JP2008177371A - Method of manufacturing circuit board - Google Patents

Method of manufacturing circuit board Download PDF

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Publication number
JP2008177371A
JP2008177371A JP2007009597A JP2007009597A JP2008177371A JP 2008177371 A JP2008177371 A JP 2008177371A JP 2007009597 A JP2007009597 A JP 2007009597A JP 2007009597 A JP2007009597 A JP 2007009597A JP 2008177371 A JP2008177371 A JP 2008177371A
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Prior art keywords
circuit board
circuit
circuit chip
uncured
sheet
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JP2007009597A
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Inventor
Hideki Matsumura
英樹 松村
Keisuke Ohira
圭介 大平
Ryohei Ishizuka
良平 石塚
Masahito Nakabayashi
正仁 中林
Tadashi Izumi
直史 泉
Tatsuo Fukuda
達夫 福田
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Lintec Corp
Japan Advanced Institute of Science and Technology
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Lintec Corp
Japan Advanced Institute of Science and Technology
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Priority to JP2007009597A priority Critical patent/JP2008177371A/en
Priority to TW97101784A priority patent/TW200843582A/en
Priority to PCT/JP2008/050480 priority patent/WO2008087997A1/en
Publication of JP2008177371A publication Critical patent/JP2008177371A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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  • Manufacturing Of Printed Wiring (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technique which can inexpensively arrange a circuit chip on a circuit board sheet in an easy and simple manner to manufacture a display circuit board having the circuit chip buried therein in an easy and simple manner with a high yield for controlling respective display pixels. <P>SOLUTION: In the method of manufacturing a circuit board by transferring a predetermined number of circuit chips on a circuit board sheet from a circuit chip holder member for holding the circuit chips thereon, locations for transfer of the predetermined number of circuit chips are selectively set for adhesion parts. The circuit board is manufactured by selectively arranging unset adhesion parts on an unset layer of the circuit board sheet and arranging the predetermined number of circuit chips on the surface thereof. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、回路チップを保持している回路チップ保持部材から、直接、所要数の回路チップを回路基板シートの表面に転写により配置させることのできる回路基板の製造方法に関するものである。   The present invention relates to a method of manufacturing a circuit board in which a required number of circuit chips can be directly arranged on a surface of a circuit board sheet from a circuit chip holding member holding the circuit chips.

液晶ディスプレイ、有機ＥＬディスプレイ等のディスプレイを構成する回路基板には、ディスプレイの各画素を制御するための微小電子デバイスが配置されるとともに、各微小電子デバイスの入出力信号を伝達する回路が形成されている。従来、この回路基板においては、微小電子デバイスは、ガラス製の回路基板上に直接その場で作製することにより、配置されている。すなわち、ガラス基板上に、ＣＶＤ（化学気相堆積）法などの真空技術を用いて、絶縁膜、半導体膜などを順次に積層し、これらの堆積膜に、半導体集積回路の作製工程と同様の工程を適用して、薄膜トランジスタ（ＴＦＴ）などの微小電子デバイスを形成している。これらの微小電子デバイスは、各画素の近傍に形成され、各画素のオン、オフ、濃淡などの制御を行って、ディスプレイ上の画像形成を実現している。   A circuit board constituting a display such as a liquid crystal display or an organic EL display is provided with a microelectronic device for controlling each pixel of the display and a circuit for transmitting an input / output signal of each microelectronic device. ing. Conventionally, in this circuit board, the microelectronic device is arranged on the circuit board made of glass directly by in-situ production. That is, an insulating film, a semiconductor film, and the like are sequentially stacked on a glass substrate by using a vacuum technique such as a CVD (chemical vapor deposition) method, and the same process as that for manufacturing a semiconductor integrated circuit is performed on these deposited films. By applying the process, a microelectronic device such as a thin film transistor (TFT) is formed. These microelectronic devices are formed in the vicinity of each pixel, and control of on / off, shading, etc. of each pixel is performed to realize image formation on the display.

近年、ディスプレイに対して４０インチ〜１００インチという大画面化が望まれ、市販されるに至っているが、前述のガラス基板と真空技術を用いた多段階工程を要する回路基板作製方法がネックとなり、コストの削減が困難となっている。大画面ディスプレイが広く用いられるためには、コスト削減が必須であり、大画面ディスプレイの製造コストを低減可能な回路基板の作製方法が模索されている。   In recent years, a display with a large screen of 40 inches to 100 inches has been desired for the display, and it has come to be marketed. However, a circuit board manufacturing method that requires a multi-step process using the glass substrate and the vacuum technology described above becomes a bottleneck, Cost reduction has become difficult. In order for a large screen display to be widely used, cost reduction is indispensable, and a circuit board manufacturing method capable of reducing the manufacturing cost of the large screen display is being sought.

大画面ディスプレイに対する前述のコスト削減の要望に対して、最近、新たな技術が提案されている（特許文献１）。この特許文献１に開示の技術は、微小電子デバイスとして別途作製した回路チップを用い、回路基板として安価で軽量なプラスチック基板を用い、印刷技術を適用して前記回路チップを前記プラスチック基板上に配置するとともに回路を作製することにより、大画面ディスプレイを安価に提供可能とする優れた技術である。   Recently, a new technology has been proposed in response to the above-mentioned demand for cost reduction for large-screen displays (Patent Document 1). The technique disclosed in Patent Document 1 uses a circuit chip separately manufactured as a microelectronic device, uses an inexpensive and lightweight plastic substrate as a circuit board, and applies the printing technique to arrange the circuit chip on the plastic substrate. In addition, it is an excellent technology that can provide a large-screen display at low cost by producing a circuit.

特開２００３−２４８４３６号公報JP 2003-248436 A

前記特許文献１に開示の技術においては、プラスチック基板上の所要位置に回路チップを配置するための穴を予め空けておく。一方では、回路チップの表面に磁気に感応するニッケル膜を積層しておく。これらニッケル膜を有する所要数の回路チップを所定のパターンに従って磁気的に吸着し、これら回路チップを一度に前記プラスチック基板上の穴に嵌め込み、配線パターンを形成する。   In the technique disclosed in Patent Document 1, a hole for arranging a circuit chip is formed in advance at a required position on a plastic substrate. On the other hand, a nickel film sensitive to magnetism is laminated on the surface of the circuit chip. A required number of circuit chips having the nickel film are magnetically attracted according to a predetermined pattern, and these circuit chips are fitted into holes on the plastic substrate at a time to form a wiring pattern.

前記従来の技術では、プラスチック基板上に回路チップの穴を予め空けておく必要がある。この回路基板シートの調製工程を削減できれば、さらに工数の削減、コストの削減が可能となる。   In the conventional technique, it is necessary to make a hole for a circuit chip on a plastic substrate in advance. If the circuit board sheet preparation process can be reduced, the man-hours and costs can be further reduced.

また、前記従来の技術では、回路チップを別途作製することで、回路基板として安価なプラスチック回路基板シートの使用を可能にしているが、別途作製した回路チップを回路基板シートに配置するために、磁気吸着を利用しており、そのために回路チップ表面に予めニッケル膜を形成しておく必要がある。また、回路チップを回路基板シートに配置した後に、回路チップの表面からニッケル膜を除去する必要がある。配置後の回路チップからニッケル膜を除去するには、塩酸溶液を用いたウェットエッチングを実施しなければならない。そのウェットエッチング処理により、回路チップ自体の回路や、回路チップ周辺の配線回路が劣化されるおそれがある。かかる回路チップへのニッケル膜の形成及び削除のために要するプロセスが不要となれば、さらにディスプレイ用の回路基板の製造工程、コストを削減することができる。したがって、従来の技術において、好ましくは、エッチング処理を不要とするプロセス、換言すれば、磁気手段に依存しない新たな回路チップ転写技術が望まれる。   In addition, in the conventional technique, it is possible to use an inexpensive plastic circuit board sheet as a circuit board by separately producing a circuit chip, but in order to place the separately produced circuit chip on the circuit board sheet, Magnetic adsorption is used, and for this purpose, it is necessary to form a nickel film in advance on the surface of the circuit chip. Further, after the circuit chip is arranged on the circuit board sheet, it is necessary to remove the nickel film from the surface of the circuit chip. In order to remove the nickel film from the circuit chip after the placement, wet etching using a hydrochloric acid solution must be performed. The wet etching process may deteriorate the circuit of the circuit chip itself and the wiring circuit around the circuit chip. If the process required for forming and deleting the nickel film on the circuit chip is not necessary, the manufacturing process and cost of the circuit board for display can be further reduced. Therefore, in the conventional technique, a process that does not require an etching process, in other words, a new circuit chip transfer technique that does not depend on magnetic means is desired.

本発明は、上記事情に鑑みてなされたものであって、その課題は、ディスプレイ用の各画素を制御するための回路チップが埋め込まれたディスプレイ用回路基板を簡易かつ高収率に作製するために、回路チップを回路基板シートに簡便かつ安価に配置することができる技術を提供することにある。   The present invention has been made in view of the above circumstances, and its object is to easily and easily produce a display circuit board in which a circuit chip for controlling each pixel for display is embedded. Another object is to provide a technique capable of simply and inexpensively arranging a circuit chip on a circuit board sheet.

前記課題を解決するために、本発明にかかる回路基板は、回路チップを保持している回路チップ保持部材から、所要数の回路チップを選択的に回路基板シートの表面に転写させる回路基板の製造方法であって、前記所要数の回路チップを転写する回路基板シートの転写箇所を選択的に粘着部と設定することを特徴とする。   In order to solve the above problems, a circuit board according to the present invention is a circuit board manufacturing method in which a required number of circuit chips are selectively transferred from the circuit chip holding member holding the circuit chips to the surface of the circuit board sheet. A method is characterized in that a transfer portion of a circuit board sheet to which the required number of circuit chips are transferred is selectively set as an adhesive portion.

前記回路チップ保持部材としては、回路チップを保持しているものであれば、いかなるものでも良いが、通常は、粘着テープが好適に用いられる。   The circuit chip holding member may be any member as long as it holds the circuit chip, but usually an adhesive tape is preferably used.

本発明にかかる回路基板の製造方法は、活性エネルギー線硬化性樹脂から構成した未硬化層を有する回路基板シートの前記未硬化層に活性エネルギー線を照射して硬化非粘着部と未硬化粘着部とを選択的に形成する未硬化粘着部形成工程と、前記未硬化粘着部と硬化非粘着部とが選択的に形成された回路基板シートに、回路チップを保持している回路チップ保持部材の回路チップ配列面を当接させて、前記回路基板シートの未硬化粘着部の表面に回路チップを付着させる工程と、前記回路基板シートから回路チップ保持部材を剥離することにより、前記回路基板シートの未硬化粘着部に回路チップを転写させる工程と、を有することを特徴とする。   A method for producing a circuit board according to the present invention includes a cured non-adhesive part and an uncured adhesive part obtained by irradiating an active energy ray to the uncured layer of a circuit board sheet having an uncured layer composed of an active energy ray-curable resin. An uncured adhesive portion forming step for selectively forming a circuit chip holding member that holds a circuit chip on a circuit board sheet on which the uncured adhesive portion and the cured non-adhesive portion are selectively formed Contacting the circuit chip array surface and attaching the circuit chip to the surface of the uncured adhesive portion of the circuit board sheet; and peeling the circuit chip holding member from the circuit board sheet, And a step of transferring the circuit chip to the uncured adhesive portion.

前記未硬化粘着部形成工程において、選択的に活性エネルギー線を遮蔽するマスクを前記回路基板シートの未硬化層上に貼合し、前記マスクを貼合した側から活性エネルギー線を前記未硬化層に照射することにより、前記未硬化粘着部と硬化非粘着部とを選択的に形成しても良い。   In the uncured adhesive portion forming step, a mask that selectively blocks active energy rays is bonded onto the uncured layer of the circuit board sheet, and the active energy rays are applied to the uncured layer from the side on which the mask is bonded. May be used to selectively form the uncured adhesive portion and the cured non-adhesive portion.

前記未硬化粘着部形成工程において、選択的に開口部を設けたシートを前記回路基板シートの未硬化層上に貼合し、活性エネルギー線を前記未硬化層に照射することにより、前記未硬化粘着部と硬化非粘着部とを選択的に形成しても良い。   In the uncured adhesive portion forming step, the uncured layer is selectively bonded to the uncured layer of the circuit board sheet, and the uncured layer is irradiated with active energy rays to thereby uncured the uncured layer. An adhesive part and a cured non-adhesive part may be selectively formed.

前記回路基板の製造方法において、未硬化粘着部が矩形であり、縦横方向それぞれ（回路チップ幅）超で、（回路チップ幅＋前記回路チップ保持部材における隣接回路チップ間隔×２＋回路チップ幅の１／２）以下のサイズに設定することが、望ましい。   In the method for manufacturing a circuit board, the uncured adhesive portion is rectangular, each of which exceeds (circuit chip width) in each of the vertical and horizontal directions, and (circuit chip width + adjacent circuit chip interval in the circuit chip holding member × 2 + circuit chip width 1) / 2) It is desirable to set the following size.

本発明によれば、回路チップを保持している回路チップ保持部材から、直接、所要数の回路チップを回路基板シートの表面に転写により配置させることのできる回路基板シートへの回路チップの配置方法および回路基板の製造方法を提供することができる。本発明の回路基板の製造方法では、別途に形成する回路チップにニッケル被膜形成などの特別な処理を施さず、使用材料の粘着力を利用して転写する技術を用いている。従って、本発明の回路基板の製造方法を用いることにより、ニッケル被膜除去に必要となるエッチング液などの処理薬剤が不要となり、安全、かつ高収率に大型ディスプレイ用回路基板を作製することが可能となる。   According to the present invention, a method for arranging circuit chips on a circuit board sheet, in which a required number of circuit chips can be directly arranged on the surface of the circuit board sheet from a circuit chip holding member holding the circuit chips. In addition, a method for manufacturing a circuit board can be provided. In the method for manufacturing a circuit board according to the present invention, a technique is used in which a circuit chip separately formed is not subjected to a special treatment such as nickel coating, but is transferred using the adhesive force of the material used. Therefore, by using the circuit board manufacturing method of the present invention, a processing agent such as an etching solution necessary for removing the nickel coating is not required, and a circuit board for a large display can be produced safely and with a high yield. It becomes.

（活性エネルギー線硬化性樹脂）
本発明の回路基板シートを構成する材料は、その表面に選択的に粘着部が設定でき、硬化処理により硬化する材料であれば、特に制限されないが、活性エネルギー線硬化性樹脂を好適に用いることができる。 (Active energy ray curable resin)
The material constituting the circuit board sheet of the present invention is not particularly limited as long as the adhesive portion can be selectively set on the surface and can be cured by a curing process, but an active energy ray curable resin is preferably used. Can do.

本発明の回路基板シートを構成する活性エネルギー線硬化性樹脂は、紫外線、電子線等の活性エネルギー線を照射することにより、重合、硬化する樹脂である。   The active energy ray-curable resin constituting the circuit board sheet of the present invention is a resin that is polymerized and cured by irradiation with active energy rays such as ultraviolet rays and electron beams.

本発明で用いる前記活性エネルギー線硬化性樹脂としては、例えば、（１）アクリル系重合体と活性エネルギー線重合性オリゴマーおよび／または重合性モノマーと所望により光重合開始剤を含む樹脂、（２）側鎖に重合性不飽和基を有する活性エネルギー線硬化性官能基が導入されてなるアクリル系重合体と所望により光重合開始剤を含む樹脂などを挙げることができる。   Examples of the active energy ray-curable resin used in the present invention include (1) a resin containing an acrylic polymer, an active energy ray-polymerizable oligomer and / or a polymerizable monomer, and, if desired, a photopolymerization initiator, (2) Examples thereof include an acrylic polymer into which an active energy ray-curable functional group having a polymerizable unsaturated group in the side chain is introduced, and a resin containing a photopolymerization initiator as required.

前記（１）の樹脂において、アクリル系重合体としては、エステル部分のアルキル基の炭素数が１〜２０の（メタ）アクリル酸エステルと、所望により用いられる活性水素を持つ官能基を有する単量体および他の単量体との共重合体、すなわち（メタ）アクリル酸エステル共重合体を好ましくは挙げることができる。   In the resin (1), the acrylic polymer is a single monomer having a functional group having an active hydrogen and a (meth) acrylic acid ester having an alkyl group of 1 to 20 carbon atoms in the ester moiety. And a copolymer with other monomers, that is, a (meth) acrylic acid ester copolymer can be preferably mentioned.

ここで、エステル部分のアルキル基の炭素数が１〜２０の（メタ）アクリル酸エステルの例としては、（メタ）アクリル酸メチル、（メタ）アクリル酸エチル、（メタ）アクリル酸プロピル、（メタ）アクリル酸ブチル、（メタ）アクリル酸ペンチル、（メタ）アクリル酸ヘキシル、（メタ）アクリル酸シクロヘキシル、（メタ）アクリル酸２−エチルヘキシル、（メタ）アクリル酸イソオクチル、（メタ）アクリル酸パルミチル、（メタ）アクリル酸ステアリルなどが挙げられる。これらは１種を単独で用いても良いし、２種以上を組み合わせて用いても良い。   Here, examples of the (meth) acrylic acid ester having 1 to 20 carbon atoms of the alkyl group in the ester portion include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, (meth ) Butyl acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, cyclohexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, palmityl (meth) acrylate, ( Examples include stearyl methacrylate. These may be used alone or in combination of two or more.

一方、所望により用いられる活性水素を持つ官能基を有する単量体の例としては、（メタ）アクリル酸２−ヒドロキシエチル、（メタ）アクリル酸２−ヒドロキシプロピル、（メタ）アクリル酸３−ヒドロキシプロピル、（メタ）アクリル酸２−ヒドロキシブチル、（メタ）アクリル酸３−ヒドロキシブチル、（メタ）アクリル酸４−ヒドロキシブチルなどの（メタ）アクリル酸ヒドロキシアルキルエステル；（メタ）アクリル酸モノメチルアミノエチル、（メタ）アクリル酸モノエチルアミノプロピルなどの（メタ）アクリル酸モノアルキルアミノアルキル；アクリル酸、メタクリル酸、クロトン酸、マレイン酸、イタコン酸、シトラコン酸などのエチレン性不飽和カルボン酸などが挙げられる。これらの単量体は１種を単独で用いても良いし、２種以上を組み合わせて用いても良い。   On the other hand, examples of the monomer having a functional group having active hydrogen that is used as desired include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 3-hydroxy (meth) acrylate. (Meth) acrylic acid hydroxyalkyl esters such as propyl, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate; monomethylaminoethyl (meth) acrylate Monoalkylaminoalkyl (meth) acrylates such as monoethylaminopropyl (meth) acrylate; ethylenically unsaturated carboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, itaconic acid, citraconic acid, etc. It is done. These monomers may be used individually by 1 type, and may be used in combination of 2 or more type.

（メタ）アクリル酸エステル共重合体中、（メタ）アクリル酸エステルは５〜１００重量％、好ましくは５０〜９５重量％含有され、活性水素を持つ官能基を有する単量体は０〜９５重量％、好ましくは５〜５０重量％含有される。   In the (meth) acrylic acid ester copolymer, the (meth) acrylic acid ester is contained in an amount of 5 to 100% by weight, preferably 50 to 95% by weight, and the monomer having a functional group having active hydrogen is 0 to 95% by weight. %, Preferably 5 to 50% by weight.

また、所望により用いられる他の単量体の例としては、酢酸ビニル、プロピオン酸ビニルなどのビニルエステル類；エチレン、プロピレン、イソブチレンなどのオレフィン類；塩化ビニル、ビニリデンクロリドなどのハロゲン化オレフィン類；スチレン、α−メチルスチレンなどのスチレン系単量体；ブタジェン、イソプレン、クロロプレンなどのジエン系単量体；アクリロニトリル、メタクリロニトリルなどのニトリル系単量体；アクリルアミド、Ｎ−メチルアクリルアミド、Ｎ，Ｎ−ジメチルアクリルアミドなどのアクリルアミド類などが挙げられる。これらは１種を単独で用いても良いし、２種以上を組み合わせて用いても良い。（メタ）アクリル酸エステル共重合体中、これらの単量体は、０〜３０重量％含有することができる。   Examples of other monomers used as desired include vinyl esters such as vinyl acetate and vinyl propionate; olefins such as ethylene, propylene and isobutylene; halogenated olefins such as vinyl chloride and vinylidene chloride; Styrene monomers such as styrene and α-methylstyrene; Diene monomers such as butadiene, isoprene and chloroprene; Nitrile monomers such as acrylonitrile and methacrylonitrile; Acrylamide, N-methylacrylamide, N, N -Examples include acrylamides such as dimethylacrylamide. These may be used alone or in combination of two or more. These monomers can be contained in the (meth) acrylic acid ester copolymer in an amount of 0 to 30% by weight.

該樹脂において、アクリル系重合体として用いられる（メタ）アクリル酸エステル系共重合体は、その共重合形態については特に制限はなく、ランダム、ブロック、グラフト共重合体のいずれであっても良い。また、分子量は、重量平均分子量で３０万以上が好ましい。   In the resin, the (meth) acrylic acid ester copolymer used as the acrylic polymer is not particularly limited with respect to the copolymerization form, and may be any of random, block, and graft copolymers. The molecular weight is preferably 300,000 or more in terms of weight average molecular weight.

なお、上記重量平均分子量は、ゲルパーミエーションクロマトグラフィー（ＧＰＣ）法により測定したポリスチレン換算の値である。   In addition, the said weight average molecular weight is the value of polystyrene conversion measured by the gel permeation chromatography (GPC) method.

本発明においては、この（メタ）アクリル酸エステル系共重合体は１種を単独で用いても良いし、２種以上を組み合わせて用いても良い。   In the present invention, this (meth) acrylic ester copolymer may be used alone or in combination of two or more.

また、活性エネルギー線重合性オリゴマーとしては、例えば、ポリエステルアクリレート系、エポキシアクリレート系、ウレタンアクリレート系、ポリエーテルアクリレート系、ポリブタジェンアクリレート系、シリコーンアクリレート系などが挙げられる。   Examples of the active energy ray polymerizable oligomer include polyester acrylate, epoxy acrylate, urethane acrylate, polyether acrylate, polybutadiene acrylate, and silicone acrylate.

上記重合性オリゴマーの重量平均分子量は、ＧＰＣ法で測定した標準ポリスチレン換算の値で、好ましくは５００〜１００，０００、より好ましくは１，０００〜７０，０００、さらに好ましくは３，０００〜４０，０００の範囲で選定される。   The weight average molecular weight of the polymerizable oligomer is a value in terms of standard polystyrene measured by GPC method, preferably 500 to 100,000, more preferably 1,000 to 70,000, and still more preferably 3,000 to 40,000. 000 is selected.

この重合性オリゴマーは、１種を単独で用いても良いし、２種以上を組み合わせて用いても良い。   This polymerizable oligomer may be used individually by 1 type, and may be used in combination of 2 or more type.

一方、活性エネルギー線重合性モノマーとしては、例えば、（メタ）アクリル酸シクロヘキシル、（メタ）アクリル酸２−エチルヘキシル、（メタ）アクリル酸モルホリン、（メタ）アクリル酸イソボニルなどの単官能性アクリル酸エステル類、ジ（メタ）アクリル酸１，４−ブタンジオールエステル、ジ（メタ）アクリル酸１，６−ヘキサンジオールエステル、ジ（メタ）アクリル酸ネオペンチルグリコールエステル、ジ（メタ）アクリル酸ポリエチレングリコールエステル、ジ（メタ）アクリル酸ネオペンチルグリコールアジペートエステル、ジ（メタ）アクリル酸ヒドロキシピバリン酸ネオペンチルグリコールエステル、ジ（メタ）アクリル酸ジシクロペンタニル、ジ（メタ）アクリル酸カプロラクトン変性ジジクロペンテニル、ジ（メタ）アクリル酸エチレンオキシド変性リン酸エステル、ジ（メタ）アクリル酸アリル化シクロヘキシル、ジ（メタ）アクリル酸イソシアヌレート、トリ（メタ）アクリル酸トリメチロールプロパンエステル、トリ（メタ）アクリル酸ジペンタエリスリトールエステル、トリ（メタ）アクリル酸ペンタエリスリトールエステル、トリ（メタ）アクリル酸プロピレンオキシド変性トリメチロールプロパンエステル、イソシアヌル酸トリス（アクリロキシエチル）、ペンタ（メタ）アクリル酸プロピオン酸変性ジペンタエリスリトールエステル、ヘキサ（メタ）アクリル酸ジペンタエリスリトールエステル、ヘキサ（メタ）アクリル酸カプロラクトン変性ジペンタエリスリトールエステルなどが挙げられる。これらの重合性モノマーは１種を単独で用いても良いし、２種以上を組み合わせて用いても良い。   On the other hand, examples of the active energy ray polymerizable monomer include monofunctional acrylic esters such as cyclohexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, morpholine (meth) acrylate, and isobornyl (meth) acrylate. Di (meth) acrylic acid 1,4-butanediol ester, di (meth) acrylic acid 1,6-hexanediol ester, di (meth) acrylic acid neopentyl glycol ester, di (meth) acrylic acid polyethylene glycol ester , Di (meth) acrylic acid neopentyl glycol adipate ester, di (meth) acrylic acid hydroxypivalic acid neopentyl glycol ester, di (meth) acrylic acid dicyclopentanyl, di (meth) acrylic acid caprolactone-modified didiclopentenyl, Di ( T) Acrylic acid ethylene oxide modified phosphoric acid ester, di (meth) acrylic acid allylated cyclohexyl, di (meth) acrylic acid isocyanurate, tri (meth) acrylic acid trimethylolpropane ester, tri (meth) acrylic acid dipentaerythritol ester , Tri (meth) acrylic acid pentaerythritol ester, tri (meth) acrylic acid propylene oxide modified trimethylolpropane ester, isocyanuric acid tris (acryloxyethyl), penta (meth) acrylic acid propionic acid modified dipentaerythritol ester, hexa ( Examples thereof include (meth) acrylic acid dipentaerythritol ester and hexa (meth) acrylic acid caprolactone-modified dipentaerythritol ester. These polymerizable monomers may be used individually by 1 type, and may be used in combination of 2 or more type.

これらの重合性オリゴマーや重合性モノマーの使用量は、通常、（メタ）アクリル酸エステル共重合体の固形分１００重量部に対し、３〜５００重量部配合することができる。   The amount of these polymerizable oligomers and polymerizable monomers used can be usually 3 to 500 parts by weight based on 100 parts by weight of the solid content of the (meth) acrylic acid ester copolymer.

また、活性エネルギー線として、通常、紫外線または電子線が照射されるが、紫外線を照射する際には、光重合開始剤を用いる。この光重合開始剤としては、例えば、ベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル、ベンゾイン−ｎ−ブチルエーテル、ベンゾインイソブチルエーテル、アセトフェノン、ジメチルアミノアセトフェノン、２，２−ジメトキシ−１，２−ジフェニルエタン−１−オン、２，２−ジメトキシ−２−フェニルアセトフェノン、２，２−ジエトキシ−２−フェニルアセトフェノン、２−ヒドロキシ−２−メチル−１−フェニルプロパン−１−オン、１−ヒドロキシシクロヘキシルフェニルケトン、２−メチル−１−［４−（メチルチオ）フェニル］−２−モルフォリノ−プロパン−１−オン、４−（２−ヒドロキシエトキシ）フェニル−２（ヒドロキシ−２−プロプル）ケトン、ベンゾフェノン、ｐ−フェニルベンゾフェノン、４，４’−ジエチルアミノベンゾフェノン、ジクロロベンゾフェノン、２−メチルアントラキノン、２−エチルアントラキノン、２−ターシャリ−ブチルアントラキノン、２−アミノアントラキノン、２−メチルチオキサントン、２−エチルチオキサントン、２−クロロチオキサントン、２，４−ジメチルチオキサントン、２，４−ジエチルチオキサントン、ベンジルジメチルケタール、アセトフェノンジメチルケタール、アセトフェノンジメチルケタール、ｐ−ジメチルアミン安息香酸エステル、オリゴ（２−ヒドロキシ−２−メチル−１−［４−（１−プロペニル）フェニル］プロパノン）などが挙げられる。これらは、１種を単独で用いても良いし、２種以上を組み合わせて用いても良い。   Moreover, although an ultraviolet ray or an electron beam is normally irradiated as the active energy ray, a photopolymerization initiator is used when irradiating the ultraviolet ray. Examples of the photopolymerization initiator include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin-n-butyl ether, benzoin isobutyl ether, acetophenone, dimethylaminoacetophenone, 2,2-dimethoxy-1,2- Diphenylethane-1-one, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexyl Phenylketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propan-1-one, 4- (2-hydroxyethoxy) phenyl-2 (hydroxy-2-propyl) ketone, Non, p-phenylbenzophenone, 4,4′-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 2-aminoanthraquinone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, benzyldimethyl ketal, acetophenone dimethyl ketal, acetophenone dimethyl ketal, p-dimethylamine benzoate, oligo (2-hydroxy-2-methyl-1 -[4- (1-propenyl) phenyl] propanone) and the like. These may be used individually by 1 type and may be used in combination of 2 or more type.

かかる光重合開始剤の配合量は、上述の活性エネルギー線硬化性樹脂の固形分１００重量部に対し、通常０．１〜１０重量部である。   The blending amount of the photopolymerization initiator is usually 0.1 to 10 parts by weight with respect to 100 parts by weight of the solid content of the above-mentioned active energy ray-curable resin.

次に、前記（２）の樹脂において、側鎖に重合性不飽和基を有する活性エネルギー線硬化性官能基が導入されてなるアクリル系重合体としては、例えば、前述した（メタ）アクリル酸エステル系重合体の側鎖に、−ＣＯＯＨ、−ＮＣＯ、エポキシ基、−ＯＨ、−ＮＨ2などの活性点を導入し、この活性点と重合性不飽和基を有する化合物を反応させて、該アクリル系重合体の側鎖に重合性不飽和基を有するエネルギー線硬化性官能基を導入してなるものを挙げることができる。 Next, as the acrylic polymer in which the active energy ray-curable functional group having a polymerizable unsaturated group is introduced into the side chain in the resin (2), for example, the above-mentioned (meth) acrylic acid ester is used. An active site such as —COOH, —NCO, epoxy group, —OH, —NH 2, etc. is introduced into the side chain of the polymer, and the active site is reacted with a compound having a polymerizable unsaturated group to produce the acrylic polymer. The thing formed by introduce | transducing the energy-beam curable functional group which has a polymerizable unsaturated group into the side chain of a type | system | group polymer can be mentioned.

アクリル系重合体に前記活性点を導入するには、該アクリル系重合体を製造する際に、−ＣＯＯＨ、−ＮＣＯ、エポキシ基、−ＯＨ、−ＮＨ2などの官能基と、重合性不飽和基とを有する単量体またはオリゴマーを反応系に共存させればよい。具体的には、前述の（１）の樹脂において説明したアクリル系重合体を製造する際に、−ＣＯＯＨ基を導入する場合には、（メタ）アクリル酸などを、−ＮＣＯ基を導入する場合には、２−（メタ）アクリロイルオキシエチルイソシアナートなどを、エポキシ基を導入する場合には、（メタ）アクリル酸グリシジルなどを、−ＯＨ基を導入する場合には、（メタ）アクリル酸２−ヒドロキシエチル、モノ（メタ）アクリル酸１，６−ヘキサンジオールエステルなどを、−ＮＨ2基を導入する場合には、Ｎ−メチル（メタ）アクリルアミドなどを用いればよい。 In order to introduce the active site into the acrylic polymer, when the acrylic polymer is produced, a functional group such as —COOH, —NCO, epoxy group, —OH, —NH 2 , and polymerizable unsaturated A monomer or oligomer having a group may be present in the reaction system. Specifically, when the -COOH group is introduced when the acrylic polymer described in the above-mentioned resin (1) is produced, (meth) acrylic acid or the like is introduced when the -NCO group is introduced. In the case of introducing 2- (meth) acryloyloxyethyl isocyanate and the like, in the case of introducing an epoxy group, glycidyl (meth) acrylate and the like, and in the case of introducing an -OH group, (meth) acrylic acid 2 - hydroxyethyl, and mono (meth) acrylic acid 1,6-hexanediol ester, when introducing the -NH 2 groups, or the like may be used N- methyl (meth) acrylamide.

これらの活性点と反応させる重合性不飽和基を有する化合物としては、例えば、２−（メタ）アクリロイルオキシエチルイソシアナート、（メタ）アクリル酸グリシジル、モノ（メタ）アクリル酸ペンタエリスリトールエステル、モノ（メタ）アクリル酸ジペンタエリスリトールエステル、モノ（メタ）アクリル酸ジペンタエリスリトールエステル、モノ（メタ）アクリル酸トリメチロールプロパンエステルなどの中から、活性点の種類に応じて、適宜選択して用いることができる。   Examples of the compound having a polymerizable unsaturated group to be reacted with these active sites include 2- (meth) acryloyloxyethyl isocyanate, glycidyl (meth) acrylate, mono (meth) acrylate pentaerythritol ester, mono ( It can be used by appropriately selecting from among dimethacrylic acid dipentaerythritol ester, mono (meth) acrylic acid dipentaerythritol ester, mono (meth) acrylic acid trimethylolpropane ester, etc. it can.

このようにして、アクリル系重合体の側鎖に、前記活性点を介して重合性不飽和基を有する活性エネルギー線硬化性官能基が導入されてなるアクリル系重合体、すなわち、（メタ）アクリル酸エステル共重合体が得られる。   Thus, an acrylic polymer in which an active energy ray-curable functional group having a polymerizable unsaturated group is introduced into the side chain of the acrylic polymer via the active site, that is, (meth) acrylic. An acid ester copolymer is obtained.

この活性エネルギー線硬化性官能基が導入された（メタ）アクリル酸エステル共重合体は、重量平均分子量が１００，０００以上のものが好ましく、特に３００，０００以上のものが好ましい。なお、上記重量平均分子量は、ＧＰＣ法により測定したポリスチレン換算の値である。   The (meth) acrylic acid ester copolymer into which the active energy ray-curable functional group is introduced preferably has a weight average molecular weight of 100,000 or more, more preferably 300,000 or more. In addition, the said weight average molecular weight is the value of polystyrene conversion measured by GPC method.

また、所望により用いられる光重合開始剤としては、前述の（１）の樹脂の説明において例示した光重合開始剤を用いることができる。   Moreover, as a photoinitiator used as needed, the photoinitiator illustrated in description of the resin of the above-mentioned (1) can be used.

前記の（１）および（２）の活性エネルギー線硬化性樹脂においては、本発明の効果が損なわれない範囲で、所望により、架橋剤、粘着付与剤、酸化防止剤、紫外線吸収剤、光安定剤、軟化剤、充填剤などを添加することができる。   In the active energy ray-curable resins (1) and (2), a crosslinking agent, a tackifier, an antioxidant, an ultraviolet absorber, and a light stabilizer are optionally added as long as the effects of the present invention are not impaired. Agents, softeners, fillers and the like can be added.

前記架橋剤としては、例えば、ポリイソシアナート化合物、エポキシ樹脂、メラミン樹脂、尿素樹脂、ジアルデヒド類、メチロールポリマー、アジリジン系化合物、金属キレート化合物、金属アルコキシド、金属塩などが挙げられるが、ポリイソシアナート化合物が好ましく用いられる。この架橋剤は、上述の（メタ）アクリル酸エステル共重合体の固形分１００重量部に対して、０〜３０重量部配合することができる。   Examples of the crosslinking agent include polyisocyanate compounds, epoxy resins, melamine resins, urea resins, dialdehydes, methylol polymers, aziridine compounds, metal chelate compounds, metal alkoxides, metal salts, and the like. A narate compound is preferably used. This crosslinking agent can be blended in an amount of 0 to 30 parts by weight with respect to 100 parts by weight of the solid content of the (meth) acrylic acid ester copolymer.

ここで、ポリイソシアナート化合物の例としては、トリレンジイソシアナート、ジフェニルメタンジイソシアナート、キシリレンジイソシアナートなどの芳香族ポリイソシアナート、ヘキサメチレンジイソシアナートなどの脂肪族ポリイソシアナート、イソホロンジイソシアナート、水素添加ジフェニルメタンジイソシアナートなどの脂環式ポリイソシアナートなど、およびそれらのビウレット体、イソシアヌレート体、さらにはエチレングリコール、ネオペンチルグリコール、トリメチロールプロパン、ヒマシ油などの低分子活性水素含有化合物との反応物であるアダクト体などを挙げることができる。これらの架橋剤は、１種を単独で用いても良く、２種以上を組み合わせて用いても良い。   Examples of polyisocyanate compounds include aromatic polyisocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate, and xylylene diisocyanate, aliphatic polyisocyanates such as hexamethylene diisocyanate, and isophorone diisocyanate. Contains alicyclic polyisocyanates such as nates, hydrogenated diphenylmethane diisocyanates, and their biurets, isocyanurates, and low molecular active hydrogens such as ethylene glycol, neopentyl glycol, trimethylolpropane, castor oil, etc. An adduct that is a reaction product with a compound can be used. These crosslinking agents may be used individually by 1 type, and may be used in combination of 2 or more type.

なお、前記（１）および（２）の活性エネルギー線硬化性樹脂は、（１）の活性エネルギー線硬化性樹脂に対し、（２）の側鎖に重合性不飽和基の活性エネルギー線硬化性基を有する（メタ）アクリル酸エステル共重合体を加えることができる。同様に（２）の活性エネルギー線硬化性樹脂に対し、（１）のアクリル系重合体、または活性エネルギー線重合性オリゴマーや活性エネルギー線重合性モノマーを加えることができる。また、所望により溶剤も添加させることができる。用いられる溶剤としては、前記の（１）および（２）の活性エネルギー線硬化性樹脂の溶解性が良好であり、前記（１）、（２）の樹脂に対して不活性な公知の溶剤の中から適宜選択して用いることができる。このような溶剤としては、例えば、トルエン、キシレン、メタノール、エタノール、イソブタノール、ｎ−ブタノール、アセトン、メチルエチルケトン、テトラヒドロフラン、酢酸エチルなどが挙げられる。これらは１種を単独で用いても良く、２種以上を組み合わせても良い。   The active energy ray-curable resins (1) and (2) are more active energy ray-curable with a polymerizable unsaturated group in the side chain (2) than the active energy ray-curable resin (1). A (meth) acrylic acid ester copolymer having a group can be added. Similarly, the acrylic polymer of (1), the active energy ray polymerizable oligomer, or the active energy ray polymerizable monomer can be added to the active energy ray curable resin of (2). Further, a solvent can be added as desired. As the solvent used, the active energy ray-curable resins (1) and (2) have good solubility, and are known solvents that are inert to the resins (1) and (2). It can be appropriately selected from among them. Examples of such a solvent include toluene, xylene, methanol, ethanol, isobutanol, n-butanol, acetone, methyl ethyl ketone, tetrahydrofuran, and ethyl acetate. These may be used alone or in combination of two or more.

なお、活性エネルギー線のうち、汎用性、経済性から紫外線が好ましく使用できる。紫外線を発生するランプとしては、高圧水銀ランプ、メタルハイドライトランプ、キセノンランプ、無電極紫外線ランプなどがある。紫外線の照射量としては、適宜選択されるが、例えば、光量は１〜１５００ｍＪ／ｃｍ2、照度は１０〜５００ｍＷ／ｃｍ2程度である。 Of the active energy rays, ultraviolet rays can be preferably used from the viewpoint of versatility and economy. Examples of the lamp that generates ultraviolet rays include a high-pressure mercury lamp, a metal hydride lamp, a xenon lamp, and an electrodeless ultraviolet lamp. The irradiation amount of ultraviolet rays is appropriately selected. For example, the light amount is 1-1500 mJ / cm 2 and the illuminance is about 10-500 mW / cm 2 .

本発明に使用する回路基板シートは、前記活性エネルギー線硬化性樹脂を用いて、以下のように形成することができる。   The circuit board sheet used in the present invention can be formed as follows using the active energy ray-curable resin.

（回路基板シートの形成）
前記活性エネルギー線硬化性樹脂の塗工液を調製し、この塗工液を、剥離基材の片面に剥離剤層が設けられた剥離シート（重剥離型剥離シート）の剥離処理面に、塗布し、塗工液が溶剤を含む場合は、加熱乾燥して、活性エネルギー線硬化性樹脂からなる未硬化層を形成する。前記塗布方法は、ナイフコーター、ロールコーター、バーコーター、ブレードコーター、グラビアコーターなどの方法で塗布し、室温〜１５０℃、好ましくは６０〜１３０℃、１〜１０分の条件で乾燥させる。また、剥離シートは公知のものが使用でき、ポリエチレンフィルムや、ポリプロピレンフィルム、ポリエチレンテレフタレートフィルム、ポリエチレンナフタレートフィルムなどのフィルムにシリコーン樹脂、アルキッド樹脂、長鎖アルキル樹脂などの剥離剤を塗布して剥離剤層を設けたものなどが挙げられる。この剥離シートの厚さは、通常、２０〜１５０μｍ程度である。 (Formation of circuit board sheet)
A coating solution of the active energy ray-curable resin is prepared, and this coating solution is applied to a release treatment surface of a release sheet (heavy release type release sheet) provided with a release agent layer on one side of a release substrate. And when a coating liquid contains a solvent, it heat-drys and forms the unhardened layer which consists of active energy ray hardening resin. The said coating method is apply | coated by methods, such as a knife coater, a roll coater, a bar coater, a blade coater, and a gravure coater, and it is made to dry on the conditions of room temperature-150 degreeC, Preferably 60-130 degreeC and 1 to 10 minutes. In addition, a known release sheet can be used, and a release agent such as a silicone resin, an alkyd resin, or a long chain alkyl resin is applied to a film such as a polyethylene film, a polypropylene film, a polyethylene terephthalate film, or a polyethylene naphthalate film to release the release sheet. The thing etc. which provided the agent layer are mentioned. The thickness of this release sheet is usually about 20 to 150 μm.

別に、同様にして、剥離基材の片面に剥離剤層が設けられてなる剥離シート（軽剥離型剥離シート）の剥離処理面に、前記塗工液を塗布し、塗工液が溶剤を含む場合は、加熱乾燥させ、活性エネルギー線硬化性樹脂からなる未硬化層を有するシートを製造する。なお、ここに使用する剥離シートの剥離力は、前記重剥離型剥離シートの剥離力より小さく設定されたものが使用される。   Separately, the coating liquid is applied to the release treatment surface of a release sheet (light release type release sheet) in which a release agent layer is provided on one side of the release substrate, and the coating liquid contains a solvent. In that case, a sheet having an uncured layer made of an active energy ray-curable resin is produced by heating and drying. In addition, what was set as the peeling force of the peeling sheet used here smaller than the peeling force of the said heavy peeling type release sheet is used.

前記重剥離型剥離シート上の未硬化層に、上記軽剥離型剥離シート上の未硬化層を積層し、軽剥離型剥離シートを剥離する。この積層工程を繰り返して、最終的に重剥離型剥離シートと軽剥離型剥離シートとにより挟まれた活性エネルギー線硬化性樹脂からなる所定厚さの未硬化層を有してなる回路基板シートを得る。前記未硬化層の厚さは、３０〜１０００μｍ、好ましくは５０〜５００μｍである。   The uncured layer on the light release type release sheet is laminated on the uncured layer on the heavy release type release sheet, and the light release type release sheet is peeled off. A circuit board sheet having an uncured layer having a predetermined thickness made of an active energy ray-curable resin, which is finally sandwiched between a heavy release type release sheet and a light release type release sheet, by repeating this lamination process obtain. The uncured layer has a thickness of 30 to 1000 μm, preferably 50 to 500 μm.

前記活性エネルギー線硬化性樹脂からなる未硬化層は、紫外線などの活性エネルギー線が照射されるまで、未硬化状態にあり、表面には粘着性がある。従って、この未硬化層の活性エネルギー線硬化性を利用して選択的に未硬化部と硬化部を形成することができる。未硬化部は粘着性を有し、硬化部は粘着性を有しない。未硬化粘着部を選択的に形成し、得られた未硬化粘着部の表面に回路チップを当接させて回路チップを回路基板シート上の所要位置に転写させる。   The uncured layer made of the active energy ray-curable resin is in an uncured state until the active energy ray such as ultraviolet rays is irradiated, and the surface is sticky. Therefore, the uncured portion and the cured portion can be selectively formed by utilizing the active energy ray curability of the uncured layer. The uncured part has tackiness, and the cured part has no tackiness. An uncured adhesive portion is selectively formed, and the circuit chip is brought into contact with the surface of the obtained uncured adhesive portion to transfer the circuit chip to a required position on the circuit board sheet.

前記回路基板シートに未硬化粘着部を選択的に形成する時期は、回路基板シートを回路チップ保持部材上の回路チップ配列面に当接させる前、あるいは回路チップ配列面に当接させた後でもよい。回路チップ保持部材としては、粘着テープ、より具体的には、ダイシングテープ等が挙げられる。   The time when the uncured adhesive portion is selectively formed on the circuit board sheet is before the circuit board sheet is brought into contact with the circuit chip arrangement surface on the circuit chip holding member or after being brought into contact with the circuit chip arrangement surface. Good. Examples of the circuit chip holding member include an adhesive tape, more specifically, a dicing tape.

前記回路基板シートに未硬化粘着部を選択的に形成するには、主に二通りの方法がある。一つは、活性エネルギー線を選択的に遮蔽するマスクを未硬化層の上に置き、活性エネルギー線を照射し、照射した部分を硬化させ、マスクにより遮蔽された未照射部分を未硬化粘着部として残す方法である。前記活性エネルギー線を遮蔽するマスクとしては、石英ガラスなどの基板の上に遮蔽部分としてクロムなどの金属薄膜を形成したものが挙げられる。もう一つの方法は、ラジカル重合の場合、活性エネルギー線硬化性樹脂は酸素と接触すると、その硬化が阻害される現象を利用した方法である。すなわち、活性エネルギー線を透過するシートに選択的に開口部を設けたシートを未硬化層の上に置き、酸素を含む雰囲気（空気）下において、活性エネルギー線を照射すると、活性エネルギー線は未硬化層の全面に隈無く照射されるが、シートに覆われて酸素と接触しない他の部分は硬化し、開口部により酸素と接触した部分は酸素により硬化が阻害されて未硬化なままになるので、この現象を利用して、未硬化粘着部を選択的に形成する方法である。シートは、前記した剥離シートに孔を開けた孔開き剥離シートが挙げられる。孔を開ける方法は、熱針やレーザーなどの公知の方法で行うことができる。孔開き剥離シートの厚みは、通常２０〜１５０μｍ程度である。   There are mainly two methods for selectively forming the uncured adhesive portion on the circuit board sheet. One is to place a mask that selectively blocks active energy rays on the uncured layer, irradiate with active energy rays, cure the irradiated part, and uncured part shielded by the mask to uncured adhesive part. It is a way to leave as. Examples of the mask for shielding the active energy ray include a mask in which a metal thin film such as chromium is formed as a shielding portion on a substrate such as quartz glass. In the case of radical polymerization, another method is a method that utilizes the phenomenon that the curing of the active energy ray-curable resin is inhibited when it comes into contact with oxygen. That is, when a sheet that selectively transmits an active energy ray and a sheet provided with an opening is placed on the uncured layer and irradiated with an active energy ray in an oxygen-containing atmosphere (air), the active energy ray is not exposed. The entire surface of the cured layer is irradiated without any damage, but the other part that is covered with the sheet and does not come into contact with oxygen is cured, and the part that is in contact with oxygen through the opening is inhibited by oxygen and remains uncured. Therefore, this is a method of selectively forming an uncured adhesive portion by utilizing this phenomenon. Examples of the sheet include a perforated release sheet in which holes are formed in the above-described release sheet. The hole can be formed by a known method such as a hot needle or a laser. The thickness of the perforated release sheet is usually about 20 to 150 μm.

前記回路基板シートに選択的に形成する未硬化粘着部の表面のサイズは、未硬化粘着部の粘着力と、回路チップ保持部材（粘着テープ）の粘着力と、そして、転写しようとしている回路チップのサイズと、転写元の回路チップ保持部材上の回路チップの配列間隔とによって変動する。各部材の粘着力は、概ね、回路チップ保持部材の粘着力＜回路基板シートの未硬化粘着部の粘着力に設定されていれば、良い。このような前提で、回路基板シートの粘着部の矩形のサイズは、回路チップ保持部材上の配列間隔を基準とすると、縦横方向それぞれ（回路チップ幅）超で、（回路チップ幅＋前記回路チップ保持部材における隣接回路チップ間隔×２＋回路チップ幅の１／２）以下とすることが、好ましい。前記下限値を下回ると、回路チップを回路基板シート内に埋め込むことができなくなり、前記上限値を超えると、隣接した回路チップまで余分に取得してしまう場合が生じる。   The size of the surface of the uncured adhesive portion that is selectively formed on the circuit board sheet includes the adhesive strength of the uncured adhesive portion, the adhesive strength of the circuit chip holding member (adhesive tape), and the circuit chip to be transferred. And the arrangement interval of the circuit chips on the transfer source circuit chip holding member. The adhesive strength of each member may be generally set so that the adhesive strength of the circuit chip holding member <the adhesive strength of the uncured adhesive portion of the circuit board sheet. Under such a premise, the rectangular size of the adhesive portion of the circuit board sheet is larger than each (circuit chip width) in the vertical and horizontal directions with respect to the arrangement interval on the circuit chip holding member, and (circuit chip width + the circuit chip). It is preferable that the distance between adjacent circuit chips in the holding member × 2 + 1/2 of the circuit chip width) or less. If the lower limit value is not reached, the circuit chip cannot be embedded in the circuit board sheet, and if the upper limit value is exceeded, extra adjacent circuit chips may be obtained.

なお、回路チップ製造工程によっては、回路チップ保持部材が粘着テープである場合、回路チップの回路面が粘着テープの粘着面と接していない場合もあれば、粘着テープの粘着面と接している場合もある。回路チップの回路面が粘着テープと接していない場合は、別途用意した転写シートを用いて粘着テープより回路チップを転写し、上記転写シートから回路基板シートへ転写すればよい。また、回路チップの回路面が粘着テープの粘着面に接している場合は、本回路基板シートにそのまま転写すればよい。   Depending on the circuit chip manufacturing process, when the circuit chip holding member is an adhesive tape, the circuit surface of the circuit chip may not be in contact with the adhesive surface of the adhesive tape, or may be in contact with the adhesive surface of the adhesive tape. There is also. When the circuit surface of the circuit chip is not in contact with the adhesive tape, the circuit chip may be transferred from the adhesive tape using a separately prepared transfer sheet and transferred from the transfer sheet to the circuit board sheet. In addition, when the circuit surface of the circuit chip is in contact with the adhesive surface of the adhesive tape, it may be transferred to the circuit board sheet as it is.

図１に、多数の回路チップ２が一定の間隔で配列されてなる回路チップ保持部材（ダイシングテープ）１の概略平面図を示した。図中、符号３は、前記回路チップ保持部材１を支えるリングフレームである。また、図２に、この回路チップ保持部材１上の回路チップ２の配列面の一部を拡大して示した。各回路チップ２は、平面正方形である場合も有れば、長方形である場合もあるが、図では、平面正方形である場合を示した。   FIG. 1 shows a schematic plan view of a circuit chip holding member (dicing tape) 1 in which a large number of circuit chips 2 are arranged at regular intervals. In the figure, reference numeral 3 denotes a ring frame that supports the circuit chip holding member 1. FIG. 2 shows an enlarged part of the arrangement surface of the circuit chips 2 on the circuit chip holding member 1. Each circuit chip 2 may be a plane square or a rectangle, but the figure shows a case where the circuit chip 2 is a plane square.

図２において、ａは回路チップ２の縦寸法、ｂは横寸法、ｘは回路チップ２と隣接の回路チップ２との間隔を示している。これらの符号ａ，ｂ，ｘにて、本発明の回路基板シートにおける未硬化粘着部の矩形サイズの好適な概略的範囲は、縦方向では、下限値が［ａ］で、上限値が［ａ＋２ｘ＋ａ×（１／２）］である。また、横方向では、下限値が［ｂ］で、上限値が［ｂ＋２ｘ＋ｂ×（１／２）］である。   In FIG. 2, a is the vertical dimension of the circuit chip 2, b is the horizontal dimension, and x is the distance between the circuit chip 2 and the adjacent circuit chip 2. With these symbols a, b, and x, the preferred approximate range of the rectangular size of the uncured adhesive portion in the circuit board sheet of the present invention is that the lower limit value is [a] and the upper limit value is [a + 2x + a] in the vertical direction. × (1/2)]. In the horizontal direction, the lower limit value is [b] and the upper limit value is [b + 2x + b × (1/2)].

前記回路基板シートに回路チップ保持部材から所要数の回路チップを配置する方法、および回路基板の製造方法を、図を参照して説明する。   A method for arranging a required number of circuit chips from the circuit chip holding member on the circuit board sheet and a method for manufacturing the circuit board will be described with reference to the drawings.

（回路基板シートへの回路チップの配置方法、回路基板の製造方法（１））
図３に示すように、上述のように製造した回路基板シート１０の軽剥離型剥離シート（不図示）を未硬化層１１から剥がしてソーダライムガラス、石英ガラスなどのガラス基板１２に貼合する。この時、活性エネルギー線を透過する重剥離型剥離シート１３は剥がさずに置く。 (Circuit board placement method on circuit board sheet, circuit board manufacturing method (1))
As shown in FIG. 3, the light release type release sheet (not shown) of the circuit board sheet 10 manufactured as described above is peeled off from the uncured layer 11 and bonded to a glass substrate 12 such as soda lime glass or quartz glass. . At this time, the heavy release type release sheet 13 that transmits the active energy ray is placed without being peeled off.

図４に示すように、活性エネルギー線を遮蔽する箇所が所要数（図では１箇所）、所要のパターンに形成されたマスク１４を、前記重剥離型剥離シート１３の上に貼合し、上方から活性エネルギー線を照射する。   As shown in FIG. 4, the required number of active energy rays are shielded (one in the figure), and a mask 14 formed in a required pattern is bonded onto the heavy release release sheet 13, Irradiate active energy rays from

前記活性エネルギー線の照射の結果、マスク１４により活性エネルギー線の照射が遮蔽された箇所が未硬化粘着部１１ａとして残り、活性エネルギー線が照射された他の部分が硬化非粘着部１１ｂとなる。その後、図５に示すように、重剥離型剥離シート１３およびマスク１４を剥離して、未硬化粘着部１１ａおよび硬化非粘着部１１ｂを露出させる。   As a result of the irradiation of the active energy rays, the portion where the irradiation of the active energy rays is shielded by the mask 14 remains as the uncured adhesive portion 11a, and the other portion irradiated with the active energy rays becomes the cured non-adhesive portion 11b. Thereafter, as shown in FIG. 5, the heavy release type release sheet 13 and the mask 14 are peeled to expose the uncured adhesive portion 11a and the cured non-adhesive portion 11b.

次に、図６に示すように、回路チップ保持部材１に支持された回路チップ２の配列面を、前記回路基板シート１０の露出面上に当接させる。   Next, as shown in FIG. 6, the array surface of the circuit chips 2 supported by the circuit chip holding member 1 is brought into contact with the exposed surface of the circuit board sheet 10.

その後、図７に示すように、回路基板シート１０から回路チップ保持部材１を剥離すると、所要数（図では１個）の回路チップ２が回路基板シート１０に転写、配置される。   Thereafter, as shown in FIG. 7, when the circuit chip holding member 1 is peeled from the circuit board sheet 10, a required number (in the figure, one) of circuit chips 2 is transferred and arranged on the circuit board sheet 10.

前記所要数（図では１個）の回路チップ２を所要箇所に配置された回路基板シート１０をガラス基板１２とともに、図８に示すように、平面プレス機２０に載置する。続いて、回路基板シート１０の上に剥離シート２１とガラス基板２２を順次載せて、徐々にプレスする。ここで、剥離シート２１、ガラス基板２２は前記したものが使用できる。回路チップ２が転写している未硬化粘着部１１ａは未硬化で軟質であるため、表面に配置されていた回路チップ２が回路基板シート１０内に埋め込まれ、その表面が回路基板シート１０の表面と一続きの平面を構成する。この時、回路基板シート１０は、下方のガラス基板１２と、上方のガラス基板２２および剥離シート２１により均一に加圧されるため、回路チップ２が埋め込まれても表面の平坦性が損なわれることがない。   As shown in FIG. 8, the circuit board sheet 10 in which the required number (one in the figure) of circuit chips 2 are arranged at the required locations is placed on the flat press machine 20 together with the glass substrate 12. Subsequently, the release sheet 21 and the glass substrate 22 are sequentially placed on the circuit board sheet 10 and gradually pressed. Here, the release sheet 21 and the glass substrate 22 described above can be used. Since the uncured adhesive portion 11a to which the circuit chip 2 is transferred is uncured and soft, the circuit chip 2 arranged on the surface is embedded in the circuit board sheet 10, and the surface is the surface of the circuit board sheet 10. And constitute a continuous plane. At this time, since the circuit board sheet 10 is uniformly pressed by the lower glass substrate 12, the upper glass substrate 22 and the release sheet 21, the flatness of the surface is impaired even when the circuit chip 2 is embedded. There is no.

回路チップ２が埋め込まれた後、上方の剥離シート２１およびガラス基板２２と、ガラス基板１２を付けたまま、平面プレス機２０から取り出す。その後、図９に示すように、下方のガラス基板１２側から活性エネルギー線を回路基板シート１０に照射して回路基板シート１０の未硬化粘着部１１ａを硬化させる。硬化後、上方のガラス基板２２と剥離シート２１を取り除くと、図１０に示すように、所望の回路チップ２が埋め込まれ、全体が硬化された回路基板シート、すなわち回路基板２３が得られる。   After the circuit chip 2 is embedded, the upper release sheet 21 and the glass substrate 22 and the glass substrate 12 are attached and taken out from the flat press machine 20. Then, as shown in FIG. 9, the circuit board sheet 10 is irradiated with an active energy ray from the lower glass substrate 12 side to cure the uncured adhesive portion 11a of the circuit board sheet 10. When the upper glass substrate 22 and the release sheet 21 are removed after the curing, as shown in FIG. 10, a desired circuit chip 2 is embedded, and a circuit substrate sheet, that is, a circuit substrate 23 in which the whole is cured is obtained.

最後に、所要数（図では１個）の回路チップ２が埋め込まれた回路基板２３には、真空蒸着やスパッタリング、フォトリソグラフィー技術などの周知の電極および配線形成方法により画素を制御するための配線が形成されて、回路基板が完成する。   Finally, on the circuit board 23 in which the required number (one in the figure) of the circuit chips 2 is embedded, wiring for controlling the pixels by a well-known electrode and wiring forming method such as vacuum deposition, sputtering, and photolithography technology. Is formed to complete the circuit board.

図３〜７を参照して上述した回路基板シートへの回路チップの配置方法では、マスク１４を使用して未硬化粘着部１１ａと硬化非粘着部１１ｂを形成するが、その他に、本発明では、ラジカル重合により硬化が進行する活性エネルギー線硬化性樹脂の場合、活性エネルギー線照射時に所要の局部を酸素に接触させることにより硬化阻害を起こして未硬化粘着部を選択的に形成することも可能である。以下、その方法を図１１〜１５を参照して説明する。   In the arrangement method of the circuit chip on the circuit board sheet described above with reference to FIGS. 3 to 7, the uncured adhesive portion 11 a and the cured non-adhesive portion 11 b are formed using the mask 14. In the case of an active energy ray-curable resin that cures by radical polymerization, it is possible to selectively form an uncured adhesive part by causing curing inhibition by contacting the required local part with oxygen during irradiation with active energy ray. It is. Hereinafter, the method will be described with reference to FIGS.

（回路基板シートへの回路チップの配置方法、回路基板の製造方法（２））
図１１に示すように、先に説明したように製造した回路基板シート１０の軽剥離型剥離シート（不図示）を未硬化層１１から剥がして露出した未硬化層をガラス基板１２に貼合する。その後、他方の重剥離型剥離シート（不図示）を剥がし、替わりに孔開き剥離シート３０を貼り付ける。この孔開き剥離シート３０には、所要数（図では１つ）の孔３０ａを所要のパターンで形成してある。 (Circuit board placement method on circuit board sheet, circuit board manufacturing method (2))
As shown in FIG. 11, the uncured layer exposed by peeling the lightly peelable release sheet (not shown) of the circuit board sheet 10 manufactured as described above from the uncured layer 11 is bonded to the glass substrate 12. . Thereafter, the other heavy release type release sheet (not shown) is peeled off, and a perforated release sheet 30 is attached instead. The perforated release sheet 30 has a required number (one in the figure) of holes 30a formed in a required pattern.

次に、図１２に示すように、酸素含有雰囲気下において、活性エネルギー線を孔開き剥離シート３０の上方から未硬化層１１に向けて照射する。前述のように、孔開き剥離シート３０には、孔３０ａが開けられているため、その孔３０ａがある部分の未硬化層１１は外気に露出している。この状態で、空気などの酸素を含有する雰囲気下で、未硬化層１１に活性エネルギー線を照射すると、活性エネルギー線は未硬化層１１の全面に隈無く露光されるので、未硬化層１１の孔３０ａ以外の領域は光硬化するが、孔３０ａにより酸素と接触した部分は酸素により硬化が阻害されて未硬化のままとなり、未硬化粘着部１１ａが選択的に形成され、残りの部分が硬化非粘着部１１ｂとなる。なお、図１２において、活性エネルギー線を孔開き剥離シート３０の上方から照射したが、ガラス基板１２側から照射してもよい。   Next, as shown in FIG. 12, an active energy ray is irradiated from above the perforated release sheet 30 toward the uncured layer 11 in an oxygen-containing atmosphere. As described above, since the holes 30a are formed in the perforated release sheet 30, the portion of the uncured layer 11 where the holes 30a are present is exposed to the outside air. In this state, when the active energy ray is irradiated to the uncured layer 11 in an atmosphere containing oxygen such as air, the active energy ray is exposed on the entire surface of the uncured layer 11. The regions other than the holes 30a are photocured, but the portions that are in contact with oxygen through the holes 30a are blocked by oxygen and remain uncured, and the uncured adhesive portion 11a is selectively formed, and the remaining portions are cured. It becomes the non-adhesion part 11b. In FIG. 12, the active energy ray is irradiated from above the perforated release sheet 30, but it may be irradiated from the glass substrate 12 side.

前述のように、孔開き剥離シート３０を用いた酸素含有雰囲気下における活性エネルギー線の照射の結果、未硬化粘着部１１ａと硬化非粘着部１１ｂが選択的に形成された後、孔開き剥離シート３０を剥離して、図１３に示すように、未硬化粘着部１１ａおよび硬化非粘着部１１ｂを露出させる。   As described above, after the uncured adhesive portion 11a and the cured non-adhesive portion 11b are selectively formed as a result of irradiation with active energy rays in an oxygen-containing atmosphere using the perforated release sheet 30, the perforated release sheet is formed. 30 is peeled off to expose the uncured adhesive portion 11a and the cured non-adhesive portion 11b as shown in FIG.

次に、図１４に示すように、回路チップ保持部材１に支持された回路チップ２の配列面を、前記回路基板シート１０の露出面上に当接させる。   Next, as shown in FIG. 14, the array surface of the circuit chips 2 supported by the circuit chip holding member 1 is brought into contact with the exposed surface of the circuit board sheet 10.

その後、図１５に示すように、回路基板シート１０から回路チップ保持部材１を剥離すると、所要数（図では１個）の回路チップ２が回路基板シート１０に転写、配置される。この後は、前述の図８〜１０に示した工程を経て回路基板を形成する。   Thereafter, as shown in FIG. 15, when the circuit chip holding member 1 is peeled from the circuit board sheet 10, a required number (one in the figure) of circuit chips 2 is transferred and arranged on the circuit board sheet 10. Thereafter, a circuit board is formed through the steps shown in FIGS.

以下、本発明の回路基板シートへの回路チップの配置方法、回路基板の製造方法の実施例を示す。なお、以下に示す実施例は、本発明を好適に説明するための例示に過ぎず、なんら本発明を限定するものではない。   Embodiments of a method for arranging circuit chips on a circuit board sheet and a method for manufacturing a circuit board according to the present invention will be described below. In addition, the Example shown below is only the illustration for demonstrating this invention suitably, and does not limit this invention at all.

以下に示す実施例１、２は、先に図３〜１０を参照して説明した回路基板シートを用いた配置方法に準じて行った実施例である。同じく、実施例３は、図１１〜１５を参照して説明した回路基板シートを用いた配置方法に準じて行った実施例である。   Examples 1 and 2 shown below are examples performed in accordance with the arrangement method using the circuit board sheet described above with reference to FIGS. Similarly, Example 3 is an example performed according to the arrangement method using the circuit board sheet described with reference to FIGS.

（実施例１）
（回路基板シートの形成）
アクリル酸ブチル（関東化学社製）８０重量部とアクリル酸（関東化学社製）２０重量部とを酢酸エチル／メチルエチルケトン混合溶媒（重量比５０：５０）中で反応させて得たアクリル酸エステル共重合体（固形分濃度３５重量％）に、共重合体中のアクリル酸１００当量に対し３０当量となるように、２−メタクリロイルオキシエチルイソシアナート（国産化学社製）を添加し、窒素雰囲気下、４０℃で４８時間反応させて、側鎖に活性エネルギー線硬化性基を有する重量平均分子量が８５万の活性エネルギー線硬化性官能基が導入されてなるアクリル系共重合体を得た。 (Example 1)
(Formation of circuit board sheet)
An acrylic ester copolymer obtained by reacting 80 parts by weight of butyl acrylate (manufactured by Kanto Chemical Co., Ltd.) and 20 parts by weight of acrylic acid (manufactured by Kanto Chemical Co., Ltd.) in an ethyl acetate / methyl ethyl ketone mixed solvent (weight ratio 50:50). 2-Methacryloyloxyethyl isocyanate (manufactured by Kokusan Chemical Co., Ltd.) was added to the polymer (solid content concentration: 35% by weight) so that it was 30 equivalents with respect to 100 equivalents of acrylic acid in the copolymer. Then, the reaction was carried out at 40 ° C. for 48 hours to obtain an acrylic copolymer into which an active energy ray-curable functional group having an active energy ray-curable group in the side chain and having a weight average molecular weight of 850,000 was introduced.

得られた活性エネルギー線硬化性官能基が導入されてなるアクリル系共重合体の溶液の固形分１００重量部に対して、光重合開始剤である２，２−ジメトキシ−１，２−ジフェニルエタン−１−オン（チバ・スペシャリティ・ケミカルズ社製、商品名「イルガキュア６５１」）３．０重量部と、活性エネルギー線重合性の多官能モノマーおよびオリゴマーからなる組成物（大日精化工業社製、商品名「１４−２９Ｂ（ＮＰＩ）」）１００重量部（固形分８０重量部）と、ポリイソシアナート化合物からなる架橋剤（東洋インキ製造社製、商品名「オリバインＢＨＳ−８５１５」）１．２重量部（固形分０．４５部）とを溶解させ、最後にメチルエチルケトンを加えて、固形分濃度を４０重量％に調整し、均一な溶液となるまで撹拌して、塗工液とした。   2,2-dimethoxy-1,2-diphenylethane, which is a photopolymerization initiator, with respect to 100 parts by weight of the solid content of the resulting acrylic copolymer solution into which the active energy ray-curable functional group has been introduced. A composition consisting of 3.0 parts by weight of -1-one (Ciba Specialty Chemicals, trade name “Irgacure 651”) and an active energy ray-polymerizable polyfunctional monomer and oligomer (manufactured by Dainichi Seika Kogyo Co., Ltd., Trade name “14-29B (NPI)”) 100 parts by weight (solid content 80 parts by weight) and a cross-linking agent comprising a polyisocyanate compound (trade name “Olivein BHS-8515” manufactured by Toyo Ink Co., Ltd.) 1.2 Dissolve parts by weight (0.45 parts solids), add methyl ethyl ketone at the end, adjust the solids concentration to 40% by weight, and stir until a uniform solution is obtained. And the.

前記塗工液を、ナイフコーターによって、厚さ３８μｍのポリエチレンテレフタレートフィルムの片面にシリコーン系剥離剤層が設けられた重剥離型剥離シート（リンテック社製、商品名「ＳＰ−ＰＥＴ３８１１」）の剥離処理面に、塗布し、９０℃で９０秒間加熱乾燥させ、厚さ５０μｍの活性エネルギー線硬化性樹脂からなる未硬化層を有するシートを作製した。   Using a knife coater, the coating solution was subjected to a peeling treatment of a heavy release type release sheet (trade name “SP-PET3811” manufactured by Lintec Corporation) in which a silicone release agent layer was provided on one side of a 38 μm thick polyethylene terephthalate film. The sheet was coated on the surface and dried by heating at 90 ° C. for 90 seconds to prepare a sheet having an uncured layer made of an active energy ray-curable resin having a thickness of 50 μm.

同様にして、別に厚さ３８μｍのポリエチレンテレフタレートフィルムの片面にシリコーン系剥離剤層が設けられてなる軽剥離型剥離シート（リンテック社製、商品名「ＳＰ−ＰＥＴ３８０１」）の剥離処理面に、前記塗工液を塗布し、９０℃で９０秒間加熱乾燥させ、厚さ５０μｍの活性エネルギー線硬化性樹脂からなる未硬化層を有するシートを作製した。   Similarly, on the release treatment surface of a light release type release sheet (trade name “SP-PET3801”, manufactured by Lintec Corporation) in which a silicone release agent layer is provided on one side of a polyethylene terephthalate film having a thickness of 38 μm. The coating liquid was applied and heated and dried at 90 ° C. for 90 seconds to produce a sheet having an uncured layer made of an active energy ray-curable resin having a thickness of 50 μm.

前記重剥離型剥離シート上の未硬化層に、上記軽剥離型剥離シート上の未硬化層を積層し、軽剥離型剥離シートを剥離した。この積層工程を繰り返して、最終的に重剥離型剥離シートと軽剥離型剥離シートとにより挟まれた活性エネルギー線硬化性樹脂からなる厚さ４００μｍの未硬化層を有してなる回路基板シートを得た。   The uncured layer on the light release type release sheet was laminated on the uncured layer on the heavy release type release sheet, and the light release type release sheet was peeled off. By repeating this lamination process, a circuit board sheet having an uncured layer having a thickness of 400 μm made of an active energy ray-curable resin finally sandwiched between a heavy release type release sheet and a light release type release sheet is obtained. Obtained.

（未硬化粘着部と硬化非粘着部の選択的形成）
前記未硬化層を有する前記回路基板シートの軽剥離型剥離シートを剥がし、５ｃｍ×５ｃｍのソーダライムガラス基板に貼合した。この状態で、重剥離型剥離シートの上にマスクを配置して回路基板シートに照度４００ｍＷ／ｃｍ2、光量３１５ｍＪ／ｃｍ2の条件で無電極ランプ（フュージョン社製、Ｈバルブ）を光源とする紫外線をマスクの上方向から照射した。マスクは、石英ガラス上に紫外線を遮蔽するためにクロムの薄膜が４箇所形成されたもの（遮蔽部分：サイズ縦５８０μｍ×横５８０μｍ、間隔１７４０μｍ）を使用した。前記紫外線の照射により、未硬化層にサイズ縦５８０μｍ×横５８０μｍの未硬化粘着部が４箇所形成され、他の部分は硬化非粘着部となった。 (Selective formation of uncured adhesive part and cured non-adhesive part)
The light release release sheet of the circuit board sheet having the uncured layer was peeled off and bonded to a 5 cm × 5 cm soda lime glass substrate. In this state, a mask is placed on the heavy release type release sheet, and an electrodeless lamp (H bulb, manufactured by Fusion) is used as the light source on the circuit board sheet under the conditions of illuminance of 400 mW / cm 2 and light quantity of 315 mJ / cm 2. Ultraviolet rays were irradiated from above the mask. A mask in which four thin chromium films were formed on quartz glass to shield ultraviolet rays (shielding part: size 580 μm × width 580 μm, interval 1740 μm) was used. By irradiation with the ultraviolet rays, four uncured adhesive portions having a size length of 580 μm × width 580 μm were formed in the uncured layer, and the other portions were cured non-adhesive portions.

（回路基板シートへの回路チップの転写）
前記回路基板シートの重剥離型剥離シートを剥がし、前記未硬化粘着部と硬化非粘着部とを露出させた。次に、回路チップ（縦５００μｍ×横５００μｍ×厚さ２００μｍ）が密に配列されたダイシングテープ（リンテック社製、商品名「Ａｄｗｉｌｌ Ｄ−６５０」：回路チップ保持部材）の基材側から、無電極ランプ（フュージョン社製、Ｈバルブ）を光源とし、照度４００ｍＷ／ｃｍ2、光量２００ｍＪ／ｃｍ2の条件で紫外線を照射した後、ダイシングテープの回路チップ配列面（回路チップ間隔８０μｍ）を、前記回路基板シートの露出面に貼合した。その後、回路基板シートからダイシングテープを剥離すると、回路基板シートの未硬化粘着部に４個の回路チップを所望の位置に転写、配置されていた。 (Transfer of circuit chip to circuit board sheet)
The heavy release type release sheet of the circuit board sheet was peeled off to expose the uncured adhesive part and the cured non-adhesive part. Next, from the substrate side of the dicing tape (product name “Adwill D-650”: circuit chip holding member, manufactured by Lintec Corporation) in which circuit chips (length 500 μm × width 500 μm × thickness 200 μm) are closely arranged, After irradiating ultraviolet rays under the conditions of an illuminance of 400 mW / cm 2 and an amount of light of 200 mJ / cm 2 using an electrode lamp (manufactured by Fusion, H bulb) as a light source, the circuit chip array surface of the dicing tape (circuit chip interval 80 μm) Bonded to the exposed surface of the circuit board sheet. Thereafter, when the dicing tape was peeled off from the circuit board sheet, four circuit chips were transferred and arranged at desired positions on the uncured adhesive portion of the circuit board sheet.

（回路チップの埋め込み、および回路基板シートの硬化（回路基板の製造））
ソーダライムガラス基板上の回路チップが配置された回路基板シートの上方に、剥離シート（リンテック社製、商品名「ＳＰ−ＰＥＴ３８０１」）を介して、別に用意した５ｃｍ×５ｃｍのガラス基板としてのソーダライムガラス板を押し当て、平面プレス機を用いて０．３ＭＰａの圧力で５分間プレスした。常圧に戻した後、平面プレス機より、剥離シート、上方のソーダライムガラス板、下方のソーダライムガラス基板を付けたままの回路基板シートを取り出し、この回路基板シートに照度４００ｍＷ／ｃｍ2、光量３１５ｍＪ／ｃｍ2の条件で無電極ランプ（フュージョン社製、Ｈバルブ）を光源とする紫外線を下方の回路チップが配置されていない側のソーダライムガラス基板側から照射して未硬化部を硬化させた。その後、回路基板上方のソーダライムガラス板と剥離シートを取り除き、回路基板シートが硬化した回路基板を得た。 (Embedding of circuit chip and curing of circuit board sheet (production of circuit board))
Soda as a 5 cm × 5 cm glass substrate prepared separately via a release sheet (trade name “SP-PET3801”, manufactured by Lintec Corporation) above a circuit board sheet on which circuit chips on a soda lime glass substrate are arranged. The lime glass plate was pressed and pressed using a flat press at a pressure of 0.3 MPa for 5 minutes. After returning to normal pressure, from the flat press machine, take out the circuit board sheet with the release sheet, the upper soda lime glass plate and the lower soda lime glass substrate attached, and the circuit board sheet has an illuminance of 400 mW / cm 2 , The uncured part is cured by irradiating UV light using an electrodeless lamp (H bulb, manufactured by Fusion) under the condition of a light amount of 315 mJ / cm 2 from the side of the soda lime glass substrate on the side where the lower circuit chip is not disposed. I let you. Thereafter, the soda lime glass plate and the release sheet above the circuit board were removed to obtain a circuit board on which the circuit board sheet was cured.

（実施例２）
実施例１において、回路基板シートへ紫外線を遮蔽するマスクとして、サイズが縦７８０μｍ×横７８０μｍ、間隔１７４０μｍの遮蔽領域が形成されたマスク（未硬化粘着部サイズ：縦７８０μｍ×横７８０μｍ）を用いた以外は、実施例１と同様な方法で、回路チップの転写、配置、回路チップの回路基板シートへの埋め込み、および回路基板シートの硬化を行い、回路基板を得た。 (Example 2)
In Example 1, as a mask for shielding ultraviolet rays on the circuit board sheet, a mask (uncured adhesive portion size: vertical 780 μm × horizontal 780 μm) in which a shielding area with a size of 780 μm × horizontal 780 μm and an interval of 1740 μm was used was used. Except for the above, a circuit board was obtained in the same manner as in Example 1 by transferring and arranging the circuit chip, embedding the circuit chip in the circuit board sheet, and curing the circuit board sheet.

（実施例３）
実施例１において、回路基板シートの未硬化粘着部と硬化非粘着部とを選択形成する工程を以下の通りに変更した以外は、実施例１と同様にして、回路チップの転写、配置、回路チップの回路基板シートへの埋め込み、および回路基板シートの硬化を行い、回路基板を得た。 (Example 3)
In Example 1, except that the process of selectively forming the uncured adhesive part and the cured non-adhesive part of the circuit board sheet was changed as follows, the transfer, arrangement, and circuit of the circuit chip were the same as in Example 1. The circuit board was obtained by embedding the chip in the circuit board sheet and curing the circuit board sheet.

（未硬化粘着部と硬化非粘着部の選択的形成）
前記未硬化層を有する前記回路基板シートの軽剥離型剥離シートを剥がし、５ｃｍ×５ｃｍのソーダライムガラス基板に貼合し、他方の表面の重剥離型剥離シートを剥がして未硬化層を露出させた。 (Selective formation of uncured adhesive part and cured non-adhesive part)
Peel off the light peelable release sheet of the circuit board sheet having the uncured layer, paste it on a 5 cm x 5 cm soda lime glass substrate, peel off the heavy peelable release sheet on the other surface, and expose the uncured layer It was.

次に、ポリエチレンテレフタレートフィルムの片面にシリコーン系剥離層が設けられた剥離シート（リンテック株式会社製、商品名「ＳＰ−ＰＥＴ３８０１」）を用意し、この剥離シートに、炭酸ガスレーザーを照射して、回路チップを配置する４箇所に対応する領域に５２０μｍ×５２０μｍ、間隔１７４０μｍの正方形の孔を開けた。   Next, a release sheet (trade name “SP-PET3801”, manufactured by Lintec Corporation) provided with a silicone release layer on one side of a polyethylene terephthalate film is prepared, and this release sheet is irradiated with a carbon dioxide laser, Square holes having a size of 520 μm × 520 μm and an interval of 1740 μm were formed in regions corresponding to the four places where the circuit chips are arranged.

前記のようにして得られた孔開き剥離シートを、前記回路基板シートの未硬化層の露出面に貼合させた。この状態の回路基板シートを空気雰囲気（酸素ガス含有雰囲気）下で、回路基板シートの未硬化層に照度４００ｍＷ／ｃｍ2、光量１００ｍＪ／ｃｍ2の条件で無電極ランプ（フュージョン社製、Ｈバルブ）を光源とする紫外線を孔開き剥離シートの上方向から照射した。その結果、未硬化層にサイズ縦５２０μｍ×横５２０μｍの未硬化粘着部が４箇所形成され、他の部分は硬化非粘着部となった。以降は、実施例１と同様な方法で、回路チップの転写、配置、回路チップの回路基板シートへの埋め込み、および回路基板シートの硬化を行い、回路基板を得た。 The perforated release sheet obtained as described above was bonded to the exposed surface of the uncured layer of the circuit board sheet. The circuit board sheet in this state is an electrodeless lamp (H bulb manufactured by Fusion Co., Ltd.) under an air atmosphere (oxygen gas-containing atmosphere) and an uncured layer of the circuit board sheet under the conditions of an illuminance of 400 mW / cm 2 and a light amount of 100 mJ / cm 2. ) Was irradiated from above the perforated release sheet. As a result, four uncured adhesive portions of size 520 μm × width 520 μm were formed in the uncured layer, and the other portions were cured non-adhesive portions. Thereafter, the circuit board was obtained by transferring and arranging the circuit chip, embedding the circuit chip in the circuit board sheet, and curing the circuit board sheet in the same manner as in Example 1.

（参考例１）
実施例１において、使用するマスクの遮蔽部のサイズを縦１０５０μｍ×横１０５０μｍ、間隔１７４０μｍ（粘着部のサイズ：縦１０５０μｍ、横１０５０μｍ）としたこと以外は実施例１と同様にして、回路基板シートへの回路チップの転写、埋め込み、配置及び回路基板シートの硬化を行って、回路基板を得た。 (Reference Example 1)
In Example 1, the circuit board sheet was the same as Example 1 except that the size of the shielding part of the mask used was 1050 μm long × 1050 μm wide and 1740 μm in spacing (adhesive part size: 1050 μm long, 1050 μm wide). The circuit chip was transferred, embedded, arranged, and the circuit board sheet was cured to obtain a circuit board.

（参考例２）
実施例１において、使用するマスクの遮蔽部のサイズを縦４００μｍ×横４００μｍ、間隔１７４０μｍ（粘着部のサイズ：縦４００μｍ、横４００μｍ）としたこと以外は実施例１と同様にして、回路基板シートへの回路チップの転写、埋め込み、配置及び回路基板シートの硬化を行って、回路基板を得た。 (Reference Example 2)
In Example 1, the circuit board sheet was the same as Example 1 except that the size of the shielding part of the mask used was 400 μm long × 400 μm wide and 1740 μm in spacing (adhesive part size: 400 μm long, 400 μm wide). The circuit chip was transferred, embedded, arranged, and the circuit board sheet was cured to obtain a circuit board.

（評価）
前記各実施例および参考例における回路チップの転写の信頼性評価は、最終的に回路チップが回路基板シートに配置されている否か、そして配置した回路チップが回路基板シートに埋め込まれたか否かを目視で確認することにより行った。転写試験は１０回実施し（ｎ＝１０）、１回の試験につき４つの回路チップ全てを配置できた場合のみ選択的に配置できたと見なした。そして、所要数の４箇所以外に回路チップが余分に転写された（５つ以上の回路チップが配置された）場合、又は、所望数の４箇所の回路チップが転写されず（配置された回路チップが３つ以下）の場合、選択的な配置ができなかったものとした。
その結果を、表１に示した。 (Evaluation)
The reliability evaluation of the transfer of the circuit chip in each of the embodiments and the reference examples is based on whether or not the circuit chip is finally arranged on the circuit board sheet and whether or not the arranged circuit chip is embedded in the circuit board sheet. Was confirmed by visual inspection. The transfer test was carried out 10 times (n = 10), and it was considered that the transfer could be selectively arranged only when all four circuit chips could be arranged per test. Then, when circuit chips are transferred in excess of the required number of four places (five or more circuit chips are arranged), or a desired number of four circuit chips are not transferred (arranged circuits) In the case of 3 chips or less), it was assumed that selective arrangement could not be made.
The results are shown in Table 1.

Figure 2008177371
Figure 2008177371

表１から明らかなように、本発明の回路基板の製造方法を用いれば、回路チップ保持部材から回路チップを転写、配置させることができる。また、その際に形成する未硬化粘着部を適正なサイズに設定することにより、所望数の回路チップを回路チップ保持部材から自身の表面に転写させることができる。     As apparent from Table 1, the circuit chip can be transferred and arranged from the circuit chip holding member by using the circuit board manufacturing method of the present invention. Further, by setting the uncured adhesive portion formed at that time to an appropriate size, a desired number of circuit chips can be transferred from the circuit chip holding member to the surface thereof.

以上説明したように、本発明にかかる回路基板の製造方法によれば、回路チップを保持している回路チップ保持部材から、所要数の回路チップを回路基板シートの表面に転写により配置させることができる。また、本発明の回路基板の製造方法では、別途に形成する回路チップにニッケル被膜形成などの特別な処理を施さず、使用材料の粘着力を利用して転写する技術を用いている。従って、本発明の回路基板の製造方法を用いることにより、ニッケル被膜除去に必要となるエッチング液などの処理薬剤が不要となり、安全、かつ高収率に大型ディスプレイ用回路基板を作製することが可能となる。   As described above, according to the method for manufacturing a circuit board according to the present invention, the required number of circuit chips can be transferred and arranged on the surface of the circuit board sheet from the circuit chip holding member holding the circuit chips. it can. In addition, the circuit board manufacturing method of the present invention uses a technique for transferring a circuit chip separately formed without using a special treatment such as nickel film formation, using the adhesive force of the material used. Therefore, by using the circuit board manufacturing method of the present invention, a processing agent such as an etching solution necessary for removing the nickel coating is not required, and a circuit board for a large display can be produced safely and with a high yield. It becomes.

回路チップが配列された回路チップ保持部材（ダイシングテープ）の平面図である。It is a top view of the circuit chip holding member (dicing tape) in which the circuit chip was arranged. 図１の要部拡大図である。It is a principal part enlarged view of FIG. 活性エネルギー線硬化性樹脂から構成した回路基板シートの側面断面図である。It is side surface sectional drawing of the circuit board sheet | seat comprised from active energy ray curable resin. 回路基板シートにマスクを介して活性エネルギー線を照射して未硬化粘着部を選択的に形成している状態の側面断面図である。It is side surface sectional drawing of the state which irradiates an active energy ray through a mask to a circuit board sheet | seat, and has selectively formed the non-hardened adhesion part. 未硬化粘着部と硬化非粘着部とを露出した状態の回路基板シートの側断面図である。It is a sectional side view of a circuit board sheet in a state where an uncured adhesive part and a cured non-adhesive part are exposed. 回路基板シートと回路チップ保持部材（ダイシングテープ）を当接させた状態の側面断面図である。It is side surface sectional drawing of the state which contacted the circuit board sheet | seat and the circuit chip holding member (dicing tape). 回路基板シートから回路チップ保持部材（ダイシングテープ）を剥離して回路チップを回路基板シートに転写した状態を示す側面断面図である。It is side surface sectional drawing which shows the state which peeled the circuit chip holding member (dicing tape) from the circuit board sheet, and transcribe | transferred the circuit chip to the circuit board sheet. 回路基板シート表面に転写された回路チップを平面プレス機により回路基板シート内に埋め込んだ状態を示す側面断面図である。It is side surface sectional drawing which shows the state which embedded the circuit chip transcribe | transferred on the circuit board sheet | seat surface in the circuit board sheet | seat with the plane press. 回路チップを埋め込んだ回路基板シートに活性エネルギー線を照射して硬化させている状態を示す側面断面図である。It is side surface sectional drawing which shows the state which has irradiated and hardened the active energy ray to the circuit board sheet | seat which embedded the circuit chip. 回路チップの埋め込みと回路基板シートの硬化とが完了した状態の回路基板シート（回路基板）の側面断面図である。It is side surface sectional drawing of a circuit board sheet (circuit board) in the state where embedding of a circuit chip and hardening of a circuit board sheet were completed. 活性エネルギー線硬化性樹脂から構成した回路基板シートの露出面に孔開き剥離シートを貼合した状態の側面断面図である。It is side surface sectional drawing of the state which bonded the perforated peeling sheet to the exposed surface of the circuit board sheet | seat comprised from active energy ray hardening resin. 回路基板シートに孔開き剥離シートの上から活性エネルギー線を酸素含有雰囲気下で照射して未硬化粘着部と硬化非粘着部を選択的に形成している状態を示す側面断面図である。It is side surface sectional drawing which shows the state which irradiates an active energy ray on a circuit board sheet | seat from above on a perforated peeling sheet in oxygen-containing atmosphere, and has selectively formed the non-hardened adhesion part and the hardening non-adhesion part. 未硬化粘着部と硬化非粘着部とを露出した状態の回路基板シートの側断面図である。It is a sectional side view of a circuit board sheet in a state where an uncured adhesive part and a cured non-adhesive part are exposed. 回路基板シートと回路チップ保持部材（ダイシングテープ）を当接させた状態の側面断面図である。It is side surface sectional drawing of the state which contacted the circuit board sheet | seat and the circuit chip holding member (dicing tape). 回路基板シートから回路チップ保持部材（ダイシングテープ）を剥離して回路チップを回路基板シートに転写した状態を示す側面断面図である。It is side surface sectional drawing which shows the state which peeled the circuit chip holding member (dicing tape) from the circuit board sheet, and transcribe | transferred the circuit chip to the circuit board sheet.

符号の説明Explanation of symbols

１ 回路チップ保持部材（ダイシングテープ）
２ 回路チップ
３ リングフレーム
１０ 回路基板シート
１１ 未硬化層
１１ａ 未硬化粘着部
１１ｂ 硬化非粘着部
１２ ガラス基板
１３ 重剥離型剥離シート
１４ マスク
２０ 平面プレス機
２１ 剥離シート
２２ ガラス基板
２３ 硬化後の回路基板シート（回路基板）
３０ 孔開き剥離シート
３０ａ 孔 1 Circuit chip holding member (dicing tape)
2 Circuit chip 3 Ring frame 10 Circuit board sheet 11 Uncured layer 11a Uncured adhesive part 11b Cured non-adhesive part 12 Glass substrate 13 Heavy release type release sheet 14 Mask 20 Flat press 21 Release sheet 22 Glass substrate 23 Circuit after curing Board sheet (circuit board)
30 perforated release sheet 30a hole

Claims (6)

回路チップを保持している回路チップ保持部材から、所要数の回路チップを選択的に回路基板シートの表面に転写させる回路基板の製造方法であって、
前記所要数の回路チップを転写する回路基板シートの転写箇所を選択的に粘着部と設定することを特徴とする回路基板の製造方法。 A circuit board manufacturing method for selectively transferring a required number of circuit chips to a surface of a circuit board sheet from a circuit chip holding member holding circuit chips,
A method of manufacturing a circuit board, wherein a transfer portion of a circuit board sheet to which the required number of circuit chips are transferred is selectively set as an adhesive portion. 前記回路チップ保持部材が粘着テープであることを特徴とする請求項１に記載の回路基板の製造方法。   The method for manufacturing a circuit board according to claim 1, wherein the circuit chip holding member is an adhesive tape. 活性エネルギー線硬化性樹脂から構成した未硬化層を有する回路基板シートの前記未硬化層に活性エネルギー線を照射して硬化非粘着部と未硬化粘着部とを選択的に形成する未硬化粘着部形成工程と、
前記未硬化粘着部と硬化非粘着部とが選択的に形成された回路基板シートに、回路チップを保持している回路チップ保持部材の回路チップ配列面を当接させて、前記回路基板シートの未硬化粘着部の表面に回路チップを付着させる工程と、
前記回路基板シートから前記回路チップ保持部材を剥離することにより、前記回路基板シートの未硬化粘着部に回路チップを転写させる工程と、
を有することを特徴とする回路基板の製造方法。 An uncured adhesive portion that selectively forms a cured non-adhesive portion and an uncured adhesive portion by irradiating active energy rays to the uncured layer of the circuit board sheet having an uncured layer composed of an active energy ray-curable resin. Forming process;
The circuit board sheet of the circuit chip holding member holding the circuit chip is brought into contact with the circuit board sheet on which the uncured adhesive part and the cured non-adhesive part are selectively formed, and the circuit board sheet Attaching the circuit chip to the surface of the uncured adhesive part;
Peeling the circuit chip holding member from the circuit board sheet to transfer the circuit chip to the uncured adhesive portion of the circuit board sheet; and
A method of manufacturing a circuit board, comprising: 前記未硬化粘着部形成工程において、選択的に活性エネルギー線を遮蔽するマスクを前記回路基板シートの未硬化層上に貼合し、前記マスクを貼合した側から活性エネルギー線を前記未硬化層に照射することにより、前記未硬化粘着部と硬化非粘着部とを選択的に形成することを特徴とする請求項３に記載の回路基板の製造方法。   In the uncured adhesive portion forming step, a mask that selectively blocks active energy rays is bonded onto the uncured layer of the circuit board sheet, and the active energy rays are applied to the uncured layer from the side on which the mask is bonded. The method for manufacturing a circuit board according to claim 3, wherein the uncured adhesive portion and the cured non-adhesive portion are selectively formed by irradiating the substrate. 前記未硬化粘着部形成工程において、選択的に開口部を設けたシートを前記回路基板シートの未硬化層上に貼合し、活性エネルギー線を前記未硬化層に照射することにより、前記未硬化粘着部と硬化非粘着部とを選択的に形成することを特徴とする請求項３に記載の回路基板の製造方法。   In the uncured adhesive portion forming step, the uncured layer is selectively bonded to the uncured layer of the circuit board sheet and irradiated with active energy rays to the uncured layer. The method for manufacturing a circuit board according to claim 3, wherein the adhesive portion and the cured non-adhesive portion are selectively formed. 前記未硬化粘着部の先端面が矩形であり、縦横方向それぞれ（回路チップ幅）超で、（回路チップ幅＋前記回路チップ保持部材における隣接回路チップ間隔×２＋回路チップ幅の１／２）以下のサイズに設定することを特徴とする請求項３〜５のいずれか１項に記載の回路基板の製造方法。   The front surface of the uncured adhesive portion is rectangular, exceeds the (circuit chip width) in each of the vertical and horizontal directions, and is equal to or less than (circuit chip width + adjacent circuit chip interval in the circuit chip holding member × 2 + circuit chip width). The method for manufacturing a circuit board according to claim 3, wherein the circuit board is set to a size.
JP2007009597A 2007-01-18 2007-01-18 Method of manufacturing circuit board Pending JP2008177371A (en)

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PCT/JP2008/050480 WO2008087997A1 (en) 2007-01-18 2008-01-17 Circuit board manufacturing method

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