JP4624241B2 - Insulating paint with protective film or method for manufacturing printed wiring board coated with photosensitive paint - Google Patents

Description

In the present invention, for example, various types of paints (resist) such as insulating paints and photosensitive paints are applied to single-layer or multi-layer printed wiring boards used as various electronic members such as electronic circuit boards, IC cards, and liquid crystal display boards. The present invention relates to a method for producing an insulating paint with a protective film, or a printed wiring board coated with a photosensitive paint, having a protective film attached to the outside thereof.

Conventionally, as a method for forming a coating film by applying a resist to a single-layer or multilayer printed wiring board (hereinafter referred to as “substrate”) as an electronic member, there has been a method as shown below.
(1) A method of manufacturing a resist-coated substrate by applying a paint (resist) on one or both sides of a substrate with a roll coater and completely drying the resist.
(2) Apply and dry a resist, peel off the protective film pasted on the resist-coated side of the dry film on the resist-coated and non-coated surfaces, and overlay the dry-coated resist-coated surface on one or both sides of the substrate A method of applying pressure (hot laminating) by applying heat and pressure to the surface on which the resist is applied.

The method (1) has the following problems.
(A) Since the resist is dried after the resist is applied to the substrate, it takes time and effort to dry, and workability is poor.
(B) By simply applying a resist to the substrate and drying it, the resist surface tends to wave and become uneven, and lacks smoothness.
(C) When the substrate has a bottomed hole or a through hole, it is difficult to reliably fill the resist into the inside.

The method (2) has the following problems.
(A) Since a heating process for heating and melting the resist of the dry film is necessary, heating takes time and effort, and workability is poor.
(B) High heat is required to melt the dried resist, and the high heat may cause the film or substrate to be altered, distorted, or stretched.
(C) Since a protective film is stacked on the resist of the dry film, two types of films are necessary, workability is poor, and this contributes to high cost.
(D) There is a difficulty in the smoothness of the resist on the substrate surface.
(E) It is difficult to fill the resist into the hole of the substrate, which may cause insulation failure.

The method for producing a printed wiring board with an insulating paint or a photosensitive paint coated with a protective film of the present application is as described in claim 1, wherein the single-leaf or continuous printed wiring board is in contact with the surface of the running single-leaf or continuous printed wiring board . An insulating paint or photosensitive paint is applied to the surface of the film that adheres to a single-leaf or continuous printed wiring board by rotating the coating roll, and the insulating paint or photosensitive paint is applied to the printed wiring board or the film while it is running. a semi-dry state in a drying apparatus, an insulating varnish or the photosensitive coating applied surface of the film of the printed wiring board insulating paint or a photosensitive coating applied surface film and or during traveling of the traveling bonded to a printed wiring board was bonded film and a printed wiring board by vulcanization consolidation, bonding printed wiring board and pressure consolidation adhesion before or under consolidation After wearing of the film, or under After completely drying the printed wiring board and the film that are in close contact with each other, the film is cut according to the dimensions of the printed wiring board, and the printed wiring board and the film are kept in close contact, and the film is used as a protective film to insulate the printed wiring board. The coating surface of the paint or photosensitive paint can be protected. In this case, as described in claim 2, the coating roll is brought into rotational contact with the transfer roll, the insulating paint or the photosensitive paint is transferred from the transfer roll to the outer peripheral surface of the application roll, Can be made to rotate and contact a continuous printed wiring board and apply an insulating paint or a photosensitive paint to the film or the printed wiring board. As described in the third aspect, the printed wiring board and the film can be bonded and pressure-contacted by a vacuum bonding method . As claimed in claim 4 , rotating feed bodies such as feed rollers and feed belts having feed holes at both ends in the width direction of the film or / and the printed wiring board and having protrusions on the outer periphery are being rotated. The film or / and the printed wiring board can be automatically fed to run by inserting the projection into the feed hole .

The method for producing an insulating paint with a protective film or a photosensitive paint- coated printed wiring board of the present application has the following effects.
(1) Since the insulating paint or photosensitive paint (hereinafter referred to as “paint”) applied to the printed wiring board or film is semi-dried and the printed wiring board or film is attached to the paint application surface, the film and the printed wiring Adhesion of the substrate is easy, and the printed wiring board and the film are pressed and adhered to each other, so that adhesion is ensured and the coating applied to the printed wiring board or film becomes smooth.
(2) Since the conventional dry film has a paint applied to the base film and a protective film is stuck on it, in order to attach the dry film to the printed circuit board, the paint is peeled off after the protective film is peeled off. The protective film is wasted on the printed wiring board because the attached base film is affixed. However, in the present invention, one film (one layer) serves as both the protective film and the base film (for paint transfer). There is no waste of film and costs are reduced.
(3) Workability is good because the application of the paint , the semi-drying of the paint, the application of the film, and the pressurization of the film and the printed wiring board are performed automatically and continuously while the printed wiring board is running.

(4) To the paste of the printed circuit board and the film and vacuum sticking type, paste is ensured, even application of the paint from the film to the printed circuit board, also ensures the application of the paint on the printed wiring board . Workability is improved because the pasting and pressurization are completed in one step.
(5) The air in the paint applied to the film or the printed wiring board, the air between the printed wiring board and the film, the air in the bottomed hole or through-hole of the printed wiring board is stuck between the printed wiring board and the film. Since it is discharged to the outside at the time of attachment, bubbles and pinholes are not generated in the paint applied to the printed circuit board.
(6) The paint can be reliably filled into the bottomed hole or the through hole of the printed wiring board.

(Embodiment 1 of printed wiring board manufacturing method with insulating paint or photosensitive paint with protective film )
An example of an embodiment of a method for producing an insulating paint with a protective film or a photosensitive paint- coated printed wiring board according to the present invention will be described with reference to FIG. In this embodiment, a film 1 wound in a roll shape is pulled out, a coating is applied to a part of one side of the film 1 while the film 1 is traveling, and the film 1 is allowed to travel as it is to be semi-drying chamber (not shown). The paint applied on the film 1 is dried in a semi-dry state (raw dry), the film 1 is pulled out from the semi-dry chamber, and the paint- coated surface of the film 1 is not shown in the printed wiring board. (Hereinafter referred to as “substrate”), and then the paint is dried to produce an insulating paint with a protective film or a photosensitive paint- coated printed wiring board.

Applying the paint to the film 1 is shown in FIG. 1, the paint by depressing a part of the outer peripheral surface of the applicator roll 2 (to be lower than the outer peripheral surface) painted portion 3 formed (FIG. 5) The coating roll 2 is rotated and brought into contact with the traveling film 1 to apply the paint onto a part of the film 1. In FIG. 1, the coating material is applied to both surfaces of the film 1, but in this embodiment, the coating material may be applied to only one surface of the film 1 in order to attach the film 1 to the substrate. In that case, the application roll 2 may be provided only on one side of the film 1.

As shown in FIG. 5, the application roll 2 is a roll-shaped member that applies a paint to a part of the film 1, and a paint application part 3 is formed on the outer peripheral surface. The paint application part 3 of the application roll 2 is recessed one step lower than the outer peripheral surface of the application roll 2. The paint in the paint coating unit 3 is supplied from the paint supply unit 4 (FIG. 1) R is accumulated in that portion, the coating R is applied as shown in FIG. 6 to the film 1. The coating material application part 3 can also be formed separately at two or more locations in the circumferential direction of the application roll 2. Although the coating material application part 3 of FIG. 5 is a rectangle, it can also be set as another shape and pattern. The coating material application part 3 can be made one step higher than the outer peripheral surface of the application roll 2. In this case, paints R supplied from the paint supply unit 4 is attached to the painted section 3, the coating R is applied to the film 1 in the traveling contact. The coating roll 2 can be a roll made of any material such as rubber, resin, metal, or ceramic.

The material of the film 1 can be arbitrarily selected. The film 1 may be a single leaf separated from each other or may be continuous. Further, it is desirable coating R which is applied to the film 1 also uniform thickness, because its uniformly leveled is preferred against the contact surface 9a of the squeegee 9 in the coated film 1 paint, a uniform thickness For smoothing, the contact surface 9a is preferably wide.

Paint supply unit 4 for supplying paint to a coating roll 2 can be a rotating roll or the like including a paint reservoir Toka paint in large quantities. May be supplied from any of the coating material supply unit 4 paint to the applicator roll 2, good to as paint applied to the coating roll 2 is uniform thickness, in order that, for example, the outer peripheral surface of the applicator roll 2 It is preferable to apply a squeegee to level the paint to a uniform thickness.

Wherein the manner drawn a semi-dry chamber as it is traveling film 1 coated with paint, dried paint that is applied to the film 1 in its semi-dry state (raw dry), half the film 1 withdrawn from the drying chamber, paste paint coated surface of the film 1 within the semi-dry state to the substrate. The semi-drying of the paint on the film 1 is not limited to being carried into the semi-drying chamber, and can be performed by any method. The film 1 can be attached by any appropriate method. However, if the film 1 is attached by a vacuum application method, the film 1 can be attached to the substrate and the paint can be applied to the substrate. In addition, since air in the paint applied to the film 1, air between the substrate and the film 1, and air in the bottomed hole or through hole of the substrate are discharged to the outside at the time of pasting, they are applied to the substrate. Bubbles and pinholes do not occur in the paint . Furthermore, the paint can be filled in the bottomed hole or the through hole of the substrate.

After the film 1 is attached to the substrate, the attached film 1 and the substrate are run as they are and sent to a drying chamber or the like to completely dry the paint on the substrate. The drying of the paint is not limited to being carried into the drying chamber, and can be performed by any method. Paint film 1 and the substrate was dried in is run as it is, while traveling, or have suspended, the film 1 was cut to fit the outer diameter of the substrate, separating the substrate one by one, the paint A coated substrate is used. In the case where the substrates are continuous, the substrate is cut at the same time as the film 1, and the substrates to which the film 1 is attached are separated one by one to obtain a paint- coated substrate.

The traveling of the film 1 in the method for producing an insulating paint with a protective film or a photosensitive paint- coated printed wiring board according to the present embodiment rotates a rotary feed body such as a feed roller or a feed belt, and a protrusion attached to the rotary feed body during the rotation. The film 1 can be automatically fed by inserting it into the feed holes 11 (see FIG. 6) opened at both ends in the width direction of the film 1. The feed hole 11 can be opened in the running film 1, and after the opening, the feed hole 11 can be used to feed the film as described above.

  The material of the substrate can be arbitrarily selected. The substrate may be a single leaf or a continuous substrate. The substrate may be a single layer or a laminate, and may be a hard substrate, a soft substrate, a rigid substrate, a flexible substrate, or a substrate that is not.

(Embodiment 2 of a method for manufacturing an insulating paint with a protective film or a photosensitive paint- coated printed wiring board)
Another example of the embodiment of the method for producing an insulating paint with a protective film or a photosensitive paint- coated printed wiring board according to the present invention will be described with reference to FIG. Also in the method for producing an insulating paint with a protective film or a photosensitive paint- coated printed wiring board according to this embodiment, the paint is applied to a part of the film 1 while the film 1 is running, and the film 1 is in a semi-dry state (raw dry). dried, paste the paint application surface of the film 1 to the substrate (not shown), and the method of the first embodiment in the subsequent to the point of coating of the substrate is dried is a method of producing a paint coating substrate Although common, different from the method of the first embodiment in the coating application method to the film 1.

In the present embodiment, the application of paint to the film 1 is shown in FIG. 2, by contacting a transition roll 5 and applicator roll 2, applying a coating material is coated or stored in paint application section 6 of the migration roll 5 applied to the roll 2 (transfer), it is rotated in contact with the film 1 in the running paint applicator roll 2 is carried out by a method of applying a coating R in the film 1 (or the single sheet or continuous substrate). In FIG. 2, the coating is applied to both surfaces of the film 1, but the insulating coating with a protective film or the method for manufacturing a printed wiring board with a photosensitive coating applied in this embodiment also applies the film 1 to the substrate. It is only necessary to apply the paint to the surface. In this case, the application roll 2 and the transfer roll 5 need only be provided on one side of the film 1.

  The coating roll 2 and the transfer roll 5 can be made of any material such as rubber, resin, metal, or ceramic. The transfer roll 5 may be the same as or different from the application roll 2 described in the first embodiment.

The coating material supply unit 4 in FIG. 2 is used as a coating material storage tank, and the coating material R in the coating material tank is attached to the transfer roll 7, and the transfer roll 7 is brought into rotational contact with the transfer roller 5, thereby attaching the coating material R to the transfer roller 5. , by the transition roll 5 rotates in contact with the applicator roll 2, the coating R migration roll 5 is applied to the applicator roll 2, are as its paint R is applied to the film 1 in the running. In this embodiment, taken migrated paint varnish coating unit 6 of the migration roll 5 is in uniform thickness, good to such coating thickness to be migrated to the coating roll 2 is uniform, For this purpose, for example, It is preferable to apply a squeegee 8 to the outer peripheral surface of the transfer roll 5 to equalize the paint to a uniform thickness.

Also in the second embodiment, the same film and substrate as those described in the first embodiment can be used. Also in the second embodiment, it is preferable that the contact surface 9a of the squeegee 9 is applied to the film 1 to which the paint has been applied so as to evenly level the film.

(Embodiment 3 of printed wiring board manufacturing method with insulating film or photosensitive paint with protective film )
Another example of the embodiment of the method for producing an insulating paint with a protective film or a photosensitive paint- coated printed wiring board according to the present invention will be described. The method for manufacturing a printed wiring board with an insulating paint or photosensitive paint applied with a film according to the present invention includes a method of applying a paint to the film 1 and attaching the film 1 to the substrate 20 in a semi-dry state as in the above embodiments. limited not, as shown in FIG. 3, during travel of the substrate 20, coating was applied to a portion of the substrate 20, dried in a semi-dry state (raw dry) and the coating in a semi-dry chamber 21, the A method of manufacturing an insulating paint with a protective film or a photosensitive paint- coated printed wiring board by attaching the film 1 to the paint- coated surface of the substrate 20 and then drying the paint on the substrate 20 can also be used. Applying the paint to the substrate 20, the contact as shown in FIG. 3, the method performed by rotating the contacted similar coating roll 2 and FIG. 1, as shown in FIG. 2, a transition roll 5 and applicator roll 2 by, migration roll 5 a coating is applied or stored in the varnish coating unit 6 is applied (transferred) to the coating roll 2, the method performed by rotating in contact with the substrate 20 of the paint in the travel of the applicator roll 2 Either can be performed.

In the method for manufacturing an insulating paint with a protective film or a printed wiring board coated with a photosensitive paint according to the present invention, the board 20 is allowed to run in the horizontal direction with its front and back surfaces oriented in the vertical direction (the board is laid down). It is. In the present embodiment, the substrate 20 travels in the same manner as in each of the embodiments described above, in which feed holes are opened at both ends in the width direction of the substrate 20 and rotating feed bodies such as feed rollers and feed belts provided with protrusions on the outer periphery are rotated. The substrate 20 can be automatically fed by inserting the projection into the feed hole during the rotation. The feed hole can be opened in the traveling substrate 20, and after the opening, the feed hole can be used for feeding as described above.

The substrate 20 to which the paint is applied may be continuous as shown in FIG. Further, the material of the substrate 20 can be arbitrarily selected. The substrate 20 may be a single layer or a laminate, and may be a hard one, a soft one, a rigid one, a flexible one, or another one. In addition, it is desirable that the coating material R applied to the substrate 20 has a uniform thickness. For this reason, it is preferable that the contact surface 9a of the squeegee 9 is applied to the film 1 to which the coating material has been applied, and the coating film R is uniformly leveled. In order to equalize the thickness uniformly, the contact surface 9a is preferably wide (see FIGS. 1 and 2).

  The material of the film to be attached to the substrate can be arbitrarily selected, and the film may be a single leaf separated from each other or continuous.

(Another embodiment of the method for manufacturing a printed wiring board with an insulating paint or a photosensitive paint coated with a protective film )
In the protective film with an insulating coating or photosensitive varnish coating printed wiring board manufacturing method of the present invention, the coating method for applying the film or substrate is not limited to those shown in FIG. 1 to FIG. 3, be by any method Can do. Thus, for example, as shown in FIG. 4, it includes contacting the transition roll 5 and applicator roll 2, directly attached to the paint R in the paint supply unit 4 to the transition roller 5, the paint application section 6 of the migration roll 5 It is also possible to apply (transfer) an applied or stored paint to the application roll 2 and rotate the paint on the application roll 2 to the traveling film 1 or substrate. Also, the number of rolls provided is not limited to that shown in FIGS. 1 to 4 and may be any number.

In the protective film with an insulating coating or photosensitive varnish coating printed wiring board manufacturing method of the present invention, by using a coating roll and migration roll paint application portion is not formed, it may also be coated with a coating material to the entire surface of the film or substrate . In that case, it is possible to manufacture an insulating paint with a protective film or a photosensitive paint- coated printed wiring board in which a paint is applied to the entire surface of the substrate.

In the method for producing an insulating paint with a protective film or a photosensitive paint- coated printed wiring board according to the present invention, the film can be attached to both surfaces of the substrate, or the film can be attached to only one surface. In addition, when a film is attached to both sides of the substrate, the film can be attached to both sides of the substrate at the same time, or can be attached with a time difference for each side.

  Further, the traveling direction of the film or the substrate is not limited to the upward direction in the vertical direction as shown in FIGS. 1 and 2, and can be traveled in an arbitrary direction. Therefore, for example, the substrate can be run vertically downward or obliquely. Further, as shown in FIG. 3, the substrate is run in the horizontal direction with the front and back surfaces of the substrate facing up and down (the substrate is laid down), or the front and back surfaces of the substrate are directed sideways (the substrate is erected). It can also be run in the horizontal direction. Moreover, the width direction end of the film 1 or a board | substrate can be made high, and the film 1 or a board | substrate can be inclined and can be carried in to the application | coating roll 2.

  Also, the traveling method of the film or substrate is the same as that of each of the embodiments described above. The method is not limited to the method in which the film or the substrate is automatically fed by rotating and inserting the projection into the feed hole during the rotation, and can be run by any method. Therefore, for example, without opening a feed hole in the film or substrate, a chucking chain or chucking conveyor is used to grip and run both ends in the width direction of the film or substrate, or a conveyor such as a belt conveyor or a roller conveyor. It can also be run by placing it on top.

(Embodiment 1 of paint coating roll)
The coating roll 2 of FIG. 1 has a coating application part 3 (FIG. 5) formed on a part of the outer peripheral surface of a roll made of various materials such as rubber, resin, metal, and ceramic. Painted portion 3 is one step recessed from the outer peripheral surface of the roll (to lower), are to be able to accumulate paint applied to the film and the substrate. The coating material application part 3 can have a desired shape such as a circuit pattern, a square, a thin rectangle, or a round shape. The coating material application part 3 can be formed in one place or two places or more on the outer peripheral surface of the roll. When forming in two or more places, it forms in the circumferential direction of an outer peripheral surface at intervals. The shape of the paint application part 3 formed in two or more places may be the same or different. The coating material application part 3 is preferably formed at the center in the width direction of the roll.

(Embodiment 2 of paint coating roll)
The paint coating roll 2 in FIG. 2 is made of various materials such as rubber and resin, and is the same as the conventional paint coating roll 2 of this type. The paint coating roll coating roll are cut groove on the outer peripheral surface 2 (Applicant is coated roll patented developed previously: Patent No. 3,253,273) using Toka, etc. those of other structures be able to.

(Embodiment of paint transfer roll)
In FIG. 2, a transfer roll 5 is used separately from the paint application roll. Similarly to the paint application roll 2 in FIG. 1, the transfer roll 5 has a paint application part 6 (FIG. 5) formed on a part of the outer peripheral surface of a roll made of various materials such as rubber, resin, metal, and ceramic. ing. The transition roller 5 are also painted section 6 or to or coated reservoir paint is formed on the outer peripheral surface, it moves the paint of the paint application section 6 to the applicator roll 2 in FIG. 2, the film and the coating roll 2 by rotating contact or the substrate are to be coated migrated paint applicator roll 2 on the film and the substrate. Paint application section 6 of the migration roll 5 of Figure 2 also stage recessed from the outer peripheral surface of the roll as shown in FIG. 5 (and lower), it is to be able to accumulate paint applied to the film and the substrate. The paint application part 6 can also have a circuit pattern or a desired shape such as a square, a thin rectangle, or a round shape. The coating material application part 6 can be formed in one place or two places or more on the outer peripheral surface of the roll 5. When forming in two or more places, it forms in the circumferential direction of an outer peripheral surface at intervals. The shape of the paint application part 6 formed in two or more places may be the same or different. It is preferable to form the coating material application part 6 in the center part of the width direction of a roll.

(Embodiment 1 of an insulating paint with a protective film or a printed wiring board coated with photosensitive paint )
Insulating paint with film or photosensitive paint- coated printed wiring board is produced by the above-mentioned insulating paint with photosensitive film or photosensitive paint- coated printed wiring board manufacturing method, and the paint is applied to a part of both sides of the board, The paint is covered with the film 1 superimposed on the substrate. Protective film with an insulating coating or photosensitive varnish coating printed circuit board of the present invention can also be pasted film 1 by applying a coating only on one surface of the substrate. Moreover, a coating material can also be apply | coated to the both surfaces of a board | substrate, or the whole surface of one side.

Explanatory drawing which shows an example of the coating application to the film in the insulating paint with a protective film of this invention, or the photosensitive paint application printed wiring board manufacturing method. Explanatory drawing which shows another example of the coating application to the film in the insulating paint with a protective film of this invention, or the photosensitive paint application printed wiring board manufacturing method. Explanatory drawing which shows another example of embodiment of the insulating paint with a protective film of this invention, or the photosensitive paint application printed wiring board manufacturing method. Explanatory drawing which shows another example of the coating application to the film in the insulating paint with a protective film of this invention, or the photosensitive paint application printed wiring board manufacturing method. (A) is a perspective view which shows an example of the coating- coating roll and coating-material transfer roll which are used for the insulating paint with a protective film of this invention or the photosensitive-coating application printed wiring board manufacturing method, (b) is AA of (a). Sectional drawing. (A) is a front view which shows an example of the film by which the coating material was apply | coated by the coating- material application | coating to the film in the insulating-paint with a protective film of this invention, or the photosensitive paint application printed wiring board manufacturing method, (b) is a side view of the film.

Explanation of symbols

1 Film 2 coating roll 3 painted portion 7 transfer roll 8,9 squeegee 11 of the paint application section 4 paint supply unit 5 shifts the roll 6 proceeds roll of the coating roll feed hole 20 substrate 21 semidry chamber R paints

Claims (4)

The coating roll is brought into rotational contact with the surface of the traveling single-leaf or continuous printed wiring board that adheres to the film , or the surface of the traveling film that adheres to the single-leaf or continuous printed wiring board. A photosensitive paint is applied, the insulating paint or the photosensitive paint is semi-dried by a drying device while the printed wiring board or the film is running, and the insulating paint or the photosensitive paint applied surface of the running printed wiring board is a film or The insulating paint or photosensitive paint application surface of the running film is bonded to the printed wiring board, the bonded film and the printed wiring board are pressed and adhered , and the bonded printed wiring board and the film are pressed or pressed tightly. Cut the film to fit the dimensions of the printed circuit board after wearing or after completely drying the printed circuit board and the film that has been pressed and adhered. , Bonding printed wiring board and the film was left adhered to with a protective film, characterized in that to be able to protect the insulating paint or photosensitive varnish coating surface of the printed wiring board to the film as a protective film insulating coating or photosensitive A method of manufacturing a printed wiring board with paint applied. In the method for manufacturing an insulating paint or photosensitive paint- coated printed wiring board with a protective film according to claim 1, the coating roll is brought into rotational contact with the transfer roll to transfer the insulating paint or the photosensitive paint from the transfer roll to the outer peripheral surface of the application roll , Insulating paint or photosensitive paint- coated print with protective film, characterized in that the coating roll is rotated and brought into contact with the running film or single-sheet or continuous printed wiring board to apply the insulating paint or photosensitive paint to the film or printed wiring board. Wiring board manufacturing method. Protective films according to claim 1 or claim 2 protective film with an insulating coating or photosensitive varnish coating printed wiring board manufacturing method according, characterized by performing the bonding and pressure compaction bonding of the printed wiring board and the film in a vacuum sticking formula A method for manufacturing a printed wiring board with a coated insulating paint or photosensitive paint . 4. A method for manufacturing a printed wiring board with an insulating paint or a photosensitive paint coated with a protective film according to claim 1 , wherein feed holes are opened at both ends in the width direction of the film or / and the printed wiring board, and are projected on the outer periphery. Rotating a rotary feed body such as a feed roller or a feed belt provided with a roller, and inserting the projection into a feed hole during the rotation to automatically feed the film or / and the printed wiring board to run. A method for producing an insulating paint with a protective film or a photosensitive paint- coated printed wiring board.

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