JP2003157419A - Transfer foil for ic card, base sheet for ic card, method of manufacturing ic card and ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve problems such as print failure, etc., by recording an authentication identification image such as a face image or the like and an attribute information image on a sheet base material in advance, and then interposing an IC chip and an antenna to manufacture an IC card. SOLUTION: The transfer foil 1 for an IC card has a separation type layer 3, a resin layer 4 and an adhesive layer 5 on a supporter 2, and has an IC chip 6 and an antenna 7 in the resin layer 4. The base sheet 11 for the IC card has a resin layer 13 and an adhesive layer 14 on the sheet base 12, and has an IC chip 15 and an antenna 16 in the resin layer 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer foil for an IC card used in an IC card having an IC chip and an antenna, a base sheet for the IC card, a method for manufacturing the IC card, and the IC card.

[0002]

2. Description of the Related Art IC having an IC chip and an antenna
Since the card has a larger recording capacity than conventional magnetic cards and has arithmetic and logical processing functions not found in magnetic cards, credit cards, banking cards, high-value prepaid cards, electronic money cards, and various other information recording Its use is expanding as a medium and highly convenient card.

This IC card reads / writes data from / to an external device via an electric contact provided on the surface or an antenna inside the card. The IC card has a larger storage capacity than the magnetic card, and the security is greatly improved. In particular, a non-contact type IC card that has an IC chip inside the card and an antenna for exchanging information with the outside and does not have an electrical contact outside the card is a contact type IC card having an electrical contact on the card surface. Compared to this, it is excellent in security and is being used for applications such as ID cards that require high data confidentiality and forgery / alteration protection.

As such an IC card, for example, the first
There is one in which the sheet material and the second sheet material are bonded together via an adhesive, and the IC module having the IC chip and the antenna is enclosed in the adhesive layer.

[0005]

In the case of a personal identification card provided with an authentication identification image such as a face image and an attribute information image by a thermal transfer method or the like, the uneven portion of the IC chip has these information. There is a problem that printing is impeded by obstructing recording, and the planarity (smoothness) of the IC chip portion and the portion without the IC chip is an important issue.

Various proposals have been made to solve this problem, but they are still insufficient.

The present invention has been made in view of the above circumstances, and an authentication identification image such as a face image is previously formed on a sheet base material.
A transfer foil for an IC card and a base sheet for an IC card capable of solving problems such as defective printing by manufacturing an IC card with an IC chip and an antenna interposed after recording an attribute information image , An IC card manufacturing method and an IC card are provided.

[0008]

In order to solve the above-mentioned problems and to achieve the object, the present invention has the following constitution.

According to the invention described in claim 1, "on the support,
A release layer, a resin layer, and an adhesive layer are provided, and an IC is provided in the resin layer.
A transfer foil for an IC card, which has a chip and an antenna. Printing is performed by recording an authentication identification image such as a face image and an attribute information image on a sheet base material in advance, and then manufacturing an IC card equipped with an IC chip and an antenna using a transfer foil for the IC card. It is possible to improve the property.

According to a second aspect of the present invention, there is provided a transfer foil for an IC card according to the first aspect, which has a pattern pattern between the resin layer and the adhesive layer. Since the pattern pattern can be recognized as a watermark image by applying light from the back surface of the IC card after the IC card is formed, the security as the authenticity discrimination is also excellent.

According to a third aspect of the invention, there is provided a "base for an IC card, comprising a resin layer and an adhesive layer on a sheet base material, and an IC chip and an antenna in the resin layer. Material sheet. By recording the authentication identification image such as a face image and the attribute information image on the sheet base material in advance, and then manufacturing the IC card on which the IC chip and the antenna are mounted using the base material sheet for the IC card. The printability can be improved.

The invention according to claim 4 is a base sheet for an IC card according to claim 3, wherein a pattern pattern is provided between the resin layer and the adhesive layer. ]
Since the pattern pattern can be recognized as a watermark image by applying light from the back surface of the IC card after the IC card is formed, the security as the authenticity determination property is excellent.

According to a fifth aspect of the present invention, there is provided a method of manufacturing an IC card having an IC chip and an antenna between a first sheet base material and a second sheet base material. The transfer foil for the IC card according to claim 1 or 2 is transferred onto one of the sheet base material and the second sheet base material under heat and pressure, and the other sheet base material has an adhesive layer. And a sheet base material to which the IC chip and the antenna are transferred is heated and pressed through an adhesive layer to be bonded together. As a method of mounting the IC chip and the antenna, the IC chip and the antenna can be mounted by thermal transfer using a transfer foil for an IC card, and a large-scale adhesive coating machine or laminating machine is not required. In addition, it can be manufactured at low cost, and productivity can be improved by reducing loss caused by defective printing, and an IC card can be manufactured at low cost.

According to a sixth aspect of the invention, in the method of manufacturing an IC card having an IC chip and an antenna between the first sheet base material and the second sheet base material, the first sheet base material is provided. The base sheet for an IC card according to claim 3 or 4 is used as either one of the sheet base material and the second sheet base material, and the other sheet base material is heated via an adhesive layer. A method for manufacturing an IC card, which comprises applying pressure and bonding. As a method of mounting the IC chip and the antenna, it is possible to mount the IC chip and the antenna by sticking them together using a base sheet for an IC card, and a large-scale adhesive coating machine or laminating machine can be used. Since it is not necessary, it can be manufactured at low cost, and productivity can be improved by reducing loss generated by defective printing, and an IC card can be manufactured at low cost.

The invention according to claim 7 is an IC card manufactured by the method for manufacturing an IC card according to claim 5 or 6, wherein after the IC card is formed, the pattern pattern portion and the pattern pattern are formed. The difference in transmission density from the non-existing part is 0.
An IC card having a range of 03 to 0.50. Since the pattern pattern can be recognized as a watermark image by applying light from the back surface of the IC card after the IC card is formed, the security as the authenticity discrimination is also excellent.

The invention according to claim 8 is an IC card manufactured by the method for manufacturing an IC card according to claim 5 or 6, wherein at least one outer surface of the sheet base material has an outer surface. And an IC having a thermal transfer image-receiving layer
card. ], The authentication transfer image such as a face image and the attribute information image can be recorded by the thermal transfer image receiving layer.

The invention described in claim 9 is an IC card manufactured by the method for manufacturing an IC card according to claim 5 or 6, wherein the outer surface of at least one of the sheet base materials is An IC card having a writing layer. ], Various information can be written in the writing layer at the time of use.

The invention described in claim 10 is an "IC card manufactured by the method for manufacturing an IC card according to claim 5 or 6, wherein the IC card includes a personal identification including a name and a face image. An IC card comprising information, a transparent protective layer provided on the upper surface, and the transparent protective layer made of an actinic ray curable resin. ] And the transparent protective layer allows
The durability of the C card is improved.

The invention according to claim 11 is an "IC card manufactured by the method for manufacturing an IC card according to claim 5 or 6, wherein personal identification information including a name and a face image is provided in advance. Card created using a sheet base material. It is possible to prevent defective printing.

According to a twelfth aspect of the present invention, "The difference in transmission density between the pattern pattern portion and the portion without the pattern pattern after the IC card is in the range of 0.03 to 0.50. The IC card according to any one of claims 8 to 11. Since the pattern pattern can be recognized as a watermark image by applying light from the back surface of the IC card after the IC card is formed, the security as the authenticity discrimination is also excellent.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a transfer foil for an IC card, a base sheet for an IC card, a method for manufacturing an IC card, and an IC card according to the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to this embodiment.

First, the transfer foil for an IC card of the present invention will be described. 1 and 2 show a transfer foil for an IC card, FIG. 1 is a sectional view of the transfer foil for an IC card, and FIG. 2 is a plan view of the transfer foil for an IC card. The transfer foil 1 for an IC card according to this embodiment has a release layer 3, a resin layer 4, and an adhesive layer 5 on a support 2, and the IC chip 6 and the antenna 7 are integrated in the resin layer 4. Has a module.

3 and 4 show a transfer foil for an IC card according to another embodiment, FIG. 3 is a sectional view of the transfer foil for an IC card, and FIG. 4 is a plan view of the transfer foil for an IC card. is there. The transfer foil 1 for an IC card of this embodiment has the same structure as that of the embodiment shown in FIGS. 1 and 2, but has a pattern 8 between the resin layer 4 and the adhesive layer 5.

Next, the base sheet for an IC card of the present invention will be described. 5 and 6 show a base sheet for an IC card, FIG. 5 is a cross-sectional view of the base sheet for an IC card, and FIG. 6 is a plan view of the base sheet for an IC card. Base sheet 11 for IC card of this embodiment
Has a resin layer 13 and an adhesive layer 14 on the sheet base material 12, and the IC chip 15 and the antenna 16 are provided in the resin layer 13.
It has an IC module.

7 and 8 show a base sheet for an IC card of another embodiment, FIG. 7 is a sectional view of the base sheet for an IC card, and FIG. 8 is a base sheet for an IC card. It is a top view. The base sheet 11 for an IC card of this embodiment has the same structure as that of the embodiment shown in FIGS. 5 and 6, except that the pattern pattern 1 is provided between the resin layer 13 and the adhesive layer 14.
Have eight.

Next, an IC card manufacturing method and an IC card according to the present invention will be described. FIG. 9 is a schematic diagram showing a method for manufacturing an IC card using a transfer foil for an IC card. In this embodiment, the transfer foil 1 for the IC card of the embodiment of FIGS. 1 and 2 is attached to the first sheet base material 20.
The adhesive layer 5 is transferred under heat and pressure onto the first sheet base material 20, and the support 2 is peeled off by the release layer 3. And the adhesive layer 31
The second sheet base material 30 on which the
The resin foil 4 of the transfer foil 1 for a card is heated and pressed to adhere. In this way, the second sheet base material 30 is bonded to the first sheet base material 20 to which the IC chip 6 and the antenna 7 are transferred by heating and pressurizing it through the adhesive layer 31. The IC card 40 having the IC module of the IC chip 6 and the antenna 7 is manufactured between the sheet 20 and the second sheet base material 30.

In this way, the IC chip 6 and the antenna 7
As a method of mounting the IC card, the IC chip 6 and the antenna 7 can be mounted by thermal transfer using the transfer foil 1 for the IC card, and a large-scale adhesive coating machine or laminating machine is not required, so that the manufacturing cost is low. In addition, productivity can be improved by reducing loss caused by defective printing, and the IC card 40 can be produced at low cost.

Further, in this embodiment, FIG. 1 and FIG.
Although the transfer foil 1 for the IC card of the embodiment is used, the transfer foil 1 for the IC card of the embodiment of FIGS. 3 and 4 may be used. Since the pattern pattern can be recognized as a watermark image by shining light from the back side of the, the security as the authenticity discrimination is also excellent.

FIG. 10 is a schematic view showing a method for manufacturing an IC card using a base sheet for an IC card. In this embodiment, the adhesive layer 1 of the base sheet 11 for IC card is used.
4, the second sheet base material 30 is heat-pressed and adhered, and between the first sheet base material 20 and the second sheet base material 30,
The IC card 50 having the IC module of the IC chip 15 and the antenna 16 is manufactured.

As described above, the first sheet base material 20 has the I
As a method for mounting an IC chip and an antenna by using the base sheet 11 for a C card and heating and pressurizing the second sheet base material 30 on the other side through the adhesive layer 14, It is possible to mount the IC chip 15 and the antenna 16 by bonding with the base material sheet 11, and since a large-scale adhesive coating machine or laminating machine is not required, it is possible to manufacture at low cost, and it is caused by defective printing. The productivity is improved by reducing the loss, and the IC card 50 can be produced at low cost.

Further, in this embodiment, FIG. 5 and FIG.
Although the base sheet 11 for an IC card of the embodiment is used, the base sheet 11 for an IC card of the embodiment of FIGS. 7 and 8 may be used. Since the pattern pattern can be recognized as a watermark image by shining light from the back surface of the card 50, the security as the authenticity discrimination is also excellent.

Further, the IC cards 40, 50 of the present invention
It is preferable that the difference in transmission density between the pattern pattern portion and the portion without the pattern pattern is in the range of 0.03 to 0.50 after the IC card is formed, and the pattern pattern can be recognized as a watermark image. Also, it has excellent security as authenticity discrimination.

Further, the IC cards 40 and 50 manufactured in the embodiments of FIGS. 9 and 10 are as shown in FIG.
A thermal transfer image-receiving layer 60 may be provided on the outer surface of at least one of the sheet base materials of the first sheet base material 20 and the second sheet base material 30, and the thermal transfer image-receiving layer 60 allows authentication and identification of facial images and the like. Images and attribute information images can be recorded.

Further, the IC cards 40 and 50 manufactured in the embodiments of FIGS. 9 and 10 are as shown in FIG.
A writing layer 61 may be provided on at least one outer surface of the sheet base material of the first sheet base material 20 or the second sheet base material 30, and the writing layer 61 may be provided with various information at the time of use. Can be listed.

Further, the IC cards 40 and 50 manufactured in the embodiments of FIGS. 9 and 10 are as shown in FIG.
The thermal transfer image receiving layer 60 is provided with personal identification information 62 including a name and a face image, and a transparent protective layer 63 is provided on the upper surface. The transparent protective layer 63 is made of an actinic ray curable resin, and the transparent protective layer 63 improves the durability of the IC cards 40 and 50.

The IC cards 40 and 50 can also be made by using a sheet base material in which the personal identification information including the name and face image is previously provided on the thermal transfer image receiving layer 60. Also,
It is preferable that the IC cards 40 and 50 also have a pattern pattern.

Next, a transfer foil for the IC card of the present invention,
The base sheet for an IC card, the method for manufacturing the IC card, and the configuration of the IC card will be described in more detail. [Transfer Foil with IC Chip and Antenna] IC of the Present Invention
The transfer foil for an IC card having a chip and an antenna coil preferably has a release layer, a resin layer, and an adhesive layer on the support. In addition, an intermediate layer between the resin layer and the adhesive layer,
It is preferably composed of at least one of a barrier layer and a primer layer. (Support for transfer foil) Examples of the support include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene terephthalate / isophthalate copolymers, polyethylene, polypropylene,
Polyolefin resins such as polymethylpentene, polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene, ethylene-4 fluoroethylene copolymer, and other polyfluorinated ethylene resins, polyamides such as nylon 6 and nylon 6.6 , Polyvinyl chloride, vinyl chloride / vinyl acetate copolymer, ethylene / vinyl acetate copolymer, ethylene /
Vinyl alcohol copolymer, polyvinyl alcohol, vinyl polymer such as vinylon, cellulose triacetate, cellulosic resin such as cellophane, methyl polymethacrylate,
Acrylic resins such as ethyl polymethacrylate, ethyl polyacrylate, butyl polyacrylate, etc., polystyrene, polycarbonate, polyarylate, synthetic resin sheets such as polyimide, or fine paper, thin paper, glassine paper,
Examples include paper such as sulfuric acid paper and the like, single-layered bodies such as metal foils, and laminated bodies of two or more layers thereof.

The thickness of the support of the present invention is 10 to 200.
μm, preferably 15 to 80 μm. If it is 10 μm or less, the support is broken during transfer, which is a problem.
Polyethylene terephthalate is preferred in the specific release layer of the present invention. (Release layer of transfer foil) As the release layer, a resin having a high glass transition temperature such as acrylic resin, polyvinyl acetal resin, polyvinyl butyral resin, waxes, silicone oils, fluorine compounds, polyvinylpyrrolidone having water solubility Resin, polyvinyl alcohol resin, Si-modified polyvinyl alcohol, methyl cellulose resin, hydroxy cellulose resin, silicone resin, paraffin wax, acrylic modified silicone, polyethylene wax, ethylene vinyl acetate, and other resins can be mentioned. In addition, polydimethylsiloxane and its modified products , Polyester modified silicone, acrylic modified silicone, urethane modified silicone, alkyd modified silicone, amino modified silicone, epoxy modified silicone, polyether modified silicone, etc. Yl or resin, or a cured product,
Etc. Examples of other fluorine-based compounds include fluorinated olefins and perfluorophosphate ester-based compounds. Preferred olefin compounds include dispersions of polyethylene, polypropylene, etc., long-chain alkyl compounds such as polyethyleneimine octadecyl, etc. Of these release agents, those having poor solubility can be used by dispersing them.

When two transfer foils are transferred, <a thermoplastic elastomer may be added. Specific examples of thermoplastic elastomers include styrene type (styrene block copolymer (SBC)), olefin type (TP), urethane type (T
PU), polyester type (TPEE), polyamide type (TPAE), 1,2-polybutadiene type, vinyl chloride type (T
PVC), fluorine-based, ionomer resin, chlorinated polyethylene, silicone-based, and the like. Specifically, 1996
It is described in "12996 Chemical Products" (Chemical Industry Daily), etc., for the fiscal year.

A thermoplastic elastomer having a tensile elongation of 100% or more, which is preferably used in the present invention and comprises a block polymer of polystyrene and a polyolefin, is a thermoplastic elastomer composed of a block of styrene and a linear or branched saturated alkyl group having 10 or less carbon atoms. It refers to a plastic resin (hereinafter also referred to as a thermoplastic resin S1). In particular, styrene-butadiene-styrene (SBS), styrene-isoprene-styrene (SIS), styrene-ethylene / butylene-styrene (SEBS), styrene-ethylene / which are block polymers having a polystyrene phase and a hydrogenated phase of polyolefin. Examples thereof include propylene-styrene (SEPS) and styrene-ethylene / propylene (SEP) block polymers.

If desired, a thermosetting resin layer may be used between the release layer of the present invention and the resin layer or the actinic ray curable layer. Specific examples thereof include polyester resin, acrylic resin, epoxy resin, xylene resin, guanamine resin, diallyl phthalate resin, phenol resin, polyimide resin, maleic acid resin, melamine resin, urea resin, polyamide resin, urethane resin and the like. (Resin foil resin layer) As the resin layer, polyvinyl butyral resin, polyurethane resin, polyamide resin, polyester resin, epoxy resin, novolac resin, styrene, paramethylstyrene, vinyl monomer such as methacrylic acid ester, acrylic acid ester, etc. Alternatively, any other high-molecular polymer such as cellulose-based, thermoplastic polyester, natural resin, etc. may be used in combination. Also, in addition, Kiyoshi Akamatsu supervised, "Practical technology of new photosensitive resin", (CMC, 1987)
Year) or “10188 chemical products” pp. 657-767 (Kagaku Kogyo Nippo Co., Ltd., 1988).

In the present invention, it is preferable to provide a light or thermosetting layer for the purpose of encapsulating the IC chip and the antenna. The light or / thermosetting layer is not particularly limited as long as it is a material composed of the composition described above. The thickness of the transparent resin layer is preferably equal to or greater than the thickness of the IC chip and the antenna. When the reinforcing plate is installed on the IC chip, it is preferable that the reinforcing plate has a thickness necessary for the joining point between the reinforcing plate and the IC chip or the antenna, or more.

The resin layer may be formed by laminating a plurality of layers. (IC Chip and Antenna) The IC chip in the present invention is a memory only or a microcomputer in addition to it. In some cases, the electronic component may include a capacitor. The present invention is not limited to this and is not particularly limited as long as it is an electronic component necessary for the information recording member. As the antenna, a coil formed by winding a copper wire, a conductor paste such as a silver paste printed on an insulating substrate in a spiral shape, a coil formed by etching a metal foil such as a copper foil, and the like are used.

The IC chip and the antenna are joined by a conductive adhesive such as silver paste, copper paste, carbon paste (EN-4000 series of Hitachi Chemical Co., Ltd., XAP series of Toshiba Chemical Co., etc.) or anisotropic conductive film. A method of using (Anisolum manufactured by Hitachi Chemical Co., Ltd.), or a method of performing solder bonding or ACF bonding is known, but any method may be used. (Adhesive layer of transfer foil) As the adhesive layer, as a heat-adhesive resin, ethylene vinyl acetate resin, ethyneethyl acrylate resin, ethylene acrylic acid resin, ionomer resin, polybutadiene resin, acrylic resin, polystyrene resin,
Examples thereof include polyester resins, olefin resins, urethane resins, tackifiers (for example, phenol resins, rosin resins, terpene resins, petroleum resins, etc.), and copolymers or mixtures thereof may be used, with a thickness of 0.1 to 10 μm. preferable. Specifically, as the urethane-modified ethylene ethyl acrylate copolymer, Hitech S-6254, S-6254B, S-3129 and the like manufactured by Toho Chemical Industry Co., Ltd. are commercially available, and as the polyacrylic acid ester copolymer, JULIMAR AT-210 and AT-5 manufactured by Nippon Pure Chemical Co., Ltd.
10, AT-613, plus size L-201, SR-102, SR-103, J-4 manufactured by Kyogo Chemical Industry Co., Ltd.
Etc. are commercially available.

The weight ratio of the urethane-modified ethylene ethyl acrylate copolymer to the polyacrylic acid ester copolymer is preferably 9: 1 to 5: 5, and the thickness of the adhesive layer is 0.1 to 5.
1.0 μm is preferable. [Base Material Sheet for IC Card] As the first sheet base material or the second sheet base material used for the base material sheet for IC card, the same material as the support for the transfer foil can be used.

In addition, in the present invention, from the viewpoint of card substrate transportability due to shrinkage and warpage of the support due to heat, 150 ° C./30 mi as a sheet member in addition to the low temperature adhesive.
The heat shrinkage in n is preferably 1.2% or less in the longitudinal direction (MD) and 0.5% or less in the transverse direction (TD). In addition, an easy contact treatment may be performed on the support to improve adhesion in post-processing, and an antistatic treatment may be performed to protect the chip.

Specifically, U2 series, U3 series, U4 series, U manufactured by Teijin DuPont Films Ltd.
L series, CRYSPER G series manufactured by Toyobo Co., Ltd., E00 series, E20 series, E22 series, X20 series, E40 series, and E60 series QE series manufactured by Toray Industries, Inc. can be preferably used.

The base sheet for an IC card of the present invention is
A cushion layer may be provided in addition to the image receiving layer for forming the face image of the card user. An image element is provided on the surface of the personal authentication card base, and an authentication identification image such as a face image,
It may be provided with at least one selected from the attribute information image and format printing, or may be a white card having no printed portion at all. (Resin Layer and Adhesive Layer of Base Sheet for IC Card) The same resin layer and adhesive layer as those of the above [IC chip, transfer foil with antenna mounted] can be used. [Transfer Method] Transfer of the IC chip and the transfer foil having the antenna mounted thereon to the sheet base material is usually performed by a means such as a thermal head, a heat roller, a hot stamping machine or the like that can apply pressure while heating. [Method of bonding] Bonding is performed by using a means such as a thermal head, a heat roller, a hot stamping machine or the like that can apply pressure while heating. [Pattern pattern] The pattern pattern of the present invention is preferably provided between the resin layer and the adhesive layer. The pattern pattern can be added by printing or transferring. For example, it can be applied by offset printing, gravure printing, flexographic printing, letterpress printing, transfer foil transfer and the like.

The pattern pattern thus printed can be observed as a watermark image after being formed into a card, and is useful as a true / false determination property.

The pattern pattern varies depending on the method of application, but usually, for example, pigments such as titanium white, magnesium carbonate, zinc oxide, barium sulfate, silica, talc, clay, calcium carbonate, carbon black and the like are used as the acrylic resin. Those dispersed in a binder such as polyester resin, petroleum resin and urethane resin can be used.

It is more effective to set the reflection density and opacity of the pattern pattern in a specific range in relation to the characteristics of the front and back sheets. Further, it is preferable for the watermark image that the difference in transmission density between the pattern pattern portion and the portion without the pattern pattern is within a range of 0.03 to 0.50 after forming the IC card, and more preferably 0.0.
It is 5 to 0.35.

If the difference between the transmission densities is higher than 0.50, the densities are too high for the watermark, and the personal identification information such as the name or face image on the outer surface is difficult to recognize. On the other hand, when the value is lower than 0.03, the watermark is hard to see, and the effect as the authenticity discrimination is lost. [Thermal Transfer Image Receiving Layer] The thermal transfer image receiving layer can be formed of a binder and various additives. The image-receiving layer in the present invention forms a gradation information-containing image by a sublimation type thermal transfer system and forms a character information-containing image by a sublimation type thermal transfer system or a fusion type thermal transfer system. The dyeability of the sublimable dye and the adhesion of the hot-melt ink should be good. To impart such special properties to the image receiving layer, as described below,
It is necessary to appropriately adjust the types of binders and various additives and their blending amounts.

The components forming the image receiving layer will be described in detail below.

As the binder for the image-receiving layer in the present invention, a generally known binder for sublimation type thermal transfer recording image-receiving layer can be appropriately used. Main binders are vinyl chloride resins, polyester resins,
Various binders such as polycarbonate resin, acrylic resin, polystyrene resin, polyvinyl acetal resin, polyvinyl butyral resin can be used.

However, if there is a practical requirement for the image formed by the present invention (for example, the issued ID card is required to have a predetermined heat resistance), the requirement should be met. It is necessary to consider the type or combination of binders. Taking heat resistance of an image as an example, if heat resistance of 60 ° C. or higher is required, Tg should be taken into consideration in consideration of bleeding of a sublimable dye.
It is preferable to use a binder having a temperature of 60 ° C. or higher.

When forming the image receiving layer, it may be preferable to contain, for example, a compound containing a metal ion, if necessary. Especially when the heat transfer compound reacts with the metal ion-containing compound to form a chelate.

Examples of the metal ions constituting the metal ion-containing compound include divalent and polyvalent metals belonging to Groups I and VIII of the Periodic Table, among which Al, Co, Cr, Cu, Fe, Mg, Mn, Mo, N
i, Sn, Ti, Zn, etc. are preferable, and particularly Ni, Cu,
Co, Cr, Zn and the like are preferable. The compound containing these metal ions is preferably an inorganic or organic salt of the metal and a complex of the metal. To give a specific example, N
A complex represented by the following general formula and containing i2 ⁺ , Cu2 ⁺ , Co2 ⁺ , Cr2 ⁺ and Zn2 ⁺ is preferably used.

[M (Q1) k (Q2) m (Q3
) N] p + p (L-) However, in formula, M represents a metal ion, Q1, Q2,
Q3 represents a coordination compound capable of coordinatively bonding with a metal ion represented by M, and these coordination compounds are selected from coordination compounds described in, for example, “Chelate Chemistry (5) (Nankodo)”. can do. Particularly preferably,
Coordination compounds having at least one amino group that forms a coordinate bond with a metal can be mentioned, and more specifically, ethylenediamine and its derivatives, glycinamide and its derivatives, picolinamide and its derivatives can be mentioned.

L is a counter anion capable of forming a complex,
Examples thereof include inorganic compound anions such as Cr, SO4, and ClO4, and organic compound anions such as benzenesulfonic acid derivatives and alkylsulfonic acid derivatives. Particularly preferred are tetraphenylboron anion and its derivatives, and alkylbenzenesulfonic acid anion and its derivatives. is there. k represents an integer of 1, 2 or 3, m is 1,
2 or 0, and n represents 1 or 0, which are determined depending on whether the complex represented by the above general formula is tetradentate or hexadentate, or whether the complex of Q1, Q2 and Q3 Determined by the number of ligands. p represents 1, 2 or 3.

Examples of this type of metal ion-containing compound include
Mention may be made of those exemplified in US Pat. No. 4,987,049. When the above-mentioned metal ion-containing compound is added, the addition amount is 0.5 to
Preferably ^{20g / m 2, 1~15g / m} 2 is more preferable.

A releasing agent is preferably added to the image receiving layer. As the effective release agent, those which are compatible with the binder used are preferable, and specifically, modified silicone oil and modified silicone polymer are typical,
Examples thereof include amino-modified silicone oil, epoxy-modified silicone oil, polyester-modified silicone oil, acrylic-modified silicone resin, urethane-modified silicone resin and the like. Among them, polyester-modified silicone oil prevents fusion with the ink sheet,
It is particularly excellent in that it does not hinder the secondary workability of the image receiving layer. The secondary processability of the image receiving layer refers to the writing property with a magic ink, the laminating property which becomes a problem when protecting the formed image, and the like. In addition, fine particles such as silica are also effective as the release agent. When the secondary workability is not a problem, it is effective to use a curable silicone compound as a measure for preventing fusion.
Ultraviolet ray curable silicone, reaction curable silicone and the like are available, and a great releasing effect can be expected. [Writing Layer] The writing layer is a layer that allows writing on the back surface of the ID card. As such a writing layer, for example, an inorganic fine powder such as calcium carbonate, talc, diatomaceous earth, titanium oxide or barium sulfate may be contained in a film of a thermoplastic resin (polyolefin such as polyethylene or various copolymers). Can be formed. It can be formed by the "writing layer" described in JP-A-1-205155. [Transparent Resin Layer] As the transparent resin layer of the present invention, a thermosetting resin is used, and the thermosetting resin composition for protecting the image recording body of the IC card is, for example, an epoxy type, polyester type, acrylic type or the like. It is possible to use a mixture of a resin with a curing agent, a curing catalyst, a leveling agent, and other additives.

The composition of the polyester resin is preferably a composition mainly containing an aromatic dicarboxylic acid such as terephthalic acid or isophthalic acid as a dicarboxylic acid component and an aliphatic diol such as ethylene glycol or neopentyl glycol as a diol component. , These include aliphatic dicarboxylic acids such as adipic acid and azelaic acid, trivalent or higher carboxylic acids such as trimellitic acid and pyromellitic acid, and trivalent or higher valency such as trimethylolethane, trimethylolpropane and pentaerythritol. Those containing a small amount of alcohol and the like are more preferable because the melt fluidity and the crosslinking reactivity are improved.

The average degree of polymerization of the polyester resin is 5
Those in the range of -50 are preferred. If it is lower than this, sufficient strength cannot be obtained when it is made into a film, and if it is higher than this, crushing becomes difficult. Next, as the curing agent, when the terminal group of polyester is -OH type, there are an isocyanate compound and a melamine resin, for example, ε-caprolactam block isocyanate and methylated melamine. Examples of the -COOH type terminal group include epoxy resin and triglycidyl isocyanurate.

Specifically, the photocurable resin layer as the protective layer for the image recording material is made of a material having an addition polymerization property or a ring-opening polymerization property, and the addition polymerization compound is a radical polymerization compound. For example, the photopolymerization (thermopolymerization) described in Japanese Patent Application Laid-Open No. 7-159998, Japanese Patent Publication No. 7-31399, Japanese Patent Application No. 7-231444, and Japanese Patent Application No. 7-231444. (Including also)) A photocurable material using a composition may be used. As the addition polysynthetic compound, a cationic polymerization type photocurable material is known, and recently, a cationic photopolymerization type photocurable material sensitized to a long wavelength region longer than visible light is also disclosed in, for example, JP-A-6- It is disclosed in Japanese Patent Publication No. 43633. A composition is disclosed in Japanese Patent Application Laid-Open No. 4-181944 as a photopolymerization material of hybrid type. Specifically, it is a photocurable layer containing any of the above-mentioned cationic initiator, cationically polymerizable compound, radical initiator, and radically polymerizable compound, and any photocurable layer is used for the purpose of the present invention. I don't mind. [Radical Polymerization Initiator] As the radical polymerization initiator,
Triazine derivatives described in JP-B-59-1281, JP-B-61-9621 and JP-A-60-60104, JP-A-59-1504 and JP-A-61-2.
Organic peroxides described in various publications such as 43807, JP-B-43-23684, JP-B-44-6413, JP-B-44-6413 and JP-B-47-1604, and U.S. Pat. Diazonium compounds described in US Pat. No. 2,848,328.
No. 2,852,379 and 2,940,85
No. 3, organic azide compounds described in each specification, JP-B-36-
22062, JP37-13109, JP38
-18015, Japanese Patent Publication No. 45-9610 and the like, ortho-quinone diazides described in Japanese Patent Publication No. 55-391.
62, JP-A-59-14023 and the like, and "Macromolecules,"
Various onium compounds described in Volume 10, page 1307 (1977), azo compounds described in JP-A-59-142205, JP-A-1-54440, European Patent 109,851, European Patents. 126th,
No. 712, etc., “Journal of Imaging Science” (J.Imag.Sci.) ”, Volume 30, p. 174 (1986), Japanese Patent Application No. 4- 56831 Specification and Japanese Patent Application No. 4-8
(Oxo) sulfonium organoboron complex described in Japanese Patent No. 9535, titanocene described in JP-A-61-151197, and "coordination chemistry.
Review (Coordination Chemist
ry Review) ", Vol. 84, Nos. 85-277
Page) (1988) and transition metal complexes containing a transition metal such as ruthenium described in JP-A-2-182701, 2,4,5 in JP-A-3-209477.
-Triarylimidazole dimer, carbon tetrabromide, organic halogen compounds described in JP-A-59-107344, and the like. These polymerization initiators are preferably contained in the range of 0.01 to 10 parts by weight with respect to 100 parts by weight of the compound having a radically polymerizable ethylenic unsaturated bond.

The photosensitive composition containing a radical-polymerizable compound contains, as a thermal polymerization initiator of a radical-polymerizable monomer, a known radical-polymerization initiator generally used for polymer synthesis reaction by radical polymerization without particular limitation. Can be made. Here, the thermal polymerization initiator is a compound capable of generating a polymerizable radical by applying heat energy.

Examples of such compounds include 2,
2'-azobisisobutyronitrile, 2,2'-azobispropionitrile and other azobisnitrile compounds, benzoyl peroxide, lauroyl peroxide, acetyl peroxide,
T-Butyl perbenzoate, α-cumyl hydroperoxide, di-t-butyl peroxide, diisopropyl peroxydicarbonate, t-butyl peroxyisopropyl carbonate, peracids, alkyl peroxycarbamates, nitrosoaryl acylamine Such as organic peroxides such as potassium persulfate, potassium persulfate, ammonium persulfate, potassium perchlorate and the like, diazoaminobenzene, p-nitrobenzenediazonium, azobis-substituted alkanes, diazothioethers, arylazosulfones, etc. Azo or diazo compounds, nitrosophenyl urea, tetramethyl thiuram disulfide, diaryl disulfides, dibenzoyl disulfide, tetraalkyl thiuram disulfides, dialkyl xanthate disulfides Aryl sulfinic acids, arylalkyl sulfonic acids, it may be mentioned 1-alkanoic sulfinic acids and the like.

Particularly preferred among these are compounds which are excellent in stability at room temperature, have a high decomposition rate upon heating, and become colorless upon decomposition, and the initiator is usually used in all polymerizable compositions. 0.1 to 30% by weight is preferable, 0.5 to 20
A range of weight% is more preferable. [Radical Polymerization Photocurable Resin] The radical polymerizable compound contained in the radical polymerizable composition includes ordinary photopolymerizable compounds and thermopolymerizable compounds. The radical-polymerizable compound is a compound having a radical-polymerizable ethylenically unsaturated bond, and may be any compound as long as it has at least one radical-polymerizable ethylenically unsaturated bond in the molecule. , Oligomers,
Those having a chemical form such as a polymer are included. The radical-polymerizable compound may be used alone, or two or more kinds thereof may be used in combination at an arbitrary ratio in order to improve target properties.

Examples of the radically polymerizable compound having an ethylenically unsaturated bond include unsaturated carboxylic acids such as acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid and maleic acid, and salts and esters thereof.
Radical polymerizable compounds such as urethane, amide and anhydride, acrylonitrile, styrene, and various unsaturated polyesters, unsaturated polyethers, unsaturated polyamides and unsaturated urethanes can be mentioned.

Specifically, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, butoxyethyl acrylate, carbitol acrylate, cyclohexyl acrylate, tetrahydrofurfuryl acrylate, benzyl acrylate, bis (4-acryloxypolyethoxyphenyl) propane, Neopentyl glycol diacrylate, 1,6-hexanediol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, polyethylene glycol diacrylate, polypropylene glycol diacrylate, pentaerythritol triacrylate. , Pentaerythritol tetraacrylate, Acrylic acid derivatives such as pentaerythritol tetraacrylate, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, oligoester acrylate, N-methylol acrylamide, diacetone acrylamide, epoxy acrylate, methyl methacrylate, n-butyl methacrylate, 2-ethylhexyl methacrylate. , Lauryl methacrylate, allyl methacrylate, glycidyl methacrylate, benzyl methacrylate, dimethylaminomethyl methacrylate, 1,6-hexanediol dimethacrylate, ethylene glycol dimethacrylate, triethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, polypropylene glycol dimethacrylate, Trimethylol ethane trimethacrylate, trimethylol propane trimethacrylate, 2,2-bis (4-methacryloxy polyethoxy phenyl) methacrylamide derivatives such as propane, other, allyl glycidyl ether, diallyl phthalate,
Examples thereof include derivatives of allyl compounds such as triallyl trimellitate, and more specifically, Shinzo Yamashita, "Handbook of Crosslinking Agents", (1981, Taiseisha); Kiyomi Kato,
"UV / EB Curing Handbook (Raw Materials)" (1985)
Year, Polymer Society); Edited by Radtech, “UV / E”
Application and Market of B Curing Technology ", p. 79, (1989, CMC); Eiichiro Takiyama," Polyester Resin Handbook ", (1988, Nikkan Kogyo Shimbun), etc., or known in the industry. Radical polymerizable or crosslinkable monomers, oligomers and polymers can be used. The amount of the radically polymerizable compound added to the radically polymerizable composition is preferably 1 to 97% by weight,
More preferably, it is 30 to 95% by weight. [Acid-Crosslinking Photocurable Resin] The crosslinking agent used in the acid-crosslinking composition of the present invention is a compound that causes a crosslinking reaction by the acid generated from the specific compound of the present invention upon irradiation with actinic light or radiation. The cross-linking agent preferably used in this invention is a compound having two or more hydroxymethyl groups, alkoxymethyl groups, epoxy groups or vinyl ether groups in the molecule. Preferred are compounds in which these crosslinkable functional groups are directly bonded to the aromatic ring. Specific examples thereof include methylol melamine, resole resin, epoxidized novolac resin, and urea resin.
Further, compounds described in "Crosslinking Agent Handbook" (written by Shinzo Yamashita and Tosuke Kaneko, Taiseisha Co., Ltd.) are also preferable. In particular, a phenol derivative having two or more hydroxymethyl groups or alkoxymethyl groups in the molecule is preferable because the strength of the image area when an image is formed is good. Specific examples of such a phenol derivative include a resol resin.

However, these cross-linking agents are unstable to heat, and their storage stability after producing the image recording material is not so good. On the other hand, it has two or more hydroxymethyl groups or alkoxymethyl groups bonded to the benzene ring in the molecule and has a molecular weight of 1,200.
The following phenol derivatives have good stability during storage and are most preferably used in the present invention. The alkoxymethyl group preferably has 6 or less carbon atoms. Specifically, a methoxymethyl group, an ethoxymethyl group,
n-propoxymethyl group, isopropoxymethyl group, n
-Butoxymethyl group, isobutoxymethyl group, sec-
A butoxymethyl group and a t-butoxymethyl group are preferable.
Furthermore, an alkoxy-substituted alkoxymethyl group such as a 2-methoxyethoxymethyl group and a 2-methoxy-1-propoxymethyl group is also preferable. In particular,
JP-A-6-282067 and JP-A-7-64285
Examples thereof include compounds described in Japanese Patent Publication No. 632,003A1 and the like.

Other cross-linking agents preferably used in the present invention include aldehyde and ketone compounds. Preferred is a compound having two or more aldehydes or ketones in the molecule.

In the present invention, the crosslinking agent is used in an amount of 5 to 70% by weight, preferably 10 to 65% by weight, based on the total solid content of the image recording material. 5% by weight of crosslinking agent
If it is less than 70% by weight, the film strength of the image portion when an image is recorded is deteriorated, and if it exceeds 70% by weight, the stability during storage is not preferable. These crosslinking agents may be used alone or in combination of two or more kinds. [Cationic Polymerization Initiator] The initiator is preferably a cationic polymerization initiator, and specific examples thereof include aromatic onium salts. As the aromatic onium salt, a salt of a Group Va element of the periodic table, for example, a phosphonium salt (for example, triphenylphenacylphosphonium hexafluorophosphate), a salt of a Group VIa element, for example, a sulfonium salt (for example, triphenylsulfonium tetrafluoroborate). , Triphenylsulfonium hexafluorophosphate, tris (4-thiomethoxyphenyl) hexafluorophosphate, sulfonium and triphenylsulfonium hexisafluoroantimonate), and No. VII
A salt of a group a element such as an iodonium salt (eg, diphenyliodonium chloride) can be used.

The use of such an aromatic onium salt as a cationic polymerization initiator in the polymerization of epoxy compounds is disclosed in US Pat. Nos. 4,058,401 and 4,058.
69,055, 4,101,513 and 4,161,478.

Preferred cationic polymerization initiators include sulfonium salts of Group VIa elements. Among them, from the viewpoint of ultraviolet curability and storage stability of the ultraviolet curable composition, triarylsulfonium hexafluoroantimonate is preferable. Also, Photo Polymer Handbook (Photo Polymer Conversation Edition, Industrial Research Committee issue 1
989), pages 39 to 56, known photopolymerization initiators, and compounds described in JP-A-64-13142 and JP-A-2-4804 can be optionally used. [Cationic polymerization type photocurable resin] An epoxy type UV-curable prepolymer of a type (mainly epoxy type) in which polymerization is caused by cationic polymerization, and a monomer is a prepolymer containing two or more epoxy groups in one molecule. Can be mentioned. As such a prepolymer,
For example, alicyclic polyepoxides, polyglycidyl esters of polybasic acids, polyglycidyl ethers of polyhydric alcohols, polyglycidyl ethers of polyoxyalkylene glycols, polyglycidyl ethers of aromatic polyols, polyglycols of aromatic polyols. Examples thereof include hydrogenated compounds of glycidyl ethers, urethane polyepoxy compounds and epoxidized polybutadienes. These prepolymers may be used alone or in a mixture of two or more.

The content of the prepolymer having two or more epoxy groups in one molecule is preferably 70% by weight or more. As the cationically polymerizable compound contained in the cationically polymerizable composition, for example, the following (1) styrene derivative, (2) vinylnaphthalene derivative, (3) vinyl ethers, and (4) N-vinyl compounds may be used. Can be mentioned. (1) Styrene derivative For example, styrene, p-methylstyrene, p-methoxystyrene, β-methylstyrene, p-methyl-β-methylstyrene, α-methylstyrene, p-methoxy-β-
Methylstyrene etc. (2) Vinylnaphthalene derivative, for example, 1-vinylnaphthalene, α-methyl-1-vinylnaphthalene, β-methyl-1-vinylnaphthalene, 4
-Methyl-1-vinylnaphthalene, 4-methoxy-1-
(3) Vinyl ethers such as vinyl naphthalene, for example, isobutyl vinyl ether, ethyl vinyl ether, phenyl vinyl ether, p-methylphenyl vinyl ether, p-methoxyphenyl vinyl ether,
α-Methylphenyl vinyl ether, β-methyl isobutyl vinyl ether, β-chloroisobutyl vinyl ether, etc. (4) N-vinyl compounds such as N-vinylcarbazole, N-vinylpyrrolidone, N-vinylindole, N-vinylpyrrole, N-
Vinylphenothiazine, N-vinylacetanilide, N
-Vinylethylacetamide, N-vinylsuccinimide, N-vinylphthalimide, N-vinylcaprolactam, N-vinylimidazole and the like.

The content of the above cationically polymerizable compound in the cationically polymerizable composition is preferably 1 to 97% by weight, more preferably 30 to 95% by weight. [Hybrid photo-curable resin layer] Hybrid type (combination of radical polymerizable type and cationic polymerization type)
When is used, the composition is disclosed in JP-A-4-181944. Specifically, any one of the above-mentioned cationic initiator, cationically polymerizable compound, radical-based initiator, and radically polymerizable compound may be included. It is preferable to use. [Other Additives to Photocurable Resin Layer] <Sensitizer> The photosensitive composition of the present invention is a composition in which various sensitizers are combined to obtain light from the ultraviolet to near infrared region. It is possible to obtain a polymerizable composition having an extremely high sensitivity to the above and having an extremely high sensitivity. Specific examples of the sensitizer in the present invention include unsaturated ketones represented by chalcone derivatives and dibenzalacetone, 1,2-diketone derivatives represented by benzyl and camphorquinone, benzoin derivatives, and fluorene. Derivative, naphthoquinone derivative, anthraquinone derivative, xanthene derivative,
Thioxanthene derivative, xanthone derivative, thioxanthone derivative, coumarin derivative, ketocoumarin derivative, cyanine derivative, styryl derivative, merocyanine derivative,
Polymethine dyes such as oxonol derivatives, acridine derivatives, azine derivatives, thiazine derivatives, oxazine derivatives, indoline derivatives, azulene derivatives, azurenium derivatives, squarylium derivatives, porphyrin derivatives,
Tetraphenylporphyrin derivative, triarylmethane derivative, tetrabenzoporphyrin derivative, tetrapyrazinoporphyrazine derivative, phthalocyanine derivative,
Tetraazaporphyrazine derivative, tetraquinoxalyloporphyrazine derivative, naphthalocyanine derivative, subphthalocyanine derivative, pyrylium derivative, thiopyrylium derivative, tetraphyllin derivative, annulene derivative,
Examples include spiropyran derivatives, spirooxazine derivatives, thiospiropyran derivatives, metal arene complexes, organic ruthenium complexes, and more specifically, Nobu Okawara et al., "Dye Handbook" (1986, Kodansha), Nobu Okawara et al. "The Chemistry of Functional Dyes" (1981, CMC), edited by Chuzaburo Ikemori, "Special Functional Materials" (19
1986, CMC), and the dyes and sensitizers described in Japanese Patent Application No. 7-108045 and the like, but are not limited to these, in addition, to the light in the ultraviolet to the near infrared region Examples thereof include dyes and sensitizers that exhibit absorption, and two or more kinds of these may be used in an arbitrary ratio as needed. <Polymerization accelerator, chain transfer agent, etc.> A polymerization accelerator and a chain transfer catalyst can be added to the photosensitive composition of the present invention. Specific examples thereof include amines such as N-phenylglycine, triethanolamine, N, N-diethylaniline, U.S. Pat. No. 4,414,312 and JP-A-64-1.
Thiols described in 3144, JP-A-2-291561
Disulfides described in U.S. Pat. No. 3,558,32
2, thiones described in JP-A No. 64-17048, o-acylthiohydroxamates and N-alkoxypyridine thiones described in JP-A-2-291560. <Polymerization Inhibitor> In the radical-polymerizable composition containing the radical-polymerizable compound, a photo-curable resin layer may contain a polymerization inhibitor for the purpose of preventing polymerization during storage of the liquid. Specific examples of the thermal polymerization inhibitor that can be added to the radically polymerizable composition include p-methoxyphenol, hydroquinone, alkyl-substituted hydroquinone, catechol and te.
Examples thereof include rt-butylcatechol and phenothiazine. These thermal polymerization inhibitors are added in the range of 0.001 to 5 parts by weight with respect to 100 parts by weight of the compound having a radically polymerizable ethylenically unsaturated bond. Preferably. <Antistatic Agent> As the antistatic agent, a cationic surfactant, an anionic surfactant, a nonionic surfactant,
In addition to polymeric antistatic agents, conductive fine particles, etc.
Chemical products of No. 0 ”, Kagaku Kogyo Nippo Co., Ltd., compounds described in p875-876 and the like. <Surfactant> Further, in the image forming layer of the image forming material of the present invention, JP-A No. 62-251740 and JP-A No. 3-251740.
Nonionic surfactants as described in JP-A-208514 and the like, or JP-A-59-121044.
And amphoteric surfactants such as those described in JP-A-4-13149 and the like can be added.

Further, a surfactant such as silicone oil or a silicone-alkylene oxide copolymer (for example, L-5410 commercially available from Union Carbide Co.), a silicone-based activator such as those manufactured by Nippon Unicar, a silicone oil-containing agent. Examples thereof include aliphatic epoxides and silicon-containing monoepoxides. It is also possible to use Si-based additives described in "New Silicone and Its Applications" issued by Toshiba Silicone Co., Ltd. in 1994, "Special Silicone Reagent Catalog" issued by Asmax Co., Ltd. in 1996, etc. The addition amount is preferably 0.001 to 1% by weight. <Resin> In addition to the adhesive polymer, polyvinyl butyral resin, polyurethane resin, polyamide resin, polyester resin, epoxy resin, novolac resin, vinyl monomer such as styrene, paramethylstyrene, methacrylic acid ester, acrylic acid ester and cellulose type , Any other high-molecular polymer such as thermoplastic polyester and natural resin may be used in combination. In addition, in addition, Kiyoshi Akamatsu's supervision, "Practical Technology of New Photosensitive Resin," (CMC, 1987) and "10188 Chemical Products" pp. 657-767 (Kagaku Kogyo Nippo, 1988) You may use together the organic high molecular polymer of.

In the present invention, an unsaturated group-containing resin is particularly preferable, and is characterized in that it contains a radical or acid-polymerizable group, and the unsaturated group here means a glycidyl group, a (meth) acryloyl group, Represents a vinyl group and the like. The content of these high molecular weight polymers in the photosensitive composition is preferably in the range of 1 to 70% by weight, more preferably 5 to 50% by weight. <Coating Solvent> In the present invention, the coating solvent is not limited, and when a coating solvent is used, it is described in detail in “Solvent Handbook” published by Kodansha. There are no particular restrictions on the use of these organic solvents.

The photosensitive composition of the present invention further comprises an oxygen scavenger and a reducing agent such as dyes, organic and inorganic pigments, phosphines, phosphonates and phosphites, an antifoggant, an antifading agent and an antihalation agent according to the purpose. , Fluorescent whitening agents, colorants, bulking agents, plasticizers, flame retardants, antioxidants, UV absorbers, foaming agents, antifungal agents, additives that impart various properties such as magnetic substances, diluent solvents, etc. You may mix and use it. [Method of Forming Heat or Photocurable Resin Layer] When the heat or photocurable resin layer is formed on the image recording body, it is preferable to form it by a coating method or transfer foil.

When coating is selected as a method for protecting the image recording medium, conventionally known methods such as spin coating, wire bar coating, dip coating, felt coating, air knife coating, spray coating, air spray coating, electrostatic coating are used. Methods such as air spray coating, roll coating blade coating and curtain coating are used. At this time, the coating amount varies depending on the application, but is, for example, 0.05 to 50.0 g as solid content.
A coating amount of / m2 is preferable. Although the apparent sensitivity increases as the coating amount decreases, the film characteristics and chemical resistance of the image forming layer decrease.

As a method for curing after coating, any method for generating active electromagnetic waves can be used. For example,
Examples thereof include lasers, light emitting diodes, xenon flash lamps, halogen lamps, carbon arc lamps, metal halide lamps, tungsten lamps, mercury lamps and electrodeless light sources. Preferably a xenon lamp,
Examples of the light source include halogen lamps, carbon arc lamps, metal halide lamps, tungsten lamps, and mercury lamps. Can be used. [Active curing line] When a laser is used as a light source,
It is easy to reduce the exposure area to a very small size, and high-resolution image formation is possible. As a laser light source, any of an argon laser, a He-Ne gas laser, a YAG laser, a semiconductor laser and the like can be preferably used.

When photocuring is performed using actinic rays,
A means for stabilizing photocuring in a nitrogen stream under reduced pressure may be used. [Heat Treatment] Heat energy can be applied, and as a means, an oven, a heat roller, a hot stamp, a thermal head, a laser beam, an infrared flash, a hot pen or the like can be appropriately selected and used.

For protection of the heat- or photo-curable resin layer of the present invention, a transparent protective layer ribbon or transparent protective foil formed by coating on a heat resistant support such as a polyethylene terephthalate resin film is prepared in advance. Alternatively, it can be formed by thermal transfer using, for example, a thermal head or a thermal transfer roll. [Examples] Hereinafter, the present invention will be described in detail with reference to Examples, but the embodiments of the present invention are not limited thereto. In the following, "part" means "part by weight". (Preparation of Transfer Foil 1 with IC Chip) A transfer foil 1 with IC chip as shown in FIG. 14 was prepared. [Formation of release layer] As a support, the following formulation was applied on one side of polyethylene terephthalate (S-25) manufactured by DIAFOIL Hoechst Co., Ltd. by wire bar coating at 90 ° C.
The coating was performed under a drying condition of / 30 sec. The film thickness is
It was 0.2 μm.

Polyvinyl alcohol (GL-05) (manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) 10 parts Water 90 parts [Arrangement of IC module] Next, the following IC module was coated on the support coated with the release layer. Was placed.

A winding type antenna is formed and has a thickness of 7
IC chips of 0 μm and 4 × 4 mm square were joined, and a stainless plate having a thickness of 120 μm and 6 × 6 mm square was bonded as a reinforcing plate to the backside of the circuit surface to obtain an IC module. IC
The total thickness of the chip portion was 210 μm. [Formation of Resin Layer] Next, the following resin layer composition was applied by curtain coating onto the support on which the IC module was placed.

Shin Nakamura Chemical Co., Ltd. A-9300 / Shin Nakamura Chemical Co., Ltd. EA-1020 = 35 / 11.75 parts Reaction Initiator Irgacure 184 Nippon Ciba Geigy Co., Ltd. 5 parts Actinic ray curable layer resin 1 48 parts Dainippon Ink Ink Surfactant F-179 0.25 part Toluene 500 parts Actinic ray curable compound after coating is 90 ° C./30 sec.
And then photocured with a mercury lamp (300 mJ / cm ² ). The film thickness was 240 μm.

Next, the following intermediate layer and adhesive layer were coated with a wire bar to prepare a transfer foil 1 having an IC chip mounted thereon. [Formation of intermediate layer] Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: S-REC BX-1] 3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX Nippon Polyurethane] 1.5 After the application of 90 parts of methyl ethyl ketone, the curing agent was cured at 50 ° C. for 24 hours. The film thickness was 1.0 μm. [Formation of adhesive layer] Urethane-modified ethylene ethyl acrylate copolymer [Toho Chemical Industry Co., Ltd .: Hitec S6254B] 8 parts Polyacrylic acid ester copolymer [Nippon Pure Chemical Co., Ltd .: Julimer AT510] 2 parts Water 45 parts Ethanol 45 parts was applied and then dried at 70 ° C./30 sec. The film thickness is
It was 0.5 μm. (Preparation of Transfer Foil 2 with IC Chip) The transfer foil 2 with an IC chip was prepared in the same manner as the transfer foil 1 with an IC chip according to the following arrangement of the IC module. [Arrangement of IC module] An antenna of is formed by using a conductive ink by a screen printing method on a support coated with a release layer, and an IC chip having a thickness of 70 μm and 4 × 4 mm square is bonded. The thickness of the reinforcing plate is 120μ.
A 6 mm × 6 mm square stainless plate was adhered to the side of the circuit opposite to the circuit surface to arrange the IC module. The total thickness of the obtained IC chip portion was 210 μm. (Preparation of Transfer Foil 3 to 4 with IC Chip) IC is the same as the transfer foil 1 with IC chip except that a pattern pattern layer is formed between the intermediate layer and the adhesive layer by a screen printing method. A transfer foil 3 with a chip was prepared.

The transfer foil 4 having the IC chip mounted thereon is the same as the transfer foil 2 having the IC chip mounted thereon, except that the pattern pattern layer is formed between the intermediate layer and the adhesive layer by the screen printing method.
It was created. (Creation of base sheet 1 for IC card with IC chip) (Creation of writing layer) As a support, 12 manufactured by Toray Industries, Inc.
5E28G 125 μm thick white PET was used.

A first writing layer forming coating liquid having the following composition, a second
The writing layer forming coating liquid and the third writing layer forming coating liquid were applied and dried in this order to give respective thicknesses of 5 μm and 15 μm.
A writing layer was formed by laminating so as to have a thickness of 0.2 μm. <Coating liquid for forming the first writing layer> Polyester resin [TOYOBO Co., Ltd .: Byron 200] 8 parts Isocyanate [Nippon Polyurethane Industry Co., Ltd .: Coronate HX] 1 part Carbon black Trace amount of titanium dioxide particles [Ishihara Sangyo] Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming the second writing layer> Polyester resin 4 parts [Toyobo Co., Ltd .: Vylonal MD1200] Silica 5 parts Titanium dioxide particles [Ishihara] Sangyo Co., Ltd .: CR80] 1 part Water 90 parts <Third writing layer forming coating liquid> Polyamide resin [Sanwa Chemical Co., Ltd .: Sunmide 55] 5 parts Methanol 95 parts Obtained writing layer The center line average roughness was 1.34 μm. (Formation of Format Printing Layer on Writing Layer) Format printing (ruled lines, issuer name, issuer telephone number) was performed by the offset printing method as shown in FIG. UV ink was used as the printing ink. The UV irradiation condition during printing was equivalent to 200 mj with a high pressure mercury lamp. [Arrangement of IC Modules] Next, the following IC modules were arranged on the opposite side (back side) from the format printing.

A winding type antenna is formed and has a thickness of 7
IC chips of 0 μm and 4 × 4 mm square were joined, and a stainless plate having a thickness of 120 μm and 6 × 6 mm square was bonded as a reinforcing plate to the backside of the circuit surface to obtain an IC module. IC
The total thickness of the chip portion was 210 μm. [Formation of Resin Layer] Next, the following resin layer composition was applied by curtain coating onto the support on which the IC module was placed.

Shin-Nakamura Chemical Co., Ltd. A-9300 / Shin-Nakamura Chemical Co., Ltd. EA-1020 = 35 / 11.75 parts Reaction initiator Irgacure 184 Nippon Ciba-Geigy Co., Ltd. 5 parts Actinic ray curable layer resin 1 48 parts Dainippon Ink Ink Surfactant F-179 0.25 part Toluene 500 parts Actinic ray curable compound after coating is 90 ° C./30 sec.
And then photocured with a mercury lamp (300 mJ / cm ² ). The film thickness was 240 μm.

Then, the following intermediate layer and adhesive layer were coated with a wire bar to prepare a base sheet 1 for an IC card equipped with an IC chip. [Formation of intermediate layer] Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: S-REC BX-1] 3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX Nippon Polyurethane] 1.5 After the application of 90 parts of methyl ethyl ketone, the curing agent was cured at 50 ° C. for 24 hours. The film thickness was 1.0 μm. [Formation of adhesive layer] Urethane-modified ethylene ethyl acrylate copolymer [Toho Chemical Industry Co., Ltd .: Hitec S6254B] 8 parts Polyacrylic acid ester copolymer [Nippon Pure Chemical Co., Ltd .: Julimer AT510] 2 parts Water 45 parts Ethanol 45 parts was applied and then dried at 70 ° C./30 sec. (Preparation of Base Material Sheet 2 for IC Card Mounted with IC Chip) [Arrangement of IC Module] Before forming the writing layer, 125E28G having a thickness of 125 μm white P manufactured by Toray Industries, Inc.
An antenna is formed by a copper foil etching method using ET, an IC chip with a thickness of 70 μm and a size of 4 × 4 mm is joined, and a stainless plate with a thickness of 120 μm and a size of 6 × 6 mm is opposite to the circuit surface as a reinforcing plate. A PET sheet having an IC module mounted on a crocodile was prepared. The total thickness of the IC chip portion was 210 μm.

On the sheet thus obtained, IC
A resin layer, an intermediate layer, and an adhesive layer were provided in the same manner as the base sheet 1 for an IC card on which chips were mounted, and a writing layer was further provided on the opposite side to prepare a base sheet 2 for an IC card.

Further, a rubber having a diameter of 5 cm and heated to a surface temperature of 200 ° C. by using the actinic ray-curable transfer foil 1 having the above-mentioned structure on the image-receiving layer or the transparent resin layer on which images and characters are recorded and the scale-pigment-containing layer. Transfer was performed by applying heat for 1.2 seconds at a pressure of 150 kg / cm ² using a heat roller having a hardness of 85. (Substrate sheets 3-4 for IC cards equipped with IC chips
Preparation of IC card with IC chip mounted in the same manner as the base sheet 1 for IC card mounted IC chip except that a pattern pattern layer was formed between the intermediate layer and the adhesive layer by a screen printing method. The base material sheet 3 was created.

For an IC card equipped with an IC chip, in the same manner as the base sheet 2 for an IC card equipped with an IC chip, except that a pattern pattern layer was formed between the intermediate layer and the adhesive layer by a screen printing method. The base material sheet 4 was created. (Creating a base sheet for an IC card with a writing layer) (IC
Similar to the base sheet 1) for IC cards with chips, the thickness of 125E28G manufactured by Toray Industries, Inc. 125 μm
A writing layer was formed on white PET, and a format printing layer was formed on the writing layer. Then, an adhesive layer was provided on the opposite side (back side) from the format printing using a wire bar. [Formation of adhesive layer] Urethane-modified ethylene ethyl acrylate copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254B] 8 parts Polyacrylic ester copolymer [manufactured by Nippon Pure Chemical Co., Ltd .: Julimer AT510] 2 parts Water 45 parts Ethanol 45 parts was applied and then dried at 70 ° C./30 sec (preparation of base material sheet for IC card with image receiving layer) 125E28G 125 μm white PET manufactured by Toray Industries, Inc.
Then, a cushion layer, an image receiving layer, an information carrier layer, a transparent resin layer, and a scaly pigment layer made of the following composition were formed to prepare a base sheet for an IC card having an image receiving layer. [Cushion layer formation] Polypropylene (PP) 20
A cushion layer was provided on the white PET so as to have a thickness of 20 μm by heat melting at 0 ° C. [Image Receiving Layer] A first image receiving layer forming coating liquid, a second image receiving layer forming coating liquid and a third image receiving layer forming coating liquid having the following compositions are applied and dried in this order on the cushion layer, respectively. An image receiving layer was formed by laminating the layers to have a thickness of 0.2 μm, 2.5 μm, and 0.5 μm. <Coating liquid for forming first image-receiving layer> Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: S-REC BL-1] 9 parts Isocyanate [Nippon Polyurethane Industry Co., Ltd .: Coronate HX] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming second image receiving layer> Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: S-REC BX-1] 6 parts Metal ion-containing compound (compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts < Third Image Receiving Layer Forming Coating Liquid> Polyethylene wax [Toho Chemical Industry Co., Ltd .: Hitec E1000] 2 parts Urethane modified ethylene acrylic acid copolymer [Toho Chemical Industry Co., Ltd .: Hitec S6254] 8 parts Methylcellulose [ Shin-Etsu Chemical Co., Ltd .: SM15] 0.1 part water 90 parts (format printing (Formation of information carrier consisting of layers) Format printing (employee ID, name) was performed on the image receiving layer by the offset printing method. UV ink was used as the printing ink. The UV irradiation condition during printing is 200 m with a high pressure mercury lamp.
It was equivalent to j. (Formation of transparent resin layer) A printing ink composed of the following composition was mixed by a roll mill to prepare a printing ink. Printing was performed on the image receiving layer by the offset printing method. The UV irradiation condition during printing was equivalent to 200 mj with a high pressure mercury lamp. (Transparent resin layer composition 1) Urethane acrylate oligomer 50 parts Aliphatic polyester acrylate oligomer 35 parts Dirocur 1173 (manufactured by Ciba Specialty Chemicals) 5 parts Trimethylol propane acrylate 10 parts (formation layer formation of scale pigment layer) Printing inks composed of the composition were mixed by the method shown in the table to prepare printing inks. Printing was performed on the image receiving layer by the offset printing method.
The images of the cross section and the surface are shown below in FIG.

The UV irradiation condition during printing is 2 with a high pressure mercury lamp.
It was equivalent to 00 mj. (Scale pigment layer composition 1) Iriodin 211 (manufactured by Merk) 45 parts Urethane acrylate oligomer 40 parts Dirocure 1173 (manufactured by Ciba Specialty Chemicals) 5 parts Trimethylol propane acrylate 10 parts With an image-receiving layer thus prepared The personal identification information such as name, address, face image, etc. was provided on the base sheet for the IC card by the following method. (Preparation of sublimation-type thermal transfer recording ink sheet) A 6 μm-thick polyethylene terephthalate sheet having a back surface processed to prevent fusion is coated with a yellow ink layer-forming coating solution, a magenta ink layer-forming coating solution, and cyan. The ink layer forming coating liquid was provided so that each thickness was 1 μm, and three color ink sheets of yellow, magenta and cyan were obtained. <Yellow Ink Layer Forming Coating Liquid> Yellow Dye [MS Yellow manufactured by Mitsui Toatsu Dye Co., Ltd.] 3 parts Polyvinyl acetal [Denka Butyral KY-24] 5.5 parts Polymethylmethacrylate Modified polystyrene [Toagosei Chemical Industry Co., Ltd .: Rededa GP-200] 1 part Urethane modified silicone oil [Dainichi Seika Chemicals Co., Ltd .: Dialomer SP-2105] 0.5 part Methyl ethyl ketone 70 parts Toluene 20 parts <Magenta Coating liquid for ink layer formation> Magenta dye [MS Magenta manufactured by Mitsui Toatsu Dye Co., Ltd.] 2 parts Polyvinyl acetal [Denka Butyral KY-24 manufactured by Denki Kagaku KK] 5.5 parts Polymethylmethacrylate modified Polystyrene [Toagosei Chemical Industry Co., Ltd .: Rededa GP-200] 2 parts Urethane-modified silicone oil [Dainichi Seika Kogyo KK: Dialomer SP-2105] 0.5 part Methyl ethyl ketone 70 parts Toluene 20 parts <Cyan ink layer forming coating solution> Cyan dye [Kaya manufactured by Nippon Kayaku Co., Ltd.] Set blue 136] 3 parts Polyvinyl acetal [Denka Butyral KY-24] manufactured by Denki Kagaku Kogyo 5.6 parts Polymethylmethacrylate modified polystyrene [Toagosei Kagaku Kogyo: Rededa GP-200] 1 part Urethane-modified silicone oil [Dainichi Seika Kogyo KK: Dialomer SP-2105] 0.5 part Methyl ethyl ketone 70 parts Toluene 20 parts (preparation of ink sheet for melt-type thermal transfer recording) Thickness to prevent fusion on the back surface A 6 μm thick polyethylene terephthalate sheet is coated with an ink layer-forming coating solution having the following composition. An ink sheet was obtained by coating and drying so that the thickness was 2 μm. <Ink layer forming coating liquid> Carnauba wax 1 part Ethylene vinyl acetate copolymer [Mitsui DuPont Chemical Co., Ltd .: EV40Y] 1 part Carbon black 3 parts Phenolic resin [Arakawa Chemical Industries Co., Ltd .: Tamanor 521] 5 parts Methyl ethyl ketone 90 parts [Facial image formation] The ink side of a sublimation-type thermal transfer recording ink sheet is superposed on the surface of a base sheet for an IC card having an image receiving layer, and output from the ink sheet side using a thermal head is 0.23 W / Dot, pulse width 0.3 to 4.5
A human image having gradation in the image was formed on the image receiving layer by heating under the condition of m second for a dot density of 16 dots / mm. In this image, the dye and nickel in the image receiving layer form a complex. [Formation of Character Information] The ink side of the ink sheet for fusion type thermal transfer recording is superposed on the surface of the front sheet, and the output is 0.5 W / dot from the side of the ink sheet using a thermal head.
Character information was formed on the OP varnish by heating under the conditions of a pulse width of 1.0 msec and a dot density of 16 dots / mm.

As described above, as shown in FIG. 17, the face image and the attribute information (Taro Konica, ID: 1223344, etc.)
Was set up. (Creation of IC card) [Creation of IC card 1] Base sheet for IC card with image receiving layer provided with personal identification information such as name, address, face image [side without the personal identification information], IC chip Using a heat roller having a surface temperature of 200 ° C. and having a rubber hardness of 5 cm and a pressure of 150 kg / cm.
Transfer was performed by applying heat at ² for 1.2 seconds.

Then, the above "base sheet for IC card with writing layer" was heated to a surface temperature of 200 ° C., diameter 5c
m rubber hardness 85 using heat roller pressure 150k
Heat was applied at g / cm ² for 1.2 seconds to perform bonding I
I made a C card.

In the IC card thus produced, the transparent protective layer 1 or 2 shown in Table 1 was formed by the following method. [Creation of IC cards 2 to 4] IC as in IC card 1
Cards 3-4 were created. Table 1 shows the conditions of the obtained cards.
Described in. [Creation of IC cards 5 to 8] An IC with an IC chip mounted on a base sheet for an IC card with an image receiving layer provided with personal identification information such as name, address and face image [on the side without the personal identification information] The surface temperature of the base sheets 1 to 4 for the card is 200
IC cards 5 to 8 were prepared by applying heat at a pressure of 150 kg / cm ² for 1.2 seconds using a heat roller heated to 50 ° C. and having a rubber hardness of 5 cm and a temperature of 150 kg / cm ² .

In the IC card thus prepared, the transparent protective layer 1 or 2 shown in Table 1 was formed by the following method. [Creation of IC card 9 for comparison] Base sheet for IC card with image receiving layer provided with personal identification information such as name, address, face image [side without the personal identification information] and "with writing layer The following IC module is arranged between the base sheet for IC card "and the hot-melt adhesive Esdyne 963.
2 (Reactive Hot Melt Adhesive manufactured by Sekisui Chemical Co., Ltd.) was used to bond them to prepare an IC card.

A flat plate hot press machine was used for the bonding, and the temperature of the upper and lower plates was 80 ° C. and the press pressure was 5.0 kg /
cm ² and pressing time 60 seconds, thickness 760 μm
It was created by sandwiching the stainless steel spacer of. (IC module) Form a winding type antenna,
IC chips having a thickness of 70 μm and 4 × 4 mm square were joined, and a stainless plate having a thickness of 120 μm and 6 × 6 mm square was bonded as a reinforcing plate on the side opposite to the circuit surface to obtain an IC module.
The total thickness of the IC chip portion was 210 μm.

In the IC card thus produced, the transparent protective layer 1 or 2 shown in Table 1 was formed by the following method.

Next, a method of forming a protective layer on the IC card substrate will be described.

The following protective layer was provided on the surface of the card thus prepared. (Formation of transparent protective layer 1) [Preparation of transparent resin transfer foil] Diafoil Hoechst Co., Ltd.
Polyethylene terephthalate (S-25) manufactured by wire bar coating with the following formulation on one side and dried,
A protective layer was formed. (Release layer) Film thickness 0.5 μm Acrylic resin (manufactured by Mitsubishi Rayon Co., Ltd., Dyanal BR-87) 5 parts Polyvinyl acetoacetal (SP value: 9.4) (Sekisui Chemical Co., Ltd., KS-1) 5 parts Methyl ethyl ketone 40 parts Toluene 50 parts After coating, it was dried at 90 ° C./30 sec. <Intermediate layer forming coating solution> Film thickness 0.3 μm Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: S-REC BX-1 5 parts Tuftex M-1913 (Asahi Kasei) 3.5 parts Curing agent Polyisocyanate [Coronate HX Japan Polyurethane] 1.5 parts Methyl ethyl ketone 20 parts Toluene 70 parts After application, drying was carried out at 90 ° C./30 sec, and the curing agent was cured at 50 ° C. for 24 hours. <Barrier layer forming coating liquid> Film thickness 0.5 μm BX-1 (polyvinyl butyral resin) [Sekisui Chemical Co., Ltd .: Eslec B series] 4 parts Tuftex M-1913 (Asahi Kasei) 4 parts Curing agent Polyisocyanate [ Coronate HX made by Nippon Polyurethane] 2 parts Toluene 50 parts Methyl ethyl ketone 40 parts After coating, drying was performed at 70 ° C./30 sec. <Adhesive layer forming coating liquid> Film thickness 0.3 μm Urethane-modified ethylene ethyl acrylate copolymer [Toho Chemical Industry Co., Ltd .: Hitech S6254B] 8 parts Polyacrylic ester copolymer [Nippon Pure Chemical Co., Ltd.] : Julimer AT510] 2 parts Water 45 parts Ethanol 45 parts After application, drying was performed at 70 ° C./30 sec.

A transparent resin transfer foil composed of a release layer, an intermediate layer and an adhesive layer having the above composition was prepared.

Then, the transfer foil was used on the surface of the IC card to heat the surface temperature to 200 ° C., and a pressure of 150 kg / cm ^{2 was} applied using a heat roller having a rubber hardness of 85 and a diameter of 5 cm.
Transfer was performed by applying heat for 1.2 seconds.

The UV-curable resin-containing coating solution was applied onto the IC card having the transfer foil transferred thereon by a gravure roll coater having a specific background pattern so that the coating amount was 20 g / m ² , and the following curing conditions were applied. The ultraviolet-curable resin-containing coating liquid 1 was cured to form an ultraviolet-curable protective layer.

Curing Conditions Light Irradiation Source 60 w / cm ² High Pressure Mercury Lamp Irradiation Distance 10 cm Irradiation Mode Optical Scanning at 3 cm / sec (Formation of Transparent Protective Layer 2) [UV-Curing Resin-Containing Coating Liquid] Bis (3,4-epoxy) 6-Methylcyclohexylmethyl) adipate 70 parts Bisphenol A glycidyl ether 10 parts 1,4-butanediol glycidyl ether 13 parts Triarylsulfonium fluoroantimony 7 parts (preparation of actinic radiation curable transfer foil) (release layer forming coating liquid) ) Film thickness 0.2 μm Polyvinyl alcohol (GL-05) (manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) 10 parts Water 90 parts The release layer was applied under the drying conditions of 90 ° C./30 sec. (Actinic ray curable compound) Film thickness 7.0 μm Shin-Nakamura Chemical Co., Ltd. A-9300 / Shin Nakamura Chemical Co., Ltd. EA-1020 = 35 / 11.75 parts Reaction initiator Irgacure 184 Nippon Ciba Geigy Co., Ltd. 5 parts Actinic ray curable compound Layer Resin 1 48 parts Dainippon Ink Surfactant F-179 0.25 parts Toluene 500 parts Actinic ray curable compound after coating is 90 ° C / 30 sec.
And then photocured with a mercury lamp (300 mJ / cm 2). <Intermediate layer forming coating solution> Film thickness 1.0 μm Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: S-REC BX-1 3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX Japan Polyurethane] 1.5 parts Methyl ethyl ketone 90 parts After application, the curing agent was cured at 50 ° C. for 24 hours. <Adhesive layer forming coating liquid> Film thickness 0.5 μm Urethane-modified ethylene ethyl acrylate copolymer [Toho Chemical Industry Co., Ltd .: Hitech S6254B] 8 parts Polyacrylic ester copolymer [Nippon Pure Chemical Co., Ltd.] : Julimer AT510] 2 parts Water 45 parts Ethanol 45 parts After application, drying was performed at 70 ° C./30 sec.

Further, a rubber having a diameter of 5 cm and heated to a surface temperature of 200 ° C. using the actinic ray-curable transfer foil 1 having the above-mentioned structure on the image receptor or transparent resin layer on which images and characters are recorded, and the scale pigment-containing layer. Transfer was performed by applying heat for 1.2 seconds at a pressure of 150 kg / cm ² using a heat roller having a hardness of 85.

100 of each of the IC cards 1 to 9 were prepared, and Table 1 shows the number of printable and printable defects.

[0111]

[Table 1] The IC cards 1 to 8 of the present invention are the IC card 9 of the comparative example.
As compared with the above, it is possible to reduce the loss that has occurred due to defective printing, improve productivity, and create an IC card at low cost. In the case of a card having a pattern pattern, the pattern pattern can be recognized as a watermark image by shining light from the back surface of the card, so that the authenticity / counterfeit security is also excellent.

[0112]

As described above, according to the invention of claim 1, after the authentication identification image such as the face image and the attribute information image are recorded on the sheet base material in advance, the transfer foil for the IC card is used. The printability can be improved by manufacturing an IC card equipped with an IC chip and an antenna.

According to the second aspect of the present invention, since the pattern pattern can be recognized as a watermark image by applying light from the back surface of the IC card after it has been made into an IC card, the security as authenticity discrimination can be improved. Is also excellent.

According to the third aspect of the invention, after the authentication identification image such as a face image and the attribute information image are recorded on the sheet base material in advance, the IC chip and the antenna are mounted using the base sheet for the IC card. The printability can be improved by manufacturing an IC card that performs

According to the fourth aspect of the invention, since the pattern pattern can be recognized as a watermark image by shining light from the back of the IC card after it has been made into an IC card, the security as authenticity discrimination is improved. Is also excellent.

According to the invention of claim 5, as a method of mounting the IC chip and the antenna, the IC chip and the antenna can be mounted by thermal transfer using a transfer foil for an IC card, and a large-scale adhesive coating is performed. Since a machine and a laminating machine are not required, manufacturing can be performed at low cost, and productivity can be improved by reducing loss generated by defective printing, and an IC card can be manufactured at low cost.

According to the sixth aspect of the invention, as a method of mounting the IC chip and the antenna, the IC chip and the antenna can be mounted by sticking them together by using the base sheet for the IC card, and a large-scale adhesion is possible. Since an agent coating machine and a laminating machine are not required, it can be manufactured at low cost, and productivity can be improved by reducing loss generated due to defective printing, and an IC card can be manufactured at low cost.

According to the seventh aspect of the invention, after the IC card is formed, the difference in the transmission density between the pattern pattern portion and the portion without the pattern pattern is in the range of 0.03 to 0.50.
After the card is formed, the pattern pattern can be recognized as a watermark image by shining light from the back surface of the IC card, for example, and thus the security as the authenticity discrimination is excellent.

In the invention according to claim 8, the IC card has a thermal transfer image-receiving layer on at least one outer surface of the sheet base material, and the thermal transfer image-receiving layer allows an authentication identification image such as a face image and an attribute information image. Can be recorded.

According to the invention of claim 9, the IC card has a writing layer on at least one outer surface of the sheet base material, and various information can be written on the writing layer at the time of use.

According to the tenth aspect of the invention, the durability of the IC card is improved by the transparent protective layer of the IC card.

According to the eleventh aspect of the present invention, the IC card uses the sheet base material on which personal identification information including the name and face image is provided in advance, whereby defective printing can be prevented.

According to the twelfth aspect of the invention, after the IC card is formed, the difference in transmission density between the pattern pattern portion and the portion without the pattern pattern is in the range of 0.03 to 0.50.
After the C card is formed, the pattern pattern can be recognized as a watermark image by shining light from the back surface of the IC card, for example, and therefore the security as the authenticity discrimination is excellent.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a transfer foil for an IC card.

FIG. 2 is a plan view of a transfer foil for an IC card.

FIG. 3 is a sectional view of a transfer foil for an IC card according to another embodiment.

FIG. 4 is a plan view of a transfer foil for an IC card according to another embodiment.

FIG. 5 is a cross-sectional view of a base sheet for an IC card.

FIG. 6 is a plan view of a base sheet for an IC card.

FIG. 7 is a cross-sectional view of a base sheet for an IC card according to another embodiment.

FIG. 8 is a plan view of a base sheet for an IC card according to another embodiment.

FIG. 9 is a schematic view showing a method for manufacturing an IC card using a transfer foil for an IC card.

FIG. 10 is a schematic view showing a method for manufacturing an IC card using a base sheet for an IC card.

FIG. 11 is a view showing an embodiment in which a thermal transfer image receiving layer is provided on the outer surface of at least one of the sheet base materials of the first sheet base material and the second sheet base material.

FIG. 12 is a diagram showing an embodiment in which a writing layer is provided on the outer surface of at least one of the sheet base materials of the first sheet base material or the second sheet base material.

FIG. 13 is a diagram showing an embodiment in which an IC card is provided with personal identification information including a name and a face image.

FIG. 14 is a diagram showing an example of a transfer foil for an IC card.

FIG. 15 is a diagram showing an example of forming a format printing layer on a writing layer.

FIG. 16 is a diagram showing an example of forming a scale pigment layer forming layer.

FIG. 17 is a diagram showing an embodiment in which a face image and attribute information are provided.

[Explanation of symbols]

1 Transfer foil for IC cards 2 support 3 Release layer 4 resin layers 5 Adhesive layer 6 IC chip 7 antenna 8 pattern patterns 11 Base sheet for IC cards 12 Sheet base material 13 Resin layer 14 Adhesive layer 15 IC chip 16 antenna 20 First sheet base material 30 Second sheet base material

Continued front page    (72) Inventor Ryoji Hattori             Konica Stock, 1 Sakura-cho, Hino City, Tokyo             In the company (72) Inventor Shigehiro Kitamura             Konica Stock, 1 Sakura-cho, Hino City, Tokyo             In the company F-term (reference) 2C005 MA03 MA13 MA18 MA19 NA09                       PA04 PA14 PA18 PA22 PA23                       PA29 RA04                 5B035 BA03 BA05 BB09 CA01 CA23

Claims (12)

[Claims] 1. A transfer foil for an IC card, comprising a release layer, a resin layer and an adhesive layer on a support, and an IC chip and an antenna in the resin layer. 2. The IC according to claim 1, wherein a pattern pattern is provided between the resin layer and the adhesive layer.
Transfer foil for cards. 3. A base sheet for an IC card, comprising a resin layer and an adhesive layer on a sheet base material, and an IC chip and an antenna in the resin layer. 4. The IC according to claim 3, wherein a pattern pattern is provided between the resin layer and the adhesive layer.
Base sheet for cards. 5. A method of manufacturing an IC card having an IC chip and an antenna between a first sheet base material and a second sheet base material, comprising: The transfer foil for an IC card according to claim 1 or 2 is transferred onto one of the sheet base materials under heat and pressure, and an adhesive layer is provided on the other sheet base material to form the IC chip and the IC chip. A method for manufacturing an IC card, which comprises heating and pressing a sheet base material having an antenna transferred thereto through an adhesive layer to bond the sheet base material. 6. A method of manufacturing an IC card having an IC chip and an antenna between a first sheet base material and a second sheet base material, comprising: The base sheet for an IC card according to claim 3 or 4 is used as one of the sheet base materials, and the other sheet base material is bonded by heating and pressing through an adhesive layer. IC
Card manufacturing method. 7. An IC card manufactured by the method for manufacturing an IC card according to claim 5 or 6, wherein a difference in transmission density between a pattern pattern portion and a portion without the pattern pattern after the IC card is formed. Is in the range of 0.03 to 0.50. 8. An IC card manufactured by the method for manufacturing an IC card according to claim 5 or 6, wherein at least one outer surface of the sheet substrate has a thermal transfer image-receiving layer. The characteristic IC card. 9. An IC card manufactured by the method for manufacturing an IC card according to claim 5 or 6, wherein at least one outer surface of the sheet base material has a writing layer. IC card. 10. The IC according to claim 5 or 6.
An IC card manufactured by the card manufacturing method, wherein personal identification information including name and face image is provided on the IC card, a transparent protective layer is provided on the upper surface, and the transparent protective layer is made of an actinic ray curable resin. IC card characterized by. 11. The IC according to claim 5 or 6.
An IC card manufactured by the card manufacturing method, which is created using a sheet base material in which personal identification information including a name and a face image is provided in advance. 12. A difference in transmission density between a pattern pattern portion and a portion without a pattern pattern is 0.03 to after an IC card is formed.
The IC card according to any one of claims 8 to 11, wherein the range is 0.50.