JP2007047937A - Ic card and manufacturing method of ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the come-off an IC chip from an antenna connection part by suppressing the unevenness of an IC chip and securing resistance to a bend or a point-pressure strength load. <P>SOLUTION: The IC card includes a reinforcement plate larger in size than an IC chip, the reinforcement plate having linear groove-shaped or curved groove-shaped uneven parts extending in least two directions or more. The reinforcement plate is smoothed in at least one surface of the IC chip-side surface corresponding to the upper part of the IC chip and the opposite surface, and has a composite reinforcement structure in a part other than it. Otherwise, the IC card includes a reinforcement plate having a composite reinforcement structure adjacent to an IC chip, which is smoothed in a surface opposite to the surface adjacent to the IC chip. Otherwise, at least one of a plurality of reinforcement plates has a composite reinforcement structure, and at least the one covers the upper part of the antenna connection part of the IC chip or adjacent thereto, and the physical property of this reinforcement plate is differed from that of the reinforcement plate of the other part. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  In this invention, parts including an IC module having a contact type or non-contact type IC chip and an antenna for storing personal information etc. that require safety (security) such as forgery and alteration prevention are stacked and bonded together. The present invention relates to an IC card in which a card substrate is created and the card substrate is manufactured in a card shape, and an IC card manufacturing method.

  For example, magnetic cards that record data by a conventional magnetic recording method have been widely used for identification cards (ID cards), credit cards, and the like. However, since data can be rewritten relatively easily in a magnetic card, data falsification is not sufficiently prevented, it is susceptible to external influences due to magnetism, data protection is insufficient, and recording capacity is small. There were problems such as.

  In recent years, IC cards incorporating IC chips have begun to spread. The IC card reads and writes data with an external device via an electrical contact provided on the surface or a loop antenna inside the card. The IC card has a larger storage capacity than the magnetic card and greatly improves security. In particular, a non-contact IC card that has an antenna for exchanging information between the IC chip and the outside inside the card and has no electrical contact outside the card is a contact IC card that has an electrical contact on the card surface. Compared with an ID card, it is being used for applications that require high confidentiality of data and prevention of forgery and alteration.

  As such an IC card, for example, there is one in which a first sheet material and a second sheet material are bonded together via an adhesive, and an IC module having an IC chip and an antenna is enclosed in the adhesive layer.

  Since the IC card has high security, durability is important from the viewpoint of counterfeiting and alteration. In particular, since electrical components such as an antenna for exchanging information between the IC chip and the outside are built in the card, various attempts have been made to ensure its durability. However, higher durability has been required while being used and spread in various applications.

  In conventional IC cards, an IC chip and an inlet having a circuit board mounted with an antenna are inserted between two sheets of material, and bonded using a moisture-curing adhesive, UV-curing adhesive, or two-component mixed adhesive. It is generally manufactured by punching into a card shape after combining and curing, or by hot pressing using a thermocompression-bondable base material and then punching into a card shape.

  The manufactured IC card is generally used after character information and image information are given to the card face and a protective layer is applied. However, in the manufacture of IC cards, destruction of IC chips and disconnection of antennas due to pressure, bending, etc. during card manufacture have occurred.

  In addition, even when a gradation image or a fused image is thermally transferred to an IC card with a thermal head, there is a problem that the IC chip built in the IC card is damaged by the stress that is bent by the platen that is a close contact mechanism and the pressure by the head. Was.

For these reasons, various proposals have been made for improving the reinforcing structure. However, in actual use, durability is not sufficient because it is kept in high temperature and high humidity for a long time while being put in the bottom pocket of trousers and keeping weight. Further, in order to strengthen the reinforcing structure, studies have been made to attach a highly durable member and a reinforcing plate to the chip portion as shown in JP-A-2003-141490 and the like.
JP 2003-141490 JP

  However, a problem has been reported that, while the IC card is used and bent, the antenna attached to the IC chip is detached from the base of the joint with the IC chip, resulting in malfunction. In addition, the shape of the reinforcing plate appears as irregularities on the surface of the IC card, which causes serious problems such as image blurring and print blurring when a gradation image or a melted image is thermally transferred to the IC card by a thermal head. Was strongly desired.

  Therefore, there is a need for an IC card that can easily obtain high durability without damaging the IC chip or detaching the antenna from the IC chip, and that does not impair the smoothness.

  The present invention has been made in view of the above points, and suppresses the occurrence of unevenness of the IC chip portion, has resistance against bending and point pressure strength load, and prevents the IC chip and the antenna connection portion from coming off. An object of the present invention is to provide a possible IC card and IC card manufacturing method.

  In order to solve the above problems and achieve the object, the present invention is configured as follows.

  According to the first aspect of the present invention, a part including an IC module including an IC chip and an antenna is stacked at a predetermined position between the first sheet material and the second sheet material, and bonded together to form a card substrate. In the IC card in which this card substrate is manufactured in a card shape, the card base has a reinforcing plate larger than the size of the IC chip, and the reinforcing plate has a linear groove shape in at least two directions or a curved shape. An IC card characterized by having a groove-shaped uneven portion. The reinforcing plate larger than the size of the IC chip suppresses unevenness due to the uneven part of the IC chip, has resistance to bending and point pressure strength load, and can prevent the IC chip and the antenna connection from coming off. .

  According to the second aspect of the present invention, a part including an IC module including an IC chip and an antenna is stacked at a predetermined position between the first sheet material and the second sheet material, and bonded together to form a card substrate. In the IC card in which the card base is manufactured in a card shape, the IC card has a reinforcing plate adjacent to the IC chip that is larger than the size of the IC chip, and the reinforcing plate is a portion of the IC chip corresponding to the upper part of the IC chip. The IC card is characterized in that at least one of the side surface and the opposite surface is smooth, and a portion other than the portion corresponding to the upper portion of the IC chip has a composite reinforcing structure. The reinforcing plate larger than the size of the IC chip has a mechanically superior composite reinforcing structure, and the upper surface portion is flat so that the structure does not hinder the card flatness, and both mechanical strength and printability are compatible. ing.

  According to a third aspect of the present invention, a part including an IC module including an IC chip and an antenna is stacked at a predetermined position between the first sheet material and the second sheet material, and bonded together to form a card substrate. In the IC card in which the card base is manufactured in a card shape, the IC card has a reinforcing plate having a composite reinforcing structure adjacent to the IC chip, and the reinforcing plate is opposite to the surface adjacent to the IC chip. The IC card is characterized by having a smooth surface. The reinforcing plate has a mechanically superior composite reinforcing structure, and the surface opposite to the surface adjacent to the IC chip is smooth so that the structure does not hinder the card flatness, mechanical strength and printability Are compatible.

  The invention according to claim 4 is the IC card according to claim 2 or 3, wherein the smooth surface of the reinforcing plate has a roughness of not less than 0.01 μm and not more than 15 μm. By defining the roughness of the smooth surface of the reinforcing plate, the printability can be improved.

  The invention according to claim 5 is such that a part including an IC module consisting of an IC chip and an antenna is stacked at a predetermined position between the first sheet material and the second sheet material, and bonded together to form a card base In an IC card in which this card base is manufactured in a card shape, the card base is provided with a plurality of reinforcing plates adjacent to the IC chip, and at least one of the plurality of reinforcing plates is a composite reinforcing structure, and at least The IC card is characterized in that one reinforcing plate covers or is adjacent to the upper part of the antenna connection portion of the IC chip, and the physical properties of the reinforcing plate are different from those of the other portions of the reinforcing plate. At least one of the plurality of reinforcing plates has a composite reinforcing structure, and at least one reinforcing plate covers or is adjacent to the upper part of the antenna connection portion of the IC chip. Unlike physical properties, it is possible to prevent the IC chip and the antenna connection portion from being detached.

  The invention according to claim 6 is the IC card according to claim 5, wherein the reinforcing plate includes at least one material having Young's modulus of 100 GPa or more. In order to avoid an increase in card thickness, the reinforcing plate is preferably a high-strength material, and in particular, a material having a Young's modulus of 100 GPa or more is preferably used for the main structure.

  According to the seventh aspect of the present invention, a part including an IC module including an IC chip and an antenna is stacked at a predetermined position between the first sheet material and the second sheet material, and bonded together to form a card base material. In the IC card in which this card base is manufactured in a card shape, the card base is provided with a plurality of reinforcing plates adjacent to the IC chip, and at least one of the plurality of reinforcing plates is a composite reinforcing structure, and The IC card is characterized in that the connecting portion between the IC chip and the antenna is covered with a concave reinforcing plate, and the ratio of the minimum thickness and the maximum thickness is 0.1 or more and 1.5 or less. Reinforcing plate with concave structure is an effective means to increase durability because it can cover the connection part of IC chip and antenna which should be most reinforced with IC card in U shape. If the thickness becomes too thick, the smoothness in the card surface is deteriorated. Therefore, the thickness ratio is preferably 0.1 or more and 1.5 or less.

  In the invention according to claim 8, the composite reinforcing structure portion of the reinforcing plate is selected from any of an H structure, a corrugated structure, a laminated panel structure, a honeycomb structure, a concave structure, a grid panel structure, and a mesh structure The IC card according to any one of claims 2 to 6, wherein the IC card is a composite reinforcing structure. The reinforcing plate has a mechanically excellent composite reinforcing structure, and the upper surface portion is made flat so that the structure does not hinder the card flatness, and both the mechanical strength and the printability are compatible.

  The invention according to claim 9 is an individual having an image receiving layer on at least one surface of the first sheet material or the second sheet material, and the image receiving layer includes a name and a face image by a thermal transfer method or an ink jet method. The IC card according to any one of claims 1 to 8, wherein identification information is provided, and a writing layer capable of writing is provided at least in part. By providing personal identification information including name and face image on at least one side of the IC card and writing on at least part of the IC card, a license, identification card, passport, alien registration card, library card, It can be preferably used for cash cards, credit cards, employee cards, employee cards, membership cards, medical cards and student cards.

  The invention according to claim 10 is characterized in that a transparent protective layer is provided on an upper surface provided with personal identification information including the name and face image, and the transparent protective layer is made of an actinic ray curable resin. It is an IC card described in 1. The transparent protective layer is made of an actinic ray curable resin, personal identification information including name and face image is protected, and durability is improved.

  The invention according to claim 11 is the IC card according to any one of claims 1 to 10, wherein the IC chip does not exist at a position overlapping the face image portion. The IC chip of the IC card is arranged at a position other than the position overlapping the face image portion, and the IC chip does not exist at the position overlapping the face image portion, thereby improving the surface smoothness and improving the printability.

  The invention according to claim 12 is the IC card according to any one of claims 1 to 11, wherein the IC card is a non-contact type. Since the IC card is a non-contact type and excellent in safety, it can be used for applications requiring high confidentiality of data and prevention of forgery and alteration.

  The invention according to claim 13 is the IC card according to any one of claims 1 to 12, wherein the planar unevenness of the chip peripheral portion on the surface of the IC card is within ± 10 μm. It is. The smoothness of the surface around the chip on the surface of the IC card is good, and the printability is improved.

  The invention according to claim 14 is the IC card manufacturing method for producing the IC card according to any one of claims 1 to 13, wherein the card substrate is punched into a card shape. A method for producing an IC card, comprising: cutting a bonded product into a single sheet before punching into a sheet. By cutting the bonded product into a single sheet before punching into a card, the handling is easy and the accuracy of punching into a card is improved.

  The invention according to claim 15 is the IC card manufacturing method for producing the IC card according to any one of claims 1 to 13 by punching the card base material into a card shape. The IC card manufacturing method according to claim 1, wherein format printing is performed before punching out. By performing format printing before punching into a card shape, handling is easy and the accuracy of format printing is improved.

  Hereinafter, the IC card and the IC card manufacturing method of the present invention will be described in detail with reference to the drawings. However, the embodiment of the present invention shows the most preferable form of the invention, and the present invention is not limited thereto. Not.

  FIG. 1 is a schematic configuration diagram of an IC card manufacturing process. In this IC card manufacturing process, the long sheet-shaped first sheet material (back sheet) 1 shown in FIG. 3 is provided in the first sheet material supply section A, and the sheet-shaped first sheet material shown in FIG. Two sheet materials (front sheets) 2 are arranged in the second sheet material supply unit B. An adhesive is supplied to the second sheet material 2 from the adhesive supply unit C <b> 1 and applied to the second sheet material 2. The sheet is conveyed to the inlet supply unit E by the second sheet material conveyance unit D. The second sheet material conveying portion D is composed of a conveying roller d1 and a conveying belt d2, and the conveying belt d2 is supported by the platen roller c1 in the adhesive supply portion C1. The first sheet material (back sheet) 1 and the second sheet material (front sheet) 2 may be pre-printed in format printing, or may be printed after being laminated and punched into a card shape. However, it is preferable that at least one of the first sheet material (back sheet) 1 and the second sheet material (front sheet) 2 is subjected to format printing.

  In the inlet supply portion E, an inlet 3 of components including an IC chip and an IC module having an antenna is supplied and placed at a predetermined position of the second sheet material 2, and the second sheet material 2 is moved to the back roller portion F. Send to. The first sheet material 1 is supplied with an adhesive from the adhesive supply unit C <b> 2, coated, and sent to the back roller unit F.

  The back roller part F has a temperature-adjustable laminating roller f, and the first sheet material 1 and the second sheet material 2 are bonded together using the laminating roller f. The temperature difference between the laminating roller f and the rollers f1, f2 is 0 ° C. or higher and 100 ° C. or lower. In this embodiment, the second sheet material 2 has an image receiving layer, the first sheet material 1 has a writing layer, and the rollers f1 and f2 have a roller temperature on the image receiving layer side of the writing layer side. The temperature is lower than the temperature of the roller.

  A card base material transport unit G is disposed at the rear stage of the back roller unit F, and the card base material transport unit G includes transport belts g1 and g2 facing each other and transport rollers g3 and g4. A sheet substrate on which the first sheet material 1 and the second sheet material 2 are bonded is sandwiched between the conveying belts g1 and g2 facing each other in the card substrate conveying section G. Send to cutting section H.

  In the cutting part H, the sheet base material of the bonded product is cut into a single sheet by a cutting machine h1. Thereafter, the sheet base material in sheet form is sent to the collection unit K.

  In the collection unit K, the flat plate k1 is disposed between the sheet-like sheet base materials and is sent to the storage unit L. As the flat plate k1, for example, a SUS plate is used.

  In the storage part L, it is stored at a predetermined temperature for a predetermined time and sent to the punching part N.

In the punching portion N, punching is performed in a card shape by a punching machine n1. The punched IC card is subjected to format printing on the front surface or back surface using the card printing machine o1 in the printing unit O, or if additional format printing is performed in advance, to the loading unit P. send.

  In the loading section P, the cartridge is loaded in the magazine p1 and sealed with the cover p2.

  In this embodiment, before punching into a card shape, the sheet base material of the bonded product is cut into a sheet-like sheet shape at the cutting portion H, so that handling is easy and punching accuracy is improved. In addition, by performing format printing in the format printing unit M before punching out into a card shape, handling is easy and the accuracy of format printing is improved.

  Further, an adhesive is interposed between the first sheet material 1 and the second sheet material 2, and an inlet 3 having an IC chip on the inlet base material is enclosed in the adhesive layer, thereby providing a card base material. An IC card is manufactured by punching the card base material into a card shape. The card base material creation process is performed in the clean room 501, the card base material storage process is performed in the clean room 502, the format printing, the card base material punching process and the punched IC card cartridge loading process are performed in the clean room 503. Are created in an environment of class 100,000 or less. In this way, by manufacturing an IC card in an environment of class 100,000 or less, dust such as dust can be prevented from being mixed during the manufacture of the IC card, and scratches can be caused during punching, printing, and card transportation. And the occurrence of dirt can be suppressed, and the yield of non-defective cards is improved.

  An IC card produced using the IC card manufacturing method or IC card manufacturing apparatus of the present invention is shown in FIGS. FIG. 3 is a cross-sectional view of an image forming body of an IC card bonded product, and FIG. 3 is a diagram showing the IC card.

  As shown in FIG. 2, a card base material that is an image forming body of an IC card bonded product includes an electronic component 3 a having a predetermined thickness between a first sheet material 1 and a second sheet material 2. ing. The electronic component 3a includes an antenna 3a1, an IC chip 3a2, and the like, and an IC module of the electronic component 3a is provided in the inlet 3. This is a laminated structure in which the inlet 3 is disposed between the first sheet material 1 and the second sheet material 2 and laminated with the adhesive layers 6 and 7 interposed therebetween. The IC chip 3a2 is covered with a reinforcing plate 3b, and the reinforcing plate 3b has a larger shape than the IC chip 3a2 and protects the IC chip 3a2.

  The first sheet material 1 or the second sheet material 2 has an image receiving layer 8a on at least one surface, in this embodiment, on one surface of the second sheet material 2, and the name and face by the thermal transfer method or the ink jet method. Personal identification information 8b including an image is provided. Further, a transparent protective layer 8c is provided on the upper surface on which personal identification information 8b including a name and a face image is provided by transfer of a transfer foil, and the transparent protective layer 8c is made of an actinic ray curable resin. By providing the transparent protective layer 8c on the upper surface on which the personal identification information 8b is provided, the personal identification information 8b is protected and durability is improved.

  In this embodiment, a writable writing layer 9 a is provided on one side of the first sheet material 1. Further, the IC chip 3a2 is disposed at a position other than the position overlapping the face image portion, and the IC chip 3a2 does not exist at the position overlapping the face image portion, thereby improving the surface smoothness and improving the printability. An IC card can be obtained.

  As described above, the IC card has an IC module, is a non-contact card, and is excellent in safety. Therefore, the IC card can be used for applications that require high confidentiality of data and anti-counterfeiting.

  The IC card created in this way can suppress the occurrence of scratches and dirt on the IC card. In this embodiment, the number of dust mixed or adhering inside or outside of one card is 100. It is as follows, and it is possible to suppress the occurrence of scratches and dirt on the IC card, and the good card yield is improved.

  Also, by providing personal identification information including name and face image by thermal transfer method or ink jet method on at least one image receiving layer of IC card, and providing a writable writing layer at least in part, licenses and identification It can be preferably used for certificate, passport, alien registration card, library card, cash card, credit card, employee card, employee card, membership card, medical card and student card. In this embodiment, the address, name, deadline, remarks, usage description column, and image recording column provided on the surface of the IC card shown in FIG. 3 (a) are displayed as shown in FIG. 3 (b). Record information and images such as expiry date, limitations, applications, and face images, and write similar information to the IC chip. Also, information relating to the issuer such as the issuer name and telephone number is recorded in the ruled line column provided on the back side of the IC card as shown in FIG.

Next, the configuration of the present invention will be described in detail.
[IC card base material adhesive]
As the bonding material of the present invention, it is preferable to use a hot melt adhesive, a thermoplastic resin, or the like. For example, as the hot melt adhesive, a commonly used one can be used. Examples of the main component of the hot melt adhesive include ethylene / vinyl acetate copolymer (EVA), polyester, polyamide, thermoplastic elastomer, and polyolefin. However, in the present invention, a moisture curable adhesive is specifically preferable among the low temperature adhesives.

  Moisture curable materials as reactive hot melt adhesives are disclosed in JP-A Nos. 2000-036026, 2000-212278, and 2000-219855. Any of these adhesives may be used, and materials that are not particularly limited can be used as long as low-temperature bonding can be performed.

The film thickness of the adhesive is preferably 100 to 600 μm, more preferably 150 to 500 μm, and still more preferably 150 μ to 450 μm in terms of the thickness including the electronic component.
[Electronic parts]
An electronic component refers to an information recording member, and specifically, an IC chip that electrically stores information of an IC card user and a coiled antenna body connected to the IC chip. The IC chip is only a memory or in addition to a microcomputer. In some cases, a capacitor may be included in the electronic component. The present invention is not limited to this, and is not particularly limited as long as it is an electronic component necessary for the information recording member.

  The IC module has an antenna coil, but when it has an antenna pattern, any method such as conductive paste printing, copper foil etching, or winding welding may be used. As the printed board, a thermoplastic film such as polyester is used, and polyimide is advantageous when heat resistance is required. The IC chip and antenna pattern can be joined using conductive adhesives such as silver paste, copper paste, and carbon paste (EN-4000 series from Hitachi Chemical, XAP series from Toshiba Chemical) and anisotropic conductive films (Hitachi Chemical). There are known methods using industrial anisol, etc.) or soldering methods, but any method may be used.

  In order to fill the resin after placing the parts including the IC chip in a predetermined position in advance, the shearing force due to the flow of the resin causes the joint to come off or the surface smoothness due to the flow or cooling of the resin. In order to eliminate the damage and lack of stability, a resin layer is previously formed on the substrate sheet, and the electronic component is sealed with a porous resin film or porous foam to enclose the component in the resin layer. It is preferably used in the form of a conductive resin film, a flexible resin sheet, a porous resin sheet, or a nonwoven fabric sheet. For example, a method described in Japanese Patent Application No. 11-105476 can be used.

Further, since the IC chip has a weak point pressure strength, it is also preferable to have a reinforcing plate in the vicinity of the IC chip. The total thickness of the electronic component is preferably 10 to 300 μm, more preferably 30 to 300 μm, still more preferably 30 to 250 μm.
[Reinforcement plate]
The reinforcing plate of the present invention is larger than the size of the IC chip, and the reinforcing plate has at least two directions of linear groove shapes or curved groove-shaped uneven portions. The reinforcing plate larger than the size of the IC chip suppresses unevenness due to the uneven part of the IC chip, has resistance to bending and point pressure strength load, and can prevent the IC chip and the antenna connection from coming off. .

  Further, the reinforcing plate has at least one of the surface on the IC chip side of the portion corresponding to the upper portion of the IC chip or the opposite surface thereof, and the portion other than the portion corresponding to the upper portion of the IC chip has a composite reinforcing structure. The reinforcing plate larger than the size of the IC chip has a mechanically superior composite reinforcing structure, and the upper surface portion is flat so that the structure does not hinder the card flatness, and both mechanical strength and printability are compatible. ing.

  The reinforcing plate has a composite reinforcing structure adjacent to the IC chip, and the surface opposite to the surface adjacent to the IC chip is smooth. The reinforcing plate has a mechanically superior composite reinforcing structure, and the surface opposite to the surface adjacent to the IC chip is smooth so that the structure does not hinder the card flatness, mechanical strength and printability Are compatible. The roughness of the smooth surface of the reinforcing plate is 0.01 μm or more and 15 μm or less, and by specifying the roughness of the smooth surface of the reinforcing plate, the printability can be improved.

  In addition, a plurality of reinforcing plates are provided adjacent to the IC chip, at least one of the plurality of reinforcing plates has a composite reinforcing structure, and at least one covers or is adjacent to the upper part of the antenna connection portion of the IC chip. The physical properties of this reinforcing plate are different from the physical properties of the reinforcing plates in other portions. At least one of the plurality of reinforcing plates has a composite reinforcing structure, and at least one covers or is adjacent to the upper part of the antenna connection portion of the IC chip. The physical properties of this reinforcing plate are different from the physical properties of the reinforcing plates of other parts. Further, it is possible to prevent the IC chip and the antenna connection portion from being detached. In order to avoid increasing the card thickness, the reinforcing plate should contain at least one material with a Young's modulus of 100 GPa or higher, and the reinforcing plate should preferably be a high-strength material, especially a material with a Young's modulus of 100 GPa or higher. It is preferable that

  A plurality of reinforcing plates are provided adjacent to the IC chip, at least one of the plurality of reinforcing plates is a composite reinforcing structure, and the connection portion between the IC chip and the antenna is covered with a concave reinforcing plate, The ratio of the minimum thickness and the maximum thickness is 0.1 or more and 1.0 or less. Reinforcing plate with concave structure is an effective means to increase durability because it can cover the connection part of IC chip and antenna which should be most reinforced with IC card in U shape. If the thickness becomes too thick, the smoothness in the card surface is deteriorated. Therefore, the thickness ratio is preferably 0.1 or more and 1.5 or less.

The surface irregularity of the chip periphery on the surface of the IC card is within ± 10 μm, the surface smoothness of the chip periphery on the surface of the IC card is good, and the printability is improved.
[Reinforcement structure of reinforcing plate]
The reinforcing plate of this invention is a mechanically excellent composite reinforcing structure, and the upper surface portion opposite to the IC chip side is made flat so that the structure does not hinder the card flatness, thereby improving the mechanical strength and printability. Both are compatible. In order to avoid an increase in card thickness, the reinforcing plate is preferably a high-strength material. In particular, a material having a Young's modulus of 100 GPa or more is preferably used for the main structure. The reinforcing plate having a composite reinforcing structure is an H structure, a corrugated structure, a laminated panel structure, a honeycomb structure, a concave structure, a blade stringer structure, a Z stringer structure, an I stringer structure, a hat stringer structure, a tube stringer structure, It is particularly preferable to have a composite reinforcing structure selected from a grid type panel structure and a mesh structure, and more preferably an H structure, a corrugated structure, a laminated panel structure, a honeycomb structure, a concave structure, a grid type panel structure, and a mesh. One of the structures.
[Split reinforcing plate]
When a strong impact is applied to the IC chip or a strong bending stress is applied, problems such as disconnection or disconnection of the antenna at the boundary between the part where the reinforcing plate exists and the part where it does not exist are likely to occur. However, if the antenna connection portion that is relatively easy to cut is covered, the antenna is less likely to slip or break. It is preferable to sandwich a resin having a low elastic modulus between the divided reinforcing plates because the resin absorbs the moving force of the reinforcing plate and the durability is improved.
[Thickness ratio of concave reinforcing plate]
The concave reinforcing plate is an effective means to increase durability because it can cover the connection part between the IC chip and the antenna, which should be reinforced most in the IC card, in a U-shape. The thickness ratio is preferably 0.1 or more and 1.5 or less, more preferably 0.1 or more and 0.5 or less in order to deteriorate the smoothness in the card surface when it becomes too thick.
[Reinforcement plate flat part]
In order to increase the strength for protecting the IC chip and improve the printability, it is effective to flatten the upper surface portion of the reinforcing plate and make the outer peripheral portion of the reinforcing plate a composite reinforcing structure. By using a composite reinforcing structure for the outer peripheral portion of the reinforcing plate, it is possible to protect the connection portion between the antenna and the IC chip portion, which is relatively easily displaced. In order to improve printability, the roughness of the flat portion of the reinforcing plate is preferably 0.001 μm or more and 15 μm or less, more preferably 0.01 μm or more and 5 μm or less.

[Sheet material for IC card substrate]
Examples of the base material of the sheet member include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyolefin resins such as polyethylene, polypropylene, and polymethylpentene, polyvinyl fluoride, polyvinylidene fluoride, Polyfluorinated ethylene resins such as polytetrafluoroethylene and ethylene-tetrafluoroethylene copolymer, polyamides such as nylon 6 and nylon 6.6, polyvinyl chloride, vinyl chloride / vinyl acetate copolymer, ethylene / Vinyl acetate copolymer, ethylene / vinyl alcohol copolymer, vinyl polymer such as polyvinyl alcohol and vinylon, biodegradable aliphatic polyester, biodegradable polycarbonate, biodegradable polylactic acid, biodegradable polyvinyl alcohol Biodegradable cellulose acetate, biodegradable resins such as biodegradable polycaprolactone, cellulose resins such as cellulose triacetate and cellophane, methyl polymethacrylate, ethyl polymethacrylate, ethyl polyacrylate, polybutyl acrylate Acrylic resin such as, synthetic resin sheet such as polystyrene, polycarbonate, polyarylate, polyimide, etc., paper such as fine paper, thin paper, glassine paper, sulfuric acid paper, single layer such as metal foil, or lamination of two or more layers The body is mentioned. The thickness of the support of the present invention is
30 to 300 μm, desirably 50 to 200 μm.

  In this invention, from the viewpoint of card base material transportability due to heat shrinkage and warping of the support, the thermal contraction rate at 150 ° C./30 min as a sheet member in addition to the low temperature adhesive is 1.2% in the longitudinal (MD) direction. Hereinafter, 0.5% or less is preferable in the lateral (TD). Further, an easy-contact process may be performed on the support for post-processing to improve adhesion, and an antistatic process may be performed for chip protection.

  Specifically, U2 series, U4 series, UL series manufactured by Teijin DuPont Films, Ltd., Chrisper G series manufactured by Toyobo Co., Ltd., E00 series, E20 series, E22 series, X20 series, E40 series manufactured by Toray Industries, Inc. The E60 series QE series can be suitably used.

  The second sheet material may be provided with a cushion layer in addition to the image receiving layer in order to form a face image of the card user. An image element is provided on the surface of the personal authentication card substrate, and at least one selected from an authentication identification image such as a face image, an attribute information image, and format printing may be provided. It may be a card.

[Image receiving layer]
The image receiving layer in the second sheet material can be formed of a binder and various additives. The image receiving layer forms a gradation information-containing image by a sublimation type thermal transfer method and also forms a character information-containing image by a sublimation type thermal transfer method or a melt type thermal transfer method. The adhesion of the hot-melt ink should be good as well as the dyeing property of the ink. In order to impart such special properties to the image-receiving layer, it is necessary to appropriately adjust the types of binders and various additives and their blending amounts as described later.

  An information carrier comprising a format print represents an information carrier provided with at least one selected from a plurality of identification information and book information. Specifically, a ruled line, a company name, a card name, and notes Indicates the issuer's phone number.

  For the formation of an information carrier consisting of format printing, use the “lithographic printing technology”, “new printing technology overview”, “offset printing technology”, “plate making / printing slightly understandable picture book” published by Japan Printing Technology Association, etc. It can be formed using the general inks described, and is formed of ink such as carbon in photocurable ink, oil-soluble ink, solvent-type ink, and the like.

  In some cases, watermark printing, holograms, fine patterns, etc. may be employed to prevent visual counterfeiting, and the printed material, hologram, barcode, matte pattern, fine pattern, background pattern, uneven pattern may be used as the forgery / alteration prevention layer. Such as visible light absorbing color material, ultraviolet absorber, infrared absorber, fluorescent whitening material, metal deposition layer, glass deposition layer, bead layer, optical change element layer, pearl ink layer, neighbor pigment layer, It is also possible to provide the front sheet by printing or the like from an antistatic layer or the like.

  [Writing Layer] The writing layer is a layer that allows writing on the back surface of the ID card. As such a writing layer, for example, inorganic fine powders such as calcium carbonate, talc, diatomaceous earth, titanium oxide, and barium sulfate are included in a film of a thermoplastic resin (polyolefins such as polyethylene and various copolymers). Can be formed. It can be formed with a “writing layer” described in JP-A-1-205155. The writing layer is formed on the first sheet material in the support in which a plurality of layers are not laminated. Addition of a material that improves slipperiness, such as wax, to the writing layer is effective in preventing damage and wear when rubbed. As the additive, polyethylene wax is preferably used.

[IC card manufacturing method]
Here, an example of a method for producing an IC card using a hot melt adhesive will be given. In producing an IC card, first, a hot melt adhesive is applied to a predetermined thickness on the front and back sheets with an applicator. As a coating method, a normal method such as a roller method, a T-die method, or a die method is used. In the case of coating in the form of stripes in the present invention, there is a method of intermittently opening the T-die slit, but it is not limited thereto.

  Further, the first sheet material and the second sheet material may be subjected to format printing or information recording either before or after bonding, offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, It can be formed by any method such as an ink jet method, a sublimation transfer method, an electrophotographic method, and a heat melting method.

  The manufacturing method of the IC card of this invention is a method of bonding and coating as in JP 2000-036026, JP 2000-21855, JP 2000-21278, JP 10-316959, JP 11-5964, and the like. It is disclosed. Any bonding method, coating method, etc. can be used, and there is no particular limitation in this invention.

  Moreover, as a method of arranging an adhesive member at a specific position, it can be manufactured by applying an adhesive at a predetermined position by a screen printing method, a gravure printing method or the like. In addition, when a hot melt adhesive is used, it can be applied to each arrangement by applying the adhesive from the nozzle in a bead shape with a hand gun type hot melt applicator.

  Alternatively, the adhesive processed into a film shape can be cut to be placed in a predetermined arrangement, and after being placed in each arrangement, it can be bonded by heating and pressing.

At the time of bonding, it is preferable to perform heating and pressurization in order to increase the surface smoothness of the base material and the adhesion of a predetermined electronic component between the first sheet material and the second sheet material. It is preferable to manufacture by a laminate method or the like. The heating is preferably 10 to 180 ° C, more preferably 30 to 150. The pressurization is preferably 1.0 to 300 kgf / cm ² , more preferably 1.0 to 200 kgf / cm ² . If the pressure is higher than this, the IC chip will be damaged. The heating and pressurizing time is preferably 0.001 to 90 seconds, more preferably 0.001 to 60 seconds. If the time is longer than this, the production efficiency is lowered.

The sheet for an IC card having an IC module having an IC chip and an antenna in the adhesive layer is stored under a predetermined condition. The first sheet material and the second sheet material are bonded together via an adhesive. Thereafter, the IC card sheet is supplied to a punching die, and the IC card is manufactured by punching the IC card from the IC card sheet with the punching die. In this case, an authentication identification image or a bibliographic item may be recorded before punching. Another effective means is a method of making a hole for supplying moisture necessary for reaction around the card size of the laminated sheets to promote curing. [Load on the sheet]
Since the adhesive of the sheet base material just after lamination is not completed, it is necessary to apply a certain amount of load during storage in order to increase the adhesion of the two sheets that are bonded together. . If the applied load is too large, the sheet base material may be distorted or the IC chip or the like inside the bonded sheet base material may be damaged. It is preferred load applied to the sheet substrate is 2 kg / m ² or more 1500 kg / m ² or less.
[Judgment of complete curing]
After curing of a sheet base material using a moisture curable adhesive is when 95% or more of the isocyanate groups contained in the moisture curable adhesive has reacted. Whether or not the reaction has been completed can be determined by whether or not blistering due to the generation of carbon dioxide gas occurs when heat treatment at 90 ° C. or higher is performed. In order to know the progress of the reaction, it can be examined by measuring an infrared absorption spectrum and quantifying the amount of isocyanate group (NCO group) from the spectrum intensity.
[Punching method]
The punching blade according to the present invention uses a die in which the punch side blade to be punched and the die side blade to be punched are paired up and down, and the sheet base is cut at an angle of about 90 °. It was. The angle of the cutting blade of this method (hereinafter referred to as punch die method) is preferably 80 ° or more and 100 ° or less, and more preferably 85 ° or more and 95 ° or less. Since the punch die method has a simple blade structure, the punch die method is suitable for production of punching a large amount of sheet base materials. Since it is difficult to punch a sheet having a high elongation at break, it is preferable to use an adhesive having a elongation at break of 500% or less.

[Method of applying transfer foil onto IC card]
Transfer of the transfer foil to the transfer material is usually performed using a means capable of applying pressure while heating, such as a thermal head, a heat roller, or a hot stamp machine.

[Example 1]
EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in detail, the aspect of this invention is not limited to this. In the following, “part” means “part by weight”.

[Selection of adhesive]
The adhesive used was Sdyne 2013MK manufactured by Sekisui Chemical Co., Ltd.

<Creation of first sheet material (back sheet)>
U2L98W low heat yield grade 188 μm manufactured by Teijin DuPont Films Ltd. was used as the top sheet and back sheet.
(Create writing layer)
A coating liquid for forming a first writing layer, a coating liquid for forming a second writing layer, and a coating liquid for forming a third writing layer having the following composition are applied and dried in this order on the support backing sheet 188 μm, and the respective thicknesses are obtained. The writing layer was formed by laminating so as to be 5 μm, 15 μm, and 0.2 μm.
<First writing layer forming coating solution>
Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Carbon black Trace amount of titanium dioxide particles [Ishihara Sangyo Co., Ltd .: CR80] 1 part methyl ethyl ketone
80 parts butyl acetate 10 parts <second writing layer forming coating solution> polyester resin 4 parts [Toyobo Co., Ltd .: Vironal MD1200]
Silica 5 parts Titanium dioxide particles [manufactured by Ishihara Sangyo Co., Ltd .: CR80] 1 part 90 parts of water <third writing layer forming coating solution>
Polyamide resin [manufactured by Sanwa Chemical Industry Co., Ltd .: Sanmide 55] 5 parts Methanol 95 parts The center line average roughness of the obtained writing layer was 1.34 μm.
(Form format printing layer on the writing layer)
Format printing (ruled lines, issuer name, issuer telephone number) was performed by the offset printing method. UV ink was used as printing ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.

<Creation of second sheet material (front sheet)>
U2L98W low heat yield grade manufactured by Teijin DuPont Films Ltd. was used as a front sheet. The thickness of the PET sheet is 188 μm on both sides.

(Create a table sheet)
A second sheet material (front sheet) formed by sequentially coating and drying a cushion layer and an image receiving layer made of the following composition on a front sheet 188 μm was formed.
(Photo-curing cushion layer) Film thickness 10μm
Urethane acrylate oligomer (made by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA512)
55 parts polyester acrylate (Toagosei Co., Ltd .: Aronix M6200)
15 parts urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA4000)
25 parts hydroxycyclohexyl phenyl ketone (Ciba Specialty Chemicals: Irgacure 184) 5 parts methyl ethyl ketone 100 parts The actinic ray curable compound after application is dried at 90 ° C./30 sec and then with a mercury lamp (300 mj / cm ² ). Photocuring was performed.
(Image receiving layer)
The first image-receiving layer forming coating solution, the second image-receiving layer forming coating solution and the third image-receiving layer forming coating solution having the following composition are applied and dried in this order on the cushion layer, and each thickness is 0. The image receiving layer was formed by laminating to 2 μm, 2.5 μm, and 0.5 μm.
<First image-receiving layer forming coating solution>
9 parts of polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BL-1]
Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX]
Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Second image-receiving layer forming coating solution>
6 parts of polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1]
Metal ion-containing compound (Compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming third image-receiving layer>
Polyethylene wax 2 parts [Toho Chemical Industry Co., Ltd .: Hitech E1000]
Urethane-modified ethylene acrylic acid copolymer 8 parts [manufactured by Toho Chemical Co., Ltd .: Hitec S6254]
Methyl cellulose [manufactured by Shin-Etsu Chemical Co., Ltd .: SM15] 0.1 part Water 90 parts (formation of information carrier consisting of format printing layer)
Format printing (employee ID, name) was performed on the image receiving layer by an offset printing method. UV ink was used as printing ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.

(Transparent resin layer formation)
The printing ink which consists of the following composition was mixed with the roll mill, and printing ink was created. Printing was performed on the image receiving layer by the offset printing method. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.

(Transparent resin layer composition 1)
Urethane acrylate oligomer 50 parts Aliphatic polyester acrylate oligomer 35 parts Dirocure 1173 (manufactured by Ciba Specialty Chemicals) 5 parts trimethylolpropane acrylate 10 parts (preparation of IC concealment layer)
By the resin convex printing method, watermark printing was performed on the outermost surface of the support opposite to the image receiving layer surface. Printing ink was printed with UV black ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp. The film thickness was 1.0 μm.
(Used inlet)
An aluminum foil having a thickness of 10 μm was vapor-deposited on an S series tetron film manufactured by Teijin DuPont Films Co., Ltd., and then etched as in the form of an antenna wire. An IC chip, a reinforcing plate, and the like were placed on the base sheet thus obtained to obtain an IC card inlet.

<Creation of IC card image recording material>
Using the first sheet material (back sheet) shown in FIG. 4 and the second sheet material (front sheet) shown in FIG. 5, the IC-mounted card substrate and card base with an image receiving layer shown in FIG. A card substrate was prepared using a material preparation device.

  The card base creation as an embodiment will be described. The first sheet material (back sheet) is installed in the first sheet supply unit, and the second sheet material (front sheet) is installed in the second sheet supply unit. An adhesive was charged into the hot melt agent supply section.

  In this way, the first sheet material (back sheet) in the form of a long sheet and the second sheet material (front sheet) of a single sheet are provided, and the second sheet material is under nitrogen at a specific temperature. An adhesive was supplied from a moisture curing type adhesive supply unit by a T-die coating method, and an electronic component composed of FIGS. 6 to 8 having a thickness of 270 μm was arranged. In order to prevent the temperature of the adhesive from decreasing, the heating member was heated and heated.

FIG. 6 is a schematic diagram of an IC module made of an IC card material, and is an IC module of an electronic component 3a in which an IC chip 3a2 is joined to an antenna 3a1 of an antenna coil wound with a copper wire.
The inlet structure of FIG. 7 is a nonwoven fabric type, and the nonwoven fabric 3a4 on which the printed pattern is formed and the IC chip 3a2 are joined by bonding or the like, and the reinforcing plate 3b covers the IC chip 3a2 by 50% or more on the IC chip 3a2. It is the schematic diagram which interposes. An IC card sheet “FT series” manufactured by Hitachi Maxell Co., Ltd. can also be used.

  FIG. 8 shows a printed circuit board type. A printed circuit board 3a5 on which a printed pattern is formed and an IC chip 3a2 are joined by bonding or the like, and a reinforcing plate 3b is interposed in the IC chip 3a2 so as to cover 50% or more of the IC chip 3a2. FIG.

  The inlet used was heat-treated for various T series Tetron films manufactured by Teijin DuPont Films Co., Ltd. to adjust the heat shrinkage rate. Thereafter, both surfaces of the support were coated with various resins with a thickness of 1 μm. Further, an aluminum foil having a thickness of 10 μm was vapor-deposited thereon, and then subjected to an etching process like an antenna wire. On the base sheet support thus obtained, an IC chip, a reinforcing plate and the like were installed to form an IC card inlet.

An adhesive is supplied to the first sheet material by a T-die coating method from a moisture curable adhesive supply section under nitrogen at a specific temperature, and the moisture curable adhesive is applied to the first sheet material and the second sheet material. And a IC / fixing member of the IC module, and a card controlled by a heating and pressing roll and a film thickness control roll (pressure 3 kg / cm ² , roll surface temperature 70 ° C.) and controlled to 740 μm A substrate master was created. This card base plate is shown in FIGS. FIG. 9 shows an embodiment using the inlet of FIG. 7, and FIG. 10 shows an embodiment using the inlet of FIG.

  The target thicknesses of the adhesive applied to the first and second sheet materials were 30 to 40 μm and 330 to 350 μm, respectively. In this invention, by controlling the thickness distribution of each coating, the card thickness standard deviation, thickness variation range, and in-plane inclination values were adjusted, and an IC card having the values shown in the examples after punching was obtained.

The cutting step is preferably performed after the initial curing of the adhesive and the adhesion to the support have been sufficiently performed. In consideration of cutting properties, the adhesive does not necessarily need to be completely cured. The prepared master was able to obtain an image recording body for an IC card having a size of 55 mm × 85 mm by a punching method shown later. When there was no format printing part on the front and back surfaces of the finished card substrate, the logo and OP varnish were printed sequentially by a resin letterpress printing method with a card printer.
[Storage of IC card]
The IC cards obtained as described above were loaded in the card magazine having the shape shown in FIG. The card magazine is configured to be mountable in the loading section of the card printer shown in FIG. After the card magazines were sealed, these magazines were stored for 10 days in a 23 ° C. and 55% environment.
[IC card creation method]
[Method of describing authentication identification image and attribute information image on IC card]
(Creation of ink sheet for sublimation thermal transfer recording)
A 6 μm-thick polyethylene terephthalate sheet with anti-fusion processing on the back side is coated with a yellow ink layer forming coating liquid, a magenta ink layer forming coating liquid, and a cyan ink layer forming coating liquid each having a thickness of 1 μm. Thus, ink sheets of three colors of yellow, magenta and cyan were obtained.
<Coating liquid for yellow ink layer formation>
Yellow dye (MSY Yellow, Mitsui Toatsu Dye Co., Ltd.) 3 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24, made by Denki Kagaku Kogyo Co., Ltd.] Polymethyl methacrylate-modified polystyrene 1 part [Toa Gosei Chemical Industry ( Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
Methyl ethyl ketone 70 parts Toluene 20 parts <Coating liquid for forming a magenta ink layer>
Magenta dye (MS Magenta manufactured by Mitsui Toatsu Dye Co., Ltd.) 2 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24 manufactured by Denki Kagaku Kogyo Co., Ltd.]
Polymethylmethacrylate modified polystyrene 2 parts [Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
Methyl ethyl ketone 70 parts Toluene 20 parts <Cyan ink layer forming coating solution>
Cyan dye (Nippon Kayaku Co., Ltd. Kayaset Blue 136) 3 parts Polyvinyl acetal 5.6 parts [Electrochemical Industry Co., Ltd .: Denkabutyral KY-24]
Polymethylmethacrylate-modified polystyrene 1 part [manufactured by Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
20 parts of methyl ethyl ketone (preparation of ink sheet for melt type thermal transfer recording)
An ink sheet was obtained by applying and drying an ink layer forming coating solution having the following composition to a polyethylene terephthalate sheet having a thickness of 6 μm that had been processed to prevent fusing on the back surface to a thickness of 2 μm.
<Ink layer forming coating solution>
Carnauba wax 1 part Ethylene vinyl acetate copolymer 1 part [Mitsui DuPont Chemicals: EV40Y]
Carbon black 3 parts Phenolic resin [Arakawa Chemical Industries, Ltd .: Tamanol 521] 5 parts Methyl ethyl ketone 90 parts (Face image formation)
The image receiving layer or transparent resin portion, the information printing portion and the ink side of the ink sheet for sublimation type thermal transfer recording are overlapped, and the output is 0.23 W / dot and the pulse width is 0.3-4. A human image having gradation in the image was formed on the image receiving layer by heating under conditions of 5 ms and a dot density of 16 dots / mm. In this image, the dye and the nickel of the image receiving layer form a complex.

(Formation of character information)
The transparent resin part and the ink side of the melt type thermal transfer recording ink sheet are overlapped, and the condition of output 0.5 W / dot, pulse width 1.0 ms, dot density 16 dots / mm using the thermal head from the ink sheet side The character information was formed on the IC card image recording body by heating with.

The face image and attribute information are provided as described above.
[Synthesis of IC card surface protective layer-added resin]
[Create IC card surface protection foil]
(Preparation of transfer foil 1)
A transfer foil 1 was prepared by laminating the following composition on a release layer of a polyethylene terephthalate film 2 having a thickness of 25 μm provided with a release layer of a 0.1 μm fluororesin layer.
(Actinic ray curable compound)
Shin-Nakamura Chemical A-9300 / Shin-Nakamura Chemical EA-1020 =
35 / 11.75 parts initiator Irgacure 184 made by Nippon Ciba-Geigy Co., Ltd. 5 parts Additive unsaturated group-containing resin 48 parts Other additives
Dainippon Ink Surfactant F-179 0.25 part <Intermediate Layer Forming Coating Liquid> Film thickness 1.0 μm
Polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1] 3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1.5 parts Methyl ethyl ketone 90 parts After application Curing of the curing agent was performed at 50 ° C. for 24 hours.
<Adhesive layer forming coating solution> Film thickness 0.5 μm
Urethane-modified ethylene ethyl acrylate copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254B] 8 parts polyacrylic acid ester copolymer [manufactured by Nippon Pure Chemicals Co., Ltd .: Jurimer AT510] 2 parts Water 45 parts Ethanol 45 parts ( Creation of transfer foil 2)
The following composition was laminated | stacked on the mold release layer of the 25-micrometer-thick polyethylene terephthalate film 2 which provided the mold release layer of the 0.1 micrometer fluororesin layer, and the actinic-light curable transfer foil 2 was produced.
(Actinic ray curable compound)
Shin-Nakamura Chemical A-9300 / Shin-Nakamura Chemical
EA-1020 = 35 / 11.75 parts Reaction initiator Irgacure 184 made by Nippon Ciba Geigy Co., Ltd. 5 parts Additive unsaturated group-containing resin 48 parts Other additives Dainippon Ink Surfactant F-179 0.25 part <intermediate layer Forming coating solution> Film thickness 1.0μm
Polyvinyl butyral resin [Sekisui Chemical Co., Ltd. product: ESREC BX-1]
3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1.5 parts Methyl ethyl ketone 90 parts Curing of the curing agent after application was carried out at 50 ° C. for 24 hours.
<Barrier layer-forming coating solution> Polyvinyl butyral resin with a film thickness of 1.0 μm [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1]
1 part Toughtex M-1913 (Asahi Kasei) 8 parts Curing agent Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1 part Methyl ethyl ketone 90 parts <Adhesive layer forming coating solution> Film thickness 0.5 μm
Urethane-modified ethylene ethyl acrylate copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254B] 8 parts polyacrylic acid ester copolymer [manufactured by Nippon Pure Chemicals Co., Ltd .: Jurimer AT510] 2 parts Water 45 parts Ethanol 45 parts Image Using the transfer foil 1 and the transfer foil 2 having the above-mentioned configuration on the image receiving body on which characters are recorded, using a heat roller having a diameter of 5 cm and a rubber hardness of 85 heated to a surface temperature of 200 ° C. at a pressure of 150 kg / cm ² . Transfer was performed in the order of transfer foil 1 and transfer foil 2 by applying heat for 1.2 seconds. The transfer was performed using the IC card making apparatus shown in FIG.

  FIG. 11 shows a card printer as an IC card creation apparatus. In the card printer, a card base material supply unit 10 and an information recording unit 20 are arranged at an upper position, and a transparent protective layer and / or an optical change are arranged at a lower position. An element transfer layer application part and / or a resin layer application part 70 are arranged, and then a transparent protective layer and / or an optical change element transfer layer application part and / or a resin layer application part 70 are arranged, and a card as an image recording body Create

  In the card base material supply unit 10, for example, a plurality of card base materials 50 that have been cut into pieces in advance to write the personal information of the card user created in FIG. Stocked up. In this example, the card substrate 50 includes a support and an image receiving layer, and the card substrate 50 is automatically supplied one by one from the card substrate supply unit 10 at a predetermined timing.

  In the information recording unit 20, a yellow ribbon cassette 21, a magenta ribbon cassette 22, a cyan ribbon cassette 23, and a black ribbon cassette 24 are arranged, and recording heads 25 to 28 are arranged correspondingly. While the card substrate 50 is moved by thermal transfer using a thermal transfer sheet such as a yellow ribbon, magenta ribbon, or cyan ribbon, an image area having a gradation such as a photograph of the card user's face is recorded in a predetermined area of the image receiving layer. Is done.

Further, a character ribbon cassette 31 and a recording head 32 are arranged, and authentication identification information such as a name and a card issuance date is recorded by thermal transfer using a thermal transfer sheet such as a character ribbon, and an image recording layer is formed. In this information recording unit 20, a gradation information image is formed on the image receiving layer by heating imagewise, and the recording head condition when forming the image is pressurized in the range of 0.01 to 0.3 kg / cm ² , The head is formed at a temperature of 50 to 500 ° C.

In the transparent protective layer and / or the optical change element transfer layer applying unit and / or the resin layer applying unit 70, a transfer foil cassette 71 is disposed, and a thermal transfer head 72 is disposed corresponding to the transfer foil cassette 71. The optical change element transfer foil 43 and / or the transparent protective transfer foil 64 and the curable transfer foil 66 are transferred, and an optical change element transfer layer and / or a transparent protective transfer layer and a curable protective layer-containing transfer layer are provided.
[Reinforcement structure]
In the present invention, the reinforcing plate 3b is larger than the size of the IC chip 3a2, and the reinforcing plate 3b has at least two linear groove shapes or curved groove-shaped uneven portions in two or more directions. FIG. 12 shows the smooth reinforcing plate 3b of the first comparative example, and FIG. 13 shows the corrugated reinforcing plate 3b of the second comparative example. In FIG. 14, the reinforcing plate 3b of the embodiment a has a reinforcing plate smooth portion 3b1 and a groove-shaped portion 3b2, and the groove-shaped portion 3b2 has a linear groove shape in two or more directions, and FIG. The reinforcing plate 3b has a reinforcing plate smooth portion 3b1 and a groove-shaped portion 3b2, the groove-shaped portion 3b2 has a curved groove shape, and the reinforcing plate smooth portion 3b1 is an upper part of the IC chip. In FIG. 16, the reinforcing plate 3b of Example c has a curved groove shape, but the reinforcing plate smooth portion is not formed.

  17 to 20, the reinforcing plate 3b has a reinforcing plate smooth portion 3b1 and a composite reinforcing structure portion 3b3. In the embodiment d of FIG. 17, the composite reinforcing structure portion 3b3 has a linear groove shape. In the embodiment e, the composite reinforcing structure portion 3b3 has a wave shape, in the embodiment f of FIG. 19, the composite reinforcing structure portion 3b3 is a mesh, and in the embodiment g of FIG. 20, the composite reinforcing structure portion 3b3 has a laminated tile structure. .

  In FIG. 21, the reinforcing plate 3b is larger than the size of the IC chip 3a2 adjacent to the IC chip 3a2, and this reinforcing plate 3b has at least one of the surface 3b4 on the IC chip side corresponding to the upper part of the IC chip or the opposite surface 3b5. A portion other than the portion that is smooth and corresponds to the upper portion of the IC chip has a composite reinforcing structure.

  Further, the reinforcing plate 3b having a composite reinforcing structure adjacent to the IC chip 3a2 has a smooth surface opposite to the surface adjacent to the IC chip 3a2, as shown in FIGS. 14, 15, and 17 to 21. is there.

  22 to 24 include a plurality of reinforcing plates 3b11 and 3b12 adjacent to the IC chip 3a2, wherein at least one of the plurality of reinforcing plates 3b11 and 3b12 has a composite reinforcing structure, and at least one reinforcing plate 3b12 is an IC. Covering or adjoining the antenna connection part upper part 3a21 of the chip 3a2, and the physical properties of the reinforcing plate 3b12 are different from those of the reinforcing plate 3b11 of the other part. FIG. 22 shows the reinforcing plate 3b11 and the reinforcing plate 3b12. 23, the reinforcing plate 3b11 and the reinforcing plate 3b12 are abutted and fixed by being sandwiched between the reinforcing plates 3b13 and 3b14 from both sides, and in FIG. 24, the reinforcing plate 3b11 and the reinforcing plate 3b12 are partially overlapped. The reinforcing plates 3b11, 3b12, 3b13, and 3b14 include at least one material having a Young's modulus of 100 GPa or more.

FIG. 25 includes a plurality of reinforcing plates 3b15 and 3b16 adjacent to the IC chip 3a2, and at least one of the plurality of reinforcing plates 3b15 and 3b16 has a composite reinforcing structure. In this embodiment, the plurality of reinforcing plates 3b15 and 3b16 have a composite reinforcing structure, and the connection portion between the IC chip 3a2 and the antenna 3a1 is covered with the concave reinforcing plate 3b16, and the ratio between the minimum thickness and the maximum thickness is It is 0.1 or more and 1.5 or less.
[Connection structure]
26, the antenna 3a1 overlaps with the smooth portion of the reinforcing plate 3b, and the connecting portion of Example 1 in FIG. 27 overlaps the connecting portion of the antenna 3a1 with the reinforcing portion of the reinforcing plate 3b. 29, the antenna 3a1 overlaps with the curved groove-shaped portion of the reinforcing plate 3b, and in the connection part of Example 3 in FIG. 29, the antenna 3a1 overlaps with the curved groove-shaped portion of the reinforcing plate 3b and the IC chip upper smooth portion.

As shown in Fig. 1, card impact resistance, card durability and card printability are evaluated by changing the concave thickness ratio of the concave structure, the roughness of the smooth portion of the reinforcing plate, and the Young's modulus of the high-strength material of the reinforcing plate. did. Evaluation of this physical property is shown below.
(Card impact)
A test was conducted in which 50 g of ropes with a radius of 1 cm were freely dropped on the created card, and the height at which the IC chip was damaged was determined. The higher the height, the higher the impact resistance. An IC card with an impact force of 20 cm or more was made practical.
(Card durability)
The IC card created to the end is in the condition of a long side direction and a short side direction of 30 / min every 125 times so that the long side direction of the card is 35 mm and the short side direction of the card is 15 mm. A total of 1000 tests were conducted. After that, the IC function was confirmed with a commercially available reader / writer and evaluated in five stages. A result of 4 or more is a preferable result.

  5: No deformation and no problem with IC function.

  4: Although there is some deformation, there is no problem in the IC function.

  3: There is no deformation or somewhat, but the IC function is lost.

  2: Largely deformed and IC function is lost.

1: The IC function is lost due to bending.
(Card printability)
Formability after forming face image and text information was evaluated in 5 levels
5 There is no blurring of characters and images around the chip.
4 There is no blurring of characters and images around the chip, but the characters and images are somewhat difficult to see due to unevenness.
3 There are blurring of characters and images around the chip.
2 There is a part where no characters or images are formed at the periphery of the chip.
1 There are a lot of parts where characters and images are not formed at all as well as the peripheral part of the chip.
4 and 5 are practical levels.
The results are shown in Table 1.

  As a result of Table 1, in the present invention, compared to the comparative example, the results show excellent effects in card impact, card durability and card printability, and the effects of the invention are recognized.

In this invention, parts including an IC module having a contact type or non-contact type IC chip and an antenna for storing personal information etc. that require safety (security) such as forgery and alteration prevention are stacked and bonded together. Create a card substrate, manufacture this card substrate in a card shape, suppress the occurrence of uneven unevenness in the IC chip part, have resistance to bending and point pressure strength load, and IC chip and antenna connection part It is possible to prevent slipping off.

It is a schematic block diagram of the manufacturing process of an IC card. It is sectional drawing of the image forming body of the bonded product of an IC card. It is a figure which shows an IC card. It is a figure which shows a 1st sheet material (back sheet). It is a figure which shows a 2nd sheet | seat material (front sheet | seat). It is a schematic diagram of the IC module of the IC card material. It is a schematic diagram of the IC module of the IC card material. It is a schematic diagram of the IC module of the IC card material. It is sectional drawing of a card base original plate. It is sectional drawing of a card base original plate. It is a figure which shows the card printer as an IC card production apparatus. FIG. 5 is a view showing a smooth reinforcing structure of Comparative Example 1; It is a figure which shows the corrugated reinforcement structure of the comparison 2. It is a figure which shows the reinforcement structure of Example a. It is a figure which shows the reinforcement structure of Example b. It is a figure which shows the reinforcement structure of Example c. It is a figure which shows the reinforcement structure of Example d. It is a figure which shows the reinforcement structure of Example e. It is a figure which shows the reinforcement structure of Example f. It is a figure which shows the reinforcement structure of Example g. It is a figure which shows the reinforcement structure of Example h. It is a figure which shows the reinforcement structure of Example i. It is a figure which shows the reinforcement structure of Example j. It is a figure which shows the reinforcement structure of Example k. It is a figure which shows the reinforcement structure of Example l. FIG. 5 is a diagram showing connection of reinforcing plates in comparison 1. FIG. 3 is a diagram showing connection of reinforcing plates of Example 1. 6 is a diagram showing connection of reinforcing plates in Example 2. FIG. FIG. 6 is a diagram showing connection of reinforcing plates in Example 3.

Explanation of symbols

1 First sheet material (back sheet)
2 Second sheet material (front sheet)
3 Inlet 3a Electronic component 3a1 Antenna 3a2 IC chip 3b, 3b11, 3b12, 3b15, 3b16 Reinforcing plate 6,7 Adhesive layer 8a Image receiving layer 8b Personal identification information 8c Transparent protective layer 9a Writing layer 50 Card base material

Claims (15)

Components including an IC module consisting of an IC chip and an antenna are stacked at a predetermined position between the first sheet material and the second sheet material, and bonded together to create a card substrate. In an IC card manufactured in a card shape,
Having a reinforcing plate larger than the size of the IC chip,
2. The IC card according to claim 1, wherein the reinforcing plate has at least two directions of linear grooves or curved grooves. Components including an IC module consisting of an IC chip and an antenna are stacked at a predetermined position between the first sheet material and the second sheet material, and bonded together to create a card substrate. In an IC card manufactured in a card shape,
Having a reinforcing plate larger than the size of the IC chip adjacent to the IC chip;
The reinforcing plate is characterized in that at least one of the surface on the IC chip side of the portion corresponding to the upper portion of the IC chip or the opposite surface thereof is smooth, and the portion other than the portion corresponding to the upper portion of the IC chip has a composite reinforcing structure. IC card. Components including an IC module consisting of an IC chip and an antenna are stacked at a predetermined position between the first sheet material and the second sheet material, and bonded together to create a card substrate. In an IC card manufactured in a card shape,
A reinforcing plate having a composite reinforcing structure adjacent to the IC chip;
An IC card, wherein the reinforcing plate has a smooth surface opposite to the surface adjacent to the IC chip.   4. The IC card according to claim 2, wherein a roughness of the smooth surface of the reinforcing plate is 0.01 μm or more and 15 μm or less. Components including an IC module consisting of an IC chip and an antenna are stacked at a predetermined position between the first sheet material and the second sheet material, and bonded together to create a card substrate. In an IC card manufactured in a card shape,
A plurality of reinforcing plates are provided adjacent to the IC chip,
At least one of the plurality of reinforcing plates has a composite reinforcing structure, and at least one reinforcing plate covers or is adjacent to the upper part of the antenna connection portion of the IC chip, and the physical properties of the reinforcing plate reinforce other portions. An IC card characterized by the physical properties of the board.   6. The IC card according to claim 5, wherein the reinforcing plate includes at least one material having a Young's modulus of 100 GPa or more. Components including an IC module consisting of an IC chip and an antenna are stacked at a predetermined position between the first sheet material and the second sheet material, and bonded together to create a card substrate. In an IC card manufactured in a card shape,
A plurality of reinforcing plates are provided adjacent to the IC chip,
At least one of the plurality of reinforcing plates has a composite reinforcing structure, and a connection portion between the IC chip and the antenna is covered with a reinforcing plate having a concave structure, and the ratio of the minimum thickness and the maximum thickness is 0.1 or more and 1.5 An IC card characterized by: The composite reinforcing structure portion of the reinforcing plate is
7. A composite reinforcing structure selected from any one of an H structure, a corrugated structure, a laminated panel structure, a honeycomb structure, a concave structure, a grid panel structure, and a mesh structure. Or IC card according to item 1. The first sheet material or the second sheet material has an image receiving layer on at least one side,
The image receiving layer is provided with personal identification information including a name and a face image by a thermal transfer method or an inkjet method,
The IC card according to any one of claims 1 to 8, wherein a writing layer capable of writing is provided at least in part. A transparent protective layer is provided on the top surface provided with personal identification information including the name and face image,
The IC card according to claim 9, wherein the transparent protective layer is made of an actinic ray curable resin.   11. The IC card according to claim 1, wherein the IC chip does not exist at a position overlapping the face image portion.   12. The IC card according to claim 1, wherein the IC card is a non-contact type.   13. The IC card according to claim 1, wherein a planar unevenness of a chip peripheral portion on the surface of the IC card is within ± 10 μm. 14. The IC card manufacturing method for producing the IC card according to any one of claims 1 to 13, wherein the card substrate is punched into a card shape.
A method for producing an IC card, comprising: cutting a bonded product into a single sheet before punching into the card. In the method of manufacturing an IC card, the IC card according to any one of claims 1 to 13, wherein the card substrate is punched into a card shape.
2. The IC card manufacturing method according to claim 1, wherein format printing is performed before punching into the card shape.