KR20130028709A - Method for eliminating resin film and method for producing laminate - Google Patents

Abstract

This invention is the removal method of the resin film which removes the resin film adhering on a glass plate, Comprising: The heat processing process of heat-processing the said resin film adhering on the said glass plate, The washing process of washing the said resin film after heat processing, In the said heat processing process, And a method for removing the resin film by exposing the surface on the side opposite to the glass plate of the resin film to an atmosphere of 300 to 450 ° C, an inert atmosphere of 350 to 600 ° C, or water vapor of 150 to 350 ° C.

Description

Removal method of resin film and manufacturing method of laminated body {METHOD FOR ELIMINATING RESIN FILM AND METHOD FOR PRODUCING LAMINATE}

The present invention relates to a method for removing a resin film and a method for producing a laminate.

In recent years, thinning and weight reduction of devices (electronic devices) such as solar cells (PV), liquid crystal panels (LCDs), organic EL panels (OLEDs), and the like, and the thinning of substrates used in these devices are in progress. If the strength of the substrate is insufficient due to the thinning, the handleability of the substrate is lowered in the manufacturing process of the device.

Therefore, conventionally, after forming a device member (for example, a thin film transistor) on the board | substrate thicker than a final thickness, the method of thinning a board | substrate by a chemical etching process is employ | adopted widely. However, in this method, for example, when the thickness of one substrate is thinned from 0.7 mm to 0.2 mm or 0.1 mm, most of the original substrate material is removed with an etching solution, and therefore, from the viewpoint of productivity and use efficiency of raw materials. Is not preferred.

In addition, in the method of thinning the substrate by the above-described chemical etching, when minute scratches exist on the surface of the substrate, minute recesses (etch pits) are formed starting from the scratches by the etching process, thereby forming an optical defect. There was a case.

Recently, in order to cope with the above problems, a method of preparing a laminate in which a substrate and a reinforcing plate are laminated, forming a device member on a substrate of the laminate, and then peeling the reinforcing plate from the substrate has been proposed ( For example, refer patent document 1). The reinforcing plate has a glass plate and a resin layer fixed on the glass plate, and the resin layer and the substrate are in close contact with each other so as to be peelable. After the reinforcing plate is peeled off from the substrate, the reinforcing plate can be laminated with a new substrate and reused as a laminate.

International Publication No. 07-018028

However, the resin layer of a reinforcement board gradually deteriorates with the use frequency of a reinforcement board. The deterioration of the resin layer is caused by heat treatment, liquid treatment, peeling operation of the reinforcing plate and the substrate in the device manufacturing process, and the like. When the resin layer is deteriorated to some extent, when peeling a reinforcement board and a board | substrate, a part of resin layer may adhere to the board | substrate which is a product side. Therefore, when the resin layer of a reinforcement board is deteriorated to some extent, it is preferable to laminate | stack a reinforcement board and a board | substrate after regenerating a resin layer.

By the way, in order to reproduce the resin layer (resin film) adhering on a glass plate, it is necessary to remove a resin film first. As a method of removing the resin film, it is also possible to use a method of thinly cutting out with a blade or a method of removing with blast particles (for example, calcium carbonate powder), but the surface of the glass plate may be caused by contact with the blade or impact of the blast particles. There exists a possibility that a fine crack may generate | occur | produce in the case, and when a glass plate is reused, a glass plate may be damaged by the influence of a fine crack.

Therefore, as a method of removing a resin film without damaging a glass plate, the method of heat-processing a resin film in air | atmosphere is considered, In this case, oxides, such as a silicon oxide, may be produced | generated by oxidation of a resin film. The resulting oxide is stuck to the glass plate, so it is difficult to remove it.

In addition, as a method of removing the resin film without damaging the glass plate, a method of using a liquid such as an alcohol solution or an alkali solution is considered. In this case, even if ultrasonic cleaning is used in combination, removal of the resin film requires several tens of hours or more.

This invention is made | formed in view of the said subject, and an object of this invention is to provide the removal method of the resin film and the manufacturing method of a laminated body which can remove a resin film efficiently, without damaging a glass plate.

In order to solve the above object, the removal method of the resin film of the present invention

It is a removal method of the resin film which removes the resin film adhering on a glass plate,

A heat treatment step of heat-treating the resin film attached on the glass plate;

It has a washing | cleaning process which wash | cleans the said resin film after heat processing,

In the heat treatment step, the surface opposite to the glass plate of the resin film is exposed to an atmosphere of 300 to 450 ° C, an inert atmosphere of 350 to 600 ° C, or water vapor of 150 to 350 ° C.

In the removal method of the resin film of this invention, it is preferable to cool after heating the said resin film adhering on the said glass plate in the said heat processing process.

In the removal method of the resin film of this invention, in the said washing process, it is preferable to melt or swell the said resin film using a liquid.

In the removal method of the resin film of this invention, it is preferable that the solubility parameter of the said liquid is 7-15.

In the removal method of the resin film of this invention, in the said washing process, it is preferable to remove the said resin film using an abrasive | polishing agent.

In the removal method of the resin film of this invention, it is preferable to wash | clean by ultrasonic washing | cleaning or brush washing in the said washing process.

Moreover, the manufacturing method of the laminated body of this invention is

In the manufacturing method of the laminated body which has a removal process which removes the resin film adhering on a glass plate, and the lamination process which mounts a resin layer between the said glass plate from which the said resin film was removed, and a board | substrate,

The removal process

A heat treatment step of heat-treating the resin film attached on the glass plate;

It has a washing | cleaning process which wash | cleans the said resin film after heat processing,

In the heat treatment step, the surface opposite to the glass plate of the resin film is exposed to an atmosphere of 300 to 450 ° C, an inert atmosphere of 350 to 600 ° C, or water vapor of 150 to 350 ° C.

In the manufacturing method of the laminated body of this invention, it is preferable to cool after heating the said resin film adhering on the said glass plate in the said heat processing process.

In the manufacturing method of the laminated body of this invention, in the said washing process, it is preferable to melt or swell the said resin film using a liquid.

In the manufacturing method of the laminated body of this invention, it is preferable that the solubility parameter of the said liquid is 7-15.

In the manufacturing method of the laminated body of this invention, in the said washing process, it is preferable to remove the said resin film using an abrasive | polishing agent.

In the manufacturing method of the laminated body of this invention, it is preferable to wash | clean by ultrasonic washing | cleaning or brush washing in the said washing process.

In the manufacturing method of the laminated body of this invention, in the said lamination process, while fixing the said resin layer to the said glass plate, it is preferable to make it adhere | attach so that the said resin layer may peel on the said board | substrate.

According to this invention, the removal method of the resin film which can remove a resin film efficiently, without damaging a glass plate, and the manufacturing method of a laminated body can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is process drawing of the manufacturing method of the laminated body in one Embodiment of this invention.
It is a partial side view of the laminated body obtained by the manufacturing method of the laminated body of FIG.
3 is a flowchart of a method of removing a resin film in one embodiment of the present invention.

EMBODIMENT OF THE INVENTION Hereinafter, although the form for implementing this invention is demonstrated with reference to drawings, this invention is not limited to the following embodiment, A various deformation | transformation and substitution can be added to the following embodiment without deviating from the range of this invention. have.

BRIEF DESCRIPTION OF THE DRAWINGS It is process drawing of the manufacturing method of the laminated body in one Embodiment of this invention. As shown in FIG. 1, the manufacturing method of a laminated body includes the removal process (step S11) which removes the resin film adhering on a glass plate, and the lamination process (step S12) which interposes a resin layer between the glass plate from which the resin film was removed, and a board | substrate. Has

It is a partial side view of the laminated body obtained by the manufacturing method of the laminated body of FIG. As shown in FIG. 2, in the laminate 10, the resin layer 22 is interposed between the glass plate 21 and the substrate 30. The resin layer 22 is adhered to the first main surface 301 of the substrate 30 so as to be peeled off, and is fixed on the glass plate 21. The glass plate 21 and the resin layer 22 function as the reinforcement board 20 which reinforces the board | substrate 30 in the process of manufacturing devices (electronic devices), such as a liquid crystal panel.

This laminated body 10 is used until the middle of the manufacturing process of a device. In other words, the laminate 10 is used until a device member such as a thin film transistor is formed on the substrate 30. Thereafter, the reinforcing plate 20 is peeled off from the substrate 30 and does not become a member constituting the device. The reinforcement board 20 peeled from the board | substrate 30 can be laminated | stacked with the new board | substrate 30, and can be reused as a new laminated body 10. FIG. Hereinafter, each structure is demonstrated in detail.

In addition, although the laminated body 10 of this embodiment is used until the device member, such as a thin film transistor, is formed on the board | substrate 30, you may use after the device member is formed. For example, when manufacturing a liquid crystal panel, first, the TFT substrate in which the thin film transistor TFT was formed, and the CF substrate in which the color filter CF were formed are laminated | stacked through a liquid crystal material. Subsequently, after thinning the TFT substrate (or CF substrate) by chemical etching, the reinforcing plate 20 is laminated on the TFT substrate (or CF substrate). As a result, the strength of the thinned TFT substrate (or CF substrate) can be increased. In addition, the laminated body is used until the middle of the manufacturing process of a liquid crystal panel, and the reinforcement board 20 is peeled from a TFT substrate (or CF board | substrate) after that.

First, the board | substrate 30 is demonstrated.

In the board | substrate 30, the member for devices is formed in the 2nd main surface 302, and comprises a device. The device member means a member constituting at least a part of the device. Specific examples thereof include a thin film transistor TFT and a color filter CF. Examples of the device include a solar cell (PV), a liquid crystal panel (LCD), an organic EL panel (OLED), and the like.

The kind of the board | substrate 30 should just be common, for example, a metal substrate, such as a silicon wafer, a glass substrate, a resin substrate, or a SUS substrate or a copper substrate, may be sufficient. Among these, a glass substrate is preferable. It is because a glass substrate is excellent in chemical resistance and moisture permeability, and its thermal contraction rate is low. As an index of thermal contraction rate, the linear expansion coefficient specified in JIS R 3102-1995 is used.

When the coefficient of linear expansion of the board | substrate 30 is large, since the manufacturing process of a device often involves heat processing, various problems tend to arise. For example, in the case of forming the TFT on the substrate 30, if the substrate 30 on which the TFT is formed is cooled under heating, there is a fear that the positional shift of the TFT is excessive due to thermal contraction of the substrate 30.

The glass substrate is obtained by melting a glass raw material and molding the molten glass into a plate shape. Such a molding method may be a general one, and for example, a float method, a fusion method, a slot down draw method, a full call method, a laverse method and the like are used. Moreover, especially a thin glass substrate is obtained by shape | molding the glass once shape | molded by plate shape by the method (thin draw method) which heats at the moldable temperature, pulls and thins by means, such as extending | stretching.

Although the glass of a glass substrate is not specifically limited, Oxide type glass which has alkali-free glass, borosilicate glass, soda-lime glass, high silica glass, and other silicon oxide as a main component is preferable. As oxide type glass, glass with a content of 40-90 mass% of the silicon oxide by oxide conversion is preferable.

As glass of a glass substrate, the glass suitable for the kind of device and its manufacturing process is employ | adopted. For example, since the elution of an alkali metal component easily affects a liquid crystal, the glass substrate for liquid crystal panels consists of glass (alkali free glass) which does not contain an alkali metal component substantially. Thus, the glass of a glass substrate is suitably selected based on the kind of device applied, and its manufacturing process.

Although the thickness of a glass substrate is not specifically limited, In terms of thickness reduction and / or light weight of a glass substrate, it is usually less than 0.8 mm, Preferably it is 0.3 mm or less, More preferably, it is 0.15 mm or less. In the case of 0.8 mm or more, the demand for thinning and / or lightening the glass substrate cannot be satisfied. When it is 0.3 mm or less, it is possible to give favorable flexibility to a glass substrate. When it is 0.15 mm or less, it is possible to wind up a glass substrate in roll shape. Moreover, it is preferable that the thickness of a glass substrate is 0.03 mm or more for the reason that manufacture of a glass substrate is easy, handling of a glass substrate is easy, etc.

The kind of resin of a resin substrate is not specifically limited. Specifically, polyethylene terephthalate resin, polycarbonate resin, polyimide resin, fluorine resin, polyamide resin, polyaramid resin, polyether sulfone resin, polyether ketone resin, polyether ether ketone resin, polyethylene naphthalate resin , Polyacrylic resins, various liquid crystal polymer resins, cycloolefin resins, polysilicon resins and the like. In addition, the resin substrate may be transparent or may be opaque. The resin substrate may be formed by forming functional layers such as protective layers on the surface thereof.

In addition, the board | substrate 30 may consist of two or more layers, In this case, the material which forms each layer may be a homogeneous material, or a heterogeneous material may be sufficient as it. In this case, "thickness of the board | substrate 30" shall mean the thickness which combined all the layers.

Next, the glass plate 21 is demonstrated.

The glass plate 21 cooperates with the resin layer 22 to support and reinforce the board | substrate 30, and prevents deformation, a damage, damage, etc. of the board | substrate 30 in the manufacturing process of a device. In addition, when using the board | substrate 30 with a thickness thinner than the conventional, by making into the laminated body 10 of the same thickness as when using the board | substrate of a conventional thickness, the manufacturing technique suitable for the board | substrate of a conventional thickness in the manufacturing process of a device It is also one of the objectives of using the glass plate 21 to make it possible to use manufacturing facilities.

The thickness of the glass plate 21 may be thicker than the board | substrate 30, and may be thin. Preferably, the thickness of the glass plate 21 is selected based on the thickness of the board | substrate 30, the thickness of the resin layer 22, and the thickness of the laminated body 10. FIG. For example, when the current device manufacturing process is designed to process a substrate having a thickness of 0.5 mm, and the sum of the thickness of the substrate 30 and the thickness of the resin layer 22 is 0.1 mm, the thickness of the glass plate 21 is determined. It is 0.4mm. It is preferable that the thickness of the glass plate 21 is 0.08 mm or more because it is easy to handle and hard to break.

The glass of the glass plate 21 may be a general thing, for example, the alkali free glass etc. which were mentioned above may be sufficient. When the device manufacturing process involves heat treatment, the glass plate 21 is preferably formed of a material having a small difference in coefficient of linear expansion with the substrate 30, and more preferably formed of the same material as the substrate 30.

The difference between the average linear expansion coefficient (hereinafter, simply referred to as "average linear expansion coefficient") at 25 to 300 ° C of the substrate 30 and the glass plate 21 is preferably 500 × 10 ^-7 / ° C or less, more preferably Is 300x10 <^-7> / degrees C or less, More preferably, it is 200x10 <^-7> / degrees C or less. If the difference is too large, there is a possibility that the laminate 10 is vigorously bent at the time of heating and cooling in the manufacturing process of the device, or the substrate 30 and the glass plate 21 are peeled off. When the material of the board | substrate 30 and the material of the glass plate 21 are the same, it can suppress that this problem arises.

Next, the resin layer 22 is demonstrated.

The resin layer 22 is fixed on the glass plate 21, and is closely_contact | adhered to the 1st main surface 301 of the board | substrate 30 so that peeling is possible. The resin layer 22 not only prevents the positional shift of the board | substrate 30 until a peeling operation is performed, but also peels easily from the board | substrate 30 by peeling operation, and the board | substrate 30 etc. are peeled off by peeling operation. To prevent breakage.

The size of the resin layer 22 is not specifically limited. The size of the resin layer 22 may be larger than the board | substrate 30 and the glass plate 21, and may be small.

The surface 221 of the resin layer 22 is in close contact with the first main surface 301 of the substrate 30 by a force caused by van der Waals forces in solid molecules rather than the adhesive force of a general adhesive. It is desirable to have. It is because it can peel easily. In this invention, the property which can peel easily the surface of this resin layer is called peelability.

On the other hand, the bonding force with respect to the surface of the glass plate 21 of the resin layer 22 is relatively higher than the bonding force with respect to the 1st main surface 301 of the board | substrate 30 of the resin layer 22. FIG. In the present invention, the bond to the substrate surface on the surface of the resin layer is called adhesion, and the bond to the glass plate surface is called fixation.

Although the thickness of the resin layer 22 is not specifically limited, It is preferable that it is 1-100 micrometers, It is more preferable that it is 5-30 micrometers, It is further more preferable that it is 7-20 micrometers. It is because the adhesiveness of the resin layer 22 and the board | substrate 30 becomes enough that the thickness of the resin layer 22 is such a range. This is because generation of distortion defects in the substrate 30 can be suppressed even when bubbles or foreign substances are interposed between the resin layer 22 and the substrate 30. In addition, if the thickness of the resin layer 22 is too thick, it is not economical because it requires more time and material to form.

In addition, the resin layer 22 may consist of two or more layers. In this case, "thickness of the resin layer 22" shall mean the thickness which combined all the layers.

In addition, when the resin layer 22 consists of two or more layers, the kind of resin which forms each layer may differ.

It is preferable that the resin layer 22 consists of a material whose glass transition point is lower than room temperature (about 25 degreeC), or does not have a glass transition point. It is because it becomes a non-adhesive resin layer, and it can peel easily with the board | substrate 30, and also the adhesiveness with the board | substrate 30 becomes sufficient at the same time.

In addition, since the resin layer 22 is heat-processed in the manufacturing process of a device in many cases, it is preferable to have heat resistance.

For example, when the elasticity modulus of the resin layer 22 is too high exceeding 1000 MPa, there exists a tendency for adhesiveness with the board | substrate 30 to become low. On the other hand, when the elasticity modulus of the resin layer 22 is too low below 1 MPa, peelability will become low.

The kind of resin which forms the resin layer 22 is not specifically limited. For example, an acrylic resin, a polyolefin resin, a polyurethane resin, and a silicone resin is mentioned. Several types of resin can also be mixed and used. Especially, silicone resin is preferable. It is because silicone resin is excellent in heat resistance and peelability. Moreover, it is because it is easy to fix to the glass plate 21 by the condensation reaction with the silanol group which exists in the surface of the glass plate 21. In a state where the silicone resin layer is interposed between the glass plate 21 and the substrate 30, even if the silicone resin layer is treated at about 200 ° C. for about 1 hour in the air, it is also preferable that the peelability hardly deteriorates.

It is preferable that the resin layer 22 consists of silicone resin (hardened | cured material) used for release papers among silicone resin. Since the resin layer 22 which hardened | cured the curable resin composition used as a release resin silicone resin on the surface of the glass plate 21, and formed was excellent, it is preferable. Moreover, since flexibility is high, generation | occurrence | production of the distortion defect of the board | substrate 30 can be suppressed even if foreign substances, such as a bubble and a crack, mix between the resin layer 22 and the board | substrate 30.

Although curable silicone used as such a release paper silicone resin is classified into condensation reaction type | mold silicone, addition reaction type | mold silicone, ultraviolet curable silicone, and electron beam curable silicone by the hardening mechanism, all can be used. Of these, addition reaction type silicon is preferable. This is because the degree of peelability is good when the ease of curing reaction and the resin layer 22 are formed, and the heat resistance is also high.

Addition-reactive silicone is a curable composition which contains a main body and a crosslinking agent, and hardens | cures in presence of catalysts, such as a platinum type catalyst. Hardening of addition reaction type silicone is accelerated by heat processing. The main component of the addition-reaction type silicone consists of a linear organopolysiloxane (that is, organoalkenylpolysiloxane) having an alkenyl group (vinyl group or the like) bonded to a silicon atom. The crosslinking agent of the addition reaction type silicone consists of a linear organopolysiloxane (that is, an organohydrogenpolysiloxane) having a hydrogen atom (hydrosilyl group) bonded to a silicon atom.

In addition, the curable silicone used as a release resin silicone resin has a solvent type, an emulsion type, and a non-solvent type, and any type can be used. Of these, no-solvent formulations are preferred. This is because it is excellent in terms of productivity, safety and environmental characteristics. This is because air bubbles hardly remain in the resin layer 22 because it does not contain a solvent that causes foaming at the time of curing when forming the resin layer 22, that is, heat curing, ultraviolet curing or electron beam curing. .

Moreover, as curable silicone used as a silicone resin for release papers, KNS-320A, KS-847 (all are Shin-Etsu Silicone Co., Ltd.), TPR6700 (GE Toshiba Silicone Co., Ltd.), vinyl silicone " 8500 "(product made by Arakawa Chemical Co., Ltd.) and methylhydrogen polysiloxane" 12031 "(product made by Arakawa Chemical Co., Ltd.), vinyl silicone" 11364 "(product made by Arakawa Chemical Industries, Ltd.) and methylhydrogen Combination with polysiloxane "12031" (product made by Arakawa Chemical Co., Ltd.), vinyl silicone "11365" (product made by Arakawa Chemical Co., Ltd.) and methylhydrogen polysiloxane "12031" (product made by Arakawa Chemical Industries, Ltd.) Combination, and the like.

In addition, KNS-320A, KS-847, and TPR6700 are curable silicones containing a main material and a crosslinking agent previously.

Moreover, it is preferable that the silicone resin which forms the resin layer 22 has the property in which a component in a silicone resin layer does not easily transfer to the board | substrate 30, ie, low silicon transition property.

Next, the removal process (step S11) of FIG. 1 is demonstrated.

In the removal process (step S11) of FIG. 1, the resin film adhering on the glass plate 21 is removed. The removal process of this embodiment is performed in the process of manufacturing the reinforcement board 20 peeled from the board | substrate 30 with the new board | substrate 30, and reusing it as a new laminated body 10 in the manufacturing process of a device. In more detail, the removal process of this embodiment is performed as a process of removing the resin layer 22 fixed on the glass plate 21 in order to reproduce the resin layer 22 of the reinforcement board 20.

FIG. 3 is a process chart of the method for removing the resin film in one embodiment of the present invention, and a detailed view of the removal process of FIG. 1. As shown in FIG. 3, the removal step includes a heat treatment step (step S31) of heat-treating the resin layer (resin film) 22 attached on the glass plate 21, and a resin layer (resin film) 22 after the heat treatment. It has a washing process (step S32) which washes off.

In the heat treatment step (step S31) of FIG. 3, the surface 221 on the side opposite to the glass plate 21 of the resin layer 22 is placed in an atmosphere of 300 to 450 ° C., an inert atmosphere of 350 to 600 ° C., or steam of 150 to 350 ° C. Exposed to In the resin layer 22, bonds of atoms and molecules are cleaved in the decomposition reaction by a high temperature ambient atmosphere. When the decomposition reaction proceeds sufficiently, fine cracks, minute holes, and the like are formed in the resin layer 22.

When exposed to the atmosphere of 300 ° C to 450 ° C, the decomposition reaction of the resin layer 22 proceeds sufficiently in 1 to 120 minutes. Preferably, when exposed to 350 degreeC-450 degreeC atmosphere, the decomposition reaction of the resin layer 22 will fully advance to 1 to 30 minutes. When the temperature of the atmosphere is less than 300 ° C, the decomposition reaction of the resin layer 22 is unlikely to proceed. Moreover, when the temperature of air | atmosphere exceeds 450 degreeC, oxides, such as a silicon oxide, are produced | generated by oxidation of the resin layer 22. Moreover, as shown in FIG. Since the produced oxide is fixed to the glass plate 21, it is difficult to remove it.

When exposed to an inert atmosphere of 350 ° C to 600 ° C, the decomposition reaction of the resin layer 22 proceeds sufficiently in 1 to 120 minutes. Preferably, when it exposes to 400 degreeC-600 degreeC inert atmosphere, the decomposition reaction of the resin layer 22 will fully advance to 1 to 30 minutes. If the temperature of an inert atmosphere is less than 350 degreeC, the decomposition reaction of the resin layer 22 will hardly advance. In addition, when the temperature of an inert atmosphere exceeds 600 degreeC, the glass plate 21 thermally deforms or thermally deteriorates.

An inert atmosphere here means the atmosphere whose oxygen volume concentration is 5000 ppm or less, and includes nitrogen atmosphere and argon atmosphere. In an inert atmosphere, generation of oxide can be suppressed. Therefore, it is possible to heat-treat at a temperature exceeding 450 degreeC, and can shorten the heat processing time required for a decomposition reaction. For example, when it heats at 600 degreeC, the decomposition reaction of the resin layer 22 will fully advance to 1-3 minutes.

When exposed to steam at 150 ° C to 350 ° C, the decomposition reaction of the resin layer 22 proceeds sufficiently in 1 to 5 hours. This is due to the hydrolyzability of the resin, and decomposition under high pressure is particularly preferable in the low temperature region. On the other hand, when the temperature of the water vapor is less than 150 ° C, the decomposition reaction of the resin layer 22 hardly proceeds. In addition, when the temperature of the water vapor exceeds 350 ° C., pyrolysis becomes superior to hydrolysis, so it is advantageous to expose it to the atmosphere for cost.

In the heat treatment step, the inside of the heating furnace for heating the resin layer 22 may be a pressurized atmosphere. The pressurized atmosphere here means an atmosphere where atmospheric pressure is higher than atmospheric pressure. Thereby, the decomposition reaction of the resin layer 22 can be accelerated.

In addition, when the inside of a heating furnace is not made into a pressurized atmosphere, a heating furnace may be arrangement | positioning and the continuous furnace in which a heating stand and a cooling stand are connected continuously in a tunnel shape may be sufficient.

In the heat treatment process, after heating the resin layer 22 to predetermined temperature, you may cool from predetermined temperature in order to accelerate formation of a crack. The average cooling rate from predetermined temperature to 50 degreeC is suitably set according to the magnitude | size of the glass plate 21, etc. For example, when the thickness of the glass plate 21 is 0.4 mm and the length of a short side is 600 mm or more, and the length of a long side is 800 mm or less, it is preferable that the average cooling rate from predetermined temperature to 50 degreeC is 5-15 degreeC / sec. . When it exceeds 15 degrees C / sec, the glass plate 21 will be easy to be damaged. On the other hand, when it is less than 5 degree-C / sec, cooling time becomes long and productivity is bad.

In the washing | cleaning process (step S32) of FIG. 3, the resin layer 22 after heat processing is wash | cleaned. Since the bond of an atom and a molecule | numerator is cut | disconnected in the surface 221 on the opposite side to the glass plate 21, the resin layer 22 after heat processing can wash | clean the resin layer 22 efficiently.

As the washing method, for example, a method of dissolving or swelling the resin layer 22 using a liquid, a method of removing the resin layer 22 using an abrasive, a method of washing by ultrasonic cleaning or brush cleaning, There is a method of blowing air to the ground layer 22, a method of chemically cleaning using a liquid such as an acid solution or an alkaline solution. These washing methods are used individually or in combination. Although it does not specifically limit as a combination, For example, the method of washing | cleaning with a brush, melt | dissolving or swelling the resin layer 22 using a liquid, and wash | cleaning with a brush, shaving the resin layer 22 using the dispersion liquid which disperse | distributed the abrasive | polishing agent How to pay.

The liquid has a solubility parameter (SP value) of 7 to 15: it is preferable that (in cal ^1/2 cm ^-3/2). If the SP value is outside the range of 7 to 15, since the affinity between the liquid and the resin layer 22 is low, the liquid is hardly wet with the resin layer 22. Specific examples of the liquid having an SP value of 7 to 15 include isoparaffin, xylene, hexane, acetone, dimethylformamide, propanol, ethanol and methanol. These liquids are used alone or in combination. In view of environmental load, an alcohol solution based on ethanol is preferred. In addition, in addition to the flammable countermeasures caused by the influence on the human body, static electricity and the like, an isoparaffin solution having a flash point of 21 ° C or higher, more preferably 70 ° C or higher is preferable.

The abrasive may be lower than the glass plate 21 while having a higher hardness than the resin layer 22, and preferably close to the glass plate 21 in order to shorten the cleaning time. Mohs' Hardness of the glass plate 21 is 5.5-6 normally. As for Mohs' Hardness of an abrasive | polishing agent, 3-5 are preferable. When Mohs' Hardness is less than 3, there exists a possibility that the resin layer 22 cannot be removed. When Mohs' Hardness exceeds 5, there exists a possibility that a micro crack may generate | occur | produce on the surface of the glass plate 21. Specific examples of the abrasive include cerium oxide (moss hardness 5), calcium carbonate (moss hardness 4), hard plastics (moss hardness 4 to 5), polyplass (moss hardness 4), peach seed powder (moss hardness 4), and the like. Can be mentioned. These abrasives are used individually or in combination. It is preferable that the number average particle diameter of these abrasive | polishing agents is 1-10 micrometers.

The brush of the brush used for brush cleaning is made of a material softer than the glass plate 21 so as not to scratch the glass plate 21.

In addition, although the removal method of the resin film of this embodiment was applied to remove the resin layer 22 fixed on the glass plate 21 in order to regenerate the resin layer 22 of the reinforcement board 20, The present invention is not limited to this. For example, in order to reuse the glass plate 21 of the reinforcement board 20 as the board | substrate 30, you may be applied for removing the resin layer 22 fixed on the glass plate 21. FIG. Thus, as long as it applies to removing the resin film adhering on glass, the removal method of the resin film of this invention does not have limitation in particular in the use.

Next, the lamination process (step S12) of FIG. 1 is demonstrated.

In the lamination process (step S12) of FIG. 1, the resin layer 22 is interposed between the glass plate 21 and the board | substrate 30 from which the resin film was removed. Specifically, for example, the resin layer 22 is fixed to the glass plate 21, and the resin layer 22 is brought into close contact with the substrate 30 so as to be peeled off. In addition, the resin layer 22 may be formed in the surface on which the resin film was removed, or may be formed in the surface on the opposite side.

Although the method of fixing the resin layer 22 on the glass plate 21 is not specifically limited, For example, the method of fixing the film-shaped resin to the surface of the glass plate 21 is mentioned. Specifically, in order to give a high fixing force (high peeling strength) to the surface of the film on the surface of the glass plate 21, a surface modification treatment (priming treatment) is performed on the surface of the glass plate 21, and the glass plate 21 is provided. The method to fix on the above is mentioned. For example, chemical methods such as silane coupling agents, such as silane coupling agents (primer treatment), physical methods of increasing surface active groups such as flame (flame) treatment, and surface roughness such as sand blast treatment can be applied. Increasing mechanical treatment methods and the like.

Moreover, the method of coat | covering the curable resin composition used as the resin layer 22 on the glass plate 21 is mentioned, for example. As a coating method, the spray coating method, the die coating method, the spin coating method, the dip coating method, the roll coating method, the bar coating method, the screen printing method, the gravure coating method, etc. are mentioned. Among these methods, it can select suitably according to the kind of resin composition.

In addition, the resin layer 22, if the coating on the glass (21) a curable resin composition that is, it is the amount of his coated construction is more preferably that of 1 to 100g / m ² is preferable, and 5 to 20g / m ^2.

For example, when forming the resin layer 22 from the curable resin composition of addition reaction type silicone, the spray coating method etc. which made curable resin composition which consists of a mixture of organo alkenyl polysiloxane, organohydrogen polysiloxane, and a catalyst etc. It coats on the glass plate 21 by the well-known method of, and it heat-hardens after that. Although the heat-hardening conditions differ also with the compounding quantity of a catalyst, when 2 mass parts of platinum-type catalysts are mix | blended with respect to 100 mass parts of total amounts of organo alkenyl polysiloxane and organohydrogen polysiloxane, it is 50 in air | atmosphere, for example. The reaction is carried out at 0.degree. C. to 250.degree. C., preferably at 100.degree. In addition, the reaction time in this case is 5 to 60 minutes, Preferably it is 10 to 30 minutes. In order to set it as the silicone resin layer which has low silicon transition property, it is preferable to advance hardening reaction as much as possible so that an unreacted silicone component may not remain in a silicone resin layer. The reaction temperature and reaction time as described above are preferable because unreacted silicone components can be left in the silicone resin layer. When the reaction time is too long or the reaction temperature is too high, oxidative decomposition of the silicone resin occurs at the same time, and a low molecular weight silicone component is generated, which may increase the silicone transferability. It is preferable to advance hardening reaction as much as possible so that unreacted silicone component may not remain in a silicone resin layer, in order to make the peelability after heat processing favorable.

In addition, when the resin layer 22 is manufactured using the curable resin composition used as a silicone resin for release papers, for example, the curable resin composition apply | coated on the glass plate 21 is heat-hardened, and a silicone resin layer is formed. By heat-hardening curable resin composition, a silicone resin couple | bonds with the glass plate 21 chemically at the time of hardening reaction. In addition, the silicone resin layer bonds with the glass plate 21 by the anchor effect. By these actions, the silicone resin layer is firmly fixed to the glass plate 21.

The method of bringing the resin layer 22 into close contact with the substrate 30 so as to be peeled off may be a known method. For example, after laminating | stacking the board | substrate 30 on the peelable surface 221 of the resin layer 22 in an atmospheric pressure environment, the method of crimping | bonding the resin layer 22 and the board | substrate 30 using a roll or a press is mentioned. Can be. Since the resin layer 22 and the board | substrate 30 adhere more closely by crimping | bonding with a roll or a press, it is preferable. Moreover, since the bubble mixed in between the resin layer 22 and the board | substrate 30 is removed comparatively easily by the crimping | bonding by a roll or a press, it is preferable.

When it crimps | bonds by the vacuum lamination method or the vacuum press method, it is more preferable because suppression of bubble mixing and ensuring good adhesion are performed more preferably. By pressing under vacuum, even when minute bubbles remain, bubbles do not grow due to heating, and there is an advantage that it is difficult to lead to distortion defects of the substrate 30.

When the resin layer 22 is brought into close contact with the substrate 30 so as to be peeled off, it is preferable that the surfaces of the resin layer 22 and the substrate 30 in contact with each other are sufficiently washed and laminated in a high clean environment. Do. Even if foreign matter is mixed between the resin layer 22 and the substrate 30, the resin layer 22 is deformed, so that the flatness of the surface of the substrate 30 is not affected. However, the higher the cleanness, the better the flatness. desirable.

In addition, there is no restriction | limiting in the order of the process of fixing the resin layer 22 on the glass plate 21, and the process of closely bonding the resin layer 22 so that peeling on the board | substrate 30 is possible, for example, may be substantially simultaneous. .

Example

Although an Example etc. demonstrate this invention concretely below, this invention is not limited by these examples.

Example 1

(Production of reinforcement board)

As a glass plate of a reinforcement board, the glass plate (Asahi Glass Co., Ltd. make, AN100, alkali free glass) of length 720mm x width 600mm x thickness 0.4mm obtained by the float method was used. The average linear expansion coefficient of this glass plate was 38x10 <^-7> / degreeC.

Pure water washing | cleaning and UV washing | cleaning of this glass plate were carried out, and the surface of the glass plate was cleaned. Then, spin coater a mixture of 100 parts by mass of solvent-free addition-response silicone (KNS-320A, manufactured by Shin-Etsu Silicone Co., Ltd.) and 5 parts by mass of platinum-based catalyst (CAT-PL-56, manufactured by Shin-Etsu Silicone Co., Ltd.) on the surface of the glass plate. The coating was carried out by (coating amount 20 g / m ² ).

The solvent-free addition silicone is a linear organoalkenylpolysiloxane having a vinyl group and a methyl group bonded to a silicon atom (topic) and a linear organohydrogenpolysiloxane having a hydrogen atom and a methyl group bonded to a silicon atom (crosslinking agent). It is to include.

The mixture coated on the glass plate was heat-cured at 180 ° C. for 10 minutes in the air, and a resin layer having a length of 705 mm × 595 mm × 20 μm in thickness was formed and fixed in the center on the glass plate.

In this way, a reinforcing plate was produced.

(Production of laminated body)

As a glass substrate, the glass plate (A100 made by Asahi Glass Co., Ltd., AN100, alkali free glass) of 720 mm x width 600 mm x thickness 0.4 mm obtained by the float method was used. The average linear expansion coefficient of this glass substrate was 38x10 <^-7> / degreeC.

Pure water washing | cleaning and UV washing | cleaning of this glass substrate were carried out, and the surface of the glass substrate was cleaned. Thereafter, the glass substrate and the reinforcing plate were brought into close contact with each other under vacuum at room temperature using a vacuum press device to obtain a laminate shown in FIG. 2.

(Separation of Glass Substrate and Reinforcement Plate)

After heat-processing this laminated body at 250 degreeC in air for 2 hours, it cooled to room temperature and performed the peeling operation of a glass substrate and a reinforcement board. Specifically, after inserting a knife having a thickness of 0.4 mm between the glass substrate and the reinforcing plate, the reinforcing plate was deformed in turn from the insertion position of the knife while supporting the glass substrate flatly.

When the reinforcing plate was observed under a microscope after the peeling operation, scratches due to the indentation of the knife were seen on the peelable surface of the resin layer. In addition, when the peelable surface of the resin layer was analyzed by the infrared absorption method, deterioration due to heat treatment was slightly recognized at the outer edge portion of the peelable surface. In addition, in the center part of a peelable surface, the degradation resulting from heat processing was not recognized.

(Removal of Resin Layer (Resin Film))

After the peeling operation, the reinforcing plate was heated at 370 ° C. for 10 minutes to expose the surface on the side opposite to the glass plate of the resin layer (resin film) to 370 ° C. for 10 minutes. Thereafter, the reinforcing plate was cooled from 370 ° C to 50 ° C at an average cooling rate of 5 ° C / sec, and then ultrasonic cleaning was performed for 5 minutes while immersing in an alkali solution at 50 ° C.

The alkali solution is obtained by diluting a resist stripper (PK-CRD620, manufactured by Parker Corporation) with 20% by weight of ion-exchanged water. This resist stripping liquid contains 20 mass% of potassium hydroxide as a main component.

Subsequently, brush cleaning with the alkali solution was performed for 1 minute, and after washing the resin layer (resin film), pure water was rinsed and water was removed by air injection.

When the surface of the glass plate was observed under a microscope after washing, foreign substances such as oxides and resins and scratches were not seen.

[Example 2]

In Example 2, as a curable resin composition used as a resin layer, the linear polyorganosiloxane (Made by Arakawa Chemical Co., Ltd., 8500) which has a vinyl group at both ends, and methyl hydro which has a hydrosilyl group in a molecule | numerator Reinforcement was carried out in the same manner as in Example 1, except that a mixture of the genpolysiloxane (manufactured by Arakawa Chemical Co., Ltd., 12031) and a platinum catalyst (manufactured by Arakawa Chemical Co., Ltd., CAT12070) was used. The plate was produced.

Here, the mixing ratio of the linear polyorganosiloxane and the methylhydrogenpolysiloxane was adjusted so that the molar ratio of the vinyl group and the hydrosilyl group was 1: 1. In addition, the platinum catalyst was 5 mass parts with respect to a total of 100 mass parts of linear polyorganosiloxane and methylhydrogen polysiloxane.

Subsequently, the laminated body shown in FIG. 2 was produced like Example 1, and after heat-processing a laminated body, the peeling operation of the glass substrate and the reinforcement plate was performed.

After the peeling operation, the reinforcing plate was heated at 370 ° C. for 5 minutes in the air to expose the surface on the side opposite to the glass plate of the resin layer (resin film) to the air at 370 ° C. for 5 minutes. Thereafter, the reinforcing plate was cooled from 370 ° C to 50 ° C at an average cooling rate of 15 ° C / sec, and cooled to room temperature. Subsequently, after brush washing with an alcohol solution (manufactured by Nippon Arukoru Hanbai, Neo-Col R7, solubility parameter of 11.5 to 14.7, flash point of 11 to 24 ° C) for 1 minute, the resin layer (resin film) is washed off. Solvent was removed by air blowing.

The said alcohol solution contains 86.6 mass% of ethanol, 9.5 mass% of normal propyl alcohol (NPA), 2.6 mass% of methanol, and 1.3 mass% of isopropyl alcohol (IPA).

When the surface of the glass plate was observed under a microscope after washing, foreign substances such as oxides and resins and scratches were not seen.

[Example 3]

In Example 3, the laminated body shown in FIG. 2 was produced like Example 2, and after heat-processing a laminated body, the peeling operation of the glass substrate and the reinforcement board was performed.

After the peeling operation, the reinforcing plate was heated at 370 ° C. for 5 minutes in the air to expose the surface on the side opposite to the glass plate of the resin layer (resin film) to the air at 370 ° C. for 5 minutes. Thereafter, the reinforcing plate was cooled from 370 ° C to 50 ° C at an average cooling rate of 15 ° C / sec, and cooled to room temperature. Subsequently, brush washing with an isoparaffin solution (manufactured by Idemitsu Koyama Co., Ltd., IP Solvent 2028, solubility parameter 7, flash point of 86 ° C) was performed for 1 minute, and the resin layer (resin film) was washed, and then heated to 200 ° C. Solvent was removed by air blowing.

The isoparaffin solution contains 80.5% by mass of isohexadecane, 3.0% by mass of isotridecane, and 16.5% by mass of isododecane.

When the surface of the glass plate was observed under a microscope after washing, foreign substances such as oxides and resins and scratches were not seen.

Example 4

In Example 4, the laminated body shown in FIG. 2 was produced like Example 2, and after heat-processing a laminated body, the peeling operation of the glass substrate and the reinforcement board was performed.

After the peeling operation, the reinforcing plate was heated at 350 ° C for 30 minutes in the air, thereby exposing the surface on the side opposite to the glass plate of the resin layer (resin film) to 350 ° C for 30 minutes. Subsequently, the reinforcing plate was cooled from 350 ° C to 50 ° C at an average cooling rate of 5 ° C / sec, and cooled to room temperature. Subsequently, the brush cleaning by the dispersion liquid which disperse | distributed the abrasive | polishing agent was performed for 1 minute, and after wash | cleaning the resin layer (resin film), pure water rinsing was performed and water was removed by air injection.

The said dispersion liquid disperse | distributed the cerium oxide microparticles | fine-particles (number average particle diameter 3 micrometers) in water. Content of the cerium oxide microparticles | fine-particles in a dispersion liquid was 10 mass%.

When the surface of the glass plate was observed under a microscope after washing, foreign substances such as oxides and resins and scratches were not seen.

[Example 5]

In Example 5, the laminated body shown in FIG. 2 was produced like Example 2, and after heat-processing a laminated body, the peeling operation of the glass substrate and the reinforcement plate was performed.

After the peeling operation, the reinforcing plate was heated at 600 ° C for 2 minutes in a nitrogen atmosphere having an oxygen volume concentration of 1000 ppm, thereby exposing the surface on the side opposite to the glass plate of the resin layer (resin film) to a nitrogen atmosphere at 600 ° C for 2 minutes. After washing the resin layer (resin film) in the same manner as in Example 3, the solvent was removed by air blowing.

When the surface of the glass plate was observed under a microscope after washing, foreign substances such as oxides and resins and scratches were not seen.

[Example 6]

In Example 6, the laminated body shown in FIG. 2 was produced like Example 2, and after heat-processing a laminated body, the peeling operation of the glass substrate and the reinforcement board was performed.

After the peeling operation, the reinforcing plate is heated at 400 ° C. for 30 minutes in a nitrogen atmosphere having an oxygen volume concentration of 1000 ppm, thereby exposing the surface on the side opposite to the glass plate of the resin layer (resin film) to a nitrogen atmosphere at 400 ° C. for 30 minutes. After washing the resin layer (resin film) similarly to Example 2, the solvent was removed by air blowing.

When the surface of the glass plate was observed under a microscope after washing, foreign substances such as oxides and resins and scratches were not seen.

[Example 7]

In Example 7, the laminated body shown in FIG. 2 was produced like Example 2, and after heat-processing a laminated body, the peeling operation of the glass substrate and the reinforcement plate was performed.

After peeling operation, it puts in a 20 liter pressurization container with 100 g of water, and it heats at 250 degreeC for 1 hour, exposing the surface on the opposite side to the glass plate of a resin layer (resin film) to high temperature and high pressure steam, and then performing After washing the resin layer (resin film) similarly to Example 2, the solvent was removed by air blowing.

In addition, the maximum pressure in the pressurized container when heat-processing at 250 degreeC for 1 hour was 0.65 Mpa.

When the surface of the glass plate was observed under a microscope after washing, foreign substances such as oxides and resins and scratches were not seen.

[Example 8]

In Example 8, the laminated body shown in FIG. 2 was produced like Example 2, and after heat-processing a laminated body, the peeling operation of the glass substrate and the reinforcement plate was performed.

After the peeling operation, the reinforcing plate was placed together with 100 g of water in a 20 liter pressure vessel and heated at 150 ° C. for 5 hours to expose the surface on the opposite side to the glass plate of the resin layer with high temperature and high pressure steam, and then as in Example 2. After washing the resin layer, the solvent was removed by air blowing.

In addition, the maximum pressure in a pressurized container at the time of heat processing at 150 degreeC for 5 hours was 0.3 Mpa.

When the surface of the glass plate was observed under a microscope after washing, foreign substances such as oxides and resins and scratches were not seen.

Comparative Example 1

In the comparative example 1, the laminated body shown in FIG. 2 was produced like Example 2, and after heat-processing a laminated body, the peeling operation of the glass substrate and the reinforcement plate was performed.

The solvent was removed by air blowing after performing the brush washing with the alcohol solution for 20 hours in the same manner as in Example 2 without performing heat treatment after the peeling operation.

When the surface of the glass plate was observed under the microscope after washing | cleaning, resin adhered.

Comparative Example 2

In the comparative example 2, the laminated body shown in FIG. 2 was produced like Example 2, and after heat-processing a laminated body, the peeling operation of the glass substrate and the reinforcement plate was performed.

After the peeling operation, the reinforcing plate was heated at 500 ° C. for 10 minutes in the air to expose the surface on the side opposite to the glass plate of the resin layer (resin film) to 500 ° C. for 10 minutes. Thereafter, the reinforcing plate was cooled from 500 ° C to 50 ° C at an average cooling rate of 5 ° C / sec, and cooled to room temperature. Subsequently, it was immersed in ion-exchanged water, the ultrasonic cleaning was performed for 5 minutes, and water was removed by air blowing.

When the surface of the glass plate was observed under a microscope after washing, no resin was observed, but oxides such as silicon oxide were fixed.

[Comparative Example 3]

In the comparative example 3, the laminated body shown in FIG. 2 was produced like Example 2, and after heat-processing a laminated body, the peeling operation of the glass substrate and the reinforcement plate was performed.

After the peeling operation, the reinforcing plate was heated at 250 ° C. for 30 minutes in the air to expose the surface opposite to the glass plate of the resin layer (resin film) to 250 ° C. air for 30 minutes, and then to the alcohol solution in the same manner as in Example 2. After 1 minute of brush cleaning, the solvent was removed by air blowing.

When the surface of the glass plate was observed under the microscope after washing | cleaning, resin adhered. Resin was stuck even if the washing | cleaning time was extended to 60 minutes.

[Comparative Example 4]

In the comparative example 4, the laminated body shown in FIG. 2 was produced like Example 2, and after heat-processing a laminated body, the peeling operation of the glass substrate and the reinforcement plate was performed.

After the peeling operation, the reinforcing plate was heated at 300 ° C. for 30 minutes in a nitrogen atmosphere to expose the surface on the side opposite to the glass plate of the resin layer (resin film) for 30 minutes in a nitrogen atmosphere at 300 ° C., followed by an alcohol solution in the same manner as in Example 2. After performing brush cleaning by 1 minute, the solvent was removed by air blowing.

When the surface of the glass plate was observed under the microscope after washing | cleaning, resin adhered. Resin was stuck even if the washing | cleaning time was extended to 60 minutes.

[Comparative Example 5]

In the comparative example 5, the laminated body shown in FIG. 2 was produced like Example 2, and after heat-processing a laminated body, the peeling operation of the glass substrate and the reinforcement board was performed.

After peeling operation, it puts in a 20 liter pressurization container with 100 g of water, and heats it at 100 degreeC for 1 hour, and after exposing the surface on the opposite side to the glass plate of a resin layer (resin film) in high-temperature, high-pressure steam, it carries out In the same manner as in Example 2, the brush was washed with an alcohol solution for 60 minutes, and then the solvent was removed by air blowing. In addition, the maximum pressure in a pressurized container at the time of heat processing at 100 degreeC for 1 hour was 0.2 Mpa.

When the surface of the glass plate was observed under the microscope after washing | cleaning, resin adhered.

Although this invention was detailed also demonstrated with reference to the specific embodiment, it is clear for those skilled in the art that various corrections and changes can be added without deviating from the range and mind of this invention.

This application is based on the JP Patent application 2010-051092 of March 8, 2010, The content is taken in here as a reference.

10 laminate
20 gusset
21 glass plates
22 resin layer
30 boards
301 first principal plane
302 2nd principal plane

Claims (13)

It is a removal method of the resin film which removes the resin film adhering on a glass plate,
A heat treatment step of heat-treating the resin film attached on the glass plate;
It has a washing | cleaning process which wash | cleans the said resin film after heat processing,
The said heat treatment process WHEREIN: The method of removing the resin film which exposes the surface on the opposite side to the said glass plate of the said resin film to 300-450 degreeC atmosphere, 350-600 degreeC inert atmosphere, or 150-350 degreeC water vapor | steam. The removal method of the resin film of Claim 1 which cools after heating the said resin film adhering on the said glass plate in the said heat processing process. The removal method of the resin film of Claim 1 or 2 which melt | dissolves or swells the said resin film in the said washing process using a liquid. The method of claim 3, wherein the liquid has a solubility parameter of 7 to 15. The resin film removal method according to any one of claims 1 to 4, wherein in the cleaning step, the resin film is removed using an abrasive. The removal method of the resin film in any one of Claims 1-5 which wash | cleans by ultrasonic washing | cleaning or brush washing in the said washing | cleaning process. In the manufacturing method of the laminated body which has a removal process which removes the resin film adhering on a glass plate, and the lamination process which mounts a resin layer between the said glass plate from which the said resin film was removed, and a board | substrate,
The removal process
A heat treatment step of heat-treating the resin film attached on the glass plate;
It has a washing | cleaning process which wash | cleans the said resin film after heat processing,
The said heat processing process WHEREIN: The manufacturing method of the laminated body which exposes the surface on the opposite side to the said glass plate of the said resin film to 300-450 degreeC atmosphere, 350-600 degreeC inert atmosphere, or 150-350 degreeC water vapor. The manufacturing method of the laminated body of Claim 7 which cools after heating the said resin film adhering on the said glass plate in the said heat processing process. The manufacturing method of the laminated body of Claim 7 or 8 which melt | dissolves or swells the said resin film in the said washing process using a liquid. The method of claim 9, wherein the liquid has a solubility parameter of 7 to 15. The manufacturing method of the laminated body in any one of Claims 7-10 in which the said resin film is removed using an abrasive | polishing agent in the said washing | cleaning process. The said washing process WHEREIN: The manufacturing method of the laminated body of any one of Claims 7-11 which wash | cleans by ultrasonic cleaning or brush cleaning. The manufacturing method of the laminated body in any one of Claims 7-12 which fix | immobilize the said resin layer to the said board | substrate while fixing the said resin layer to the said glass plate in the said lamination process.

Images