JP2017119868A - Polyimide polymer composition and production method of the same, and production method of polyimide film using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polyimide polymer composition and a production method of the composition, and a production method of a polyimide film using the composition.SOLUTION: The polyimide polymer composition comprises a polyamic acid-polyimide copolymer represented by formula 1 produced by using DMPA (dimethyl propionamide) as a synthesis solvent or dispersion solvent. In formula 1, Rrepresents a fluorine group or an aromatic anhydride monomer; R represents a diamine monomer; n is a constant of 1 to 1,000; and m is a constant of 1 to 1,000.SELECTED DRAWING: None

Description

  The present invention relates to a polyimide polymer composition, a method for producing the same, and a method for producing a polyimide film using the same.

  Polyimide resins have excellent electrical, thermal, chemical, and mechanical properties compared to other polymers, and thus are widely applied in the heat-resistant tip material and electronic material fields. In particular, in the display field, a material for manufacturing a flexible substrate is attracting attention because of its high heat resistance.

  In general, a diamine monomer, a dianhydride monomer, and a polar solvent are used to synthesize polyimide. Depending on the imide method, a thermal imide method, a chemical imide method, and the like are often used. In order to apply the chemical imide method, the chemical imide method may be advanced using a catalyst or a dehydrating agent.

  In order to synthesize polyimide resin with excellent heat resistance, it is necessary to use a monomer with an aromatic structure, but due to the high density of the aromatic ring, the color of the film becomes brown or yellow, and in the visible light region The transmittance is lowered. Such a polyimide resin has a limit in the field where transparency is required, and other composition and structural design are required to use it as a substitute for the glass substrate material. However, when one physical property is improved, the other physical properties are degraded. To produce a transparent flexible substrate that satisfies all of the transparency, thermal properties, and mechanical properties of polyimide, polyamic acid (polyamic acid) ) It is a situation that requires development of the composition.

  Most of the solvents used for synthesizing polyimide are polar solvents and are substances subject to environmental regulations (Patent Document 1). However, if this is replaced, the desired physical properties cannot be obtained, so they are used as they are.

Patent registration No. 5201155

  In order to solve the above-mentioned problems caused by the prior art, the present invention completes the present invention by producing a polyamic acid-polyimide copolymer using DMPA (dimethylpropionamide) as a synthesis solvent or a dispersion solvent. It came.

One aspect of the present invention for achieving the above object is produced using DMPA (dimethylpropionamide) as a synthesis solvent or a dispersion solvent.
(In Formula 1, R ₁ is a fluorine group or aromatic anhydride monomer, R is a diamine monomer, n is a constant of 1 to 1,000, and m is 1 to 1,000. It is a constant.) The polyimide polymer composition containing the polyamic acid-polyimide copolymer represented by this is provided.

  In another aspect of the present invention, a step of adding an hydride monomer to a synthetic solvent containing a diamine monomer and reacting, and a step of adding a catalyst and a dehydrating agent to the reaction solution to cause the reaction solution to solidify And a step of dispersing the solidified product in DMPA (dimethylpropionamide), and a method for producing a polyimide polymer composition for producing a transparent polyimide film.

  According to another aspect of the present invention, a reaction is performed by adding an anhydride monomer to a DMPA (dimethylpropionamide) solution containing a diamine monomer, and a reaction after adding an end-capping preparation to the reaction solution. And a step of synthesizing a polyamic acid, and a step of adding a crosslinking agent to the polyamic acid and mixing them, and a method for producing a polyimide polymer composition.

  Another aspect of the present invention provides a transparent or colored polyimide film formed from the polyimide polymer composition according to the above aspect of the present invention.

  According to the present invention, DMPA (dimethylpropionamide) can be used for synthesis or dispersion instead of the polar solvent used for the synthesis of existing polyimides, thereby replacing the polar solvent that is subject to environmental regulations. By using DMPA (dimethylpropionamide), the present invention can provide a polyimide film having improved physical properties such as CTE and permeability compared with the case of using a conventional polar solvent.

  Hereinafter, exemplary embodiments and embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present invention pertains can be easily implemented.

  However, the present invention can be embodied in various forms, and is not limited to the following embodiments and examples. In order to clearly describe the present invention in the drawings, parts not related to the description are omitted, and like parts are denoted by like reference numerals throughout the specification.

One aspect of the present invention is produced using DMPA (dimethylpropionamide) as a synthesis solvent or a dispersion solvent.
(In Formula 1, R ₁ is a fluorine group or aromatic anhydride monomer, R is a diamine monomer, n is a constant of 1 to 1,000, and m is 1 to 1,000. It is a constant.) The polyimide polymer composition containing the polyamic acid-polyimide copolymer represented by this is provided.

  In one embodiment of the present invention, the polyimide polymer composition may be for producing a transparent or colored polyimide film.

  In one embodiment of the present invention, the diamine monomer may be PPDA (p-phenylenediamine), ODA (4,4′-oxydianiline), MDA (4,4′-methylenedianiline), m-tolidene. (2,2′-dimethyl-4,4′-diaminobiphenyl), TPE-R (1,3-bis (4′-aminophenoxy) benzene), TFMB (2,2′-bis (trifluoromethyl) benzidine ), HFBAPP (2,2′-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane), BIS-AP-AF (2,2′-bis (3-amino-4-hydroxyphenyl) hexafluoro Propane), DRFB (1,3-diamino-2,4,5,6-tetrafluorobenzene), DDS (3,3′-diaminodiphenylsulfone) ASD (4,4′-diaminodiphenyl sulfide), BAPS (bis [4- (4-aminophenoxy) phenyl] sulfone), m-BAPS (2,2′-bis [4- (3-aminophenoxy) benzene] Sulfone) and combinations thereof may be included. An appropriate diamine monomer can be selected and used according to the required physical properties of the application field of polyimide. In order to produce a polyimide film with high heat resistance and low coefficient of thermal expansion, it is possible to select and use a diamine monomer with an aromatic structure and to synthesize colored polyimide that does not require transparency In this case, it is appropriate to use a PPDA monomer. Furthermore, in order to synthesize a transparent polyimide, a fluorine-based monomer can be used. For example, a TFMB monomer can be used.

  In one embodiment of the present invention, the anhydride monomer may be an aromatic dianhydride monomer, such as BTDA (3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride), PMDA (pyromellitic anhydride), BPDA (3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride), 6FDA (2,2-bis (3,4-anhydrodicarboxyphenyl) -hexafluoro Propane dianhydride), a-BPDA (2,3,3 ′, 4′-biphenyltetracarboxylic dianhydride), ODPA (4,4′-oxydiphthalic anhydride), DSDA (3,3 ′, 4 , 4'-diphenylsulfonetetracarboxylic dianhydride), BPADA (5,5 '-[1-methyl-1,1-ethanediylbis (1,4-phenylene) bisoxy] bi (Isobenzofuran-1,3-dione), HQDA (hydroquinone diphthalic anhydride), and a combination thereof may include one aromatic dianhydride monomer. As described above, for example, at least two monomers can be used, and an appropriate anhydride monomer can be selected and used according to the required physical properties in the application field of polyimide. In the case of synthesis of a colored polyimide film that does not require transparency, BPDA and PMDA monomers can be used, and in order to synthesize transparent polyimide, it is appropriate to use 6FDA monomer, In order to improve heat resistance and mechanical properties, it is appropriate to use a BPDA monomer.

  In another aspect of the present invention, a step of adding an hydride monomer to a synthetic solvent containing a diamine monomer and reacting, and a step of adding a catalyst and a dehydrating agent to the reaction solution to cause the reaction solution to solidify And a step of dispersing the solidified product in DMPA (dimethylpropionamide), and a method for producing a polyimide polymer composition.

  According to another aspect of the present invention, a reaction is performed by adding an anhydride monomer to a DMPA (dimethylpropionamide) solution containing a diamine monomer, and a reaction after adding an end-capping preparation to the reaction solution. And a step of synthesizing a polyamic acid, and a step of adding a crosslinking agent to the polyamic acid and mixing them, and a method for producing a polyimide polymer composition.

  In one embodiment of the present invention, the polyimide polymer composition may be for producing a transparent or colored polyimide film.

  In one embodiment of the present invention, the diamine monomer may be PPDA (p-phenylenediamine), ODA (4,4′-oxydianiline), MDA (4,4′-methylenedianiline), m-tolidene. (2,2′-dimethyl-4,4′-diaminobiphenyl), TPE-R (1,3-bis (4′-aminophenoxy) benzene), TFMB (2,2′-bis (trifluoromethyl) benzidine ), HFBAPP (2,2′-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane), BIS-AP-AF (2,2′-bis (3-amino-4-hydroxyphenyl) hexafluoro Propane), DRFB (1,3-diamino-2,4,5,6-tetrafluorobenzene), DDS (3,3′-diaminodiphenylsulfone) ASD (4,4′-diaminodiphenyl sulfide), BAPS (bis [4- (4-aminophenoxy) phenyl] sulfone), m-BAPS (2,2′-bis [4- (3-aminophenoxy) benzene] Sulfone) and combinations thereof may be included. An appropriate diamine monomer can be selected and used according to the required physical properties of the application field of polyimide. In order to produce a polyimide film with high heat resistance and low coefficient of thermal expansion, it is possible to select and use a diamine monomer with an aromatic structure and to synthesize colored polyimide that does not require transparency In this case, it is appropriate to use a PPDA monomer. Furthermore, in order to synthesize a transparent polyimide, a fluorine-based monomer can be used. For example, a TFMB monomer can be used.

  In one embodiment of the present invention, the anhydride monomer may be an aromatic dianhydride monomer, such as BTDA (3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride), PMDA (pyromellitic anhydride), BPDA (3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride), 6FDA (2,2-bis (3,4-anhydrodicarboxyphenyl) -hexafluoro Propane dianhydride), a-BPDA (2,3,3 ′, 4′-biphenyltetracarboxylic dianhydride), ODPA (4,4′-oxydiphthalic anhydride), DSDA (3,3 ′, 4 , 4′-diphenylsulfonetetracarboxylic dianhydride), BPADA (5,5 ′-[1-methyl-1,1-ethanediylbis (1,4-phenylene) bisoxy] bis (isobenzo) Furan-1,3-dione), HQDA (hydroquinone diphthalic anhydride), and combinations thereof, the aromatic dianhydride monomer may include one or more, For example, at least two monomers can be used, and an appropriate anhydride monomer can be selected and used in accordance with the required physical properties of the polyimide application field. BPDA and PMDA monomers can be used when synthesizing colored polyimide films that are not required for the properties, and it is appropriate to use 6FDA monomers to synthesize transparent polyimide, and have heat resistance characteristics. In order to improve the mechanical properties, it is appropriate to use a BPDA monomer.

  In one embodiment of the present invention, the synthetic solvent can be used without limitation as long as it is a solvent used in this field. For example, amide solvents, ketone solvents, ether solvents, ester solvents, symmetric glycol diethers Those selected from the group consisting of solvents, ether solvents and combinations thereof can be included. The amide solvent may include dimethylformamide (DMF), dimethylacetamide (DMAC), n-methylpyrrolidone (NMP), and the ketone solvent may be acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK). ), Cyclopentanone, cyclohexanone, and the like. The ether solvent may include tetrahydrofuran (THF), 1,3-dioxolane, 1,4-dioxane, and the ester solvent may include methyl acetate, ethyl acetate, butyl acetate, γ-butyrolactone, α- Acetolactone, β-propiolactone, δ-valerolactone and the like can be included. The symmetric glycol diether solvents are methyl monoglyme (1,2-dimethoxyethane), methyl diglyme (bis (2-methoxyethyl) ether), methyltriglyme (1,2-bis (2-methoxyethoxy) ethane) , Methyl tetraglyme (bis [2- (2-methoxyethoxyethyl)] ether), ethyl monoglyme (1,2-diethoxyethane), ethyl diglyme (bis (2-ethoxyethyl) ether), butyl diglyme (bis (2 -Butoxyethyl) ether) and the like, and the ether solvents include glycol diethers, dipropylene glycol methyl ether, tripropylene glycol methyl ether, propylene glycol n-propyl ether, dipropylene glycol n-propyl ether. , Propi Glycol n-butyl ether, dipropylene glycol n-butyl ether, tripylene glycol n-propyl ether, propylene glycol phenyl ether, dipropylene glycol dimethyl ether, 1,3-dioxolane, ethylene glycol monobutyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether , Ethylene glycol monoethyl ether, and the like.

  In one embodiment of the present invention, the synthetic solvent may be DMPA (dimethylpropionamide).

  In one embodiment of the present invention, the end-capping preparation comprises PA (phthalic anhydride), TSA (n-tetradecyl succinic anhydride), HAS (hexadecyl succinic anhydride), OSA (octadecyl succinic anhydride). ) And combinations thereof, and may preferably be PA. The end-capping preparation is for controlling the polymerization reaction, and can adjust the molecular weight of the polymer in a mono-anhydride form, reduce the content of unreacted substances, and improve storage stability.

  In one embodiment of the present invention, the method may further include adding an end-capping preparation after the step of adding an hydride monomer to a synthetic solvent containing a diamine monomer and reacting the synthetic solvent.

  In one embodiment of the present invention, in synthesizing a polyimide polymer composition with a polyamic acid polymer solution, the imidization reaction can be performed in parallel with a thermal imide reaction and a chemical imide reaction. When the two imidization reactions are performed in parallel, the reaction temperature can be reduced during the thermal imidization reaction, and there is an advantage that the unreacted phase remaining during the synthesis can be removed in advance through the precipitation step.

  In one embodiment of the present invention, the dehydrating agent and the catalyst are used for a chemical imidization reaction, and the dehydrating agent includes an acid anhydride such as acetic anhydride, and the catalyst includes pyridine, isoquinoline. , Tertiary amines such as β-picoline and the like can be included.

In one embodiment of the present invention, the bridging agent may include 4,4′-methylenebis (N, N-diglycidylaniline). The 4,4′-methylenebis (N, N-diglycidylaniline) can have the following structure:

  In one embodiment of the present invention, the method may further include adding a crosslinking agent to the polyimide polymer composition.

  Another aspect of the present invention provides a transparent or colored polyimide film formed from the polyimide polymer composition according to the present invention.

  In one embodiment of the present invention, the polyimide film may be manufactured by coating the polyimide polymer composition on a substrate and heating and drying the substrate coated with the polyimide polymer.

  In one embodiment of the present invention, a transparent or colored polyimide film can be produced according to the type of diamine monomer and anhydride monomer used in the production of the polyimide polymer composition.

  The present invention will be more specifically described by the following examples, which are merely illustrative and are not intended to limit the scope of the present invention.

Example 1: Production of a polyimide polymer solution for producing a transparent polyimide film Nitrogen was added to 704.2 g of DMAC at room temperature while passing nitrogen through a temperature-adjustable stirring reactor connected with a nitrogen injection device and a dropping funnel. Thereafter, 32.02 g (0.1 mol) of TFMB, which is a fluorine-based diamine monomer, was dissolved. The aromatic monomer BPDA 8.83 g (0.03 mol) and the fluorine-based monomer 6FDA (31.1 g (0.07 mol)) were added and reacted as an hydride monomer. After 1 hour from the start, pyridine and acetic anhydride were added as a catalyst and a dehydrating agent.
Then, it was precipitated and solidified in a mixed solution of MeOH and distilled water (3: 1). After thoroughly washing with MeOH, it was sufficiently dried in a vacuum oven at 80 ° C. for 6 hours to obtain a polyimide polymer solid.
Disperse the obtained polyimide solid in DMPA (dimethylpropionamide) solution, stir well so that there is no remaining solid, then filter to remove foreign matter and unreacted phase to obtain polyimide polymer solution did.

Comparative Example 1
While passing nitrogen through a temperature-adjustable stirring reactor connected with a nitrogen injection device and a dropping funnel, 704.2 g of DMAC was added at room temperature, and then 32.02 g of TFMB, which is a fluorine-based diamine monomer (0. 1 mol) was completely dissolved. The aromatic monomer BPDA 8.83 g (0.03 mol) and the fluorine-based monomer 6FDA (31.1 g (0.07 mol)) were added and reacted as an anhydride monomer. After 1 hour from the start, pyridine and acetic anhydride were added as a catalyst and a dehydrating agent.
Then, it was precipitated and solidified in a mixed solution of MeOH and distilled water. After thoroughly washing with MeOH, it was sufficiently dried in a vacuum oven at 80 ° C. for 6 hours to obtain a polyimide polymer solid.
The obtained polyimide solid was dispersed in the DMAC solution and sufficiently stirred so that there was no remaining solid, and then filtered to remove foreign substances and unreacted phase to obtain a polyimide polymer solution.

Comparative Example 2
This is a fluorine-based diamine monomer after adding 704.2 g of DMPA (dimethylpropionamide) at room temperature while passing nitrogen through a stirring reactor to which a nitrogen injection device and a dropping funnel are connected and temperature control is possible. 32.02 g (0.1 mol) of TFMB was completely dissolved. The aromatic monomer BPDA 8.83 g (0.03 mol) and the fluorine-based monomer 6FDA (31.1 g (0.07 mol)) were added and reacted as an anhydride monomer. After 1 hour from the start, pyridine and acetic anhydride were added as a catalyst and a dehydrating agent.
Then, it was precipitated into a mixed solution of MeOH and distilled water and solidified. After thoroughly washing with MeOH, it was sufficiently dried in a vacuum oven at 80 ° C. for 6 hours to obtain a polyimide solid.
Disperse the obtained polyimide solid in DMPA (dimethylpropionamide) solution, stir well so that there is no remaining solid, then filter to remove foreign matter and unreacted phase to obtain polyimide polymer solution did.

Example 2 Production of Transparent Polyimide Film After the polyimide polymer solution obtained in Example 1 and Comparative Examples 1 and 2 was coated on a glass substrate with a wet thickness of 400 μm using an applicator. Then, it was heated and dried to 280 ° C. in a convection oven to produce a polyimide film having a thickness of 30 μm.

Example 3: Production of polyimide polymer solution for production of colored polyimide film DMPA (dimethylpropionamide) at room temperature while passing nitrogen through a temperature-controllable stirring reactor connected with a nitrogen injection device and a dropping funnel ) After adding 242.45 g, 10.91 g of PPDA was completely dissolved, and 26.48 g of BPDA and 2.18 g of PMDA were added in order. One hour after completely dissolved, 0.2 g of PA was added and reacted for 16 hours to synthesize PAA. Next, 4000 ppm of 4,4′-methylenebis (N, N-diglycidylaniline) having a monomer (DMPA, BPDA and PMDA) content was dissolved in the same solvent as the reaction solvent, and added to the PAA after the reaction and mixed. did.

Comparative Example 3
While passing nitrogen through a temperature-adjustable stirred reactor connected with a nitrogen injection device and a dropping funnel, 242.45 g of NMP was added at room temperature, and 10.91 g of PPDA was completely dissolved, and 26.48 g of BPDA, PMDA 2.18g was added in order. One hour after completely dissolved, 0.2 g of PA was added and reacted for 16 hours to synthesize PAA. Then, 4000 ppm of 4,4′-methylenebis (N, N-diglycidylaniline) with a monomer (PPDA, BPDA and PMDA) content was dissolved in the solvent and added to the reacted PAA and mixed.

Example 4: Production of colored polyimide film The polyimide polymer solution obtained in Example 3 and Comparative Example 3 above was coated on a glass substrate with a wet thickness of 350 μm using an applicator, and then up to 450 ° C. in a convection oven. A polyimide film having a thickness of 20 μm was produced by heating and drying.

Experimental example 1
The physical properties of the polyimide films synthesized in Example 2 and Example 4 were evaluated by the following methods, and the results are shown in Tables 1 to 3 below.

The linear thermal expansion coefficient was measured by TMA-method using thermal expansion coefficient measurement TMA (TA instrument, Q400). The temperature rise rate is 5 ° C per minute, the cooling rate is 20 ° C per minute, and there is a possibility that stress in the film remains, so in the temperature range from 30 ° C to 300 ° C at temperatures below Tg It was measured. The CTE value was measured from the gradient during cooling.

The average value was measured after measuring five times in the visible light region using a transmission measuring optical measurement equipment (Nippon Denshoku, COH-400).

Yellowness was measured using a yellowness measurement optical measurement equipment (Nippon Denshoku, COH-400).

  The measurement results are shown in Tables 1-3.

  As seen in Tables 1 to 3, DMPA (N, N, N-dimethylacetamide) or NMP (1-methyl-2-pyrrolidone), which is a polar solvent conventionally used in the production of polyimide films, is used. When N-dimethylpropionamide) is used, it can be confirmed that physical properties such as CTE and permeability are more excellent. Furthermore, the monomer was better dissolved with DMPA and showed high solubility.

  The above description of the present invention is for illustrative purposes only, and those having ordinary knowledge in the technical field to which the present invention pertains can be applied to other specific forms without changing the technical idea and essential features of the present invention. I think you can understand that you can easily change. Accordingly, it should be understood that the embodiments described above are illustrative in all aspects and not limiting. For example, each component described as a single type can be implemented in a distributed manner, and similarly, a component described as being distributed can be implemented in a combined form.

  The scope of the present invention is defined by the following claims rather than the above detailed description, and all modifications or modified forms derived from the meaning and scope of the claims and the equivalent concept thereof. Should be construed as included in the present invention.

Claims (14)

DMPA (dimethylpropionamide) and the following formula 1
Wherein R ₁ is a fluorine group or aromatic anhydride monomer, R is a diamine monomer, n is a constant of 1 to 1,000, and m is a constant of 1 to 1,000. The polyimide polymer composition characterized by including the polyamic acid-polyimide copolymer represented by this.   The diamine monomer may be PPDA (p-phenylenediamine), ODA (4,4′-oxydianiline), MDA (4,4′-methylenedianiline), m-tolidene (2,2′-dimethyl-). 4,4′-diaminobiphenyl), TPE-R (1,3-bis (4′-aminophenoxy) benzene), TFMB (2,2′-bis (trifluoromethyl) benzidine), HFBAPP (2,2 ′ -Bis [4- (4-aminophenoxy) phenyl] hexafluoropropane), BIS-AP-AF (2,2′-bis (3-amino-4-hydroxyphenyl) hexafluoropropane), DRFB (1,3 -Diamino-2,4,5,6-tetrafluorobenzene), DDS (3,3'-diaminodiphenylsulfone), ASD (4,4'-diamidine) Diphenyl sulfide), BAPS (bis [4- (4-aminophenoxy) phenyl] sulfone), m-BAPS (2,2′-bis [4- (3-aminophenoxy) benzene] sulfone) and combinations thereof The polyimide polymer composition according to claim 1, which is selected from the group.   The anhydride monomer includes BTDA (3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride), PMDA (pyromellitic anhydride), BPDA (3,3 ′, 4,4′-biphenyl). Tetracarboxylic dianhydride), 6FDA (2,2-bis (3,4-anhydrodicarboxyphenyl) -hexafluoropropane dianhydride), a-BPDA (2,3,3 ′, 4′-biphenyl) Tetracarboxylic dianhydride), ODPA (4,4′-oxydiphthalic anhydride), DSDA (3,3 ′, 4,4′-diphenylsulfonetetracarboxylic dianhydride), BPADA (5,5′- [1-Methyl-1,1-ethanediylbis (1,4-phenylene) bisoxy] bis (isobenzofuran-1,3-dione), HQDA (hydroquinone diphthalic acid) Anhydride) and polyimide polymer composition according to claim 1, characterized in that the invention will include those selected from the group consisting of. Adding an hydride monomer to a synthesis solution containing a diamine monomer and reacting the synthesis solution;
Adding a catalyst and a dehydrating agent to the reaction solution to cause a reaction and then solidifying;
Dispersing the solidified product in DMPA (dimethylpropionamide), and a method for producing a polyimide polymer composition. Adding an anhydride monomer to a DMPA (dimethylpropionamide) solution containing a diamine monomer and reacting;
Adding a terminal-capping formulation to the reaction solution and reacting to synthesize a polyamic acid;
And a step of adding a crosslinking agent to the polyamic acid and mixing the mixture.   The diamine monomer may be PPDA (p-phenylenediamine), ODA (4,4′-oxydianiline), MDA (4,4′-methylenedianiline), m-tolidene (2,2′-dimethyl-). 4,4′-diaminobiphenyl), TPE-R (1,3-bis (4′-aminophenoxy) benzene), TFMB (2,2′-bis (trifluoromethyl) benzidine), HFBAPP (2,2 ′ -Bis [4- (4-aminophenoxy) phenyl] hexafluoropropane), BIS-AP-AF (2,2′-bis (3-amino-4-hydroxyphenyl) hexafluoropropane), DRFB (1,3 -Diamino-2,4,5,6-tetrafluorobenzene), DDS (3,3'-diaminodiphenylsulfone), ASD (4,4'-diamidine) Diphenyl sulfide), BAPS (bis [4- (4-aminophenoxy) phenyl] sulfone), m-BAPS (2,2′-bis [4- (3-aminophenoxy) benzene] sulfone) and combinations thereof The method for producing a polyimide polymer composition according to claim 4 or 5, wherein the polyimide polymer composition is selected from the group.   6. The method for producing a polyimide polymer composition according to claim 4, wherein the anhydride monomer is an aromatic dianhydride monomer.   The aromatic dianhydride monomer includes BTDA (3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride), PMDA (pyromellitic anhydride), BPDA (3,3 ′, 4,4 ′). -Biphenyltetracarboxylic dianhydride), 6FDA (2,2-bis (3,4-anhydrodicarboxyphenyl) -hexafluoropropane dianhydride), a-BPDA (2,3,3 ', 4' -Biphenyltetracarboxylic dianhydride), ODPA (4,4'-oxydiphthalic anhydride), DSDA (3,3 ', 4,4'-diphenylsulfonetetracarboxylic dianhydride), BPADA (5,5 '-[1-Methyl-1,1-ethanediylbis (1,4-phenylene) bisoxy] bis (isobenzofuran-1,3-dione), HQDA (hydroquinonedi) Method for producing a polyimide polymer composition according to claim 7, wherein the barrel anhydride) and is intended to include those selected from the group consisting of.   6. The method for producing a polyimide polymer composition according to claim 4 or 5, wherein one or more anhydride monomers are added.   The synthetic solvent includes an amide solvent, a ketone solvent, an ether solvent, an ester solvent, a symmetric glycol diether solvent, an ether solvent, and a combination thereof. The manufacturing method of the polyimide polymer composition of Claim 4.   The method for producing a polyimide polymer composition according to claim 4, wherein the dehydrating agent includes an acid anhydride and the catalyst includes a tertiary amine.   The end-capping formulation comprises PA (phthalic anhydride), TSA (n-tetradecyl succinic anhydride), HAS (hexadecyl succinic anhydride), OSA (octadecyl succinic anhydride), and combinations thereof The method for producing a polyimide polymer composition according to claim 5, wherein the polyimide polymer composition is selected from the group consisting of:   6. The method for producing a polyimide polymer composition according to claim 5, wherein the bridging agent contains 4,4'-methylenebis (N, N-diglycidylaniline).   A transparent or colored polyimide film formed from the polyimide polymer composition according to claim 1.