KR100336153B1 - Mold for forming a braun tube glass a method of making the same - Google Patents

Abstract

The CRT molding mold has a mold body portion and a lamination portion between a heat conductive layer made of a metal material having good thermal conductivity and a heat insulation layer, wherein the lamination portion is located on the side of the mold surface and the heat insulation layer is on the side to be cooled. In order to be embedded in at least a portion of the mold body portion in the thickness direction, the mold body portion and the heat conductive layer are connected through a diffusion layer in which each component of the mold body portion and the heat conductive layer diffuses.

Description

CRT Mold for Glass Forming and Manufacturing Method thereof {MOLD FOR FORMING A BRAUN TUBE GLASS A METHOD OF MAKING THE SAME}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to molds for press molding panels, funnels and the like which are parts of cathode ray tubes (CRT) or cathode ray tube glass bulbs.

Apparatuses for forming panels or funnels which are parts of CRT or TV tube glass bulbs have been used. As the panel forming apparatus, a configuration as shown in FIG. 6 has been used. In other words, a predetermined amount of molten glass (lump) 30 is charged into a mold formed by combining the bottom mold 31 and the shell mold 32, the plunger 33 is lowered to perform press molding. To prepare. Practically, the same apparatus and operation as above apply to funnel molding.

As shown in FIG. 7, the panel 34 includes a faceplate 35 having a smoothly convex cross section, a corner portion 36 sharply bent from the faceplate portion 35, and this corner portion. It consists of a flange part 37 (a circumferential side wall part) continuing in succession. The form seen from above of the face plate part 35 is generally a rectangle having an appearance ratio such as 4: 3 or 16: 9. The radius of curvature at the inner or outer surface of the face plate portion 35 is an important factor in obtaining the required quality. The quality at which this quality can be obtained depends on the temperature distribution in the mold used.

The temperature distribution in the conventional plunger 200 will be described with reference to FIG. 8 (side cross-sectional view of the plunger). The plunger 200 has a corner portion 201, which has a large surface area for receiving heat due to the convex curved surface, and the temperature of the corner portion 201 is locally raised. To avoid this, a drill hole 203 is formed in the inner surface of the plunger to come into contact with the cooling medium (for example, water) 202, thereby suppressing an increase in temperature at the corner portion 201. However, since the peripheral part 204 of the corner part 201 is also cooled simultaneously, there exists a disadvantage that a crack etc. generate | occur | produce. Thus, conventional plungers do not provide the desired uniform temperature distribution.

The temperature distribution of the conventional bottom mold (arm mold) 300 will be described with reference to FIG. 9 (side cross-sectional view of the bottom mold). Since the cooling air 301 is supplied near the center of the bottom part, the center part 302 is easy to cool. In addition, since the corner portion 303 has a large surface area for radiating heat due to the convex curved surface, the temperature of the corner portion 303 is relatively low. On the other hand, the temperature of the slightly inner portion 304 of the corner portion 303 is relatively high. Conventional bottom mold 300 has no means of equalizing the temperature distribution of the mold.

Non-uniform temperature distribution in the mold may cause abnormal curvature radii on the inner and outer surfaces of the panel, or cause irregular oxidation of the plating due to uneven temperature, thereby reducing productivity. As mentioned above, control of the temperature distribution is an important factor in order to obtain the quality required for glass articles. For this purpose, a mold for forming a glass container having a heat radiating part made of a material having excellent thermal conductivity has been proposed, in which the outer side or the inner side of a portion used for forming a glass product is in contact with a cooling medium. Location 155633/1993). However, in this proposal, since the heat radiating portion is in direct contact with the cooling medium, there is a temperature difference in the mold as a whole, although the cooling efficiency is improved. In addition, the proposal does not have the function of eliminating the above-mentioned disadvantages in the press molding of glass products. In addition, there has been proposed a glass press molding mold in which a laminated portion of a high thermal conductive layer and a heat insulating layer is embedded in a mold (Japanese Patent Laid-Open No. 220637/1995).

The mold disclosed in Japanese Patent Laid-Open No. 155633/1995 has a heat radiating portion at its local portion. However, since the thermal conductivity in the metal is isotropic, the peripheral portion is also cooled at the same time. Therefore, it has little effect on improving the temperature distribution.

The inventor of the present application has proposed a mold for forming a glass container in which a carbon composite material having anisotropic thermal conductivity is provided on the back of a working surface of a mold (JP-A 306635/1994). However, the carbon composite material has the disadvantage of being oxidized and burned under a high temperature atmosphere. Therefore, there is still a problem of preventing oxidation.

In Japanese Patent Laid-Open No. 220637/1995, an attempt has been made to reduce surface irregularities at the contact surface between the mold body portion and the high thermal conductive layer or between the high thermal conductive layer and the heat insulating layer in a laminated structure. However, the attempted technique is insufficient because there is a thermal resistance at the contact surface between the mold body portion and the high thermal conductive layer or between the high thermal conductive layer and the heat insulating layer. As a result, the technique is insufficient because it does not provide the desired temperature distribution due to the presence of thermal resistance.

As another approach, a method of injecting a molten metal material or a molten alloy into a portion to be laminated, cooling the molten material, and solidifying it is used. However, gaps or cracks generated by the difference in cooling rate during the cooling and solidifying processes cannot be completely avoided, and thermal resistance at the contact surface cannot be stably reduced.

By providing an appropriate temperature distribution on the mold surface, irregular curvature radiuses or non-uniform oxidation of the plating on the mold caused by glass molds formed by press molding caused by temperature differences on the mold surface, i.e., undesirable temperature distribution on the mold surface. It is a technical problem of the present invention to eliminate defects in the molding of glass products due to the present invention.

1 is a partial cross-sectional front view of a plunger according to an embodiment of the present invention;

2 is a partial cross-sectional front view of a plunger according to another embodiment of the present invention.

3 is a partial cross-sectional front view of a plunger according to another embodiment of the present invention.

4 is an enlarged cross-sectional view of a corner portion of the plunger according to the embodiment of the present invention.

5 is a cross-sectional view of a corner portion of the bottom mold according to an embodiment of the present invention.

6 is a longitudinal sectional view of a mold for explaining a conventional apparatus for forming a panel.

7 is a diagram illustrating a form of a panel.

8 is a longitudinal sectional view showing a conventional plunger.

9 is a cross-sectional view showing a conventional bottom mold.

Explanation of symbols on the main parts of the drawings

1: Plunger 2, 22, 111: Corner part

3, 112: circumference 21, 31: bottom mold

102, 114, 115: air layer 116: diffusion layer

4A, 26A: Cover member

According to the present invention, the laminate includes a mold body and a lamination part made of a heat conductive layer and a heat insulating layer made of a metal material having high thermal conductivity, and the lamination part is formed so that the heat conductive layer is disposed on the mold surface side and the heat insulating layer is cooled side. The mold body portion and the heat conductive layer are embedded in at least a portion of the body portion, and the mold body portion and the heat conductive layer provide a mold for forming a CRT glass which is bonded through a diffusion layer in which each component of the mold body portion and the heat conductive layer is diffused.

In one embodiment of the present invention, an intermediate film having a thermal expansion coefficient between the thermal expansion coefficient of the mold body portion and the thermal expansion layer of the thermal conductive layer instead of the diffusion layer in which each component of the mold body portion and the thermal conductive layer is diffused is the mold body portion and the thermal conductive layer. Is inserted in between.

According to the present invention, the mold body portion and the heat conductive layer are bonded in an inert gas atmosphere under a pressure of 100 atm or more at a temperature within a range from 300 ° C. to a low melting point of the melting point of the mold body portion and the melting point of the heat conductive layer. It provides a method for producing a mold.

According to the present invention, the present invention also includes a mold surface and a metal material of high thermal conductivity which is provided on the back side of the hot portion in the local region of the mold surface which is locally hot during the molding operation, whereby the mold surface is in the normal direction. Provided is a mold for forming a CRT glass, in which heat transfer can be increased in localized areas.

When performing temperature control on the mold by the above-described means, it is preferable to arrange the air insulation layer surrounding the metal material of high thermal conductivity in order to prevent heat conduction in the same direction as the mold surface. It is preferable that the thickness of this heat insulation layer is in the range of 0.1 mm to 10 mm.

The high thermal conductivity metal material is disposed in a recess formed on the back side of the high temperature region and soldered to the mold body portion using brazing metal or the like. However, other techniques may be used.

If the mold is a plunger, the hot zone is usually at the corner. If the mold is a bottom mold, the hot zone is in the range from 0.4 to 0.4 L towards Q, where 'P' represents the midpoint of the bottom and 'Q' represents the inflection point between the corner and the bottom. , 'L' represents the distance between 'P' and 'Q'. The above-mentioned corner part means the shaping surface in the corner part which connects the circumferential side wall of a metal mold to a bottom part.

Preferred embodiments of the present invention will be described with reference to the drawings. Here, the same or corresponding parts are denoted by the same reference numerals.

When the mold of the present invention is a plunger for forming a panel, the plunger has a mold surface consisting of a circumferential portion, a corner portion and a bottom portion. In the present invention, the laminated portion of the heat conductive layer and the heat insulating layer is provided in at least one mold surface among the above-described mold surface portions. At that time, the thermal conductive layer is bonded to the mold body portion, and maintains a high thermal conductive state therebetween.

As the mold body portion, it is preferable to use a material having excellent heat resistance, oxidation resistance and corrosion resistance such as stainless steel. As the heat conductive layer, it is preferable to use a metal layer or an alloy layer having excellent thermal conductivity such as copper, copper alloy, silver, gold, aluminum and the like. As a heat insulation layer, it is preferable to use gas, such as ceramic, resin, teflon (brand name), or air, nitrogen which has the outstanding heat insulation property.

The thickness of the diffusion layer formed at the interface between the mold body portion and the heat conductive layer is preferably 0.01 μm to 5 mm, particularly preferably 0.1 μm to 10 μm. If the thickness is less than 0.01 μm, the effect of reducing the thermal resistance and the effect of maintaining the strength at the interface are lost. On the other hand, when the thickness exceeds 5 mm, the thermal conductivity is reduced.

If there is a large difference between the thermal expansion coefficient of the mold body portion and the thermal expansion coefficient of the thermal conductive layer, instead of forming a diffusion layer in which each component of the mold body portion and the thermal conductive layer is diffused, an interlayer film having a thermal expansion coefficient between these thermal expansion coefficients Alternatively, an intermediate layer should be inserted between the mold body and the thermally conductive layer. In this case, at least one thin metal film, a thin alloy film, or a layer formed by plating or vapor deposition is inserted between the mold body portion and the heat conductive layer as an intermediate film, and a diffusion layer is formed thereon, whereby the difference in coefficient of thermal expansion is different. Progressively reduced. In this case, their components diffuse at the interface between the mold body portion and the intermediate film. In addition, these components also diffuse at the interface between the intermediate film and the heat conductive layer. As a result, the mold body portion and the heat conductive layer are bonded very well in terms of heat conductivity.

The thickness of the interlayer film for adjusting the difference in thermal expansion coefficient is preferably 0.1 µm to 1 mm, particularly 0.1 µm to 500 µm. When the thickness is less than 0.1 mu m, the intermediate film may not perform a sufficient function or the intermediate film may not have sufficient strength. On the other hand, when the thickness exceeds 1 mm, the thermal conductivity may be undesirably reduced. As the interlayer film, metal foil such as nickel foil is preferably used.

In the conventional mold, the corner portion tends to be in an overheated state, and the circumferential portion that finally comes into contact with glass during press molding tends to be in an overcooled state. However, in the mold of the present invention, by using a layer made of a material having excellent thermal conductivity, heat can be transferred from the corner portion in the overheated state to the circumference in the supercooled state without energy loss due to thermal resistance. . As a result, the temperature at the corner portion and the circumference portion can be made uniform. In this case, when the cooling medium comes into direct contact with the heat conductive layer, the corner portion and the circumference portion are in the supercooled state. Therefore, the thermal insulation layer must be disposed in the mold body portion so that an optimum temperature can be provided. That is, when the mold body portion is in direct contact with the glass, heat is transferred to the outermost portion of the mold body. This heat is conducted into the mold body due to the heat conduction and reaches the heat conduction layer with little thermal resistance through the diffusion layer. The temperature in contact with the glass tends to cause the temperature of the mold body portion to be higher than the temperature of the circumference, or the temperature of the corner portion is higher than the temperature of the circumference due to the shape of the corner portion. However, since the thermal conductivity of the thermal conductive layer is large, the temperature distribution in the height direction of the thermal conductive layer is much lower than the temperature distribution of the mold body portion.

In addition, heat exchange is performed between the heat conducting layer and the cooling medium through the heat insulating layer, thereby enabling temperature control to an optimum temperature. In this case, excess heat from the corner portion increases the temperature of the circumference through the heat conductive layer, thus making it possible to make the temperature of the entire mold surface uniform.

In addition, the laminated portions of the heat conductive layer and the heat insulating layer may extend from the corner portion to the circumferential portion or the bottom portion, whereby the temperature of the entire mold surface can be made uniform.

When there is a large difference between the coefficient of thermal expansion of the mold body and the coefficient of thermal expansion of the thermally conductive layer, when the mold body and the thermally conductive layer become high temperature at room temperature during press molding of the glass, shearing is performed according to the difference in thermal expansion at the interface. Stress may occur and peeling or breaking may occur. In the present invention, an interlayer film having a thermal expansion coefficient between the thermal expansion coefficient of the mold body portion and the thermal expansion coefficient of the thermal conductive layer is inserted therebetween. In addition, the diffusion layer is generated through the interlayer can reduce the shear stress, it is possible to maintain a good bond.

The mold of the present invention is prepared as follows.

In the case of the plunger shown in FIGS. 1 and 2, the plunger is divided into upper and lower portions at its periphery along a plane approximately parallel to the bottom surface. A recess or a hole for embedding the copper layer 101 is formed in the lower portion of the plunger. The copper piece is inserted into the recess or the pupil to diffusely bond the copper to the main body of the plunger. In this case, it is preferable to form the recess or the pupil so as to reach the corner portion where the highest temperature occurs.

Thereafter, a part of the lower part of the plunger on the opposite side to the circumference adjacent to the copper layer 101 is cut to form an air layer 102 as a heat insulating layer. In the same manner as above, a recess or a pupil and an air layer 102 for receiving a portion of the copper layer 101 are formed on the top of the plunger. The upper portion of the plunger is coupled to the lower portion of the plunger by means of welding, screwing, diffusion bonding, or the like. In this case, the recess for the heat insulating layer may be previously formed in the lower part of the plunger.

In the case of FIG. 3, the plunger is divided into an outer side and an inner side along the copper layer 113 as the heat conductive layer, the copper layer 113 and the air layers 114, 115 are formed inside the outer side, and the inner side is welded, screwed. The outer portion is joined by means of bonding, diffusion bonding, or the like, and then a process for diffusion bonding is performed. The perimeter of the mold may be formed as shown in FIGS. 1 and 2. The process for diffusion bonding may be performed before welding the inner side.

An embodiment of the present invention will be described in detail with reference to FIG. 1. 1 shows a plunger for forming a panel glass, wherein stainless steel is used as the mold body, copper is used as the heat conductive layer, and an air layer is used as the heat insulating layer.

Reference numeral 100 denotes a stainless steel layer constituting the perimeter. The high thermal conductivity copper layer 101 is disposed inside the stainless steel layer 100. The air layer 102 is disposed inside the copper layer 101. In addition, the stainless steel layer 103 is disposed inside the air layer 102 to prevent the supercooling portion from occurring by direct contact between the cooling medium such as water and the heat conductive layer. The stainless steel layer 100 and the copper layer 101 were contacted using a hot isostatic press (HIP) treatment apparatus at a pressure of 1500 atm, at a temperature of 900 ° C. for 5 hours, and bonded using argon as a hydraulic gas. As a result, a good bonding surface having a diffusion layer 105 of about 1 탆 thickness was obtained.

In this example, the plunger was prepared as follows. The plunger was divided up and down at its perimeter along a plane approximately parallel to the bottom. A recess for embedding the copper layer 101 was formed in the lower portion of the plunger. The copper piece was put in the recess and diffusion-bonded to the plunger body part. Thereafter, a portion of the body portion adjacent to the copper layer 101 and opposed to the circumference was cut off to form an air layer 102 as a heat insulating layer. Thereafter, the upper portion of the plunger was joined to the lower portion of the plunger by welding.

The plunger shown in FIG. 1 was used to mold the glass panel. It was found that defects such as cracks and irregularities on the surface of the glass that could be caused by uneven temperature distribution on the molding surface of the plunger were almost eliminated.

As shown in FIG. 2, nickel foil 104 was inserted between stainless steel layer 100 and copper layer 101. Thereafter, heat treatment for diffusion bonding was performed, whereby the coefficient of thermal expansion was changed step by step, thereby suppressing the generation of shear stress caused by temperature increase. Moreover, peeling or breaking of the joined portion could be avoided.

3 shows a plunger for forming panel glass. This plunger is provided with the surface part 110, the corner part 111, and the circumference part 112, and the laminated part of the copper layer 113 and the air layers 114 and 115 is embedded. In this example, the plunger was divided into two parts along the copper layer 113 to the outer side and the inner side. The copper layer 113 and the air layers 114 and 115 were arrange | positioned inside the outer side, and the inner side was welded to the outer side. Thereafter, heat treatment for the diffusion layer 116 was performed. In this case, a much more uniform temperature distribution is obtained on the mold surface of the plunger, and better results can be obtained than in the case of FIGS. 1 and 2.

Another embodiment of the present invention is described with reference to FIGS. 4 and 5.

In this embodiment, the metal material of high thermal conductivity is embedded in the high temperature portion of the mold so as to be substantially perpendicular to the mold surface, so that heat generated from the mold surface is transferred to the relatively low temperature portion through the metal material. The high thermal conductivity metal material for controlling the temperature distribution of the mold is preferably copper or copper alloy. In fact, oxygen-free copper (JIS-C1020, thermal conductivity 380 W / mK) was used. In the mold, stainless steel having a thermal conductivity of 25 W / mK was used.

4 shows an embodiment of the plunger. The temperature of the corner portion 2 of the plunger 1 tends to be higher than the circumferential portion 3 because the surface area receiving heat from the glass is large. As a result, mold release property with glass deteriorates locally, and when a plunger 1 is pulled out from a bottom mold, deformation | transformation like wrinkles generate | occur | produces in the localized surface of the molded glass. In addition, the oxidation state of the mold surface plating becomes uneven.

In this embodiment, a cylindrical hole or recess was formed in the back side of the four corner portions 2 (both ends of the diagonal lines) and the central portion of the four sides (four portions at both ends of the long axis and the short axis). The copper piece 4 was embedded in the cylindrical hole along the direction (ie, the normal direction) approximately perpendicular to the central surface of the corner portion 2. The copper piece was fixed to the hole with a brazing metal. Preference is given to using nickel as the brazing metal.

When the metal material of high thermal conductivity is a material which is easily oxidized, such as copper, a copper alloy, etc., it is preferable to seal the upper surface of the metal material fixed to the recess of the metal mold by a brazing metal with a cover material. The cover material may be a cover member such as stainless steel, or may be a cover layer formed of a plated metal or an alloy.

In this example, brazing was performed only on the bottom surface of the hole. An air insulating layer 5 was formed in the gap around the brazed metal, and the upper surface portion was covered with a cover member 4A made of stainless steel. In order to adjust the heat flux, the heat radiation fins 8 were formed on the cover member 4A on the cooling medium 7 side. The cover member 4A should have a thickness (about 1 mm) that does not interfere with heat conduction. The metal material was soldered with Ni lead. Instead of holes or recesses, grooves may be formed that extend throughout the corners, which become hot regions.

Thus, heat at the corners is absorbed into the cooling medium (water) 7 through the copper 4 of high thermal conductivity.

In this case, however, the drop in temperature at the periphery 3 of the corner portion is prevented by the function of the air insulation layer 5. Therefore, local temperature increase of the corner part 2 is prevented, and uniform temperature distribution is achieved. As a result, local deformation of the glass surface such as wrinkles on the glass surface (height of 200 µm to 300 µm) can be almost avoided, and transfer defects due to press work can be eliminated, thereby improving productivity.

5 shows an embodiment of the bottom mold 21. The temperature of the corner portion 22 of the bottom mold 21 tends to be low because the surface area to be cooled at the outer surface of the bottom mold is large. On the other hand, the temperature of the center portion 23 of the bottom mold 21 is likely to be lowered by the cooling air 24. Therefore, the temperature of the molding surface 25 slightly inward from the corner portion 22 is relatively high. As a result, a cooling rate distribution occurs in the glass, and the curvature radius of the glass changes locally. The above-mentioned high temperature range is an area from 'Q' to 0.4 L toward 'P', where 'P' represents the center point of the bottom mold surface, 'Q' represents the inflection point between the corner and the bottom, L 'represents the distance between' P 'and' Q '.

Corresponding to the four corner portions (both ends of the diagonal lines) and the center portion of the four sides (four positions on both ends of the long axis and the short axis) of the rectangular mold on the back, covering an area from 'Q' to 0.4 L of the forming surface of the bottom mold 21. A cylindrical hole was formed at the position. The copper piece 26 was fixed to the cylindrical hole in the same manner as the case of the plunger.

The brazing operation was performed only at the bottom surface of the hole in the same manner as in the case of the plunger shown in FIG. The lower surface portion of the copper piece 26 was covered with a cover member 26A made of stainless steel. The air insulation layer 28 was formed around the copper piece 26 substantially parallel to the normal line 27 to the mold surface 25. In order to adjust the heat flux, a heat radiation fin 29 was formed on the surface of the cover member 26A exposed to the cooling air.

Heat accumulated in the mold surface 25 slightly inside of the corner portion 22 is absorbed by the cooling air, which is a cooling medium, through the copper piece 26. However, the temperature of the corner portion 22 and the center portion 23 is not easily lowered by the influence of the air insulation layer 28. As a result, local temperature rise of the mold surface 25 is prevented, and a uniform temperature distribution can be obtained in the metal mold. Thus, it is possible to eliminate the occurrence of wrinkles that have been found in the local parts of the molded product.

4 and 5, the thermal conductivity of the high thermal conductivity metal material should be greater than twice the thermal conductivity of the mold. If it is smaller than twice the thermal conductivity of the mold, the effect of cooling the high temperature region at the local portion is lowered, and it may not be possible to prevent the occurrence of local deformation. In addition, when the air insulation layer is not formed in the direction perpendicular to the mold surface, heat conduction from the peripheral region occurs. As a result, the surrounding area is also simultaneously cooled, so that the effect of cooling the local is lowered, thereby making it difficult to partially adjust the temperature distribution of the mold. Since the thermal conductivity of the mold made of stainless steel is about 25 W / mK, it is preferable that the metal material has a thermal conductivity greater than 50 W / mK. When the thermal conductivity of the metal material is 200 W / mK or more, excellent effects can be obtained.

The shape of the recess formed in the mold is not particularly limited. In addition to the cylindrical holes as shown in the figures, rectangular prismatic holes, inverted conical holes, inverted pyramids, etc., or grooves that span the entire high temperature region of the mold, may be selected.

In the case where the mold surface has a specific local portion higher than the ambient temperature, a high thermal conductivity metal material should be installed with the air insulation layer on the back side of the specific portion so as to be perpendicular to the mold surface. As a result, the movement of the local heat is accelerated from the mold surface to the back side of the mold, whereby the temperature of the local portion is reduced to obtain a uniform temperature distribution.

In this case, if the metal material of high thermal conductivity is not fixed to the mold without resistance in terms of thermal conductivity, a predetermined effect cannot be obtained. Therefore, it is desirable to use brazing metal for this purpose. The desired effect can be obtained by using the material and heat insulation layer which have a desired thermal conductivity. The thermal conductivity of the metal material of high thermal conductivity should be at least twice that of about 20 to 25 W / mK, that is, 50 W / mK, which is the thermal conductivity of the material normally used for mold. In addition, the thickness of the air insulation layer is preferably 0.1 mm to 10 mm, which is a value obtained from the result of analyzing the thermal conductivity.

A thickness of less than 0.1 mm is undesirable because the temperature of the portion surrounding the high thermal conductivity metal material is lowered as in the case where no air insulation layer is formed. On the other hand, a thickness exceeding 10 mm is also undesirable because the surface area of the inner surface of the recess into which the high thermal conductivity metal material is inserted is large, and the temperature is lowered by thermal radiation. In addition, when there is no air insulation layer, the temperature of the surroundings of the high thermal conductivity metal material is lowered at the same time, and the effect of equalizing the temperature distribution is reduced.

According to the present invention, it is difficult to obtain a desired temperature distribution due to the problem of temperature nonuniformity causing uncertainty or uncertainty of contact state between different kinds of materials embedded in a mold to control the temperature distribution. The problem can be solved.

According to the present invention, the temperature distribution on the mold surface can be made uniform compared to the temperature distribution of the conventional mold. When the bonding between the heat conductive layer and the mold body portion is insufficient, the temperature of the mold surface is partially higher than the temperature of the other portion by 100 to 300 ° C, but in the present invention, the temperature non-uniformity caused by the poor bonding can be eliminated. Can be.

In addition, when the metal material of high thermal conductivity is disposed in the high temperature region in the mold surface, and the air insulation layer is formed around the metal material so as to be parallel to the normal to the mold surface, heat can be effectively moved from the mold surface.

According to the present invention, it is possible to solve various problems such as problems caused by conventional press molding of glass products, that is, occurrence of cracks due to overheating or overcooling of the mold surface, change of stipple shape, and deformation of glass products. have. In addition, the temperature distribution of the plunger can be changed as desired, thereby obtaining an optimum temperature distribution.

Obviously, various modifications and variations of the present invention are possible within the above concept. Accordingly, the present invention should not be limited to that described herein but should be understood within the scope of the appended claims.

Claims (11)

As a mold for forming a CRT glass, A mold body part and a lamination part comprising a heat conductive layer and a heat insulating layer made of a metal material having high thermal conductivity, The laminate portion is embedded in at least a portion of the mold body portion in the thickness direction such that the heat conductive layer is disposed on the mold surface side and the heat insulating layer is cooled side, and And the mold body portion and the heat conductive layer are bonded through a diffusion layer in which each component of the mold body portion and the heat conductive layer is diffused. The intermediate film having a coefficient of thermal expansion between the coefficient of thermal expansion of the mold body and the coefficient of thermal expansion of the thermally conductive layer, instead of the diffusion layer through which the components of the mold body and the thermally conductive layer are diffused. A CRT glass forming mold, characterized in that it is inserted between the layers. 2. The thermally conductive layer of claim 1, wherein the thermally conductive layer extends from the hot region within the mold to the supercooled region, wherein the thermal insulation layer is embedded in the mold so as to be stacked on the thermally conductive layer on the cooling side of the subcooled region, thereby A mold for forming a CRT glass, which is moved to the subcooled region through the heat conductive layer. As a manufacturing method of a mold for forming a CRT glass, Forming a mold body portion and a lamination portion formed of a heat conductive layer and a heat insulation layer made of a metal material having a high thermal conductivity, wherein the lamination portion is disposed on the mold surface side and the heat insulation layer on the side to be cooled. Forming step of embedding in at least a portion of the mold body portion in the thickness direction, and Bonding the mold body portion and the heat conductive layer in an inert gas atmosphere under a pressure of 100 atm or more at a temperature within a range from 300 ° C. to a low melting point of the melting point of the mold body portion and the heat conductive layer. Method for producing a mold for forming a glass tube glass. As a mold for forming a CRT glass, A mold surface, and a metal material of high thermal conductivity disposed on the back side of the high temperature region in the local region of the mold surface which becomes locally high during the molding operation, whereby the movement of heat in the normal direction to the mold surface is achieved. CRT glass molding mold, characterized in that it can be increased in the local area. The mold for forming a CRT glass according to claim 5, wherein the mold is a plunger for forming CRT glass, and the high temperature region is a corner portion. 6. The mold according to claim 5, wherein the mold is a bottom mold for forming a CRT panel, the center point of the bottom mold surface is 'P', the inflection point between the corner portion and the bottom mold molding surface is 'Q', and When the distance between P 'and' Q 'is set to' L ', the high temperature region is a region of the range from Q to P toward 0.4 L, characterized in that the CRT mold for forming a glass tube. The mold for forming a CRT glass according to claim 5, wherein an air insulating layer having a thickness of 0.1 mm to 10 mm is provided around the high thermal conductivity metal material. 6. The CRT mold according to claim 5, wherein the high thermal conductivity metal material is copper or a copper alloy. The mold for forming a CRT glass according to claim 5, wherein the high thermal conductivity metal material is brazed to the mold by a brazing metal. 6. The CRT mold according to claim 5, wherein the thermal conductivity of the metal material is greater than twice the thermal conductivity of the mold.