4'-Diaminodiphenyl Sulfide), BAPS(Bis[4-(4-aminophenoxy)phenyl]sulfone), m-BAPS(2,2-Bis [4-(3-Aminophenoxy) Benzene] Sulfone) 및 이들의 조합들로 이루어진 군으로부터 선택된 것인, 폴리이미드 고분자 조성물.
The method according to claim 1,
The diamine monomer may be at least one selected from the group consisting of PPDA (p-phenylenediamine), ODA (4,4'-Oxydianiline), MDA (4,4'-Methylenedianiline), 2,2'- , TPE-R (1,3-BIS (4'-Aminophenoxy) benzene), TFMB (2,2'-Bis (trifluoromethyl) benzidine), HFBAPP (2,2- (1,3-diamino-2,4,5,6-tetrafluorobenzene), DDS (3,3-diamino-4-hydroxyphenyl) hexafluoropropane) (4-aminophenoxy) phenyl sulfone), m-BAPS (2,2-Bis [4- (3-Aminophenoxy) Benzene] Sulfone), and combinations thereof.
제 1 항에 있어서,
상기 안하이드라이드 단량체는 BTDA(3,3',4,4'-benzophenonetetracarboxylicdianhydride), PMDA(pyromelliticdianhydride), BPDA(3,3',4,4'-biphenyl tetracarboxylicaciddianhydride), 6FDA(2,2-bis(3,4-anhydrodicarboxyphenyl)-hexafluoropropanedianhydride), a-BPDA(2,3,3',4-biphenyl tetracarboxylicaciddianhydride), ODPA(4,4'-oxydiphthalic anhydride), DSDA(3,3',4,4'-diphenylsulfone-tetracarboxylic dianhydride), BPADA(2,2-bis[4-(3,4-dicarboxyphenoxy) phenyl] propane dianhydride), HQDA(hydroquinone diphthalic anhydride) 및 이들의 조합들로 이루어진 군으로부터 선택된 것을 포함하는 것인, 폴리이미드 고분자 조성물.
The method according to claim 1,
The anhydride monomer may be selected from the group consisting of BTDA (3,3 ', 4,4'-benzophenonetetracarboxylic dihydride), PMDA (pyromellitic dianhydride), BPDA (3,3', 4,4'-biphenyl tetracarboxylic acid hydrides), 6FDA 3,4-anhydrodicarboxyphenyl) -hexafluoropropanedianhydride), a-BPDA (2,3,3 ', 4-biphenyl tetracarboxylic acid dihydride), 4,4'- oxydiphthalic anhydride, DSDA (3,3', 4,4'- diphenylsulfone-tetracarboxylic dianhydride), BPADA (2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] propane dianhydride, HQDA (hydroquinone diphthalic anhydride), and combinations thereof. , Polyimide polymer composition.
디아민 단량체를 함유하는 합성용액에 안하이드라이드 단량체를 첨가하여 반응시키는 단계;
상기 반응 용액에 촉매 및 탈수제를 첨가하여 반응시킨 후 고형화시키는 단계; 및
상기 고형화물을 DMPA(dimethylpropionamide)에 분산시키는 단계
를 포함하는, 폴리이미드 고분자 조성물의 제조 방법.
Adding an anhydride monomer to a synthetic solution containing a diamine monomer and reacting;
Adding a catalyst and a dehydrating agent to the reaction solution to react and solidify the catalyst; And
Dispersing the solidified product in DMPA (dimethylpropionamide)
≪ / RTI >
디아민 단량체를 함유하는 DMPA(dimethylpropionamide) 용액에 안하이드라이드 단량체를 첨가하여 반응시키는 단계;
상기 반응 용액에 말단-캡핑 제제를 첨가한 후 반응시켜 폴리아믹산을 합성하는 단계; 및
상기 폴리아믹산에 가교제를 첨가하여 혼합하는 단계
를 포함하는, 폴리이미드 고분자 조성물의 제조 방법.
Adding an anhydride monomer to a dimethylpropionamide (DMPA) solution containing a diamine monomer and reacting;
Adding a terminal-capping agent to the reaction solution, and then reacting to synthesize a polyamic acid; And
Adding a cross-linking agent to the polyamic acid and mixing
≪ / RTI >
제 4 항 또는 제 5 항에 있어서,
상기 디아민 단량체는PPDA(p-Phenylenediamine), ODA(4,4'-Oxydianiline), MDA(4,4'-Methylenedianiline), m-톨리딘(2,2'-Dimethyl-4,4'-Diaminobiphenyl), TPE-R(1,3-BIS(4'-Aminophenoxyl)benzene), TFMB(2,2'-Bis(trifluoromethyl) benzidine), HFBAPP(2,2-BIS[4-(4-Aminophenoxy)Phenyl]Hexafluoropropane), BIS-AP-AF(2,2-Bis(3-amino-4-hydroxyphenyl)hexafluoropropane), DRFB(1,3-Diamino-2,4,5,6-Tetrafluorobenzene), DDS(3,3'-Diaminodiphenyl Sulfone), ASD(4,4'-Diaminodiphenyl Sulfide), BAPS(Bis[4-(4-aminophenoxy)phenyl]sulfone), m-BAPS(2,2-Bis [4-(3-Aminophenoxy) Benzene] Sulfone) 및 이들의 조합들로 이루어진 군으로부터 선택된 것인, 폴리이미드 고분자 조성물의 제조 방법.
The method according to claim 4 or 5,
The diamine monomer may be at least one selected from the group consisting of PPDA (p-phenylenediamine), ODA (4,4'-Oxydianiline), MDA (4,4'-Methylenedianiline), 2,2'- , TPE-R (1,3-BIS (4'-Aminophenoxy) benzene), TFMB (2,2'-Bis (trifluoromethyl) benzidine), HFBAPP (2,2- (1,3-diamino-2,4,5,6-tetrafluorobenzene), DDS (3,3-diamino-4-hydroxyphenyl) hexafluoropropane) (4-aminophenoxy) phenyl sulfone), m-BAPS (2,2-Bis [4- (3-Aminophenoxy) Benzene] sulfone), and combinations thereof. ≪ Desc / Clms Page number 13 >
제 4 항 또는 제 5 항에 있어서,
상기 안하이드라이드 단량체는 방향족 디안하이드라이드 단량체인 것인, 폴리이미드 고분자 조성물의 제조 방법.
The method according to claim 4 or 5,
Wherein the anhydride monomer is an aromatic dianhydride monomer.
제 7 항에 있어서,
상기 방향족 디안하이드라이드 단량체는BTDA(3,3',4,4'-benzophenonetetracarboxylicdianhydride), PMDA(pyromelliticdianhydride), BPDA(3,3',4,4'-biphenyl tetracarboxylicaciddianhydride), 6FDA(2,2-bis(3,4-anhydrodicarboxyphenyl)-hexafluoropropanedianhydride), a-BPDA(2,3,3',4-biphenyl tetracarboxylicaciddianhydride), ODPA(4,4'-oxydiphthalic anhydride), DSDA(3,3',4,4'-diphenylsulfone-tetracarboxylic dianhydride), BPADA(2,2-bis[4-(3,4-dicarboxyphenoxy) phenyl] propane dianhydride), HQDA(hydroquinone diphthalic anhydride) 및 이들의 조합들로 이루어진 군으로부터 선택된 것을 포함하는 것인, 폴리이미드 고분자 조성물의 제조 방법.
8. The method of claim 7,
The aromatic dianhydride monomer may be selected from the group consisting of BTDA (3,3 ', 4,4'-benzophenonetetracarboxylic dihydride), PMDA (pyromellitic dianhydride), BPDA (3,3', 4,4'-biphenyl tetracarboxylic acid hydydride), 6FDA (3,4-anhydrodicarboxyphenyl) -hexafluoropropanedianhydride), a-BPDA (2,3,3 ', 4-biphenyl tetracarboxylic acid dihydride), 4,4'- oxydiphthalic anhydride, DSDA (3,3' -diphenylsulfone-tetracarboxylic dianhydride), BPADA (2,2-bis [4- (3,4-dicarboxyphenoxy) phenyl] propane dianhydride), HQDA (hydroquinone diphthalic anhydride) and combinations thereof ≪ / RTI > by weight of the polyimide polymer composition.
제 4 항 또는 제 5 항에 있어서,
하나 이상의 안하이드라이드 단량체를 첨가하는 것인, 폴리이미드 고분자 조성물의 제조 방법.
The method according to claim 4 or 5,
Wherein at least one anhydride monomer is added to the polyimide polymer composition.
제 4 항에 있어서,
상기 합성 용매는 아미드계 용매, 케톤계 용매, 에테르계 용매, 에스테르계 용매, 대칭 글리콜디에테르류 용매, 에테르류 용매 및 이들의 조합들로 이루어진 군으로부터 선택된 것을 포함하는 것인, 폴리이미드 고분자 조성물의 제조 방법.
5. The method of claim 4,
Wherein the synthetic solvent is selected from the group consisting of an amide solvent, a ketone solvent, an ether solvent, an ester solvent, a symmetric glycol diether solvent, an ether solvent and combinations thereof. ≪ / RTI >
제 4 항에 있어서,
상기 탈수제는 산무수물을 포함하며, 상기 촉매는 3급 아민류를 포함하는 선택된 것인, 폴리이미드 고분자 조성물의 제조 방법.
5. The method of claim 4,
Wherein the dehydrating agent comprises an acid anhydride, and the catalyst is selected comprising tertiary amines.
제 5 항에 있어서,
상기 말단-캡핑 제제는 PA(phthallic anhydride), TSA(tetradecyl succinic anhydride), HAS(hexadecyl succinic anhydride), OSA(octadecyl succinic anhydride) 및 이들의 조합들로 이루어진 군으로부터 선택된 것인, 폴리이미드 고분자 조성물의 제조 방법.
6. The method of claim 5,
Wherein the end-capping agent is selected from the group consisting of phthalic anhydride, tetradecyl succinic anhydride (TSA), hexadecyl succinic anhydride (HAS), octadecyl succinic anhydride (OSA), and combinations thereof. Gt;
제 5 항에 있어서,
상기 가교제는 4,4’-메틸렌비스(N,N-디글리시딜아닐린)을 포함하는 것인, 폴리이미드 고분자 조성물의 제조 방법.
6. The method of claim 5,
Wherein the cross-linking agent comprises 4,4'-methylenebis (N, N-diglycidylaniline).
제 1 항의 폴리이미드 고분자 조성물로부터 형성된 투명 또는 유색의 폴리이미드 필름.A transparent or colored polyimide film formed from the polyimide polymer composition of claim 1.
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