JP4074293B2 - Method for forming coating film with protective coating film for coating on electronic circuit board and coating film forming apparatus - Google Patents

Description

  The present invention is for an electronic member for forming a coating film with various paints such as an insulating paint and a photosensitive paint on a single layer or laminated substrate for an electronic member such as an electronic circuit substrate, an IC card, and a liquid crystal display substrate. The present invention relates to a method for forming a coating film on a substrate and a coating film forming apparatus used in the method.

Conventionally, methods for forming a coating film by applying a paint such as an insulating paint or a photosensitive paint (resist) to an electronic circuit board (hereinafter referred to as “substrate”) have been as follows.
(1) A method in which a paint is directly applied to one or both sides of a substrate by a roll coater or the like, the substrate is dried, and a protective film is applied to the dried substrate to form a painted substrate.
(2) A method in which a dry film to which a paint has been applied in advance and dried is heated, the applied paint is melted and applied to one or both sides of the substrate (hot lamination), and a protective film is applied thereon.

In the case of the method (1), a drying step is required to dry the paint after applying the paint to the substrate. However, since the drying takes time and effort, the workability is poor. Further, simply by applying a paint to the substrate and drying it, the fixability of the paint on the substrate is not excellent, and it is difficult to fill the paint into the hole of the substrate. Moreover, the substrate for electronic members completed by this method was easily formed with unevenness on the surface, and the substrate was easily damaged from the uneven portion.
In the case of the method (2), since a heating step is required to heat a dry film on which a paint has been applied in advance and melt the paint, heating takes time and effort, and workability is poor. Moreover, there is a possibility that the properties of the dry film or the substrate may be changed by applying high heat to melt the solidified coating. Furthermore, since the protective film is stacked on the dry film, the completed substrate becomes thick. In addition, two types of films, a dry film and a protective film, are required, resulting in poor workability and high cost.

  The present invention has a small number of steps, good workability, excellent paint fixability, the finished substrate does not become thick, and can be formed on the substrate at a low cost. A method and a coating film forming apparatus used therefor.

A method of forming a coating film to an electronic circuit board of the present application, the surface to be bonded to the electronic circuit board insulating paint or the photosensitive coating material is applied out of the paint coating protective film traveling, traveling the coating of the film Semi-dry with a semi-drying device, stick the paint surface of the running film to the electronic circuit board, and apply the paint to the electronic circuit board by pressurizing or heat-pressing the paint application protective film The paint application protective film is still attached to the substrate, and the paint application surface of the electronic circuit board can be protected by the film. In this case, the paint coating protective film can be pressurized or heated and pressed to apply the semi-dry paint to the electronic circuit board, so that the hole can be filled in the electronic circuit board . Further, the paint application surface of the paint application protective film can be applied to the electronic circuit board under vacuum or by a vacuum application (vacuum lamination) method . A coating material can also be apply | coated to the whole surface or desired location of the surface which adhere | attaches with the board | substrate for electronic circuits among coating material coating protection films with a rotary application roll . It is also possible to run two coating coating protective films, apply a coating on the surface of the two films that adheres to the electronic circuit substrate, and attach the coating surfaces of both films to both sides of the electronic circuit substrate.

An apparatus for forming a coating film on an electronic circuit board of the present application includes: an application apparatus that applies a paint to a surface of the paint application protective film that adheres to the electronic circuit board; a semi-drying apparatus that semi-drys the paint; and Equipped with a sticking device for sticking the semi-dry paint coating surface of the paint coating protective film to the substrate for electronic circuits, and a pressurizing device for applying the semi-dry paint to the substrate by pressurizing or heat-pressing the paint coating protective film It is. The sticking device can be a sticking device for sticking the paint coating protective film to the electronic circuit board under vacuum or a vacuum sticking type. The coating device is a rotary coating roll , and the entire surface of the coating roll or a desired portion can be used as a coating portion .

The method for forming a coating film on an electronic circuit board of the present invention has the following effects.
(1) Since the paint of the protective film is applied to the substrate by applying the paint to the surface of the protective film that adheres to the substrate and then applying the protective film to one or both surfaces of the substrate, the paint is applied to the substrate. Easy to apply.
(2) Further, the surface of the completed electronic member substrate is formed to be smooth (flat), and the substrate is less likely to be damaged as compared with application by a roll coater or spray.
(3) Since the protective film is also applied to the substrate simultaneously with the application of the coating material to the substrate, the step of drying the coating material on the substrate becomes unnecessary, and the workability is improved and the productivity is improved.
(4) When using a dry film pre-applied with a paint, a heating step for melting the paint is required, but in the present invention, a heating step for melting the paint is unnecessary, and workability is good. Productivity is improved.
(5) Since only the protective film layer is affixed to the substrate, the substrate is not thicker than the conventional method in which both the dry film and the protective film are affixed to the substrate. Since the film is not necessary, the cost is reduced.

The method for forming a coating film on an electronic circuit board of the present invention pressurizes or heat-presses the protective film attached to the board, so that in addition to the above effects, the effect of ensuring the fixing of the paint to the board is also achieved. is there. In the case of heating and pressurizing, the fixing of the paint to the substrate is ensured particularly in a short time, and further, the drying of the paint is promoted. Further, there is an effect that the surface of the electronic member substrate can be formed more smoothly by pressurization or pressurization heating.

In addition to the effects described above, the method for forming a coating film on an electronic circuit board of the present invention makes it possible to fill a hole in the board with a paint when applying the paint to the board, thereby eliminating unnecessary holes in the board. There is also an effect that it can be blocked.

In the method for forming a coating film on an electronic circuit substrate of the present invention , a protective film is applied to the substrate by a vacuum application (vacuum laminating) method. Therefore, in addition to the above effects, bubbles in the substrate hole, air on the substrate surface Since the protective film is removed, the protective film comes into close contact with the substrate, and there is also an effect that the fixing of the paint becomes more reliable.

Since the coating film etc. formation method to the board | substrate for electronic circuits of this invention decided to apply a coating material to the whole surface or desired location of the surface which adheres to a board | substrate among protective films, in addition to said each effect, it is as follows Has an effect.
(1) An electronic member substrate having a paint applied at a desired position can be manufactured, and an electronic member substrate suitable for various applications and purposes can be provided.
(2) On the work line, it is possible not to apply the paint to the gap between the substrates. Therefore, the coating material is not wastefully applied, which contributes to cost reduction.

The apparatus for forming a coating film on an electronic circuit board of the present invention has the following effects.
(1) Since a coating device for applying a coating material to a surface of the protective film that adheres to the substrate and a sticking device for sticking the protective film to the substrate are provided, a coating film can be formed on the substrate by a series of operations.
(2) Since a device for drying the paint and a device for heating and melting the paint are unnecessary, the coating film forming apparatus can be downsized.

The apparatus for forming a coating film on an electronic circuit board of the present invention has the following effects in addition to the above-mentioned effects because the application device is a heating type or non-heating type pressure type.
(1) The coating of the substrate is more reliably and uniformly applied. Therefore, the surface of the completed electronic member substrate can be formed smoothly.
(2) When the heating and pressurizing device is provided, not only can the paint be fixed to the substrate reliably, but also the drying of the paint is promoted, and a coating film can be formed in a short time.

In the coating film forming apparatus for an electronic circuit substrate of the present invention , the application device is a device for applying a protective film to a substrate in a vacuum state or a vacuum application type (vacuum laminator). There are also the following effects.
(1) When the paint is applied to the substrate, the hole can be filled with the paint.
(2) Air bubbles in the hole of the substrate and air on the surface of the substrate are removed, and the protective film is closely attached to the substrate, so that the fixing of the paint becomes more reliable.

An apparatus for forming a coating film on an electronic circuit board according to the present invention is a coating apparatus that applies a coating material to a surface of a protective film that adheres to the entire surface of a protective film or a desired portion of the coating device. Since the coating portion is used, in addition to the above effects, there are the following effects.
(1) Since the paint can be applied to the entire surface of the protective film to be bonded to the substrate or to a desired location, it is possible to manufacture an electronic member substrate having the paint applied at a desired position. It becomes possible to provide an electronic member substrate suitable for the application and purpose.
(2) On the work line, it is possible not to apply the paint to the gap between the substrates. Therefore, the coating material is not wastefully applied, which contributes to cost reduction.

(Embodiment 1)
The method for forming a coating film on an electronic circuit board of the present invention is carried out using the coating film forming apparatus shown in FIG. An example of an embodiment of a coating film forming apparatus for carrying out the coating film forming method of the present invention will be described with reference to FIGS. The coating film forming apparatus shown in FIG. 1 is a horizontal apparatus that transports an electronic circuit substrate (hereinafter referred to as “substrate”) 4 in a lateral direction, and is on a surface 6 of the protective film 5 that adheres to the substrate 4. An applicator 1 for applying a paint and an applicator 2 for attaching a protective film 5 applied with a paint to a substrate 4 are provided. The sticking device 2 can also apply (transfer) the paint of the protective film 5 to the substrate 4 by heating or pressurizing the protective film 5 attached to the substrate 4 without heating. Moreover, the sticking apparatus 2 can be accommodated in the vacuum chamber 3 and can be a vacuum sticking method.

  1 is provided on each of the upper and lower surfaces of the substrate 4 one by one. The coating device 1 is a rotating roll type, and the rotating roll rotates in the direction of arrow a in FIG. 1 or the opposite direction while being pulled out from the reel 7 and out of the protective film 5 guided by the guide roll 10. The coating is applied to the protective film 5 by being pressed against the surface 6 to be adhered to. A groove (not shown) having the same depth as the thickness of the coating film to be formed is formed on the rotating roll of the coating apparatus 1. Further, as shown in FIG. 1, the coating device 1 is provided with a coating material supply device 11 in contact with the coating device 1. As shown in FIG. 1, the paint supply device 11 is a rotating roll and is provided so as to come into contact with the paint 16 in the paint container 12. The coating material supply device 11 rotates in the direction of the arrow d and supplies the coating material to the coating device 1 in contact therewith. Further, a squeegee (not shown) is applied to the surface of the coating apparatus 1, and among the paints supplied to the surface of the coating apparatus 1 by the coating material supply device 11, an extra material other than the coating material accommodated in the groove is provided. The paint can be scraped off. Accordingly, when the coating material supply device 11 supplies the coating material to the coating device 1 and applies a squeegee (not shown) to the surface of the coating device 1 to scrape off the excess coating material, only the coating material in the groove remains in the coating device 1. The paint in the groove can be applied to the protective film to form a coating film having a desired thickness. The thickness of the coating film formed on the protective film 5 can be adjusted by adjusting the depth of the groove formed on the coating apparatus 1. Although the thickness of a coating film can be made arbitrary, it can be set as 0.1 micrometer-50 micrometers or more, for example. Further, if a portion that does not form a groove is formed on the surface of the coating device 1, the paint supplied to the portion by the paint supply device 11 is scraped off by the squeegee, and no paint remains in that portion, and the protective film 5 In addition, it is possible to form a blank portion where no paint is applied. Therefore, only the part which formed the groove | channel among the rotary roll-type coating devices 1 can be made into a coating material coating part. The formation position of the groove can be arbitrarily determined. The coating device 1 and the coating material supply device 11 are not limited to rolls, and any device such as an ink jet device, a spray device, or a brush can be used as long as the coating material can be applied to the protective film 5. The protective film 5 to which the paint has been applied is guided by a guide roll 10 and conveyed in the direction of arrow A in FIG.

  1 are also arranged on the upper and lower surfaces of the substrate 4 one by one. The sticking device 2 is two rotating rolls arranged so as to face each other up and down, and the sticking device 2 is also two rolls arranged so as to face up and down. This roll may be a pressure type that presses in the direction of sandwiching the substrate 4, a pressure type, a heating type, or a non-heating type. The two rotating rolls are rotated in the direction of arrow c in FIG. 1, and the protective film 5 coated with the paint is simultaneously pressed on both sides of the substrate 4 to attach the protective film 5 to the substrate 4 and applied to the protective film 5. The paint is applied (transferred) to the substrate 4. In the case of a heating roll, the protective film 5 is heated and pressed to apply the coating material of the protective film 5 to the substrate 4. Further, the sticking device 2 is not limited to the roll-shaped device shown in FIG. 1, as long as it can apply (transfer) the coating material of the protective film 5 to the substrate by pressing the protective film 5 coated with the coating material onto the substrate 4. Any device such as a plate-shaped press board can be used.

  The substrate 4 is a substrate for an electronic member such as an electronic circuit substrate or a liquid crystal display substrate, and is a resin plate member. Arbitrary resin materials such as general-purpose hard resins such as bakelite and functional resins can be used for the substrate 4. Moreover, the board | substrate 4 can also use arbitrary materials used for the board | substrate for other electronic members, such as a glass material and a metal material. The substrate 4 may be a single layer plate or a laminated plate. Further, as shown in FIG. 3, holes such as a bottomed hole 14 and a through hole 15 can be formed in the substrate 4. As shown in FIG. 1, the substrate 4 is transported in the lateral direction by a transport body 13 such as a roller conveyor and drawn into the vacuum chamber 3. The conveyance body 13 is not limited to the roller conveyor shown in the figure, and an arbitrary conveyance device such as a belt conveyor or a chain conveyor can be used.

  The protective film 5 may be any resin film material as long as it can apply a paint and can protect the paint applied to the substrate 4, for example, a general-purpose resin such as polypropylene or polyethylene or a function. Arbitrary resin materials, such as an adhesive resin, can be used. The protective film 5 of FIG. 1 is wound around a reel 7 that can rotate in the direction of arrow b.

  The paint applied to the protective film 5 may be any of an insulating paint and a photosensitive paint. The protective film 5 is affixed to the substrate 4 in a clay (softness) state in which the applied paint is easily applied to the substrate 4. The viscosity is, for example, about 18 to 40 centipoise (cP). With this level of viscosity, as shown in FIG. 3, the bottomed hole 14 and the through hole 15 formed in the substrate 4 are filled with the paint 16. The coating material 16 is put in the coating material container 12 shown in FIG. 1, and is supplied to the coating device 1 in contact with the coating material supply device 11 by the coating material supply device 11 provided so as to contact the coating material in the coating material container 12. .

(Usage example 1)
In order to form the coating film forming substrate shown in FIG. 2B by using the coating film forming apparatus for the electronic member substrate of the present embodiment, the following is performed.
(1) Rotate the coating apparatus 1 provided on each of both surfaces of the substrate 4 in the direction of arrow a in FIG. 1 and press against the surface 6 to be bonded to the substrate 4 of the protective film 5 pulled out from the reel 7. Then, paint is applied to the protective film 5.
(2) The protective film 5 coated with the paint is guided by the guide rail 1 and pulled in the direction of arrow A in FIG. 1 and is pulled into the vacuum chamber 3 at the same speed as the substrate 4 transported by the transport body 13. . The viscosity of the paint is about 18 to 40 centipoise (cP).
(3) The protective film 5 coated with the paint is heated and pressurized by the application device 2 rotating in the direction of arrow c in FIG. 1 in the vacuum chamber 3 and attached to the substrate 4 (see FIG. 2a), and vacuum application (vacuum) Then, the paint is applied (transferred) to the substrate 4 to form a paint-coated substrate having the coating layer 8 as shown in FIG. At this time, as shown in FIG. 3, if a hole is formed in the substrate 4, the hole is filled with a paint. The paint coating substrate is conveyed in the direction of arrow B in FIG.

(Embodiment 2)
In the first embodiment, the coating film forming apparatus for the electronic member substrate of the present invention is a horizontal apparatus that transports the substrate 4 in the lateral direction as shown in FIG. 1, but is not limited thereto. As shown in FIG. 4, a vertical apparatus that transports the substrate 4 in the upward direction may be used. The coating film forming apparatus shown in FIG. 4 has the same basic configuration and method of use as the coating film forming apparatus shown in FIG. 1, but the transport direction of the substrate 4 by the transport body 13 is upward, and The difference is that one coating device 1 and one application device 2 are provided on each of the left and right sides of the substrate 4. Further, in the present embodiment, unlike the first embodiment, the roll-shaped coating device 1 is provided so as to come into contact with the paint in the paint container 12, and the paint supply device 11 is not provided. But in the coating-film formation apparatus to the board | substrate for electronic members of this invention, the conveyance direction of a board | substrate is not restricted to the thing of the said each embodiment, It can be made into arbitrary directions.

(Embodiment 3)
In each of the embodiments described above, the sticking device 2 is disposed so as to face both surfaces of the substrate 4 so that the protective film 5 can be simultaneously stuck on both surfaces of the substrate 4. However, the present invention is not limited to this. It is also possible to dispose 2 and provide the substrate 4 so as not to face both surfaces of the substrate 4 so that the protective film 5 is pasted on one side of the substrate 4 first and then the protective film 5 is pasted on the other surface. In this case, the bubbles in the holes of the substrate 4 and the air on the surface of the substrate 4 can be surely removed one by one, and the protective film 5 can be easily adhered to the substrate 4.

(Embodiment 4)
When the protective film 5 is attached to the substrate 4 and the paint is applied to the substrate 4, the paint applied to the protective film 5 can be applied to the substrate 4 after being semi-dried. In that case, a semi-drying device such as a heater can be provided between the coating device 1 and the pasting device 2 of the coating film forming apparatus shown in each of the embodiments.

(Embodiment 5)
In each said embodiment, as shown in FIG.1, FIG.3, although the protective film 5 is conveyed by the conveyance bodies 13, such as a roller conveyor, the conveying method of the protective film 5 is not restricted to this, FIG. It can also be transported in the manner shown. In this embodiment, as shown in FIG. 5, a large number of holes 17 are continuously opened at predetermined intervals in the longitudinal direction of the protective film 5 at both ends in the width direction of the protective film 5. Under the holes 17 at both ends in the width direction of the protective film 5, a rotating plate 19 having a plurality of protrusions 18 on the outer peripheral surface is provided with the protrusions 18 protruding from the holes 17 onto the protective film 5. ing. Therefore, when the rotating plate 19 is rotated in the direction of arrow A in the figure, the rotating plate 19 rotates with the protrusion 18 being caught in the hole 17, and the protrusion 18 on the outer peripheral surface of the rotating plate 19 is continuously inserted into the hole 17. The protective film 5 is conveyed in the direction of arrow B in the figure. The number of rotating plates 19 is not limited to two as shown in the figure, and any number can be installed. The opening interval of the holes 17, the diameter of the holes 17, the diameter of the rotating plate 19, the number of protrusions 18 provided, and the like can be arbitrarily set. Further, when a coating film is formed on the electronic member substrate using the transport method shown in FIG. 5, no paint is applied to both end portions of the protective film 5 where the holes 17 are opened.

(Other embodiments)
In FIG. 1, each of the coating device 1, the reel 7, and the sticking device 2 is arranged on each side of the substrate 4. It can also be arranged only on the (applied surface) side.

  In the first embodiment, the coating film forming apparatus shown in FIG. 2 is provided with the pressure-type sticking device 2 and the vacuum chamber 3, but instead of the pressure-type sticking device and the vacuum chamber, a vacuum laminator (vacuum sticking type) is used. Apparatus) can also be used.

The coating film forming method and the coating film forming apparatus for an electronic circuit board of the present invention can form a coating film on a base material, for example, when a paint such as paint is applied to a metal plate, or other Can be used in the field.

Explanatory drawing which shows an example of the coating-film formation apparatus and coating-film formation method of this invention. (A) is explanatory drawing in the case of forming a coating-film board | substrate by the coating-film formation method of this invention, (b) is a front view of the coating-film board | substrate formed by the coating-film formation method of this invention. Front explanatory drawing which shows a mode that a protective film is affixed on a board | substrate with the sticking apparatus of the coating-film formation apparatus of this invention. Explanatory drawing which shows another example of the coating-film formation apparatus and coating-film formation method of this invention. Explanatory perspective view which shows an example of the conveyance method of a protective film of the coating-film formation apparatus of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Application | coating apparatus 2 Sticking apparatus 3 Vacuum chamber 4 Board | substrate 5 Protective film 6 Adhesive surface with a board | substrate among protective films 7 Reel 8 Coating film layer 10 Guide roll 11 Paint supply apparatus 12 Paint container 13 Conveying body 14 Bottomed hole 15 Through hole 16 Paint 17 Hole 18 Protrusion 19 Rotating plate

Claims (8)

Face the insulating paint or photosensitive coating that adheres to the electronic circuit board is coated out of painted protective film traveling, then semi-dry semi-drying apparatus the coating material during travel of the film, the film traveling The paint surface is affixed to the electronic circuit board, the paint application protective film is pressurized or heated and pressed to apply the paint to the electronic circuit board, and the paint application protective film is left attached to the board. A method of forming a coating film with a paint coating protective film on an electronic circuit board, wherein the coating surface of the electronic circuit board can be protected by the film . The method for forming a coating film with a paint coating protective film on an electronic circuit board according to claim 1, wherein the paint coating protective film is pressurized or heated and pressed to apply a semi-dry paint to the electronic circuit board. A method of forming a coating film with a paint application protective film on an electronic circuit board, comprising filling a hole in a circuit board with a paint . 3. The method for forming a coating film with a paint coating protective film on an electronic circuit board according to claim 1 or 2, wherein the paint coating surface of the paint coating protective film is stuck on the electronic circuit board in a vacuum state or by a vacuum pasting method. A method for forming a coating film with a paint coating protective film on an electronic circuit board, comprising: In the coating-film formation method with the coating-coating protective film to the electronic circuit board in any one of Claims 1 thru | or 3, it is the whole surface of the surface adhere | attached with the electronic-circuit board among coating-coating protective films , or a desired location. A method for forming a coating film with a paint application protective film on a substrate for electronic circuits , wherein the paint is applied by a rotary application roll . 5. The method of forming a coating film with a paint coating protective film on an electronic circuit board according to claim 1 , wherein two coating films are traveled and bonded to the electronic circuit board of both films. A method of forming a coating film with a paint application protective film on an electronic circuit substrate, comprising: applying a paint to the surface to be coated, and attaching the paint application surfaces of both films to both surfaces of the electronic circuit substrate . A coating device for applying paint to the surface of the paint coating protective film to be bonded to the electronic circuit substrate, a semi-drying device for semi-drying the paint, and a semi-dry paint coating surface of the paint coating protective film for the electronic circuit substrate A coating device for applying to a circuit board, and a pressure coating device for applying a semi-dried coating to a substrate by pressurizing or heat-pressing the coating coating protective film on the substrate. Coating film forming device. 7. A coating film forming apparatus with a paint application protective film on an electronic circuit board according to claim 6, wherein the sticking apparatus is one for sticking the paint application protective film to the electronic circuit board under vacuum or of a vacuum sticking type. An apparatus for forming a coating film with a paint- protecting film on an electronic circuit board. 8. A coating film forming apparatus with a paint coating protective film on an electronic circuit board according to claim 6 or 7, wherein the coating device is a rotary coating roll , and the entire surface or a desired portion of the coating roll is coated with a coating material. An apparatus for forming a coating film with a paint application protective film on an electronic circuit board, characterized in that it is a part .

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