JP2003162697A - Ic card and creation method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card that has a smooth surface, improved printing properties (decrease in concentration and printing omission), and an improved heat resistance property. <P>SOLUTION: In the method for creating an IC card where the IC card is provided in an adhesive layer 3 included between first and second sheet materials 1 and 2, the first and second sheet materials 1 and 2 are bonded by temperature-adjustable laminate roller. The temperature difference between a pair of rollers in the laminate roller is equal to or more than 0°C and equal to or less than 100°C. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a driver's license such as a driver's license, an identification card, a passport, an alien registration card, a library card, a cash card, and an IC module having an IC chip and an antenna. The present invention relates to a method for creating an IC card such as a credit card, an employee ID, an employee ID, a membership ID, a medical card, and a student ID, and an IC card.

[0002]

2. Description of the Related Art Conventionally, ID cards such as ID cards, cash cards, and credit cards are
A magnetic card that records data by a magnetic recording method is often widely used. Since data can be rewritten relatively easily with a magnetic card, it is not possible to prevent tampering with the data, the medium is magnetic and is easily affected by external influences, and the data is not sufficiently protected. There are problems such as few.

Therefore, in recent years, ICs with built-in IC chips
Cards are becoming popular. The IC card is configured to read / write data from / to an external device via an electric contact provided on the surface or a loop antenna inside the card. The IC card has a larger storage capacity than the magnetic card, and the security is greatly improved.

As such an IC card, for example, there is one in which a top sheet material and a back sheet material are bonded together via an adhesive, and an IC module having an IC chip and an antenna is enclosed in the adhesive layer. In particular, a non-contact type IC card that has an IC chip and an antenna for exchanging information with the outside inside the card and has no electric contact outside the card is a contact type IC having an electric contact on the surface of the card. Since it has better security than a card, it is being used for applications that require high confidentiality of data and protection against forgery.

An IC card is manufactured by using an inlet having a circuit board on which an IC chip and an antenna are mounted and two PEs.
It is generally prepared by inserting it between the T bases, adhering it using a moisture curable adhesive, a UV curable adhesive, a two-liquid mixed adhesive, etc., and punching it into a card mold after curing.

Since the IC chip is generally easily damaged,
It is necessary to use a reinforcing plate to protect this. Since the reinforcing plate has the same area as the IC chip or has a thickness larger than that of the IC chip, unevenness occurs on the surface, which causes a problem that the printability of the surface deteriorates. There is known a means of heating a pressing machine to press the card in the thickness direction in order to eliminate surface irregularities and smooth the surface.

[0007]

However, in the case of a card in which a face image or character information is written on the surface of the card, the surface of the PET base is damaged by heat when heated and pressed, and thermal transfer such as sublimation heat transfer and melt heat transfer occurs. There are serious problems such as inability to write by the method or ink jet method, and lack of density.

When the hot press is performed within a range that does not damage the surface of the PET base, the two PETs to be bonded together
Since the adhesive between the bases does not melt due to insufficient heating, the adhesive around the IC chip and the reinforcing plate does not flow and smoothing is difficult.

For example, in the case of bonding at a temperature of 100 ° C. or higher, there are problems that the card substrate is easily warped, and irregularities are easily generated on the surface of the card when it is conveyed by a laminating roll. In addition, when an adhesive with a low melting temperature is used, the storage stability and heat resistance after card formation are poor, and if left inside the car, etc., the adhesive will melt and the card will peel off, which is a serious problem. There was a strong demand for a solution.

The present invention has been made in view of the above circumstances, and provides a method for producing an IC card having a smooth card surface, good printability (decrease in density, printing loss), and good heat resistance, and an IC card. The purpose is to

[0011]

In order to solve the above-mentioned problems and to achieve the object, the present invention has the following constitution.

According to the invention described in claim 1, "I in the adhesive layer interposed between the first sheet material and the second sheet material
In the method of making an IC card having a C module,
A method of making an IC card, characterized in that the first sheet material and the second sheet material are bonded together by using a temperature-adjustable laminating roller. The warp of the IC card is reduced, the surface of the card is smoothed, and the printability (decrease in density, print loss) is good.

According to a second aspect of the present invention, "I in the adhesive layer interposed between the first sheet material and the second sheet material
In the method of making an IC card having a C module,
The temperature difference between the laminating roller and the roller for laminating the first sheet material and the second sheet material is 0 ° C. or more 10
A method for producing an IC card, which is characterized in that the temperature is 0 ° C. or lower. ], The warpage of the IC card is reduced, the surface of the card becomes smooth, and the printability (decrease in density, printing loss)
Is good. Further, even when an adhesive having a low melting temperature is used, the storage stability and heat resistance after forming into a card are improved.

According to a third aspect of the present invention, "a back roller portion having the laminating roller is used for bonding, followed by heating by a heating roller and further heating and pressurization by a caterpillar press portion. The method for producing an IC card according to claim 2. ],
The warp of the IC card is further reduced, the surface of the card is made smoother, and the printability (decrease in density, print loss) is good. Further, even when an adhesive having a low melting temperature is used, the storage stability and heat resistance after forming into a card are improved.

According to a fourth aspect of the invention, "the temperature range of the pair of rollers is 50 to 120 ° C. for one roller and 20 to 80 ° C. for the other roller.
The method for creating the IC card described in. The warpage of the IC card is further reduced, the surface of the card is smoothed, and the printability (decrease in density, print loss) is good. Further, even when an adhesive having a low melting temperature is used, the storage stability and heat resistance after forming into a card are improved.

According to a fifth aspect of the present invention, "A sheet material of either the first sheet material or the second sheet material has an image receiving layer, and the other sheet material has a writing layer. The method for producing an IC card according to claim 4, wherein the temperature of the roller on the side is lower than the temperature of the roller on the writing layer side. ], The surface on the image receiving layer side is prevented from being damaged by heat, and writing by a thermal transfer system such as sublimation thermal transfer or melt thermal transfer or an inkjet system is good.

According to a sixth aspect of the present invention, "The first sheet material is coated with an adhesive and the second sheet material is coated with an adhesive. 6. The IC card according to any one of claims 1 to 5, characterized in that the adhesive layer coated with one sheet material is reheated before being bonded to the second sheet material. Method. ]
And the lack of heating is eliminated when pasting, and IC
The adhesive around the chip, the antenna, and the reinforcing plate flows to smooth the IC card.

According to a seventh aspect of the present invention, "The method for producing an IC card according to the sixth aspect is characterized in that the reheating temperature is about 80 to 120 ° C. By reheating the adhesive layer without damaging the surface of the sheet material due to heat, insufficient heating can be eliminated at the time of bonding, and the IC card can be smoothed.

The invention according to claim 8 is that "the adhesive layer is a hot-melt moisture-curable adhesive, and the IC according to any one of claims 1 to 7.
How to make a card. ], Low temperature adhesion is possible and the surface of the sheet material can be prevented from being damaged by heat.

According to a ninth aspect of the present invention, "The viscosity of the hot melt moisture-curable adhesive at 130 ° C. is 200.
The method for producing an IC card according to claim 8, wherein the method is 0 mPs or more and 40000 mPs or less. ],
Adhesion at low temperature is possible, the surface of the sheet material can be prevented from being damaged by heat, and the storage stability and heat resistance after card formation are improved.

According to a tenth aspect of the invention, "the melting temperature of the hot melt moisture-curable adhesive is 50 ° C. or higher and 70 or higher.
The method for producing an IC card according to claim 8 or 9, wherein the temperature is not higher than ° C. ], Low-temperature adhesion is possible, the surface of the sheet material can be prevented from being damaged by heat, and the storage stability and heat resistance after card formation are improved.

The invention according to claim 11 is characterized in that "at least one caterpillar press portion is used on the same line for bonding.
The method for producing an IC card according to any one of 1. ], And quick and good bonding is possible.

According to a twelfth aspect of the invention, there is provided a method of manufacturing an IC card according to the eleventh aspect, wherein the caterpillar press section has a heating press section and a cooling press section. By performing hot pressing followed by cooling pressing, the storage stability and heat resistance after carding are improved.

The invention as set forth in claim 13 is characterized in that "the bonded product is cut into a sheet before being punched out into a card shape.
The method of making an IC card according to item. ], The positioning and the like becomes simple and accurate, and the punching accuracy of the IC card is improved.

According to a fourteenth aspect of the invention, "formatting printing is performed on one of the first sheet material and the second sheet material before punching into a card shape. Item 14. A method of making an IC card according to any one of items 13. ], And format printing becomes easy.

The invention according to claim 15 is the "opposing 2
In an IC card in which a part including an IC module having an IC chip and an antenna is placed at a predetermined position between two sheet materials, and a resin containing a cured adhesive is filled, a sheet material close to the antenna The ratio of the thickness of the resin and the thickness of the resin between the two sheet materials is 0.01 to
An IC card characterized by being 0.15. It is possible to reduce the thickness of the IC card by defining the ratio with the thickness of the resin.

According to a sixteenth aspect of the invention, in the IC card according to the fifteenth aspect, "the thickness of the resin from the antenna to the sheet material near the antenna is 30 μm or less. It is possible to make the IC card thinner.

The invention as set forth in claim 17 is directed to "opposing 2
In an IC card in which a component including an IC module having an IC chip and an antenna is placed at a predetermined position between two sheet materials and filled with a resin containing a cured adhesive, the IC module is adjacent to the IC chip. The IC module has a mesh-like opening.
The mesh sheet having a two-dimensional mesh structure inserted between the mesh sheets having a three-dimensional mesh structure and having a mesh-like opening on at least one of the upper part and the lower part of the IC chip is removed. IC card to do. It is possible to make the IC card thin and smooth.

The invention according to claim 18 is characterized in that "a mesh sheet having a two-dimensional mesh structure having a mesh-like opening in the upper portion or the peripheral portion of the IC chip is removed. The listed IC card. ], And I
The C card can be made thin and smooth.

According to a nineteenth aspect of the present invention, "Personal identification information including a name and a face image by a thermal transfer system or an inkjet system, which has an image receiving layer on at least one surface of the first sheet material or the second sheet material The IC card according to any one of claims 15 to 18, characterized in that a writable layer is provided on at least a part of the IC card. , Such as driver's licenses, identification cards, passports, alien registration cards, library cards, cash cards, credit cards, employee IDs, employee IDs, membership IDs, medical cards, student IDs, etc. Can be used for

The invention according to claim 20 is characterized in that "a transparent protective layer is provided on the upper surface on which personal identification information including name and face image is provided, and the transparent protective layer is made of an actinic ray curable resin. The IC card according to claim 19. ], Scratches can be prevented and durability is improved.

The invention according to claim 21 is the IC card according to claim 19 or 20, wherein the IC chip is not present at a position overlapping the face image portion. ]
Therefore, smoothing can be performed and the printability of the face image is improved.

The invention as set forth in claim 22 is characterized in that it has a part including an IC module and is of a non-contact type.
C card. ], The storage capacity is large, and the security can be improved.

The invention described in claim 23 is that "the planar irregularity of the peripheral portion of the chip on the surface of the IC card is within ± 10 μm. IC card. ], The printability of the IC card is improved.

[0035]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a method of making an IC card and an IC card of the present invention will be described in detail with reference to the drawings, but the present invention is not limited to this embodiment.

FIG. 1 is a schematic configuration diagram of an IC card producing process.

In the process of making this IC card, the long sheet-shaped first sheet material (back sheet) 1 is provided in the first sheet material supply section A, and the long sheet-shaped second sheet material ( The front sheet) 2 is arranged in the second sheet material supplying section B. An adhesive is supplied from the adhesive supply section C to the second sheet material 2 to apply the adhesive, and the adhesive sheet is heated by the adhesive heating section D and sent to the inlet supply section E.

In the inlet supply section E, an inlet 3 of a component including an IC module having an IC chip and an antenna is supplied, placed on a predetermined position of the second sheet material 2, and the second sheet material 2 is backed up. Send to roller section F.

An adhesive is supplied to the first sheet material 1 from an adhesive supply section G to apply it, and the first sheet material 1 is heated by an adhesive heating section H and sent to a back roller section F.

The back roller portion F has a temperature-adjustable laminating roller 4, and the laminating roller 4 is used to bond the first sheet material 1 and the second sheet material 2 together. The temperature difference between the rollers 4a and 4b of the laminating roller 4 is 0 ° C. or more and 100 ° C. or less. In this embodiment, the second sheet material 2 has an image receiving layer, the first sheet material 1 has a writing layer, and the pair of rollers 4a and 4b have a temperature on the image receiving layer side that is the writing layer side. The temperature is lower than the temperature of the roller.

The heating roller portion I is arranged at the subsequent stage of the back roller portion F, and after being bonded by the back roller portion F, it is heated by the pair of rollers 5a and 5b of the heating roller portion I. Thus, the first sheet material 1 and the second sheet material 2
The adhesive layer coated with the sheet material is reheated before being bonded to and is sent to the caterpillar press section J.

The back roller portion F, the heating roller portion I, and the caterpillar press portion J are arranged on the same line for bonding, and the caterpillar press portion J is provided.
Has a heating press part J1 and a cooling press part J2, and heats and pressurizes and then cools and pressurizes.

After being heated and pressed and cooled and pressed by the caterpillar press section J, the bonded product is sent to the cutting section K. In the cutting section K, the bonded product is cut into a sheet. After that, it is sent to the punching section L and punched into a card shape. Before punching into a card shape at the punching portion L, either one of the first sheet material 1 and the second sheet material 2 is subjected to format printing.

FIG. 2 is a cross-sectional view of an image forming body which is a bonded product of IC cards. IC of bonded product of IC card
The card base material includes an electronic component 3a having a predetermined thickness between a first sheet material 1 and a second sheet material 2. The electronic component 3a includes an antenna 3a1, an IC chip 3a2, etc., and the IC module of the electronic component 3a is provided in the inlet 3. The inlet 3 is arranged between the first sheet material 1 and the second sheet material 2, and the layers are laminated with the adhesive layers 6 and 7 interposed therebetween.

The first sheet material 1 or the second sheet material 2 has an image receiving layer on at least one surface, and personal identification information including a name and a face image by a thermal transfer method or an ink jet method is provided, and at least a part thereof is provided. A writing layer that allows writing is provided.

A transparent protective layer is provided on the upper surface on which personal identification information including name and face image is provided, and the transparent protective layer is made of actinic ray curable resin.

Further, the IC chip does not exist at a position overlapping the face image portion. Further, it has a part including an IC module and is a non-contact type. [Back Roll Temperature Control] The laminating roller of the back roller portion F in the present invention is provided with a temperature adjusting mechanism,
The temperature difference between the top and bottom of this laminating roller is 0 ° C or more and 100
It is preferably at most ° C. Examples of the temperature adjusting mechanism include a method of electrically heating the laminating roller, blowing hot air into the laminating roller, and circulating a temperature-controlled liquid. A method of circulating hot water is simple and preferable. As a preferable temperature range, the laminating roller temperature on the writing layer side is 50 to 120 ° C., and the laminating roller temperature on the image receiving layer side is 20 to 80 ° C. More preferably, the laminating roller temperature on the writing layer side is 50 to 80 ° C, and the laminating roller temperature on the image receiving layer side is 20 to 70 ° C.
More preferably, the temperature of the laminating roller on the writing layer side is 6
0 to 80 ° C, the laminating roller temperature on the image receiving layer side is 50 to
The temperature is 65 ° C., and heat shrinkage occurs outside this range, which causes deterioration of unevenness. [Plurality of Heating Rollers] In the present invention, it is preferable that the heating roller portion I is arranged at the subsequent stage of the back roller portion F and that a plurality of laminating rolls are installed after the laminating roller. It is preferable that these laminating rollers are also temperature-controlled. The laminate gap width of the laminating roller is preferably the same as or narrower than the gap width of the back roller portion F. In addition, the smoothness is improved because the thickness is forced stepwise when there are a plurality of rollers.

A caterpillar press J can be provided after these laminating rollers. The caterpillar press section J may be heated by providing a heating press section J1. When the sheet material cannot be smoothed only by the laminating roller, heating the caterpillar above the melting temperature of the adhesive crushes the irregularities generated on the surfaces of the bonded sheet materials, which is effective for smoothing the card.

The heating press J1 is added to the track press J.
It is preferable that the cooling press section J2 is further provided after that when heating is performed in order to prevent distortion and swelling that occur after pasting the finished sheet materials. Without the cooling press, distortion occurs during transportation, and after the card is formed, the IC chip peripheral portion is bent, and the irregularity of the IC chip peripheral portion deteriorates. When smoothing is possible with only one or a plurality of laminating rolls, the caterpillar press section J may be only the cooling press section J2. [Adhesive Ratio] In the present invention, the ratio of the thickness of the resin from the antenna to the adjacent sheet to the thickness of the resin between the two sheet materials of the image receiving layer side sheet material and the writing layer side sheet material. Is 0.01 to 0.15. It is preferable that the sheet material on the image receiving layer side is closer, that is, the thickness of the resin between the sheet material on the image receiving side and the antenna is thinner than the thickness of the resin between the sheet material on the writing layer side and the antenna.

In the present invention, the thickness of the resin between the sheet material on the image receiving side and the antenna is preferably 30 μm or less, more preferably 20 μm or less. Also,
The ratio of the thickness of the resin between the two sheet materials of the image receiving layer side sheet material and the writing layer side sheet material is preferably between 0.04 and 0.12. [Nonwoven fabric inlet] The mesh sheet used in the present invention is a member having a mesh structure and has a two-dimensional mesh structure. The two-dimensional mesh structure has an opening in the depth direction, and parts other than the opening are connected or integrated to form a sheet structure in the plane direction.

The following materials, for example, can be used if they are suitable for the purpose of the present invention. There are mesh fabrics such as non-woven fabrics, plain weaves, twill weaves, and satin weaves. In addition, moquette, plush velour, seal, velvet, woven fabric having a pile called suede, and the like can be used.

In the present invention, it is preferable that the openings have a regular polygonal shape. The polygonal shape can be created by embossing a plastic sheet and stretching it. Further, a member obtained by punching a plastic sheet can be used. Materials include polyamides such as nylon 6, nylon 66 and nylon 8, polyesters such as polyethylene terephthalate, polyolefins such as polyethylene, polyvinyl alcohols, polyvinylidene chloride,
Synthetic resins such as polyvinyl chloride, polyacrylonitrile, acrylamide, methacrylamide, and other acrylics, polyvinylidene cyanide, polyfluoroethylene, polyurethane, and other synthetic resins; silk, cotton, wool, cellulose, cellulose ester, and other natural fibers , 1 or 2 selected from regenerated fibers (rayon, acetate) and aramid fibers
Examples include fibers that are a combination of two or more species. Among these fiber materials, rayon which is preferably polyamide type such as nylon 6 or nylon 66, acrylic type such as polyacrylonitrile, acrylamide or methacrylic acid, polyester type such as polyethylene terephthalate, cellulose type as regenerated fiber or cellulose ester type is preferable. And acetate and aramid fibers, and it is preferable to include one or more of them from the viewpoint of durability. The thickness of the reinforcing plate is IC
It is sufficient if the thickness is sufficient to protect the chip, but it is preferable to be thin in order to improve the printability by eliminating the planar unevenness of the card when placed on the upper part of the chip. The position of the reinforcing plate is not limited to the position above the IC chip, and may be a shape that covers the IC chip or a structure that surrounds the IC chip. [Adhesive for Making IC Card Base Material] As the bonding material of the present invention, it is preferable to use a hot melt adhesive, a thermoplastic resin, or the like. For example, as the hot melt adhesive, a commonly used adhesive can be used.
Examples of the main component of the hot melt adhesive include ethylene-vinyl acetate copolymer (EVA) type, polyester type,
Examples thereof include polyamide-based, thermoplastic elastomer-based, polyolefin-based, and the like.

However, in the present invention, in the case of laminating with an adhesive from the viewpoint of transportability of the support, transportability of the card base material due to heat shrinkage of the support, warpage, etc.
It is preferable to bond at 0 ° C or lower, and further 10
It is preferably -80 ° C, more preferably 20-80. Among the low-temperature adhesives, specifically, photo-curable adhesives, moisture-curable adhesives, elastic epoxy adhesives and the like are preferable.

A moisture-curable material as a reactive hot melt adhesive is disclosed in JP-A 2000-036026 and 2000.
-2119855, JP 2000-212178, JP 2
000-2119855 and Japanese Patent Application No. 2000-369855. JP-A-10-3 as a photocurable adhesive
No. 16959, JP-A No. 11-5964 and the like are disclosed. As an elastic epoxy adhesive, Japanese Patent Laid-Open No. 10-12
0764, JP-A-2000-229927, JP-A-6-
Any of these adhesives disclosed in Japanese Patent Application No. 87190 and Japanese Patent Application Laid-Open No. 5-295272 can be used, and any material can be used as long as low-temperature adhesion is possible.

The thickness of the adhesive is preferably 100 to 600 μm including the thickness of electronic parts, more preferably 150.
To 500 μm, more preferably 150 to 450 μm. Further, the temperature after curing the adhesive member of the present invention is 25
What is left for 7 days or more under the condition of ℃, humidity 50% RH,
Alternatively, the adhesive is not particularly limited as long as it is cured under the conditions required for curing.

The viscosity at 130 ° C. is 2000 m
If it is smaller than Ps, many bubbles will be generated when the cards are stuck together, and the unevenness of the plane will be deteriorated to 40,000 mPs.
If it is larger than this, the coating property of the adhesive will deteriorate,
Planar unevenness deteriorates. Since problems such as deterioration of the card surface strength after curing and problems such as burrs and beards occur, it is preferably 5000 mPs or more and 30,000 mPs.
s or less, more preferably 10,000 mPs or more and 2
It is 2000 mPs or less.

Further, an adhesive member having the characteristics of the present invention may be prepared by mixing an additive with these adhesives. The additive is not particularly limited, and examples thereof include organic and inorganic pigments and resin materials. As phenol resin, xylene resin,
Examples thereof include epoxy resin, melamine resin, urea resin, polycarbonate and the like. [Electronic Component] The electronic component refers to an information recording member, specifically, an IC chip that electrically stores information of a user of an IC card and a coil-shaped antenna connected to the IC chip. . The IC chip is a memory only or a microcomputer in addition to the memory. In some cases, the electronic component may include a capacitor. The present invention is not limited to this and is not particularly limited as long as it is an electronic component necessary for the information recording member.

Although the IC module has an antenna coil, when it has an antenna pattern, any method such as a conductive paste printing process, a copper foil etching process, or a winding welding process may be used. As the printed circuit board, a thermoplastic film such as polyester is used, and when heat resistance is required, polyimide is advantageous.

A conductive adhesive such as silver paste, copper paste, carbon paste (EN-4000 series of Hitachi Chemical Co., Ltd., XAP series of Toshiba Chemical Co., etc.) or an anisotropic conductive film is used to bond the IC chip and the antenna pattern. A method of using (Anisolum manufactured by Hitachi Chemical Co., Ltd.) or a method of solder bonding is known, but any method may be used. Since the parts including the IC chip are placed in a predetermined position in advance and then the resin is filled, the joint portion is detached by the shearing force due to the flow of the resin, or the surface smoothness is caused by the flow and cooling of the resin. In order to eliminate damage and lack of stability, a resin layer is formed in advance on the substrate sheet and the electronic component is enclosed in the resin layer by forming a porous resin film or a porous foaming resin. It is preferably used in the form of a film, a flexible resin sheet, a porous resin sheet or a non-woven sheet. For example, Japanese Patent Application No. 11-10
The method described in No. 5476 etc. can be used. Further, since the IC chip has weak point pressure strength, it is also preferable to have a reinforcing plate in the vicinity of the IC chip. The total thickness of the electronic component is preferably 10 to 300 μm, more preferably 30 to 300 μm, and further preferably 30 to 250 μm. [Method of Providing Electronic Component Between First Sheet Material and Second Sheet Material] To provide a predetermined electronic component between the first sheet material and the second sheet material of the present invention As a manufacturing method, a heat bonding method, an adhesive bonding method, and an injection molding method are known, but they may be bonded by any method.
In addition, the first sheet material and the second sheet material may be subjected to format printing or information recording either before or after bonding, and offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, It can be formed by any method such as an inkjet method, a sublimation transfer method, an electrophotographic method, and a heat melting method.

A method of manufacturing an IC-mounted card base material according to the present invention is described in JP-A 2000-036026 and 2000-21.
9855, JP 2000-212178 A, JP 2000 A
-2119855, JP-A-10-316959, JP-A-11-5964 and the like, a method of laminating and coating is disclosed. Any bonding method, coating method or the like can be used, and the present invention is not particularly limited.
Also, as a method of placing the adhesive at a specific position,
It can be manufactured by applying an adhesive at a predetermined position by a screen printing method, a gravure printing method, or the like. When using a hot melt adhesive, use a hand gun type hot melt applicator.
It is also possible to apply the adhesive in a bead shape from the nozzle so as to apply the adhesive to each arrangement. Alternatively, the adhesive processed into a film shape may be cut so as to be installed in a predetermined arrangement, and after being installed in each arrangement, heat and pressure treatment may be performed to bond them together. [Sheet material for IC card base material] First sheet material and second sheet material
Examples of the IC card base material of the sheet material include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyethylene, polypropylene,
Polyolefin resins such as polymethylpentene, polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene, ethylene-4 fluoroethylene copolymer, and other polyfluorinated ethylene resins, polyamides such as nylon 6 and nylon 6.6 , Polyvinyl chloride, vinyl chloride / vinyl acetate copolymer, ethylene / vinyl acetate copolymer, ethylene /
Vinyl alcohol copolymer, polyvinyl alcohol, vinyl polymers such as vinylon, biodegradable aliphatic polyester, biodegradable polycarbonate, biodegradable polylactic acid,
Biodegradable polyvinyl alcohol, biodegradable cellulose acetate, biodegradable resins such as biodegradable polycaprolactone, cellulose triacetate, cellulosic resins such as cellophane, methyl polymethacrylate, ethyl polymethacrylate, polyacrylic acid Ethyl, polybutyl acrylate,
Acrylic resin such as, polystyrene, polycarbonate, polyarylate, synthetic resin sheet such as polyimide,
Alternatively, there may be mentioned high-quality paper, thin paper, glassine paper, paper such as sulfuric acid paper, a single layer of metal foil, or a laminate of two or more layers thereof.

The thickness of the support of the present invention is 30 to 300 μm.
m, preferably 50 to 200 μm. In the present invention, in view of card substrate transportability due to heat contraction and warpage of the support, the heat shrinkage at 150 ° C./30 min as a sheet member is 1.2% or less in the longitudinal direction (MD) in addition to the low temperature adhesive. , Horizontal (TD) is preferably 0.5% or less.
In addition, an easy contact treatment may be performed on the support to improve adhesion in post-processing, and an antistatic treatment may be performed to protect the chip.

Specifically, U2 series, U4 series, UL series manufactured by Teijin DuPont Films Ltd., Crisper G series manufactured by Toyobo Co., Ltd., E00 series, E20 series, E22 series, X20 series manufactured by Toray Industries, Inc., E40 series, E60 series and QE series can be preferably used.

The second sheet material of the present invention may be provided with a cushion layer in addition to the image receiving layer for forming the face image of the card user. An image element is provided on the surface of the personal authentication card base, and an authentication identification image such as a face image, an attribute information image,
It may be provided with at least one selected from format printing, or may be a white card having no printed portion at all. [Lamination] The present invention, when laminating, heats and pressurizes the surface of the sheet base material to increase the surface smoothness and the adhesion of a predetermined electronic component between the first sheet material and the second sheet material. It is preferable to carry out the above, and it is preferable to manufacture by a vertical pressing method, a laminating method or the like. Heating is 10-1
80 ° C. is preferable, and 30 to 150 is more preferable. The applied pressure is preferably 1.0 to 300 kgf / cm ² , and more preferably 1.0 to 200 kgf / cm ² . If the pressure is higher than this, the IC chip will be damaged. The heating and pressurizing time is preferably 0.001 to 90 sec, more preferably 0.001 to 60 sec. If the time is longer than this, the manufacturing efficiency is reduced.

For a moisture-curing type adhesive whose reaction rate is lowered by the influence of moisture or the like, that is, the adhesive strength and the durability of the card are deteriorated. Therefore, the bonding should be performed under vacuum or under nitrogen. Is more effective.
In the bonding or coating process, the substrate member, the electronic component holder and the surface member are bonded together under a predetermined pressurizing and heating condition, so that the electronic component holder itself is used as an adhesive. The member for the sheet substrate, the electronic component holder thereof, and the substrate for the surface can be bonded with good reproducibility.

A sheet for an IC card in which the first sheet material and the second sheet material are bonded together via an adhesive agent, and the adhesive agent layer has an IC module having an IC chip and an antenna is provided under predetermined conditions. IC after being stored in
An IC card is manufactured by supplying a card sheet to a punching die and punching the IC card from the IC card sheet with the punching die. In this case, the authentication identification image and the bibliographic items may be recorded before the punching process. [Photocurable Resin Layer] The photocurable resin layer is made of a material having an addition polymerization property or a ring-opening polymerization property, and the addition polysynthetic compound is a radically polymerizable compound, for example, JP-A-7-159983. , Japanese Patent Publication No. 7-31399, Japanese Patent Application No. 7-231444, and Japanese Patent Application No. 7-231.
It may be a photocurable material using the photopolymerization (including thermal polymerization) composition described in Japanese Patent No. 444. As the polyaddition compound, a cationic polymerization type photocurable material is known, and recently, a cationic photopolymerization type photocurable material sensitized to a long wavelength region of visible light or longer is also disclosed in, for example, Japanese Patent Laid-Open No.
-43633 publication etc. A hybrid polymerization type photocurable material is disclosed in JP-A-4-181944.
The composition is disclosed in the publication. Specifically, it is a photocurable layer containing any of the above-mentioned cationic initiator, cationically polymerizable compound, radical initiator, and radically polymerizable compound, and any photocurable layer is used for the purpose of the present invention. I don't mind. [Thermosetting Resin Layer] In the present invention, as the thermosetting resin composition, for example, an epoxy-based resin, a polyester-based resin, an acrylic resin, or the like is mixed with a curing agent, a curing catalyst, a leveling agent, and other additives. May be. As the composition of the polyester resin, those mainly containing an aromatic dicarboxylic acid such as terephthalic acid or isophthalic acid as a dicarboxylic acid component and mainly containing an aliphatic diol such as ethylene glycol or neopentyl glycol as a diol component are preferable. Aliphatic dicarboxylic acids such as adipic acid and azelaic acid, trivalent or higher carboxylic acids such as trimellitic acid and pyromellitic acid, trimethylolethane, trimethylolpropane,
Those containing a small amount of trihydric or higher alcohol such as pentaerythritol are more preferable because the melt fluidity and the crosslinking reactivity are improved. The average degree of polymerization of the polyester resin is preferably in the range of 5 to 50. If it is lower than this, sufficient strength cannot be obtained when it is made into a film, and if it is higher than this, crushing becomes difficult. Next, as the curing agent,
When the terminal group of the polyester is -OH type, there are an isocyanate compound and a melamine resin such as ε-caprolactam block isocyanate and methylated melamine. Examples of the -COOH type terminal group include epoxy resin and triglycidyl isocyanurate. [Method for Producing Heat- or Photo-curable Resin Layer] When the heat- or photo-curable resin layer is produced on the image recording body, it is preferably produced by a coating method or by a transfer foil. When coating is selected as a method of protecting the image recording medium, conventionally known methods such as spin coating, wire bar coating, dip coating, felt coating, air knife coating, spray coating, air spray coating, electrostatic air spray coating. Methods such as roll coating, blade coating, and curtain coating are used. At this time, the coating amount varies depending on the application, but for example, a coating amount of 0.05 to 50.0 g / m ² as a solid content is preferable. Although the apparent sensitivity increases as the coating amount decreases, the film characteristics and chemical resistance of the image forming layer decrease. As a method of curing after coating, any method that generates an active electromagnetic wave can be used. Examples thereof include lasers, light emitting diodes, xenon flash lamps, halogen lamps, carbon arc lamps, metal halide lamps, tungsten lamps, mercury lamps and electrodeless light sources. Preferably, a xenon lamp, a halogen lamp, a carbon arc lamp, a metal halide lamp,
Examples of the light source include a tungsten lamp and a mercury lamp, and the energy applied at this time depends on the type of polymerization initiator.
By adjusting the exposure distance, time, and intensity, it can be selected and used as appropriate. [Active curing line] When a laser is used as a light source,
It is easy to reduce the exposure area to a very small size, and high-resolution image formation is possible. As a laser light source, any of an argon laser, a He-Ne gas laser, a YAG laser, a semiconductor laser and the like can be preferably used. When photocuring is performed using actinic rays, a means for stabilizing the photocuring in a nitrogen stream under reduced pressure may be used. [Heat treatment] Heat energy can be applied, and as the means, an oven, a heat roller, a hot stamp, a thermal head, a laser beam, an infrared flash, a hot pen, etc. can be selected and used as appropriate. The protection of the heat- or photo-curable resin layer of the present invention is a heat-resistant support, for example, a transparent protective layer ribbon or transparent protective foil formed by coating on a polyethylene terephthalate resin film is prepared in advance. Can be formed by thermal transfer using, for example, a thermal head or a thermal transfer roll.

Next, the transfer foil material used in the present invention will be described in detail.

The transfer foil of the present invention preferably comprises a support having a release layer and a transparent resin layer, more preferably a release layer, a transparent resin layer, an intermediate layer, a barrier layer, a primer layer and an adhesive layer. It is preferably composed of at least one layer. In the case of the present invention, the IC chip can prevent forgery or the like, but an optical change element layer can be provided for the purpose of visual discrimination. [Support for Transfer Foil] Examples of the support include polyester resins such as polyethylene terephthalate, polybutylene terephthalate and polyethylene terephthalate / isophthalate copolymers, polyolefin resins such as polyethylene, polypropylene and polymethylpentene, polyvinyl fluoride, polyvinyl fluoride. Poly (vinyl fluoride), poly (tetrafluoroethylene), ethylene / tetrafluoroethylene copolymer, etc., polyfluorinated ethylene resin, polyamide such as nylon 6, nylon 6.6, polyvinyl chloride, vinyl chloride / vinyl acetate copolymer , Ethylene / vinyl acetate copolymer, ethylene /
Vinyl alcohol copolymer, polyvinyl alcohol, vinyl polymer such as vinylon, cellulose triacetate, cellulosic resin such as cellophane, methyl polymethacrylate,
Acrylic resins such as ethyl polymethacrylate, ethyl polyacrylate, butyl polyacrylate, etc., polystyrene, polycarbonate, polyarylate, synthetic resin sheets such as polyimide, or fine paper, thin paper, glassine paper,
Examples include paper such as sulfuric acid paper and the like, single-layered bodies such as metal foils, and laminated bodies of two or more layers thereof.

The support of the present invention has a thickness of 10 to 200 μm.
m, preferably 15 to 80 μm. If it is 10 μm or less, the support is broken during transfer, which is a problem. Polyethylene terephthalate is preferred in the specific release layer of the present invention. The support of the present invention may have irregularities if necessary. Examples of means for forming irregularities include kneading with a matting agent, sandblasting, hairline processing, matte coating, or chemical etching. In the case of matte coating, either an organic substance or an inorganic substance may be used. For example, as the inorganic substance, silica described in Swiss Patent No. 330,158, glass powder described in French Patent No. 1,296,995, and alkali described in British Patent No. 1,173,181, etc. An earth metal or a carbonate such as cadmium or zinc can be used as a matting agent.

As the organic substance, US Pat.
037, etc., Belgian Patent No. 625,45
1, starch derivatives described in British Patent No. 981,198 and the like, polyvinyl alcohol described in Japanese Patent Publication No. 44-3643 and the like, polystyrene or polymethacrylate described in Swiss Patent No. 330,158, US patents. Organic matting agents such as polyacrylonitrile described in US Pat. No. 3,079,257 and polycarbonate described in US Pat. No. 3,022,169 can be used. The method for attaching the matting agent may be a method in which the matting agent is dispersed in the coating solution in advance and then applied, or after applying the coating solution,
A method of spraying the matting agent before the completion of drying may be used. When adding a plurality of types of matting agents, both methods may be used in combination. In the present invention, when unevenness processing is performed, it can be applied to one or more of the transfer surface and the back surface. [Transfer foil release layer] As the release layer, a resin having a high glass transition temperature such as an acrylic resin, a polyvinyl acetal resin, a poly (vinyl butyral) resin, waxes, silicone oils, a fluorine compound, a polyvinylpyrrolidone resin having water solubility , Polyvinyl alcohol resin, Si modified polyvinyl alcohol, methyl cellulose resin, hydroxy cellulose resin, silicone resin, paraffin wax, acrylic modified silicone, polyethylene wax,
Resins such as ethylene vinyl acetate can be mentioned. In addition, polydimethylsiloxane and its modified products such as polyester modified silicone, acrylic modified silicone, urethane modified silicone, alkyd modified silicone, amino modified silicone, epoxy modified silicone, polyether modified silicone, etc. Oils and resins, or cured products thereof.

Examples of other fluorine compounds include fluorinated olefins and perfluorophosphate ester compounds. Preferred olefin compounds include dispersions of polyethylene, polypropylene, etc., long-chain alkyl compounds such as polyethyleneimine octadecyl, etc. Of these release agents, those having poor solubility can be used by dispersing them. When transferring two transfer foils, a thermoplastic elastomer may be added. Specific examples of the thermoplastic elastomer include styrene (styrene block copolymer (SBC)), olefin (TP), urethane (TPU), polyester (TPEE), polyamide (TPAE), and 1,2-polybutadiene. ,
PVC-based (TPVC), fluorine-based, ionomer resin, chlorinated polyethylene, silicone-based and the like are mentioned, and specifically, they are described in the 1996 edition "Chemical products of 12996" (Chemical Industry Daily).

The thermoplastic elastomer having a tensile elongation of 100% or more, which is preferably used in the present invention and comprises a block polymer of polystyrene and a polyolefin, comprises styrene and a linear or branched saturated alkyl block having 10 or less carbon atoms. It refers to a thermoplastic resin (hereinafter also referred to as a thermoplastic resin S1). In particular, styrene-butadiene-styrene (SBS), styrene-isoprene-styrene (SIS), styrene- which are block polymers having a polystyrene phase and a polyolefin hydrogenated phase.
Examples thereof include ethylene / butylene-styrene (SEBS), styrene-ethylene / propylene-styrene (SEPS), and styrene-ethylene / propylene (SEP) block polymers.

If desired, a thermosetting resin layer may be used between the release layer of the present invention and the resin layer or the actinic ray curable layer. Specifically, polyester resin, acrylic resin, epoxy resin, xylene resin, guanamine resin, diallyl phthalate resin, phenol resin, polyimide resin, maleic acid resin, melamine resin, urea resin,
Examples thereof include polyamide resin and urethane resin.

The transparent resin layer of the transfer foil is made of polyvinyl butyral resin, polyurethane resin, polyamide resin, polyester resin, epoxy resin, novolac resin, styrene, paramethylstyrene, vinyl methacrylate such as methacrylic acid ester, acrylic acid ester or the like. Any other high-molecular polymer such as cellulose-based, thermoplastic polyester, and natural resin may be used in combination. Also, in addition, Kiyoshi Akamatsu supervised, "Practical technology of new photosensitive resin", (CMC, 1987)
Year) or “10188 chemical products” pp. 657-767 (Kagaku Kogyo Nippo Co., Ltd., 1988).

In the present invention, it is preferable to provide a photo or thermosetting layer with a transfer foil for the purpose of protecting the IC card. The light or / thermosetting layer is not particularly limited as long as it is a material composed of the composition described above. The thickness of the transparent resin layer is preferably 0.3 to 50 μm, more preferably 0.3 to 30 μm, and particularly preferably 0.3 to 20 μm.

The intermediate layer of the transfer foil is preferably composed of one or more intermediate layers. In some cases, a primer layer and a barrier layer may be interposed to further improve the adhesion between the layers. For example, vinyl chloride resin, polyester resin, acrylic resin, polyvinyl acetal resin, polyvinyl butyral resin, polyvinyl alcohol, polycarbonate, cellulose resin, styrene resin, urethane resin, amide resin, urea resin,
Epoxy resin, phenoxy resin, polycaprolactone resin, polyacrylonitrile resin, SEBS resin, SEP
S resin and modified products thereof can be used.

Among the above resins, preferred for the purpose of the present invention are vinyl chloride resins, polyester resins,
These are acrylic resins, polyvinyl butyral resins, styrene resins, epoxy resins, urethane resins, urethane acrylate resins, SEBS resins, and SEPS resins.
These resins may be used alone or in combination of two or more. As a specific compound, a thermoplastic resin composed of a block polymer of polystyrene and polyolefin, polyvinyl butyral and the like are preferable.

The intermediate layer of the present invention has a degree of polymerization of 10
As the polyvinyl butyral resin of 00 or more, S-REC BH-3, BX-1, BX- manufactured by Sekisui Chemical Co., Ltd.
2, BX-5, BX-55, BH-S, Denka Butyral # 4000-2, # 500 manufactured by Denki Kagaku Kogyo Co., Ltd.
0-A, # 6000-EP and the like are commercially available. The thermosetting resin of polybutyral of the intermediate layer is not limited to the degree of polymerization before thermosetting and may be a resin having a low degree of polymerization, and an isocyanate curing agent or an epoxy curing agent can be used for thermosetting, and the thermosetting conditions Is preferably 50 to 90 ° C. for 1 to 24 hours. The thickness of the intermediate layer is preferably 0.1 to 1.0 μm.

As the heat-adhesive resin, as the adhesive layer of the transfer foil, as the heat-adhesive resin, ethylene vinyl acetate resin, ethyne ethyl acrylate resin, ethylene acrylic acid resin, ionomer resin, polybutadiene resin, acrylic resin, polystyrene Resin, polyester resin, olefin resin, urethane resin, tackifier (eg phenol resin, rosin resin, terpene resin, petroleum resin, etc.)
And the like, and copolymers or mixtures thereof may be used. Specifically, the urethane-modified ethylene ethyl acrylate copolymer is Hitech S- manufactured by Toho Chemical Industry Co., Ltd.
6254, S-6254B, S-3129 and the like are commercially available, and as the polyacrylic acid ester copolymer, Jurimer AT-210, AT-510, A manufactured by Nippon Pure Chemical Industries, Ltd.
T-613, Plus size L- manufactured by Mutual Chemical Co., Ltd.
201, SR-102, SR-103, J-4 and the like are commercially available. The weight ratio of the urethane-modified ethylene ethyl acrylate copolymer and the polyacrylic acid ester copolymer is preferably 9: 1 to 2: 8, and the thickness of the adhesive layer is 0.1 to 10.
1.0 μm is preferable. In some cases, an optical change element layer transfer layer may be provided for the purpose of preventing forgery / alteration.

Optical Change Element (Optical Vari)
Able Device (OVD) is 1) a two-dimensional CG image of a diffraction grating such as a kinegram, and is characterized in that the image of a line image structure freely moves and changes such as movement, rotation, expansion and reduction. 2) Pixelgram, which has the characteristic that the image changes to positive and negative, 3) OSD (Optical Security)
A device whose color changes from gold to green (4) LEAD (Long Lasting Econ)
What looks like a change in the image, such as an optical anti-optical device 5) Strive OV
D, 6) Metal foil, etc.
(Year) Volume 35, No. 6, P482 to P496, paper materials, special printing techniques, special ink, etc. may be used to maintain security.

Holograms are particularly preferred in the present invention. Holograms used in the present invention include relief holograms, Fresnel holograms, Fraunhofer holograms, lensless Fourier transform holograms, laser holograms such as image holograms, white holograms such as Lippmann holograms and rainbow holograms, color holograms, computer holograms, and hologram displays. , Multi-flex hologram,
A hologram flick stereogram, a holographic diffraction grating, etc. can be arbitrarily adopted.

The optical change element layer can be formed, for example, by adhering a hologram sheet on the image receiving layer. A relief type hologram sheet can be used as the hologram sheet. The relief type hologram sheet is formed by laminating a hologram forming layer and a hologram effect layer in this order on a support film. Specifically, a hologram sheet is a resin layer that is solid at room temperature and has thermoformability on the surface of a support film such as a polyethylene terephthalate film, for example, a thermoplastic electron that is solid at room temperature. A line-curable resin layer (hologram forming layer) is formed, and a hologram master plate on which a hologram interference pattern is formed in a concavo-convex shape is pressed and compressed, and the concavo-convex shape is transferred to a resin surface and cured, Further, a thin hologram effect layer made of a material (for example, a vapor-deposited film of TiO2, SiO2, ZnS) that has sufficient transparency and a large reflectivity at a certain angle on the uneven surface and has a refractive index different from that of the hologram forming layer is formed. It can be obtained by forming. A hologram whose image is reproduced by white light such as daylight or illumination light is also excellent in decorativeness because the hologram image can be observed even in a normal state. On the other hand, the type in which an image is reproduced by laser light is excellent in tampering detectability.

Further, according to the present invention, a bead-holding layer can be provided, and the bead-holding layer having the beads according to the present invention is recombined by imparting a phase difference to a part of human incident light,
It has a reflective substrate and transparent beads arranged on the substrate to enhance light components in a specific wavelength region by interference and to return colored light having a color tone different from that of the incident light in the incident light entering direction. The bead-holding layer having beads is formed by disposing a resin layer on a reflective substrate, and further arranging a large number of beads having a bead diameter of 10 to 60 μm, preferably 15 to 40 μm, which are made of glass or the like, on the surface side thereof. The optical refractive index of is 1.
6-2.1 are preferable and 1.7-2.0 are more preferable. The incident light entering from the outside travels into the beads, at least a part of which is reflected from the transparent beads through the resin layer to the reflective substrate, returns to the beads again, and travels to the outside. Since the surface of the beads protruding outward is a spherical surface,
Even if there is a slight change in the angle of incidence of the person, the same effect is produced, and the reflected light can be returned in the incident direction.

Next, in the present invention, a reflective layer can be provided, and the reflective layer of the present invention can be used as a reflective layer.
It is selected from at least a metal thin film, a metal oxide thin film, a light interference material and a light diffraction layer. The reflective layer is preferably provided by printing a paint containing a powder capable of expressing an interference color such as an interfering substance, a metal oxide, or mica in an arbitrary pattern.

Examples of metal oxides include titanium dioxide, iron oxide, low-order titanium oxide, zirconium oxide, silicon oxide, aluminum oxide, cobalt oxide, nickel oxide, cobalt titanate, and Li2CoTi3O8 or K.
Examples thereof include composite oxides such as NiTiOx, and mixtures of these metal oxides, but the metal oxides are not particularly limited as long as they are metal oxides capable of exhibiting an interference color. As the interference material layer, a metal film having an interference color obtained by oxidizing the surface of the metal film can be used. These metal films include a method of anodizing metal aluminum, metal titanium, a stainless steel film, etc., or a method of preparing a metal oxide capable of expressing an interference color by a sol-gel method and coating it or a metal capable of expressing an interference color. A method of applying an alkoxide to a metal film and thermally decomposing it, a vapor deposition operation method such as CVD or PVD, and the like can be used. [Method of Applying Transfer Foil on IC Card] Transfer of the transfer foil to the material to be transferred is usually performed by using a hand means such as a thermal head, a heat roller, or a hot stamping machine that can apply pressure while heating. [Image Receiving Layer Receiving Sublimation or Thermal Diffusion Dye Image by Thermal Transfer Recording Method] The image receiving layer of the second sheet material can be formed by a binder and various additives. The image-receiving layer in the present invention forms a gradation information containing image by a sublimation type thermal transfer system, and also forms a character information containing image by a sublimation type thermal transfer system or a fusion type thermal transfer system.
The dyeability of the sublimable dye, or the dyeability of the sublimable dye and the adhesiveness of the hot-melt ink should be good.
In order to impart such special properties to the image-receiving layer, it is necessary to appropriately adjust the types of binders and various additives and their compounding amounts, as described later.

The components forming the image receiving layer will be described in detail below.

As the binder for the image receiving layer in the present invention, a generally known binder for sublimation type thermal transfer recording image receiving layer can be appropriately used. Main binders are vinyl chloride resins, polyester resins,
Various binders such as polycarbonate resin, acrylic resin, polystyrene resin, polyvinyl acetal resin, polyvinyl butyral resin can be used.

However, if there is a practical requirement for the image formed by the present invention (for example, the issued ID card is required to have a predetermined heat resistance), the requirement should be met. It is necessary to consider the type or combination of binders. Taking heat resistance of an image as an example, if heat resistance of 60 ° C. or higher is required, Tg should be taken into consideration in consideration of bleeding of a sublimable dye.
It is preferable to use a binder having a temperature of 60 ° C. or higher.

When forming the image receiving layer, it may be preferable to contain, for example, a compound containing a metal ion, if necessary. Especially when the heat transfer compound reacts with the metal ion-containing compound to form a chelate.

Examples of the metal ions constituting the metal ion-containing compound include divalent and polyvalent metals belonging to Groups I to VIII of the Periodic Table, among which Al, Co, Cr, Cu, Fe, Mg, Mn, Mo, N
i, Sn, Ti, Zn, etc. are preferable, and particularly Ni, Cu,
Co, Cr, Zn and the like are preferable. The compound containing these metal ions is preferably an inorganic or organic salt of the metal and a complex of the metal. To give a specific example, N
A complex represented by the following general formula containing i2 ⁺ , Cu2 ⁺ , Co2 ⁺ , Cr2 ⁺ and Zn2 ⁺ is preferably used. [M (Q1) k (Q2) m (Q3) n] p + p (L
-) However, in the formula, M represents a metal ion, and Q1, Q2,
Q3 represents a coordination compound capable of coordinatively bonding with a metal ion represented by M, and these coordination compounds are selected from coordination compounds described in, for example, “Chelate Chemistry (5) (Nankodo)”. can do. Particularly preferably,
Coordination compounds having at least one amino group that forms a coordinate bond with a metal can be mentioned, and more specifically, ethylenediamine and its derivatives, glycinamide and its derivatives, picolinamide and its derivatives can be mentioned.

L is a counter anion capable of forming a complex,
Examples thereof include inorganic compound anions such as Cr, SO4, and ClO4, and organic compound anions such as benzenesulfonic acid derivatives and alkylsulfonic acid derivatives. Particularly preferred are tetraphenylboron anion and its derivatives, and alkylbenzenesulfonic acid anion and its derivatives. is there. k represents an integer of 1, 2 or 3, m represents 1, 2 or 0, and n represents 1 or 0, which is a tetradentate or hexadentate complex represented by the above general formula. It is determined by coordination or by the number of ligands of Q1, Q2 and Q3. p represents 1, 2 or 3.

Examples of this type of metal ion-containing compound include
Mention may be made of those exemplified in US Pat. No. 4,987,049. When the above-mentioned metal ion-containing compound is added, the addition amount is 0.5 to
Preferably ^{20g / m 2, 1~15g / m} 2 is more preferable.

Further, it is preferable to add a releasing agent to the image receiving layer. As the effective release agent, those which are compatible with the binder used are preferable, and specifically, modified silicone oil and modified silicone polymer are typical,
Examples thereof include amino-modified silicone oil, epoxy-modified silicone oil, polyester-modified silicone oil, acrylic-modified silicone resin, urethane-modified silicone resin and the like. Among them, polyester-modified silicone oil prevents fusion with the ink sheet,
It is particularly excellent in that it does not hinder the secondary workability of the image receiving layer. The secondary processability of the image receiving layer refers to the writing property with a magic ink, the laminating property which becomes a problem when protecting the formed image, and the like. In addition, fine particles such as silica are also effective as the release agent. When the secondary workability is not a problem, it is effective to use a curable silicone compound as a measure for preventing fusion.
Ultraviolet ray curable silicone, reaction curable silicone and the like are available, and a great releasing effect can be expected.

The image-receiving layer according to the present invention is prepared by dispersing or dissolving the forming components in a solvent to prepare a coating solution for the image-receiving layer, coating the coating solution for the image-receiving layer on the surface of the support, and then drying. It can be manufactured by the coating method. The thickness of the image receiving layer formed on the surface of the support is generally from 1 to 5
It is 0 μm, preferably about 2 to 10 μm.

In the present invention, a cushion layer or a barrier layer may be provided between the support and the image receiving layer. When the cushion layer is provided, noise can be reduced and an image corresponding to image information can be transferred and recorded with good reproducibility. Examples of the material forming the cushion layer include urethane resin, acrylic resin, ethylene resin, polypropylene resin, butadiene rubber, epoxy resin, and photocurable resin described in Japanese Patent Application No. 2001-16934. The thickness of the cushion layer is usually 1 to 50 μm, preferably 3 to 30 μm.

In the image-receiving layer of the present invention, the distance relationship between the image-receiving layer and the IC card base material manufacturing device transporting member preferably satisfies the following expression 1. The distance relational expression −1 between the image receiving layer and the conveying member included in the second sheet material is the distance between the image receiving layer and the conveying member / thickness of the second sheet material or the first sheet material = 0 to 0.3
Is more preferable. When it is 0.3 or more, the role of the image receiving layer is lowered and the performance such as printability is deteriorated, which is a problem.

In the present invention, an information carrier layer formed by format printing can be provided on the image receiving layer.
The information carrier consisting of format printing represents an information carrier provided with at least one selected from a plurality of records of identification information and book information. Specifically, ruled lines, company name, card name, notes , Issuer telephone number, etc.
For the formation of information carrier consisting of format printing, please refer to "Lithographic printing technology", "Introduction to new printing technology", "Offset printing technology", "Plate making / printing quick guide" published by Japan Printing Technology Association. It can be formed using the general inks described, photocurable ink, oil-soluble ink,
It is formed by ink such as carbon in solvent type ink. Further, in some cases, watermark printing, hologram, fine print, etc. may be adopted for visual prevention of forgery, and as the forgery / alteration preventing layer, printed matter, hologram, bar code,
Matte pattern, fine pattern, tint block, uneven pattern, etc., timely selection, visible light absorption color material, ultraviolet light absorption material, infrared absorption material, fluorescent whitening material, metal deposition layer, glass deposition layer, bead layer, optical change element It is also possible to form a layer, a pearl ink layer, an adjacent pigment layer, an antistatic layer, etc. on the surface sheet by printing or the like.

As the material for forming the cushion layer of the present invention, the photocurable resin described in Japanese Patent Application No. 2001-1693,
Polyolefins are preferred. For example, polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, styrene-butadiene-
Styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butadiene-styrene block copolymer, styrene-hydrogenated isoprene-styrene block copolymer, having flexibility such as polybutadiene, Those with low thermal conductivity are suitable. [Cushion Layer] As a material for forming the cushion layer of the present invention, polyolefin is preferable. For example, polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, styrene-
Butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butadiene-styrene block copolymer, styrene-hydrogenated isoprene-styrene block copolymer,
It has flexibility like polybutadiene and photocurable resin layer,
Those with low thermal conductivity are suitable. Specifically, Japanese Patent Application 200
A cushion layer such as 1-193634 can be used. The cushion layer referred to in the present invention is not particularly limited as long as it has a cushion layer between the image receiving layer and the electronic component, but the second sheet material or the second sheet material of another support having substantially the same quality as the sheet substrate. It is particularly preferable that the first and second sheet materials are formed by coating or laminating on both surfaces. [Writing Layer] The writing layer is a layer that allows writing on the back surface of the ID card. As such a writing layer, for example, an inorganic fine powder such as calcium carbonate, talc, diatomaceous earth, titanium oxide or barium sulfate may be contained in a film of a thermoplastic resin (polyolefin such as polyethylene or various copolymers). Can be formed. It can be formed by the "writing layer" described in JP-A-1-205155. The writing layer is formed on the first sheet material in which a plurality of layers are not laminated in the support. [Low-Temperature Adhesive] As the hot-melt adhesive used in the IC card of the present invention, those generally used can be used. As the main component of hot melt adhesive,
Examples thereof include ethylene / vinyl acetate copolymer (EVA) type, polyester type, polyamide type, thermoplastic elastomer type, polyolefin type and the like. However, in the present invention, the card substrate is easily warped, and the layer is damaged when the card surface is provided with a layer that is weak against high temperature processing such as an image receiving layer for image formation by thermal transfer. Alternatively, it is preferable to bond at a temperature of 80 ° C. or lower when bonding via an adhesive from the viewpoint that the size and the positional accuracy at the time of bonding deteriorate due to heat shrinkage of the sheet base material due to bonding at high temperature. It is preferably 10 to 80 ° C., and more preferably 20 to 80 ° C. Among the low-temperature adhesives, specifically reactive hot-melt adhesives are preferable.

In particular, it is preferable that the hot-melt moisture-curable adhesive has a melting temperature of 50 ° C. or higher and 70 ° C. or lower, which enables low-temperature adhesion and prevents the surface of the sheet material from being damaged by heat. The storage stability and heat resistance after conversion are improved.

A moisture-curable material as a reactive hot melt adhesive is disclosed in JP-A 2000-036026 and 2000.
-2119855, JP 2000-212178, JP 2
000-2119855 and Japanese Patent Application No. 2000-369855. JP-A-10-3 as a photocurable adhesive
No. 16959, JP-A No. 11-5964 and the like are disclosed. Any of these adhesives may be used, and it is preferable to use a material that does not limit the present invention. The film thickness of the adhesive is preferably 10 to 600 μm, more preferably 10 to 500 μm, and further preferably 10 μ to 450 μm, including the thickness of the electronic component. [IC Card Making Method] Here, an example of a method for making an IC card of the present invention using a hot melt adhesive will be described. In producing an IC card, first, a hot melt adhesive is applied to the front and back sheets with an applicator to a predetermined thickness. As a coating method, a usual method such as a roller method, a T-die method, or a die method is used. In the case of coating in a stripe shape in the present invention, there is a method of intermittently providing an opening portion for the T die slit, but the method is not limited to this. Further, as a method of making the adhesive surface of the present invention uneven, there is a method of subjecting the adhesive surface coated by the above method to pressure treatment with an embossing roll.
An IC member is mounted between the upper and lower sheets coated with the adhesive. The adhesive applied may be preheated with a heater or the like before mounting. Then I between the upper and lower sheets
The member with the C member attached may be pressed for a predetermined time with a press heated to the bonding temperature of the adhesive, or may be rolled with a roll while conveying the sheet in a constant temperature layer at a predetermined temperature instead of rolling with the press. Good. Further, vacuum pressing may be performed in order to prevent bubbles from entering during bonding. After pasting with a press etc., it will be punched into a predetermined shape,
It is cut into a card and turned into a card. When a reactive adhesive is used as the adhesive, it is cured for a predetermined time and then cut into a card. It is effective to make a hole around the card size of the laminated sheets to accelerate the curing, in order to supply water necessary for the reaction.

In the present invention, when a base material having a card-like size is prepared, as a manufacturing method, for example, a first base material and a second base material are adhered to each other with an adhesive, and a sheet base is laminated after adhesion. The method of molding into a card-like size is selected. As a method of molding into a card size, a punching method, a cutting method and the like are mainly selected. [Thermosetting Resin Layer] In the present invention, the thermosetting resin composition as the image recording body protective layer is, for example, an epoxy resin,
It is possible to use a mixture of polyester resin, acrylic resin and the like with a curing agent, a curing catalyst, a leveling agent, other additives and the like.

As the composition of the polyester resin, a composition mainly containing an aromatic dicarboxylic acid such as terephthalic acid or isophthalic acid as a dicarboxylic acid component and an aliphatic diol such as ethylene glycol or neopentyl glycol as a diol component is often used. , Aliphatic dicarboxylic acids such as adipic acid and azelaic acid, trivalent or higher carboxylic acids such as trimellitic acid and pyromellitic acid, and trivalent or higher valency such as trimethylolethane, trimethylolpropane and pentaerythritol. Those containing a small amount of alcohol and the like are more preferable because the melt fluidity and the crosslinking reactivity are improved.

The average degree of polymerization of the polyester resin is 5
Those in the range of -50 are preferred. If it is lower than this, sufficient strength cannot be obtained when it is made into a film, and if it is higher than this, crushing becomes difficult. Next, as the curing agent, when the terminal group of polyester is -OH type, there are an isocyanate compound and a melamine resin, for example, ε-caprolactam block isocyanate and methylated melamine. Examples of the -COOH type terminal group include epoxy resin and triglycidyl isocyanurate. [Photocurable resin layer] Specifically, the photocurable resin layer as the protective layer for the image recording material is made of a material having an addition polymerization property or a ring-opening polymerization property.
Radical-polymerizable compounds such as JP-A-7-159983
No. 7, Japanese Patent Publication No. 7-31399, Japanese Patent Application No. 7-231444
It may be a photocurable material using a photopolymerization (including heat-polymerizable) composition described in each publication such as Japanese Patent Application No. 7-231444. As the addition polysynthetic compound, a cationic polymerization type photocurable material is known, and recently, a cationic photopolymerization type photocurable material sensitized to a long wavelength region longer than visible light is also disclosed in, for example, JP-A-6- It is disclosed in Japanese Patent Publication No. 43633. A composition is disclosed in Japanese Patent Application Laid-Open No. 4-181944 as a photopolymerization material of hybrid type. Specifically, it is a photocurable layer containing any of the above-mentioned cationic initiator, cationically polymerizable compound, radical initiator, and radically polymerizable compound, and any photocurable layer is used for the purpose of the present invention. I don't mind. [Radical Polymerization Initiator] As the radical polymerization initiator,
Triazine derivatives described in JP-B-59-1281, JP-B-61-9621 and JP-A-60-60104, JP-A-59-1504 and JP-A-61-2.
Organic peroxides described in various publications such as 43807, JP-B-43-23684, JP-B-44-6413, JP-B-44-6413 and JP-B-47-1604, and U.S. Pat. Diazonium compounds described in US Pat. No. 2,848,328.
No. 2,852,379 and 2,940,85
No. 3, organic azide compounds described in each specification, JP-B-36-
22062, JP37-13109, JP38
-18015, Japanese Patent Publication No. 45-9610 and the like, ortho-quinone diazides described in Japanese Patent Publication No. 55-391.
62, JP-A-59-14023 and the like, and "Macromolecules,"
Various onium compounds described in Volume 10, page 1307 (1977), azo compounds described in JP-A-59-142205, JP-A-1-54440, European Patent 109,851, European Patents. 126th,
No. 712, etc., “Journal of Imaging Science” (J.Imag.Sci.) ”, Volume 30, p. 174 (1986), Japanese Patent Application No. 4- 56831 Specification and Japanese Patent Application No. 4-8
(Oxo) sulfonium organoboron complex described in Japanese Patent No. 9535, titanocene described in JP-A-61-151197, and "coordination chemistry.
Review (Coordination Chemist
ry Review) ", Vol. 84, Nos. 85-277
Page) (1988) and transition metal complexes containing a transition metal such as ruthenium described in JP-A-2-182701, 2,4,5 in JP-A-3-209477.
-Triarylimidazole dimer, carbon tetrabromide, organic halogen compounds described in JP-A-59-107344, and the like. These polymerization initiators are preferably contained in the range of 0.01 to 10 parts by weight with respect to 100 parts by weight of the compound having a radically polymerizable ethylenic unsaturated bond.

The photosensitive composition containing the radical-polymerizable compound contains, as a thermal polymerization initiator of the radical-polymerizable monomer, a known radical-polymerization initiator generally used for polymer synthesis reaction by radical polymerization without particular limitation. Can be made. Here, the thermal polymerization initiator is a compound capable of generating a polymerizable radical by applying heat energy.

Examples of such compounds include 2,
2'-azobisisobutyronitrile, 2,2'-azobispropionitrile and other azobisnitrile compounds, benzoyl peroxide, lauroyl peroxide, acetyl peroxide,
T-Butyl perbenzoate, α-cumyl hydroperoxide, di-t-butyl peroxide, diisopropyl peroxydicarbonate, t-butyl peroxyisopropyl carbonate, peracids, alkyl peroxycarbamates, nitrosoaryl acylamine Such as organic peroxides such as potassium persulfate, potassium persulfate, ammonium persulfate, potassium perchlorate and the like, diazoaminobenzene, p-nitrobenzenediazonium, azobis-substituted alkanes, diazothioethers, arylazosulfones, etc. Azo or diazo compounds, nitrosophenyl urea, tetramethyl thiuram disulfide, diaryl disulfides, dibenzoyl disulfide, tetraalkyl thiuram disulfides, dialkyl xanthate disulfides Aryl sulfinic acids, arylalkyl sulfonic acids, it may be mentioned 1-alkanoic sulfinic acids and the like.

Particularly preferred among these are compounds which are excellent in stability at room temperature, have a high decomposition rate upon heating, and become colorless upon decomposition, and the initiator is usually used in all polymerizable compositions. 0.1 to 30% by weight is preferable, 0.5 to 20
A range of weight% is more preferable. [Radical Polymerization Photocurable Resin] The radical polymerizable compound contained in the radical polymerizable composition includes ordinary photopolymerizable compounds and thermopolymerizable compounds. The radical-polymerizable compound is a compound having a radical-polymerizable ethylenically unsaturated bond, and may be any compound as long as it has at least one radical-polymerizable ethylenically unsaturated bond in the molecule. , Oligomers,
Those having a chemical form such as a polymer are included. The radical-polymerizable compound may be used alone, or two or more kinds thereof may be used in combination at an arbitrary ratio in order to improve target properties.

Examples of the radically polymerizable compound having an ethylenically unsaturated bond include unsaturated carboxylic acids such as acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid and maleic acid, and salts and esters thereof.
Radical polymerizable compounds such as urethane, amide and anhydride, acrylonitrile, styrene, and various unsaturated polyesters, unsaturated polyethers, unsaturated polyamides and unsaturated urethanes can be mentioned.

Specifically, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, butoxyethyl acrylate, carbitol acrylate, cyclohexyl acrylate, tetrahydrofurfuryl acrylate, benzyl acrylate, bis (4-acryloxypolyethoxyphenyl) propane, Neopentyl glycol diacrylate, 1,6-hexanediol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, polyethylene glycol diacrylate, polypropylene glycol diacrylate, pentaerythritol triacrylate. , Pentaerythritol tetraacrylate, Acrylic acid derivatives such as pentaerythritol tetraacrylate, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, oligoester acrylate, N-methylol acrylamide, diacetone acrylamide, epoxy acrylate, methyl methacrylate, n-butyl methacrylate, 2-ethylhexyl methacrylate. , Lauryl methacrylate, allyl methacrylate, glycidyl methacrylate, benzyl methacrylate, dimethylaminomethyl methacrylate, 1,6-hexanediol dimethacrylate, ethylene glycol dimethacrylate, triethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, polypropylene glycol dimethacrylate, Trimethylol ethane trimethacrylate, trimethylol propane trimethacrylate, 2,2-bis (4-methacryloxy polyethoxy phenyl) methacrylamide derivatives such as propane, other, allyl glycidyl ether, diallyl phthalate,
Examples thereof include derivatives of allyl compounds such as triallyl trimellitate, and more specifically, Shinzo Yamashita, "Handbook of Crosslinking Agents", (1981, Taiseisha); Kiyomi Kato,
"UV / EB Curing Handbook (Raw Materials)" (1985)
Year, Polymer Society); Edited by Radtech, “UV / E”
Application and Market of B Curing Technology ", p. 79, (1989, CMC); Eiichiro Takiyama," Polyester Resin Handbook ", (1988, Nikkan Kogyo Shimbun), etc., or known in the industry. Radical polymerizable or crosslinkable monomers, oligomers and polymers can be used. The amount of the radically polymerizable compound added to the radically polymerizable composition is preferably 1 to 97% by weight,
More preferably, it is 30 to 95% by weight. [Acid-Crosslinking Photocurable Resin] The crosslinking agent used in the acid-crosslinking composition of the present invention is a compound that causes a crosslinking reaction by the acid generated from the specific compound of the present invention upon irradiation with actinic light or radiation. The cross-linking agent preferably used in this invention is a compound having two or more hydroxymethyl groups, alkoxymethyl groups, epoxy groups or vinyl ether groups in the molecule. Preferred are compounds in which these crosslinkable functional groups are directly bonded to the aromatic ring. Specific examples thereof include methylol melamine, resole resin, epoxidized novolac resin, and urea resin.
Further, compounds described in "Crosslinking Agent Handbook" (written by Shinzo Yamashita and Tosuke Kaneko, Taiseisha Co., Ltd.) are also preferable. In particular, a phenol derivative having two or more hydroxymethyl groups or alkoxymethyl groups in the molecule is preferable because the strength of the image area when an image is formed is good. Specific examples of such a phenol derivative include a resol resin.

However, these cross-linking agents are unstable to heat, and the storage stability after preparation of the image recording material is not so good. On the other hand, it has two or more hydroxymethyl groups or alkoxymethyl groups bonded to the benzene ring in the molecule and has a molecular weight of 1,200.
The following phenol derivatives have good stability during storage and are most preferably used in the present invention. The alkoxymethyl group preferably has 6 or less carbon atoms. Specifically, a methoxymethyl group, an ethoxymethyl group,
n-propoxymethyl group, isopropoxymethyl group, n
-Butoxymethyl group, isobutoxymethyl group, sec-
A butoxymethyl group and a t-butoxymethyl group are preferable.
Furthermore, an alkoxy-substituted alkoxymethyl group such as a 2-methoxyethoxymethyl group and a 2-methoxy-1-propoxymethyl group is also preferable. In particular,
JP-A-6-282067 and JP-A-7-64285
Examples thereof include compounds described in Japanese Patent Publication No. 632,003A1 and the like.

Other cross-linking agents preferably used in the present invention include aldehyde and ketone compounds. Preferred is a compound having two or more aldehydes or ketones in the molecule.

In the present invention, the crosslinking agent is used in an amount of 5 to 70% by weight, preferably 10 to 65% by weight, based on the total solid content of the image recording material. 5% by weight of crosslinking agent
If it is less than 70% by weight, the film strength of the image portion when an image is recorded is deteriorated, and if it exceeds 70% by weight, the stability during storage is not preferable. These crosslinking agents may be used alone or in combination of two or more kinds. [Cationic Polymerization Initiator] The initiator is preferably a cationic polymerization initiator, and specific examples thereof include aromatic onium salts. As the aromatic onium salt, a salt of a Group Va element of the periodic table, for example, a phosphonium salt (for example, triphenylphenacylphosphonium hexafluorophosphate), a salt of a Group VIa element, for example, a sulfonium salt (for example, triphenylsulfonium tetrafluoroborate). , Triphenylsulfonium hexafluorophosphate, tris (4-thiomethoxyphenyl) hexafluorophosphate, sulfonium and triphenylsulfonium hexisafluoroantimonate), and No. VII
A salt of a group a element such as an iodonium salt (eg, diphenyliodonium chloride) can be used.

The use of such an aromatic onium salt as a cationic polymerization initiator in the polymerization of an epoxy compound is described in US Pat. Nos. 4,058,401 and 4,058.
69,055, 4,101,513 and 4,161,478.

Preferred cationic polymerization initiators include sulfonium salts of Group VIa elements. Among them, from the viewpoint of ultraviolet curability and storage stability of the ultraviolet curable composition, triarylsulfonium hexafluoroantimonate is preferable. Also, Photo Polymer Handbook (Photo Polymer Conversation Edition, Industrial Research Committee issue 1
989), pages 39 to 56, known photopolymerization initiators, and compounds described in JP-A-64-13142 and JP-A-2-4804 can be optionally used. [Cationic polymerization type photocurable resin] An epoxy type UV-curable prepolymer of a type (mainly epoxy type) in which polymerization is caused by cationic polymerization, and a monomer is a prepolymer containing two or more epoxy groups in one molecule. Can be mentioned. As such a prepolymer,
For example, alicyclic polyepoxides, polyglycidyl esters of polybasic acids, polyglycidyl ethers of polyhydric alcohols, polyglycidyl ethers of polyoxyalkylene glycols, polyglycidyl ethers of aromatic polyols, polyglycols of aromatic polyols. Examples thereof include hydrogenated compounds of glycidyl ethers, urethane polyepoxy compounds and epoxidized polybutadienes. These prepolymers may be used alone or in a mixture of two or more.

The content of the prepolymer having two or more epoxy groups in one molecule is preferably 70% by weight or more. As the cationically polymerizable compound contained in the cationically polymerizable composition, for example, the following (1) styrene derivative, (2) vinylnaphthalene derivative, (3) vinyl ethers, and (4) N-vinyl compounds may be used. Can be mentioned. (1) Styrene derivative For example, styrene, p-methylstyrene, p-methoxystyrene, β-methylstyrene, p-methyl-β-methylstyrene, α-methylstyrene, p-methoxy-β-
Methylstyrene etc. (2) Vinylnaphthalene derivative, for example, 1-vinylnaphthalene, α-methyl-1-vinylnaphthalene, β-methyl-1-vinylnaphthalene, 4
-Methyl-1-vinylnaphthalene, 4-methoxy-1-
(3) Vinyl ethers such as vinyl naphthalene, for example, isobutyl vinyl ether, ethyl vinyl ether, phenyl vinyl ether, p-methylphenyl vinyl ether, p-methoxyphenyl vinyl ether,
α-Methylphenyl vinyl ether, β-methyl isobutyl vinyl ether, β-chloroisobutyl vinyl ether, etc. (4) N-vinyl compounds such as N-vinylcarbazole, N-vinylpyrrolidone, N-vinylindole, N-vinylpyrrole, N-
Vinylphenothiazine, N-vinylacetanilide, N
-Vinylethylacetamide, N-vinylsuccinimide, N-vinylphthalimide, N-vinylcaprolactam, N-vinylimidazole and the like.

The content of the above cationically polymerizable compound in the cationically polymerizable composition is preferably 1 to 97% by weight, more preferably 30 to 95% by weight. [Hybrid photo-curable resin layer] Hybrid type (combination of radical polymerizable type and cationic polymerization type)
When is used, the composition is disclosed in JP-A-4-181944. Specifically, any one of the above-mentioned cationic initiator, cationically polymerizable compound, radical-based initiator, and radically polymerizable compound may be included. It is preferable to use. [Photocurable Adhesive Additive] To be added as an additive for controlling the temperature at which a predetermined electronic component can be adhered between the first sheet member and the second sheet member of the present invention to 80 ° C. or less. Is more preferable. The addition amount is preferably 5 to 80% by weight, more preferably 10% by weight based on the total solid content of the photocurable adhesive layer.
Is about 70% by weight.

Examples of preferable adhesive acrylic polymers include homopolymers or copolymers of alkyl (meth) acrylate monomers in which the alkyl group has 1 to 14 carbon atoms, and more preferably the above alkyl A copolymer of a (meth) acrylate monomer and a vinyl monomer having an unsaturated bond copolymerizable with the alkyl (meth) acrylate monomer can be mentioned.

Examples of the alkyl (meth) acrylate monomer include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate,
2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, isomyristyl (meth) acrylate, etc. can be illustrated.

The vinyl monomer is not particularly limited as long as it is a compound having an unsaturated bond copolymerizable with the alkyl (meth) acrylate monomer, and (meth) acrylic acid ester other than the alkyl (meth) acrylate, Vinyl acetate, styrene, vinyl chloride, ethylene, propylene, 2-hydroxyethyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate,
ε-caprolactone (meth) acrylate, 2-acryloyloxyethyl (propyl) succinic acid, (meth) acrylonitrile, N-vinylpyrrolidone, isovoltanyl (meth) acrylate, N-acryloylmorpholine, benzyl (meth) acrylate, glycidyl (meth) ) Acrylate, N-vinylcaprolactone, N-vinylpiperidine, (meth) acrylic acid, rosin epoxy (meth) acrylate, rosin modified (meth) acrylate such as rosin ester (meth) acrylate. As rosin epoxy (meth) acrylate,
Examples thereof include reaction products of rosins and glycidyl (meth) acrylate, (meth) acrylic monomers having an alicyclic epoxy group with rosins, maleic anhydride, crotonic acid, and itaconic acid. From these, the average molecular weight Mw of the acrylic copolymer is 500 to 1,000,000.
Is preferable, and more preferably 10,000 to 100,000.
It is 0. [Other Additives to Photocurable Resin Layer] <Sensitizer> The photosensitive composition of the present invention is a composition in which various sensitizers are combined to obtain light from the ultraviolet to near infrared region. It is possible to obtain a polymerizable composition having an extremely high sensitivity to the above and having an extremely high sensitivity. Specific examples of the sensitizer in the present invention include unsaturated ketones represented by chalcone derivatives and dibenzalacetone, 1,2-diketone derivatives represented by benzyl and camphorquinone, benzoin derivatives, and fluorene. Derivative, naphthoquinone derivative, anthraquinone derivative, xanthene derivative,
Thioxanthene derivative, xanthone derivative, thioxanthone derivative, coumarin derivative, ketocoumarin derivative, cyanine derivative, styryl derivative, merocyanine derivative,
Polymethine dyes such as oxonol derivatives, acridine derivatives, azine derivatives, thiazine derivatives, oxazine derivatives, indoline derivatives, azulene derivatives, azurenium derivatives, squarylium derivatives, porphyrin derivatives,
Tetraphenylporphyrin derivative, triarylmethane derivative, tetrabenzoporphyrin derivative, tetrapyrazinoporphyrazine derivative, phthalocyanine derivative,
Tetraazaporphyrazine derivative, tetraquinoxalyloporphyrazine derivative, naphthalocyanine derivative, subphthalocyanine derivative, pyrylium derivative, thiopyrylium derivative, tetraphyllin derivative, annulene derivative,
Examples include spiropyran derivatives, spirooxazine derivatives, thiospiropyran derivatives, metal arene complexes, organic ruthenium complexes, and more specifically, Nobu Okawara et al., "Dye Handbook" (1986, Kodansha), Nobu Okawara et al. "The Chemistry of Functional Dyes" (1981, CMC), edited by Chuzaburo Ikemori, "Special Functional Materials" (19
1986, CMC), and the dyes and sensitizers described in Japanese Patent Application No. 7-108045 and the like, but are not limited to these, in addition, to the light in the ultraviolet to the near infrared region Examples thereof include dyes and sensitizers that exhibit absorption, and two or more kinds of these may be used in an arbitrary ratio as needed. <Polymerization accelerator, chain transfer agent, etc.> A polymerization accelerator and a chain transfer catalyst can be added to the photosensitive composition of the present invention. Specific examples thereof include amines such as N-phenylglycine, triethanolamine, N, N-diethylaniline, U.S. Pat. No. 4,414,312 and JP-A-64-1.
Thiols described in 3144, JP-A-2-291561
Disulfides described in U.S. Pat. No. 3,558,32
2, thiones described in JP-A No. 64-17048, o-acylthiohydroxamates and N-alkoxypyridine thiones described in JP-A-2-291560. <Polymerization Inhibitor> In the radical-polymerizable composition containing the radical-polymerizable compound, a photo-curable resin layer may contain a polymerization inhibitor for the purpose of preventing polymerization during storage of the liquid. Specific examples of the thermal polymerization inhibitor that can be added to the radically polymerizable composition include p-methoxyphenol, hydroquinone, alkyl-substituted hydroquinone, catechol and te.
Examples thereof include rt-butylcatechol and phenothiazine. These thermal polymerization inhibitors are added in the range of 0.001 to 5 parts by weight with respect to 100 parts by weight of the compound having a radically polymerizable ethylenically unsaturated bond. Preferably. <Antistatic Agent> As the antistatic agent, a cationic surfactant, an anionic surfactant, a nonionic surfactant,
In addition to polymeric antistatic agents, conductive fine particles, etc.
Chemical products of No. 0 ”, Kagaku Kogyo Nippo Co., Ltd., compounds described in p875-876 and the like. <Surfactant> Further, in the image forming layer of the image forming material of the present invention, JP-A No. 62-251740 and JP-A No. 3-251740.
Nonionic surfactants as described in JP-A-208514 and the like, or JP-A-59-121044.
And amphoteric surfactants such as those described in JP-A-4-13149 and the like can be added.

Further, a surfactant such as silicone oil, a silicone-alkylene oxide copolymer (for example, L-5410 commercially available from Union Carbide Co.), a silicone-based active agent such as those manufactured by Nippon Unicar, a silicone oil-containing agent. Examples thereof include aliphatic epoxides and silicon-containing monoepoxides. It is also possible to use the Si-based additives described in "New Silicone and Its Applications" published by Toshiba Silicone Co., Ltd. in 1994, "Special Silicone Reagent Catalog" published by Asmax Co., Ltd. in 1996, and the like. The addition amount is preferably 0.001 to 1% by weight. <Resin> In addition to the adhesive polymer, polyvinyl butyral resin, polyurethane resin, polyamide resin, polyester resin, epoxy resin, novolac resin, vinyl monomer such as styrene, paramethylstyrene, methacrylic acid ester, acrylic acid ester and cellulose type , Any other high-molecular polymer such as thermoplastic polyester and natural resin may be used in combination. In addition, in addition, Kiyoshi Akamatsu's supervision, "Practical Technology of New Photosensitive Resin," (CMC, 1987) and "10188 Chemical Products" pp. 657-767 (Kagaku Kogyo Nippo, 1988) You may use together the organic high molecular polymer of.

In the present invention, an unsaturated group-containing resin is particularly preferable, and is characterized in that it contains a group that can be polymerized by a radical or an acid, and the unsaturated group here means a glycidyl group, a (meth) acryloyl group, Represents a vinyl group and the like. Specifically, a resin having a structure shown below can be given. The content of these high molecular weight polymers in the photosensitive composition is preferably in the range of 1 to 70% by weight,
The range of 5 to 50% by weight is more preferable. <Coating Solvent> In the present invention, the coating solvent is not limited, and when a coating solvent is used, it is described in detail in “Solvent Handbook” published by Kodansha. There are no particular restrictions on the use of these organic solvents.

The photosensitive composition of the present invention further comprises an oxygen scavenger such as dyes, organic and inorganic pigments, phosphines, phosphonates and phosphites, a reducing agent, an antifoggant, an antifading agent and an antihalation agent according to the purpose. , Fluorescent whitening agents, colorants, bulking agents, plasticizers, flame retardants, antioxidants, UV absorbers, foaming agents, antifungal agents, additives that impart various properties such as magnetic substances, diluent solvents, etc. You may mix and use it. [Method of Forming Heat or Photocurable Resin Layer] When the heat or photocurable resin layer is formed on the image recording body, it is preferable to form it by a coating method or transfer foil.

When coating is selected as a method for protecting the image recording medium, conventionally known methods such as spin coating, wire bar coating, dip coating, felt coating, air knife coating, spray coating, air spray coating and electrostatic coating are used. Methods such as air spray coating, roll coating blade coating and curtain coating are used. At this time, the coating amount varies depending on the application, but is, for example, 0.05 to 50.0 g as solid content.
A coating amount of / m2 is preferable. Although the apparent sensitivity increases as the coating amount decreases, the film characteristics and chemical resistance of the image forming layer decrease.

As a method of curing after coating, any method of generating active electromagnetic waves can be used. For example,
Examples thereof include lasers, light emitting diodes, xenon flash lamps, halogen lamps, carbon arc lamps, metal halide lamps, tungsten lamps, mercury lamps and electrodeless light sources. Preferably a xenon lamp,
Examples of the light source include halogen lamps, carbon arc lamps, metal halide lamps, tungsten lamps, and mercury lamps. Can be used. [Active curing line] When a laser is used as a light source,
It is easy to reduce the exposure area to a very small size, and high-resolution image formation is possible. As a laser light source, any of an argon laser, a He-Ne gas laser, a YAG laser, a semiconductor laser and the like can be preferably used.

When photocuring is performed using actinic rays,
A means for stabilizing photocuring in a nitrogen stream under reduced pressure may be used. [Heat treatment] Heat energy can be applied, and as the means, an oven, a heat roller, a hot stamp, a thermal head, a laser beam, an infrared flash, a hot pen, etc. can be selected and used as appropriate.

For protection of the heat- or photo-curable resin layer of the present invention, a transparent protective layer ribbon or transparent protective foil formed by coating on a heat-resistant support such as a polyethylene terephthalate resin film is prepared in advance. Alternatively, it can be formed by thermal transfer using, for example, a thermal head or a thermal transfer roll. <General Description of Image Forming Method of Image Recording Body> The present invention is provided with an image element, and an image on a substrate provided with at least one selected from an authentication identification image such as a face image, an attribute information image, and format printing. Alternatively, it is formed on the printing surface side.

The face image is usually a full-color image having gradation, and is produced by, for example, a sublimation type thermal transfer recording system or a silver halide color photographic system. The character information image is composed of a binary image, and is produced by, for example, a fusion type thermal transfer recording system, a sublimation type thermal transfer recording system, a silver halide color photographic system, an electrophotographic system, an inkjet system or the like. In the present invention, it is preferable to record an authentication identification image such as a face image and an attribute information image by a sublimation thermal transfer recording system.

The attribute information is a name, address, date of birth, qualification, etc., and the attribute information is usually recorded as character information, and a melting type thermal transfer recording method is general. Format printing or information recording may be performed by any method such as offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, inkjet method, sublimation transfer method, electrophotographic method, heat melting method, etc. Can also be formed.

Further, for the purpose of preventing forgery / alteration, watermark printing, hologram, fine print, etc. may be adopted. The anti-counterfeiting / alteration layer is appropriately selected from printed matter, holograms, barcodes, matte patterns, fine prints, tint patterns, uneven patterns, etc. It is composed of a vapor deposition layer, a glass vapor deposition layer, a bead layer, an optical change element layer, a pearl ink layer, an adjacent piece pigment layer and the like. <Sublimation Image Forming Method> The sublimation-type thermal transfer recording ink sheet can be composed of a support and a sublimable dye-containing ink layer formed thereon. -Support-The support is not particularly limited as long as it has good dimensional stability and can withstand heat during recording with a thermal head, and any known support can be used. —Sublimable Dye-Containing Ink Layer— The sublimable dye-containing ink layer basically contains a sublimable dye and a binder.

Examples of the sublimable dyes include cyan dyes, magenta dyes and yellow dyes.

As the cyan dye, there is disclosed in JP-A-59-7.
8896, 59-227948, and 60.
No. 24966, No. 60-53563, and No. 6
No. 0-130735, No. 60-131292, No. 60-239289, No. 61-19396.
No. 61-29293, No. 61-3129.
No. 2, gazette 61-31467, gazette 61-359.
94, 61-49893, 61-14.
No. 8269, No. 62-191191, No. 63.
-912288, 63-91287, and 6
Examples thereof include naphthoquinone dyes, anthraquinone dyes, and azomethine dyes described in JP-A-3-290793.

As the magenta dye, there is disclosed in JP-A-59-59.
No. 78896, No. 60-30392, and No. 60
-30394, 60-253595, 61-262190, 63-5992,
No. 63-205288, No. 64-159, and No. 6
Examples thereof include anthraquinone dyes, azo dyes, azomethine dyes, and the like described in each publication such as 4-63194.

As the yellow dye, JP-A-59-78 can be used.
No. 896, No. 60-27594, and No. 60-3.
No. 1560, No. 60-53565, No. 61-
Examples thereof include methine dyes, azo dyes, quinophthalone dyes, and anthrythothiazole dyes described in each of the publications such as 12394 and 63-122594.

Particularly preferred as the sublimable dye is a compound having an active methylene group of open or closed type, which is an oxidized product of p-phenylenediamine derivative or p-phenylenediamine derivative.
Azomethine dye obtained by coupling reaction with aminophenol derivative oxidant and indoaniline obtained by coupling reaction with phenol or naphthol derivative or p-phenylenediamine derivative oxidant or p-aminophenol derivative oxidant It is a pigment.

When a metal ion-containing compound is blended in the image receiving layer, a sublimable dye which reacts with the metal ion-containing compound to form a chelate is contained in the sublimable dye-containing ink layer. Is good. Examples of such a sublimable dye capable of forming a chelate include, for example, JP-A-59.
-78893, 59-109349, Japanese Patent Application No. 2-
No. 213303, No. 2-214719, No. 2-203
Cyan dyes, magenta dyes and yellow dyes which are capable of forming at least a bidentate chelate as described in JP-A No. 742 can be mentioned.

Preferred sublimable dyes capable of forming a chelate can be represented by the following general formula.

X1-N = N-X2-G wherein X1 is necessary for completing an aromatic carbocycle or a heterocycle in which at least one ring is composed of 5 to 7 atoms. At least one of the adjacent carbon atoms, which represents a group of atoms and is bonded to an azo bond, is a carbon atom substituted with a nitrogen atom or a chelating group. X2
Represents an aromatic heterocycle or an aromatic carbocycle in which at least one ring is composed of 5 to 7 atoms. G represents a chelating group.

With respect to any of the sublimable dyes, the sublimable dye contained in the sublimable dye-containing ink layer may be any one of a yellow dye, a magenta dye, and a cyan dye if the image to be formed is a single color. It may be present, and depending on the color tone of the image to be formed, any two or more of the above three types of dyes or another sublimable dye may be included. The amount of the sublimable dye used is usually 1
It is 0.1 to 20 g, preferably 0.2 to 5 g per m ² .

The binder for the ink layer is not particularly limited, and any conventionally known binder can be used. Further, various conventionally known additives can be appropriately added to the ink layer.

An image recording body for an IC card, an apparatus for manufacturing the same, and a method for manufacturing the same will be described below with reference to the drawings.

The thickness of the IC card base material in the present invention is not particularly limited, but preferably 100 μm to 120 μm.
0 μm is preferable, and more preferably 200 μm to 100
0 μm, more preferably 200 μm to 900 μm
Is. The thickness of the IC card prepared from the IC card base material is not particularly limited, but is preferably 200 μm to 150 μm.
0 μm is preferable, and more preferably 250 μm to 120 μm.
0 μm, more preferably 300 μm to 1000 μm
m. <IC Card Base Material and Method of Making IC Card> FIG. 3 shows a first embodiment of a front sheet, FIG. 3 (a) is a sectional view of the front sheet, and FIG. 3 (b) is a front view of the front sheet. Figure 3 (c)
[Fig. 3] is a perspective view showing a configuration of an IC card using a front sheet. As shown in FIG. 3A, the card base material of the front sheet has a cushion layer, an image receiving layer, an information carrier layer, and a transparent resin layer sequentially laminated on the base material, and an image is formed on the image receiving layer. .
The information carrier layer is an employee ID card, as shown in FIG.
It represents the name and is composed of an aggregate of them, I in FIG.
An IC card as shown in FIG. 3C is created using the C card base material creating sheet.

FIG. 4 shows a first embodiment of the back sheet,
FIG. 4A is a sectional view of the back sheet, and FIG. 4B is a surface view of the back sheet. The card base material of the back sheet is shown in FIG.
As shown in, the writing layer and the information carrier layer are sequentially laminated on the base material. As shown in FIG. 4 (b), the information carrier on the writing layer represents a ruled line, an issuer, an issuer's name, and a postscript item, and the IC card base of FIG. 10 (b) composed of these aggregates. An IC card is created using the material creation sheet.

FIG. 5 shows a second embodiment of the back sheet,
5A is a cross-sectional view of the back sheet, and FIG. 5B is a surface view of the back sheet. The card base material of the back sheet is shown in FIG.
As shown in, an IC concealing layer is provided on the base material, and the writing layer and the information carrier layer are sequentially laminated on the base material. As shown in FIG. 5 (b), the information carrier on the writing layer represents a ruled line, an issuer, an issuer's name, and an additional item, and the IC card base of FIG. An IC card is created using the material creation sheet.

FIG. 6 is a diagram showing a printed pattern. This printed pattern is provided by printing on the base material of the back sheet in FIG.

Next, FIGS. 7 to 9 show an IC card material prepared by using the back sheet as the first sheet material and the front sheet as the second sheet material. FIG. 7 is a schematic view of an IC module made of an IC card material, which is an IC module of an electronic component 3a in which an IC chip 3a2 is joined to an antenna 3a1 of an antenna coil wound with a copper wire.

The structure of the inlet shown in FIG. 8 is a non-woven fabric type, and the non-woven fabric 3a4 on which the print pattern is formed and the IC chip 3a2 are joined by bonding or the like, and the reinforcing plate 3a3 is attached to the IC chip 3a2 by the IC chip 3a2.
It is the schematic diagram which interposes so that it may cover more than%. Hitachi Maxell KK IC card sheet "FT series"
Can also be used.

FIG. 9 shows a printed circuit board type in which the printed circuit board 3a5 on which a print pattern is formed and the IC chip 3a2 are joined by bonding or the like.
2 is a schematic view in which a reinforcing plate 3a3 is interposed so as to cover the IC chip 3a2 by 50% or more.

FIG. 10 is a perspective view of the front sheet or the back sheet.

11 and 12 are sectional views of the finished IC card. FIG. 11 shows an IC card in which the adhesive layer 7, the inlet 3, the adhesive layer 6, and the first sheet material 1 are sequentially arranged on the second sheet material 2.

FIG. 12 shows an IC card in which the adhesive layer 7 containing tabular particles, the inlet 3, the adhesive layer 6 containing tabular particles, and the first sheet material 1 are sequentially arranged on the second sheet material 2.

13 to 15 are plan views of the finished IC card. The IC card of FIGS. 13 and 14 has a reinforcing plate 3a whose inlet structure is adjacent to the IC chip 3a2.
3, and the connection position with the antenna 3a1 is different.

The IC card of FIG. 15 has a reinforcing plate 3a3 having an inlet structure adjacent to the IC chip 3a2.
The connection position with the antenna 3a1 is the same as in FIG. 13,
The IC module is inserted in a state of being sandwiched by a nonwoven fabric 3a4 which is a mesh sheet having a two-dimensional mesh structure having openings 3a41 in a mesh shape.

[0151]

The present invention will be described in detail below with reference to examples, but the embodiments of the present invention are not limited thereto. In addition,
In the following, "part" means "part by weight". (Preparation of Adhesive) Adhesive 1 Macroplast QR3460 (moisture-curing adhesive) manufactured by Henkel Co., Ltd. 80 parts Porous high silica aluminosilicate (AMT-SILICA # 200B; manufactured by Mizusawa Chemical Co., Ltd.) Adhesive 1 was prepared by stirring with a homogenizer at 150 ° C. for 60 minutes. Adhesive 2 Sekisui Chemical Co., Ltd. Esdyne 9631W 95 parts Porous high silica aluminosilicate (AMT-SILICA # 200B; Mizusawa Chemical Co., Ltd.) Amount shown in Table 1 The above components were stirred at a temperature of 150 ° C. for 60 minutes with a homogenizer. Adhesive 2 was prepared. Adhesive 3 Hitachi Chemical Polymer Hibon 4810 95 parts Porous high silica aluminosilicate (AMT-SILICA # 200B; manufactured by Mizusawa Chemical Co., Ltd.) The amounts shown in Table 1 The above components were stirred at a temperature of 150 ° C. for 60 minutes with a homogenizer. Adhesive 3 was prepared. Adhesive 4 Elastic epoxy adhesive: Ultoite 1540 set manufactured by Toho Kasei Co., Ltd. (500 μm breaking elongation after curing 176%, 2% elastic modulus 0.4%, viscosity 15000mp
The main agent was added to the A solution supply part using s), and the curing agent was added to the B solution supply part. Adhesive 5 Elastic epoxy adhesive of the present invention: ThreeBond 3950 set manufactured by ThreeBond Co., Ltd. (500 μm breaking elongation after curing 246%, 2% elastic modulus 0.3%, viscosity 30000mp
The main agent was added to the A solution supply part using s), and the curing agent was added to the B solution supply part. Further, 3% by weight of iridione 211 manufactured by Merck Ltd. was added to the solution B.

However, the adhesives 1 to 3 had a temperature of 130 ° C. for the adhesive supply part, and the adhesive 4.5 had a temperature of 30 ° C. for the adhesive supply part after defoaming. <Creation of the first sheet material (back sheet)> U and Teijin DuPont Films Co., Ltd. as front and back sheets
2L98W-100 low heat balance grade 100 μm was used. (Preparation of Writing Layer) A coating liquid for forming a first writing layer, a coating liquid for forming a second writing layer, and a coating liquid for forming a third writing layer, each having the following composition, were applied to 100 μm of the support backing sheet in this order and dried. Then, the writing layers were formed by laminating the layers so that the respective thicknesses were 5 μm, 15 μm, and 0.2 μm. <Coating liquid for forming the first writing layer> Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Japan Polyurethane Industry Co., Ltd .: Coronate HX] Carbon black Trace amount of titanium dioxide particles [Ishihara Sangyo] Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming second writing layer> Polyester resin 4 parts [Toyobo Co., Ltd .: Vylonal MD1200] Silica 5 parts Titanium dioxide particles [Ishihara] Sangyo Co., Ltd .: CR80] 1 part Water 90 parts <Third writing layer forming coating liquid> Polyamide resin [Sanwa Chemical Industry Co., Ltd .: Sunmide 55] 5 parts Methanol 95 parts Obtained writing layer The center line average roughness was 1.34 μm. (Formation of Format Printing Layer on Writing Layer) Format printing (ruled lines, issuer name, issuer telephone number) was performed by the offset printing method. UV ink was used as the printing ink. The UV irradiation condition during printing is 200 m with a high pressure mercury lamp.
It was equivalent to j. (Creation of IC concealing layer) An IC concealing layer was provided on the outermost surface of the support on the side opposite to the writing layer by a resin convex printing method. Printing Printing ink was printed with UV ink. U when printing
The V irradiation condition was equivalent to 200 mj with a high pressure mercury lamp.
The film thickness was 1.0 μm. <Creation of second sheet material (front sheet)> U and Teijin DuPont Films Co., Ltd. as front and back sheets
2L98W-100 low heat balance grade was used. (Preparation of Front Sheet) A second sheet member (top sheet 1) was formed by sequentially coating and drying a cushion layer and an image receiving layer made of the following composition on 100 μm of the support front sheet. (Photo-curable cushion layer) Film thickness 10 μm Urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA512) 55 parts Polyester acrylate (manufactured by Toagosei Co., Ltd .: Aronix M6200) 15 parts Urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK) Oligo UA4000) 25 parts Hydroxycyclohexyl phenyl ketone (Ciba Specialty Chemicals: Irgacure 184) 5 parts Methyl ethyl ketone 100 parts Actinic ray curable compound after application is 90 ° C / 30 sec.
And then photocured with a mercury lamp (300 mJ / cm ² ). (Image-Receiving Layer) A first image-receiving layer-forming coating liquid, a second image-receiving layer-forming coating liquid and a third image-receiving layer-forming coating liquid having the following compositions are applied and dried in this order on the cushion layer, respectively. An image receiving layer was formed by laminating the layers to have a thickness of 0.2 μm, 2.5 μm, and 0.5 μm. <Coating liquid for forming first image-receiving layer> Polyvinyl butyral resin 9 parts [Sekisui Chemical Co., Ltd .: Eslec BL-1] Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX] Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming second image-receiving layer> Polyvinyl butyral resin 6 parts [Sekisui Chemical Co., Ltd .: S-REC BX-1] Metal ion-containing compound (compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts < Third image-receiving layer forming coating liquid> Polyethylene wax 2 parts [Toho Chemical Industry Co., Ltd .: Hitec E1000] Urethane-modified ethylene acrylic acid copolymer 8 parts [Toho Chemical Industry Co., Ltd .: Hitech S6254] Methylcellulose [ Shin-Etsu Chemical Co., Ltd .: SM15] 0.1 part water 90 parts (format print layer The Ranaru information carrying body forming) offset printing method on the image receiving layer, the format printing (of employee's ID card and name) was performed. UV ink was used as the printing ink. The UV irradiation condition during printing is 200 m with a high pressure mercury lamp.
It was equivalent to j. (Formation of transparent resin layer) A printing ink composed of the following composition was mixed by a roll mill to prepare a printing ink. Printing was performed on the image receiving layer by the offset printing method. The UV irradiation condition during printing was equivalent to 200 mj with a high pressure mercury lamp. (Transparent resin layer composition 1) Urethane acrylate oligomer 50 parts Aliphatic polyester acrylate oligomer 35 parts Dyrocur 1173 (Ciba Specialty Chemicals Co., Ltd.) 5 parts Trimethylol propane acrylate 10 parts (IC hiding layer) Resin convex printing According to the method, watermark printing was performed on the outermost surface of the support opposite to the image receiving layer surface. Printing Printing ink was printed with UV ink. The UV irradiation condition during printing was equivalent to 200 mj with a high pressure mercury lamp. The film thickness was 1.0 μm. <Creation of image recording body for IC card> In the process of producing the IC card of FIG. 1, using the above-prepared first sheet material (back sheet) and second sheet material (top sheet), the first sheet member The (back sheet) is installed in the first sheet material supply unit, and the second sheet material (front sheet) is installed in the second sheet material supply unit. Henkel's Macrop for adhesive supply
Last QR3460 was charged and applied to the first and second sheet materials to obtain an image recording body for an IC card having a size of 520 μm. After confirming that the adhesive has hardened, cut at the cutting part, punch out into a card shape at the punching part, make a cosmetic cut,
An image recording body for an IC card having a size of 55 mm × 85 mm was created. [IC Card Creation Method] Next, a method of writing the authentication identification image and the attribute information image on the IC card will be described.

(Preparation of Ink Sheet for Sublimation-Type Thermal Transfer Recording) A 6 μm thick polyethylene terephthalate sheet having a back surface processed to prevent fusion is coated with a yellow ink layer-forming coating solution and a magenta ink layer-forming coating having the following composition. Liquid and cyan ink layer forming coating liquid were provided so that each thickness was 1 μm, and three color ink sheets of yellow, magenta and cyan were obtained.

<Coating liquid for forming yellow ink layer> Yellow dye (MS Yellow manufactured by Mitsui Toatsu Dye Co., Ltd.) 3 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24] manufactured by Denki Kagaku Kogyo Co., Ltd. Poly Methyl methacrylate modified polystyrene 1 part [Toagosei Chemical Industry Co., Ltd .: Rededa GP-200] Urethane modified silicone oil 0.5 part [Dainichi Seika Chemicals Co., Ltd .: Dialomer SP-2105] Methyl ethyl ketone 70 parts Toluene 20 Part <Coating liquid for forming magenta ink layer> Magenta dye (MS Magenta manufactured by Mitsui Toatsu Dye Co., Ltd.) 2 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24] polymethyl Methacrylate modified polystyrene 2 parts [Toa Gosei Chemical Industry Co., Ltd .: Rededa GP -200] Urethane-modified silicone oil 0.5 part [Dainichi Seika Kogyo KK: Dialomer SP-2105] Methyl ethyl ketone 70 parts Toluene 20 parts <Cyan ink layer forming coating liquid> Cyan dye (Nippon Kayaku Co., Ltd. ) Kayaset blue 136) 3 parts Polyvinyl acetal 5.6 parts [Denka Butyral KY-24] manufactured by Denki Kagaku Kogyo Co., Ltd. Polymethylmethacrylate modified polystyrene 1 part [Toagosei Kagaku Kogyo: Rededa GP] -200] Urethane-modified silicone oil 0.5 part [Dainichi Seika Kogyo KK: Dialomer SP-2105] Methyl ethyl ketone 20 parts (preparation of ink sheet for melt-type thermal transfer recording) Thickness processed with fusion prevention on back surface A 6 μm thick polyethylene terephthalate sheet is coated with an ink layer-forming coating solution having the following composition to a thickness of 2 An ink sheet was obtained by coating and drying so as to have a thickness of μm. <Ink layer forming coating liquid> Carnauba wax 1 part Ethylene vinyl acetate copolymer 1 part [Mitsui DuPont Chemical Co., Ltd .: EV40Y] Carbon black 3 parts Phenolic resin [Arakawa Chemical Industries Co., Ltd .: Tamanor 521] 5 parts Methyl ethyl ketone 90 parts (formation of face image) Image receiving layer or transparent resin part, information printing part and ink side of sublimation type thermal transfer recording ink sheet are overlaid and output from the ink sheet side using a thermal head 0.23 W / dot , Pulse width 0.3-4.5 ms,
By heating under a condition of a dot density of 16 dots / mm, a human image having gradation is formed on the image receiving layer.

In this image, the dye and nickel in the image receiving layer form a complex. (Formation of character information) The transparent resin portion or the scale-pigment-containing layer and the ink side of the ink sheet for melt-type thermal transfer recording are superposed and output from the ink sheet side by using a thermal head 0.5 W / dot, pulse width 1. 0 ms, dot density 1
Character information was formed on the image recording body for the IC card by heating under the condition of 6 dots / mm. The face image and the attribute information are provided as described above. Method for Forming Protective Layer on IC Card [Synthesis Example 1] (Synthesis Example 1 of Resin for Adding Surface Protective Layer on IC Card) 73 parts of methyl methacrylate, 15 parts of styrene, and 12 parts of methacrylic acid were placed in a three-necked flask under a nitrogen stream. Ethanol 50
0 part and 3 parts of α, α′-azobisisobutyronitrile were added, and the mixture was reacted in a nitrogen stream in an oil bath at 80 ° C. for 6 hours. Then, 3 parts of triethylammonium chloride,
1.0 part of glycidyl methacrylate was added and reacted for 3 hours to obtain a synthetic binder 1 of the intended acrylic copolymer. [Example 1] (Preparation of transparent resin transfer foil 1) Polyethylene terephthalate (S-25) manufactured by Diafoil Hoechst Co., Ltd. was coated with the following formulation by wire bar coating and dried, and Examples 1 to 3 were prepared. To form a protective layer. <Release layer> Film thickness 0.5 μm Acrylic resin (manufactured by Mitsubishi Rayon Co., Ltd., DIANAR BR-87) 5 parts Polyvinyl acetoacetal (SP value: 9.4) (Sekisui Chemical Co., Ltd., KS-1) 5 parts Methyl ethyl ketone 40 parts Toluene 50 parts After coating, drying was performed at 90 ° C./30 sec. <Intermediate layer forming coating liquid> Film thickness 0.3 μm Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: S-REC BX-1] 5 parts Tuftex M-1913 (Asahi Kasei) 3.5 parts Hardener Polyisocyanate [Coronate HX Made in Japan Polyurethane] 1.5 parts Methyl ethyl ketone 20 parts Toluene 70 parts After application, drying was carried out at 90 ° C./30 sec, and curing of the curing agent was carried out at 50 ° C. for 24 hours. <Barrier layer forming coating solution> Film thickness 0.5 μm BX-1 (polyvinyl butyral resin) 4 parts [Sekisui Chemical Co., Ltd .: Eslec B series] Tuftex M-1913 (Asahi Kasei) 4 parts Curing agent Polyisocyanate [ Coronate HX made by Nippon Polyurethane] 2 parts Toluene 50 parts Methyl ethyl ketone 40 parts After coating, drying was performed at 70 ° C./30 sec. <Adhesive layer forming coating liquid> Film thickness 0.3 μm Urethane-modified ethylene ethyl acrylate copolymer [Toho Chemical Industry Co., Ltd .: Hitec S6254B] 8 parts Polyacrylic ester copolymer [Nippon Pure Chemical Co., Ltd.] : Julimer AT510] 2 parts Water 45 parts Ethanol 45 parts After coating, it was dried at 70 ° C./30 sec.

A transparent resin transfer foil 1 composed of a release layer, an intermediate layer and an adhesive layer having the above composition was prepared.

Further, the transfer foil described in each of the examples and comparative examples having the transparent protective layer having the above-mentioned structure on the image receptor on which images and characters are recorded is heated to a surface temperature of 200 ° C., and the rubber hardness is 5 cm. Transfer was performed using a 85 heat roller at a pressure of 150 kg / cm ² for 1.2 seconds.

On the image receptor to which the transfer foil 1 was transferred, the ultraviolet-curable resin-containing coating liquid was applied by a gravure roll coater having a specific background pattern so that the coating amount was 20 g / m ² . The ultraviolet curable resin-containing coating liquid 1 was cured under curing conditions to form an ultraviolet curable protective layer.

Curing conditions Light irradiation source 60 w / cm ² high-pressure mercury lamp Irradiation distance 10 cm Irradiation mode Optical scanning at 3 cm / sec [UV curable resin-containing coating liquid 1] Bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate 70 parts Bisphenol A glycidyl ether 10 parts 1,4-butanediol glycidyl ether 13 parts Triarylsulfonium fluoroantimony 7 parts [Example 2] <Preparation of actinic ray curable transfer foil 1> (Release layer forming coating liquid) Film thickness 0.2 μm Polyvinyl alcohol (GL-05) (Nippon Gosei Kagaku) 10 parts Water 90 parts The release layer was applied under the drying conditions of 90 ° C./30 sec. (Actinic ray curable compound) Film thickness 7.0 μm Shin-Nakamura Chemical Co., Ltd. A-9300 / Shin-Nakamura Chemical Co., Ltd. EA-1020 = 35 / 11.75 parts Reaction initiator Irgacure 184 Nippon Ciba Geigy Co., Ltd. 5 parts Actinic ray curable compound Layer Resin 1 48 parts Dainippon Ink Surfactant F-179 0.25 parts Toluene 500 parts Actinic ray curable compound after coating is 90 ° C / 30sec.
And then photocured with a mercury lamp (300 mJ / cm ² ). (Intermediate layer forming coating liquid) Film thickness 1.0 μm Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: S-REC BX-1] 3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX Made in Japan Polyurethane] 1.5 parts Methyl ethyl ketone 90 parts After application, the curing agent was cured at 50 ° C. for 24 hours. (Adhesive layer forming coating liquid) Film thickness 0.5 μm Urethane-modified ethylene ethyl acrylate copolymer [Toho Chemical Industry Co., Ltd .: Hitec S6254B] 8 parts Polyacrylic ester copolymer [Nippon Pure Chemical Co., Ltd.] : Julimer AT510] 2 parts Water 45 parts Ethanol 45 parts After application, it was dried at 70 ° C./30 sec. Further, the actinic ray-curable transfer foil 1 having the above-mentioned structure was used on the image receptor or the transparent resin layer on which images and characters were recorded, and the scale-pigment-containing layer.
Using a heat roller with rubber hardness 85, pressure 150kg
The transfer was performed by applying heat for 1.2 seconds at / cm ² . [Example 3] <Preparation of optical variable element transfer foil 1> (Release layer forming coating solution) Film thickness 0.2 μm Polyvinyl alcohol (GL-05) (Nippon Gosei Kagaku KK) 10 parts Water 90 parts After coating, it was dried at 90 ° C./30 sec. (Optical conversion element layer) Film thickness 2 μm (Intermediate layer forming coating liquid) Film thickness 1.0 μm Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: S-REC BX-1] 3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX Nippon Polyurethane] 1.5 parts Methyl ethyl ketone 90 parts After application, 90 ° C./30 Sec
After the coating, the curing agent was cured at 50 ° C. for 24 hours. (Adhesive layer forming coating liquid) Film thickness 0.5 μm Urethane-modified ethylene ethyl acrylate copolymer [Toho Chemical Industry Co., Ltd .: Hitec S6254B] 8 parts Polyacrylic ester copolymer [Nippon Pure Chemical Co., Ltd.] : Julimer AT510] 2 parts Water 45 parts Ethanol was applied and dried at 70 ° C./30 Sec. Further, the surface temperature of the image receiving member on which the image and the characters are recorded is set to 2 by using the optical changing element transfer foil 1 having the above-mentioned configuration.
Transfer was performed by applying heat at a pressure of 150 kg / cm ² for 1.2 seconds using a heat roller heated to 00 ° C. and having a rubber hardness of 5 cm and a diameter of 85 cm.

Next, regarding the present inventions 6 to 21 of the IC cards shown in Table 1 prepared in this example, the surface roughness, the image printability, and the high temperature storability are shown in comparison with Comparative examples 1 to 5. <Measurement of surface roughness> The surface roughness of the created card (text, before image formation) is measured by a surface roughness meter (RST / PLUS WY
(Manufactured by CO). In the present inventions 6 to 21, the height difference of the card surface is within 20 μm, that is, ± 10 μm.
Within) was a practical level, and Comparative Examples 1 to 5 were all practical levels. <Image printability> The formability after forming the face image and the character information was evaluated in five levels.

5: The peripheral portion of the chip is clean without any blurring of characters or images.

4: Characters and images are not blurred in the peripheral portion of the chip, but the characters and images are slightly difficult to see due to unevenness.

3: Characters and image blurring are seen around the chip.

2: There is a portion in the peripheral portion of the chip where characters and images are not formed at all.

1: There are many parts not having the characters and images at all in addition to the peripheral part of the chip.

The inventions 6 to 21 were practical levels at 4 and 5, but the comparative examples 1 to 5 were practical levels at 1 and 2. <Evaluation of High-Temperature Preservability> The personal authentication card thus prepared was left on a dashboard for 3 days in a car closed in the summer, and the surface of the card was observed.

The evaluation was visually conducted according to the following evaluation items.

[0168] 5: No change from the initial card 4: The card is slightly warped.

3: A large warp occurs on the card and the card rises.

2: Peeled at the interface between the adhesive and the top sheet or back sheet. Or the protective layer is peeled off.

1: The adhesive of the card base material is melted and peeled off.

The inventions 6 to 21 were practical levels at 4 and 5, but the comparative examples 1 to 5 were practical levels at 1 and 2.

[0173]

【table】

[0174]

As described above, according to the first aspect of the present invention, by adjusting the temperature of the laminating roller and adhering the laminating rollers, the warp of the IC card is reduced and the surface of the card is smoothed, so that the printability is improved. (Density decrease, printing loss) is good.

According to the second aspect of the invention, since the temperature difference between the laminating roller and the roller is 0 ° C. or more and 100 ° C. or less, the warpage of the IC card is reduced, and the card surface is smoothed, so that the printability is improved. (Density decrease, printing loss) is good. Further, even when an adhesive having a low melting temperature is used, the storage stability and heat resistance after forming into a card are improved.

According to the third aspect of the present invention, the warp of the IC card is further reduced by bonding the back roller portion, then heating by the heating roller and heating and pressurizing by the caterpillar press portion. Is smooth, and the printability (decrease in density, printing loss) is good. Further, even when an adhesive having a low melting temperature is used, the storage stability and heat resistance after forming into a card are improved.

In the invention described in claim 4, by defining the temperature range of the roller pair, the warp of the IC card is further reduced, the surface of the card is made smoother, and the printability (decrease in density, missing print) is improved. It is good. Further, even when an adhesive having a low melting temperature is used, the storage stability and heat resistance after forming into a card are improved.

According to the invention of claim 5, the temperature of the roller of the sheet material on the image receiving layer side is lower than the temperature of the roller of the sheet material on the writing layer side, so that the surface of the image receiving layer side is damaged by heat. It is preferable that writing is performed by a thermal transfer method such as sublimation thermal transfer and melt thermal transfer, or an inkjet method.

In the invention described in claim 6, before the first sheet material and the second sheet material are pasted together, the coated adhesive layer of one sheet material is reheated to be pasted together. Occasionally, insufficient heating is eliminated, and the adhesive around the IC chip, antenna, and reinforcing plate flows, and the IC card can be smoothed.

In the invention according to claim 7, the reheating temperature is about 80 to 120 ° C., and the adhesive layer is reheated without damaging the surface of the sheet material by heat.
Insufficient heating can be eliminated when pasting, and the IC card can be smoothed.

According to the eighth aspect of the invention, by using the hot-melt moisture-curable adhesive, low-temperature adhesion is possible and the surface of the sheet material can be prevented from being damaged by heat.

In the invention described in claim 9, the viscosity of the hot-melt moisture-curable adhesive at 130 ° C. is 2000 m.
It is not less than Ps and not more than 40,000 mPs, it is possible to suppress the generation of bubbles at the time of sticking, and the coating property is good, so that smoothing can be achieved.

According to the tenth aspect of the invention, the hot-melt moisture-curable adhesive has a melting temperature of 50 ° C. or higher and 70 ° C. or lower, so that low-temperature adhesion is possible and the surface of the sheet material is damaged by heat. Can be prevented, and the storage stability and heat resistance after card formation are improved.

According to the eleventh aspect of the present invention, quick and excellent bonding is possible.

According to the twelfth aspect of the present invention, by performing hot pressing and then cooling pressing, the storage stability and heat resistance after card formation are improved.

According to the thirteenth aspect of the present invention, by cutting the bonded product into a sheet shape and punching it into a card shape, positioning and the like can be made simple and accurate, and the punching accuracy of the IC card is improved.

According to the fourteenth aspect of the present invention, the format printing is facilitated by performing the format printing on one of the first sheet material and the second sheet material and punching it into a card shape.

According to the fifteenth aspect of the invention, the IC card can be thinned by defining the ratio of the resin thickness from the antenna to the sheet material close to the antenna and the resin thickness between the two sheet materials. .

According to the sixteenth aspect of the present invention, the thickness of the resin from the antenna to the sheet material close to the antenna is 30 μm or less, and the IC card can be made thin.

In the seventeenth aspect of the present invention, the IC chip is reinforced by the reinforcing plate, and the mesh sheet having a two-dimensional mesh structure having a mesh-like opening on at least one of the upper part and the lower part of the IC chip is removed. As a result, the IC card can be made thin and smooth.

According to the eighteenth aspect of the present invention, the mesh sheet having a two-dimensional mesh structure having openings in a mesh shape on the upper portion or the peripheral portion of the IC chip is removed.
The card can be made thin and smooth.

According to the invention described in claim 19, personal identification information including a name and a face image is provided, and a writing layer capable of writing is provided in a part of the personal identification information. Certificate, passport, alien registration card, library card, cash card, credit card, employee ID,
It can be used for employee ID, membership ID, medical card and student ID.

According to the twentieth aspect of the invention, since the transparent protective layer is provided on the upper surface on which the personal identification information is provided, scratches can be prevented and durability can be improved.

In the twenty-first aspect of the invention, since the IC chip does not exist at the position overlapping the face image portion, smoothing can be performed and the printability of the face image is improved.

According to the twenty-second aspect of the invention, the IC card is a non-contact type, has a large storage capacity, and can improve security.

According to the twenty-third aspect of the present invention, the planar irregularity of the chip peripheral portion on the surface of the C card is within ± 10 μm, and the printability of the IC card is improved.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of an IC card production process.

FIG. 2 is a cross-sectional view of an image forming body of an IC card laminated product.

FIG. 3 is a diagram showing a first embodiment of a front sheet.

FIG. 4 is a diagram showing a first embodiment of a back sheet.

FIG. 5 is a diagram showing a second embodiment of a back sheet.

FIG. 6 is a diagram showing a printed pattern.

FIG. 7 is a schematic view of an IC module of an IC card material.

FIG. 8 is a diagram showing the structure of a non-woven fabric type inlet.

FIG. 9 is a diagram showing the structure of a printed circuit board type inlet.

FIG. 10 is a perspective view of a front sheet or a back sheet.

FIG. 11 is a sectional view of the finished IC card.

FIG. 12 is a sectional view of the finished IC card.

FIG. 13 is a plan view of an IC card.

FIG. 14 is a plan view of an IC card.

FIG. 15 is a plan view of an IC card.

[Explanation of symbols]

1 First sheet material (back sheet) 2 Second sheet material (front sheet) 3 inlets 4 Laminating roller A First sheet material supply unit B Second sheet material supply unit C Adhesive supply section D Adhesive heating part E inlet supply section F Back roller part G Adhesive supply section H adhesive heating section I Heating roller section J Track Press Department K cutting section L punching part

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Ryoji Hattori             Konica Stock, 1 Sakura-cho, Hino City, Tokyo             In the company F-term (reference) 2C005 MA13 MB01 MB07 MB08 NA06                       PA18 PA22 RA04                 4J040 DA001 DA051 DE031 EB032                       EB132 EC002 ED001 EG001                       EL022 JA06 JA09 JB01                       JB04 LA02 LA08 NA20 PA30                 5B035 AA07 BA05 BB09 CA02 CA23

Claims (23)

[Claims] 1. A method of producing an IC card, wherein an IC module is provided in an adhesive layer interposed between a first sheet material and a second sheet material, the method comprising: A method for producing an IC card, characterized in that the sheet materials are bonded together by using a temperature-adjustable laminating roller. 2. A method for producing an IC card, wherein an IC module is provided in an adhesive layer interposed between a first sheet material and a second sheet material, wherein the first sheet material and the second sheet material are provided. The temperature difference between the laminating roller and the roller that bonds the sheet materials is 0 ° C or more 10
A method for producing an IC card, which is characterized in that the temperature is 0 ° C. or lower. 3. The IC card according to claim 1, wherein the back roller portion having the laminating roller is used for bonding, the heating roller is then used for heating, and the caterpillar press portion is for heating and pressing. How to create. 4. A roller 5 having a temperature range of the pair of rollers which is one side.
The method for producing an IC card according to claim 2, wherein the temperature is 0 to 120 ° C and the other roller is 20 to 80 ° C. 5. A sheet material of either the first sheet material or the second sheet material has an image receiving layer, the other sheet material has a writing layer, and the temperature of the roller on the image receiving layer side is the writing layer. The method for producing an IC card according to claim 4, wherein the temperature is lower than the temperature of the roller on the side. 6. An adhesive agent is applied to the first sheet material, and an adhesive agent is applied to the second sheet material.
6. The adhesive layer coated with one of the sheet materials is reheated before the sheet material and the second sheet material are attached to each other, according to any one of claims 1 to 5. How to make an IC card. 7. The method for producing an IC card according to claim 6, wherein the reheating temperature is about 80 to 120 ° C. 8. The method for producing an IC card according to claim 1, wherein the adhesive layer is a hot-melt moisture-curable adhesive. 9. The hot-melt moisture-curable adhesive of 13
Viscosity at 0 ° C is 2000mPs or more and 40,000mP
The method for producing an IC card according to claim 8, wherein the method is s or less. 10. The method for producing an IC card according to claim 8, wherein the hot-melt moisture-curable adhesive has a melting temperature of 50 ° C. or higher and 70 ° C. or lower. 11. The IC according to claim 1, wherein at least one caterpillar press portion is used on the same line for bonding.
How to make a card. 12. The caterpillar press section has a heating press section and a cooling press section.
1. The method for making the IC card described in 1. 13. The method for producing an IC card according to claim 1, wherein the bonded product is cut into a sheet shape before being punched out into a card shape. 14. The method according to claim 1, wherein one of the first sheet material and the second sheet material is subjected to format printing before punching into a card shape. How to make the described IC card. 15. An IC card in which a component including an IC module having an IC chip and an antenna is placed at a predetermined position between two facing sheet materials, and a resin containing a cured adhesive is filled therein. The thickness of the resin from the antenna to the nearby sheet material and 2
The ratio of resin thickness between two sheet materials is 0.01-0.1
An IC card characterized by being 5. 16. The IC card according to claim 15, wherein the thickness of the resin from the antenna to the sheet material near the antenna is 30 μm or less. 17. An IC card in which a component including an IC module having an IC chip and an antenna is placed at a predetermined position between two facing sheet materials, and a resin containing a cured adhesive is filled therein. The IC module has a reinforcing plate adjacent to the IC chip, the IC module is inserted in a state of being sandwiched by a mesh sheet having a two-dimensional mesh structure having openings in a mesh shape, and the upper or lower part of the IC chip. An IC card, wherein a mesh sheet having a two-dimensional mesh structure having openings in at least one of the meshes is removed. 18. The IC card according to claim 17, wherein a mesh sheet having a two-dimensional mesh structure having openings in a mesh shape on the upper portion or the peripheral portion of the IC chip is removed. 19. The first sheet material or the second sheet material has an image receiving layer on at least one surface thereof, personal identification information including a name and a face image is provided by a thermal transfer method or an inkjet method, and at least a part of the information is written. The IC card according to any one of claims 15 to 18, wherein a writable layer capable of being provided is provided. 20. The IC card according to claim 19, wherein a transparent protective layer is provided on the upper surface on which personal identification information including name and face image is provided, and the transparent protective layer is made of actinic ray curable resin. . 21. The IC chip according to claim 19, wherein the IC chip does not exist at a position overlapping with the face image portion.
IC card described in 0. 22. A non-contact type having a component including an IC module.
The IC card according to any one of 1. 23. The planar irregularity of the chip peripheral portion on the surface of the IC card is within ± 10 μm.
The IC card according to any one of claims 5 to 22.