JP2004345350A - Transfer-foil support, transfer foil and id card making method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make the dust-adhesion prevention, transfer-foil transfer nature (foil-separation nature) and blocking resistance to be improved. <P>SOLUTION: The numerical values represented in the following formula (1) satisfy the range of 0.03-0.005, and the surface specific resistance value at 23°C/50% covers the range of 1×10<SP>5</SP>-10<SP>14</SP>Ω. Formula (1): Average roughness of the one centerline of the above transfer-foil support (Ra) (μm)/Thickness of the above transfer-foil support (μm), provided the transfer-foil thickness is 5 to 40 μm. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an identification card (ID card), a contact-type or non-contact type electronic or magnetic ID card for storing personal information and the like for which security (security) such as forgery and alteration prevention is required, and How to make it. In addition, the present invention relates to a transfer foil support and a transfer foil used therefor.

  In recent years, in the service industries such as government offices, banks, companies, medical institutions and schools, licenses such as identification cards, passports, alien registration cards, library use cards, cash cards, credit cards, automobile licenses, ID cards such as personal identification cards, employee identification cards, membership cards, medical cards, and student identification cards have been widely used. In this type of ID card, a face image for identification and a character information image such as characters and symbols related to the owner are recorded. Therefore, printing or the like for the purpose of preventing forgery or falsification of the ID card is often performed. In recent years, many contact-type or non-contact-type electronic cards or magnetic cards for storing personal information and the like have been widely used.

  This face image is usually formed by a full-color image having multiple gradations, for example, by a sublimation type thermal transfer recording system, a silver halide color photographic system, or the like. The character information image is composed of a binary image and is formed by, for example, a fusion type thermal transfer recording system, a sublimation type thermal transfer recording system, a silver halide color photographic system, an electrophotographic system, an ink jet system, or the like. Further, holograms, fine prints, and the like are employed for the purpose of preventing forgery and falsification. In addition, fixed format printing is performed on the ID card in advance as needed.

However, in the case of ID cards, a technique using a transfer foil as a surface protective layer in order to improve image strength has been known. This technology can be produced quickly and has recently been reported with improved image fixability and durability. (See, for example, Patent Document 1, Patent Document 2, and Patent Document 3 below)
JP-A-2002-326323 (pages 1 to 6, FIG. 1) JP-A-5-69690 (pages 1 to 12, FIGS. 1 to 12) JP 2001-96956 A (pages 1 to 37, FIGS. 1 to 21)

  By the way, in Patent Literature 1, although the transfer foil support improves the dust entrapment property during transfer due to antistatic, the support has no surface protection function, has poor durability, and the transfer foil blocks the adhesive layer and the base material over time. Occurred and was a problem.

  Further, in Patent Document 2, an ultraviolet-curable coating liquid is applied to an image forming surface of a substrate having an intermediate protective layer, and the applied ultraviolet-curable coating liquid is cured by irradiation of ultraviolet light, A large amount of card recording media whose image forming surface is protected by an ultraviolet-curable resin layer via an intermediate protective layer can be obtained in large quantities and quickly, and the image fixing and durability are improved. Was poor in uniformity of application to the base material, and the maintainability was also deteriorated.

  In Patent Document 3, a transfer foil having at least an actinic ray-curable resin layer having a breaking elongation of 5 to 90% provided on a support and an information carrier layer is transferred by a heat roll, and then the transfer foil support is peeled off. To form a protective layer composed of a UV cured layer, there were problems in the bendability of the finished card over time, the adhesion of dust after the card was made, and the adhesion of the transfer foil. In addition, there was no contrivance for breaking the hardened layer having a breaking elongation of 5 to 90%, and a foil breakage failure during transfer occurred.

  The present invention has been made in view of such circumstances, and by using the transfer foil support of the present invention, prevention of dust adhesion, transfer foil transferability (cutting property of foil), and blocking property can be improved.

  In addition, by using the transfer foil of the present invention, it is possible to improve the bendability, the bendability after storage, the prevention of dust adhesion to the foil, the transfer foil transfer property (foil cut property), and the blocking property.

  In addition, by transferring to a specific image recording medium using the transfer foil support and the transfer foil of the present invention, there is no dust failure, foil breakage at the time of transfer, card surface appearance after transfer, image record after transfer. It has been found that the adhesiveness, bendability, and bendability after storage can be improved.

  In order to solve the above problems and achieve the object, the present invention is configured as follows.

(1) In order to solve the above-mentioned problems, in one embodiment of the present invention, the numerical value represented by the following general formula 1 satisfies 0.03 to 0.005, and the surface resistivity at 23 ° C./50% is: A transfer foil support having a range of 1 × 10 ⁵ to 10 ¹⁴ Ω.

[General formula 1]
One center line average roughness (Ra) of the transfer foil support “μm” / thickness of the transfer foil support “μm”
However, the thickness of the transfer foil support is 5 to 40 μm.
(2) In the present invention, the transfer foil support according to the above (1), further comprising an antistatic layer adjacent to the support.

  (3) In the present invention, at least one surface of the transfer foil support is roughened by any one of sandblasting, hairline processing, mat coating, and chemical etching. The transfer foil support according to (1).

  (4) One embodiment of the present invention is a transfer foil in which a transfer layer including at least a photocurable layer and an adhesive layer is laminated on the transfer foil support according to the above (1). A transfer foil characterized in that the initial elongation at break at 10C is 10 to 90% and the elongation at break after storage at 50C for 3 days is 10 to 90%.

  (5) In the present invention, the average peel force at 30 ° C. of the transfer foil support and the transfer layer is 3.5 to 25 g / cm at a 90 ° peel angle. It is a transfer foil of description.

  (6) In the present invention, the initial breaking peel force at 30 ° C. of the transfer foil support and the transfer layer is 15 to 150 g / cm at a 90 ° peel angle. It is a transfer foil.

(7) An embodiment of the present invention is an ID card producing method for producing an ID card by transferring the transfer layer of a transfer foil having a transfer layer on a transfer foil support onto a card-type image recording medium. At
The transfer foil support has a numerical value represented by the following general formula 1 satisfying 0.03 to 0.005 and a surface specific resistance at 23 ° C./50% of 1 × 10 ⁵ to 10 ¹⁴ Ω. This is a method for creating an ID card.

General formula 1:
One center line average roughness (Ra) of the transfer foil support “μm” / thickness of the transfer foil support “μm”
However, the thickness of the transfer foil support is 5 to 40 μm.
(8) In the present invention, a center line average roughness (Ra) on a surface of the card type image recording body on which the transfer layer is transferred is in a range of 0.00 to 0.6 μm. The ID card creation method according to (7) above.

(9) In the present invention, on the surface of the card-type image recording body on which the transfer layer is transferred,
A reference line is a line connecting two points at a distance of 10 mm each in the upper and lower directions in parallel with the short side direction of the card type image recording medium from the maximum portion of the concave portion or the convex portion,
The method according to (7), wherein a distance between a maximum portion of the concave portion or the convex portion and the reference line is 20 μm or less.

(10) In the present invention, on the surface of the card type image recording body on which the transfer layer is transferred,
A reference line is a line connecting two points at a distance of 10 mm each in the upper and lower directions in parallel with the short side direction of the card type image recording medium from the maximum portion of the concave portion or the convex portion,
The ID card creation method according to (7), wherein the maximum value of the inclination of the concave portion or the convex portion with respect to the reference line is 80 ° or less.

  (11) In the present invention, the card-type image recording body includes a first sheet member, a second sheet member, and an electronic component provided between the first sheet member and the second sheet member. The ID card creation method according to the above (7), wherein the ID card creation type is an electronic component mounting type.

  (12) In the present invention, the first sheet member is provided with a layer that carries at least identification information, bibliographic information, an authentication identification image, and an attribute information image by at least sublimation thermal transfer, melt thermal transfer, inkjet, and retransfer. The ID card creation method according to the above (11), wherein

  (13) The ID card producing method according to (11), wherein a writable layer is provided on the second sheet member.

  (14) In the ID card creation method according to (11), the electronic component stores personal information including at least a face image, an address, a name, and a date of birth. is there.

(15) In the present invention, on the surface of the card-type image recording body on which the transfer layer is transferred,
A reference line is a line connecting two points at a distance of 10 mm each in the upper and lower directions in parallel with the short side direction of the card type image recording medium from the maximum portion of the concave portion or the convex portion,
The ID card creation method according to (11), wherein the maximum value of the inclination of the concave portion or the convex portion with respect to the reference line is 80 ° or less.

  With the above configuration, the present invention has the following effects.

The transfer foil support of the present invention has a numerical value represented by the following general formula 1 satisfying 0.03 to 0.005, and having a surface specific resistance of 1 × 10 ⁵ to 10 ¹⁴ Ω at 23 ° C./50%. By being a range,
General formula 1:
One center line average roughness (Ra) of the transfer foil support “μm” / thickness of the transfer foil support “μm”
However, the thickness of the transfer foil support is 5 to 40 μm.
It is possible to provide an ID card and an IC card having improved prevention of dust adhesion, transfer foil transferability (foil breakability), blocking property, and transfer surface appearance.

  In addition, the transfer foil of the present invention has a bending property and a storage property by having an initial breaking elongation at 23 ° C. of the photocured layer of 10 to 90% and a breaking elongation after storage at 50 ° C. for 3 days of 10 to 90%. An ID card and an IC card having improved post-bending property, prevention of dust adhesion, transfer foil transfer property (foil cut property), blocking property, and transfer surface appearance can be provided.

  Further, the transfer foil of the present invention regulates the peeling force between the support and the transfer layer at 30 ° C., so that the bendability, the bendability after storage, the blocking property, the transfer foil transfer property (foil cut property), and the dust adhesion An ID card and an IC card having improved prevention and transfer surface appearance can be provided.

  By transferring the image to a specific image recording medium using the transfer foil support and the transfer foil of the present invention, the card bendability, the bendability after storage of the card, the transfer foil transfer property (foil cut property), and the prevention of card dust adhesion. In addition, it is possible to provide an ID card and an IC card in which the adhesion between the transfer foil and the image recording medium and the transfer surface appearance are improved.

  Hereinafter, a transfer foil support, a transfer foil, and a method for preparing an ID card of the present invention will be described in detail with reference to the drawings, but the present invention is not limited to this embodiment. Further, the embodiments of the present invention show the most preferred embodiments of the present invention, and the meaning of the terms of the present invention is not limited thereto.

  FIG. 1 shows a layer configuration diagram of the transfer foil support. In FIG. 1A, the support 1 has a roughened surface 2 on one side and an antistatic layer 3 on the other side. In FIG. 1B, the support 1 has an antistatic layer provided with a roughened surface 4 on one side and an antistatic layer 3 on the other side. In FIG. 1C, the support 1 has a roughened surface 4 provided with an antistatic layer on one surface side.

  FIG. 2 shows a configuration example of a transfer foil layer using the transfer foil support. FIGS. 2A to 2D are configuration examples of a transfer foil layer using the transfer foil support of FIG. 1A. 2 (e) to 2 (h) show examples of the configuration of a transfer foil layer using the transfer foil support of FIG. 1 (b). 2 (i) to 2 (l) are examples of the configuration of a transfer foil layer using the transfer foil support of FIG. 1 (c).

  In the transfer foil support of the present invention, examples of the support include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene terephthalate / isophthalate copolymer; polyolefin resins such as polyethylene, polypropylene, and polymethylpentene; Polyethylene resins such as vinyl, polyvinylidene fluoride, polytetrafluoroethylene, ethylene-tetrafluoroethylene copolymer, polyamides such as nylon 6, nylon 6.6, polyvinyl chloride, vinyl chloride / vinyl acetate copolymer Polymers, ethylene / vinyl acetate copolymer, ethylene / vinyl alcohol copolymer, polyvinyl alcohol, vinyl polymer such as vinylon, cellulose triacetate, cellulosic resin such as cellophane, biodegradable cellulose acetate, Synthesis of biodegradable resin such as degradable polycaprolactone, acrylic resin such as polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, polybutyl acrylate, polystyrene, polycarbonate, polyarylate, polyimide, etc. Examples of the sheet include a resin sheet, a paper such as a high-quality paper, a thin paper, a glassine paper, a parchment paper, a single layer body such as a metal foil, and a laminate of two or more layers.

  The thickness of the support of the present invention is 5 to 40 μm, preferably 8 to 38 μm. If the thickness is 5 μm or less, the support may be broken at the time of transfer or transfer unevenness may occur, resulting in a problem that surface protection and surface appearance deteriorate. If it is more than 40 μm, the thickness of the support becomes too thick, so that the transferability deteriorates due to a decrease in the heat transfer force to the adhesive layer during transfer. The transfer foil support of the present invention is preferably heat-resistant and inexpensive polyethylene terephthalate among the above resins.

  In the present invention, the support having a thickness of 5 to 40 μm is preferably a transfer foil support characterized in that at least one center line average roughness (Ra) is represented by the general formula 1.

General formula 1:
One center line average roughness (Ra) of the support “μm” / support thickness “μm” = 0.03 to 0.005
In the present invention, in order to satisfy the general formula 1, it is preferable to roughen one or both sides of the support.

  When the value of the general formula 1 is 0.005 or less, the degree of surface roughening of the support is low, and when the transfer foil is wound up, the support is blocked with the adhesive layer located at the outermost layer in the transfer foil, which causes a problem. . In addition, if the thickness is 0.03 or more, a hole is formed in the support when one of the surfaces is roughened. Is a problem.

  It has been discovered in this study that the presence of the roughened surface of the present invention serves as a trigger during transfer and peeling to act as a perforation effect to improve foil breakage. Further, when the elongation at break of the photocurable layer in the transfer foil used in the present invention is low, excessive force is applied to the surface of the card transfer surface other than the cut portion of the foil, and cracks and the like are generated, resulting in poor card appearance. Was.

  In the present invention, by using a specific support and a transfer foil having a photocurable layer having a high elongation at break, it was possible to obtain a card with good foil breakage and no appearance defect.

  Examples of the surface roughening method include sandblasting, hairline processing, mat coating, and chemical etching. In the present invention, sandblasting and hairline processing are preferable in order to satisfy the above-mentioned general formula 1 or to make the method not impairing the function of the antistatic layer and to make the surface roughness the content described in the present invention. The surface roughening treatment is preferably performed on the entire surface to be treated.

  The sandblasting technology is a technology disclosed in Japanese Patent Application Laid-Open Nos. 7-49615, 10-48863, 2000-155436, and 2000-105481.

Specifically, the surface is roughened by an injection device for causing the sand particles to collide with the surface of the support. Sand particles are powders such as silica sand, alumina, carborundum, glass, and synthetic resin. If the particle size of the abrasive is too large, unevenness on the blasted surface tends to be too large. Therefore, it is preferable to use particles having an average particle diameter in the range of 0.1 to 5.0 μm. Injection can be performed at a spray angle of 0 ° to 90 ° with respect to the surface of the support, and a spray pressure of 0.5 to 10 kg / cm ² . After the sand treatment, since the sand remains on the support, it is preferable to wash with water, acidic water, alkaline water or the like. When an antistatic layer is provided in advance, it is preferable to select an antistatic layer that does not dissolve in a detergent with water, acidic water, alkaline water, or the like, and to select a washing method. In the present invention, there is no particular limitation as long as the surface resistivity of the support is in the range of 1 × 10 ⁵ to 10 ¹⁴ Ω.

  As a hairline processing technique, a method is known in which a brushing roll or a sand roll is linearly moved to form a streak to form an uneven pattern. The pitch of each hairline is preferably 0.00 to 2.0 μm, and there is no particular limitation in the depth direction as long as the support cannot be perforated.

  The center line average roughness (Ra) of the roughened surface prepared according to the present invention was measured by measuring with a surface roughness measuring instrument SE-30H manufactured by Koita Seisakusho.

  The measurement of the thickness of the support was performed by using a Sony MMUmate M30.

In the present invention, the transfer foil support preferably has a surface specific resistance at 23 ° C./50% in the range of 1 × 10 ⁵ to 1 × 10 ¹⁴ Ω, more preferably 1 × 10 ⁵ to 1 × 10 ⁵ Ω. × 10 ¹² Ω. In order to make the surface specific resistance value of the present invention, it is preferable to provide an antistatic layer on the support before or after the surface roughening, and further to provide an antistatic layer on the non-roughened side. Is preferred. When the antistatic layer is provided on the roughened portion after the surface is roughened, the productivity and the surface roughening rate decrease, which causes a problem.If the antistatic layer is further provided on the support, and the antistatic layer side is further roughened, The antistatic layer is peeled off at the time of roughening, and the antistatic function is completely eliminated. It is preferable to provide an antistatic treatment layer on the support before the surface is roughened from the viewpoint of production cost and the like.

Also, the effect of dust adhesion due to peeling charging is reduced. In the case of the present invention, there is no particular limitation as long as the surface specific resistance at 23 ° C./50% falls within the range of 1 × 10 ⁵ to 1 × 10 ¹⁴ Ω.

Antistatic layer is generally higher charge amount is low surface resistivity in the can prevent a decrease dust adhesion, undesirable less than 1 × 10 ⁵ Ω in the present invention. Generally, in order to achieve a resistance of less than 1 × 10 ⁵ Ω, it is necessary to add a large amount of particles such as metal particles to the antistatic layer or to add a resin having high electric conductivity. As a result, the transmission density of the support itself was reduced, the adhesion between the support and the antistatic layer was deteriorated, and peeling occurred between the antistatic layer and the support in the manufacturing process, thereby reducing the antistatic effect. Further, when another transfer foil is provided as a post-processing on a transfer foil of less than 1 × 10 ⁵ Ω, or when a UV curing layer liquid is applied, the antistatic layer contains many particles such as metal particles. In addition, a resin having high electric conductivity was inserted, and the adhesion to the foil was reduced, which was a problem.

If the resistance is 1 × 10 ¹⁴ Ω or more, the foil itself adsorbs the foreign substance in the apparatus during thermocompression bonding or before transfer, and the foreign substance gets caught on the ID card, resulting in a problem as a defective card.

The antistatic layer of the present invention contains at least one of metal oxide fine particles, conductive powder or conductive resin in order to achieve an antistatic layer in the range of 1 × 10 ⁵ to 1 × 10 ¹² Ω. Is preferred.

<Metal oxide fine particles>
Examples of the metal oxide fine particles include metal oxide fine particles that easily form nonstoichiometric compounds such as an oxygen-deficient oxide, a metal-excess oxide, a metal-deficient oxide, and an oxygen-excess oxide. Among them, the most preferred compounds for the present invention are metal oxide fine particles which can be produced in various ways by various methods.

For example, fine particles such as stannic oxide, zinc oxide, and titanium oxide can be used. Preferably, amorphous stannic oxide fine particles having conductivity of less than 10 ⁵ Ω · cm are used. More preferably, in addition to the above-mentioned conductivity, a non-crystalline material whose mass loss in the range of 200 ° C. to 500 ° C. due to heat treatment such as general thermal mass spectrometry is 0.1% by weight or more and less than 30% by weight. It is preferable to use stannic oxide fine particles. It is particularly preferable to use amorphous stannic oxide fine particles containing, in addition to the above-mentioned properties, ions, particularly an anion of at least 0.001% by weight or more inside and / or outside the fine particles. Good.

  Examples of the ion include a cation such as an ammonium ion and a hydrogen ion, an ion including a carboxylic acid group, a sulfonic acid group, an amino group and a hydroxyl group, and an anion such as a carbonate ion and a halogen ion. Details of the production of such fine particles are described in, for example, JP-A-56-143430. JP-A-56-143431, JP-A-7-77761, JP-A-2001-160326, and JP-A-10-142803 disclose crystalline metal oxide particles or JP-B-35-6616. Amorphous stannic oxide sol, amorphous vanadium pentoxide described in JP-A-55-5982, and alumina sol having an electrolyte disclosed in JP-B-57-1279. Etc. can also be used.

  The metal oxide fine particles used in the present invention preferably have a particle diameter of about 1 to 20 nm.

  The metal oxide fine particles are preferably dispersed in a hydrophilic solvent, preferably water or alcohol, to form a sol. Use of a hydrophilic solvent, particularly water, as the solvent improves environmental compatibility. The dispersion method is not particularly limited, but other components for assisting the sol at the time of dispersion and additives such as a stabilizer may be contained.

As a method for producing the conductive sol used in the present invention, for example, when the metal oxide fine particles are stannic oxide, a hydrolyzable tin compound, or a hydrolyzable tin compound and a compound containing fluorine, There is a method in which a substance subjected to a hydrolysis treatment and washed to have a halogen concentration of 0.001% or more and 3% or less is dissolved in aqueous ammonia and subjected to a heat treatment. When heat treatment is performed, the temperature is preferably 450 ° C. or lower, more preferably 300 ° C. or lower, further preferably 200 ° C. or lower, and particularly preferably 150 ° C. or lower. More preferably, it is performed in the range of 25 to 150 ° C. Examples of the hydrolyzable tin compound include a compound containing an oxo anion such as K ₂ SnO ₃ .3H ₂ O, a water-soluble halide such as SnCl ₄ , SnCl ₄ .5H ₂ O, R′2SnR2, R3SnX, R2SnX2 [R 'and R each represent an aliphatic or aromatic organic compound, and X represents a halogen. Compounds of the structure of, for example, (CH ₃₎ 3SnCl · _{(pyridine), (C 4 H 9)} 2Sn (O 2 CC 2 H 5) organometallic compounds such as _{2, Sn (SO 4) 2} · 2H 2 O And the like. When producing a conductive sol from the above-mentioned hydrolyzable compound, a compound containing another element soluble in a hydrophilic solvent, such as a fluorine compound or a carbonate, may be added.

  As the conductive sol, an aqueous amorphous stannic oxide sol, an aqueous zinc antimonate zinc oxide sol, an aqueous fluorine-doped amorphous stannic oxide sol, an aqueous titanium antimonate oxide sol, an aqueous antimony using water as a solvent. It is preferably one or more conductive sols selected from stannic oxide sols. Particularly preferably, an aqueous amorphous stannic oxide sol is used. In particular, a water-based amorphous stannic oxide sol containing no antimony is preferred because the diffusion of antimony is prevented.

  The binder resin to be mixed with the conductive sol is not particularly limited, and can be selected according to the adhesiveness to a substrate to be coated and the physical properties of a desired conductive layer. May be used, or a thermoplastic resin such as polyvinyl chloride, polyvinyl acetate, nitrocellulose, polyurethane, acrylic resin, epoxy group-containing acrylic resin, urethane acrylate resin, thermoplastic elastomer, or the like may be used as an organic solvent. These may be used in the form of an aqueous dispersion. Furthermore, a curing agent can be used together with these binders.

  As in the present invention, when the antistatic layer-provided support is subjected to post-processing, sunbuffing, and hairline processing, when a process cleaning agent is used to remove dust generated from surface processing of the support, water, It is preferable that the material does not dissolve in cleaning agents such as acidic water and alkaline water.

  A layer formed by applying a resin composition obtained by mixing a conductive sol in which a metal oxide fine particle is dispersed in a hydrophilic solvent and a binder resin is formed, a conductive sol in which the metal oxide fine particle is dispersed in a hydrophilic solvent, and a binder. After the resin composition mixed with the resin is applied on the base material, the solvent is dried and removed to form the resin composition. After the metal oxide fine particles are formed into a conductive sol, by mixing with a binder resin, it is possible to disperse the fine particles having a small particle size in the conductive layer, and the conductivity and transparency, and furthermore, with the conductive layer substrate. Adhesion, uniformity, surface smoothness, and film thickness controllability are improved.

  The particle size of the inorganic metal oxide used is not particularly limited, and is preferably 1 μm or less.

  The mixing method and the mixing ratio of the conductive sol and the binder resin are not particularly limited as long as the action of the present invention is not impaired. When the conductive sol and the binder resin are mixed, additives such as a neutralizing agent such as an amine compound, ammonia, and caustic soda, a pH adjusting agent, and a surfactant may be added. The method of applying the resin composition obtained by mixing the conductive sol and the binder resin on the substrate is not particularly limited, and a generally used method such as roll coating, air knife coating, blade coating, rod coating, and bar coating is used. it can. After application of the resin composition onto the substrate, the solvent is dried and removed using an oven, a drier, or the like, to form a conductive layer.

The thickness of the metal oxide-containing release layer is not particularly limited, preferably ^{0.000g / m 2 ~3.00g / m 2} , more preferably 0.000005g / m ² ~2.00g / m ² And more preferably 0.00001 g / m ^{2 to} 2.00 g / m ² .

<Conductive powder or conductive resin>
<Conductive powder>
As the conductive powder, tin oxide as a main component, a powder doped with a metal having a different valence such as antimony, aluminum, and boron, or a core material such as mica powder, potassium titanate, silica Powders coated with powders, zinc antimonate, indium tin oxide, gold, silver, copper, carbon black, acetylene black, organic electrolyte surfactants, and the like.

<Conductive resin>
The conductive resin is not particularly limited, and may be any of anionic, cationic, amphoteric and nonionic. Among them, preferred are anionic and cationic. More preferred are sulfonic acid-based and carboxylic acid-based polymers for anionic and tertiary amine-based and quaternary ammonium-based polymers or latex for cationic.

  These conductive resins include, for example, an anionic polymer or latex described in JP-B-52-25251, JP-A-51-29923, JP-B-60-48024, JP-B-57-18176, JP-B-57-56059, Nos. 58-56856, U.S. Pat. No. 4,118,231, and the like, and cationic polymers or latexes described in JP-A-2000-191971, such as polypyrroles, polythiophenes, polyaniline, polyphenylenevinylene, and polyparaphenylene. Examples include phenylene and polymetaphenylene.

  These conductive powders and conductive resins can be used alone or in combination with other binders. As the binder, an acrylic thermoplastic resin, a photo-curable resin, a thermo-curable resin, polyurethane, polyester, polyvinyl butyral, polyvinyl acetal, polycarbonate, polystyrene, polypropylene, or the like can be used. Furthermore, a curing agent can be used together with these binders. As in the present invention, when the support provided with the antistatic layer is subjected to sun-dot processing and hairline processing by post-processing, a process cleaning agent is used to remove dust generated from surface processing of the support. It is preferable that the material does not dissolve in a cleaning agent such as acidic water and alkaline water.

Conductive powder, the thickness of the made of a conductive resin release layer is not particularly limited, preferably ^{0.000g / m 2 ~3.00g / m 2} , more preferably 0.000005g / m ² ~2 0.000 g / m ² , and more preferably 0.00001 g / m ^{2 to} 2.00 g / m ² .

  When a binder is used in combination, the ratio of the conductive powder or conductive resin to the binder is preferably 99: 1 to 1:99, more preferably 80:20 to 5:95, and more preferably 70:30 to 5:95 by weight. Is particularly preferred.

  As a method for receiving an antistatic layer, a method such as roll coating, air knife coating, blade coating, rod coating, bar coating and the like generally used with a general organic solvent or water can be used. After application of the resin composition onto the substrate, the solvent is dried and removed using an oven, a drier, or the like, to form a conductive layer.

  In addition, when making printing inks using these, concretely, the gravure printing method, the screen printing method, and the offset printing method are possible, and the printing is performed according to the film thickness and the required printing film thickness to be formed on the film. Choose a law. For example, screen printing is suitable when a thick film thickness is required, and gravure printing or offset printing is suitable for thin printing. When a printing ink is used, a known conductive ink can be used. For example, the conductive ink may be used as described in JP-A-9-59553, JP-A-7-57545, and JP-A-2000-191971. Can be.

In the present invention, a transfer foil support having a surface specific resistance of 10 ¹³ Ω or less at 23 ° C./50% is formed by using any one of metal oxide fine particles, conductive powder and conductive resin. can do.

[Surface resistivity measurement method]
The surface specific resistance was measured according to JIS K6911 using a high resistance meter at 23 ° C./50% at an electrode of 50 mmφ / 70 mmφ, an applied voltage of 10 V, and a voltage application time of 10 sec.

  The transfer foil in the present invention can be prepared using the specific transfer foil support described above or the following support. In the present invention, it is preferable to use a transfer foil in which at least a photocurable layer and an adhesive layer are laminated on a substrate, and more preferably, from the viewpoint of preventing dust adhesion, transfer foil transferability (foil cut property), and transfer surface appearance. It is preferable to provide it on the support for a specific transfer foil described above.

  In the transfer foil of the present invention, the following release layer may be provided in addition to the photocurable layer and the adhesive layer. By providing the release layer, the releasability from the support becomes easy, and the average peeling force and the initial peeling force between the support and the transfer layer at 30 ° C. can be adjusted.

[Transfer foil release layer]
As the release layer, acrylic resins having a high glass transition temperature, resins such as polyvinyl acetal resins, polyvinyl butyral resins, waxes, silicone oils, fluorine compounds, water-soluble polyvinyl pyrrolidone resins, polyvinyl alcohol resins, and Si-modified Polyvinyl alcohol, methylcellulose resin, hydroxycellulose resin, silicone resin, paraffin wax, acryl-modified silicone, polyethylene wax, ethylene vinyl acetate, and other resins.In addition, polydimethylsiloxane and its modified products, for example, polyester-modified silicone, acrylic-modified Oils and resins such as silicone, urethane-modified silicone, alkyd-modified silicone, amino-modified silicone, epoxy-modified silicone, polyether-modified silicone, The cured product, and the like. Other fluorinated compounds include fluorinated olefins and perfluorophosphate compounds. Preferred olefin compounds include dispersions of polyethylene and polypropylene, and long-chain alkyl compounds such as polyethyleneimine octadecyl. These release agents having poor solubility can be used after being dispersed. The release layer preferably has a weight of 0.000005 to 2.0 g / m ² . Especially preferably, it is 0.00001-2.0 g / m < ² >, More preferably, it is 0.00005-2.0 g / m < ² >.

  When transferring two transfer foils, a thermoplastic elastomer may be added. Specific examples of the thermoplastic elastomer include styrene (styrene block copolymer (SBC)), olefin (TP), urethane (TPU), polyester (TPEE), polyamide (TPAE), and 1,2-polybutadiene. , PVC (TPVC), fluorine, ionomer resin, chlorinated polyethylene, silicone, and the like, and are specifically described in the 1996 edition "12996 Chemical Products" (Chemical Industry Daily).

  The thermoplastic elastomer preferably comprising a block polymer of polystyrene and polyolefin, preferably used in the present invention, is a thermoplastic resin comprising a block of styrene and a linear or branched saturated alkyl having 10 or less carbon atoms (hereinafter also referred to as thermoplastic resin S1). Say). In particular, styrene-butadiene-styrene (SBS), styrene-isoprene-styrene (SIS), styrene-ethylene / butylene-styrene (SEBS), and styrene-ethylene / block polymers having a polystyrene phase and a polyolefin-hydrogenated phase. Examples include propylene-styrene (SEPS) and styrene-ethylene / propylene (SEP) block polymers.

  If necessary, a thermosetting resin layer may be used between the release layer of the present invention and the resin layer or the actinic ray-curable layer. Specific examples include polyester resin, acrylic resin, epoxy resin, xylene resin, guanamine resin, diallyl phthalate resin, phenol resin, polyimide resin, maleic acid resin, melamine resin, urea resin, polyamide resin, urethane resin, and the like.

  Next, it is preferable to provide a photocurable layer adjacent to the release layer.

[Light cured layer]
The actinic ray-curable resin layer of the present invention is composed of a material having addition polymerizability or ring-opening polymerizability. No. 7-31399, JP-A-10-97067, JP-A-2000-258903, JP-A-2001-138677, etc., using a photocurable (including thermopolymerizable) composition described in the specification. It may be a material. As the addition polysynthetic compound, a cationically curable photocurable material is known, and a cationically photocurable photocurable material is also disclosed, for example, in JP-A-6-43633. As a photocurable material of the hybrid polymerization type, a composition is disclosed in JP-A-4-181944 and the like.

Specifically, it is a photocurable layer containing any of a radical initiator, a radical polymerizable compound, a cationic initiator, and a cationic polymerizable compound. For the purpose of the present invention, any photocurable layer is used. No problem. Table 1 shows examples of the composition of the photocurable layer.
Table 1

[Radical polymerization initiator]
Examples of the radical polymerization initiator include triazine derivatives described in JP-B-59-1281, JP-B-61-9621, and JP-A-60-60104, JP-A-59-1504 and JP-A-61-60104. Organic peroxides described in JP-A-243807, JP-B-43-23684, JP-B-44-6413, JP-B-44-6413 and JP-B-47-1604, and U.S. Pat. 3,567,453, diazonium compounds described in U.S. Pat. Nos. 2,848,328, 2,852,379 and 2,940,853, and organic azide compounds described in each of U.S. Pat. Ortho-quinonediazides described in JP-B-36-22062, JP-B-37-13109, JP-B-45-9610, etc .; JP-B-55-39162; Nos. 9-14023 and various onium compounds described in Macromolecules, vol. 10, p. 1307 (1977); azo compounds described in JP-A-59-142205; JP-A-1-54440, European Patent No. 109,851, European Patent No. 126,712, etc., "Journal of Imaging Science" (J. Imag. Sci.), No. 30, Vol., P. 174 (1986), an (oxo) sulfonium organoboron complex described in Japanese Patent Application Nos. 4-56831 and 4-89535, Patent No. 151197, titanocenes, “Coordination Chemistry Review (Coordinant) on Chemistry Review), Vol. 84, pp. 85-277) (1988) and a transition metal complex containing a transition metal such as ruthenium described in JP-A-2-182701, JP-A-3-209777. Examples thereof include 2,4,5-triarylimidazole dimer, carbon tetrabromide, and organic halogen compounds described in JP-A-59-107344 described in the publication. These polymerization initiators are preferably contained in a range of 0.01 to 10 parts by weight based on 100 parts by weight of the radically polymerizable compound having an ethylenically unsaturated bond.

  The photosensitive composition containing a radical polymerizable compound may contain, as a thermal polymerization initiator for a radical polymerizable monomer, a known radical polymerization initiator generally used for a polymer synthesis reaction by radical polymerization without any particular limitation. it can. Here, the thermal polymerization initiator is a compound capable of generating a polymerizable radical by applying thermal energy.

  Examples of such compounds include azobisnitrile compounds such as 2,2'-azobisisobutyronitrile and 2,2'-azobispropionitrile, benzoyl peroxide, lauroyl peroxide, and acetyl peroxide. T-butyl perbenzoate, α-cumyl hydroperoxide, di-t-butyl peroxide, diisopropyl peroxydicarbonate, t-butyl peroxyisopropyl carbonate, peracids, alkyl peroxycarbamates, nitrosoaryl acyl Organic peroxides such as amines, inorganic peroxides such as potassium persulfate, ammonium persulfate, potassium perchlorate, diazoaminobenzene, p-nitrobenzenediazonium, azobis-substituted alkanes, diazothioethers, arylazosulfones, etc. Azo or diazo compounds Nitroso phenylurea, tetramethylthiuram disulfide, diaryl disulfides, dibenzoyl disulfide, tetraalkyl thiuram disulfides, dialkyl xanthate disulfides, aryl sulfinic acids, arylalkyl sulfonic acids, may be mentioned 1-alkanoic sulfinic acids and the like.

  Particularly preferred among these are compounds which are excellent in stability at normal temperature, have a high decomposition rate upon heating, and become colorless upon decomposition, and the initiator is usually 0.1% in the total polymerizable composition. -30% by weight is preferable, and the range of 0.5-20% by weight is more preferable.

[Radical polymerization type photocurable layer composition]
Radical polymerizable composition The radical polymerizable compound contained in the radical polymerizable composition includes ordinary photopolymerizable compounds and thermopolymerizable compounds. The radically polymerizable compound is a compound having a radically polymerizable ethylenically unsaturated bond, and may be any compound as long as it has at least one radically polymerizable ethylenically unsaturated bond in the molecule. , Oligomers, polymers and the like having a chemical form. Only one radical polymerizable compound may be used, or two or more radical polymerizable compounds may be used in an optional ratio in order to improve desired properties.

  Examples of the compound having a radically polymerizable ethylenically unsaturated bond include unsaturated carboxylic acids such as acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid and maleic acid, and salts, esters, urethanes and amides thereof. And anhydrides, acrylonitrile, styrene, and various other radically polymerizable compounds such as unsaturated polyesters, unsaturated polyethers, unsaturated polyamides, and unsaturated urethanes. Specifically, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, butoxyethyl acrylate, carbitol acrylate, cyclohexyl acrylate, tetrahydrofurfuryl acrylate, benzyl acrylate, bis (4-acryloxypolyethoxyphenyl) propane, neopentyl glycol Diacrylate, 1,6-hexanediol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, polyethylene glycol diacrylate, polypropylene glycol diacrylate, pentaerythritol triacrylate, pentaerythritol Tetraacrylate, dipentaery Litol tetraacrylate, trimethylolpropane triacrylate, tetramethylol methane tetraacrylate, oligoester acrylate, N-methylol acrylamide, diacetone acrylamide, acrylic acid derivatives such as epoxy acrylate, methyl methacrylate, n-butyl methacrylate, 2-ethylhexyl methacrylate , Lauryl methacrylate, allyl methacrylate, glycidyl methacrylate, benzyl methacrylate, dimethylaminomethyl methacrylate, 1,6-hexanediol dimethacrylate, ethylene glycol dimethacrylate, triethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, polypropylene glycol dimethacrylate, trimethylol Methacryl derivatives such as tantrimethacrylate, trimethylolpropanetrimethacrylate, 2,2-bis (4-methacryloxypolyethoxyphenyl) propane, and derivatives of allyl compounds such as allyl glycidyl ether, diallyl phthalate, and triallyl trimellitate More specifically, Shinzo Yamashita eds., "Crosslinking Agent Handbook", (1981 Taisei Corporation); Kato Kiyomi, eds., "UV / EB Curing Handbook (Raw Materials)" (1985, Polymer Publishing) Association); Radtec Research Association, "Applications and Markets of UV / EB Curing Technology", 79 pages, (1989, CMC); Eiichiro Takiyama, "Polyester Resin Handbook", (1988, Nikkan Kogyo Shimbun) Etc. or commercially available radical polymerizable or crosslinkable monomers described in the industry , Oligomers and polymers can be used.

  Urethane oligomers, caprolactone-modified acrylates, isocyanuric acid-modified (meth) acrylates, epoxy acrylates, glycol-based (meth) acrylates, etc. in order to achieve the physical properties of the present invention having a breaking elongation of 10 to 90%. It is preferable to employ The amount of the radical polymerizable compound to be added in the radical polymerizable composition is preferably 1 to 97% by weight, more preferably 30 to 95% by weight.

[Cationic polymerization initiator]
Specific examples of the cationic polymerization initiator include an aromatic onium salt. Examples of the aromatic onium salt include salts of elements of Group Va in the periodic table such as phosphonium salts (eg, triphenylphenacylphosphonium hexafluorophosphate) and salts of elements of Group VIa such as sulfonium salts (eg, triphenylsulfonium tetrafluoroborate). , Triphenylsulfonium hexafluorophosphate, tris (4-thiomethoxyphenyl) hexafluorophosphate, triphenylsulfonium sulphonium and hexisafluoroantimonate, and salts of Group VIIa elements such as iodonium salts (eg, diphenyliodonium chloride) Etc.).

  The use of such an aromatic onium salt as a cationic polymerization initiator in the polymerization of epoxy compounds is disclosed in U.S. Pat. Nos. 4,058,401, 4,069,055 and 4,101,513. And No. 4,161,478.

  Preferred cationic polymerization initiators include sulfonium salts of Group VIa elements. Among them, triarylsulfonium hexafluoroantimonate is preferable from the viewpoint of ultraviolet curability and storage stability of the ultraviolet curable composition. Also, known photopolymerization initiators described in Photopolymer Handbook (published by the Industrial Research Committee of the Photopolymer Society, 1989), pages 39 to 56, described in JP-A-64-13142 and JP-A-2-4804. Can be used arbitrarily.

[Cation polymerization photocurable resin]
Cationic polymerizable compound Epoxy type ultraviolet curable prepolymer of the type (mainly epoxy type) that polymerizes due to cationic polymerization. Monomers include prepolymers containing two or more epoxy groups in one molecule. it can. Examples of such prepolymers include alicyclic polyepoxides, polyglycidyl esters of polybasic acids, polyglycidyl ethers of polyhydric alcohols, polyglycidyl ethers of polyoxyalkylene glycol, and polyglycidyl of aromatic polyol. Examples include ethers, hydrogenated compounds of polyglycidyl ethers of aromatic polyols, urethane polyepoxy compounds, epoxidized polybutadienes, and the like. One of these prepolymers can be used alone, or two or more of them can be used as a mixture.

The content of the prepolymer having two or more epoxy groups in one molecule is preferably 70% by weight or more. Other cationic polymerizable compounds contained in the cationic polymerizable composition include, for example, the following (1) styrene derivatives, (2) vinylnaphthalene derivatives, (3) vinyl ethers, and (4) N-vinyl compounds. Can be mentioned.
(1) Styrene derivatives For example, styrene, p-methylstyrene, p-methoxystyrene, β-methylstyrene, p-methyl-β-methylstyrene, α-methylstyrene, p-methoxy-β-methylstyrene and the like (2) Vinyl naphthalene derivatives, for example, 1-vinyl naphthalene, α-methyl-1-vinyl naphthalene, β-methyl-1-vinyl naphthalene, 4-methyl-1-vinyl naphthalene, 4-methoxy-1-vinyl naphthalene, etc. (3) vinyl ether And the like, for example, isobutyl vinyl ether, ethyl vinyl ether, phenyl vinyl ether, p-methylphenyl vinyl ether, p-methoxyphenyl vinyl ether, α-methylphenyl vinyl ether, β-methyl isobutyl vinyl ether, β-chloroisobutyl vinyl ether and the like. Nyl compounds such as N-vinylcarbazole, N-vinylpyrrolidone, N-vinylindole, N-vinylpyrrole, N-vinylphenothiazine, N-vinylacetanilide, N-vinylethylacetamide, N-vinylsuccinimide, N-vinylphthalimide, N-vinylcaprolactam, N-vinylimidazole and the like. The content of the cationically polymerizable compound in the cationically polymerizable composition is preferably from 1 to 97% by weight, more preferably from 30 to 95% by weight.

[Hybrid photocurable resin layer]
When a hybrid type (a combination of a radical polymerizable type and a cationic polymerization type) is used, a composition is disclosed in JP-A-4-181944 and the like. Specifically, any of the above-mentioned cationic initiator, cationic polymerizable compound, radical initiator, and radical polymerizable compound may be included, and particularly in the case of the present invention, the cationic polymerizable compound is a vinyl ether compound Preferably, it is used.

[Other additives to the photocurable resin layer]
Sensitizer The photosensitive composition of the present invention, by forming a composition in combination with various sensitizers, enhances the activity against light in the ultraviolet to near-infrared region, and a highly sensitive polymerizable composition. It is possible to Specific examples of the sensitizer in the present invention include unsaturated ketones such as chalcone derivatives and dibenzalacetone, 1,2-diketone derivatives such as benzyl and camphorquinone, benzoin derivatives, and fluorene. Derivatives, naphthoquinone derivatives, anthraquinone derivatives, xanthene derivatives, thioxanthene derivatives, xanthone derivatives, thioxanthone derivatives, coumarin derivatives, ketocoumarin derivatives, cyanine derivatives, styryl derivatives, merocyanine derivatives, polymethine dyes such as oxonol derivatives, acridine derivatives, azine derivatives, thiazines Derivatives, oxazine derivatives, indoline derivatives, azulene derivatives, azurenium derivatives, squarylium derivatives, porphyrin derivatives, tetraphenylporphyrin derivatives, triarylmethane derivatives Body, tetrabenzoporphyrin derivative, tetrapyrazinoporphyrazine derivative, phthalocyanine derivative, tetraazaporphyrazine derivative, tetraquinoxalyloporphyrazine derivative, naphthalocyanine derivative, subphthalocyanine derivative, pyrylium derivative, thiopyrylium derivative, tetrafilin derivative, annulene Derivatives, spiropyran derivatives, spirooxazine derivatives, thiospiropyran derivatives, metal arene complexes, organic ruthenium complexes, and the like. More specifically, edited by Nobuo Okawara et al., “Dye Handbook” (1986, Kodansha), Nobuo Okawara et al. Ed., "Chemistry of Functional Dyes" (CMC, 1981), edited by Chusaburo Ikemori et al., "Special Functional Materials" (CMC, 1986), and the dyes described in Japanese Patent Application No. 7-108045. You And sensitizers include, but are not limited to, dyes and sensitizers that absorb ultraviolet light in the near infrared region, and any of these may be used as necessary. Two or more kinds may be used in a ratio.

Polymerization accelerator, chain transfer agent, etc. A polymerization accelerator or a chain transfer catalyst can be added to the photosensitive composition of the present invention. Specific examples thereof include amines such as N-phenylglycine, triethanolamine and N, N-diethylaniline; thiols described in U.S. Pat. No. 4,414,312 and JP-A-64-13144; Disulfides described in JP-A-2-291561, thiones described in U.S. Pat. No. 3,558,322 and JP-A-64-17048, o-acylthiohydroxamates and N -Alkoxypyridinethiones.

Polymerization Inhibitor In the radically polymerizable composition containing the radically polymerizable compound, a polymerization inhibitor can be contained in the photocurable resin layer for the purpose of preventing polymerization during storage of the liquid. Specific examples of the thermal polymerization inhibitor that can be added to the radical polymerizable composition include p-methoxyphenol, hydroquinone, alkyl-substituted hydroquinone, catechol, tert-butylcatechol, phenothiazine, and the like. The agent is preferably added in the range of 0.001 to 5 parts by weight based on 100 parts by weight of the radical polymerizable compound having an ethylenically unsaturated bond. In the present invention, since the elongation at break of the photocurable layer gradually increases with time, the use of the polymerization inhibitor is an effective means to suppress the generation of radicals with time.

Surfactant In the image forming layer of the image forming material of the present invention, a nonionic surfactant such as those described in JP-A Nos. 62-251740 and 3-208514 is disclosed. Alternatively, an amphoteric surfactant as described in JP-A-59-121044, JP-A-4-13149 and the like can be added.

  A surfactant such as silicone oil, a silicone-alkylene oxide copolymer (for example, L-5410 commercially available from Union Carbide), a silicone-based activator such as manufactured by Nippon Unicar, and a silicone oil-containing aliphatic epoxide. And silicon-containing monoepoxides. Si-based additives described in Toshiba Silicone Co., Ltd., "New Silicone and Its Application" published in 1994, Asmax Co., Ltd., "Special Silicone Reagent Catalog" published in 1996, etc. can also be used. The addition amount is preferably 0.001 to 1% by weight.

Resins Other than polyvinyl butyral resin, polyurethane resin, polyamide resin, polyester resin, epoxy resin, novolak resin, vinyl monomer such as styrene, p-methylstyrene, methacrylate, acrylate, cellulose-based, thermoplastic polyester, natural Any other high-molecular polymer such as a resin may be used in combination. In addition, other publicly known in the industry described by Kiyoshi Akamatsu, “Actual Technology of New Photosensitive Resins”, (CMC, 1987) and “Chemical Products of 10188”, pages 657 to 767 (Chemical Industry Daily, 1988). May be used in combination. In the present invention, an unsaturated group-containing resin is preferable in order to improve the adhesion to an adjacent layer, and is characterized by containing a group polymerizable by a radical or an acid. The unsaturated group is a glycidyl group here. , (Meth) acryloyl group, vinyl group and the like. Specifically, resins described in specifications such as JP-A-2000-258903 and JP-A-2001-138677 can be used. The monomer unit having an unsaturated group unit is contained in an amount of 0.001 to 10% by weight, more preferably 0.001 to 5% by weight, based on 100% by weight of the total binder. When the content of the unit represented by the general formula (1) is lower than 0.001% by weight, the crosslink density of the cured layer decreases due to the decrease in the amount of unsaturated groups, so that the chemical resistance deteriorates and the scratch strength deteriorates. Get up. If it is more than 10% by weight, the product stability of the binder alone is poor, which is a problem.

Specifically, a resin having a structure represented by Structural Formula 1 can be given.
Structural formula 1

  The content of these high-molecular polymers in the photosensitive composition is preferably in the range of 1 to 70% by weight, and more preferably in the range of 5 to 50% by weight.

Coating Solvent In the present invention, the coating solvent is not limited, and the case of using the coating solvent is described in detail in "Solvent Handbook" issued by Kodansha. There is no particular limitation on the use of these organic solvents.

  The photosensitive composition of the present invention may further comprise, depending on the purpose, dyes, organic and inorganic pigments, oxygen removing agents such as phosphine, phosphonate, and phosphite, reducing agents, antifoggants, anti-fading agents, antihalation agents, and fluorescent enhancers. Whitening agents, coloring agents, extenders, plasticizers, flame retardants, antioxidants, ultraviolet absorbers, foaming agents, antifungal agents, magnetic substances and other additives that impart various properties, mixed with diluting solvents, etc. May be used.

This photocured cured layer preferably has a weight of 3.0 to 15 g / m ² . Particularly preferably, it is 3.0 to 12 g / m ² , more preferably 5.0 to 12 g / m ² . If it is less than 3.0 g / m ^{2, if} it is prepared as a transfer foil and provided on an ID card, the scratch strength is reduced, which is problematic. If the thickness of the photo-cured layer is 15 g / m ² or more, the scratch strength is good, but the resin of the photo-cured layer has a high elongation at break, so that the foil is poorly cut and transfer failure occurs.

  As a method for curing the photocurable layer, there are various methods such as a method of curing at the time of production of the transfer foil and a method of exposing the transfer foil after transferring it onto a card, and any method may be adopted. In the present invention, a method of curing during the production of the transfer foil is preferable from the viewpoint of production stability and maintainability of the card issuing device.

  Examples of the actinic ray include a laser, a light emitting diode, a xenon flash lamp, a halogen lamp, a carbon arc lamp, a metal halide lamp, a tungsten lamp, a mercury lamp, a high-pressure mercury lamp, and an electrodeless light source. Preferably, a light source such as a xenon lamp, a halogen lamp, a carbon arc lamp, a metal halide lamp, a tungsten lamp, and a mercury lamp is used.The energy applied at this time adjusts the exposure distance, time, and intensity according to the type of the polymerization initiator. Thus, it can be selected and used as appropriate. The actinic ray may be optionally blocked with air by nitrogen replacement, under reduced pressure or the like to increase the polymerization rate. When a laser is used as a light source, the exposure area can be easily reduced to a very small size, and a high-resolution image can be formed. As a laser light source, any of an argon laser, a He—Ne gas laser, a YAG laser, a semiconductor laser and the like can be suitably used. In the present invention, a metal halide lamp, a tungsten lamp, a mercury lamp, and a high-pressure mercury lamp are preferable because they are inexpensive.

  The photocurable layer according to the present invention has an initial elongation at break of 10% to 90% after preparation and an elongation at break of 10% after storage at 50 ° C. for 3 days under humidity. It is preferably 90%. Conventionally, JP-A-2000-258903, JP-A-2001-138677, and the like disclose a cured layer in which a single layer of a photocured layer has a breaking elongation of 10% to 90%. This study revealed that the bendability was poor over time after the card was formed after the transfer foil was formed. As a result of elucidating the cause in this study, the main factor was that the elongation at break gradually decreased over time due to the influence of the remaining photopolymerization initiator and the like. Thus, the present inventors have clarified that the bendability after storage can be improved by selecting a radical polymerizable compound capable of improving the elongation at break. The term “bending after storage” in the present invention is based on the assumption that after transfer foil production and after the transfer foil has been formed, the card has passed several years. The elongation was defined as a storage condition because there was no fluctuation.

  If the elongation at break is 10% or less including before and after storage, there is a problem because the card bendability deteriorates. On the other hand, when it is 90% or more, the photocurable layer has a high elongation at break, so that the photocurable layer cannot be cut during transfer, and unnecessary portions of the transfer are removed from the foil, resulting in poor transfer.

[Measurement of elongation at break]
Resin elongation at break (%) was measured at 23 ° C. and 55% RH. After photo-curing, the resin layer was allowed to stand for 24 hours or more. Then, using Orientec Tensilon Universal Tester RTA-100, the data processing was performed using Tensilon Multiplicity. Functional type data processing TYPE MP-100 / 200S Ver. 44 was used for the measurement. The resin fixing means was fixed by an air chuck method. The pulling speed can be selected from 5 to 100 mm / min, the RANGE can be selected from 5 to 100%, and the load can be selected from 0.1 to 500 kg. In the evaluation of the present invention, the sample width is 10 mm, the distance between the chucks is 50 mm, and the pulling speed is: The evaluation was performed under the conditions of 10 mm / min, RANGE of 20%, and load of 100 kg.

  In measuring the elongation at break, since it is particularly difficult to prepare a single film, a 10 μm photo-cured layer is formed on 25 μm PET manufactured by Teijin Limited and exposed with a metal halide lamp at an integrated exposure dose of 250 mj to produce a desired sample. did. The elongation at break was calculated from the elongation at break when the actinic radiation-curable resin was broken or cracked during stretching.

  In the present invention, the adhesive layer is provided to improve the adhesive force with the ID card base material. However, from the viewpoint of the adhesiveness with the photocurable layer, the interlayer adhesiveness, and the applicability, the photocurable layer described above, In addition to the layer, a primer layer, a barrier layer, an intermediate layer, an ultraviolet absorbing layer, an optical change element layer, and the like may be provided.In addition to the photocurable layer and the release layer, an adhesive layer is provided on the outermost layer of the transfer foil. There is no particular limitation if it is.

  In the present invention, it is preferable that at least one of a primer layer, a barrier layer, and an intermediate layer is provided from the viewpoint of transferability of the card. The primer layer refers to a layer used for improving interlayer adhesion and adhesion to an ID card. The barrier layer refers to a layer that improves applicability and the like when laminating each layer. The intermediate layer is a layer that improves the applicability and the like when the respective layers are laminated, and also indicates that the interlayer adhesion is improved. The hologram layer and the optical change element layer are layers that can be provided when it is necessary to prevent forgery and falsification, and can be provided when necessary.

  Materials used for the primer layer, the barrier layer, and the intermediate layer include, for example, a vinyl chloride resin, a polyester resin, an acrylic resin, a polyvinyl acetal resin, a polyvinyl butyral resin, a polyvinyl alcohol, a polycarbonate, a cellulose resin, and a styrene resin. Thermoplastic elastomers such as resin, urethane-based resin, amide-based resin, urea-based resin, epoxy resin, phenoxy resin, polycaprolactone resin, polyacrylonitrile resin, SEBS resin, and SEPS resin, and modified products thereof can be used.

  Among the above-mentioned resins, preferred for the purpose of the present invention are vinyl chloride resin, polyester resin, acrylic resin, polyvinyl butyral resin, styrene resin, epoxy resin, urethane resin, urethane acrylate resin, SEBS resin. , SEPS resin. These resins can be used alone or in a combination of two or more.

  As a specific compound, a thermoplastic resin composed of a block polymer of polystyrene and polyolefin, polyvinyl butyral, and the like are preferable. In the intermediate layer of the present invention, as a polyvinyl butyral resin having a degree of polymerization of 1000 or more, S-Lek BL-S, BH-3, BX-1, BX-2, BX-5, and BX-55 manufactured by Sekisui Chemical Co., Ltd. , BH-S, Denka Butyral # 4000-2, # 5000-A, # 6000-EP and the like manufactured by Denki Kagaku Kogyo KK are commercially available. The thermosetting resin of the polybutyral in the intermediate layer is not limited to the degree of polymerization before the thermosetting, and may be a resin having a low degree of polymerization.The thermosetting can be performed using an isocyanate curing agent or an epoxy curing agent. Is preferably at 50 to 90 ° C. for 1 to 48 hours. The thickness of the primer layer, the barrier layer, and the intermediate layer is preferably from 0.1 to 3.0 μm. More preferably, it is 0.1 to 2.5 μm. Further, additives such as an ultraviolet absorber, an antioxidant, and a light stabilizer described below may be contained. When an ultraviolet absorber, an antioxidant, a light stabilizer or the like is added, the content is preferably 0.05 to 20% by weight, more preferably 0.05 to 10% by weight, based on the binder resin of the added layer. Preferably, there is. If the addition amount is 20% or more, the effect of the binder is significantly reduced, and the function of each layer is deteriorated. When the content is less than 0.05%, the above additive does not function.

  The ultraviolet absorber may be any as long as it functions as an ultraviolet absorber for dye images and is capable of thermal transfer. For example, JP-A-59-158287, JP-A-63-74686, JP-A-63-145089, and JP-A-59-196292. Nos. 63-122596, 61-283595, and JP-A-1-204788, and compounds known to improve image durability in photographs and other image recording materials. can do.

  Specific examples thereof include those based on salicylic acid, benzophenone, benzotriazole, and cyanoacrylate. For example, Tinuvin P, Tinuvin 123, 234, 320, 326, 327, 328, 312, 315, 384, 400 (manufactured by Ciba Geigy) ), Sumisorb-110, 130, 140, 200, 250, 300, 320, 340, 350, 400 (manufactured by Sumitomo Chemical Co., Ltd.), MarkLa-32, 36, 1413 (manufactured by Adeka Gas Chemical Co., Ltd.) Etc. can be used.

  Pendant polymers having a benzophenone derivative or the like in the side chain are also preferably used. In addition, inorganic fine particles having absorption in the ultraviolet region, ultrafine metal oxide powder dispersants, and the like can also be used. Examples of the inorganic fine particles include titanium oxide, zinc oxide, and a silicon compound. As ultrafine metal oxide powder dispersants, ultrafine zinc oxide powder, ultrafine titanium oxide powder, etc. are mixed with water or an alcohol mixture or various oily dispersion media, and a surfactant, a water-soluble polymer or a solvent-soluble polymer. And the like using a dispersant such as

  Examples of the antioxidant include antioxidants described in JP-A-59-182785, JP-A-60-130735, JP-A-1-127287, and the like, and improve image durability in photographs and other image recording materials. Known compounds can be mentioned as examples. Specific examples include phenol-based, monophenol-based, bisphenol-based and amine-based primary antioxidants, and sulfur-based and phosphorus-based secondary antioxidants. Examples thereof include Sumilizer BBM-S, BHT, and BP-76. , MDP-S, GM, WX-R, BP-179, GA, TPM, TP-D, TNP (manufactured by Sumitomo Chemical Co., Ltd.), Irganox-245, 259, 565, 1010, 1035, 1076, 1081, Products having trade names such as 1098, 3114 (manufactured by Ciba Geigy), MarkAQ-20, AO-30, and AO-40 (manufactured by Adeka Argus Chemical Co., Ltd.) can be used.

  Examples of the light stabilizer include JP-A-59-158287, JP-A-63-74686, JP-A-63-145089, JP-A-59-196292, JP-A-63-122596, JP-A-61-283595, and JP-A-1-204788. And compounds known to improve the image durability of photographs and other image recording materials. Specific examples include hindered amines and the like. For example, Tinuvin 622LD, 144, Chimassob 944 LD (manufactured by Ciba Geigy), Sanol LS-770, LS-765, LS-292, LS-2626, LS-114, LS-774 ( Products having trade names such as Sankyo Co., Ltd. and Mark LA-62, LA-67, LA-63, LA-68, LA-82, LA-87 (manufactured by Adeka Argas Chemical Co., Ltd.) can be used.

  As the adhesive layer of the transfer foil, ethylene vinyl acetate resin, ethyne ethyl acrylate resin, ethylene acrylic acid resin, ionomer resin, polybutadiene resin, acrylic resin, polystyrene resin, polyester resin, olefin resin, urethane resin as a heat-adhesive resin, Tackifiers (for example, phenolic resin, rosin resin, terpene resin, petroleum resin, etc.) and the like, and copolymers or mixtures thereof may be used.

  Specifically, as a urethane-modified ethylene ethyl acrylate copolymer, Hitec S-6254, S-6254B, S-3129 and the like manufactured by Toho Chemical Industry Co., Ltd. are commercially available, and as a polyacrylate copolymer, Japan is used. Julimer AT-210, AT-510, AT-613 manufactured by Junyaku Co., Ltd., plus size L-201, SR-102, SR-103, J-4 manufactured by Kyogo Chemical Co., Ltd. are commercially available. I have. The weight ratio of the urethane-modified ethylene ethyl acrylate copolymer to the polyacrylate copolymer is preferably from 9: 1 to 2: 8, and the thickness of the adhesive layer is preferably from 0.1 to 1.0 μm.

  An optical change element layer can be provided for the purpose of preventing forgery and falsification. An optical variable device (OVD) is 1) a two-dimensional CG image of a diffraction grating such as a kinegram, in which an image having a line image structure moves freely, such as moving, rotating, expanding, and reducing. 2) Pixels such as Pixelgram that change positively and negatively 3) Colors such as OSD (Optical Security Device) change from gold to green 4 ) An image such as LEAD (Long Lasting Economical Antibody Device) that looks and changes, 5) a stripe type OVD, 6) a metal foil, etc., which is the 35th issue of the Printing Society of Japan (1998) Vol. Paper materials, special printing techniques, and special printing techniques as described on pages 482 to 496 Security may be maintained with a key or the like. In the present invention, a hologram is particularly preferred.

  When a hologram is used, for example, a relief hologram, a Fresnel hologram, a Fraunhofer hologram, a lensless Fourier transform hologram, a laser reproduction hologram such as an image hologram, a Lipogram hologram, a white reproduction hologram such as a rainbow hologram, a color hologram, a computer hologram, a hologram display, Multiflex holograms, hologram flex stereograms, holographic diffraction gratings, etc. can be arbitrarily adopted.

  In the present invention, in a transfer foil having a specific light-cured layer in which the photocurable layer has a breaking elongation at 23 ° C. of 10 to 90% and a breaking elongation after storage at 50 ° C. for 3 days of 10 to 90%, the transfer medium The research has revealed that the peeling force between the support and the transfer layer is important when transferring and peeling off (ID card) and heat and pressure.

  In the present invention, these are referred to as an average peel force and an initial break peel force. The initial rupture force refers to a force at which the transfer layer peels from the foil while breaking. The average peeling force represents an average value at which the transfer layer peels from the support after the initial breakage.

  As shown in FIG. 3, when the transfer foil 16 is transferred to the image recording body 15 by heating and pressing, and the temperature is increased when the transfer foil 16 is peeled off by the peeling roll 17, the transfer unnecessary portion shown in FIG. As in the non-transferred portion of the transfer foil of (1), the cutting of the foil becomes worse and the peeling force increases, so that adjustment is necessary.

  In order to improve the breakage of the photocurable layer resin having a breaking elongation of 10 to 90%, the average peeling force between the support and the transfer layer at 30 ° C. of the transfer foil is 3.5 to 25 g / 90 ° at a peeling angle. cm is preferable. Further, it is preferable that the initial breaking peel force of the transfer layer at 30 ° C. of the transfer foil be 15 to 150 g / cm at a peel angle of 90 °.

  Preferably, any one of the average peeling force and the initial breaking peeling force may be satisfied, and it is preferable that the average peeling force and the initial breaking peeling force are satisfied. When the average peeling force is 3.5 g / cm or less, the elongation of the photocurable layer is high, so that the foil breakage is poor and transfer failure occurs. If it is 25 g / cm or more, an untransferred ID card is produced without peeling during transfer. The average peel force is preferably from 3.5 g / cm to 20 g / cm. The initial peeling force is preferably from 20 g / cm to 150 g / cm. When the initial peeling force was 15 g / cm or less, the photocurable layer was poorly cut, resulting in poor transfer. On the other hand, if it is 150 g / cm or more, an untransferred portion is generated on the card due to the weight of the initial peeling force, causing a problem.

[Peeling force measurement method]
As shown in FIG. 5, the transfer foil 11 having the specific light-cured layer having a breaking elongation at 23 ° C. of 10 to 90% and a breaking elongation after storage at 50 ° C. for 3 days of 10 to 90% has a width of 63.5 mm. The transfer layer surface 13 is directed to the hot stage 12 at a temperature of 30 ° C., and the hot stage 12 is 63.5 mm wide using a double-faced tape double face DF-8320 (manufactured by Toyo Ink Co., Ltd.). Was measured using a RHEO METER (manufactured by Fudo Kogyo) MODE ASSII at a peeling angle θ of 90 ° using a cylindrical peeling member 14 at a peeling speed of 30 mm / sec.

  The peeling force shows the behavior as shown in FIG. 6. The average peeling force was determined by peeling the foil and the support at an initial stage and then peeling at 90 ° thereafter.

  The initial peeling force between the foil and the support and the initial peeling force are the forces required for the initial rupture, and were calculated by the above measurement method.

<Transfer method of ID card or IC card>
The transfer of the transfer foil to the material to be transferred can be usually performed by means such as a thermal head, a heat roller, a hot stamping machine or the like which can apply pressure while heating. Specifically, when using a hot stamping machine, heat to a surface temperature of 150 to 300 ° C. and apply heat at a pressure of 50 to 500 kg / cm ² for 0.5 to 10 seconds using a heat roller having a diameter of 5 cm and a rubber hardness of 85. Transfer can be performed.

  FIG. 7 shows a transfer cartridge as a specific example of use of the present invention, and FIG. 8 shows a hot stamping device.

"Cartridge 400 for thermal transfer sheet"
FIG. 7 is a perspective view illustrating a configuration example of the transfer cartridge 400. In this example, a peeling rod 201 is attached to a predetermined position of the transfer cartridge 400, and a hardening type protection member having the outer shape of the card substrate 203 is peeled from the thermal transfer sheet 200 fed from the transfer foil core 202. In this way, at the time of this transfer, only the curable protective member corresponding to the size of the outer shape of the card substrate 203 can be peeled off from the thermal transfer sheet 200, and the burr at the outer peripheral end of the curable protective layer can be removed. Is to be reduced.

"Hot stamping device 500"
FIG. 8 is a conceptual diagram illustrating a configuration example of the hot stamping device 500. In this example, the transfer cartridge 400 is detachably attached to the hot stamping device 500. This shows a state in which the transfer cartridge 400 is loaded in the hot stamping device 500, and the thermal roller device 204 transfers the thermal transfer sheet 200 fed from the transfer foil core 202 to the card substrate 203.

  In this example, it is assumed that the end portion of the card substrate 203 to which the curable protective member has come in contact with the stage in the home position just before the end of the peeling is reached by the bar 201 for peeling. I do.

  In the present invention, the method of transferring to a card and the method of peeling a transfer foil from a card are not particularly limited, and apparatuses such as JP-A-2001-063294, JP-A-2001-1672, and JP-A-2001-1674 can be used. .

  In the present invention, it is preferable to transfer the transfer foil at least once or more, and it is preferable to use a plurality of transfer foils in order to improve the scratch strength.

[Image recording medium]
<Definition of image recording medium>
The ID card according to the present invention represents an ID card provided with an image element using an ID card base material and at least one selected from an authentication identification image such as a face image, an attribute information image, and format printing.

  As such an ID card, for example, a first sheet material and a second sheet material are bonded via an adhesive, and an IC module (electronic component) having an IC chip and an antenna is sealed in the adhesive layer. (A so-called IC card) is also included, and is not particularly limited in the present invention.

  Hereinafter, the details of the present invention will be described.

<Support>
As the support, for example, polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyolefin resins such as polyethylene, polypropylene, and polymethylpentene, polyvinyl fluoride, polyvinylidene fluoride, and poly4-fluoroethylene Polyethylene resins such as ethylene fluoride, ethylene-tetrafluoroethylene copolymer, etc., polyamides such as nylon 6, nylon 6.6, polyvinyl chloride, vinyl chloride / vinyl acetate copolymer, ethylene / vinyl acetate copolymer Polymer, ethylene / vinyl alcohol copolymer, polyvinyl alcohol, vinyl polymer such as vinylon, biodegradable aliphatic polyester, biodegradable polycarbonate, biodegradable polylactic acid, biodegradable polyvinyl alcohol, biodegradable Biodegradable resins such as cellulose acetate, biodegradable polycaprolactone, cellulose resins such as cellulose triacetate, cellophane, polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, polybutyl acrylate, etc. Synthetic resin sheet such as acrylic resin, polystyrene, polycarbonate, polyarylate, polyimide, etc., or paper such as high-quality paper, thin paper, glassine paper, parchment paper, etc., a single layer such as metal foil, or a laminate of two or more of these Can be

  The thickness of the support of the present invention is 50 to 800 μm, preferably 75 to 800 μm. In the present invention, the support can contain a fluorescent substance. In addition, a white pigment such as titanium white, magnesium carbonate, zinc oxide, barium sulfate, silica, talc, clay, calcium carbonate, or the like is added in advance to the support in order to enhance the sharpness of an image formed in a later step. It is preferred that

  In the ID card substrate or the electronic component-mounted ID card substrate, the first sheet member or the second sheet member may have the same or the same orientation angle, and in some cases, a plurality of different substrates or a plurality of supports having different thicknesses are laminated. Alternatively, a card constituted by bonding or the like may be created. In the case where a plurality of supports are bonded together, it is possible to align them at an orientation angle to reduce curl and warpage.

  The support may be subjected to a treatment for facilitating contact, and is formed of a resin layer such as a coupling agent, a latex, a hydrophilic resin, or an antistatic resin. In some cases, the support may be subjected to easy contacting treatment such as corona treatment or plasma treatment.

  In the case of the present invention, it is preferable that an antistatic treatment is preferably performed on the card base material. By laminating the antistatic agent on the card base material, dust adhesion on the card is reduced. In addition, when transferring two or more transfer foils, the antistatic function of the card when transferring the second transfer foil can reduce dust adhesion on the card.

  If necessary, layers and components such as an emboss, a sign, an IC memory, an optical memory, a magnetic recording layer, a forgery / alteration prevention layer, an IC chip, and an infrared absorption layer can be interposed on the support. When producing an IC card, which is a subordinate concept of the ID card in the present invention, an IC card substrate can be produced from the above-described support by a known technique. The support may have a single-layer structure or a multilayer structure. In the case of a multi-layer structure, it is preferable to match the orientation of the support as described in JP-A-5-116242.

  An image receiving layer and a cushion layer may be provided to form a face image of the card user. In addition, a writing layer may be provided on the back surface in order to provide writing properties.

<Image receiving layer>
The image receiving layer formed on the surface of the support can be formed with a binder and various additives.

  The image receiving layer in the present invention forms a gradation information-containing image by a sublimation-type thermal transfer system, and forms a character information-containing image by a sublimation-type thermal transfer system or a fusion-type thermal transfer system. The adhesiveness of the hot-melt ink as well as the dyeability of the sublimable dye must be good. In order to impart such special properties to the image receiving layer, it is necessary to appropriately adjust the types of the binder and the various additives and the amounts thereof as described below.

  Hereinafter, the components forming the image receiving layer will be described in detail.

  As the binder for the image receiving layer in the present invention, a commonly known binder for a sublimation type thermal transfer recording image receiving layer can be appropriately used. As the main binder, various binders such as a vinyl chloride resin, a polyester resin, a polycarbonate resin, an acrylic resin, a polystyrene resin, a polyvinyl acetal resin, a polyvinyl butyral resin, and a styrene acrylic resin can be used. .

  However, if there is a practical requirement for the image formed by the present invention (for example, the ID card to be issued is required to have a predetermined heat resistance), the binder is required to satisfy such requirement. It is necessary to consider the type or combination. Taking the heat resistance of an image as an example, if heat resistance of 60 ° C. or higher is required, it is preferable to use a binder having a Tg of 60 ° C. or higher in consideration of the bleeding of the sublimable dye.

  When forming the image receiving layer, it may be preferable to include, for example, a metal ion-containing compound as necessary. Particularly when the heat transferable compound reacts with the metal ion-containing compound to form a chelate.

Examples of the metal ion constituting the metal ion-containing compound include divalent and polyvalent metals belonging to Groups I to VIII of the periodic table. Among them, Al, Co, Cr, Cu, Fe, Mg , Mn, Mo, Ni, Sn, Ti, Zn and the like are preferable, and Ni, Cu, Co, Cr and Zn are particularly preferable. As the compound containing these metal ions, an inorganic or organic salt of the metal and a complex of the metal are preferable. As a specific example, a complex represented by the following general formula containing Ni ²⁺ , Cu ²⁺ , Co ²⁺ , Cr ²⁺ and Zn ²⁺ is preferably used.

[M (Q1) k (Q2) m (Q3) n] p ⁺ p ( ^L- )
In the formula, M represents a metal ion, and Q1, Q2, and Q3 each represent a coordination compound capable of coordinating with the metal ion represented by M. Examples of these coordination compounds include "chelate chemistry (5 ) (Nankodo) "can be selected from the coordination compounds. Particularly preferably, a coordination compound having at least one amino group coordinated with a metal can be mentioned, and more specifically, ethylenediamine and its derivatives, glycinamide and its derivatives, picolinamide and its derivatives can be mentioned. Can be

L is a counter anion capable of forming a complex, and examples thereof include an anion of an inorganic compound such as Cr, SO ₄ and ClO ₄ and an anion of an organic compound such as a benzenesulfonic acid derivative and an alkylsulfonic acid derivative, and particularly preferred is tetraphenylboron. Anions and their derivatives, and alkylbenzenesulfonic acid anions and their derivatives. k represents an integer of 1, 2 or 3, m represents 1, 2 or 0, and n represents 1 or 0, and the complex represented by the above general formula is tetradentate or hexadentate. It is determined by coordination or by the number of ligands Q1, Q2, Q3. p represents 1, 2 or 3.

As such a metal ion-containing compound, those exemplified in US Pat. No. 4,987,049 can be exemplified. When adding the metal ion-containing compound, the added amount with respect to the image-receiving layer is preferably 0.5 to 20 g / m @ 2, more preferably 1 to 15 g / m ^2.

  It is preferable to add a release agent to the image receiving layer. As the effective release agent, those which are compatible with the binder to be used are preferable, and specific examples thereof include modified silicone oils and modified silicone polymers, such as amino-modified silicone oil, epoxy-modified silicone oil, and polyester-modified silicone. Examples include oil, acrylic-modified silicone resin, and urethane-modified silicone resin. Among them, the polyester-modified silicone oil prevents fusion with the ink sheet, but is particularly excellent in that it does not hinder the secondary workability of the image receiving layer. The secondary processability of the image receiving layer refers to writability with magic ink, laminating property which is a problem when protecting a formed image, and the like. In addition, fine particles such as silica are effective as a release agent. When the secondary workability is not a problem, the use of a curable silicone compound is also effective as a measure for preventing fusion. Ultraviolet-curable silicone, reaction-curable silicone, and the like are available, and a large releasing effect can be expected.

  The image receiving layer in the present invention is a coating method in which a coating liquid for an image receiving layer is prepared by dispersing or dissolving the forming components in a solvent, the coating liquid for the image receiving layer is applied to the surface of the support, and dried. Can be manufactured by As for the surface roughness of the image recording medium of the present invention, that is, the surface roughness of the image receiving layer, the center line average roughness (Ra) is preferably 0.00 to 0.6 μm. For this purpose, the viscosity of the coating solution, the coating method, and the coating environment are optimized in order to prevent coating unevenness, coating streaks, and coating foreign matter from being involved during the dry coating, and the center line average roughness (Ra) of the present invention is set to 0.1. It is preferred to achieve a thickness of from 00 to 0.6 μm. In the present invention, in order to perform format printing or the like on the surface of the image receiving layer, it is necessary to devise to make the center line average roughness (Ra) in the format printing to be 0.00 to 0.6 μm.

  The thickness of the image receiving layer formed on the surface of the support is generally 1 to 50 μm, preferably about 2 to 10 μm. In the present invention, a cushion layer or a barrier layer may be provided between the support and the image receiving layer. By providing a cushion layer, an image corresponding to image information can be transferred and recorded with good reproducibility with little noise. Examples of the material forming the cushion layer include urethane resin, acrylic resin, ethylene-based resin, polypropylene-based resin, butadiene rubber, and epoxy resin. The thickness of the cushion layer is usually 1 to 50 μm, preferably 3 to 30 μm.

<Cushion layer>
As the material for forming the cushion layer of the present invention, polyolefin is preferable. For example, polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butadiene-styrene block A material having flexibility and low heat conductivity, such as a copolymer, a styrene-hydrogenated isoprene-styrene block copolymer, polybutadiene, and a photocurable resin layer, is suitable. Specifically, a cushion layer as disclosed in JP-A-2002-222403 can be used.

<Writing layer>
In the second sheet member of the present invention, a writing layer can be provided for forming an information carrier including identification information and bibliographic items, and the writing layer can be formed with a binder and various additives. .

  The writing layer can be formed with a binder and various additives.

  The writing layer is a layer that allows writing on the back surface of the ID card. This layer is preferably composed of at least one layer, and more preferably formed of 1 to 5 layers, since it has writability. As such a writing layer, for example, an inorganic fine powder, a porous substance, or the like can be used. As the porous substance, for example, silica (precipitable or gel type), talc, kaolin, clay, alumina white, diatomaceous earth, titanium oxide, calcium carbonate, barium sulfate and the like can be used. In addition, as the porous substance, one kind or a mixture of two or more kinds among the above compounds may be used. There is no particular limitation as it can include a porous material.

  Further, other binders can be used, for example, ceramics, rosin and derivatives thereof, nitrified cotton and cellulose derivatives, polyamide resins, polyacrylate resins, polyvinyl chloride resins, polyvinyl acetate resins, polystyrene resins, petroleum resins, rings Rubber, chlorinated rubber, chlorinated polypropylene, urethane resin, epoxy resin, polyester resin, acrylic resin, vinyl chloride, vinyl chloride-vinyl acetate copolymer, butyral resin, vinylidene chloride resin, water-soluble resin, etc. can be used. . Alternatively, a UV-curable resin containing a prepolymer that is copolymerized and cured by ultraviolet rays may be used. Examples of the copolymerizable compound used therein include polyol acrylate, polyester acrylate, epoxy acrylate, urethane acrylate, and alkyd acrylate. Among them, polyester resin, polyacrylate resin, polyvinyl chloride resin, polyvinyl acetate resin, polyamide resin, and polystyrene resin are preferably used. The resin may be used alone or as a mixture of two or more of the above compounds. The particle size of the porous material may be 1 to 10 μm, preferably the average particle size is 1 to 8 μm. The weight ratio of the porous substance to the resin is preferably 20 parts by weight to 100 parts by weight based on 100 parts by weight of the resin in terms of solid content. Other additives may include wax, surfactant, solvent, and water, and are not particularly limited.

  The thickness of the writing layer is preferably 5 to 40 μm, and more preferably 5 to 30 μm. When the writing layer is formed, an adhesive layer may be provided for improving the adhesion to the support, or a cushion layer may be provided for improving the writing property.

<Information carrier consisting of format print layer>
It is preferable that the information carrier is formed by format printing on the image receiving layer, the writing layer, or the substrate. The information carrier composed of format printing refers to an information carrier provided with at least one of a plurality of information recording identification information and book information. Specifically, ruled lines, company names, card names, notes , Issuer's telephone number, etc.

  The format printing is performed on the image receiving layer or the writing layer and on the base material by a printing method such as resin letterpress printing, planographic printing, silk printing, flexographic printing or the like.

  The format printing layer of the present invention may employ watermark printing, fine print, etc. to prevent visual forgery. Digital watermark, barcode, matte pattern, fine print, ground pattern, uneven pattern , Stealth, etc. as appropriate, visible light absorbing color material, ultraviolet light absorbing material, infrared light absorbing material, fluorescent whitening material, glass evaporation layer, bead layer, optical change element layer, pearl ink layer, scaly pigment layer, IC For the formation of the information carrier consisting of the concealing layer and the format printing, the lithographic printing technology, “new printing technology overview”, “offset printing technology”, and “plate making and printing And the like, and it is formed of a photocurable ink, an oil-soluble ink, a solvent-based ink, and the like with an ink such as carbon.

  The surface roughness of the surface of the image recording medium of the present invention, that is, the surface roughness of the format printing layer, preferably has a center line average roughness (Ra) of 0.00 to 0.6 μm. For this purpose, the printing ink viscosity, printing method, printing environment and printing pressure during printing are optimized in order to avoid uneven printing density, streaks, and foreign matter entrapment during printing, and the center line average roughness (Ra) of the present invention is optimized. Preferably achieves 0.00 to 0.6 μm. In addition, when using an ink using a pigment having a large particle size of the printing ink, the center line average roughness (Ra) often exceeds 0.6 μm.

  In the present invention, a print layer that can be used for the format print layer is a typical example of a binder resin, for example, an actinic ray-curable resin, a polymethyl methacrylate-based acrylic resin, a styrene-based resin such as polystyrene, Vinyl chloride resins such as polyvinyl chloride, vinylidene chloride resins such as polyvinylidene chloride, polyester resins such as polyethylene terephthalate, cellulose resins such as cellulose acetate, polyvinyl acetal resins such as polyvinyl butyral, epoxy resins, amides Resin, urethane resin, melamine resin, alkyd resin, phenol resin, fluorine resin, silicone resin, polycarbonate, polyvinyl alcohol, casein, gelatin and the like. In the present invention, it is preferably a photocurable resin layer, and more preferably (a) 25 to 95 parts by weight of a binder component comprising at least one kind of a monomer or oligomer having one or more unsaturated bonds, and (b) starting. It is particularly preferable to use a printing ink layer composed of a photocurable resin composition composed of a composition containing 1 to 20 parts by weight of an agent from the viewpoint of card surface strength.

  When an actinic ray curable resin is used, it can be cured by exposure to light of 100 mj to 500 mj using a light source such as a mercury lamp, UV lamp, or xenon.

[Electronic component materials for IC cards]
[Electronic components]
The electronic component refers to an information recording member. Specifically, an IC chip that electrically stores information of a user of an electronic card and an IC chip that is a coil-shaped antenna connected to the IC chip include: It is a memory only or a microcomputer in addition to it. In some cases, the electronic component may include a capacitor. The present invention is not limited to this, and is not particularly limited as long as it is an electronic component necessary for the information recording member.

  An IC module of an electronic component has an antenna coil. When the antenna has an antenna pattern, a coil formed by winding copper or a conductor paste such as silver paste printed in a spiral shape on an insulating base may be used. A coil or the like obtained by etching a metal foil such as a copper foil is used. In the present invention, it is preferable to use a coil made of copper winding from the viewpoint of communication. In some cases, it may be covered with a resin, an insulating layer, or the like.

  The circuit pattern including the antenna coil is preferably of a winding type. In some cases, the circuit pattern may be electrically connected in another step so as not to be short-circuited with the coil pattern in the middle. The number of turns of the antenna coil is preferably 2 to 10, but is not particularly limited in the present invention. As the printed circuit board, a thermoplastic film such as polyester is used, and when heat resistance is required, polyimide is advantageous. The bonding between the IC chip and the antenna pattern is performed by using a conductive adhesive such as a silver paste, a copper paste, or a carbon paste (EN-4000 series of Hitachi Chemical Co., Ltd., XAP series of Toshiba Chemical Co., Ltd.), or an anisotropic conductive film (Hitachi Chemical). It is known that a method using an industrial anisolum or the like, or a method of performing solder bonding or ACF bonding, but any method may be used.

  In order to fill the resin after placing the parts including the IC chip in a predetermined position in advance, the joint may come off due to the shearing force due to the flow of the resin, or the smoothness of the surface may be reduced due to the flow or cooling of the resin. In order to eliminate damage or lack of stability, a resin layer is formed on a substrate sheet in advance, and the electronic component is sealed with a porous resin film or a porous foam in order to enclose the component in the resin layer. It is preferably used in the form of a porous resin film, a flexible resin sheet, a porous resin sheet or a nonwoven fabric sheet. For example, a method described in Japanese Patent Application No. 11-105476 or the like can be used.

  For example, as the nonwoven fabric sheet member, there are a mesh fabric such as a nonwoven fabric, a plain weave, a twill weave and a satin weave. Further, a woven fabric having a pile called moquette, plush velor, seal, velvet, or suede can be used. Materials include polyamides such as nylon 6, nylon 66, and nylon 8, polyesters such as polyethylene terephthalate, polyolefins such as polyethylene, polyvinyl alcohol, polyvinylidene chloride, polyvinyl chloride, polyacrylonitrile, acrylamide, and methacryl. Acrylic resin such as amide, synthetic resin such as polyvinylidene cyanide, polyfluoroethylene, polyurethane, etc., natural fiber such as silk, cotton, wool, cellulose, cellulose ester, regenerated fiber (rayon, acetate), aramid fiber And fibers obtained by combining one or two or more selected from the group consisting of: Of these fiber materials, rayon is preferably polyamide-based such as nylon 6, nylon 66, etc., acrylic-based such as polyacrylonitrile, acrylamide, methacrylide, polyester-based such as polyethylene terephthalate, cellulose-based as regenerated fiber, or cellulose ester-based. And acetate and aramid fibers.

  Further, since the IC chip has a low point pressure strength, it is preferable to have a reinforcing plate near the IC chip.

  The total thickness of the electronic component is preferably from 10 to 500 μm, more preferably from 10 to 450 μm, and still more preferably from 10 to 350 μm.

[Method of Providing First Sheet Member and Second Sheet Member and Method of Mounting Electronic Component] [Method of Mounting Electronic Component for IC Card]
A first sheet member (hereinafter, referred to as a first sheet member) having an image receiving layer using the image recording medium support of the present invention, and a second sheet member (hereinafter, referred to as a second sheet member) having a writing layer. As a manufacturing method, a heat bonding method, an adhesive bonding method, and an injection molding method are known in order to provide a predetermined electronic component between them, but they may be bonded by any method. Further, the first sheet member and the second sheet member may be provided with an information carrier layer made of the above-described format printing either before or after lamination.

  The method for manufacturing an IC-mounted card base material of the present invention includes the steps of laminating and coating as described in JP-A-2000-036026, JP-A-2000-219855, JP-A-2000-212278, JP-A-10-316959, JP-A-11-5596, and the like. A setting method is disclosed. Any bonding method, coating method, or the like can be used, and the present invention is not particularly limited.

  The method for manufacturing an electronic card of the present invention includes, at least, a step of forming an electronic component holder by applying an adhesive member which is a solid or a viscous body in a normal temperature state and softens in a heated state to an electronic component for a card, A step of disposing the electronic component holder on a substrate member; a step of disposing a surface member so as to cover the electronic component holder on the substrate member; Laminating the member for the substrate, the electronic component holder and the member for the surface underneath.

  It is preferable that the adhesive member which is softened in a heated state of the solid or the viscous body is bonded to the adhesive member by forming the adhesive itself into a sheet shape and bonding the adhesive itself by heating or melting at room temperature and then by injection molding. In the present invention, a low-temperature adhesive is preferable in order to reduce thermal deformation of the support, and more preferably a reactive adhesive, a hot melt adhesive, and more preferably a reactive hot melt adhesive is used.

  The reactive hot-melt adhesive refers to a light-curable adhesive, a moisture-curable adhesive, an elastic epoxy adhesive, and the like. For example, a moisture-curable material as a reactive hot-melt adhesive is disclosed in JP-A-2000-036026. Japanese Patent Application Laid-Open No. 2000-219855, Japanese Patent Application Laid-Open No. 2000-212278, and Japanese Patent Application No. 2000-369855. JP-A-10-316959, JP-A-11-5964 and the like are disclosed as photocurable adhesives.

  As an example of a reactive moisture-curing adhesive, there is an adhesive whose main component is a urethane polymer containing an isocyanate group at a molecular terminal, and the isocyanate group reacts with moisture to form a crosslinked structure. Examples of reactive adhesives usable in the present invention include TE030 and TE100 manufactured by Sumitomo 3M, Hibon 4820 manufactured by Hitachi Chemical Co., Ltd., Bondmaster 170 series manufactured by Kanebo Wenus Sci. And the like. In the present invention, it is preferable to use resins having different elastic moduli. By using resins having different elastic moduli, a resin having a high elastic modulus exhibits a skeletal function, and a resin having a low elastic modulus can flow to fill in a gap when a support is bonded, thereby obtaining smoothness.

  Any of these adhesives may be used, and it is preferable to use a material which is not limited in the present invention.

  The thickness of the adhesive is preferably from 10 to 600 μm, more preferably from 10 to 500 μm, and still more preferably from 10 to 450 μm, including the thickness of the electronic component.

At the time of bonding, it is preferable to perform heating and pressing in order to improve the surface smoothness of the base material and the adhesion of a predetermined electronic component between the first sheet member and the second sheet member. It is preferable to manufacture by a method, a caterpillar method, etc. In addition, in consideration of cracking of IC parts, it is preferable to use a flat press type, avoiding rollers that are close to line contact and apply excessive bending force even with slight displacement . The heating is preferably performed at 10 to 120 ° C, more preferably 30 to 100 ° C. Pressure is preferably 0.01~300kgf / cm ^2, more preferably 0.05~100kgf / cm ^2. If the pressure is higher than this, the IC chip will be damaged. The heating and pressurizing time is preferably 0.1 to 180 sec, more preferably 0.1 to 120 sec. If the time is longer than this, the manufacturing efficiency decreases.

  According to the method of manufacturing an IC card of the present invention, the above-described electronic component holder is applied, and in the bonding step, a member for a substrate, an electronic component holder, and a surface Since the electronic component holder itself is used as an adhesive, the substrate member, the electronic component holder, and the surface substrate can be bonded with good reproducibility. If it is not prepared by the above method, the surface irregularities of the manufactured IC card deteriorate, and the transferability of the transfer foil deteriorates.

  The laminated single sheet or continuous coated lami roll formed as a continuous sheet by the adhesive laminating method or the resin injection method, after being left for a predetermined time corresponding to a predetermined curing time of the adhesive, records the authentication identification image and bibliographic information. May be performed, and then molded into a predetermined card size. As a method of forming a predetermined card size, a punching method, a cutting method, and the like are mainly selected, and an electronic component mounted IC card base material can be prepared. Also, by using the same method as described above, an ID card on which no electronic component is mounted can be created.

<How to make IC card substrate>
Here, an example of a method for manufacturing an electronic component mounted IC card using a hot melt adhesive will be described. When manufacturing an IC card, first, a hot melt adhesive is applied to the front and back sheets with an applicator to a predetermined thickness. As a coating method, an ordinary method such as a roller method, a T-die method, a dice method or the like is used. In the case of coating in the form of stripes according to the present invention, there is a method of intermittently providing an opening in a T-die slit, but the present invention is not limited to this. Further, as a method for forming the adhesive surface of the present invention into an uneven shape, there is a method in which the adhesive surface coated by the above method is subjected to pressure treatment with an embossing roll. The IC member is mounted between the upper and lower sheets coated with the adhesive. Before mounting, the applied adhesive may be heated in advance by a heater or the like. After that, the IC member is mounted between the upper and lower sheets and pressed for a predetermined time with a press heated to the bonding temperature of the adhesive, or rolls are transported in a constant temperature layer at a predetermined temperature instead of rolling by pressing. May be rolled. Further, vacuum pressing may be performed to prevent air bubbles from entering during bonding. After bonding with a press or the like, the sheet is punched into a predetermined shape and cut into a card shape to form a card. When a reactive adhesive is used as the adhesive, the adhesive is cured for a predetermined time and then cut into a card. It is effective to form a hole for supplying water necessary for the reaction around the card size of the bonded sheets to promote curing.

[ID card or IC card surface center line surface roughness (Ra)]
In the present invention, the surface roughness of the ID card base material or the electronic component-mounted IC card base material prepared as described above may have a center line average roughness (Ra) of 0.00 to 0.6 μm. preferable. When the center line average roughness (Ra) exceeds 0.6 μm, it is confirmed that when the transfer is performed using the transfer foil of the present invention, the perforation effect using the roughened support is deteriorated due to the rough surface. Was. At the same time, the adhesion of the transfer foil deteriorates, which is problematic.

  Center Line Surface Roughness (Ra) Measuring Method In the case of an ID card, as shown in FIG. 9, a surface roughness measuring device manufactured by Kodama Seisakusho on an information carrier layer formed by format printing of a surface layer for transferring a transfer foil. The center line surface roughness (Ra) measuring method was measured by SE-30H.

  In the case of an IC card, as shown in FIG. 10, the measurement was carried out on the information carrier layer formed by format printing of the surface layer on which the transfer foil on which the electronic components were not arranged was transferred, in the same manner as described above.

[Define concave or convex part 1 on IC card surface]
Further, according to the present invention, when a concave or convex portion is provided on the surface of an IC card in which an electronic component is built, when a reference line is set in the specific concave or convex portion, the specific concave or convex portion is perpendicular to the reference line. The distance to the direction is 20 μm or less. When the transfer foil of the present invention was transferred to an IC card having a thickness exceeding 20 μm using the transfer foil of the present invention, it was confirmed that the perforation effect using the roughened support was deteriorated due to the unevenness of the surface. In particular, in a chip portion having a large surface unevenness, the perforation effect was deteriorated, and defective foil was generated. Further, the adhesion between the foil and the IC card was also deteriorated.

  Here, the setting of the reference line will be described. In the present invention, a card plane connecting two points at a distance of 10 mm each in the upper and lower directions in parallel with the short side of the card from the local maximum of the concave or convex portion on the surface of the IC card is used as the reference line. In this case, the maximum part means the highest point at the convex part and the lowest point at the concave part.

  FIG. 11 is a schematic diagram of a card surface defining a reference line with respect to the irregularities on the surface of the IC card. When the convex portion is on the card surface as shown in FIG. A straight line L1 connecting the distant points B and C is set as a reference line. FIG. 12 is a schematic sectional view on the card side.

[Define concave or convex part 2 on IC card surface]
Further, in the present invention, when a concave or convex portion is provided on the surface of an IC card having a built-in electronic component, the maximum value of the inclination from the cross section of the concave or convex portion of interest with respect to the reference line having the same definition as above is 80 °. It is as follows. In the present invention, a view from a cross section means a case where measurement is performed from a side surface of a specific concave or convex portion, that is, a cross section. FIG. 13 is a schematic cross-sectional view of the card side of the definition of the reference line and the slope with respect to the irregularities on the surface of the IC card. In this case, the slope is considered to be e larger than a. Similarly, when the maximum value of the inclination with respect to the reference line is 80 ° or less, when the transfer foil of the present invention is transferred to an IC card in which the inclination exceeds 80 ° using the transfer foil of the present invention, the surface has irregularities. It was confirmed that the perforated effect deteriorated. Particularly, in a chip portion having a large surface unevenness, the perforation effect was deteriorated, and a defective foil was generated. Further, the adhesion between the foil and the IC card was also deteriorated.

[Concave or convex measurement of IC card surface]
The measurement is performed by using a non-contact three-dimensional measuring device NH-3 (Mitaka Optical Co., Ltd.) with the card surface facing the measurement surface, and the concave or convex portion definition 1 on the IC card surface, the concave or convex portion on the IC card surface. Protrusion rule 2 was calculated.

<General description of image forming method on image recording medium>
A plurality of information carriers on which the identification information and the book information are recorded on the ID card base material or the IC card base material prepared above, and the identification information by a different method on the printing surface side of the image recording material formed by format printing. Further, image elements such as a plurality of information carriers recording book information are provided, and an ID card or an IC card can be created. The face image is usually a full-color image having a gradation, and is produced by, for example, a sublimation-type thermal transfer recording method, a silver halide color photographic method, or the like. The character information image is composed of a binary image, and is produced by, for example, a fusion type thermal transfer recording system, a sublimation type thermal transfer recording system, a silver halide color photographic system, an electrophotographic system, an ink jet system, a retransfer system, or the like. . In the present invention, it is preferable to record an authentication identification image such as a face image and an attribute information image by a sublimation type thermal transfer recording method and a fusion type thermal transfer recording method.

  The attribute information is a name, an address, a date of birth, a qualification, and the like. The attribute information is usually recorded as character information, and a fusion-type thermal transfer recording method is generally used. Format printing or information recording may be performed, by any method such as offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, inkjet method, sublimation transfer method, electrophotographic method, heat melting method, etc. Although it can be formed, in the case of the present invention, any one of a sublimation transfer method, an ink jet method, a heat melting method, and an ink jet method is preferable.

<Sublimation image forming method>
The sublimation-type thermal transfer recording ink sheet can be composed of a support and a sublimable dye-containing ink layer formed thereon.

<Support>
The support is not particularly limited as long as it has good dimensional stability and can withstand heat at the time of recording with a thermal head, and a conventionally known support can be used.

<Sublimable dye-containing ink layer>
The sublimable dye-containing ink layer basically contains a sublimable dye and a binder.

  Examples of the sublimable dye include a cyan dye, a magenta dye and a yellow dye.

  As the cyan dye, JP-A-59-78896, JP-A-59-227948, JP-A-60-24966, JP-A-60-53563, JP-A-60-130735, JP-A-60-131292, JP-A-60-239289, JP-A-61-19396, JP-A-61-22993, JP-A-61-31292, JP-A-61-31467, JP-A-61-35994, JP-A-61-49893, and JP-A-61-49893. Nos. 61-148269, 62-191191, 63-91288, 63-91287, 63-290793, naphthoquinone dyes, anthraquinone dyes, and azomethine dyes And the like.

  As the magenta dye, JP-A-59-78896, JP-A-60-30392, JP-A-60-30394, JP-A-60-253595, JP-A-61-262190, JP-A-63-5992, Examples thereof include anthraquinone dyes, azo dyes, and azomethine dyes described in JP-A-63-205288, JP-A-64-159, and JP-A-64-63194.

  Examples of yellow dyes include JP-A-59-78896, JP-A-60-27594, JP-A-60-31560, JP-A-60-53565, JP-A-61-12394, and JP-A-63-122594. Examples thereof include methine dyes, azo dyes, quinophthalone dyes and anthrisothiazole dyes described in each publication.

  A particularly preferred sublimable dye is azomethine obtained by coupling a compound having an open-chain or closed-type active methylene group with an oxidized form of a p-phenylenediamine derivative or an oxidized form of a p-aminophenol derivative. An indoaniline dye obtained by a coupling reaction with a dye and an oxidized form of a phenol or naphthol derivative or a p-phenylenediamine derivative or an oxidized form of a p-aminophenol derivative.

  When a metal ion-containing compound is compounded in the image receiving layer, a sublimable dye that reacts with the metal ion-containing compound to form a chelate is preferably included in the sublimable dye-containing ink layer. Such chelate-forming sublimable dyes are described, for example, in JP-A-59-78893, JP-A-59-109349, JP-A-4-09974, JP-A-4-097894, and JP-A-4-089292. And cyan dyes, magenta dyes and yellow dyes capable of forming at least bidentate chelates. A preferred sublimable dye capable of forming a chelate can be represented by the following general formula.

X1-N = N-X2-G
In the formula, X1 represents an aromatic carbon ring in which at least one ring is composed of 5 to 7 atoms, or a group of atoms necessary to complete a heterocyclic ring, and represents a carbon atom bonded to an azo bond. At least one of the adjacent atoms is a nitrogen atom or a carbon atom substituted with a chelating group. X2 represents an aromatic heterocyclic ring or an aromatic carbocyclic ring in which at least one ring is composed of 5 to 7 atoms. G represents a chelating group.

For any sublimable dye, the sublimable dye contained in the sublimable dye-containing ink layer may be any of a yellow dye, a magenta dye, and a cyan dye as long as the image to be formed is a single color. Depending on the color tone of the image to be formed, two or more of the three dyes or other sublimable dyes may be contained. The amount of the sublimable dye to be used is generally 0.1 to ²⁰ g, preferably 0.2 to 5 g, per m ^{2 of} the support.

  The binder for the ink layer is not particularly limited, and a conventionally known binder can be used. Further, conventionally known various additives can be appropriately added to the ink layer.

  Sublimation type thermal transfer recording ink sheet is prepared by dispersing or dissolving the various components forming the ink layer in a solvent to prepare an ink layer forming coating liquid, coating this on the surface of the support, It can be manufactured by drying. The thickness of the ink layer thus formed is usually from 0.2 to 10 μm, preferably from 0.3 to 3 μm.

<Inkjet>
In the case of adopting the ink jet system, for example, a resolution of about 400 dpi is sufficient in a bubble jet (registered trademark) system, and a face image can be a multi-gradation in a shear mode system. As disclosed in JP-A-9-71743, a method in which a fatty acid ester having 18 to 36 carbon atoms of an alkyl group is used in combination with a dimer acid-based polyamide, or as disclosed in JP-A-2000-44857, Or an ink described in JP-A-9-71743, JP-A-2000-297237, JP-A-2000-85236, JP-A-5-1254 and the like. As post-processing, post-heating, post-exposure, etc. may be performed after writing character information, a face image, and the like with an inkjet, and there is no particular limitation on the type of ink and the image forming method.

[Method of Applying Protective Layer Transfer Foil with Antistatic Layer on Image Recording Material]
<Transfer method>
The transfer of the transfer foil to the material to be transferred can be usually performed by means such as a thermal head, a heat roller, a hot stamping machine or the like which can apply pressure while heating. Specifically, when using a hot stamping machine, heat to a surface temperature of 150 to 300 ° C. and apply heat for 0.5 to 10 seconds at a pressure of 50 to 500 kg / cm ² using a heat roller having a diameter of 5 cm and a rubber hardness of 85. Transfer can be performed. As a specific use example of the present invention, a transfer cartridge 400 shown in FIG. 7 and a hot stamping device 500 shown in FIG. 8 are used.

[ID card or IC card making device]
Hereinafter, an embodiment of an ID or IC card creation device will be described with reference to the drawings, but the present invention is not limited to the description of the embodiments and the drawings. An embodiment of an ID or IC card creation device is shown in FIGS.

  In FIG. 14, a card base supply unit 10 and an information recording unit 20 are arranged at an upper position, and a transfer foil applying unit 60 of the present invention is arranged at a lower position, and a card is created as an image recording body. Can also be created.

  In the card base material supply unit 10, a plurality of card base materials 50 which have been cut into a card shape in advance for writing personal information of a card user are stocked with the face for recording a face photograph facing upward. . In this example, an ID card substrate or IC card substrate 50 is composed of a support and an image receiving layer, and the card substrates 50 are automatically supplied one by one from the card substrate supply unit 10 at a predetermined timing.

  In the information recording unit 20, a yellow ribbon cassette 21, a magenta ribbon cassette 22, a cyan ribbon cassette 23, and a black ribbon cassette 24 are arranged, and recording heads 25 to 28 are arranged corresponding to each of them. By thermal transfer using a thermal transfer sheet such as a yellow ribbon, a magenta ribbon, and a cyan ribbon, an image area having a gradation such as a photograph of the face of a card user is recorded in a predetermined area of the image receiving layer while the card base material 50 is being moved. Is done. Further, a character ribbon cassette 31 and a recording head 32 are arranged, and authentication identification information such as a name and a card issuance date is recorded by thermal transfer using a thermal transfer sheet such as a character ribbon to form an image recording layer.

  In the transfer foil applying section 60, a transfer foil cassette 61 is arranged, and a thermal transfer head 62 is arranged corresponding to the transfer foil cassette 61. The transfer foil applying section 60 thermally transfers the photo-curable layer-containing transfer foil 64 to provide a transparent surface protection transfer layer.

  In FIG. 15, the card base material supply unit 10 and the information recording unit 20 have the same configuration, but two transfer foil applying units 70 are arranged next to the information recording unit 20.

  A transfer foil cassette 71 is disposed in the transfer foil applying section 70, and a thermal transfer head 72 is disposed corresponding to the transfer foil cassette 71. A transfer foil 74 containing a photocurable layer is set on the transfer foil cassette 71 and thermally transferred to provide a transparent surface protection transfer layer. Further, in the next step, a transfer foil cassette 71 is similarly disposed in the transfer foil applying section 70, and a thermal transfer head 72 is disposed corresponding to the transfer foil cassette 71. A transfer foil 74 containing a photocurable layer is set on the transfer foil cassette 71 and thermally transferred to provide a transparent surface protection transfer layer.

[Example]
<Preparation of transfer foil substrate>
Transfer foil support 1
Using Tetron G2P8-25μPET manufactured by Teijin Dupont Co., Ltd., using sand sand on one side opposite to the antistatic layer, a sand mat processing was performed so that the center line average roughness (Ra) became 0.4 μm. . Thereafter, the treated surface was washed with water in order to remove residues such as silica sand and polishing residue, and then dried to produce. The general formula (1) of the finished support was 0.016, and the surface resistivity was 1.1 × 10 ¹³ Ω.

Transfer foil support 2
Using Toray Co., Ltd. Lumirror # 25 QT30 PET, and using a hairline polishing jig on one side opposite to the antistatic layer, hairline processing is performed so that the center line average roughness (Ra) is 0.2 μm. went. Thereafter, the treated surface was washed with water to remove polishing residues and the like, and dried to produce the same. The general formula (1) of the finished support was 0.008, and the surface specific resistance was 4.2 × 10 ¹² Ω.

Transfer foil support 3
A sand matting process was performed using Unitletka's emblem PTH 25 µm PET, using silica sand on one side, and having a center line average roughness (Ra) of 0.4 µm. Thereafter, the treated surface was washed with water in order to remove residues such as silica sand and polishing residue, and then dried to produce. Thereafter, the following antistatic layer coating solution was coated with a wire bar and dried at 120 ° C. for 2 minutes to prepare a transfer foil support 3 having a 0.5 μm antistatic layer. The general formula (1) of the finished support was 0.016, and the surface specific resistance was 3.0 × 10 ¹⁰ Ω. However, in this method, the cost was higher than that of the transfer foils 1 and 2.

(Preparation of antistatic layer)
(Preparation of conductive metal oxide fine particle dispersion liquid-1)
65 g of stannic chloride hydrate was dissolved in 2000 ml of a water / ethanol mixed solution to obtain a homogeneous solution, which was then boiled to obtain a coprecipitate. The generated precipitate was taken out by decantation, and the precipitate was sufficiently washed with distilled water. Silver nitrate was dropped into distilled water from which the precipitate was washed, and after confirming that there was no reaction of chloride ions, distilled water was added to adjust the solid content to 8% by weight. Further, 40 ml of 30% aqueous ammonia was added, and the mixture was heated in a water bath to obtain a conductive metal oxide fine particle dispersion liquid-1.
(Antistatic layer coating solution composition)
Conductive metal oxide fine particle dispersion liquid-1 300 parts by weight Copolymer latex liquid having a weight ratio of butyl acrylate / styrene / glycidyl acrylate of 40/20/40 (solid content: 30% by weight) 70 parts by weight Butyl acrylate / t -Butyl acrylate / styrene /
Copolymer latex liquid having a weight ratio of 2-hydroxyacrylate of 10/45/30/15 (solid content: 30% by weight) 10 parts by weight Pure water 620 parts by weight Transfer foil support 4
Using Toray Co., Ltd. Lumirror # 50 QT30 PET, using a hairline polishing jig on one side opposite to the antistatic layer, and subjecting the hairline processing to a center line average roughness (Ra) of 0.2 μm. went. Thereafter, the treated surface was washed with water in order to remove polishing debris and the like, and dried to produce. The general formula (1) of the finished support was 0.004, and the surface resistivity was 4.0 × 10 ¹² Ω.

Transfer foil support 5
A sand mat processing was performed using an emblem PTME 12 μm PET manufactured by Unitika Co., Ltd., using silica sand on one side, and a center line average roughness (Ra) of 0.5 μm. Thereafter, the treated surface was washed with water in order to remove residues such as silica sand and polishing residue, and then dried to produce. The general formula (1) of the finished support was 0.041, and the surface specific resistance was 1.6 × 10 ¹³ Ω. The support had several perforated locations.

Transfer foil support 6
A sand mat processing was performed by using Unitletka's emblem PTH 25 μm PET, using silica sand on one side, and adjusting the center line average roughness (Ra) to 0.5 μm. Thereafter, the treated surface was washed with water in order to remove residues such as silica sand and polishing residue, and then dried to produce. The general formula (1) of the finished support was 0.0020, and the surface resistivity was> 10 ¹⁶ Ω.

Transfer foil support 7
The unit was used without embedding by using Enbret PTH 25 μm PET manufactured by Unitika Ltd. Since the surface was not roughened, the value of the general formula (1) was 0.005 or less. The surface resistivity was> 10 ¹⁶ Ω.

<Evaluation result of photo-cured layer for transfer foil>
The photo-cured layer shown in Table 1 was coated on a 25 μm emullet PTH (Unitika Co., Ltd.) with a coating solvent composition of toluene / methyl ethyl ketone at a ratio of 80/20 at a solid content of 40% using a wire bar to give a dry film of 10 μm.

  Thereafter, exposure was performed using a metal halide lamp at an integrated exposure amount of 250 mj to prepare a desired sample, and the initial elongation at break and elongation at break after 50 ° C. for 3 days were measured. Table 1 shows the composition and results of the photocurable layer prepared according to the present invention.

<Preparation of transfer foil>
A transfer foil was prepared by sequentially forming a transfer foil support, a release layer, a photocurable layer, an intermediate layer, a primer layer, and an adhesive layer described below. Table 2 shows the transfer foil produced according to the present invention.
Table 2

[Synthesis of Transfer Foil Resin 1]
In a three-necked flask under a nitrogen stream, put 73 parts of ethyl methacrylate, 15 parts of benzyl methacrylate, 12 parts of methacrylic acid and 500 parts of ethanol, and 3 parts of α, α'-azobisisobutyronitrile, and place in a nitrogen stream. The reaction was performed in an oil bath at 80 ° C. for 6 hours. Thereafter, 3 parts of triethylammonium chloride and 1.0 part of glycidyl methacrylate were added and reacted for 3 hours to obtain a desired synthetic binder 1 of an acrylic copolymer. Mw. 17000, acid value 32
[Support for transfer foil]
The transfer foil supports 1 to 7 described above were used.

[Adjustment of release layer for transfer foil]
The release layer material shown in Table 3 was used for the release layer caused by the peeling force. It was applied by wire bar coating, dried at 100 ° C. for 30 seconds, and formed to the amount described in the table.
Table 3

[Light cured layer]
Using the photocurable layer described in Table 1 above, a coating solvent composition of toluene / methyl ethyl ketone at a ratio of 80/20 was applied using a wire bar at a solid content of 40% to form a dry film of 10 μm. After drying at 100 ° C. for 20 seconds, exposure was performed using a metal halide lamp at an integrated exposure amount of 250 mj to form a photocured layer.

[Intermediate layer]
The following intermediate layer solution was applied using a wire bar, and dried at 100 ° C. for 30 seconds to form a dry film of 0.5 μm. After application, the curing agent was cured at 50 ° C. for 24 hours.
Preparation of coating solution for middle layer 1 Polyvinyl butyral resin (Sekisui Chemical Co., Ltd .: Esrec BX-1) 5 parts thermoplastic elastomer (Daicel Chemical Industries, Ltd .: Epofriend CT310) 3 parts Curing agent Polyisocyanate [Coronate HX] Nippon Polyurethane] 2 parts Methyl ethyl ketone 30 parts Toluene 70 parts Preparation of coating solution for intermediate layer 2 Polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: SREC BX-1] 5 parts thermoplastic elastomer (manufactured by Daicel Chemical Industries, Ltd .: Epo 2.5 parts UV absorber (TINUVIN-400 manufactured by Ciba Geigy) 0.5 part Curing agent Polyisocyanate [Coronate HX Nippon Polyurethane] 2 parts Methyl ethyl ketone 30 parts Toluene 70 parts [Primer layer]
Using the following primer layer solution, coating was performed with a wire bar, and the coating was dried at 100 ° C. for 30 seconds to 1.0 μm.
Preparation of Primer Layer 1 Coating Solution Polyvinyl butyral resin (Sekisui Chemical Co., Ltd .: Esrec BX-1) 4 parts thermoplastic elastomer (Daicel Chemical Industries, Ltd .: Epofriend CT310) 4 parts Curing agent Polyisocyanate [Coronate HX] Nippon Polyurethane] 2 parts Methyl ethyl ketone 30 parts Toluene 70 parts Preparation of coating solution for primer layer 2 Polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: Esrec BX-1] 2.3 parts Thermoplastic elastomer (manufactured by Daicel Chemical Industries, Ltd.) : Epofriend CT310) 7 parts UV absorber (TINUVIN-400, Ciba-Geigy) 0.5 part Light stabilizer (TINUVIN-123, Ciba-Geigy) 0.2 part Curing agent Polyisocyanate [Coronate HX Japan Polyurethane] 2 parts methyl ethyl ketone 30 parts Toluene 70 parts [Adhesive layer]
Using the following adhesive layer liquid, it was applied with a wire bar and dried at 70 ° C. for 30 seconds to 0.5 μm.

Preparation of Adhesive Layer 1 Coating Solution Urethane-modified ethylene ethyl acrylate copolymer [Toho Chemical Industry Co., Ltd .: Hitec S6254B] 8 parts Polyacrylate ester copolymer [Nippon Pure Chemical Co., Ltd .: Julimer AT510] 2 parts Water 45 parts Ethanol 45 parts Preparation of coating solution for adhesive layer 2 Urethane-modified ethylene ethyl acrylate copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254B] 9 parts Polyacrylate ester copolymer [manufactured by Nippon Pure Chemical Co., Ltd.] : Julimer AT210] 1 part Water 45 parts Ethanol 45 parts <Transfer foil transfer method>
After describing the face image and the character information described below, heat was applied at a pressure of 150 kg / cm ² for 1.2 seconds using a heat roller having a diameter of 5 cm and a rubber hardness of 85, which was heated to a surface temperature of 200 ° C. using a transfer foil. Transfer was performed. The transfer foil was transferred after image formation on the image recording medium described below.
<Preparation of ID card substrate 1>
A white polypropylene resin (Noblen FL25HA, manufactured by Mitsubishi Yuka Co., Ltd.) was provided on both sides of a 350 μm-thick polyethylene terephthalate (Tetron HS350, manufactured by Teijin Limited) by extrusion lamination to a thickness of 50 μm. One surface of the obtained composite resin sheet was subjected to a corona discharge treatment at 25 W / m ² · min, and this sheet was used as a support.

(Image receiving layer formation)
A coating liquid for forming a first image-receiving layer, a coating liquid for forming a second image-receiving layer, and a coating liquid for forming a third image-receiving layer having the following compositions are coated and dried in this order on the corona discharge-treated surface of the support, The image receiving layers were formed by laminating the respective layers so that the thicknesses became 0.2 μm, 2.5 μm, and 0.5 μm.
<Coating liquid for forming first image receiving layer>
9 parts of polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: Eslec BL-1]
1 part of isocyanate [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
80 parts of methyl ethyl ketone 10 parts of butyl acetate <Coating solution for forming second image receiving layer>
6 parts of polyvinyl butyral resin (Sekisui Chemical Co., Ltd .: S-LEC BX-1)
Metal ion-containing compound (Compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming third image receiving layer>
2 parts of polyethylene wax [Toho Chemical Industry Co., Ltd .: Hitec E1000]
8 parts of urethane-modified ethylene acrylic acid copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254]
Methylcellulose (Shin-Etsu Chemical Co., Ltd .: SM15) 0.1 part Water 90 parts
A fixed format was provided thereon by letterpress printing using UV printing ink (FD-O black, manufactured by Naruto Ink). Further, a transparent UV-curable OP varnish (FD-O dry coat varnish, manufactured by Naruto Ink) is applied to the area excluding the sublimation thermal transfer image recording area by letterpress printing while adjusting the printing density and printing pressure. The linear average roughness (Ra) was adjusted to 0.4 μm to obtain an ID card base material of the present invention. UV irradiation conditions at the time of printing were equivalent to 200 mj with a high-pressure mercury lamp.

(Writing layer formation)
On the opposite side of the support from the image receiving layer, Opo Yuka Co., Ltd .: Yupo DFG-65 sheet is laminated, and a first writing layer forming coating liquid and a second writing layer forming coating liquid having the following composition are applied. And a coating liquid for forming a third writing layer were applied and dried in this order, and laminated so that their thicknesses were 5 μm, 15 μm, and 0.2 μm, thereby forming an image receiving layer.
<Coating liquid for forming first writing layer>
Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Carbon black trace amount of titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming second writing layer>
4 parts of polyester resin [Toyobo Co., Ltd .: Vironal MD1200]
Silica 5 parts Titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Water 90 parts <Coating liquid for forming the third writing layer>
Polyamide resin [manufactured by Sanwa Chemical Industry Co., Ltd .: Sunmide 55] 5 parts Methanol 95 parts (formation of information carrier composed of format print layer)
A fixed format was provided thereon by letterpress printing using UV printing ink (FD-O black, manufactured by Naruto Ink). UV irradiation conditions at the time of printing were equivalent to 200 mj with a high-pressure mercury lamp.

  The sheet having the image receiving layer and the writing layer formed as described above was cut and trimmed with a roll cutter to prepare an ID card substrate 1 having a size of 55 mm × 85 mm. The card thickness was 490 μm.

<Preparation of ID card base material 2>
A white polypropylene resin (Noblen FL25HA, manufactured by Mitsubishi Yuka Co., Ltd.) was provided on both sides of a 350 μm-thick polyethylene terephthalate (Tetron HS350, manufactured by Teijin Limited) by extrusion lamination to a thickness of 50 μm. One surface of the obtained composite resin sheet was subjected to a corona discharge treatment at 25 W / m ² · min, and this sheet was used as a support.

(Image receiving layer formation)
A coating liquid for forming a first image-receiving layer, a coating liquid for forming a second image-receiving layer, and a coating liquid for forming a third image-receiving layer having the following compositions are coated and dried in this order on the corona discharge-treated surface of the support, The image receiving layers were formed by laminating the respective layers so that the thicknesses became 0.2 μm, 2.5 μm, and 0.5 μm.
<Coating liquid for forming first image receiving layer>
9 parts of polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: Eslec BL-1]
1 part of isocyanate [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
80 parts of methyl ethyl ketone 10 parts of butyl acetate <Coating solution for forming second image receiving layer>
6 parts of polyvinyl butyral resin (Sekisui Chemical Co., Ltd .: S-LEC BX-1)
Metal ion-containing compound (Compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming third image receiving layer>
2 parts of polyethylene wax [Toho Chemical Industry Co., Ltd .: Hitec E1000]
8 parts of urethane-modified ethylene acrylic acid copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254]
Methylcellulose (Shin-Etsu Chemical Co., Ltd .: SM15) 0.1 part Water 90 parts
A fixed format was provided thereon by letterpress printing using UV printing ink (FD-O black, manufactured by Naruto Ink). Further, in an area other than the sublimation thermal transfer image recording area, UV clear for surface decoration (FUN-COAT DPL-K, Jujo Chemical Co., Ltd.) was printed at 200 mesh by screen printing. The base material for an ID card of the present invention having a center line average roughness (Ra) of 0.8 μm was obtained. UV irradiation conditions at the time of printing were equivalent to 200 mj with a high-pressure mercury lamp.

(Writing layer formation)
On the opposite side of the support from the image receiving layer, Opo Yuka Co., Ltd .: Yupo DFG-65 sheet is laminated, and a first writing layer forming coating liquid and a second writing layer forming coating liquid having the following composition are applied. And a coating liquid for forming a third writing layer were applied and dried in this order, and laminated so that their thicknesses were 5 μm, 15 μm, and 0.2 μm, thereby forming an image receiving layer.
<Coating liquid for forming first writing layer>
Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Carbon black trace amount of titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming second writing layer>
4 parts of polyester resin [Toyobo Co., Ltd .: Vironal MD1200]
Silica 5 parts Titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Water 90 parts <Coating liquid for forming the third writing layer>
Polyamide resin [manufactured by Sanwa Chemical Industry Co., Ltd .: Sunmide 55] 5 parts Methanol 95 parts (formation of information carrier composed of format print layer)
A fixed format was provided thereon by letterpress printing using UV printing ink (FD-O black, manufactured by Naruto Ink). UV irradiation conditions at the time of printing were equivalent to 200 mj with a high-pressure mercury lamp.

  The sheet having the image receiving layer and the writing layer prepared as described above was cut and trimmed with a roll cutter to prepare an ID card substrate 2 having a size of 55 mm × 85 mm. The card thickness was 490 μm.

<Preparation of ID card base material 3>
(Preparation of the first sheet member (image receiving sheet))
A 188 μm-thick U2L98W (with an antistatic layer) white support manufactured by Teijin Dupont Film Co., Ltd. was used as a top sheet and a back sheet. A first sheet member was formed by sequentially applying and drying a cushion layer, an image receiving layer, and an information carrier layer comprising the following composition.
(Light-curing cushion layer) 10 μm thick
Urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA512) 55 parts Polyester acrylate (manufactured by Toagosei Co., Ltd .: Aronix M6200) 15 parts Urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA4000) 25 parts Hydroxycyclohexyl phenyl ketone ( Ciba Specialty Chemicals: Irgacure 184) 5 parts Methyl ethyl ketone 100 parts After application, the actinic ray-curable compound was dried at 90 ° C./30 sec, and then photocured with a mercury lamp (300 mJ / cm ² ).

(Image receiving layer)
A coating solution for forming a first image receiving layer and a coating solution for forming a second image receiving layer having the following composition are applied and dried in this order on the cushion layer so that the thicknesses thereof become 2.5 μm and 0.5 μm, respectively. The image receiving layer was formed by laminating.
<Coating liquid for forming first image receiving layer>
6 parts of polyvinyl butyral resin (Sekisui Chemical Co., Ltd .: S-LEC BX-1)
Metal ion-containing compound (Compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating solution for forming second image receiving layer>
2 parts of polyethylene wax [Toho Chemical Industry Co., Ltd .: Hitec E1000]
8 parts of urethane-modified ethylene acrylic acid copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254]
Methylcellulose [Shin-Etsu Chemical Co., Ltd .: SM15] 0.1 parts Water 90 parts (formation of information carrier composed of format print layer)
A fixed format was provided thereon by letterpress printing using UV printing ink (FD-O black, manufactured by Naruto Ink). Further, a transparent UV-curable OP varnish (FD-O dry coat varnish, manufactured by Naruto Ink) is applied to the area excluding the sublimation thermal transfer image recording area by letterpress printing while adjusting the printing density and printing pressure. The linear average roughness (Ra) was adjusted to 0.4 μm to obtain an ID card base material of the present invention. UV irradiation conditions at the time of printing were equivalent to 200 mj with a high-pressure mercury lamp.

(Preparation of the second sheet member (writing sheet))
As a top sheet of the first sheet member and a back sheet of the second sheet member, a U2L98W (with an antistatic layer) 188 μm thick white support manufactured by Teijin Dupont Films Co., Ltd. was used. A second sheet member was formed by sequentially applying and drying writing layers made of the following compositions so that the thicknesses became 5 μm, 15 μm, and 0.2 μm, respectively.
<Coating liquid for forming first writing layer>
Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Carbon black trace amount of titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming second writing layer>
4 parts of polyester resin [Toyobo Co., Ltd .: Vironal MD1200]
Silica 5 parts Titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Water 90 parts <Coating liquid for forming the third writing layer>
Polyamide resin (manufactured by Sanwa Chemical Industry Co., Ltd .: Sunmide 55) 5 parts Methanol 95 parts (formation of information carrier layer on writing layer)
Format printing (ruled lines, issuer name, issuer telephone number) was performed by the offset printing method. The printing ink used was UV black ink. UV irradiation conditions at the time of printing were equivalent to 200 mj with a high-pressure mercury lamp.

On the support side of the first sheet member prepared above, Macroplast QR3460 manufactured by Henkel Co., Ltd. hot-melted at 130 ° C. was applied, and on the support side of the second sheet member, Macroplast QR3460 manufactured by Henkel Co., Ltd. hot-melted at 130 ° C. coated, pressure, heat roll condition, the pressure is 0.2 kg / cm ^2, the heating temperature is performed bonding at 60 ° C., further after storage 7 days at 23 ° C. / 55%, cosmetics cutting a roll cutter Then, an ID card base material 3 having a size of 55 mm × 85 mm was obtained. The card thickness was 740 μm.

[IC card base material making method]
An IC card base material was prepared using the IC card base material forming apparatus shown in FIG. Hereinafter, the IC card base material producing apparatus will be described.

  FIG. 17 shows a typical first sheet member, and FIG. 18 shows a second sheet member.

<Example of electronic components>
[Embodiment of the invention]
Hereinafter, an image recording body, an apparatus for manufacturing the same, and a method for manufacturing the same will be described with reference to the drawings.

<Method of making IC-mounted card substrate and IC-mounted card substrate with image receiving layer>
FIG. 19 is a diagram showing an example of a laminated structure of an IC mounting card base and an IC mounting card base with an image receiving layer.

  20 to 22 are detailed drawings of the electronic component fixing layer shown in FIG. FIG. 20 is a schematic diagram of an IC module in which an IC chip 100 is joined to an antenna coil 101 in which a copper wire is wound four times. Although it is possible to use the form shown in FIG. 20 as the fixed layer of the present invention, it is preferable to use the types shown in FIGS.

  FIG. 21 and FIG. 22 are schematic views of the electronic component fixing layer used in the present invention. FIG. 21 is a schematic diagram of a nonwoven fabric type, in which a nonwoven fabric 103 on which a print pattern is formed and an IC chip 100 are joined by bonding or the like. It is also possible to use an IC card sheet "FT series" manufactured by Hitachi Maxell, Ltd.

  FIG. 22 is a schematic diagram of a printed circuit board type, in which a printed circuit board 104 on which a printed pattern is formed and an IC chip 100 are joined by bonding or the like. When a nonwoven fabric sheet as shown in FIG. 21, that is, a porous resin sheet, is used, the impregnating property of the adhesive at the time of heat bonding is improved, and the adhesiveness between members becomes superior. The IC chip 100 is reinforced by a reinforcing plate 102 against bending and pressing. In the present invention, the IC card shown in FIG. 19 was created using either FIG. 21 or FIG. The IC card was prepared by interposing an electronic component fixing layer 114 having a predetermined thickness shown in FIG. 21 or FIG. 22 between the first sheet member 110 and the second sheet member 111 with adhesive layers 112 and 113.

[IC card base making device]
Next, an IC card base material producing apparatus as an embodiment will be described. FIG. 16 is a perspective view showing an IC card base material producing apparatus. The IC card base material producing apparatus of the present invention includes a first sheet member (back sheet) having a long sheet shape and a thickness of 188 μm and a second sheet member (top sheet) having a single sheet shape and a thickness of 188 μm. Is done. A first sheet member (image receiving sheet) conveying step and a second sheet member (writing sheet) conveying step are provided, the first sheet member is supplied from the first sheet member (image receiving sheet) supply section 600, and the second sheet member ( A second sheet member is supplied from a writing sheet (supply unit) 601.

  An IC card adhesive, specifically, a moisture-curable hot melt adhesive Macroplast QR3460 adhesive manufactured by Henkel Japan Co., Ltd. is melted at 130 ° C. under nitrogen from the low-temperature adhesive supply unit 610 to the first sheet member, An adhesive is supplied from the low-temperature adhesive supply unit 610 by a T-die coating method, and an electronic component having a thickness of about 300 μm and including FIG. 21 or FIG. .

  An IC card adhesive, specifically, a moisture-curable hot melt adhesive Macroplast QR3460 adhesive manufactured by Henkel Japan Co., Ltd. is applied to the second sheet member having a long sheet shape and a thickness of 188 μm from the low-temperature adhesive supply unit 611. The mixture was melted at 130 ° C. under nitrogen, and the adhesive was supplied from a low-temperature adhesive supply unit 611 by a T-die coating method.

The first sheet member coated with the low-temperature adhesive is conveyed by a first sheet conveying member 620, and the first sheet member and the second sheet member are heated / pressed by a roll 621 (pressure 3 kg / cm ² , roll surface temperature 70). C), and the IC card base material is controlled to 740 μm by the film thickness control roll 622, and is taken out by the IC mounted card base material transport member 623.

  It is preferable that the IC card base material is cut after the curing of the adhesive and the adhesion to the support are sufficiently performed. In the present invention, the curing is accelerated for 10 days at 23 ° C./55%. After that, an IC card substrate having a size of 55 mm × 85 mm was obtained from the original IC card substrate with a rotary cutter. When there was no format printing part on the front and back surfaces of the finished card base material, a logo and an OP varnish were sequentially printed by a letterpress printing method using a card printer.

  FIG. 23 is a front view of the IC card or ID card base material, and FIG. 24 is a rear view of the IC card or ID card base material. FIG. 25 is a front view of the IC card or the ID card, and FIG. 26 is a rear view of the IC card or the ID card.

<Preparation of IC card substrate 1>
(Preparation of the first sheet member (image receiving sheet))
A 188 μm-thick U2L98W (with an antistatic layer) white support manufactured by Teijin Dupont Film Co., Ltd. was used as a top sheet and a back sheet. A first sheet member was formed by sequentially applying and drying a cushion layer, an image receiving layer, and an information carrier layer comprising the following composition.
(Light-curing cushion layer) 10 μm thick
Urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA512) 55 parts Polyester acrylate (manufactured by Toagosei Co., Ltd .: Aronix M6200) 15 parts Urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA4000) 25 parts Hydroxycyclohexyl phenyl ketone ( Ciba Specialty Chemicals: Irgacure 184) 5 parts Methyl ethyl ketone 100 parts After application, the actinic ray-curable compound was dried at 90 ° C./30 sec, and then photocured with a mercury lamp (300 mJ / cm ² ).

(Image receiving layer)
A coating solution for forming a first image receiving layer and a coating solution for forming a second image receiving layer having the following composition are applied and dried in this order on the cushion layer so that the thicknesses thereof become 2.5 μm and 0.5 μm, respectively. The image receiving layer was formed by laminating.
<Coating liquid for forming first image receiving layer>
6 parts of polyvinyl butyral resin (Sekisui Chemical Co., Ltd .: S-LEC BX-1)
Metal ion-containing compound (Compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating solution for forming second image receiving layer>
2 parts of polyethylene wax [Toho Chemical Industry Co., Ltd .: Hitec E1000]
8 parts of urethane-modified ethylene acrylic acid copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254]
Methylcellulose (Shin-Etsu Chemical Co., Ltd .: SM15) 0.1 part Water 90 parts
A fixed format was provided thereon by letterpress printing using UV printing ink (FD-O black, manufactured by Naruto Ink). Further, a transparent UV-curable OP varnish (FD-O dry coat varnish, manufactured by Naruto Ink) is applied to the area excluding the sublimation thermal transfer image recording area by letterpress printing while adjusting the printing density and printing pressure. The linear average roughness (Ra) was adjusted to 0.4 μm to obtain an ID card base material of the present invention. UV irradiation conditions at the time of printing were equivalent to 200 mj with a high-pressure mercury lamp.

(Preparation of the second sheet member (writing sheet))
A 188 μm-thick U2L98W (with an antistatic layer) white support manufactured by Teijin Dupont Film Co., Ltd. was used as a top sheet and a back sheet. A second sheet member was formed by sequentially applying and drying writing layers made of the following compositions so that the thicknesses became 5 μm, 15 μm, and 0.2 μm, respectively.
<Coating liquid for forming first writing layer>
Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Carbon black trace amount of titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming second writing layer>
4 parts of polyester resin [Toyobo Co., Ltd .: Vironal MD1200]
Silica 5 parts Titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Water 90 parts <Coating liquid for forming the third writing layer>
Polyamide resin (manufactured by Sanwa Chemical Industry Co., Ltd .: Sunmide 55) 5 parts Methanol 95 parts (formation of information carrier layer on writing layer)
Format printing (ruled lines, issuer name, issuer telephone number) was performed by the offset printing method. The printing ink used was UV black ink. UV irradiation conditions at the time of printing were equivalent to 200 mj with a high-pressure mercury lamp.

On the support side of the first sheet member prepared above, Macroplast QR3460 manufactured by Henkel Co., Ltd., which was hot melted at 130 ° C., was applied, and an IC card sheet “FT series” manufactured by Hitachi Maxell, Ltd. was laminated thereon. Two sides of the support member were coated with Macroplast QR3460 manufactured by Henkel, which was hot melted at 130 ° C., and the pressure and the heating roll were bonded at a pressure of 0.2 kg / cm ² and a heating temperature of 60 ° C. Then, after storing at 23 ° C./55% for 10 days, makeup cutting was performed with a roll cutter to obtain an IC card substrate 1 having a size of 55 mm × 85 mm. The card thickness was 740 μm.

  The distance between the local maximum portion of the concave portion or the convex portion on the card surface and the reference line was 10 μm, and the maximum value of the inclination from the side of the concave portion or the convex portion with respect to the reference line was 40 °.

<Preparation of IC card base 2>
(Preparation of the first sheet member (image receiving sheet))
A 188 μm-thick U2L98W (with an antistatic layer) white support manufactured by Teijin Dupont Film Co., Ltd. was used as a top sheet and a back sheet. A first sheet member was formed by sequentially applying and drying a cushion layer, an image receiving layer, and an information carrier layer comprising the following composition.
(Light-curing cushion layer) 10 μm thick
Urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA512) 55 parts Polyester acrylate (manufactured by Toagosei Co., Ltd .: Aronix M6200) 15 parts Urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA4000) 25 parts Hydroxycyclohexyl phenyl ketone ( Ciba Specialty Chemicals: Irgacure 184) 5 parts Methyl ethyl ketone 100 parts After application, the actinic ray-curable compound was dried at 90 ° C./30 sec, and then photocured with a mercury lamp (300 mJ / cm ² ).

(Image receiving layer)
A coating solution for forming a first image receiving layer and a coating solution for forming a second image receiving layer having the following composition are applied and dried in this order on the cushion layer so that the thicknesses thereof become 2.5 μm and 0.5 μm, respectively. The image receiving layer was formed by laminating.
<Coating liquid for forming first image receiving layer>
6 parts of polyvinyl butyral resin (Sekisui Chemical Co., Ltd .: S-LEC BX-1)
Metal ion-containing compound (Compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating solution for forming second image receiving layer>
2 parts of polyethylene wax [Toho Chemical Industry Co., Ltd .: Hitec E1000]
8 parts of urethane-modified ethylene acrylic acid copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254]
Methylcellulose (Shin-Etsu Chemical Co., Ltd .: SM15) 0.1 part Water 90 parts
A fixed format was provided thereon by letterpress printing using UV printing ink (FD-O black, manufactured by Naruto Ink). Further, a transparent UV-curable OP varnish (FD-O dry coat varnish, manufactured by Naruto Ink) is applied to the area excluding the sublimation thermal transfer image recording area by letterpress printing while adjusting the printing density and printing pressure. The linear average roughness (Ra) was adjusted to 0.4 μm to obtain an ID card base material of the present invention. UV irradiation conditions at the time of printing were equivalent to 200 mj with a high-pressure mercury lamp.

(Preparation of the second sheet member (writing sheet))
A 188 μm-thick U2L98W (with an antistatic layer) white support manufactured by Teijin Dupont Film Co., Ltd. was used as a top sheet and a back sheet. A second sheet member was formed by sequentially applying and drying writing layers made of the following compositions so that the thicknesses became 5 μm, 15 μm, and 0.2 μm, respectively.
<Coating liquid for forming first writing layer>
Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Carbon black trace amount of titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming second writing layer>
4 parts of polyester resin [Toyobo Co., Ltd .: Vironal MD1200]
Silica 5 parts Titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Water 90 parts <Coating liquid for forming the third writing layer>
Polyamide resin (manufactured by Sanwa Chemical Industry Co., Ltd .: Sunmide 55) 5 parts Methanol 95 parts (formation of information carrier layer on writing layer)
Format printing (ruled lines, issuer name, issuer telephone number) was performed by the offset printing method. The printing ink used was UV black ink. UV irradiation conditions at the time of printing were equivalent to 200 mj with a high-pressure mercury lamp.

On the support side of the first sheet member prepared above, Macroplast QR3460 manufactured by Henkel, which was hot melted at 130 ° C., was applied, and an IC card sheet “FT series” manufactured by Hitachi Maxell, Ltd. was laminated thereon. Two sides of the support of the sheet member were coated with Macroplast QR3460 manufactured by Henkel, which was hot melted at 130 ° C., and the pressure and the heating roll were applied under the conditions of a pressure of 0.005 kg / cm ² and a heating temperature of 60 ° C. Then, after storing at 23 ° C./55% for 10 days, makeup cutting was performed with a roll cutter to obtain an IC card substrate 2 having a size of 55 mm × 85 mm. The card thickness was 740 μm.

  The distance between the local maximum portion of the concave portion or convex portion on the card surface and the reference line was 25 μm, and the maximum value of the inclination of the concave portion or convex portion with respect to the reference line from the side of the concave portion was 40 °.

<Preparation of IC card base material 3>
(Preparation of the first sheet member (image receiving sheet))
A 188 μm-thick U2L98W (with an antistatic layer) white support manufactured by Teijin Dupont Film Co., Ltd. was used as a top sheet and a back sheet. A first sheet member was formed by sequentially applying and drying a cushion layer, an image receiving layer, and an information carrier layer comprising the following composition.
(Light-curing cushion layer) 10 μm thick
Urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA512) 55 parts Polyester acrylate (manufactured by Toagosei Co., Ltd .: Aronix M6200) 15 parts Urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA4000) 25 parts Hydroxycyclohexyl phenyl ketone ( Ciba Specialty Chemicals: Irgacure 184) 5 parts Methyl ethyl ketone 100 parts After application, the actinic ray-curable compound was dried at 90 ° C./30 sec, and then photocured with a mercury lamp (300 mJ / cm ² ).

(Image receiving layer)
A coating solution for forming a first image receiving layer and a coating solution for forming a second image receiving layer having the following composition are applied and dried in this order on the cushion layer so that the thicknesses thereof become 2.5 μm and 0.5 μm, respectively. The image receiving layer was formed by laminating.
<Coating liquid for forming first image receiving layer>
6 parts of polyvinyl butyral resin (Sekisui Chemical Co., Ltd .: S-LEC BX-1)
Metal ion-containing compound (Compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating solution for forming second image receiving layer>
2 parts of polyethylene wax [Toho Chemical Industry Co., Ltd .: Hitec E1000]
8 parts of urethane-modified ethylene acrylic acid copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254]
Methylcellulose (Shin-Etsu Chemical Co., Ltd .: SM15) 0.1 part Water 90 parts
A fixed format was provided thereon by letterpress printing using UV printing ink (FD-O black, manufactured by Naruto Ink). Further, a transparent UV-curable OP varnish (FD-O dry coat varnish, manufactured by Naruto Ink) is applied to the area excluding the sublimation thermal transfer image recording area by letterpress printing while adjusting the printing density and printing pressure. The linear average roughness (Ra) was adjusted to 0.4 μm to obtain an ID card base material of the present invention. UV irradiation conditions at the time of printing were equivalent to 200 mj with a high-pressure mercury lamp.

(Preparation of the second sheet member (writing sheet))
A 188 μm-thick U2L98W (with an antistatic layer) white support manufactured by Teijin Dupont Film Co., Ltd. was used as a top sheet and a back sheet. A second sheet member was formed by sequentially applying and drying writing layers made of the following compositions so that the thicknesses became 5 μm, 15 μm, and 0.2 μm, respectively.
<Coating liquid for forming first writing layer>
Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Carbon black trace amount of titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming second writing layer>
4 parts of polyester resin [Toyobo Co., Ltd .: Vironal MD1200]
Silica 5 parts Titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Water 90 parts <Coating liquid for forming the third writing layer>
Polyamide resin (manufactured by Sanwa Chemical Industry Co., Ltd .: Sunmide 55) 5 parts Methanol 95 parts (formation of information carrier layer on writing layer)
Format printing (ruled lines, issuer name, issuer telephone number) was performed by the offset printing method. The printing ink used was UV black ink. UV irradiation conditions at the time of printing were equivalent to 200 mj with a high-pressure mercury lamp.

On the support side of the first sheet member prepared above, Macroplast QR3460 manufactured by Henkel Co., Ltd., which was hot melted at 130 ° C., was applied, and an IC card sheet “FT series” manufactured by Hitachi Maxell, Ltd. was laminated thereon, and further a reinforcing plate A two-part curable epoxy resin and a chip were fixed and reinforced by using 50 μm SUS. Further, Macroplast QR3460 manufactured by Henkel Co., which was hot-melted to 130 ° C., was applied to the support side of the second sheet member, and applied under pressure and heating roll conditions of 0.01 kg / cm ^{2 at} a pressure of 60 ° C. and a heating temperature of 60 ° C. After performing alignment and further storing at 23 ° C./55% for 10 days, makeup cutting was performed with a roll cutter to obtain an IC card substrate 3 having a size of 55 mm × 85 mm. The card thickness was 740 μm.

  The distance between the local maximum portion of the concave portion or convex portion on the card surface and the reference line was 18 μm, and the maximum value of the inclination of the concave portion or convex portion with respect to the reference line from the side of the concave portion was 90 °.

<Preparation of IC card base 4>
(Preparation of the first sheet member (image receiving sheet))
A 188 μm-thick U2L98W (with an antistatic layer) white support manufactured by Teijin Dupont Film Co., Ltd. was used as a top sheet and a back sheet. A first sheet member was formed by sequentially applying and drying a cushion layer, an image receiving layer, and an information carrier layer comprising the following composition.
(Light-curing cushion layer) 10 μm thick
Urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA512) 55 parts Polyester acrylate (manufactured by Toagosei Co., Ltd .: Aronix M6200) 15 parts Urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA4000) 25 parts Hydroxycyclohexyl phenyl ketone ( Ciba Specialty Chemicals: Irgacure 184) 5 parts Methyl ethyl ketone 100 parts After application, the actinic ray-curable compound was dried at 90 ° C./30 sec, and then photocured with a mercury lamp (300 mJ / cm ² ).

(Image receiving layer)
A coating solution for forming a first image receiving layer and a coating solution for forming a second image receiving layer having the following composition are applied and dried in this order on the cushion layer so that the thicknesses thereof become 2.5 μm and 0.5 μm, respectively. The image receiving layer was formed by laminating.
<Coating liquid for forming first image receiving layer>
6 parts of polyvinyl butyral resin (Sekisui Chemical Co., Ltd .: S-LEC BX-1)
Metal ion-containing compound (Compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating solution for forming second image receiving layer>
2 parts of polyethylene wax [Toho Chemical Industry Co., Ltd .: Hitec E1000]
8 parts of urethane-modified ethylene acrylic acid copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254]
Methylcellulose (Shin-Etsu Chemical Co., Ltd .: SM15) 0.1 part Water 90 parts
A fixed format was provided thereon by letterpress printing using UV printing ink (FD-O black, manufactured by Naruto Ink). Further, in an area other than the sublimation thermal transfer image recording area, UV clear for surface decoration (FUN-COAT DPL-K, Jujo Chemical Co., Ltd.) was printed at 200 mesh by screen printing. The base material for an ID card of the present invention having a center line average roughness (Ra) of 0.8 μm was obtained. UV irradiation conditions at the time of printing were equivalent to 200 mj with a high-pressure mercury lamp.

(Preparation of the second sheet member (writing sheet))
A 188 μm-thick U2L98W (with an antistatic layer) white support manufactured by Teijin Dupont Film Co., Ltd. was used as a top sheet and a back sheet. A second sheet member was formed by sequentially applying and drying writing layers made of the following compositions so that the thicknesses became 5 μm, 15 μm, and 0.2 μm, respectively.
<Coating liquid for forming first writing layer>
Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Carbon black trace amount of titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming second writing layer>
4 parts of polyester resin [Toyobo Co., Ltd .: Vironal MD1200]
Silica 5 parts Titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Water 90 parts <Coating liquid for forming the third writing layer>
Polyamide resin (manufactured by Sanwa Chemical Industry Co., Ltd .: Sunmide 55) 5 parts Methanol 95 parts (formation of information carrier layer on writing layer)
Format printing (ruled lines, issuer name, issuer telephone number) was performed by the offset printing method. The printing ink used was UV black ink. UV irradiation conditions at the time of printing were equivalent to 200 mj with a high-pressure mercury lamp.

On the support side of the first sheet member prepared above, Macroplast QR3460 manufactured by Henkel Co., Ltd., which was hot melted at 130 ° C., was applied, and an IC card sheet “FT series” manufactured by Hitachi Maxell, Ltd. was laminated thereon, and further a reinforcing plate A two-part curable epoxy resin and a chip were fixed and reinforced by using 50 μm SUS. Further, Macroplast QR3460 manufactured by Henkel Co., which was hot-melted to 130 ° C., was applied to the support side of the second sheet member, and applied under pressure and heating roll conditions of 0.01 kg / cm ^{2 for} pressure and 60 ° C. for heating. After performing alignment and further storing at 23 ° C./55% for 10 days, makeup cutting was performed with a roll cutter to obtain an IC card substrate 4 having a size of 55 mm × 85 mm. The card thickness was 740 μm.

  The distance between the local maximum portion of the concave portion or convex portion on the card surface and the reference line was 18 μm, and the maximum value of the inclination from the concave portion or convex portion side to the reference line was 90 °.

<Preparation of IC card base material 5>
(Preparation of the first sheet member (image receiving sheet))
A 188 μm-thick U2L98W (with an antistatic layer) white support manufactured by Teijin Dupont Film Co., Ltd. was used as a top sheet and a back sheet. A first sheet member was formed by sequentially applying and drying a cushion layer, an image receiving layer, and an information carrier layer comprising the following composition.
(Light-curing cushion layer) 10 μm thick
Urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA512) 55 parts Polyester acrylate (manufactured by Toagosei Co., Ltd .: Aronix M6200) 15 parts Urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA4000) 25 parts Hydroxycyclohexyl phenyl ketone ( Ciba Specialty Chemicals: Irgacure 184) 5 parts Methyl ethyl ketone 100 parts After application, the actinic ray-curable compound was dried at 90 ° C./30 sec, and then photocured with a mercury lamp (300 mJ / cm ² ).

(Image receiving layer)
A coating solution for forming a first image receiving layer and a coating solution for forming a second image receiving layer having the following composition are applied and dried in this order on the cushion layer so that the thicknesses thereof become 2.5 μm and 0.5 μm, respectively. The image receiving layer was formed by laminating.
<Coating liquid for forming first image receiving layer>
6 parts of polyvinyl butyral resin (Sekisui Chemical Co., Ltd .: S-LEC BX-1)
Metal ion-containing compound (Compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating solution for forming second image receiving layer>
2 parts of polyethylene wax [Toho Chemical Industry Co., Ltd .: Hitec E1000]
8 parts of urethane-modified ethylene acrylic acid copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254]
Methylcellulose (Shin-Etsu Chemical Co., Ltd .: SM15) 0.1 part Water 90 parts
A fixed format was provided thereon by letterpress printing using UV printing ink (FD-O black, manufactured by Naruto Ink). Further, in an area other than the sublimation thermal transfer image recording area, UV clear for surface decoration (FUN-COAT DPL-K, Jujo Chemical Co., Ltd.) was printed at 200 mesh by screen printing. The base material for an ID card of the present invention having a center line average roughness (Ra) of 0.8 μm was obtained. UV irradiation conditions at the time of printing were equivalent to 200 mj with a high-pressure mercury lamp.

(Preparation of the second sheet member (writing sheet))
A 188 μm-thick U2L98W (with an antistatic layer) white support manufactured by Teijin Dupont Film Co., Ltd. was used as a top sheet and a back sheet. A second sheet member was formed by sequentially applying and drying writing layers made of the following compositions so that the thicknesses became 5 μm, 15 μm, and 0.2 μm, respectively.
<Coating liquid for forming first writing layer>
Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Carbon black trace amount of titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming second writing layer>
4 parts of polyester resin [Toyobo Co., Ltd .: Vironal MD1200]
Silica 5 parts Titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part Water 90 parts <Coating liquid for forming the third writing layer>
Polyamide resin (manufactured by Sanwa Chemical Industry Co., Ltd .: Sunmide 55) 5 parts Methanol 95 parts (formation of information carrier layer on writing layer)
Format printing (ruled lines, issuer name, issuer telephone number) was performed by the offset printing method. The printing ink used was UV black ink. UV irradiation conditions at the time of printing were equivalent to 200 mj with a high-pressure mercury lamp.

On the support side of the first sheet member prepared above, Macroplast QR3460 manufactured by Henkel Co., Ltd., which was hot melted at 130 ° C., was applied, and an IC card sheet “FT series” manufactured by Hitachi Maxell, Ltd. was laminated thereon, and further a reinforcing plate A two-part curable epoxy resin and a chip were fixed and reinforced by using 50 μm SUS. Further, Macroplast QR3460 manufactured by Henkel Co., which was hot-melted to 130 ° C., was applied to the support side of the second sheet member, and applied under pressure and heating roll conditions of 0.005 kg / cm ² under pressure and 60 ° C. under heating. After performing alignment and further storing at 23 ° C./55% for 10 days, makeup cutting was performed with a roll cutter to obtain an IC card substrate 5 having a size of 55 mm × 85 mm. The card thickness was 740 μm.

  The distance between the local maximum part of the concave part or convex part on the card surface and the reference line was 25 μm, and the maximum value of the inclination from the concave part or convex part side with respect to the reference line was 90 °.

<How to write the authentication identification image and attribute information image on the ID card>
Information was recorded on the prepared image recording material, that is, the ID card substrates 1 to 3 and the IC card substrates 1 to 5 using the following information recording members.

(Preparation of ink sheet for sublimation type thermal transfer recording)
A coating liquid for forming a yellow ink layer, a coating liquid for forming a magenta ink layer, and a coating liquid for forming a cyan ink layer each having the following composition is applied to a 6 μm-thick polyethylene terephthalate sheet that has been subjected to an anti-fusing process on the back surface. To obtain ink sheets of three colors of yellow, magenta and cyan.
<Coating liquid for forming yellow ink layer>
3 parts of yellow dye (MSYellow manufactured by Mitsui Toatsu Dye Co., Ltd.) 5.5 parts of polyvinyl acetal [Denka Butyral KY-24 manufactured by Denki Kagaku Kogyo Co., Ltd.]
1 part of polymethyl methacrylate-modified polystyrene [Toda Gosei Chemical Industry Co., Ltd .: Rededa GP-200]
0.5 parts of urethane modified silicone oil [DaiNichisei Chemical Co., Ltd .: Dialomer SP-2105]
Methyl ethyl ketone 70 parts Toluene 20 parts <Magenta ink layer forming coating liquid>
Magenta dye (MS Magenta manufactured by Mitsui Toatsu Dye Co., Ltd.) 2 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24 manufactured by Denki Kagaku Kogyo Co., Ltd.]
2 parts of polymethyl methacrylate-modified polystyrene [Toda Gosei Chemical Industry Co., Ltd .: Rededa GP-200]
0.5 parts of urethane modified silicone oil [DaiNichisei Chemical Co., Ltd .: Dialomer SP-2105]
Methyl ethyl ketone 70 parts Toluene 20 parts <Cyan ink layer forming coating liquid>
3 parts of cyan dye (Kayaset Blue 136 manufactured by Nippon Kayaku Co., Ltd.) 5.6 parts of polyvinyl acetal [Denka Butyral KY-24 manufactured by Denki Kagaku Kogyo Co., Ltd.]
1 part of polymethyl methacrylate-modified polystyrene [Toda Gosei Chemical Industry Co., Ltd .: Rededa GP-200]
0.5 parts of urethane modified silicone oil [DaiNichisei Chemical Co., Ltd .: Dialomer SP-2105]
Methyl ethyl ketone 70 parts Toluene 20 parts (Preparation of ink sheet for melt-type thermal transfer recording)
An ink layer-forming coating liquid having the following composition was applied to a 6 μm-thick polyethylene terephthalate sheet, which had been subjected to a fusion preventing treatment on the back surface, and dried so as to have a thickness of 2 μm to obtain an ink sheet.
<Coating liquid for forming ink layer>
Carnauba wax 1 part Ethylene vinyl acetate copolymer 1 part [manufactured by DuPont Mitsui Chemicals: EV40Y]
Carbon black 3 parts Phenol resin [Arakawa Chemical Industry Co., Ltd .: Tamanol 521] 5 parts Methyl ethyl ketone 90 parts (Formation of face image)
The ink side of the sublimation type thermal transfer recording ink sheet is superposed on the ink sheet side, and the thermal head is used to output 0.23 W / dot, pulse width 0.3 to 4.5 msec, and dot density 16 dot / mm. To form a human image with gradation on the image receiving layer. In this image, the dye and nickel in the image receiving layer form a complex.

(Formation of character information)
A printing portion other than the image receiving layer (such as an OP varnish portion) and an ink side of an ink sheet for fusion-type thermal transfer recording are overlapped with each other, and a 0.5 W / dot, pulse width of 1.0 msec. By heating under the condition of a dot density of 16 dots / mm, character information was formed on a printing portion (eg, an OP varnish portion) other than the image receiving layer.

(Formation of character information)
The ink side of the melt-type thermal transfer recording ink sheet is overlapped and heated from the ink sheet side using a thermal head under the conditions of an output of 0.5 W / dot, a pulse width of 1.0 ms, and a dot density of 16 dots / mm. Thus, character information was formed on the image recording medium for an IC card.

  A face image and attribute information were provided by a card making device, and then a protective layer was provided with a transfer foil.

  Next, using the card bases 1 to 3 of the ID card and the card bases 1 to 5 of the IC card, an ID card and an IC card are created by the card creating apparatus 1 of FIG. 14 and the card creating apparatus 2 of FIG. Then, the scratch strength, card dust adhesion, transfer foil transfer evaluation, transfer foil break evaluation, tape peeling (card / transfer foil adhesion) evaluation, card bending evaluation, card appearance, etc. were evaluated. It is shown in Table 4.

Table 4

* In addition to the above evaluation, Sample 7 showed wrinkles on the finished card transfer surface and unevenness due to holes in the support.

{Evaluation method}
<Scratch strength (wear resistance) measurement method>
When the load is changed with a 0.1 mmφ sapphire needle at 0 to 300 g using a wear resistance tester (HEIDON-18), the surface of the created card is slid, and the card writing layer surface begins to be scratched. Was measured. The higher the load, the better.

<Card dust adhesion>
After 100 cards were prepared, the number of generated sheets was calculated based on the number of dust deposits in the prepared cards. When two sheets were transferred, the adhesion of dust to 100 finished cards was evaluated.

<Evaluation of transfer foil transferability>
100 cards were prepared, and the finished 100 cards were measured using a gold scale to calculate an average untransferred area and a maximum untransferred area (mm ² ). When two sheets were transferred, the transfer property of the first transfer foil and the transfer property of the second transfer foil were evaluated, and the entire average untransferred area and the entire maximum untransferred area (mm ² ) were calculated.

  The closer the untransferred area is to zero, the better, and the larger the number, the worse the transferability.

<Evaluation of transfer foil break>
100 cards were prepared, and the remaining amount of the remaining foil in the portion of the finished 100 cards other than the card was measured with a gold scale, and the average remaining area of the foil and the maximum remaining area of the foil (mm ² ) Was calculated. The first and second foil stripping properties were evaluated, and the overall average foil remaining area and the maximum foil remaining area (mm ² ) were calculated.

  The more the residue, the worse the foil breakage. The lower the number, the better the foil breakage.

<Evaluation of tape peeling (card / transfer foil adhesion)>
A cellophane adhesive tape (manufactured by Nichiban) was strongly adhered to the surface of the cured protective layer, and the cellophane adhesive tape was rapidly peeled from the surface, and the peeled state was evaluated by a method specified in JIS K-5400 Crosscut Tape Method. In the case of an IC card, a tape was attached to the surface of a card having a chip portion, and the above evaluation was performed.

  The surface of the protective layer is cut at an angle of 30 ° with a sharp knife such as a knife to make 100 1 × 10 mm grids (10 × 10) reaching the substrate. The number of grids was measured. If the coating film has good overall adhesiveness, after making a grid, attach cellophane tape to the surface, peel off the tape and measure the number of strips in the thickness direction where the grid is peeled off. Was evaluated.

The evaluation was performed by the following evaluation score method.
Evaluation score of cross-cut test Evaluation score Scratch condition 10 Each cut is thin and smooth on both sides, and does not come off at a glance at the square of the intersection of the cuts.

  8 There is a slight peeling at the intersection of the cuts, and there is no peeling at a glance, and the area of the defect is within 5% of the total square area.

  6 Both sides of the cut and the intersection were peeled off, and the area of the defect was 5 to 15% of the total square area.

  4 The width of peeling due to cuts is wide, and the area of the defect is 15 to 35% of the total square area.

  2 The width of the peeling due to the cut is wider than 4 points, and the area of the defect is 35 to 65% of the total square area.

0 The area of peeling is 65% or more of the total square area.
<Evaluation of finished card bending property>
A 30 mm portion from the end of the card (a part other than the face) was bent 180 ° using a 4 mmφ cylindrical bar as a fulcrum, and the space between the card and the transfer foil was visually evaluated. The card was subjected to bending evaluation with the image recording portion inside.
A: No problem at all in appearance B: Slight cracks in foil, but no floating between foil cards C: Cracks in foil, but floating between foil cards No D: Cracks in the foil and slight lifting between the foil cards E: Cracks in the foil and floating from the card <Evaluation of bendability after storage of finished card>
After aging at 50 ° C. for 3 days and returning to room temperature, a 30 mm portion (a portion other than the face portion) from the end of the card was bent 180 ° using a 4 mmφ cylindrical bar as a fulcrum, and the space between the card and the transfer foil was visually evaluated. The card was subjected to bending evaluation with the image recording portion inside.
A: No problem at all in appearance B: Slight cracks in foil, but no floating between foil cards C: Cracks in foil, but floating between foil cards No D: Cracks in the foil and slight lifting between the foil cards E: Cracks in the foil and floating from the card <Card appearance>
100 cards were prepared, and the prepared cards were observed with a loupe, and the occurrence frequency (%) of cracks on the surface, transfer unevenness, and appearance defect rate of transfer streaks was calculated.

  ADVANTAGE OF THE INVENTION The transfer foil support of this invention can provide ID card and IC card which improved prevention of dust adhesion, transfer foil transfer property (foil cut property), blocking property, and transfer surface appearance.

  In addition, the transfer foil of the present invention has a bending property and a storage property by having an initial breaking elongation at 23 ° C. of the photocured layer of 10 to 90% and a breaking elongation after storage at 50 ° C. for 3 days of 10 to 90%. An ID card and an IC card having improved post-bending property, prevention of dust adhesion, transfer foil transfer property (foil cut property), blocking property, and transfer surface appearance can be provided.

  Further, the transfer foil of the present invention regulates the peeling force between the support and the transfer layer at 30 ° C., so that the bendability, the bendability after storage, the blocking property, the transfer foil transfer property (foil cut property), and the dust adhesion An ID card and an IC card having improved prevention and transfer surface appearance can be provided.

  By transferring the image to a specific image recording medium using the transfer foil support and the transfer foil of the present invention, the card bendability, the bendability after storage of the card, the transfer foil transfer property (foil cut property), and the prevention of card dust adhesion. In addition, it is possible to provide an ID card and an IC card in which the adhesion between the transfer foil and the image recording medium and the transfer surface appearance are improved.

FIG. 2 is a layer configuration diagram of a transfer foil support. It is a block diagram of a transfer foil layer (transfer layer). FIG. 3 is a conceptual diagram in which a transfer foil is brought into contact with a card-type image recording medium by heat compression and peeled off by a peeling roll. It is a figure which shows a transfer failure. It is a figure which shows the peeling force measuring method. It is a figure explaining an average peeling force and an initial peeling force. FIG. 3 is a perspective view of a transfer cartridge. It is a block diagram of a hot stamping device. FIG. 3 is a schematic diagram illustrating measurement of a center line surface roughness (Ra) of an image recording medium. FIG. 3 is a schematic diagram illustrating measurement of a center line surface roughness (Ra) of an image recording medium. It is a card surface schematic diagram of the reference line definition with respect to the unevenness | corrugation of the image recording body surface. It is a card cross section schematic diagram of a reference line definition to the unevenness of the surface of the image recording medium. FIG. 4 is a schematic cross-sectional view of a card having a reference line and an inclined definition with respect to irregularities on the surface of an image recording medium. FIG. 2 is a configuration diagram of the card issuing device 1. FIG. 2 is a configuration diagram of the card issuing device 2. It is a block diagram of an IC card base material preparation apparatus. It is a figure showing a 1st sheet member. It is a figure showing a 2nd sheet member. It is sectional drawing of an IC card. It is a schematic diagram of an IC module. It is a schematic diagram of an IC fixing layer. It is a schematic diagram of an IC fixing layer. It is a front view of a card base material. It is a back view of a card base material. It is a front view of a card. It is a back view of a card.

Explanation of reference numerals

REFERENCE SIGNS LIST 1 support 2 roughened surface 3 antistatic layer 4 roughened surface with antistatic layer

Claims (15)

The transfer characterized in that the numerical value represented by the following general formula 1 satisfies 0.03 to 0.005, and the surface specific resistance at 23 ° C./50% is in the range of 1 × 10 ⁵ to 10 ¹⁴ Ω. Foil support.
General formula 1:
One center line average roughness (Ra) of the transfer foil support “μm” / thickness of the transfer foil support “μm”
However, the thickness of the transfer foil support is 5 to 40 μm. The transfer foil support according to claim 1, further comprising an antistatic layer adjacent to the support. The transfer foil support according to claim 1, wherein at least one surface of the transfer foil support is roughened by any one of sandblasting, hairline processing, mat coating, or chemical etching. body. A transfer foil having a transfer layer including at least a photocurable layer and an adhesive layer laminated on the transfer foil support according to claim 1,
A transfer foil, wherein the photocurable layer has an initial elongation at break at 23 ° C of 10 to 90% and an elongation at break after storage at 50 ° C for 3 days of 10 to 90%. The transfer foil according to claim 4, wherein an average peel force of the transfer foil support and the transfer layer at 30C is 3.5 to 25 g / cm at a peel angle of 90 °. 5. The transfer foil according to claim 4, wherein the initial peel strength at 30 ° C. of the transfer foil support and the transfer layer is 15 to 150 g / cm at a peel angle of 90 °. By transferring the transfer layer of a transfer foil having a transfer layer on a transfer foil support onto a card-type image recording medium, an ID card creating method for creating an ID card,
The transfer foil support has a numerical value represented by the following general formula 1 satisfying 0.03 to 0.005 and a surface specific resistance at 23 ° C./50% of 1 × 10 ⁵ to 10 ¹⁴ Ω. An ID card creation method characterized by the following.
General formula 1:
One center line average roughness (Ra) of the transfer foil support “μm” / thickness of the transfer foil support “μm”
However, the thickness of the transfer foil support is 5 to 40 μm. 8. The ID according to claim 7, wherein a center line average roughness (Ra) on a surface of the card type image recording body on which the transfer layer is transferred is in a range of 0.00 to 0.6 [mu] m. Card making method. On the surface of the card-type image recording body on which the transfer layer is transferred,
A reference line is a line connecting two points at a distance of 10 mm each in the upper and lower directions in parallel with the short side direction of the card type image recording medium from the maximum portion of the concave portion or the convex portion,
The method according to claim 7, wherein a distance between a maximum portion of the concave portion or the convex portion and the reference line is 20 µm or less. On the surface of the card-type image recording body on which the transfer layer is transferred,
A reference line is a line connecting two points at a distance of 10 mm each in the upper and lower directions in parallel with the short side direction of the card type image recording medium from the maximum portion of the concave portion or the convex portion,
8. The method according to claim 7, wherein the maximum value of the inclination of the concave or convex portion with respect to the reference line is 80 ° or less. The card type image recording body,
A first sheet member,
The ID card creation method according to claim 7, wherein the ID card creation method is an electronic component mounting type including a second sheet member, and an electronic component provided between the first sheet member and the second sheet member. The said 1st sheet member is provided with the layer which carries at least identification information, bibliographic information, an authentication identification image, and an attribute information image by sublimation heat transfer, fusion heat transfer, inkjet, and retransfer. Item 14. The ID card creation method according to Item 11. The ID card producing method according to claim 11, wherein a writable layer is provided on the second sheet member. The method according to claim 11, wherein the electronic component stores personal information including at least a face image, an address, a name, and a date of birth. On the surface of the card-type image recording body on which the transfer layer is transferred,
A reference line is a line connecting two points at a distance of 10 mm each in the upper and lower directions in parallel with the short side direction of the card type image recording medium from the maximum portion of the concave portion or the convex portion,
The method according to claim 11, wherein the maximum value of the inclination from the side of the concave portion or the convex portion with respect to the reference line is 80 ° or less.

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